JP7420514B2 - processing equipment - Google Patents

processing equipment Download PDF

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JP7420514B2
JP7420514B2 JP2019170037A JP2019170037A JP7420514B2 JP 7420514 B2 JP7420514 B2 JP 7420514B2 JP 2019170037 A JP2019170037 A JP 2019170037A JP 2019170037 A JP2019170037 A JP 2019170037A JP 7420514 B2 JP7420514 B2 JP 7420514B2
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cassette
mounting table
workpiece
cassette mounting
processing
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JP2021048271A (en
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智人 松田
孝行 政田
毅 北浦
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Disco Corp
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Disco Corp
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Priority to KR1020200102994A priority patent/KR20210033887A/en
Priority to CN202010960646.XA priority patent/CN112519012A/en
Priority to TW109131863A priority patent/TW202114036A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)

Description

本発明は、被加工物を保持する保持手段と、該保持手段で保持された被加工物に加工を施す加工手段と、を備えた加工装置に関する。 The present invention relates to a processing apparatus that includes a holding means for holding a workpiece, and a processing means for processing the workpiece held by the holding means.

従来、例えば特許文献１に開示されるように、被加工物である半導体ウェーハを切削する加工装置において、複数枚のウェーハを収容したカセットをカセット載置台に載置し、カセット載置台を高さ方向（Ｚ軸方向）に移動させ、連続加工する構成が知られている。 Conventionally, as disclosed in Patent Document 1, for example, in a processing apparatus for cutting a semiconductor wafer as a workpiece, a cassette containing a plurality of wafers is placed on a cassette mounting table, and the cassette mounting table is set at a height. A configuration in which continuous processing is performed by moving in the direction (Z-axis direction) is known.

この連続加工の際においては、例えば、一枚目のウェーハを切削加工している間に、二枚目のウェーハをカセットから搬出して仮置エリアで待機させておき、一枚目のウェーハの切削加工が終わったタイミングで直ぐに二枚目のウェーハの切削加工を実行することが行われている。こうすることで、一つのカセットの全てのウェーハの加工に要する時間の短縮が図られている。 During this continuous processing, for example, while the first wafer is being cut, the second wafer is taken out of the cassette and kept waiting in a temporary storage area, and then the first wafer is cut. Immediately after the cutting process is completed, the cutting process for the second wafer is performed. This reduces the time required to process all wafers in one cassette.

特開２０１３－２２２８３４号公報JP2013-222834A

一枚目のカセットの最後のウェーハの加工が終了すると、二枚目のカセットについての加工に移ることになるが、最後のウェーハは元のカセット（一枚目のカセット）に戻さなければならないため、次の二枚目のカセットをセットすることができないことになる。 Once the processing of the last wafer in the first cassette is completed, processing will begin on the second cassette, but the last wafer must be returned to the original cassette (first cassette). , it becomes impossible to set the next second cassette.

このため、次の二枚目のカセットの最初のウェーハを搬出して仮置エリアで待機させることはできなくなり、カセットの交換のタイミングでは、加工装置による加工を停止せざるを得ないものであった。 For this reason, it is no longer possible to take out the first wafer of the next second cassette and wait it in the temporary storage area, and when it is time to replace the cassette, processing by the processing equipment must be stopped. Ta.

カセット交換のタイミングでの加工の停止は、加工装置のダウンタイムとなり、加工スループット（単位時間当たりの加工量）を向上させる上でボトルネックとなるため、改善が望まれていた。 Stopping machining at the timing of replacing a cassette results in downtime for the machining equipment and becomes a bottleneck in improving machining throughput (amount of machining per unit time), so improvements have been desired.

以上に鑑み、本願発明は、カセット交換のタイミングでも、ダウンタイムを削減し、加工スループット（生産性）を向上させることを可能とする新たな技術を提案するものである。 In view of the above, the present invention proposes a new technique that makes it possible to reduce downtime and improve processing throughput (productivity) even when replacing cassettes.

本発明の一態様によれば、
被加工物を保持する保持手段と、該保持手段で保持された被加工物に加工を施す加工手段と、を備えた加工装置であって、
該被加工物を複数収容可能な第一カセットが載置される第一カセット載置台と、
該被加工物を複数収容可能な第二カセットが載置される第二カセット載置台と、
該第一カセット載置台を受渡位置と、第一カセット退避位置と、に位置付ける第一位置付け手段と、
該第二カセット載置台を該受渡位置と、第二カセット退避位置と、に位置付ける第二位置付け手段と、
該受渡位置と該保持手段の間で被加工物を搬送する搬送手段と、を備え、
該受渡位置と該第一カセット退避位置は、Ｚ方向に隣接して配置され、
該受渡位置と該第二カセット退避位置は、該Ｚ方向に直交するＸ方向に隣接して配置される、加工装置とするものである。 According to one aspect of the present invention,
A processing device comprising a holding means for holding a workpiece, and a processing means for processing the workpiece held by the holding means,
a first cassette mounting table on which a first cassette capable of accommodating a plurality of the workpieces is mounted;
a second cassette mounting table on which a second cassette capable of accommodating a plurality of the workpieces is mounted;
a first positioning means for positioning the first cassette mounting table at a delivery position and a first cassette retraction position;
a second positioning means for positioning the second cassette mounting table at the delivery position and the second cassette retraction position;
A conveying means for conveying the workpiece between the delivery position and the holding means,
The delivery position and the first cassette retraction position are arranged adjacent to each other in the Z direction,
The delivery position and the second cassette retraction position are processing devices disposed adjacent to each other in the X direction orthogonal to the Z direction.

また、本発明の一態様によれば、
該加工装置は、少なくとも該第一位置付け手段と、該第二位置付け手段と、を制御する制御手段を備え、
該制御手段は、該加工手段で加工が施された被加工物が、該第一カセットと該第二カセットとのうち収容されていたカセットに搬入されるように、該第一カセット載置台と該第二カセット載置台とをそれぞれ該受渡位置に位置付けるように、該第一位置付け手段と該第二位置付け手段を制御する、こととするものである。 Further, according to one aspect of the present invention,
The processing device includes a control means for controlling at least the first positioning means and the second positioning means,
The control means controls the first cassette mounting table and the first cassette mounting table so that the workpiece processed by the processing means is carried into a cassette that has been accommodated in the first cassette and the second cassette. The first positioning means and the second positioning means are controlled so as to position the second cassette mounting table at the delivery position.

本発明の構成によれば、第一カセットに収容された最終の被加工物を加工している最中でも第二カセットから被加工物を搬出して仮置エリアで待機させることができ、第一カセットに収容されていた最終の被加工物の加工終了後、直ちに第二カセットの最初の被加工物を仮置エリアから保持手段に搬送することができる。加工が途切れる時間が圧縮されることで、カセット切替タイミングでのダウンタイムが大幅に削減され、装置全体の加工スループット（生産性）を向上させることができる。 According to the configuration of the present invention, even while the final workpiece stored in the first cassette is being processed, the workpiece can be taken out from the second cassette and left on standby in the temporary storage area. Immediately after finishing processing the last workpiece stored in the cassette, the first workpiece in the second cassette can be transferred from the temporary storage area to the holding means. By compressing the time during which machining is interrupted, downtime at cassette switching timing can be significantly reduced, and the machining throughput (productivity) of the entire apparatus can be improved.

本発明にかかる加工装置の一実施例について示す図である。1 is a diagram showing an embodiment of a processing device according to the present invention. （Ａ）は、第一カセット載置台の構成例について示す図である。（Ｂ）は、第二カセット載置台の構成例について示す図である。(A) is a diagram showing an example of the configuration of a first cassette mounting table. (B) is a diagram showing an example of the configuration of a second cassette mounting table. カセット載置台の受渡位置、退避位置の状態について示す図である。It is a figure which shows the state of the delivery position of a cassette mounting stand, and a retracted position. カセット載置台の受渡位置、退避位置の他の状態について示す図である。FIG. 7 is a diagram showing other states of the delivery position and the retracted position of the cassette mounting table. カセットの内部構成について示す図である。FIG. 3 is a diagram showing the internal configuration of a cassette. カセットの状態などについて示すタイムチャートである。It is a time chart showing the state of a cassette, etc.

図１は本発明の一実施形態に関する加工装置１であり、加工手段として回転する切削ブレードを備え、例えば、板状の半導体ウェーハを個片化する切削装置として構成される。なお、切削装置の他、半導体ウェーハを個片化するためのレーザー加工装置や、エキスパンド装置においても本発明を提供することができる。 FIG. 1 shows a processing apparatus 1 according to an embodiment of the present invention, which is equipped with a rotating cutting blade as a processing means and configured as a cutting apparatus for, for example, cutting a plate-shaped semiconductor wafer into pieces. In addition to the cutting device, the present invention can also be applied to a laser processing device for cutting a semiconductor wafer into pieces and an expanding device.

被加工物は、例えば、Ｓｉ（シリコン）、ＳｉＣ（シリコンカーバイド）、ＧａＮ（ガリウムナイトライド）、ＧａＡｓ（ヒ化ガリウム）、若しくは、その他の半導体等の材料からなる略円板状のウェーハである。または、被加工物は、サファイア、ガラス、石英等の材料からなる基板等である。または、被加工物は、モールド樹脂等で封止された複数のデバイスチップが含まれるパッケージ基板等でもよい。 The workpiece is, for example, a substantially disk-shaped wafer made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductors. . Alternatively, the workpiece is a substrate made of a material such as sapphire, glass, or quartz. Alternatively, the workpiece may be a package substrate or the like that includes a plurality of device chips sealed with a mold resin or the like.

図１に示すように、加工装置１の基台２の上面中央部には、被加工物を保持する保持手段５が配設される。保持手段５は、被加工物であるウェーハＷを吸引保持するチャックテーブルとして構成され、Ｘ軸方向に移動して図示せぬ切削ユニットによる切削加工を可能とするものである。被加工物であるウェーハＷは、テープＴを介してフレームＦに固定された状態で、カセットＫ１，Ｋ２に収容されるものである。 As shown in FIG. 1, at the center of the upper surface of the base 2 of the processing apparatus 1, a holding means 5 for holding a workpiece is disposed. The holding means 5 is configured as a chuck table that suction-holds a wafer W as a workpiece, and moves in the X-axis direction to enable cutting by a cutting unit (not shown). A wafer W, which is a workpiece, is fixed to a frame F via a tape T and is housed in cassettes K1 and K2.

保持手段５が移動するエリアには、保持手段５の上方となる位置に一対のガイドレール７が互いに平行に配置されて、仮置エリアＭが構成される。各ガイドレール７は、断面Ｌ字状に形成されており、被加工物を支持するフレームＦの両端を載置できるものであり、互いに近づく／離れる方向に移動可能に構成され、フレームＦをガイドしつつ仮置できるように構成される。 In the area where the holding means 5 moves, a pair of guide rails 7 are arranged parallel to each other above the holding means 5, thereby forming a temporary storage area M. Each guide rail 7 is formed to have an L-shaped cross section, and can place both ends of the frame F that supports the workpiece, and is configured to be movable toward/away from each other, and guides the frame F. It is configured so that it can be temporarily placed while doing so.

ガイドレール７には、搬出入手段２０によって、第一カセットＫ１、Ｋ２から搬出したフレームＦが仮置される。搬出入手段２０は、プレート部２１と、プレート部２１の端部に配設されたクランプ部２２とを有しており、クランプ部２２により被加工物であるウェーハＷと一体となったフレームＦの外周縁を把持することができるように構成される。 The frames F carried out from the first cassettes K1 and K2 are temporarily placed on the guide rail 7 by the carry-in/out means 20. The loading/unloading means 20 has a plate section 21 and a clamp section 22 disposed at the end of the plate section 21, and the clamp section 22 allows the frame F to be integrated with the wafer W as the workpiece. The outer periphery of the handle can be gripped.

搬出入手段２０のプレート部２１は、第一搬送手段２３のＬ字状のアーム部２６に連結され、搬出入手段２０は第一搬送手段２３とともにＹ軸方向に移動する。 The plate portion 21 of the loading/unloading means 20 is connected to the L-shaped arm portion 26 of the first conveying means 23, and the loading/unloading means 20 moves in the Y-axis direction together with the first conveying means 23.

第一搬送手段２３は、ガイドレール７から保持手段５に被加工物を搬送するものであり、アーム部２６と、アーム部２６の下部に装着された保持部２４と、保持部２４の端部に装着されフレームＦを吸着する少なくとも４つの吸着部２５とを備えている。 The first conveying means 23 conveys the workpiece from the guide rail 7 to the holding means 5, and includes an arm part 26, a holding part 24 attached to the lower part of the arm part 26, and an end of the holding part 24. At least four suction parts 25 that are attached to the frame F and suction the frame F are provided.

第一搬送手段２３は、第一Ｙ軸方向送り手段２８に連結され、Ｙ軸方向に移動する。第一Ｙ軸方向送り手段２８は、筐体３の側部３ａに設けられるものであり、Ｙ軸方向にのびるボールネジ２８ａと、ボールネジ２８ａの先端に接続されたモータ２８ｂと、ボールネジ２８ａと平行に配設された一対のガイドレール２８ｃと、内部に設けたナットがボールネジ２８ａに螺合するとともに側部が一対のガイドレール２８ｃに摺接する第一移動部２８ｄとを備えている。 The first conveying means 23 is connected to the first Y-axis direction feeding means 28 and moves in the Y-axis direction. The first Y-axis direction feeding means 28 is provided on the side 3a of the housing 3, and includes a ball screw 28a extending in the Y-axis direction, a motor 28b connected to the tip of the ball screw 28a, and a motor 28b extending parallel to the ball screw 28a. The first moving part 28d has a pair of guide rails 28c arranged therein, and a first moving part 28d having a nut provided therein which is screwed into a ball screw 28a and a side part slidingly contacting the pair of guide rails 28c.

第一移動部２８ｄと第一搬送手段２３のアーム部２６は、昇降部２７を介して接続されており、昇降部２７の上下方向の移動により、搬出入手段２０及び第一搬送手段２３をＺ軸方向に昇降させることができる。 The first moving section 28d and the arm section 26 of the first conveying means 23 are connected via the elevating section 27, and by moving the elevating section 27 in the vertical direction, the loading/unloading means 20 and the first conveying means 23 are moved to Z. It can be raised and lowered in the axial direction.

第二搬送手段３２は、保持手段５から洗浄手段７０に被加工物を搬送するものであり、円盤状のカバー部３３と、カバー部３３の下部に配設された保持部３４と、保持部３４の端部に装着されフレームＦを吸着する少なくとも４つの吸着部３５と、カバー部３３の上部に取り付けられたＬ字状のアーム部３６とを備えている。 The second conveying means 32 conveys the workpiece from the holding means 5 to the cleaning means 70, and includes a disk-shaped cover part 33, a holding part 34 disposed below the cover part 33, and a holding part At least four suction parts 35 are attached to the ends of the frame F to suction the frame F, and an L-shaped arm part 36 is attached to the upper part of the cover part 33.

第二搬送手段３２は、第二Ｙ軸方向送り手段３８に連結され、Ｙ軸方向に移動する。
第二Ｙ軸方向送り手段３８は、筐体３の側部３ａに設け荒れるものであり、Ｙ軸方向にのびるボールネジ３８ａと、ボールネジ３８ａの先端に接続されたモータ３８ｂと、ボールネジ３８ａと平行に配設された一対のガイドレール３８ｃと、内部に設けたナットがボールネジ３８ａに螺合するとともに側部が一対のガイドレール３８ｃに摺接する第二移動部３８ｄとを備えている。 The second conveying means 32 is connected to a second Y-axis direction feeding means 38 and moves in the Y-axis direction.
The second Y-axis direction feeding means 38 is provided on the side 3a of the housing 3, and includes a ball screw 38a extending in the Y-axis direction, a motor 38b connected to the tip of the ball screw 38a, and a motor 38b extending parallel to the ball screw 38a. The second moving part 38d has a pair of guide rails 38c arranged therein, and a second moving part 38d whose internal nut is screwed into the ball screw 38a and whose side parts are in sliding contact with the pair of guide rails 38c.

第二搬送手段３２のアーム部３６は、昇降部３７を介して第二移動部３８ｄに接続されており、昇降部３７が上下方向に移動することにより、第二搬送手段３２をＺ軸方向に昇降させることができる。 The arm section 36 of the second conveying means 32 is connected to the second moving section 38d via an elevating section 37, and by moving the elevating section 37 in the vertical direction, the arm section 36 of the second conveying means 32 is moved in the Z-axis direction. It can be raised and lowered.

次に、カセット載置台に関する構成について説明する。
図１に示すように、加工装置１には、第一カセット載置台５１と、第二カセット載置台５２が、Ｘ軸方向（加工装置の加工送り方向）において互いに対向するように設けられている。各載置台５１，５２に対し、随時カセットＫ１，Ｋ２の搬入／搬出が行われるようになっている。第一カセット載置台５１に随時載置されるカセットが第一カセット、第二カセット載置台５２に随時載置されるカセットが第二カセット、として定義され、明細書、及び、図面では、適宜、カセットＫ１，Ｋ２・・・として表現される。 Next, the configuration regarding the cassette mounting table will be explained.
As shown in FIG. 1, the processing device 1 is provided with a first cassette mounting table 51 and a second cassette mounting table 52 so as to face each other in the X-axis direction (processing feed direction of the processing device). . Cassettes K1 and K2 are carried in and out of each mounting table 51 and 52 at any time. A cassette that is placed on the first cassette mounting table 51 at any time is defined as a first cassette, and a cassette that is placed on the second cassette placement table 52 at any time is defined as a second cassette. The cassettes are expressed as cassettes K1, K2, and so on.

図２（Ａ）に示すように、第一カセット載置台５１は、その上面が第一カセットＫ１を載置するための載置面５１ａとして構成される。第一カセット載置台５１は、Ｚ軸方向（高さ方向）に立設される縦フレーム５１２において、Ｚ軸方向に移動可能に設けられるものである。縦フレーム５１２には、Ｚ軸方向に伸びる一対の縦ガイドレール５１４，５１４と、縦ガイドレール５１４，５１４の間に配置されるボールネジ５１６と、ボールネジ５１６の上端に接続されるモータ５１８と、が設けられる。 As shown in FIG. 2(A), the upper surface of the first cassette mounting table 51 is configured as a mounting surface 51a on which the first cassette K1 is mounted. The first cassette mounting table 51 is provided movably in the Z-axis direction on a vertical frame 512 that is erected in the Z-axis direction (height direction). The vertical frame 512 includes a pair of vertical guide rails 514, 514 extending in the Z-axis direction, a ball screw 516 disposed between the vertical guide rails 514, 514, and a motor 518 connected to the upper end of the ball screw 516. provided.

第一カセット載置台５１の内部に設けたナットがボールネジ５１６に螺合されており、モータ５１８にてボールネジ５１６を回転駆動させると、第一カセット載置台５１が縦ガイドレール５１４，５１４に沿って上下移動する。 A nut provided inside the first cassette mounting base 51 is screwed onto a ball screw 516, and when the ball screw 516 is rotated by a motor 518, the first cassette mounting base 51 is moved along the vertical guide rails 514, 514. Move up and down.

以上の構成により、第一カセット載置台５１を受渡位置Ｐ０（図３）と、第一カセット退避位置Ｐ１（図３）と、に位置付ける第一位置付け手段５１０が構成される。図２（Ａ）に示すように、第一位置付け手段５１０は、モータ５１８が制御手段６００で制御されることで動作制御される。 The above configuration constitutes the first positioning means 510 that positions the first cassette mounting table 51 at the delivery position P0 (FIG. 3) and the first cassette retraction position P1 (FIG. 3). As shown in FIG. 2(A), the operation of the first positioning means 510 is controlled by controlling the motor 518 by the control means 600.

図２（Ｂ）に示すように、第二カセット載置台５２は、その上面が第二カセットＫ２を載置するための載置面５２ａとして構成される。第二カセット載置台５２は、Ｚ軸方向に立設される縦フレーム５２２において、Ｚ軸方向に移動可能に設けられるものである。縦フレーム５２２には、Ｚ軸方向に伸びる一対の縦ガイドレール５２４，５２４と、縦ガイドレール５２４，５２４の間に配置されるボールネジ５２６と、ボールネジ５２６の上端に接続されるモータ５２８と、が設けられる。 As shown in FIG. 2(B), the upper surface of the second cassette mounting table 52 is configured as a mounting surface 52a on which the second cassette K2 is placed. The second cassette mounting table 52 is provided movably in the Z-axis direction on a vertical frame 522 that is erected in the Z-axis direction. The vertical frame 522 includes a pair of vertical guide rails 524, 524 extending in the Z-axis direction, a ball screw 526 disposed between the vertical guide rails 524, 524, and a motor 528 connected to the upper end of the ball screw 526. provided.

第二カセット載置台５２の内部に設けたナットがボールネジ５２６に螺合されており、モータ５２８にてボールネジ５２６を回転駆動させると、第二カセット載置台５２が縦ガイドレール５２４，５２４に沿って上下移動する。 A nut provided inside the second cassette mounting base 52 is screwed onto a ball screw 526, and when the ball screw 526 is rotated by a motor 528, the second cassette mounting base 52 is moved along the vertical guide rails 524, 524. Move up and down.

第二カセット載置台５２が設けられる縦フレーム５２２は、Ｘ軸方向に移動するベース５３２に立設される。ベース５３２は、Ｘ軸方向において略水平に設けた横フレーム５３１において、Ｘ軸方向に移動可能に設けられるものである。横フレーム５３１には、Ｘ軸方向に伸びる一対の横ガイドレール５３４，５３４と、横ガイドレール５３４，５３４の間に配置されるボールネジ５３６と、ボールネジ５３６の一端に接続されるモータ５３８と、が設けられる。 The vertical frame 522 on which the second cassette mounting table 52 is provided is erected on a base 532 that moves in the X-axis direction. The base 532 is provided movably in the X-axis direction in the horizontal frame 531 that is provided substantially horizontally in the X-axis direction. The horizontal frame 531 includes a pair of horizontal guide rails 534, 534 extending in the X-axis direction, a ball screw 536 disposed between the horizontal guide rails 534, 534, and a motor 538 connected to one end of the ball screw 536. provided.

ベース５３２の内部に設けたナットがボールネジ５３６に螺合されており、モータにてボールネジ５３６を回転駆動させると、ベース５３２が横ガイドレール５３４，５３４に沿ってＸ軸方向に水平移動し、これに伴って、第二カセット載置台５２（縦フレーム５２２）がＸ軸方向に水平移動する。 A nut provided inside the base 532 is screwed onto a ball screw 536, and when the ball screw 536 is rotated by a motor, the base 532 moves horizontally in the X-axis direction along the horizontal guide rails 534, 534. Accordingly, the second cassette mounting table 52 (vertical frame 522) moves horizontally in the X-axis direction.

以上の構成により、第二カセット載置台５２を受渡位置Ｐ０（図３）と、第二カセット退避位置Ｐ２（図３）と、に位置付ける第二位置付け手段５２０が構成される。図２（Ｂ）に示すように、第二位置付け手段５２０は、モータ５２８，５３８が制御手段６００で制御されることで動作制御される。 The above configuration constitutes the second positioning means 520 that positions the second cassette mounting table 52 at the delivery position P0 (FIG. 3) and the second cassette retraction position P2 (FIG. 3). As shown in FIG. 2(B), the operation of the second positioning means 520 is controlled by controlling the motors 528 and 538 by the control means 600.

次に、カセット載置台の動作について説明する。
図３及び図４に示すように、第一カセット載置台５１は、第一カセット退避位置Ｐ１と、受渡位置Ｐ０の間で移動する。
第一カセット退避位置Ｐ１では、第一カセットＫ１の搬入／搬出が行われる。
受渡位置Ｐ０では、第一カセットＫ１に収容された被加工物の搬入／搬出が行なわれる。 Next, the operation of the cassette mounting table will be explained.
As shown in FIGS. 3 and 4, the first cassette mounting table 51 moves between the first cassette retraction position P1 and the delivery position P0.
At the first cassette retraction position P1, the first cassette K1 is loaded/unloaded.
At the delivery position P0, the workpieces accommodated in the first cassette K1 are carried in and out.

図５に示すように、被加工物を保持するフレームＦは、第一カセットＫ１内に復数段形成される収容棚Ｋｔに載置される。受渡位置Ｐ０においては、第一カセットＫ１の収容棚Ｋｔの各段の高さを随時搬出入手段２０のクランプ部２２の高さに合わせるように、第一カセット載置台５１が上下移動する制御がされる。 As shown in FIG. 5, the frame F that holds the workpiece is placed on storage shelves Kt formed in several stages within the first cassette K1. At the delivery position P0, the first cassette mounting table 51 is controlled to move up and down so that the height of each stage of the storage shelf Kt of the first cassette K1 is adjusted to the height of the clamp part 22 of the loading/unloading means 20. be done.

同様に、図３及び図４に示すように、第二カセット載置台５２は、第二カセット退避位置Ｐ２と、受渡位置Ｐ０の間で移動する。
第二カセット退避位置Ｐ２では、第二カセットＫ２の搬入／搬出が行われる。
受渡位置Ｐ０では、第二カセットＫ２に収容された被加工物の搬入／搬出が行なわれる。 Similarly, as shown in FIGS. 3 and 4, the second cassette mounting table 52 moves between the second cassette retraction position P2 and the delivery position P0.
At the second cassette retraction position P2, the second cassette K2 is carried in/out.
At the delivery position P0, the workpieces accommodated in the second cassette K2 are carried in and out.

図５に示すように、第二カセットＫ２においても同様に、第二カセットＫ２の収容棚Ｋｔの各段の高さを随時搬出入手段２０のクランプ部２２の高さに合わせるように、第二カセット載置台５２が上下移動する制御がされる。 As shown in FIG. 5, in the second cassette K2, the second cassette The cassette mounting table 52 is controlled to move up and down.

図２（Ａ）（Ｂ）に示すように、第一カセット載置台５１、第二カセット載置台５２は、それぞれ、第一位置付け手段５１０、第二位置付け手段５２０を制御する制御手段６００によって受渡位置Ｐ０での昇降、及び、受渡位置Ｐ０と退避位置Ｐ１，Ｐ２の間での移動が制御され、第一カセット載置台５１、第二カセット載置台５２が連携して動作するように制御される。 As shown in FIGS. 2A and 2B, the first cassette mounting table 51 and the second cassette mounting table 52 are moved to the delivery position by a control means 600 that controls the first positioning means 510 and the second positioning means 520, respectively. Elevation at P0 and movement between the delivery position P0 and the retreat positions P1 and P2 are controlled, and the first cassette mounting table 51 and the second cassette mounting table 52 are controlled to operate in cooperation.

さらに、制御手段６００は、第一カセットＫ１から搬出された被加工物については第一カセットＫ１に搬入され、第二カセットＫ２から搬出された被加工物については第二カセットＫ２に搬入されるように制御を行うようにしている。このようにして、各カセットから搬出された被加工物は、もとのカセットに搬入される（戻される）ようになっている。 Furthermore, the control means 600 controls the workpieces carried out from the first cassette K1 to be carried into the first cassette K1, and the workpieces carried out from the second cassette K2 to be carried into the second cassette K2. I am trying to control it. In this way, the workpieces discharged from each cassette are transported (returned) to the original cassette.

以上の構成による一連の動作について一例を説明する。各動作のタイミングは、図６に示すタイムチャートも合わせて参照される。 An example of a series of operations with the above configuration will be explained. For the timing of each operation, the time chart shown in FIG. 6 is also referred to.

図３に示すように、自動搬送装置Ｊ１により、第一カセットＫ１が第一カセット載置台５１に搬入される。この搬入の際には、第一カセット載置台５１が第一カセット退避位置Ｐ１に位置付けられる。第一カセット載置台５１には、カセットの有無を検出するセンサが設けられており、自動搬送装置Ｊ１はセンサにより検出される情報に基づいて第一カセット載置台５１へのカセットの搬入を行う。 As shown in FIG. 3, the first cassette K1 is carried onto the first cassette mounting table 51 by the automatic transport device J1. During this loading, the first cassette mounting table 51 is positioned at the first cassette retraction position P1. The first cassette mounting table 51 is provided with a sensor that detects the presence or absence of a cassette, and the automatic transport device J1 carries the cassette to the first cassette mounting table 51 based on information detected by the sensor.

また、同様に、図３に示すように、自動搬送装置Ｊ２により、第二カセットＫ２が第二カセット載置台５２に搬入される。この搬入の際には、第二カセット載置台５２が第二カセット退避位置Ｐ２に位置付けられる。第二カセット載置台５２には、カセットの有無を検出するセンサが設けられており、自動搬送装置はセンサにより検出される情報に基づいて第二カセット載置台５２へのカセットの搬入を行う。 Similarly, as shown in FIG. 3, the second cassette K2 is carried onto the second cassette mounting table 52 by the automatic transport device J2. During this loading, the second cassette mounting table 52 is positioned at the second cassette retraction position P2. The second cassette mounting table 52 is provided with a sensor that detects the presence or absence of a cassette, and the automatic transport device carries the cassette to the second cassette mounting table 52 based on information detected by the sensor.

なお、第二カセット載置台５２への第二カセットＫ２の搬入は、第一カセット載置台５１への第一カセットＫ１の搬入と同時である必要はなく、第一カセットＫ１の最後の被加工物の加工が開始されるまでの間であれば、特に限定されるものではない。つまり、図６に示すタイムチャートにおいて、時間Ｔ０が経過する前（時間Ｔ１の前）であればよい。 Note that the loading of the second cassette K2 to the second cassette mounting table 52 does not need to be at the same time as the loading of the first cassette K1 to the first cassette mounting table 51, and the loading of the second cassette K2 to the second cassette loading table 52 is not necessarily the same as the loading of the first cassette K1 to the first cassette loading table 51. There is no particular limitation as long as the period is until processing starts. That is, in the time chart shown in FIG. 6, it is sufficient if the time is before time T0 has elapsed (before time T1).

また、各カセット載置台５１，５２への各カセットＫ１，Ｋ２の搬入は、自動搬送装置Ｊ１，Ｊ２によって行われることとする他、作業者による手作業よって行われるものであってもよい。また、後述するカセット載置台５１，５２からのカセットＫ１，Ｋ２の搬出についても、自動搬送装置Ｊ１，Ｊ２によって行われることとする他、作業者による手作業よって行われるものであってよい。なお、自動搬送装置Ｊ１，Ｊ２は、例えば、天井に吊り下げたレールに沿ってカセットを吊り下げて搬送する吊り下げ式の搬送装置などにて構成することができる。 Furthermore, the cassettes K1 and K2 may be loaded onto the respective cassette mounting tables 51 and 52 by the automatic transport devices J1 and J2, but may also be carried out manually by an operator. Further, the unloading of cassettes K1 and K2 from cassette mounting tables 51 and 52, which will be described later, may be carried out manually by an operator instead of being carried out by automatic transport devices J1 and J2. Note that the automatic transport devices J1 and J2 can be configured, for example, by a hanging type transport device that suspends and transports the cassette along a rail suspended from the ceiling.

次いで、図３及び図５に示すように、第一カセット載置台５１が下降して受渡位置Ｐ０に位置付けられるとともに、未加工の被加工物（フレームＦ）が収容される収容棚Ｋｔの位置が検出され、収容棚Ｋｔの高さが搬出入手段２０の高さに一致するように第一カセット載置台５１が昇降する（図５）。そして、一枚目の未加工の被加工物（フレームＦ）が搬出入手段２０により搬出されてガイドレール７（図１）上に仮置された後（図６；Ｓ１）、第一搬送手段２３（図１）により保持手段へと搬送されて切削加工がされる（図６；Ｓ２）。 Next, as shown in FIGS. 3 and 5, the first cassette mounting table 51 is lowered and positioned at the delivery position P0, and the position of the storage shelf Kt in which the unprocessed workpiece (frame F) is stored is changed. Detected, the first cassette mounting table 51 moves up and down so that the height of the storage shelf Kt matches the height of the loading/unloading means 20 (FIG. 5). Then, after the first unprocessed workpiece (frame F) is carried out by the carry-in/out means 20 and temporarily placed on the guide rail 7 (FIG. 1) (FIG. 6; S1), the first unprocessed workpiece (frame F) 23 (FIG. 1), it is transported to the holding means and subjected to cutting (FIG. 6; S2).

一枚目の被加工物が切削加工されている間に（図６：Ｓ２）、第一カセット載置台５１が昇降し、二枚目の未加工の被加工物（フレームＦ）が搬出入手段２０により搬出されて、ガイドレール７（図１）上に仮置された後（図６；Ｓ３）、先の被加工物（一枚目）の切削加工が完了するまで第一搬送手段２３（図１）に保持されて待機する（図６；Ｓ４）。 While the first workpiece is being cut (FIG. 6: S2), the first cassette mounting table 51 moves up and down, and the second unprocessed workpiece (frame F) is transferred to the loading/unloading means. 20 and temporarily placed on the guide rail 7 (FIG. 1) (FIG. 6; S3), the first conveying means 23 ( 1) and waits (FIG. 6; S4).

一枚目の被加工物の切削加工が終了すると、一枚目の被加工物は第二搬送手段３２（図１）により洗浄手段７０に搬送され（図６；Ｓ５）、洗浄手段７０により洗浄される（図６；Ｓ６）。 When the cutting of the first workpiece is completed, the first workpiece is transported by the second transport means 32 (FIG. 1) to the cleaning means 70 (FIG. 6; S5), and is cleaned by the cleaning means 70. (Figure 6; S6).

この際、二枚目の未加工の被加工物は、第一搬送手段２３（図１）により保持手段へと搬送されて（図６；Ｓ７）、切削加工がされる（図６；Ｓ２）。 At this time, the second unprocessed workpiece is transported by the first transport means 23 (Fig. 1) to the holding means (Fig. 6; S7), and is subjected to cutting processing (Fig. 6; S2). .

さらに並行して、第一カセット載置台５１が昇降し、三枚目の未加工の被加工物（フレームＦ）が搬出入手段２０により搬出されてガイドレール７（図１）上に仮置され（図６；Ｓ３）、先の被加工物（二枚目）の切削加工が完了するまで第一搬送手段２３（図１）に保持されて仮置エリアＭで待機する（図６；Ｓ４）。 Furthermore, in parallel, the first cassette mounting table 51 moves up and down, and the third unprocessed workpiece (frame F) is carried out by the carry-in/out means 20 and temporarily placed on the guide rail 7 (FIG. 1). (FIG. 6; S3), and is held in the first conveyance means 23 (FIG. 1) and waits in the temporary storage area M until the cutting of the previous workpiece (second workpiece) is completed (FIG. 6; S4) .

洗浄手段７０より洗浄がされた一枚目の被加工物は、第一搬送手段２３（図１）により第一カセットＫ１の空いている収容棚Ｋｔ（図５）へと搬入される（図６；Ｓ８）。このようにして、第一カセットＫ１の一枚目の被加工物についての一連の工程が完了する。 The first workpiece cleaned by the cleaning means 70 is carried by the first conveying means 23 (FIG. 1) to an empty storage shelf Kt (FIG. 5) of the first cassette K1 (FIG. 6). ;S8). In this way, a series of steps for the first workpiece in the first cassette K1 is completed.

二枚目、三枚目の被加工物についても、同様に切削加工がなされ、最後の被加工物の加工が開始されると、図３に示すように、第一カセット載置台５１が上昇して第一カセット退避位置Ｐ１へと移動する（図６：時間Ｔ１）。 The second and third workpieces are similarly cut, and when the last workpiece is started, the first cassette mounting table 51 is raised as shown in FIG. and moves to the first cassette retraction position P1 (FIG. 6: time T1).

これと同時に、図４に示すように、第二カセット載置台５２が受渡位置Ｐ０に移動し、未加工の被加工物（フレームＦ）が収容される収容棚Ｋｔ（図５）の位置が検出され、収容棚Ｋｔ（図５）の高さが搬出入手段２０の高さに一致するように第二カセット載置台５２が上下方向に移動する。そして、第二カセットＫ２の一枚目の未加工の被加工物（フレームＦ）が搬出入手段２０により搬出された後、先の被加工物（第一カセットＫ１の最後）の切削加工が完了するまで第一搬送手段２３（図１）に保持されて待機する（図６；Ｓ９）。 At the same time, as shown in FIG. 4, the second cassette mounting table 52 moves to the delivery position P0, and the position of the storage shelf Kt (FIG. 5) in which the unprocessed workpiece (frame F) is stored is detected. Then, the second cassette mounting table 52 moves in the vertical direction so that the height of the storage shelf Kt (FIG. 5) matches the height of the loading/unloading means 20. Then, after the first unprocessed workpiece (frame F) of the second cassette K2 is carried out by the carry-in/out means 20, the cutting of the previous workpiece (the last of the first cassette K1) is completed. It is held by the first conveying means 23 (FIG. 1) until it is ready (FIG. 6; S9).

第二カセットＫ２から一枚目の被加工物が搬出されると、図３に示すように、第二カセット載置台５２が再び第二カセット退避位置Ｐ２に移動するととともに、第一カセット載置台５１が下降して受渡位置Ｐ０に戻り、第一カセットＫ１の空いている収容棚Ｋｔの高さが搬出入手段２０に合わせられ（図５）、加工が終了し洗浄が終わった最後の被加工物が第一カセットＫ１内へと搬入される（図６：時間Ｔ２）。 When the first workpiece is carried out from the second cassette K2, as shown in FIG. descends and returns to the delivery position P0, the height of the vacant storage shelf Kt of the first cassette K1 is adjusted to the loading/unloading means 20 (Fig. 5), and the last workpiece that has been processed and cleaned is is carried into the first cassette K1 (FIG. 6: time T2).

この段階で第一カセットＫ１のすべての被加工物についての切削加工、搬入が完了した状態となり、再び図４に示すように、第一カセット載置台５１は第一カセット退避位置Ｐ１へ移動して、自動搬送装置Ｊ１によって、第一カセットＫ１が搬出され、図６の時間Ｔ３に示すように新たなカセットＫ３が適宜搬入される。 At this stage, the cutting and loading of all the workpieces in the first cassette K1 are completed, and as shown in FIG. 4 again, the first cassette mounting table 51 moves to the first cassette retreat position P1. , the first cassette K1 is carried out by the automatic transport device J1, and a new cassette K3 is suitably carried in as shown at time T3 in FIG.

また、同時に、図４に示すように、第二カセット載置台５２が受渡位置Ｐ０へと移動し（図６：時間Ｔ３）、第二カセットＫ２の二枚目の被加工物が搬出され、その後は上述したものと同様の工程が繰り返される。 At the same time, as shown in FIG. 4, the second cassette mounting table 52 moves to the delivery position P0 (FIG. 6: time T3), the second workpiece of the second cassette K2 is carried out, and then The same steps as described above are repeated.

そして、最後の被加工物の加工が開始された後は、上述した図６の時間Ｔ１，Ｔ２（切替タイミング）での動作と同様の内容が実施される。即ち、図３に示すように、第二カセット載置台５２は第二カセット退避位置Ｐ２へと移動するとともに、第一カセット載置台５１が下降して、新たに搬入されたカセットの一枚目の被加工物が搬出される。 After the machining of the last workpiece is started, the same operations as those at times T1 and T2 (switching timing) in FIG. 6 described above are performed. That is, as shown in FIG. 3, the second cassette mounting table 52 moves to the second cassette retraction position P2, and the first cassette mounting table 51 lowers to place the first cassette newly brought in. The workpiece is carried out.

次いで、図４に示すように、第一カセット載置台５１は再び上昇して第一カセット退避位置Ｐ１に戻されるとともに、第二カセット載置台５２が受渡位置Ｐ０へと戻され、洗浄が終わった最後の被加工物が第二カセットＫ２内へと搬入される。 Next, as shown in FIG. 4, the first cassette mounting table 51 is raised again and returned to the first cassette retraction position P1, and the second cassette mounting table 52 is returned to the delivery position P0, and the cleaning is completed. The last workpiece is loaded into the second cassette K2.

この段階で第二カセットＫ２のすべての被加工物についての切削加工、搬入が完了した状態となり、図３に示すように、第二カセット載置台５２は第二カセット退避位置Ｐ２へ移動して、自動搬送装置Ｊ２によって、第二カセットＫ２が搬出され、また別のカセットＫ４が適宜搬入される。 At this stage, cutting and loading of all the workpieces in the second cassette K2 have been completed, and as shown in FIG. 3, the second cassette mounting table 52 moves to the second cassette retraction position P2. The second cassette K2 is carried out by the automatic transport device J2, and another cassette K4 is carried in as appropriate.

また、同時に、図３に示すように、第一カセット載置台５１が受渡位置Ｐ０へと移動し、第一カセットＫ１の二枚目の被加工物が搬出され、その後は上述したものと同様の工程が繰り返される。 At the same time, as shown in FIG. 3, the first cassette mounting table 51 moves to the delivery position P0, and the second workpiece of the first cassette K1 is carried out, and then the same process as described above is carried out. The process is repeated.

以上のようにして、カセットＫ１から次のカセットＫ２への切替タイミングにおいても、予め次のカセットＫ２の最初の被加工物の加工を開始することが可能となり、切削加工が途切れる時間が圧縮されることで、カセット切替タイミングでのダウンタイムが大幅に削減され、装置全体の加工スループット（生産性）を向上させることができる。 As described above, even at the timing of switching from cassette K1 to the next cassette K2, it is possible to start machining the first workpiece of the next cassette K2 in advance, and the time during which cutting is interrupted is reduced. As a result, downtime at the cassette switching timing can be significantly reduced, and the processing throughput (productivity) of the entire apparatus can be improved.

次に、カセット載置台の衝突防止のための構成について説明する。
図３に示すように、第一カセット載置台５１が受渡位置Ｐ０にある状態で、第二カセット載置台５２が第二カセット退避位置Ｐ２から受渡位置Ｐ０に移動すると、カセット載置台５１，５２同士が衝突し、カセットＫ１，Ｋ２内の高価な被加工物が損傷し、損害が発生してしまうことになる。 Next, a configuration for preventing collision of the cassette mounting table will be described.
As shown in FIG. 3, when the second cassette mounting table 52 moves from the second cassette retreat position P2 to the delivery position P0 while the first cassette mounting table 51 is at the delivery position P0, the cassette mounting tables 51 and 52 collides with each other, damaging the expensive workpieces in the cassettes K1 and K2, resulting in damage.

このことを回避するために、第一カセット載置台５１、及び、第二カセット載置台５２には、互いに対向して当接可能な当接部５１ｄ，５２ｄが設けられ、第一カセット載置台５１が受渡位置Ｐ０にある場合に、第二カセット載置台５２が第二カセット退避位置Ｐ２から受渡位置Ｐ０に進入した際に、当接部５１ｄ，５２ｄ同士が当接することで、カセットＫ１，Ｋ２同士の直接の衝突が防止される構成としている。 In order to avoid this, the first cassette mounting table 51 and the second cassette mounting table 52 are provided with contact portions 51d and 52d that can face each other and come into contact with each other. is at the delivery position P0, and when the second cassette mounting table 52 enters the delivery position P0 from the second cassette retraction position P2, the contact parts 51d and 52d contact each other, thereby causing the cassettes K1 and K2 to The structure is designed to prevent direct collision between the two.

本実施例では、当接部５１ｄ，５２ｄは、各カセット載置台５１，５２に立設される棒状の板部材にて構成され、上下方向（Ｚ軸方向）に有効な幅を設けることで、第一カセット載置台５１が受渡位置Ｐ０で移動する範囲のいずれの位置においても、当接部５１ｄ，５２ｄ同士が確実に当接できるように構成される。 In this embodiment, the contact portions 51d and 52d are constituted by rod-shaped plate members that are erected on each cassette mounting table 51 and 52, and are provided with an effective width in the vertical direction (Z-axis direction). The structure is such that the contact portions 51d and 52d can reliably contact each other at any position within the range in which the first cassette mounting table 51 moves from the delivery position P0.

以上のように、当接部５１ｄ，５２ｄを設けることで、カセット載置台５１，５２同士を物理的に衝突させることで、カセットＫ１，Ｋ２同士の直接的な衝突を回避することができ、被加工物の損傷を防止できる。 As described above, by providing the contact portions 51d and 52d, it is possible to physically cause the cassette mounting tables 51 and 52 to collide with each other, thereby avoiding a direct collision between the cassettes K1 and K2. Damage to the workpiece can be prevented.

さらに、第一カセット載置台５１、及び、第二カセット載置台５２の少なくとも一方には、両者が水平方向において、規定の距離よりも近づいたことを検知するための検知手段５２ｓと、検知手段５２ｓによる検知に基づいて、第二カセット載置台５２の水平方向の移動を停止させるための制御手段６００（図２（Ｂ））と、を設けることとしている。 Further, at least one of the first cassette mounting table 51 and the second cassette mounting table 52 includes a detection means 52s and a detection means 52s for detecting that the two have come closer than a prescribed distance in the horizontal direction. A control means 600 (FIG. 2(B)) is provided for stopping the movement of the second cassette mounting table 52 in the horizontal direction based on the detection by.

検知手段５２ｓは、例えば、当接部５２ｄに設けられる近接センサとし、当接部５１ｄに接近したことを検知して制御手段（図２（Ｂ））に出力する構成にて実現することができる。制御手段は、図２（Ｂ）に示されるボールネジ５３６を駆動するモータを制御するものであり、このモータを停止することで、第二カセット載置台５２（ベース５３２）の移動を停止させるものである。 The detection means 52s can be realized, for example, by a proximity sensor provided on the contact portion 52d, which detects the proximity to the contact portion 51d and outputs the detected information to the control means (FIG. 2(B)). . The control means controls the motor that drives the ball screw 536 shown in FIG. 2(B), and by stopping this motor, the movement of the second cassette mounting table 52 (base 532) is stopped. be.

このように、検知手段５２ｓによって両カセット載置台５１，５２が近接したことを検知することで、当接部５１ｄ，５２ｄ同士が衝突する前に、第二カセット載置台５２の移動を停止することが可能となり、カセット載置台５１，５２に関する機構の損傷や故障を防ぐことが可能となる。また、カセット載置台５１，５２同士の衝撃がカセットＫ１，Ｋ２に伝わり、カセットＫ１，Ｋ２内の高価な被加工物が損傷し、損害が発生してしまうことも防止できる。 In this way, by detecting that the two cassette mounting tables 51 and 52 have approached each other by the detection means 52s, the movement of the second cassette mounting table 52 can be stopped before the contact parts 51d and 52d collide with each other. This makes it possible to prevent damage or failure of mechanisms related to the cassette mounting tables 51 and 52. Further, it is also possible to prevent damage caused by the impact between the cassette mounting tables 51 and 52 being transmitted to the cassettes K1 and K2 and damaging the expensive workpieces in the cassettes K1 and K2.

以上のようにして本願発明を実施することができる。
即ち、図１乃至図４に示すように、
被加工物としての半導体ウェーハを保持する保持手段５と、保持手段５で保持された被加工物に切削加工を施す切削ブレードなどの加工手段と、を備えた加工装置であって、
被加工物を複数収容可能な第一カセットＫ１が載置される第一カセット載置台５１と、
被加工物を複数収容可能な第二カセットＫ２が載置される第二カセット載置台５２と、
第一カセット載置台５１を受渡位置Ｐ０と、第一カセット退避位置Ｐ１と、に位置付ける第一位置付け手段５１０と、
第二カセット載置台５２を受渡位置Ｐ０と、第二カセット退避位置Ｐ２と、に位置付ける第二位置付け手段５２０と、
受渡位置Ｐ０と保持手段５の間で被加工物を搬送する搬出入手段２０と、を備え、
受渡位置Ｐ０と第一カセット退避位置Ｐ１は、Ｚ方向に隣接して配置され、
受渡位置Ｐ０と第二カセット退避位置Ｐ２は、Ｚ方向に直交するＸ方向に隣接して配置される、加工装置とするものである。 The present invention can be implemented as described above.
That is, as shown in FIGS. 1 to 4,
A processing device comprising a holding means 5 for holding a semiconductor wafer as a workpiece, and a processing means such as a cutting blade for cutting the workpiece held by the holding means 5,
a first cassette mounting table 51 on which a first cassette K1 capable of accommodating a plurality of workpieces is mounted;
a second cassette mounting table 52 on which a second cassette K2 capable of accommodating a plurality of workpieces is mounted;
a first positioning means 510 for positioning the first cassette mounting table 51 at a delivery position P0 and a first cassette retraction position P1;
a second positioning means 520 for positioning the second cassette mounting table 52 at a delivery position P0 and a second cassette retraction position P2;
A loading/unloading means 20 for transporting the workpiece between the delivery position P0 and the holding means 5,
The delivery position P0 and the first cassette retraction position P1 are arranged adjacent to each other in the Z direction,
The delivery position P0 and the second cassette retraction position P2 are processing devices arranged adjacent to each other in the X direction orthogonal to the Z direction.

以上の構成により、第一カセットＫ１に収容された最終の被加工物を加工している最中でも第二カセットＫ２から被加工物を搬出して仮置エリアＭで待機させることができ、第一カセットに収容されていた最終の被加工物の加工終了後、直ちに第二カセットの最初の被加工物を仮置エリアＭから保持手段に搬送することができる。加工が途切れる時間が圧縮されることで、カセット切替タイミングでのダウンタイムが大幅に削減され、装置全体の加工スループット（生産性）を向上させることができる。 With the above configuration, even while the final workpiece stored in the first cassette K1 is being processed, the workpiece can be taken out from the second cassette K2 and left on standby in the temporary storage area M. Immediately after finishing processing the last workpiece stored in the cassette, the first workpiece in the second cassette can be transferred from the temporary storage area M to the holding means. By compressing the time during which machining is interrupted, downtime at cassette switching timing can be significantly reduced, and the machining throughput (productivity) of the entire apparatus can be improved.

図２（Ａ）（Ｂ）、及び、図３に示すように、
加工装置は、
少なくとも第一位置付け手段５１０と、第二位置付け手段５２０と、を制御する制御手段６００を備え、
制御手段６００は、
加工手段で加工が施された被加工物が、第一カセットＫ１と第二カセットＫ２とのうち収容されていたカセットに搬入されるように、
第一カセット載置台５１と第二カセット載置台５２とをそれぞれ受渡位置Ｐ０に位置付けるように、第一位置付け手段５１０と第二位置付け手段５２０を制御する、こととするものである。 As shown in FIGS. 2(A)(B) and 3,
The processing equipment is
comprising a control means 600 for controlling at least the first positioning means 510 and the second positioning means 520;
The control means 600 is
so that the workpiece processed by the processing means is carried into the cassette that was accommodated in the first cassette K1 and the second cassette K2,
The first positioning means 510 and the second positioning means 520 are controlled to position the first cassette mounting table 51 and the second cassette mounting table 52 at the delivery position P0, respectively.

これにより、このようにして、各カセットから搬出された被加工物は、もとのカセットに搬入される（戻される）ことができる。 Thereby, the workpieces carried out from each cassette in this way can be carried (returned) into the original cassette.

２０ 搬出入手段
２３ 第一搬送手段
３２ 第二搬送手段
５１ 第一カセット載置台
５１ａ 載置面
５１ｄ 当接部
５２ 第二カセット載置台
５２ａ 載置面
５２ｄ 当接部
５２ｓ 検知手段
５５ 保持手段
７０ 洗浄手段
５１０ 第一位置付け手段
５１２ 縦フレーム
５１４ 縦ガイドレール
５１６ ボールネジ
５１８ モータ
５２０ 第二位置付け手段手段
５２２ 縦フレーム
５２４縦ガイドレール
５２６ ボールネジ
５２８ モータ
５３１ 横フレーム
５３２ ベース
５３４ 横ガイドレール
５３６ ボールネジ
５３８ モータ
６００ 制御手段
Ｆ フレーム
Ｋ１ 第一カセット
Ｋ２ 第二カセット
Ｋｔ 収容棚
Ｐ０ 受渡位置
Ｐ１ 第一カセット退避位置
Ｐ２ 第二カセット退避位置
Ｔ テープ
Ｗ ウェーハ

20 Carrying in/out means 23 First conveying means 32 Second conveying means 51 First cassette mounting table 51a Placing surface 51d Contact part 52 Second cassette placing table 52a Placing surface 52d Contact part 52s Detecting means 55 Holding means 70 Cleaning Means 510 First positioning means 512 Vertical frame 514 Vertical guide rail 516 Ball screw 518 Motor 520 Second positioning means 522 Vertical frame 524 Vertical guide rail 526 Ball screw 528 Motor 531 Horizontal frame 532 Base 534 Horizontal guide rail 536 Ball screw 538 Motor 600 Control means F Frame K1 First cassette K2 Second cassette Kt Storage shelf P0 Delivery position P1 First cassette retraction position P2 Second cassette retraction position T Tape W Wafer

Claims (2)

被加工物を保持する保持手段と、該保持手段で保持された被加工物に加工を施す加工手段と、洗浄手段と、を備えた加工装置であって、
該被加工物を複数収容可能な第一カセットが載置される第一カセット載置台と、
該被加工物を複数収容可能な第二カセットが載置される第二カセット載置台と、
該第一カセット載置台を受渡位置と、第一カセット退避位置と、に位置付ける第一位置付け手段と、
該第二カセット載置台を該受渡位置と、第二カセット退避位置と、に位置付ける第二位置付け手段と、
該受渡位置と該保持手段の間で被加工物を搬送する第一搬送手段と、
該保持手段から該洗浄手段に該被加工物を搬送する第二搬送手段と、を備え、
該受渡位置と該第一カセット退避位置は、Ｚ方向に隣接して配置され、
該受渡位置と該第二カセット退避位置は、該Ｚ方向に直交するＸ方向に隣接して配置され、
該第一カセットから搬出された被加工物を、該保持手段で保持して該加工手段で加工している間に、該第二カセットからから搬出された被加工物を該第一搬送手段で保持して待機し、
該第一カセットから搬出された被加工物が、該加工手段による加工が終了して該第二搬送手段により該保持手段から該洗浄手段へと搬送された後、
該第一搬送手段で保持して待機していた該第二カセットから搬出された被加工物が、該保持手段へと搬送されて加工がされる構成とする、加工装置。 A processing device comprising a holding means for holding a workpiece, a processing means for processing the workpiece held by the holding means, and a cleaning means ,
a first cassette mounting table on which a first cassette capable of accommodating a plurality of the workpieces is mounted;
a second cassette mounting table on which a second cassette capable of accommodating a plurality of the workpieces is mounted;
a first positioning means for positioning the first cassette mounting table at a delivery position and a first cassette retraction position;
a second positioning means for positioning the second cassette mounting table at the delivery position and a second cassette retraction position;
a first conveying means for conveying the workpiece between the delivery position and the holding means;
a second conveying means for conveying the workpiece from the holding means to the cleaning means ,
The delivery position and the first cassette retraction position are arranged adjacent to each other in the Z direction,
The delivery position and the second cassette retraction position are arranged adjacent to each other in the X direction perpendicular to the Z direction,
While the workpiece carried out from the first cassette is held by the holding means and processed by the processing means, the workpiece carried out from the second cassette is held by the first conveying means. hold and wait,
After the workpiece carried out from the first cassette has been processed by the processing means and is transported from the holding means to the cleaning means by the second transport means ,
A processing device configured such that a workpiece carried out from the second cassette, which has been held and waited by the first conveyance means, is conveyed to the holding means and processed. 該加工装置は、少なくとも該第一位置付け手段と、該第二位置付け手段と、を制御する制御手段を備え、
該制御手段は、該加工手段で加工が施された被加工物が、該第一カセットと該第二カセットとのうち収容されていたカセットに搬入されるように、該第一カセット載置台と該第二カセット載置台とをそれぞれ該受渡位置に位置付けるように、該第一位置付け手段と該第二位置付け手段を制御する、
ことを特徴とする請求項１に記載の加工装置。 The processing device includes a control means for controlling at least the first positioning means and the second positioning means,
The control means is configured to control the first cassette mounting table and the first cassette mounting table so that the workpiece processed by the processing means is carried into the cassette that has been accommodated in the first cassette and the second cassette. controlling the first positioning means and the second positioning means so as to respectively position the second cassette mounting table at the delivery position;
The processing apparatus according to claim 1, characterized in that:
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TW109131863A TW202114036A (en) 2019-09-19 2020-09-16 Processing apparatus comprising a holding means, a processing means, a first cassette carrying platform, a second cassette carrying platform, a first positioning means, a second positioning means, and a loading/unloading means

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Citations (3)

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JP2007305862A (en) 2006-05-12 2007-11-22 Tokyo Seimitsu Co Ltd Method and device for conveying cassette
JP2015138856A (en) 2014-01-22 2015-07-30 株式会社ディスコ Cutting device
JP2018181951A (en) 2017-04-06 2018-11-15 株式会社ディスコ Processing device

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JP5988666B2 (en) 2012-04-17 2016-09-07 株式会社ディスコ Cutting equipment

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2007305862A (en) 2006-05-12 2007-11-22 Tokyo Seimitsu Co Ltd Method and device for conveying cassette
JP2015138856A (en) 2014-01-22 2015-07-30 株式会社ディスコ Cutting device
JP2018181951A (en) 2017-04-06 2018-11-15 株式会社ディスコ Processing device

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