JP7476831B2 - LED lighting equipment - Google Patents

LED lighting equipment Download PDF

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JP7476831B2
JP7476831B2 JP2021047598A JP2021047598A JP7476831B2 JP 7476831 B2 JP7476831 B2 JP 7476831B2 JP 2021047598 A JP2021047598 A JP 2021047598A JP 2021047598 A JP2021047598 A JP 2021047598A JP 7476831 B2 JP7476831 B2 JP 7476831B2
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pad portion
internal pressure
substrate
adjustment hole
pressure adjustment
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JP2022146566A (en
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哲夫 田部
卓矢 吉田
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Toyoda Gosei Co Ltd
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Toyoda Gosei Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V25/00—Safety devices structurally associated with lighting devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H05F3/02—Carrying-off electrostatic charges by means of earthing connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)

Description

本発明は、ＬＥＤ照明装置に関する。特に、ＬＥＤが実装された基板を内包するケースに内圧調整穴が空けられたものに関する。 The present invention relates to an LED lighting device. In particular, it relates to an LED lighting device in which an internal pressure adjustment hole is drilled in a case that contains a board on which an LED is mounted.

ＬＥＤの高輝度化に伴い、車両の外装にＬＥＤを用いた照明装置が採用される事例が増加している。その場合、外装装置であることから、ＬＥＤを実装した基板を防水ケースに内包している。防水ケースには、内部の空気圧を調整するために内圧調整穴が空けられており、内圧調整穴は水分を透過せず空気は透過する材質の封止材によって封止されている。これにより、防水ケース内部に水分が進入するのを防止しつつ、防水ケース内部の圧力を調整することが可能となる。 As LEDs become brighter, there are an increasing number of cases where lighting devices using LEDs are used on the exterior of vehicles. In these cases, since it is an exterior device, the board on which the LEDs are mounted is housed in a waterproof case. The waterproof case has an internal pressure adjustment hole to adjust the internal air pressure, and the internal pressure adjustment hole is sealed with a sealant made of a material that is impermeable to water but permeable to air. This makes it possible to adjust the pressure inside the waterproof case while preventing water from entering the case.

特許文献１には、ＥＳＤ（静電気放電）から電子回路を保護するための保護回路が記載されている。 Patent document 1 describes a protection circuit for protecting electronic circuits from ESD (electrostatic discharge).

特開２０１４－２２０２６６号公報JP 2014-220266 A

しかし、防水ケースに内圧調整穴が空けられている場合、その内部調整穴を介して防水ケース内部に静電気が進入してしまうことが問題であった。従来、ＬＥＤの駆動回路にツェナーダイオードなどの静電気保護素子を追加することでＬＥＤを保護していたが、近年はＬＥＤが多数用いられる傾向にあり、ツェナーダイオードの数も増えてコストが増大していた。また、特許文献１のように保護回路を別途用意するのは回路が複雑となり、やはりコストが増大してしまう。そのため、静電気保護素子や保護回路を用いずにＬＥＤの静電気破壊を防止することが求められていた。 However, when an internal pressure adjustment hole is provided in the waterproof case, there is a problem in that static electricity can enter the waterproof case through the internal adjustment hole. Conventionally, LEDs have been protected by adding static electricity protection elements such as Zener diodes to the LED drive circuit, but in recent years, there has been a trend toward using a large number of LEDs, and the number of Zener diodes has also increased, resulting in increased costs. Furthermore, providing a separate protection circuit as in Patent Document 1 results in a complex circuit, which also increases costs. For this reason, there has been a demand for preventing static electricity damage to LEDs without using static electricity protection elements or protection circuits.

そこで本発明の目的は、ＬＥＤの静電気破壊が防止されたＬＥＤ照明装置を実現することである。 The object of the present invention is to realize an LED lighting device that prevents electrostatic damage to LEDs.

本発明は、基板と、基板に実装されたＬＥＤと、基板を内包し、内圧調整穴が空けられたケースと、内圧調整穴を塞ぎ、水分を通さず空気を透過する材料からなる封止部と、基板に設けられ、外部電源と接続される正極端子および負極端子と、基板に設けられ、ケースの外部から内圧調整穴を軸方向から見たときに、内圧調整穴と対向する領域に設けられた第１パッド部と、基板に設けられ、正極端子と負極端子のうち一方と、第１パッド部とを***に接続する第１配線部と、基板に設けられ、ケースの外部から内圧調整穴を軸方向から見たときに、内圧調整穴と対向する領域に設けられ、第１パッド部から離間して設けられた第２パッド部と、基板上に設けられ、正極端子と負極端子のうち他方と、第２パッド部とを***に接続する第２配線部と、を有することを特徴とするＬＥＤ照明装置である。 the first pad portion is provided on the substrate and in a region facing the internal pressure adjustment hole when the internal pressure adjustment hole is viewed from the outside of the case in the axial direction; a first wiring portion is provided on the substrate and connects one of the positive and negative terminals to the first pad portion in a single path; a second pad portion is provided on the substrate and in a region facing the internal pressure adjustment hole when the internal pressure adjustment hole is viewed from the outside of the case in the axial direction and spaced from the first pad portion; and a second wiring portion is provided on the substrate and connects the other of the positive and negative terminals to the second pad portion in a single path.

第１パッド部は、金属膜と、金属膜上に設けられたはんだ層からなる積層体であってもよい。 The first pad portion may be a laminate consisting of a metal film and a solder layer provided on the metal film.

第１配線部の長さは１０ｃｍ以下であってもよい。 The length of the first wiring portion may be 10 cm or less.

基板に設けられ、ケースの外部から内圧調整穴を軸方向から見たときに、内圧調整穴と対向する領域に設けられ、第１パッド部から離間して設けられた第２パッド部と、基板上に設けられ、正極端子と負極端子のうち他方と、第２パッド部とを***に接続する第２配線部と、をさらに有していてもよい。 The case may further include a second pad portion provided on the substrate, in a region facing the internal pressure adjustment hole when the internal pressure adjustment hole is viewed from the outside of the case in the axial direction, and spaced apart from the first pad portion, and a second wiring portion provided on the substrate and connecting the other of the positive and negative terminals to the second pad portion in a single path.

第２パッド部は、金属膜と、金属膜上に設けられたはんだ層からなる積層体であってもよい。 The second pad portion may be a laminate consisting of a metal film and a solder layer provided on the metal film.

第２配線部の長さは１０ｃｍ以下であってもよい。 The length of the second wiring portion may be 10 cm or less.

第１パッド部は、円環の一部を除去したＣ字型のパターンであり、第２パッド部は、第１パッド部の円環の内部に位置する円形のパターンであってもよい。 The first pad portion may be a C-shaped pattern with part of the ring removed, and the second pad portion may be a circular pattern located inside the ring of the first pad portion.

内圧調整穴から基板までの距離は１ｃｍ以下であってもよい。 The distance from the internal pressure adjustment hole to the substrate may be 1 cm or less.

本発明によれば、内圧調整穴からケース内部に進入する静電気は第１パッド部や第２パッド部に落ち、バッテリーの正極や負極（グランド）に逃がすことができるので、ＬＥＤの静電気破壊を防止することができる。 According to the present invention, static electricity that enters the case through the internal pressure adjustment hole falls onto the first pad section or the second pad section and can be released to the positive or negative pole (ground) of the battery, preventing static electricity damage to the LED.

実施例１のＬＥＤ照明装置の構成を示した図。FIG. 1 is a diagram showing a configuration of an LED lighting device according to a first embodiment. ケース２の外観を示した図。FIG. 2 is a diagram showing the appearance of case 2. 基板１の裏面を示した図。FIG. 第１パッド部１３の構成を示した図。FIG. 4 is a diagram showing the configuration of a first pad portion 13.

以下、本発明の実施例について図を参照に説明するが、本発明は実施例に限定されるものではない。 The following describes examples of the present invention with reference to the drawings, but the present invention is not limited to these examples.

図１は、実施例１のＬＥＤ照明装置の構成を示した図（断面図）である。図１のように、実施例１のＬＥＤ照明装置は、基板１と、基板１を内包するケース２と、を有している。 Figure 1 is a diagram (cross-sectional view) showing the configuration of the LED lighting device of Example 1. As shown in Figure 1, the LED lighting device of Example 1 has a substrate 1 and a case 2 that contains the substrate 1.

基板１は、一方の面（以下表面とする）にＬＥＤ１０と、ＬＥＤ１０を駆動するための駆動回路（図示しない）が実装されている。駆動回路は、抵抗、トランジスタ、ツェナーダイオードなどの電子部品と、電子部品を接続する金属箔の配線パターンで構成される。また、基板１の他方の面（以下裏面とする）には、正極端子１１および負極端子１２と、第１パッド部１３と、第２パッド部１４と、第１配線部１５と、第２配線部１６と、を有している。 The substrate 1 has an LED 10 and a drive circuit (not shown) for driving the LED 10 mounted on one surface (hereinafter referred to as the front surface). The drive circuit is composed of electronic components such as resistors, transistors, and Zener diodes, and a metal foil wiring pattern that connects the electronic components. The substrate 1 also has a positive terminal 11, a negative terminal 12, a first pad portion 13, a second pad portion 14, a first wiring portion 15, and a second wiring portion 16 on the other surface (hereinafter referred to as the back surface).

ケース２は、内部空間を有したボックス状の防水ケースである。ケース２の内部には基板１が内包され、基板１を水分から保護している。ケース２は、たとえば樹脂からなる。また、ケース２のうち、ＬＥＤ１０からの光が放射される側の領域は、透明部材で構成され、ケース２内部から外部へと光が取り出されるように構成されている。ケース２の外部形状、および内部空間の形状は、基板１を内包可能な形状であれば任意でよい。 Case 2 is a box-shaped waterproof case with an internal space. Substrate 1 is contained inside case 2, protecting it from moisture. Case 2 is made of, for example, resin. The area of case 2 from which light is emitted from LED 10 is made of a transparent material, and is configured so that light can be extracted from inside case 2 to the outside. The external shape of case 2 and the shape of the internal space may be any shape that can contain substrate 1.

ケース２には、円形の内圧調整穴２０が空けられている。図２は、ケース２を内圧調整穴２０側から見た外観を示した図である。内圧調整穴２０は、内部空間の圧力を調整するためのものである。この内圧調整穴２０を介してケース２の外部と内部とで空気の出入りが可能となっており、ケース２の内部空間の気圧はケース２外部の気圧とおよそ等しくなる。 A circular internal pressure adjustment hole 20 is drilled in the case 2. Figure 2 shows the appearance of the case 2 as seen from the side of the internal pressure adjustment hole 20. The internal pressure adjustment hole 20 is for adjusting the pressure in the internal space. Air can flow between the outside and inside of the case 2 through this internal pressure adjustment hole 20, and the air pressure in the internal space of the case 2 is approximately equal to the air pressure outside the case 2.

内圧調整穴２０は、基板１の裏面側に設けられている。また、後述のように、ケース２外部から内圧調整穴２０の軸方向に見た場合に、基板１裏面の第１パッド部１３、第２パッド部１４が内圧調整穴２０に対向するように、基板１が配置されている。ケース２の内部における基板１の配置は、内圧調整穴２０から基板１裏面までの距離がなるべく短くなるようにすることが好ましい。たとえば１ｃｍ以下とすることが好ましい。これにより、内圧調整穴２０からケース内部に進入した静電気を、第１パッド部１３や第２パッド部１４により落ちやすくすることができる。 The internal pressure adjustment hole 20 is provided on the back side of the substrate 1. As described below, when viewed from outside the case 2 in the axial direction of the internal pressure adjustment hole 20, the substrate 1 is arranged so that the first pad portion 13 and the second pad portion 14 on the back side of the substrate 1 face the internal pressure adjustment hole 20. It is preferable to arrange the substrate 1 inside the case 2 so that the distance from the internal pressure adjustment hole 20 to the back side of the substrate 1 is as short as possible. For example, it is preferable to make it 1 cm or less. This makes it easier for static electricity that has entered the case from the internal pressure adjustment hole 20 to be dissipated by the first pad portion 13 and the second pad portion 14.

また、内圧調整穴２０は、ケース２の内部側から封止部２１によって覆われている。封止部２１は、空気は透過するが水分は透過しない材料からなるシールである。これにより、内圧調整穴２０を介してケース２外部から内部へと水分が進入しないようにしつつ、空気は内圧調整穴２０を介して出入り可能となっている。封止部２１の材料は、たとえばフッ素樹脂の多孔質膜である。 The internal pressure adjustment hole 20 is covered from the inside of the case 2 by a sealing portion 21. The sealing portion 21 is a seal made of a material that is permeable to air but not moisture. This prevents moisture from entering the case 2 from the outside to the inside through the internal pressure adjustment hole 20, while allowing air to enter and exit through the internal pressure adjustment hole 20. The material of the sealing portion 21 is, for example, a porous film of fluororesin.

内圧調整穴２０の直径は、ケース２外部と内部とで十分に迅速に空気の出入りが可能な程度であればよく、たとえば５～１０ｍｍである。なお、実施例１では内圧調整穴２０の形状を円としているが、正方形、長方形、楕円など他の任意の形状でよい。 The diameter of the internal pressure adjustment hole 20 may be, for example, 5 to 10 mm, so long as it allows air to flow between the outside and inside of the case 2 quickly. Note that, although the shape of the internal pressure adjustment hole 20 in the first embodiment is a circle, it may be any other shape, such as a square, rectangle, or ellipse.

ケース２にはコネクタ２２が設けられており、コネクタ２２は基板１の正極端子１１および負極端子１２に接続されている。コネクタ２２には電源ケーブルが接続され、その電源ケーブルを介して外部電源の正極と正極端子１１、外部電源の負極（グランド）と負極端子１２とが接続される。 A connector 22 is provided in the case 2, and the connector 22 is connected to the positive terminal 11 and the negative terminal 12 of the board 1. A power cable is connected to the connector 22, and the positive pole of the external power supply is connected to the positive terminal 11, and the negative pole (ground) of the external power supply is connected to the negative terminal 12 via the power cable.

次に、基板１の裏面の構成について説明する。 Next, we will explain the configuration of the back side of the substrate 1.

図３は、基板１の裏面を示した図である。図３のように、基板１の裏面には、正極端子１１と負極端子１２とが隣接して配置され、これらから３～４ｃｍ離れた位置に第１パッド部１３と第２パッド部１４が配置されている。第１パッド部１３と第２パッド部１４は、ケース２外部から内圧調整穴２０をその内圧調整穴２０の軸方向に見たときに、内圧調整穴２０と対向する位置に設けられている。 Figure 3 is a diagram showing the back surface of the substrate 1. As shown in Figure 3, a positive electrode terminal 11 and a negative electrode terminal 12 are arranged adjacent to each other on the back surface of the substrate 1, and a first pad portion 13 and a second pad portion 14 are arranged 3 to 4 cm away from them. The first pad portion 13 and the second pad portion 14 are provided in positions facing the internal pressure adjustment hole 20 when the internal pressure adjustment hole 20 is viewed in the axial direction of the internal pressure adjustment hole 20 from outside the case 2.

正極端子１１は、外部電源の正極と接続される端子である。負極端子１２は、外部電源の負極（グランド）と接続される端子である。正極端子１１および負極端子１２の形状はコネクタ２２に接続可能な形状であれば任意でよい。 The positive terminal 11 is a terminal that is connected to the positive pole of an external power supply. The negative terminal 12 is a terminal that is connected to the negative pole (ground) of an external power supply. The positive terminal 11 and the negative terminal 12 may have any shape as long as they can be connected to the connector 22.

第１パッド部１３は、図３に示すように、円環の一部が除去されたＣの字型の形状である。また、ケース２の外側から内圧調整穴２０を軸方向に見たときに、内圧調整穴２０の周と第１パッド部１３の円環の外周とが一致するようにしている。つまり、内圧調整穴２０の中心と第１パッド部１３の円環の中心とを一致させ、内圧調整穴２０の直径と第１パッド部１３の円環の外周の直径とを一致させている。ただし厳密に一致させる必要はなく、円環の外周の直径は、内圧調整穴２０の直径の１～１．２倍であってもよい。 As shown in FIG. 3, the first pad portion 13 has a C-shape with part of the ring removed. In addition, when the internal pressure adjustment hole 20 is viewed axially from outside the case 2, the circumference of the internal pressure adjustment hole 20 and the outer periphery of the ring of the first pad portion 13 are made to coincide. In other words, the center of the internal pressure adjustment hole 20 and the center of the ring of the first pad portion 13 are made to coincide, and the diameter of the internal pressure adjustment hole 20 and the diameter of the outer periphery of the ring of the first pad portion 13 are made to coincide. However, they do not need to coincide strictly, and the diameter of the outer periphery of the ring may be 1 to 1.2 times the diameter of the internal pressure adjustment hole 20.

第１パッド部１３は、基板１の裏面上に設けられた金属膜１７と、金属膜１７上に設けられたはんだ層１８と、で構成された積層体（図４参照）である。金属膜１７の材料は、Ｃｕ、Ａｌ、Ａｕなどであり、基板１の表面に形成された配線パターンの材料と同一とすることができる。はんだ層１８の材料は、Ｓｎ－Ａｇ－Ｃｕ、Ｓｎ－Ｃｕ、Ｓｎ－Ａｇ、Ｓｎ－Ｓｂなどである。 The first pad portion 13 is a laminate (see FIG. 4) composed of a metal film 17 provided on the rear surface of the substrate 1 and a solder layer 18 provided on the metal film 17. The material of the metal film 17 is Cu, Al, Au, etc., and can be the same as the material of the wiring pattern formed on the front surface of the substrate 1. The material of the solder layer 18 is Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb, etc.

はんだ層１８は必ずしも必要でなく、金属膜１７のみであってもよい。ただし、実施例１のようにはんだ層１８を設ける方が好ましい。その理由は、第１に、金属膜１７を腐食などから保護するためである。第２に、内圧調整穴２０からケース２内部に進入する静電気が第１パッド部１３に落ちやすくし、ＬＥＤ１０の静電気破壊をより防止するためである。金属膜１７上にはんだ層１８を形成することで第１パッド部１３が厚くなり、第１パッド部１３の抵抗が下がるとともに、内圧調整穴２０から第１パッド部１３までの距離が近くなるので、静電気が第１パッド部１３に落ちやすくなるのである。 The solder layer 18 is not necessarily required, and only the metal film 17 may be used. However, it is preferable to provide the solder layer 18 as in Example 1. The reason is, first, to protect the metal film 17 from corrosion and the like. Second, to make it easier for static electricity entering the inside of the case 2 from the internal pressure adjustment hole 20 to fall on the first pad portion 13, and to better prevent electrostatic damage to the LED 10. By forming the solder layer 18 on the metal film 17, the first pad portion 13 becomes thicker, the resistance of the first pad portion 13 decreases, and the distance from the internal pressure adjustment hole 20 to the first pad portion 13 becomes shorter, so that static electricity becomes easier to fall on the first pad portion 13.

第２パッド部１４は、図３に示すように、円形のドット状である。第２パッド部１４は、第１パッド部１３の円環の内側中央に配置され、第１パッド部１３とは離れて配置されている。第２パッド部１４の直径は、内圧調整穴２０の直径の１／１０～１／５であり、たとえば０．５～２ｍｍである。第１パッド部１３と第２パッド部１４は、３ｍｍ以上離れていることが好ましい。マイグレーションにより第１パッド部１３と第２パッド部１４とが短絡してしまうのを防止するためである。 As shown in FIG. 3, the second pad portion 14 is in the shape of a circular dot. The second pad portion 14 is disposed at the center inside the annulus of the first pad portion 13, and is disposed away from the first pad portion 13. The diameter of the second pad portion 14 is 1/10 to 1/5 of the diameter of the internal pressure adjustment hole 20, for example, 0.5 to 2 mm. It is preferable that the first pad portion 13 and the second pad portion 14 are separated by 3 mm or more. This is to prevent the first pad portion 13 and the second pad portion 14 from shorting out due to migration.

第２パッド部１４は、第１パッド部１３と同様に、基板１の裏面上に設けられた金属膜１７と、金属膜１７上に設けられたはんだ層１８と、で構成された積層体（図４参照）である。金属膜１７、はんだ層１８の材料は、第１パッド部１３と同一である。もちろん、異なる材料としてもよい。 The second pad section 14, like the first pad section 13, is a laminate (see FIG. 4) composed of a metal film 17 provided on the rear surface of the substrate 1 and a solder layer 18 provided on the metal film 17. The materials of the metal film 17 and the solder layer 18 are the same as those of the first pad section 13. Of course, they may be made of different materials.

第１配線部１５は、正極端子１１と第１パッド部１３とを接続する配線パターンである。第１配線部１５は、途中で分岐することなく、第１パッド部１３から正極端子１１まで***であり、基板１の辺に沿ってＬ字型に設けられている。***とすることで、静電気のエネルギーが正極端子１１以外へと逃げないようにし、正極端子１１から外部電源の正極へと静電気のエネルギーをそのまま逃がすことができるようにしている。 The first wiring part 15 is a wiring pattern that connects the positive electrode terminal 11 and the first pad part 13. The first wiring part 15 is a single path from the first pad part 13 to the positive electrode terminal 11 without branching along the way, and is provided in an L-shape along the edge of the substrate 1. By making it a single path, the static electricity energy is prevented from escaping to anywhere other than the positive electrode terminal 11, and the static electricity energy can be released directly from the positive electrode terminal 11 to the positive electrode of the external power supply.

第１配線部１５のパターンは、第１パッド部１３から正極端子１１まで***に接続するパターンであって、第２パッド部１４や第２配線部１６から離間したパターンであれば任意のパターンでよい。ただし、第１配線部１５の長さはなるべく短い方が好ましい。静電気のエネルギーが正極端子１１に達する前に他所へ漏れてしまうのを抑制することができるからである。たとえば、第１配線部１５の長さは１０ｃｍ以下とすることが好ましい。第１配線部１５の線幅は、第１パッド部１３から正極端子１１まで十分に低抵抗に接続できる幅であればよい。 The pattern of the first wiring portion 15 may be any pattern that connects in a single path from the first pad portion 13 to the positive electrode terminal 11 and is spaced apart from the second pad portion 14 and the second wiring portion 16. However, it is preferable that the length of the first wiring portion 15 is as short as possible. This is because it is possible to prevent static electricity energy from leaking to other locations before reaching the positive electrode terminal 11. For example, it is preferable that the length of the first wiring portion 15 is 10 cm or less. The line width of the first wiring portion 15 may be any width that allows a connection with sufficiently low resistance from the first pad portion 13 to the positive electrode terminal 11.

第１配線部１５の材料は、Ｃｕ、Ａｌ、Ａｕなどであり、基板１の表面に形成された配線パターンの材料と同一とすることができる。 The material of the first wiring part 15 is Cu, Al, Au, etc., and can be the same as the material of the wiring pattern formed on the surface of the substrate 1.

第２配線部１６は、負極端子１２と第２パッド部１４とを接続する配線パターンである。図３のように、第２配線部１６は第１パッド部１３の円環が切れた部分を通っており、第２配線部１６と第１パッド部１３は十分に離間している。たとえば、３ｍｍ以上離間していることが好ましい。また、第２配線部１６も第１配線部１５と同様に、途中で分岐することなく、第２パッド部１４から負極端子１２まで***であり、基板１の辺に沿ってＬ字型に設けられている。 The second wiring portion 16 is a wiring pattern that connects the negative electrode terminal 12 and the second pad portion 14. As shown in FIG. 3, the second wiring portion 16 passes through the portion where the ring of the first pad portion 13 is broken, and the second wiring portion 16 and the first pad portion 13 are sufficiently separated. For example, it is preferable that they are separated by 3 mm or more. Also, like the first wiring portion 15, the second wiring portion 16 is a single road from the second pad portion 14 to the negative electrode terminal 12 without branching along the way, and is provided in an L-shape along the edge of the substrate 1.

第２配線部１６のパターンは、第２パッド部１４や第２配線部１６まで***に接続するパターンであって、第１パッド部１３や第１配線部１５から離間したパターンであれば任意のパターンでよい。ただし、第１配線部１５と同様に第２配線部１６の長さもなるべく短い方が好ましい。たとえば、第２配線部１６の長さは１０ｃｍ以下とすることが好ましい。第２配線部１６の線幅は、第２パッド部１４から負極端子１２まで十分に低抵抗に接続できる幅であればよい。 The pattern of the second wiring portion 16 may be any pattern that is connected in a single line to the second pad portion 14 or the second wiring portion 16 and is spaced apart from the first pad portion 13 or the first wiring portion 15. However, like the first wiring portion 15, it is preferable that the length of the second wiring portion 16 is as short as possible. For example, it is preferable that the length of the second wiring portion 16 is 10 cm or less. The line width of the second wiring portion 16 may be any width that allows a connection with sufficiently low resistance from the second pad portion 14 to the negative terminal 12.

第２配線部１６の材料は、第１配線部１５と同様であり、基板１の表面に形成された配線パターンの材料や第１配線部１５と同一とすることができる。 The material of the second wiring part 16 is the same as that of the first wiring part 15, and can be the same as that of the wiring pattern formed on the surface of the substrate 1 or the first wiring part 15.

次に、ケース２の内部に静電気が進入した場合の動作について説明する。 Next, we will explain what happens when static electricity enters the inside of case 2.

実施例１のＬＥＤ照明装置では、ケース２に内圧調整穴２０が空けられているため、この内圧調整穴２０からケース２の内部に静電気が進入する可能性がある。 In the LED lighting device of Example 1, an internal pressure adjustment hole 20 is provided in the case 2, and therefore there is a possibility that static electricity may enter the inside of the case 2 through this internal pressure adjustment hole 20.

ここで、内圧調整穴２０からケース２の内部に進入した静電気は、内圧調整穴２０から近い位置の導体に落ちる可能性が高い。実施例１では、内圧調整穴２０に対向した位置に第１パッド部１３と第２パッド部１４が設けられていることから、内圧調整穴２０から最も近い導体は第１パッド部１３か第２パッド部１４となる。そのため、静電気は第１パッド部１３または第２パッド部１４へと非常に高い確率で落ちる。 Here, static electricity that has entered the inside of the case 2 through the internal pressure adjustment hole 20 is highly likely to fall on a conductor located close to the internal pressure adjustment hole 20. In Example 1, since the first pad portion 13 and the second pad portion 14 are provided in positions facing the internal pressure adjustment hole 20, the conductor closest to the internal pressure adjustment hole 20 is either the first pad portion 13 or the second pad portion 14. Therefore, there is a very high probability that static electricity will fall on either the first pad portion 13 or the second pad portion 14.

第１パッド部１３に落ちた静電気は、第１配線部１５を通って正極端子１１に達し、さらに正極端子１１から外部電源の正極へと流れる。第１配線部１５は***であり、分岐がないため、静電気のエネルギーが電子部品を経由することはなく、電子部品（特にＬＥＤ１０）の静電気破壊を生じることなく、静電気を外部電源へと逃がすことができる。 The static electricity that falls on the first pad portion 13 reaches the positive electrode terminal 11 through the first wiring portion 15, and then flows from the positive electrode terminal 11 to the positive electrode of the external power supply. Because the first wiring portion 15 is a single path with no branches, the static electricity energy does not pass through the electronic components, and the static electricity can be released to the external power supply without causing electrostatic damage to the electronic components (especially the LED 10).

第２パッド部１４に落ちた静電気についても同様に、第２配線部１６から負極端子１２、さらに負極端子１２から外部電源の負極（グランド）へと逃がすことができる。また、第２配線部１６も***であり、分岐がないため、電子部品（特にＬＥＤ１０）の静電気破壊を生じることなく、静電気を外部電源へと逃がすことができる。 Similarly, static electricity that falls on the second pad portion 14 can be dissipated from the second wiring portion 16 to the negative terminal 12, and then from the negative terminal 12 to the negative pole (ground) of the external power supply. Moreover, since the second wiring portion 16 is also a single path with no branches, static electricity can be dissipated to the external power supply without causing electrostatic damage to electronic components (particularly the LED 10).

以上、実施例１のＬＥＤ照明装置によれば、内圧調整穴２０からケース２内部に進入した静電気を第１パッド部１３、第２パッド部１４に落とすことができ、正極端子１１、負極端子１２を介して外部電源の正極や負極（グランド）に逃がすことができるので、電子部品、特にＬＥＤ１０の静電気破壊を防止することができる。 As described above, according to the LED lighting device of Example 1, static electricity that has entered the case 2 through the internal pressure adjustment hole 20 can be discharged to the first pad portion 13 and the second pad portion 14, and can be released to the positive and negative poles (ground) of the external power supply via the positive and negative terminals 11 and 12, preventing static electricity damage to electronic components, particularly the LED 10.

なお、実施例１では、第１パッド部１３、第２パッド部１４の２つのパッド部を設けてそれぞれを正極端子１１、負極端子１２に接続しているが、パッド部を１つのみ設け、それを正極端子１１、負極端子１２のうち一方に接続するようにしてもよい。ただし、実施例１のように第１パッド部１３と第２パッド部１４の両方設ける方が静電気を外部電源の正極と負極へそれぞれ逃がすことができ、効率的に静電気を外部電源へと逃がすことができるので好ましい。 In Example 1, two pads, the first pad 13 and the second pad 14, are provided and connected to the positive terminal 11 and the negative terminal 12, respectively, but only one pad may be provided and connected to either the positive terminal 11 or the negative terminal 12. However, providing both the first pad 13 and the second pad 14 as in Example 1 is preferable because it allows static electricity to escape to the positive and negative electrodes of the external power supply, respectively, and allows static electricity to escape to the external power supply efficiently.

また、第１パッド部１３、第２パッド部１４のパターンは実施例１に示したものに限られない。第１パッド部１３と第２パッド部１４が内圧調整穴２０に対向する位置に設けられ、第１パッド部１３と第２パッド部１４とが離間したパターンであれば任意のパターンでよい。ただし、第１パッド部１３と第２パッド部１４とを十分に離間させつつ、第１パッド部１３と第２パッド部１４の面積をなるべく広くするパターンが好ましい。実施例１のパターンはこの点で優れたパターンである。 The patterns of the first pad portion 13 and the second pad portion 14 are not limited to those shown in Example 1. Any pattern may be used as long as the first pad portion 13 and the second pad portion 14 are provided at positions facing the internal pressure adjustment hole 20 and are spaced apart from each other. However, a pattern that sufficiently spaces the first pad portion 13 and the second pad portion 14 while making the areas of the first pad portion 13 and the second pad portion 14 as large as possible is preferable. The pattern of Example 1 is an excellent pattern in this respect.

また、内圧調整穴２０は、必ずしも基板１の裏面側に位置している必要はなく、表面側に設けてもよい。この場合、第１パッド部１３、第２パッド部１４、正極端子１１、負極端子１２についても、基板１の表面側に設けることとなる。ただし、内圧調整穴２０を基板１の表面側に設けると、ＬＥＤ１０からの光取り出しを阻害する可能性があり、デザイン性を損なう可能性もある。また静電気が基板１表面側の電子部品に影響する可能性がある。そのため、内圧調整穴２０は基板１の裏面側に設けることが好ましい。 In addition, the internal pressure adjustment hole 20 does not necessarily have to be located on the back side of the substrate 1, and may be provided on the front side. In this case, the first pad portion 13, the second pad portion 14, the positive electrode terminal 11, and the negative electrode terminal 12 are also provided on the front side of the substrate 1. However, providing the internal pressure adjustment hole 20 on the front side of the substrate 1 may hinder the light extraction from the LED 10, which may impair the design. In addition, static electricity may affect the electronic components on the front side of the substrate 1. For this reason, it is preferable to provide the internal pressure adjustment hole 20 on the back side of the substrate 1.

本発明のＬＥＤ照明装置は、車両の外装装置などに利用することができる。 The LED lighting device of the present invention can be used for vehicle exterior equipment, etc.

１：基板
２：ケース
１０：ＬＥＤ
１１：正極端子
１２：負極端子
１３：第１パッド部
１４：第２パッド部
１５：第１配線部
１６：第２配線部
１７：金属膜
１８：はんだ層
２０：内圧調整穴
２１：封止部 1: Board 2: Case 10: LED
11: Positive electrode terminal 12: Negative electrode terminal 13: First pad portion 14: Second pad portion 15: First wiring portion 16: Second wiring portion 17: Metal film 18: Solder layer 20: Internal pressure adjustment hole 21: Sealing portion

Claims (7)

基板と、
前記基板に実装されたＬＥＤと、
前記基板を内包し、内圧調整穴が空けられたケースと、
前記内圧調整穴を塞ぎ、水分を通さず空気を透過する材料からなる封止部と、
前記基板に設けられ、外部電源と接続される正極端子および負極端子と、
前記基板に設けられ、前記ケースの外部から前記内圧調整穴を軸方向から見たときに、前記内圧調整穴と対向する領域に設けられた第１パッド部と、
前記基板に設けられ、前記正極端子と前記負極端子のうち一方と、前記第１パッド部とを***に接続する第１配線部と、
前記基板に設けられ、前記ケースの外部から前記内圧調整穴を軸方向から見たときに、前記内圧調整穴と対向する領域に設けられ、前記第１パッド部から離間して設けられた第２パッド部と、
前記基板上に設けられ、前記正極端子と前記負極端子のうち他方と、前記第２パッド部とを***に接続する第２配線部と、
を有することを特徴とするＬＥＤ照明装置。 A substrate;
An LED mounted on the substrate;
a case containing the substrate and having an internal pressure adjustment hole;
a sealing portion that closes the internal pressure adjustment hole and is made of a material that is impermeable to moisture but permeable to air;
A positive terminal and a negative terminal provided on the substrate and connected to an external power source;
a first pad portion provided on the substrate and provided in a region facing the internal pressure adjustment hole when the internal pressure adjustment hole is viewed from the outside of the case in an axial direction;
a first wiring portion provided on the substrate and connecting one of the positive electrode terminal and the negative electrode terminal to the first pad portion in a single line;
a second pad portion provided on the substrate, in a region facing the internal pressure adjustment hole when the internal pressure adjustment hole is viewed from the outside of the case in an axial direction, and spaced apart from the first pad portion;
a second wiring portion provided on the substrate and connecting the other of the positive electrode terminal and the negative electrode terminal to the second pad portion in a single line;
An LED lighting device comprising: 前記第１パッド部は、金属膜と、前記金属膜上に設けられたはんだ層からなる積層体である、ことを特徴とする請求項１に記載のＬＥＤ照明装置。 The LED lighting device according to claim 1, characterized in that the first pad portion is a laminate consisting of a metal film and a solder layer provided on the metal film. 前記第１配線部の長さは１０ｃｍ以下である、ことを特徴とする請求項１または請求項２に記載のＬＥＤ照明装置。 The LED lighting device according to claim 1 or 2, characterized in that the length of the first wiring portion is 10 cm or less. 前記第２パッド部は、金属膜と、前記金属膜上に設けられたはんだ層からなる積層体である、ことを特徴とする請求項１から請求項３までのいずれか１項に記載のＬＥＤ照明装置。 4. The LED lighting device according to claim 1, wherein the second pad portion is a laminated body including a metal film and a solder layer provided on the metal film. 前記第２配線部の長さは１０ｃｍ以下である、ことを特徴とする請求項１から請求項４までのずれか１項に記載のＬＥＤ照明装置。 5. The LED lighting device according to claim 1, wherein the second wiring portion has a length of 10 cm or less. 前記第１パッド部は、円環の一部を除去したＣ字型のパターンであり、
前記第２パッド部は、前記第１パッド部の円環の内部に位置する円形のパターンである、
ことを特徴とする請求項１から請求項５までのいずれか１項に記載のＬＥＤ照明装置。 The first pad portion has a C-shaped pattern with a part of a ring removed,
The second pad portion is a circular pattern located inside the annulus of the first pad portion.
6. The LED lighting device according to claim 1 , wherein the LED lighting device is a light-emitting diode (LED) light source. 前記内圧調整穴から前記基板までの距離は１ｃｍ以下である、ことを特徴とする請求項１から請求項６までのいずれか１項に記載のＬＥＤ照明装置。 7. The LED lighting device according to claim 1 , wherein a distance from the internal pressure adjustment hole to the substrate is 1 cm or less.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014181562A (en) 2013-03-18 2014-09-29 Jtekt Corp Electric oil pump device
JP2019117748A (en) 2017-12-27 2019-07-18 スタンレー電気株式会社 Luminaire

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5281478B2 (en) * 2009-05-15 2013-09-04 キヤノン株式会社 ELECTRONIC DEVICE, CIRCUIT BOARD, HIGH-VOLTAGE POWER SUPPLY DEVICE, AND METHOD FOR SOLDERING ELECTRONIC COMPONENT AND PIEZOELECTRIC ELEMENT TO CIRCUIT BOARD
CN101963298B (en) * 2009-07-24 2013-01-02 友达光电股份有限公司 Backlight module
CN102606937B (en) * 2012-03-13 2014-03-26 深圳市华星光电技术有限公司 Light emitting diode (LED) lamp strip and backlight module
FR3052538B1 (en) * 2016-06-09 2018-07-20 Valeo Vision LUMINOUS DEVICE FOR A MOTOR VEHICLE INCORPORATING MEANS FOR PROTECTING ELECTROSTATIC DISCHARGES
CN106019707A (en) * 2016-07-08 2016-10-12 深圳天珑无线科技有限公司 Backlight source and mobile device
CN205942205U (en) * 2016-08-29 2017-02-08 无锡博一光电科技有限公司 Backlight of static can release
CN206582817U (en) * 2017-03-23 2017-10-24 中山市煌进兴照明科技有限公司 A kind of LED spotlight with water-proof function

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014181562A (en) 2013-03-18 2014-09-29 Jtekt Corp Electric oil pump device
JP2019117748A (en) 2017-12-27 2019-07-18 スタンレー電気株式会社 Luminaire

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