JP7452819B2 - 高分子組成物 - Google Patents
高分子組成物 Download PDFInfo
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- JP7452819B2 JP7452819B2 JP2021180436A JP2021180436A JP7452819B2 JP 7452819 B2 JP7452819 B2 JP 7452819B2 JP 2021180436 A JP2021180436 A JP 2021180436A JP 2021180436 A JP2021180436 A JP 2021180436A JP 7452819 B2 JP7452819 B2 JP 7452819B2
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- polymer
- block copolymer
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- 229920000642 polymer Polymers 0.000 title claims description 233
- 239000000203 mixture Substances 0.000 title claims description 59
- 229920001400 block copolymer Polymers 0.000 claims description 208
- 125000004432 carbon atom Chemical group C* 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 50
- 125000004429 atom Chemical group 0.000 claims description 42
- 239000000126 substance Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 38
- 239000013598 vector Substances 0.000 claims description 34
- 238000004519 manufacturing process Methods 0.000 claims description 31
- 125000002947 alkylene group Chemical group 0.000 claims description 25
- 230000007704 transition Effects 0.000 claims description 25
- 238000002441 X-ray diffraction Methods 0.000 claims description 23
- 125000004450 alkenylene group Chemical group 0.000 claims description 23
- 125000004419 alkynylene group Chemical group 0.000 claims description 23
- 125000000217 alkyl group Chemical group 0.000 claims description 22
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 21
- 229910052717 sulfur Inorganic materials 0.000 claims description 20
- 125000004434 sulfur atom Chemical group 0.000 claims description 20
- 125000005843 halogen group Chemical group 0.000 claims description 18
- 229920005597 polymer membrane Polymers 0.000 claims description 18
- 229920006254 polymer film Polymers 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 125000001424 substituent group Chemical group 0.000 claims description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
- 238000000113 differential scanning calorimetry Methods 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000012528 membrane Substances 0.000 claims description 6
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 3
- 230000001939 inductive effect Effects 0.000 claims description 2
- 239000000178 monomer Substances 0.000 description 29
- 125000003118 aryl group Chemical group 0.000 description 26
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 24
- 238000001338 self-assembly Methods 0.000 description 17
- 239000000523 sample Substances 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 125000003342 alkenyl group Chemical group 0.000 description 10
- 125000000304 alkynyl group Chemical group 0.000 description 10
- 238000010560 atom transfer radical polymerization reaction Methods 0.000 description 10
- 238000005227 gel permeation chromatography Methods 0.000 description 10
- 125000005647 linker group Chemical group 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 229910052799 carbon Inorganic materials 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 125000003545 alkoxy group Chemical group 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 238000005191 phase separation Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 238000005481 NMR spectroscopy Methods 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 6
- 125000000732 arylene group Chemical group 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 230000007935 neutral effect Effects 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000001747 exhibiting effect Effects 0.000 description 5
- -1 methacryloyl group Chemical group 0.000 description 5
- 230000002441 reversible effect Effects 0.000 description 5
- 238000003878 thermal aging Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 230000032683 aging Effects 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- NZZFYRREKKOMAT-UHFFFAOYSA-N diiodomethane Chemical compound ICI NZZFYRREKKOMAT-UHFFFAOYSA-N 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 238000013467 fragmentation Methods 0.000 description 4
- 238000006062 fragmentation reaction Methods 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 229920001519 homopolymer Polymers 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001721 carbon Chemical group 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229920000359 diblock copolymer Polymers 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- LVJZCPNIJXVIAT-UHFFFAOYSA-N 1-ethenyl-2,3,4,5,6-pentafluorobenzene Chemical compound FC1=C(F)C(F)=C(C=C)C(F)=C1F LVJZCPNIJXVIAT-UHFFFAOYSA-N 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- FHXJDKPJCDJBEM-UHFFFAOYSA-N 4-dodecoxyphenol Chemical compound CCCCCCCCCCCCOC1=CC=C(O)C=C1 FHXJDKPJCDJBEM-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 241000446313 Lamella Species 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 150000001339 alkali metal compounds Chemical class 0.000 description 2
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000004440 column chromatography Methods 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 125000001188 haloalkyl group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- PYLWMHQQBFSUBP-UHFFFAOYSA-N monofluorobenzene Chemical compound FC1=CC=CC=C1 PYLWMHQQBFSUBP-UHFFFAOYSA-N 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 239000012985 polymerization agent Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- PBLNBZIONSLZBU-UHFFFAOYSA-N 1-bromododecane Chemical compound CCCCCCCCCCCCBr PBLNBZIONSLZBU-UHFFFAOYSA-N 0.000 description 1
- IDSLBLWCPSAZBL-UHFFFAOYSA-N 2-cyanopropan-2-yl benzenecarbodithioate Chemical compound N#CC(C)(C)SC(=S)C1=CC=CC=C1 IDSLBLWCPSAZBL-UHFFFAOYSA-N 0.000 description 1
- 125000005916 2-methylpentyl group Chemical group 0.000 description 1
- 229960000549 4-dimethylaminophenol Drugs 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229940030980 inova Drugs 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920006030 multiblock copolymer Polymers 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000002073 nanorod Substances 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 150000003498 tellurium compounds Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F293/00—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule
- C08F293/005—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule using free radical "living" or "controlled" polymerisation, e.g. using a complexing agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/20—Manufacture of shaped structures of ion-exchange resins
- C08J5/22—Films, membranes or diaphragms
- C08J5/2206—Films, membranes or diaphragms based on organic and/or inorganic macromolecular compounds
- C08J5/2218—Synthetic macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/22—Esters containing halogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/38—Esters containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F228/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a bond to sulfur or by a heterocyclic ring containing sulfur
- C08F228/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a bond to sulfur or by a heterocyclic ring containing sulfur by a bond to sulfur
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/20—Manufacture of shaped structures of ion-exchange resins
- C08J5/22—Films, membranes or diaphragms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D153/00—Coating compositions based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Description
3nm-1~5nm-1=nq/(2×π)
本出願のブロック共重合体または前記ブロック共重合体のいずれか一つの高分子セグメントは、DSC(Differential scanning calorimetry)分析で-80~200の範囲内で融解転移(melting transition)ピークまたは等方転移(isotropic transition)ピークを示すことができる。ブロック共重合体または前記ブロック共重合体のいずれか一つの高分子セグメントは、融解転移ピークまたは等方転移ピークのうちいずれか一つのピークのみを示すことができ、または、2つのピークの両方を示すことができる。このようなブロック共重合体は、自己組織化に適合した結晶(crystal)相および/または液晶(liquid crystal)相を全体的に示すか、あるいはそのような結晶相および/または液晶相を示す高分子セグメントを含む共重合体であってもよい。前記条件1を満たす高分子セグメントは、高分子セグメントAであってもよい。
10℃≦Tm-12.25×n+149.5≦10℃
本出願のブロック共重合体は、XRD分析(X線回折分析、X-ray Diffraction analysis)時に所定範囲の散乱ベクトル(q)内で少なくとも一つのピークを示す高分子セグメントを含んでいてもよい。条件2を満たす高分子セグメントは、前記高分子セグメントAであってもよい。
本出願のブロック共重合体は、高分子セグメントAとして、後述する側鎖を有する高分子セグメントを含むことができ、前記側鎖の鎖形成原子の数(n)が、前記条件2と同じ方式で行われるX線回折分析により求められる散乱ベクトル(q)と下記数式1を満たすことができる。
3nm-1~5nm-1=nq/(2×π)
本出願のブロック共重合体の高分子セグメントAの表面エネルギーと高分子セグメントBの表面エネルギーとの差の絶対値が10mN/m以下、9mN/m以下、8mN/m以下、7.5mN/m以下または7mN/m以下であってもよい。前記表面エネルギーの差の絶対値は、1.5mN/m、2mN/mまたは2.5mN/m以上であってもよい。このような範囲の表面エネルギーの差の絶対値を有する高分子セグメントAおよびBが共有結合により連結された構造は、効果的な微細相分離(microphase seperation)を誘導することができる。前記で高分子セグメントAは、例えば、後述する側鎖を有する高分子セグメントであってもよい。
ブロック共重合体において高分子セグメントAと高分子セグメントBの密度差の絶対値は、0.25g/cm3以上、0.3g/cm3以上、0.35g/cm3以上、0.4g/cm3以上または0.45g/cm3以上であってもよい。前記密度差の絶対値は、0.9g/cm3以上、0.8g/cm3以下、0.7g/cm3以下、0.65g/cm3以下または0.6g/cm3以下であってもよい。このような範囲の密度差の絶対値を有する高分子セグメントAと高分子セグメントBが共有結合により連結された構造は、好適な非相溶性による相分離によって効果的な微細相分離(microphase seperation)を誘導することができる。
NMR分析は、三重共鳴5mmプローブを有するVarian Unity Inova(500 MHz)分光計を含むNMR分光計を使用して常温で行った。NMR測定用溶媒(CDCl3)に分析対象物質を約10mg/mL程度の濃度で希釈させて使用し、化学的移動は、ppmで表現した。
br=広い信号、s=単一線、d=二重線、dd=二重二重線、t=三重線、dt=二重三重線、q=四重線、p=五重線、m=多重線。
数平均分子量(Mn)および分子量分布は、GPC(Gel permeation chromatography)を使用して測定した。5mLのバイアル(vial)に実施例または比較例のブロック共重合体または巨大開始剤などの分析対象物質を入れ、約1mg/mL程度の濃度になるようにTHF(tetrahydro furan)に希釈する。その後、キャリブレーション用標準試料と分析しようとする試料をシリンジフィルタ(細孔サイズ:0.45μm)を通じて濾過させた後に測定した。分析プログラムは、Agilent technologies社のChemStationを使用し、試料の溶出時間(elution time)を検量線(calibration curve)と比較して重量平均分子量(Mw)および数平均分子量(Mn)をそれぞれ求め、その比率(Mw/Mn)で分子量分布(PDI)を計算した。GPCの測定条件は、下記の通りである。
機器:Agilent technologies社の1200series
カラム:Polymer laboratories社のPLgel mixed B 2個使用
溶媒:THF
カラム温度:35℃
サンプル濃度:1mg/mL、200L注入
標準試料:ポリスチレン(Mp:3900000、723000、316500、52200、31400、7200、3940、485)
XRD分析は、浦項加速器4Cビームラインで試料にX線を透過させて散乱ベクトル(q)による散乱強度を測定することにより測定した。試料としては、特別な前処理なしに合成されたブロック共重合体を精製した後、真空オーブンで約1日間維持することにより、乾燥させた粉末状態のブロック共重合体をXRD測定用セルに入れて使用した。XRDパターン分析時には、垂直サイズが0.023mmであり、水平サイズが0.3mmであるX線を利用し、検出器としては、2D marCCDを利用した。散乱して出る2D回折パターンをイメージとして得た。得られた回折パターンを最小二乗法を適用した数値分析学的な方式で分析して散乱ベクトルおよび半値全幅などの情報を得た。前記分析時には、オリジンプログラムを適用し、XRD回折パターンにおいて最も最小の強度を示す部分をベースラインとして取って前記での強度を0になるようにした状態で前記XRDパターンピークのプロファイルをガウシアンフィッティングし、フィッティングされた結果から前記散乱ベクトルと半値全幅を求めた。ガウシアンフィッティング時にR二乗は、少なくとも0.96以上になるようにした。
表面エネルギーは、水滴型分析器(Drop Shape Analyzer,KRUSS社のDSA100製品)を使用して測定した。測定しようとする物質(重合体)をフルオロベンゼンに約2重量%の固形分の濃度で希釈させてコーティング液を製造し、製造されたコーティング液をシリコンウェハーに約50nmの厚さおよび4cm2のコーティング面積(横:2cm、縦:2cm)でスピンコートした。コーティング層を常温で約1時間乾燥し、引き続いて約160℃で約1時間熱的熟成させた。熱的熟成を経た膜に表面張力が公知となっている脱イオン化水を落とし、その接触角を求める過程を5回繰り返して、得られた5個の接触角の数値の平均値を求めた。同一に、表面張力が公知となっているジヨードメタンを落とし、その接触角を求める過程を5回繰り返して、得られた5個の接触角の数値の平均値を求めた。求められた脱イオン化水とジヨードメタンに対する接触角の平均値を利用してOwens-Wendt-Rabel-Kaelble方法により溶媒の表面張力に関する数値(Strom値)を代入して表面エネルギーを求めた。ブロック共重合体の各高分子セグメントに対する表面エネルギーの数値は、前記高分子セグメントを形成する単量体だけで製造された単独重合体(homopolymer)に対して前記記述した方法で求めた。
ブロック共重合体の各高分子セグメントの体積分率は、各高分子セグメントの常温での密度とGPCにより測定された分子量に基づいて計算した。前記で密度は、浮力法を利用して測定し、具体的には、空気中での質量と密度を知っている溶媒(エタノール)内に分析しようとする試料を入れ、その質量を用いて計算した。
下記化学式Aの化合物(DPM-C12)は、次の方式で合成した。250mLのフラスコにヒドロキノン(10.0g、94.2mmol)および1-ブロモドデカン(23.5g、94.2mmol)を入れ、100mLのアセトニトリルに溶かした後、過量の炭酸カリウムを添加し、75℃で約48時間窒素条件下で反応させた。反応後に残存する炭酸カリウムをフィルタリングして除去し、反応に使用したアセトニトリルをも除去した。これにDCM(dichloromethane)と水の混合溶媒を添加し、ワークアップし、分離した有機層を集めてMgSO4に通過させて脱水した。引き続いて、カラムクロマトグラフィーでDCM(dichloromethane)を使用して白色固体状の目的物(4-ドデシルオキシフェノール)(9.8g、35.2mmol)を約37%の収得率で得た。
1H-NMR(CDCl3):d6.77(dd、4H);δd4.45(s、1H);d3.89(t、2H);d1.75(p、2H);d1.43(p、2H);d1.33-1.26(m、16H);d0.88(t、3H)。
1H-NMR(CDCl3):d7.02(dd、2H);δd6.89(dd、2H);d6.32(dt、1H);d5.73(dt、1H);d3.94(t、2H);δd2.05(dd、3H);d1.76(p、2H);δd1.43(p、2H);1.34-1.27(m、16H);d0.88(t、3H)。
製造例1のモノマー(A)4.0gとRAFT(Reversible Addition-Fragmentation chain Transfer)試薬であるシアノイソプロピルジチオベンゾエート64mg、ラジカル開始剤であるAIBN(Azobisisobutyronitrile)23mgおよびベンゼン5.34mLを10mLのシュレンクフラスコ(Schlenk flask)に入れ、窒素の雰囲気下で常温で30分間撹拌した後、70℃で4時間RAFT(Reversible Addition-Fragmentation chain Transfer)重合反応を行った。重合後、反応溶液を抽出溶媒であるメタノール250mLに沈殿させた後、減圧濾過して乾燥させ、ピンク色の巨大開始剤を製造した。前記巨大開始剤の数平均分子量(Mn)および分子量分布(Mw/Mn)は、それぞれ18,000g/molおよび1.15であった。
製造例2と同じ方式でブロック共重合体を製造するものの、単量体と巨大開始剤のモル比などを調節して、分子量が互いに異なる5種のブロック共重合体をさらに製造した。各製造過程で使用された巨大開始剤およびブロック共重合体の特性を下記表1に整理して記載した。
製造例2のブロック共重合体(A)と製造例6のブロック共重合体(E)を混合して高分子組成物を製造した。高分子組成物の具体的な組成は、下記表2に整理して記載した。引き続いて、前記高分子組成物をトルエンに1.5重量%程度の固形分の濃度で希釈させて製造したコーティング液を基板上にスピンコートし、常温で1時間程度乾燥した後、約200℃程度の温度で約10分間熱的熟成して自己組織化された膜を形成した。前記で基板としては、公知のシリコンウェハーとして、表面に何らの中性処理が施されていない基板を適用した。前記形成された膜に対してSEM(Scanning electron microscope)イメージを撮影した。図1は、前記実施例1に対して撮影したSEMイメージであり、図面から確認されるように、実施例1の高分子組成物の場合、垂直配向された自己組織化シリンダー構造が効果的に形成されたことを確認した。
高分子組成物の製造時に適用されたブロック共重合体の種類および比率などを下記表2のように変更したことを除いて、実施例1と同一に高分子膜を形成し、これに対する評価結果は、下記表2に整理して記載した。
Claims (15)
- 高分子セグメントAと高分子セグメントBを有する第1ブロック共重合体と、前記第1ブロック共重合体とは異なる数平均分子量を有し、高分子セグメントAと高分子セグメントBを有する第2ブロック共重合体とを含む高分子組成物を使用して高分子膜を形成し、前記高分子膜内に前記ブロック共重合体のシリンダー構造を誘導する段階を含み、高分子セグメントAは、鎖形成原子が8個以上の側鎖を含み、
高分子セグメントBは、3個以上のハロゲン原子を含み、
前記高分子セグメントAは、下記化学式1で表示される単位を含み、
[化学式1]
高分子セグメントBは、下記化学式3で表示される単位を含み、
[化学式3]
- 高分子組成物内のブロック共重合体のうち第1ブロック共重合体が最も小さい数平均分子量(M1)を有し、前記数平均分子量(M1)は、5~60Kg/molの範囲内にある、請求項1に記載の高分子膜の製造方法。
- 高分子組成物内のすべてのブロック共重合体の合計重量を基準とする第1ブロック共重合体の重量比が10重量%~90重量%の範囲内である、請求項2に記載の高分子膜の製造方法。
- 高分子組成物内のすべてのブロック共重合体のモル数の合計を基準とする第1ブロック共重合体のモル比率が10モル%~90モル%の範囲内である、請求項2に記載の高分子膜の製造方法。
- 高分子組成物内のブロック共重合体のうち第2ブロック共重合体が最も大きい数平均分子量(M2)を有し、前記数平均分子量(M2)は、10~100Kg/molの範囲内にある、請求項1から4のいずれか一項に記載の高分子膜の製造方法。
- 高分子組成物内のすべてのブロック共重合体の重量の合計を基準とする第2ブロック共重合体の重量比が10重量%~90重量%の範囲内である、請求項5に記載の高分子膜の製造方法。
- 高分子組成物内のすべてのブロック共重合体のモル数の合計を基準とする第2ブロック共重合体のモル比率が10モル%~90モル%の範囲内である、請求項5に記載の高分子膜の製造方法。
- 第1ブロック共重合体の数平均分子量(M1)と第2ブロック共重合体の数平均分子量(M2)の比率(M2/M1)が1.2~10の範囲内である、請求項1に記載の高分子膜の製造方法。
- 第1ブロック共重合体の数平均分子量(M1)と第2ブロック共重合体の数平均分子量(M2)の差(M2-M1)が100Kg/mol以下である、請求項1に記載の高分子膜の製造方法。
- 高分子セグメントAは、下記条件1~3のうちいずれか一つの条件を満たす、請求項1から9のいずれか一項に記載の高分子膜の製造方法:
条件1:DSC分析の-80℃~200℃の範囲内で融解転移ピークまたは等方転移ピークを示す:
条件2:XRD分析の0.5nm-1~10nm-1の散乱ベクトル(q)範囲内で半値全幅が0.2~0.9nm-1の範囲内であるピークを示す:
条件3:側鎖を含み、前記側鎖の鎖形成原子の数(n)が、XRD分析での散乱ベクトル(q)と下記数式1を満たす:
[数式1]
3nm-1~5nm-1=nq/(2×π)
数式1でnは、前記鎖形成原子の数であり、qは、前記ブロック共重合体に対するX線回折分析でピークが観察される最も小さい散乱ベクトル(q)または最も大きいピーク面積のピークが観察される散乱ベクトル(q)である。 - 高分子セグメントAおよびBの表面エネルギーの差の絶対値が2.5~7mN/mの範囲内である、請求項10に記載の高分子膜の製造方法。
- 高分子組成物内のすべての高分子セグメントAの体積分率の合計が0.5~0.7の範囲内であり、高分子組成物内のすべての高分子セグメントAとすべての高分子セグメントBの体積分率の合計が1である、請求項1から11のいずれか一項に記載の高分子膜の製造方法。
- 基板と、前記基板上に形成されている高分子膜とを含む積層体であり、前記高分子膜は、高分子セグメントAと高分子セグメントBを有する第1ブロック共重合体と、前記第1ブロック共重合体とは異なる数平均分子量を有し、高分子セグメントAと高分子セグメントBを有する第2ブロック共重合体とを含む高分子組成物を使用して形成された高分子膜であり、前記高分子膜内に前記ブロック共重合体のシリンダー構造が形成されている高分子膜から前記高分子セグメントAおよびBのうちいずれか一つの高分子セグメントを選択的に除去する段階を含み、高分子セグメントAは、鎖形成原子が8個以上の側鎖を含み、高分子セグメントBは、3個以上のハロゲン原子を含み、
前記高分子セグメントAは、下記化学式1で表示される単位を含み、
[化学式1]
高分子セグメントBは、下記化学式3で表示される単位を含み、
[化学式3]
- 高分子膜は、基板に直接当接して形成されている、請求項13に記載のパターン化基板の製造方法。
- 高分子セグメントが除去された高分子膜をマスクとして基板をエッチングする段階をさらに含む、請求項13または14に記載のパターン化基板の製造方法。
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US8834956B2 (en) | 2009-06-22 | 2014-09-16 | Micron Technology, Inc. | Methods of utilizing block copolymer to form patterns |
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US10287430B2 (en) | 2014-09-30 | 2019-05-14 | Lg Chem, Ltd. | Method of manufacturing patterned substrate |
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