JP7262012B2 - Onboard charger and inverter - Google Patents

Onboard charger and inverter Download PDF

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JP7262012B2
JP7262012B2 JP2021178787A JP2021178787A JP7262012B2 JP 7262012 B2 JP7262012 B2 JP 7262012B2 JP 2021178787 A JP2021178787 A JP 2021178787A JP 2021178787 A JP2021178787 A JP 2021178787A JP 7262012 B2 JP7262012 B2 JP 7262012B2
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heat
component
electronic component
transfer body
generating electronic
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JP2022009834A (en
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篤志 山島
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Panasonic Intellectual Property Management Co Ltd
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Priority claimed from JP2020100805A external-priority patent/JP6982776B2/en
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

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Description

本発明は、車載充電器およびインバータに関する。 The present invention relates to an onboard charger and an inverter .

従来、放熱部材で形成された略直方体の筐体内に基板や電子部品を格納し、電子部品から発生する熱を、筐体を介して放熱することが知られている。このような略直方体の筐体の構造の製造方法として、上面と側面が箱型に一体成型されるとともに下面が開口された筐体を上方から被せる方法と、下面（底面）と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法の２通りが知られている。 2. Description of the Related Art Conventionally, it is known to house substrates and electronic components in a substantially rectangular parallelepiped housing made of a heat radiating member, and to dissipate heat generated from the electronic components through the housing. As a method for manufacturing such a substantially rectangular parallelepiped housing structure, there is a method in which the upper surface and side surfaces are integrally molded into a box shape and the lower surface is opened, and the lower surface (bottom surface) and side surfaces are box-shaped. There are two known methods of covering a housing which is integrally molded into the housing and has an open top surface with a lid member (upper surface).

上面と側面が箱型に一体成型されるとともに下面が開口された筐体を上方から被せる方法を用いる場合、下面に基板や電子部品を取り付ける際には側面が存在しないため、側方から電子部品をネジ留めすることが可能であるが、一方、筐体内に格納した電子部品を筐体外の電子部品と電気的に接続するための端子（コネクタ）の配置に制約が生じる。 When using a method in which the top and side surfaces are integrally molded into a box shape and the bottom surface is open, and the method is used to cover the case from above, there are no side surfaces when mounting substrates and electronic components on the bottom surface. However, there are restrictions on the placement of terminals (connectors) for electrically connecting electronic components stored in the housing to electronic components outside the housing.

一般的に、コネクタを側面に設ける場合には、下面と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法を用いることが好ましい。 In general, when the connector is provided on the side surface, it is preferable to use a method in which a lid member (upper surface) is placed on a housing in which the lower surface and side surfaces are integrally molded into a box shape and the upper surface is open.

しかしながら、下面と側面が箱型に一体成型されるとともに上面が開口された筐体に蓋部材（上面）を被せる方法においては、下面と側面が箱型に一体成型されているため、側方から電子部品をネジ留めすることが不可能であり、開口された上面からネジ留めを行う必要がある。 However, in the method of covering the lid member (upper surface) on the housing whose bottom surface and side surfaces are integrally molded into a box shape and whose top surface is open, since the bottom surface and side surfaces are integrally molded into a box shape, It is impossible to screw the electronic parts, and it is necessary to screw from the opened upper surface.

開口された上面から電子部品を固定するためのネジ留めを行う方法として、発熱電子部品のリード線を折り曲げることで発熱電子部品の放熱面を底面に直接接触させて配置し、例えば、特許文献１に開示されている弾性部材が放熱面の反対側の面を押さえつけるように弾性部材を上方からネジ留めすることが考えられる。 As a method of screwing to fix an electronic component from an opened upper surface, the lead wire of the heat-generating electronic component is bent so that the heat-dissipating surface of the heat-generating electronic component is placed in direct contact with the bottom surface. It is conceivable to screw the elastic member from above so that the elastic member disclosed in the above presses the surface opposite to the heat radiating surface.

特開２００２－２１７３４３号公報JP-A-2002-217343

しかしながら、上述した放熱機構の底面に発熱電子部品を配置する方法では、放熱効果を確保するために、放熱機構の底面において発熱電子部品の放熱面が接触する部分の面積および弾性部材が設置される部分の面積が必要となり、底面積の大型化、ひいては装置全体が大型化してしまうおそれがある。 However, in the above-described method of arranging the heat-generating electronic component on the bottom surface of the heat-dissipating mechanism, in order to secure the heat-dissipating effect, the area of the portion where the heat-dissipating surface of the heat-generating electronic component contacts the bottom surface of the heat-dissipating mechanism and an elastic member are provided. The area of the part is required, and there is a risk that the bottom area will be increased, and the entire device will be increased in size.

本発明の目的は、箱型に一体成型され、一面のみに開口部が設けられた放熱機構を用いた場合に、大型化を抑制しつつ、発熱電子部品の放熱に対応できる車載充電器およびインバータを提供することである。 SUMMARY OF THE INVENTION It is an object of the present invention to provide an in-vehicle charger and an inverter capable of dissipating heat from heat-generating electronic components while suppressing an increase in size when using a heat dissipation mechanism integrally molded in a box shape and provided with an opening on only one side. is to provide

本発明の一態様に係る車載充電器は、回路基板と、通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、前記発熱電子部品の放熱面が熱的に接続され、前記発熱電子部品が配置される伝熱体と、第１の面を有し、前記第１の面を介して前記伝熱体と熱的に接続する放熱部品と、を有し、前記伝熱体は、リアクトル部品を収容する空間が設けられた収容部を有し、前記リアクトル部品は、前記放熱部品と熱的に接続され、前記リアクトル部品と前記収容部との間に放熱性を有するポッティング材が充填されていることで、前記リアクトル部品と前記伝熱体とは、前記ポッティング材により熱的に接続され、前記発熱電子部品は、前記放熱部品に接触しない状態で、前記伝熱体に固定され、前記伝熱体は、第２の面と前記第２の面と対向する第３の面とを有し、前記伝熱体は、前記第２の面を介して前記発熱電子部品と熱的に接続され、前記伝熱体は、前記第３の面を介して前記ポッティング材により前記リアクトル部品と熱的に接続される。 An in-vehicle charger according to an aspect of the present invention includes a circuit board, a heat-generating electronic component that self-heats when energized and has a lead wire connected to the circuit board, and a heat-dissipating surface of the heat-generating electronic component is thermally connected. a heat transfer body on which the heat-generating electronic component is disposed; and a heat dissipation component having a first surface and thermally connecting to the heat transfer body via the first surface, The heat transfer body has an accommodation portion provided with a space for accommodating a reactor component, the reactor component is thermally connected to the heat dissipation component, and heat dissipation is provided between the reactor component and the accommodation portion. By filling the potting material, the reactor part and the heat transfer element are thermally connected by the potting material, and the heat-generating electronic part is not in contact with the heat dissipation part, and the heat transfer part The heat conductor has a second surface and a third surface facing the second surface, and the heat conductor transmits the exothermic electrons through the second surface. It is thermally connected to the component, and the heat transfer body is thermally connected to the reactor component by the potting material through the third surface.

本発明の一態様に係るインバータは、回路基板と、通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、前記発熱電子部品の放熱面が熱的に接続され、前記発熱電子部品が配置される伝熱体と、第１の面を有し、前記第１の面を介して前記伝熱体と熱的に接続する放熱部品と、を有し、前記伝熱体は、リアクトル部品を収容する空間が設けられた収容部を有し、前記リアクトル部品は、前記放熱部品と熱的に接続され、前記リアクトル部品と前記収容部との間に放熱性を有するポッティング材が充填されることで、前記リアクトル部品と前記伝熱体とは、前記ポッティング材により熱的に接続され、前記発熱電子部品は、前記放熱部品に接触しない状態で、前記伝熱体に固定され、前記伝熱体は、第２の面と前記第２の面と対向する第３の面とを有し、前記伝熱体は、前記第２の面を介して前記発熱電子部品と熱的に接続され、前記伝熱体は、前記第３の面を介して前記ポッティング材により前記リアクトル部品と熱的に接続される。 An inverter according to an aspect of the present invention includes a circuit board, a heat-generating electronic component that self-heats when energized and has a lead wire connected to the circuit board, and a heat dissipation surface of the heat-generating electronic component are thermally connected, a heat transfer body on which the heat-generating electronic component is disposed; and a heat dissipation component having a first surface and thermally connecting to the heat transfer body via the first surface, wherein the heat transfer The body has an accommodating portion provided with a space for accommodating the reactor component, the reactor component is thermally connected to the heat radiating component, and a potting having heat dissipation property is provided between the reactor component and the accommodating portion. By filling the material, the reactor component and the heat transfer body are thermally connected by the potting material, and the heat-generating electronic component is fixed to the heat transfer body without contacting the heat dissipation component. The heat conductor has a second surface and a third surface facing the second surface, and the heat conductor communicates heat with the heat-generating electronic component through the second surface. The heat transfer body is thermally connected to the reactor component through the third surface by the potting material.

本発明によれば、箱型に一体成型され、一面のみに開口部が設けられた放熱機構を用いた場合に、大型化を抑制しつつ、発熱電子部品の放熱に対応できる。 According to the present invention, when a heat dissipation mechanism integrally molded in a box shape and provided with an opening on only one side is used, it is possible to cope with the heat dissipation of the heat-generating electronic component while suppressing an increase in size.

本発明の実施の形態に係る発熱電子部品の放熱構造の一例を示す斜視図1 is a perspective view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention; 本発明の実施の形態に係る発熱電子部品の放熱構造の一例を示す正面図1 is a front view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention; 本発明の実施の形態に係る発熱電子部品の放熱構造の一例を示す側面図1 is a side view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention; 本発明の実施の形態に係る発熱電子部品の放熱構造の一例を示す上面斜視図1 is a top perspective view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention; FIG. 本発明の変形例１に係る発熱電子部品の放熱構造の構成例を示す上面斜視図FIG. 4 is a top perspective view showing a configuration example of a heat dissipation structure for a heat-generating electronic component according to Modification 1 of the present invention; 本発明の変形例２に係る発熱電子部品の放熱構造の構成例を示す上面斜視図FIG. 11 is a top perspective view showing a configuration example of a heat dissipation structure for a heat-generating electronic component according to Modification 2 of the present invention;

（実施の形態）
以下、本発明の実施の形態について、図面を参照して説明する。 (Embodiment)
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings.

まず、図１～４を用いて、本実施の形態に係る発熱電子部品の放熱構造１の構成例について説明する。図１は、発熱電子部品の放熱構造１の一例を示す斜視図である。図２は、発熱電子部品の放熱構造１の一例を示す正面図である。図３は、発熱電子部品の放熱構造１の一例を示す側面図である。図４は、発熱電子部品の放熱構造１の一例を示す上面斜視図である。なお、図１、図２では、ヒートシンク２の前面部分の図示を省略しており、図３では、ヒートシンク２の側面部分の図示を省略している。また、図４では、図１～図３に示す回路基板９の図示を省略している。 First, a configuration example of a heat dissipation structure 1 for a heat-generating electronic component according to the present embodiment will be described with reference to FIGS. 1 to 4. FIG. FIG. 1 is a perspective view showing an example of a heat dissipation structure 1 for a heat-generating electronic component. FIG. 2 is a front view showing an example of the heat dissipation structure 1 for heat-generating electronic components. FIG. 3 is a side view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. FIG. 4 is a top perspective view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. 1 and 2, illustration of the front portion of the heat sink 2 is omitted, and illustration of the side portion of the heat sink 2 is omitted in FIG. 4, illustration of the circuit board 9 shown in FIGS. 1 to 3 is omitted.

発熱電子部品の放熱構造１は、例えば、車両に搭載される充電器やインバータ等に用いられる。発熱電子部品の放熱構造１は、ヒートシンク２、アルミブロック３、電子部品５ａ、５ｂ、回路基板９を備える。 The heat dissipation structure 1 for heat-generating electronic components is used, for example, in chargers and inverters mounted on vehicles. A heat dissipation structure 1 for a heat-generating electronic component includes a heat sink 2 , an aluminum block 3 , electronic components 5 a and 5 b, and a circuit board 9 .

ヒートシンク２（放熱機構の一例）は、箱型に一体成型され、一面のみに開口部が設けられている。Ｆ１は、開口面（第２の面の一例）であり、Ｆ２は、開口面Ｆ１に対向する底面（第１の面の一例）である。 The heat sink 2 (an example of a heat dissipation mechanism) is integrally molded in a box shape and has an opening on only one side. F1 is an opening surface (an example of a second surface), and F2 is a bottom surface (an example of a first surface) facing the opening surface F1.

ヒートシンク２の底面Ｆ２の四隅には、底面Ｆ２に対する垂直方向Ｄ（以下、単に「垂直方向」という）に沿って、支柱２ａ、２ｂ、２ｃ、２ｄが設けられている。支柱２ａ～２ｄには、それぞれ、ネジ穴（図示略）が形成されており、後述する回路基板９がネジ留めされる。 Supports 2a, 2b, 2c, and 2d are provided at the four corners of the bottom surface F2 of the heat sink 2 along a direction D perpendicular to the bottom surface F2 (hereinafter simply referred to as "vertical direction"). A screw hole (not shown) is formed in each of the posts 2a to 2d, and a circuit board 9, which will be described later, is screwed thereon.

アルミブロック３（伝熱体の一例）は、アルミで形成された略直方体の部材である。アルミブロック３は、その長手方向が垂直方向Ｄに沿うようにヒートシンク２の内部に配置されている。 The aluminum block 3 (an example of a heat transfer body) is a substantially rectangular parallelepiped member made of aluminum. The aluminum block 3 is arranged inside the heat sink 2 so that its longitudinal direction is along the vertical direction D. As shown in FIG.

アルミブロック３は、その下部に略直方体の締結部３ａを有している。この締結部３ａは、ネジ４ａ、４ｂ（固定部材の一例）により底面Ｆ２にネジ留めされる。これにより、アルミブロック３は、底面Ｆ２に接触して固定される。 The aluminum block 3 has a substantially rectangular parallelepiped fastening portion 3a at its lower portion. The fastening portion 3a is screwed to the bottom surface F2 by screws 4a and 4b (an example of a fixing member). Thereby, the aluminum block 3 is fixed in contact with the bottom surface F2.

電子部品５ａ、５ｂ（発熱電子部品の一例）は、通電によって自己発熱する電子部品であり、例えば、ディスクリート部品、ＦＥＴ（Field Effect Transistor）等である。電子部品５ａ、５ｂは、それぞれ、リード線６ａ、６ｂを有する。 The electronic components 5a and 5b (an example of heat-generating electronic components) are electronic components that generate heat by themselves when energized, such as discrete components and FETs (Field Effect Transistors). The electronic components 5a, 5b have lead wires 6a, 6b, respectively.

電子部品５ａ、５ｂは、それぞれの放熱面がアルミブロック３の側面に接触するように、アルミブロック３に取り付けられる。例えば、電子部品５ａ、５ｂは、それぞれ、バネ７ａ、７ｂ（保持部材の一例）により、放熱面に対向する面から押さえ付けられ、アルミブロック３の側面に固着して保持される。バネ７ａ、７ｂは、それぞれ、ネジ８ａ、８ｂによりアルミブロック３の側面にネジ留めされる。 The electronic components 5a and 5b are attached to the aluminum block 3 so that their heat radiation surfaces are in contact with the side surfaces of the aluminum block 3. As shown in FIG. For example, the electronic components 5a and 5b are pressed by springs 7a and 7b (an example of a holding member) from the surface facing the heat dissipation surface, and are fixed and held on the side surface of the aluminum block 3 . The springs 7a and 7b are screwed to the side surfaces of the aluminum block 3 with screws 8a and 8b, respectively.

アルミブロック３に固着した電子部品５ａ、５ｂは、垂直方向Ｄに沿って直立した状態となる。また、アルミブロック３に固着した電子部品５ａ、５ｂは、ヒートシンク２に接触しない。 The electronic components 5a and 5b fixed to the aluminum block 3 stand upright along the vertical direction D. As shown in FIG. Also, the electronic components 5 a and 5 b fixed to the aluminum block 3 do not contact the heat sink 2 .

以上のようにアルミブロック３に固着した電子部品５ａ、５ｂから発生する熱は、アルミブロック３を介して、ヒートシンク２へ伝熱される。これにより、電子部品５ａ、５ｂの放熱が実現される。 The heat generated from the electronic components 5 a and 5 b fixed to the aluminum block 3 as described above is transferred to the heat sink 2 via the aluminum block 3 . Thereby, the heat dissipation of the electronic components 5a and 5b is realized.

なお、図１～図４では、例として、アルミブロック３に固着する電子部品を２つとしたが、１つであってもよいし、３つ以上であってもよい。また、複数の電子部品は、アルミブロック３の一面のみならず複数の面に固着されてもよい。 In FIGS. 1 to 4, as an example, two electronic components are fixed to the aluminum block 3, but the number may be one or three or more. Also, the plurality of electronic components may be fixed to not only one surface of the aluminum block 3 but also multiple surfaces.

回路基板９は、パターンが形成されたり、所定の半導体素子（図示略）が実装されたりするプリント基板である。回路基板９は、上述した支柱２ａ～２ｄに載置される。そして、回路基板９は、ネジ１０ａ、１０ｂ、１０ｃ、１０ｄにより柱２ａ～２ｄにネジ留めされる。これにより、回路基板９は、支柱２ａ～２ｄに固定される。 The circuit board 9 is a printed board on which a pattern is formed and predetermined semiconductor elements (not shown) are mounted. The circuit board 9 is mounted on the support columns 2a to 2d described above. The circuit board 9 is screwed to the pillars 2a to 2d with screws 10a, 10b, 10c, and 10d. Thereby, the circuit board 9 is fixed to the posts 2a to 2d.

また、回路基板９は、例えば半田付けにより、電子部品５ａのリード線６ａおよび電子部品５ｂのリード線６ｂと接続する。 Further, the circuit board 9 is connected to the lead wires 6a of the electronic component 5a and the lead wires 6b of the electronic component 5b by soldering, for example.

アルミブロック３および回路基板９は、垂直方向Ｄに沿って、底面Ｆ２からアルミブロック３、回路基板９の順に配置される。 The aluminum block 3 and the circuit board 9 are arranged along the vertical direction D in the order of the aluminum block 3 and the circuit board 9 from the bottom surface F2.

また、アルミブロック３と回路基板９は、ボンド１１ａ、１１ｂ（接着部材の一例）により互いに接着して固定される。これにより、回路基板９における固定点が多くなり、リード線６ａ、６ｂの折れを防止できる。特に支柱２ａ～２ｄが高く、振動が多く生じる場合に効果を奏する。 Also, the aluminum block 3 and the circuit board 9 are bonded and fixed to each other by bonds 11a and 11b (an example of adhesive members). This increases the number of fixing points on the circuit board 9 and prevents the lead wires 6a and 6b from being bent. This is particularly effective when the posts 2a to 2d are high and vibrations occur frequently.

また、ボンド１１ａ、１１ｂは、絶縁性または放熱性の少なくとも一方を有することが好ましい。ボンド１１ａ、１１ｂが絶縁性を有する場合、回路基板９においてボンド１１ａ、１１ｂに対応する箇所に、パターンを形成したり、半導体素子を実装したりできる。また、ボンド１１ａ、１１ｂが放熱性を有する場合、回路基板９で発生した熱を、ボンド１１ａ、１１ｂを介してアルミブロック３へ伝熱できる。 Also, the bonds 11a and 11b preferably have at least one of insulating properties and heat dissipation properties. When the bonds 11a and 11b have insulating properties, patterns can be formed and semiconductor elements can be mounted on the portions of the circuit board 9 corresponding to the bonds 11a and 11b. Further, when the bonds 11a and 11b have heat dissipation properties, the heat generated in the circuit board 9 can be transferred to the aluminum block 3 via the bonds 11a and 11b.

なお、図１～図４では、図示を省略しているが、回路基板９の上方に、開口面Ｆ１を閉塞するカバーが設けられてもよい。 Although not shown in FIGS. 1 to 4, a cover may be provided above the circuit board 9 to close the opening surface F1.

以上説明したように、本実施の形態の発熱電子部品の放熱構造１は、ヒートシンク２に接触して配置されたアルミブロック３に対して電子部品５ａ、５ｂの放熱面を接触させて配置するため、電子部品５ａ、５ｂの放熱面をヒートシンク２の底面Ｆ２に接触させて配置する場合に比べて、大型化を抑制しつつ、電子部品の放熱に対応することができる。 As described above, in the heat dissipation structure 1 of the heat-generating electronic component of the present embodiment, the heat dissipation surfaces of the electronic components 5a and 5b are arranged in contact with the aluminum block 3 arranged in contact with the heat sink 2. As compared with the case where the heat radiation surfaces of the electronic components 5a and 5b are arranged in contact with the bottom surface F2 of the heat sink 2, the heat radiation of the electronic components can be dealt with while suppressing the increase in size.

以上、発熱電子部品の放熱構造１の構成例について説明した。 The configuration example of the heat dissipation structure 1 for the heat-generating electronic component has been described above.

次に、発熱電子部品の放熱構造１の製造方法について、図１～図４を用いて説明する。 Next, a method of manufacturing the heat dissipation structure 1 for heat-generating electronic components will be described with reference to FIGS. 1 to 4. FIG.

まず、バネ７ａ、７ｂおよびネジ８ａ、８ｂを用いて、電子部品５ａ、５ｂをアルミブロック３に固定して接着させる。このとき、電子部品５ａ、５ｂの放熱面をアルミブロック３に接触させる。なお、電子部品５ａ、５ｂが、絶縁が必要なタイプの場合であれば、電子部品５ａ、５ｂの放熱面とアルミブロック３の間に放熱絶縁シート（図示略）を設けることが好ましい。 First, the electronic components 5a and 5b are fixed and adhered to the aluminum block 3 using the springs 7a and 7b and the screws 8a and 8b. At this time, the heat radiation surfaces of the electronic components 5 a and 5 b are brought into contact with the aluminum block 3 . If the electronic components 5a and 5b are of a type that requires insulation, it is preferable to provide a heat radiation insulating sheet (not shown) between the heat radiation surfaces of the electronic components 5a and 5b and the aluminum block 3.

次に、電子部品５ａ、５ｂが固着したアルミブロック３を、ヒートシンク２の開口面Ｆ１からヒートシンク２の内部に収容し、アルミブロック３を底面Ｆ２に配置する。そして、ネジ４ａ、４ｂを用いて締結部３ａを底面Ｆ２にネジ留めする。 Next, the aluminum block 3 to which the electronic components 5a and 5b are fixed is accommodated inside the heat sink 2 from the opening surface F1 of the heat sink 2, and the aluminum block 3 is arranged on the bottom surface F2. Then, the fastening portion 3a is screwed to the bottom surface F2 using the screws 4a and 4b.

次に、回路基板９を、ヒートシンク２の開口面からヒートシンク２の内部に収容し、支柱２ａ～２ｄに配置する。このとき、リード線６ａ、６ｂを回路基板９に対して半田付けする。そして、ネジ１０ａ～１０ｄを用いて回路基板９を支柱２ａ～２ｄにネジ留めする。 Next, the circuit board 9 is accommodated inside the heat sink 2 from the opening surface of the heat sink 2 and arranged on the support columns 2a to 2d. At this time, the lead wires 6 a and 6 b are soldered to the circuit board 9 . Then, the circuit board 9 is screwed to the posts 2a to 2d using the screws 10a to 10d.

以上の製造方法により、図１～図４に示した発熱電子部品の放熱構造１が製造される。 By the manufacturing method described above, the heat dissipation structure 1 for the heat-generating electronic component shown in FIGS. 1 to 4 is manufactured.

なお、回路基板９のネジ留めの後で、回路基板９の上方に、開口面Ｆ１を閉塞するカバー（図示略）を設けてもよい。 After the circuit board 9 is screwed, a cover (not shown) may be provided above the circuit board 9 to close the opening F1.

以上、本発明の実施の形態について説明したが、本発明は上記実施の形態に限定されず、種々の変形が可能である。以下、変形例について説明する。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications are possible. Modifications will be described below.

（変形例１）
本変形例に係る発熱電子部品の放熱構造１について、図５を用いて説明する。図５は、本変形例に係る発熱電子部品の放熱構造１の一例を示す上面斜視図である。なお、図５において、図１～図４と同じ構成要素には同一符号を付し、その説明は省略する。また、図５では、図１～図３に示した回路基板９の図示を省略している。 (Modification 1)
A heat dissipation structure 1 for a heat-generating electronic component according to this modification will be described with reference to FIG. FIG. 5 is a top perspective view showing an example of a heat dissipation structure 1 for a heat-generating electronic component according to this modification. In FIG. 5, the same components as in FIGS. 1 to 4 are denoted by the same reference numerals, and description thereof will be omitted. 5, illustration of the circuit board 9 shown in FIGS. 1 to 3 is omitted.

本変形例では、図５に示すように、ヒートシンク２において、アルミブロック３０および電子部品３２を備える点が図１～図４と異なる。 This modification differs from FIGS. 1 to 4 in that the heat sink 2 includes an aluminum block 30 and an electronic component 32 as shown in FIG.

アルミブロック３０は、その下部に略直方体の締結部３０ａを有している。なお、図５では、支柱２ａと支柱２ｂとの間にある締結部３０ａのみを図示しているが、これと同様に支柱２ｄと支柱２ｃの間にも締結部３０ａが存在する。 The aluminum block 30 has a substantially rectangular parallelepiped fastening portion 30a at its lower portion. Although FIG. 5 shows only the fastening portion 30a between the pillars 2a and 2b, there is also a fastening portion 30a between the pillars 2d and 2c.

締結部３０ａは、ネジ３１により底面Ｆ２にネジ留めされる。これにより、アルミブロック３０は、底面Ｆ２に接触して固定される。 The fastening portion 30 a is screwed to the bottom surface F<b>2 with screws 31 . Thereby, the aluminum block 30 is fixed in contact with the bottom surface F2.

また、アルミブロック３０は、略直方体状の空間が設けられた収容部３０ｂを有する。この収容部３０ｂの空間には、電子部品３２（例えば、リアクトル部品。高背部品の一例）が収容される。電子部品３２の底面は、ヒートシンク２の底面Ｆ２に接触して固定される。なお、図示は省略しているが、電子部品３２と収容部３０ｂとの間には、ポッティング材が充填されている。 In addition, the aluminum block 30 has an accommodating portion 30b in which a substantially rectangular parallelepiped space is provided. An electronic component 32 (for example, a reactor component, an example of a tall component) is accommodated in the space of the accommodation portion 30b. The bottom surface of the electronic component 32 is fixed in contact with the bottom surface F<b>2 of the heat sink 2 . Although not shown, a potting material is filled between the electronic component 32 and the housing portion 30b.

電子部品３２は、底面Ｆ２と回路基板９（図１～図３参照）の間において、電子部品３２の長手方向が垂直方向Ｄ（図１～図３参照）に沿うように直立して配置される。また、電子部品３２の垂直方向Ｄの長さ（電子部品３２の長手方向の長さ）は、電子部品５ａ、５ｂの垂直方向Ｄの長さ（電子部品５ａ、５ｂの長手方向の長さ）よりも長い。 The electronic component 32 is arranged upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) such that the longitudinal direction of the electronic component 32 is along the vertical direction D (see FIGS. 1 to 3). be. Further, the length of the electronic component 32 in the vertical direction D (the length of the electronic component 32 in the longitudinal direction) is the length of the electronic components 5a and 5b in the vertical direction D (the length of the electronic components 5a and 5b in the longitudinal direction). longer than

このように、電子部品３２を底面Ｆ２に配置することにより、回路基板９と底面Ｆ２との間に空間が設けられ、その空間にアルミブロック３を配置できる。よって、発熱電子部品の放熱構造１がその高さ方向（垂直方向Ｄ）に大型化することはない。 By arranging the electronic component 32 on the bottom surface F2 in this way, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be arranged in the space. Therefore, the heat dissipation structure 1 of the heat-generating electronic component does not become large in its height direction (vertical direction D).

本変形例によれば、実施の形態１で述べた効果に加え、ヒートシンク２の底面Ｆ２に配置された電子部品３２の固定（振動対策）も行うことができる。また、ポッティング材が放熱性のポッティング材である場合には、電子部品３２の固定（振動対策）と放熱も行うことができる。 According to this modification, in addition to the effect described in the first embodiment, it is possible to fix the electronic component 32 arranged on the bottom surface F2 of the heat sink 2 (vibration countermeasure). In addition, when the potting material is a heat-dissipating potting material, it is possible to fix the electronic component 32 (anti-vibration) and to dissipate heat.

（変形例２）
本変形例に係る発熱電子部品の放熱構造１について、図６を用いて説明する。図６は、本変形例に係る発熱電子部品の放熱構造１の一例を示す上面斜視図である。なお、図６において、図１～図４と同じ構成要素には同一符号を付し、その説明は省略する。また、図６では、図１～図３に示した回路基板９の図示を省略している。 (Modification 2)
A heat dissipation structure 1 for a heat-generating electronic component according to this modification will be described with reference to FIG. FIG. 6 is a top perspective view showing an example of a heat dissipation structure 1 for a heat-generating electronic component according to this modification. In FIG. 6, the same components as in FIGS. 1 to 4 are denoted by the same reference numerals, and description thereof will be omitted. 6, illustration of the circuit board 9 shown in FIGS. 1 to 3 is omitted.

本変形例では、図６に示すように、ヒートシンク２において、電子部品３３、３４を備える点が図１～図４と異なる。 1 to 4 in that the heat sink 2 includes electronic components 33 and 34, as shown in FIG.

電子部品３３、３４（例えば、リアクトル部品。高背部品の一例）は、それぞれ、ヒートシンク２の底面Ｆ２に接触して固定される。 The electronic components 33 and 34 (for example, reactor components, an example of tall components) are fixed in contact with the bottom surface F2 of the heat sink 2, respectively.

電子部品３３、３４は、底面Ｆ２と回路基板９（図１～図３参照）の間において、電子部品３３、３４の長手方向が垂直方向Ｄ（図１～図３参照）に沿うように直立して配置される。また、電子部品３３、３４の垂直方向Ｄの長さ（電子部品３３、３４の長手方向の長さ）は、電子部品５ａ、５ｂの垂直方向Ｄの長さ（電子部品５ａ、５ｂの長手方向の長さ）よりも長い。 The electronic components 33, 34 stand upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) so that the longitudinal direction of the electronic components 33, 34 is along the vertical direction D (see FIGS. 1 to 3). are placed as follows. In addition, the length of the electronic components 33 and 34 in the vertical direction D (the length in the longitudinal direction of the electronic components 33 and 34) is equal to the length of the electronic components 5a and 5b in the vertical direction D (the length in the longitudinal direction of the electronic components 5a and 5b). length).

このように、電子部品３３、３４を底面Ｆ２に配置することにより、回路基板９と底面Ｆ２との間に空間が設けられ、その空間にアルミブロック３を配置できる。よって、発熱電子部品の放熱構造１がその高さ方向（垂直方向Ｄ）に大型化することはない。 By arranging the electronic components 33 and 34 on the bottom surface F2 in this way, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be arranged in the space. Therefore, the heat dissipation structure 1 of the heat-generating electronic component does not become large in its height direction (vertical direction D).

本変形例では、実施の形態１で述べた効果に加え、ヒートシンク２の底面Ｆ２に配置された電子部品３３、３４の放熱も行うことができる。 In this modification, in addition to the effects described in the first embodiment, heat can be dissipated from the electronic components 33 and 34 arranged on the bottom surface F2 of the heat sink 2. FIG.

（変形例３）
実施の形態では、ヒートシンク２を用いて空冷を行う場合を例に挙げて説明したが、空冷の代わりに、水冷を適用してもよい。 (Modification 3)
In the embodiment, the case where air cooling is performed using the heat sink 2 has been described as an example, but water cooling may be applied instead of air cooling.

（変形例４）
実施の形態では、アルミブロック３の底面Ｆ２への締結、バネ７ａ、７ｂのアルミブロック３への締結、回路基板９の支柱２ａ～２ｄへの締結にネジを用いる場合を例に挙げて説明したが、ネジの代わりに、ボンドを用いてもよい。また、実施の形態では、電子部品５ａ、５ｂのアルミブロック３への固着にバネを用いる場合を例に挙げて説明したが、バネの代わりに、ネジを用いてもよい。 (Modification 4)
In the embodiment, the case where screws are used for fastening to the bottom surface F2 of the aluminum block 3, fastening the springs 7a and 7b to the aluminum block 3, and fastening the circuit board 9 to the posts 2a to 2d has been described as an example. However, instead of screws, bonds may be used. Further, in the embodiment, the case where springs are used to fix the electronic components 5a and 5b to the aluminum block 3 has been described as an example, but screws may be used instead of the springs.

（変形例５）
また、アルミブロック３と回路基板９は、ボンド１１ａ、１１ｂ（接着部材の一例）により互いに接着して固定される場合を例に挙げて説明したが、グリスやギャップフィラー（放熱部材の一例）等の接着性を有しない放熱性部材をアルミブロック３と回路基板９の間に設けてもよい。これにより、回路基板９で発生した熱を、グリスやギャップフィラー等を介してアルミブロック３へ伝熱できる。また、グリスやギャップフィラーが絶縁性を有する場合、回路基板９においてグリスやギャップフィラーに対応する箇所に、パターンを形成したり、半導体素子を実装したりできる。 (Modification 5)
Also, the case where the aluminum block 3 and the circuit board 9 are bonded and fixed to each other by bonds 11a and 11b (an example of adhesive members) has been described as an example, but grease, gap filler (an example of a heat dissipation member), or the like has been described. A heat dissipating member having no adhesive property may be provided between the aluminum block 3 and the circuit board 9 . As a result, the heat generated in the circuit board 9 can be transferred to the aluminum block 3 via grease, gap filler, or the like. Further, when the grease or the gap filler has insulating properties, it is possible to form a pattern or mount a semiconductor element on the portion of the circuit board 9 corresponding to the grease or the gap filler.

本発明は、車載充電器およびインバータに有用である。 INDUSTRIAL APPLICABILITY The present invention is useful for onboard chargers and inverters .

１ 発熱電子部品の放熱構造
２ ヒートシンク
２ａ、２ｂ、２ｃ、２ｄ 支柱
３、３０ アルミブロック
３ａ、３０ａ 締結部
４ａ、４ｂ、８ａ、８ｂ、１０ａ、１０ｂ、１０ｃ、１０ｄ、３１ ネジ
５ａ、５ｂ 電子部品
６ａ、６ｂ リード線
７ａ、７ｂ バネ
９ 回路基板
３０ｂ 収容部
３２、３３、３４ 電子部品 1 heat dissipation structure of heat-generating electronic component 2 heat sink 2a, 2b, 2c, 2d post 3, 30 aluminum block 3a, 30a fastening portion 4a, 4b, 8a, 8b, 10a, 10b, 10c, 10d, 31 screw 5a, 5b electronic component 6a, 6b Lead wire 7a, 7b Spring 9 Circuit board 30b Housing 32, 33, 34 Electronic component

Claims (12)

回路基板と、
通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、
前記発熱電子部品の放熱面が熱的に接続され、前記発熱電子部品が配置される伝熱体と、
第１の面を有し、前記第１の面を介して前記伝熱体と熱的に接続する放熱部品と、を有し、
前記伝熱体は、リアクトル部品を収容する空間が設けられた収容部を有し、
前記リアクトル部品は、前記放熱部品と熱的に接続され、
前記リアクトル部品と前記収容部との間に放熱性を有するポッティング材が充填されていることで、前記リアクトル部品と前記伝熱体とは、前記ポッティング材により熱的に接続され、
前記発熱電子部品は、
前記放熱部品に接触しない状態で、前記伝熱体に固定され、
前記伝熱体は、第２の面と前記第２の面と対向する第３の面とを有し、
前記伝熱体は、前記第２の面を介して前記発熱電子部品と熱的に接続され、
前記伝熱体は、前記第３の面を介して前記ポッティング材により前記リアクトル部品と
熱的に接続される、
車載充電器。 a circuit board;
a heat-generating electronic component that self-heats when energized and has lead wires connected to the circuit board;
a heat transfer body to which a heat dissipation surface of the heat-generating electronic component is thermally connected and on which the heat-generating electronic component is disposed;
a heat dissipation component having a first surface and thermally connecting to the heat transfer body via the first surface;
The heat transfer body has a housing portion provided with a space for housing the reactor component,
The reactor component is thermally connected to the heat dissipation component,
A potting material having a heat dissipation property is filled between the reactor part and the accommodating portion, so that the reactor part and the heat transfer body are thermally connected by the potting material,
The heat-generating electronic component is
fixed to the heat conductor without contacting the heat dissipating component;
The heat transfer body has a second surface and a third surface facing the second surface,
the heat conductor is thermally connected to the heat-generating electronic component through the second surface;
The heat transfer body is thermally connected to the reactor component by the potting material via the third surface,
car charger . 前記発熱電子部品は、その長手方向が前記第１の面に対して垂直な第１の方向に平行となる状態で前記伝熱体に固定される、
請求項１に記載の車載充電器。 The heat-generating electronic component is fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to the first surface.
The vehicle-mounted charger according to claim 1. 前記伝熱体は、
接着部材により前記回路基板に接着して固定される、
請求項２に記載の車載充電器。 The heat transfer body is
Adhered and fixed to the circuit board by an adhesive member;
The vehicle-mounted charger according to claim 2. 前記接着部材は、
絶縁性または放熱性の少なくとも一方を有する、
請求項３に記載の車載充電器。 The adhesive member
having at least one of insulation or heat dissipation,
The vehicle-mounted charger according to claim 3. 前記伝熱体と前記回路基板の間に放熱部材が配置される、
請求項１から４のいずれか１項に記載の車載充電器。 A heat dissipating member is arranged between the heat conductor and the circuit board;
The vehicle-mounted charger according to any one of claims 1 to 4. 前記伝熱体と前記回路基板の間に絶縁性および放熱性を有する部材が配置され、
前記回路基板において、前記絶縁性および放熱性を有する部材に対応する箇所に、パターンが形成される、
請求項１から５のいずれか１項に記載の車載充電器。 A member having insulating properties and heat dissipation properties is arranged between the heat conductor and the circuit board,
A pattern is formed in a portion of the circuit board corresponding to the insulating and heat-dissipating member.
The vehicle-mounted charger according to any one of claims 1 to 5. 前記絶縁性および放熱性を有する部材は、接着性も有する、
請求項６に記載の車載充電器。 The member having insulation and heat dissipation also has adhesiveness,
The vehicle-mounted charger according to claim 6. 前記リアクトル部品は、高背部品であり、
前記高背部品の前記第１の方向の長さは、前記発熱電子部品の前記第１の方向の長さよりも長い、
請求項２に記載の車載充電器。 The reactor component is a tall component,
The length of the tall component in the first direction is longer than the length of the heat-generating electronic component in the first direction,
The vehicle-mounted charger according to claim 2. 前記リアクトル部品は、前記放熱部品と、放熱性を有する前記ポッティング材により熱的に接続されている、
請求項１に記載の車載充電器。 The reactor component is thermally connected to the heat dissipation component by the potting material having heat dissipation properties,
The vehicle-mounted charger according to claim 1. 前記伝熱体は、前記リアクトル部品を収容する空間が設けられた収容部により前記リアクトル部品を保持する、
請求項１に記載の車載充電器。 The heat transfer body holds the reactor component by an accommodating portion provided with a space for accommodating the reactor component.
The vehicle-mounted charger according to claim 1. 前記リアクトル部品は、前記収容部を介して前記放熱部品と熱的に接続される、
請求項１０に記載の車載充電器。 The reactor component is thermally connected to the heat radiating component via the accommodating portion,
The vehicle-mounted charger according to claim 10. 回路基板と、
通電によって自己発熱し、前記回路基板と接続されるリード線を有する発熱電子部品と、
前記発熱電子部品の放熱面が熱的に接続され、前記発熱電子部品が配置される伝熱体と、
第１の面を有し、前記第１の面を介して前記伝熱体と熱的に接続する放熱部品と、を有し、
前記伝熱体は、リアクトル部品を収容する空間が設けられた収容部を有し、
前記リアクトル部品は、前記放熱部品と熱的に接続され、
前記リアクトル部品と前記収容部との間に放熱性を有するポッティング材が充填されることで、前記リアクトル部品と前記伝熱体とは、前記ポッティング材により熱的に接続され、
前記発熱電子部品は、
前記放熱部品に接触しない状態で、前記伝熱体に固定され、
前記伝熱体は、第２の面と前記第２の面と対向する第３の面とを有し、
前記伝熱体は、前記第２の面を介して前記発熱電子部品と熱的に接続され、
前記伝熱体は、前記第３の面を介して前記ポッティング材により前記リアクトル部品と熱的に接続される、
インバータ。 a circuit board;
a heat-generating electronic component that self-heats when energized and has lead wires connected to the circuit board;
a heat transfer body to which a heat dissipation surface of the heat-generating electronic component is thermally connected and on which the heat-generating electronic component is arranged;
a heat dissipation component having a first surface and thermally connecting to the heat transfer body via the first surface;
The heat transfer body has a housing portion provided with a space for housing the reactor component,
The reactor component is thermally connected to the heat dissipation component,
By filling a space between the reactor component and the accommodating portion with a potting material having heat dissipation properties, the reactor component and the heat transfer body are thermally connected by the potting material,
The heat-generating electronic component is
fixed to the heat conductor without contacting the heat dissipating component;
The heat transfer body has a second surface and a third surface facing the second surface,
the heat conductor is thermally connected to the heat-generating electronic component through the second surface;
The heat transfer body is thermally connected to the reactor component by the potting material via the third surface,
inverter .
JP2021178787A 2015-12-10 2021-11-01 Onboard charger and inverter Active JP7262012B2 (en)

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