JP7475462B2 - 隣接する導電層のスタックの研磨中のプロファイル制御 - Google Patents

隣接する導電層のスタックの研磨中のプロファイル制御 Download PDF

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JP7475462B2
JP7475462B2 JP2022544299A JP2022544299A JP7475462B2 JP 7475462 B2 JP7475462 B2 JP 7475462B2 JP 2022544299 A JP2022544299 A JP 2022544299A JP 2022544299 A JP2022544299 A JP 2022544299A JP 7475462 B2 JP7475462 B2 JP 7475462B2
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polishing
polishing rate
calculating
substrate
sequence
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Japanese (ja)
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JP2023517450A (ja
Inventor
クン シュー，
ハリー キュー． リー，
ベンジャミン シェリアン，
デーヴィッド マクスウェル ゲージ，
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Applied Materials Inc
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Applied Materials Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2022544299A 2020-06-08 2021-06-07 隣接する導電層のスタックの研磨中のプロファイル制御 Active JP7475462B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063036392P 2020-06-08 2020-06-08
US63/036,392 2020-06-08
PCT/US2021/036189 WO2021252363A1 (en) 2020-06-08 2021-06-07 Profile control during polishing of a stack of adjacent conductive layers

Publications (2)

Publication Number Publication Date
JP2023517450A JP2023517450A (ja) 2023-04-26
JP7475462B2 true JP7475462B2 (ja) 2024-04-26

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JP2022544299A Active JP7475462B2 (ja) 2020-06-08 2021-06-07 隣接する導電層のスタックの研磨中のプロファイル制御

Country Status (6)

Country Link
US (4) US11850699B2 (zh)
JP (1) JP7475462B2 (zh)
KR (1) KR20220116313A (zh)
CN (1) CN115175785B (zh)
TW (2) TWI810069B (zh)
WO (1) WO2021252363A1 (zh)

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TWI810069B (zh) 2020-06-08 2023-07-21 美商應用材料股份有限公司 用於在拋光相鄰導電層的堆疊期間的輪廓控制的系統、方法及電腦程式產品
US20240139906A1 (en) * 2022-10-27 2024-05-02 Applied Materials, Inc. Control of carrier head sweep and platen shape
CN115855886B (zh) * 2022-11-25 2023-08-01 广东汇发塑业科技有限公司 一种多层共挤制膜的均匀性检测方法
CN116372781B (zh) * 2023-04-20 2023-11-07 山东欣立得光电科技有限公司 一种led屏幕衬底自动化清洗抛光***
CN117067042B (zh) * 2023-10-17 2024-01-30 杭州泓芯微半导体有限公司 一种研磨机及其控制方法

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Also Published As

Publication number Publication date
US11850699B2 (en) 2023-12-26
US20210379724A1 (en) 2021-12-09
TWI809389B (zh) 2023-07-21
TW202212051A (zh) 2022-04-01
US20240116152A1 (en) 2024-04-11
TWI810069B (zh) 2023-07-21
US11865664B2 (en) 2024-01-09
WO2021252363A1 (en) 2021-12-16
US20210379722A1 (en) 2021-12-09
TW202302273A (zh) 2023-01-16
KR20220116313A (ko) 2022-08-22
JP2023517450A (ja) 2023-04-26
CN115175785B (zh) 2024-05-07
US20210379721A1 (en) 2021-12-09
CN115175785A (zh) 2022-10-11

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