JP7435001B2 - 異方導電性接着フィルム、接続構造体及びその製造方法 - Google Patents
異方導電性接着フィルム、接続構造体及びその製造方法 Download PDFInfo
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- JP7435001B2 JP7435001B2 JP2020024529A JP2020024529A JP7435001B2 JP 7435001 B2 JP7435001 B2 JP 7435001B2 JP 2020024529 A JP2020024529 A JP 2020024529A JP 2020024529 A JP2020024529 A JP 2020024529A JP 7435001 B2 JP7435001 B2 JP 7435001B2
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- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000001624 naphthyl group Chemical class 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000005474 octanoate group Chemical group 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
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- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- LFULEKSKNZEWOE-UHFFFAOYSA-N propanil Chemical compound CCC(=O)NC1=CC=C(Cl)C(Cl)=C1 LFULEKSKNZEWOE-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- VNJISVYSDHJQFR-UHFFFAOYSA-N tert-butyl 4,4-dimethylpentaneperoxoate Chemical compound CC(C)(C)CCC(=O)OOC(C)(C)C VNJISVYSDHJQFR-UHFFFAOYSA-N 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
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- Manufacturing Of Electrical Connectors (AREA)
Description
(測定条件)
装置:東ソー株式会社製 GPC-8020
検出器:東ソー株式会社製 RI-8020
カラム:日立化成株式会社製 Gelpack GLA160S+GLA150S
試料濃度:120mg/3mL
溶媒:テトラヒドロフラン
注入量:60μL
圧力:2.94×106Pa(30kgf/cm2)
流量:1.00mL/min
まず、接着フィルム1を200℃の加熱炉に入れ、1時間加熱することで、接着フィルム1を硬化させて硬化物を得る。その硬化物を2.0mm×20.0mmの短冊状に切り出し、測定試料とする。なお、接着フィルム1の短辺が2.0mm未満である場合は、その短辺の長さ×20.0mmの短冊状に切り出して測定試料とする。その測定試料について、動的粘弾性測定装置(例えば、装置名RSA III、ティー・エイ・インスツルメント社製)を用いて、周波数10Hz、昇温速度10℃/分の条件で、40℃における貯蔵弾性率を測定する。
以下の表1,2に示す配合で接着成分を調製した後、ポリマー粒子と当該ポリマー粒子を被覆するNiめっき層とを備える導電性粒子(平均粒径:3μm)を接着成分中に分散させて、接着成分と導電性粒子の混合物を得た。このとき、導電性粒子の粒子密度が30,000個/mm2となるような量の導電性粒子を用いた。得られた混合物を、乾燥後の厚みが20μmとなるように、剥離処理されたPETフィルム上に塗布し、各実施例及び比較例の異方導電性接着フィルムを作製した。
得られた各異方導電性接着フィルムを200℃の加熱炉に入れ、1時間加熱することで硬化させた。異方導電性接着フィルムの硬化物をPETフィルムから剥離し、2.0mm×20.0mmの短冊状に切り出し、測定試料とした。その測定試料について、動的粘弾性測定装置(装置名RSA III、ティー・エイ・インスツルメント社製)を用いて、周波数10Hz、昇温速度10℃/分の条件で、40℃における貯蔵弾性率を測定した。結果を表1,2に示す。
-接続抵抗(導通抵抗)の評価-
作製した各異方導電性接着フィルムを用いて、金バンプ付きICチップ(0.9mm×20.3mm、厚み:0.3mm)と、Ti/Al/Ti回路付きプラスチック基板(厚み:0.05mm)との接続を以下のとおり行った。なお、金バンプの面積は12μm×100μmであった。金バンプ間のスペース(ピッチ)は12μmであった。金バンプの高さは15μmであった。
A:接続抵抗値が5Ω未満
B:接続抵抗値が5Ω以上
評価電子部材として、金バンプ付きICチップ(1.7mm×17mm、厚み:0.5mm)とプラスチック基材(厚み:0.05mm)を用いた。
異方導電性接着フィルムを2.5mm幅に切り出し、異方導電性接着フィルムがプラスチック基板に接するように、プラスチック基材に貼り付けた。異方導電性接着フィルム上に、金バンプ付きICチップ配置した後、ヒートツールを10mm×50mmで用い、緩衝材として厚み50μmのテフロン(登録商標)を介し、170℃、60MPaの条件で、5秒間加熱及び加圧することで、接続構造体を得た。
A:接着強度が10MPa以上
B:接着強度が10MPa未満
評価電子部材として、金バンプ付きICチップ(1.7mm×17mm、厚み:0.5mm)とプラスチック基板(厚み:0.05mm)を用いた。
異方導電性接着フィルムを2.5mm幅に切り出し、異方導電性接着フィルムがプラスチック基板に接するように、プラスチック基板に貼り付けた。異方導電性接着フィルム上に、金バンプ付きICチップ配置した後、ヒートツールを10mm×50mmで用い、緩衝材として厚み50μmのテフロン(登録商標)を介し、170℃、60MPaの条件で、5秒間加熱及び加圧することで、接続構造体を得た。
作製した接続構造体について、初期のピール強度を、引張り試験器(STA-1150、株式会社オリエンテック製)を用い、測定速度50mm/分でプラスチック基板を引上げて測定した。得られたピール強度を下記の基準に基づき評価した。結果を表1,2に示す。
A:ピール強度が100N/m以上
B:ピール強度が100N/m未満
PKHC:ビスフェノールA型フェノキシ樹脂(巴工業株式会社製、酢酸エチル/トルエン=50/50(質量比)の混合溶媒に40質量%溶解させたもの)
ZX1356-2:ビスフェノールA型とビスフェノールF型の共重合型フェノキシ樹脂(新日鉄住金化学株式会社製、酢酸エチル/トルエン=50/50(質量比)の混合溶媒に45質量%溶解させたもの)
FX316:ビスフェノールF型フェノキシ樹脂(新日鉄住金化学株式会社製、酢酸エチル/トルエン=50/50(質量比)の混合溶媒に60質量%溶解させたもの)
HP-4032D:ナフタレン型エポキシ樹脂(DIC株式会社製)
EXA-4850:ポリアルキレンオキシ化ビスフェノールA型エポキシ樹脂(DIC株式会社)
SH-6040:シランカップリング剤(東レ・ダウコーニング株式会社製)
SI-60LA:重合開始剤(三新化学工業株式会社製)
UR-4800:共重合ポリエステルウレタン樹脂(東洋紡株式会社、メチルエチルケトン/トルエン=50/50(質量比)の混合溶媒に32質量%溶解させたもの)
UR-8200:共重合ポリエステルポリウレタン樹脂(東洋紡株式会社、メチルエチルケトン/トルエン=50/50(質量比)の混合溶媒に30質量%溶解させたもの)
UR-4125:共重合ポリエステルポリウレタン樹脂(東洋紡株式会社、メチルエチルケトン/トルエン=50/50(質量比)の混合溶媒に23質量%溶解させたもの)
UR-5537:共重合ポリエステルポリウレタン樹脂(東洋紡株式会社、メチルエチルケトン/トルエン=50/50(質量比)の混合溶媒に30質量%溶解させたもの)
UA-5500-70T:ウレタンアクリレート(新中村化学工業株式会社、トルエンに70質量%溶解させたもの)
DCPA:トリシクロデカンジメタノールジアクリレート(共栄社化学株式会社製)
M215:イソシアヌル酸EO変性ジアクリレート(東亜合成株式会社製)
M315:イソシアヌル酸EO変性トリアクリレート(東亜合成株式会社製)
KBE502:3-メタアクリロキシプロピルメチルジエトキシシラン(信越化学工業株式会社製)
ナイパーBMT-K40:重合開始剤(日油株式会社製)
LA7RT:重合禁止剤(旭電化工業株式会社製)
Claims (3)
- 熱硬化性の接着成分と、導電性粒子と、を含有する異方導電性接着フィルムであって、
前記異方導電性接着フィルムを200℃、1時間の条件で熱硬化させた硬化物が、40℃において0.7GPa~1.5GPaの貯蔵弾性率を有する、異方導電性接着フィルム(ただし、エポキシ樹脂と、エポキシ樹脂硬化剤と、平均粒径300nm以下のシリコーン微粒子と、を含有する異方導電性接着フィルムを除く)。 - プラスチック基板、及び前記プラスチック基板上に設けられた電極を有する第一の電子部材と、
第二の電子部材と、
前記第一の電子部材と前記第二の電子部材とを互いに電気的に接続する接続部材と、を備え、
前記接続部材が、請求項1に記載の異方導電性接着フィルムの硬化物である、接続構造体。 - プラスチック基板、及び前記プラスチック基板上に設けられた電極を有する第一の電子部材と、第二の電子部材との間に、請求項1に記載の異方導電性接着フィルムを配置し、前記異方導電性接着フィルムを介して前記第一の電子部材と前記第二の電子部材とを熱圧着して、前記第一の電子部材と前記第二の電子部材とを電気的に接続する工程を備える、接続構造体の製造方法。
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JP2005166438A (ja) | 2003-12-02 | 2005-06-23 | Hitachi Chem Co Ltd | 回路接続材料、及びこれを用いた回路部材の接続構造 |
WO2009051067A1 (ja) | 2007-10-18 | 2009-04-23 | Hitachi Chemical Company, Ltd. | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 |
JP2009194359A (ja) | 2008-01-16 | 2009-08-27 | Hitachi Chem Co Ltd | 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法 |
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JP2005166438A (ja) | 2003-12-02 | 2005-06-23 | Hitachi Chem Co Ltd | 回路接続材料、及びこれを用いた回路部材の接続構造 |
WO2009051067A1 (ja) | 2007-10-18 | 2009-04-23 | Hitachi Chemical Company, Ltd. | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 |
JP2009194359A (ja) | 2008-01-16 | 2009-08-27 | Hitachi Chem Co Ltd | 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法 |
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