JP7378090B2 - 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 - Google Patents
樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 Download PDFInfo
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- JP7378090B2 JP7378090B2 JP2020531258A JP2020531258A JP7378090B2 JP 7378090 B2 JP7378090 B2 JP 7378090B2 JP 2020531258 A JP2020531258 A JP 2020531258A JP 2020531258 A JP2020531258 A JP 2020531258A JP 7378090 B2 JP7378090 B2 JP 7378090B2
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- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- ZXPDYFSTVHQQOI-UHFFFAOYSA-N diethoxysilane Chemical compound CCO[SiH2]OCC ZXPDYFSTVHQQOI-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- JHXRVOAOESLJHL-UHFFFAOYSA-N ethene;1,2,3,4,5-pentabromobenzene Chemical compound C=C.BrC1=CC(Br)=C(Br)C(Br)=C1Br.BrC1=CC(Br)=C(Br)C(Br)=C1Br JHXRVOAOESLJHL-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- YJSSCAJSFIGKSN-UHFFFAOYSA-N hex-1-en-2-ylbenzene Chemical compound CCCCC(=C)C1=CC=CC=C1 YJSSCAJSFIGKSN-UHFFFAOYSA-N 0.000 description 1
- 125000003104 hexanoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- LIBWSLLLJZULCP-UHFFFAOYSA-N n-(3-triethoxysilylpropyl)aniline Chemical compound CCO[Si](OCC)(OCC)CCCNC1=CC=CC=C1 LIBWSLLLJZULCP-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- SFLRURCEBYIKSS-UHFFFAOYSA-N n-butyl-2-[[1-(butylamino)-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound CCCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCCC SFLRURCEBYIKSS-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- GFPVQVVHZYIGOF-UHFFFAOYSA-N oct-1-en-2-ylbenzene Chemical compound CCCCCCC(=C)C1=CC=CC=C1 GFPVQVVHZYIGOF-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 125000002801 octanoyl group Chemical group C(CCCCCCC)(=O)* 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- HDBWAWNLGGMZRQ-UHFFFAOYSA-N p-Vinylbiphenyl Chemical group C1=CC(C=C)=CC=C1C1=CC=CC=C1 HDBWAWNLGGMZRQ-UHFFFAOYSA-N 0.000 description 1
- ANGVCCXFJKHNDS-UHFFFAOYSA-N pent-1-en-2-ylbenzene Chemical compound CCCC(=C)C1=CC=CC=C1 ANGVCCXFJKHNDS-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000003444 phase transfer catalyst Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 125000001501 propionyl group Chemical group O=C([*])C([H])([H])C([H])([H])[H] 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- UGNWTBMOAKPKBL-UHFFFAOYSA-N tetrachloro-1,4-benzoquinone Chemical compound ClC1=C(Cl)C(=O)C(Cl)=C(Cl)C1=O UGNWTBMOAKPKBL-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
- C08G65/485—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/062—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/126—Polyphenylene oxides modified by chemical after-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2353/00—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
- C08J2353/02—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08J2371/12—Polyphenylene oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Description
本発明の一態様に係る樹脂組成物は、分子中に下記式(1)で表される基を少なくとも1つ有する化合物(A)と、アセナフチレン化合物(B)とを含むことを特徴とする樹脂組成物である。
前記化合物(A)は、分子中に前記式(1)で表される基を少なくとも1つ有する化合物であれば、特に限定されない。なお、前記式(1)において、nが0である場合は、アリーレン基であるZが前記化合物(A)の末端や分子鎖に直接結合していることを示す。
前記変性ポリフェニレンエーテル化合物は、前記式(1)で表される基を分子末端に有する変性ポリフェニレンエーテル化合物であれば、特に限定されない。前記式(1)で表される基の好ましい具体例としては、例えば、下記式(6)で表される基等が挙げられる。
前記重合体は、分子中に前記式(2)で表される構造単位を有する重合体であれば、特に限定されない。また、前記重合体は、分子中に前記式(2)で表される構造単位を有する重合体であれば、前記式(2)で表される構造単位以外の構造単位を有していてもよい。また、前記重合体は、前記式(2)で表される構造単位が繰り返し結合した繰り返し単位を含んでもよいし、前記式(2)で表される構造単位が繰り返し結合した繰り返し単位と前記式(2)で表される構造単位以外の構造単位が繰り返し結合した繰り返し単位とが、ランダムに結合した重合体であってもよい。すなわち、前記式(2)で表される構造単位以外の構造単位を有する場合、ブロック共重合体であってもよいし、ランダム共重合体であってもよい。
前記アセナフチレン化合物(B)は、アセナフチレン骨格を有する化合物であれば、特に限定されず、アセナフチレン及びアセナフチレン誘導体等が挙げられる。前記アセナフチレン化合物(B)は、具体的には、アセナフチレン、ヒドロキシアセナフチレン化合物、アルキルアセナフチレン化合物、アルコキシアセナフチレン化合物、及びハロゲン化アセナフチレン化合物等が挙げられる。前記ヒドロキシアセナフチレン化合物としては、例えば、3-ヒドロキシアセナフチレン、4-ヒドロキシアセナフチレン、5-ヒドロキシアセナフチレン、及び5,6-ジヒドロキシアセナフチレン等が挙げられる。また、前記アルキルアセナフチレン化合物としては、例えば、3-メチルアセナフチレン、3-エチルアセナフチレン、3-プロピルアセナフチレン、4-メチルアセナフチレン、4-エチルアセナフチレン、4-プロピルアセナフチレン、5-メチルアセナフチレン、5-エチルアセナフチレン、5-プロピルアセナフチレン、3,8-ジメチルアセナフチレン、及び5,6-ジメチルアセナフチレン化合物等が挙げられる。また、前記アルコキシアセナフチレン化合物としては、例えば、3-メトキシアセナフチレン、3-エトキシアセナフチレン、3-ブトキシアセナフチレン、4-メトキシアセナフチレン、4-エトキシアセナフチレン、4-ブトキシアセナフチレン、5-メトキシアセナフチレン、5-エトキシアセナフチレン、5-ブトキシアセナフチレン等が挙げられる。前記ハロゲン化アセナフチレン化合物としては、例えば、3-クロロアセナフチレン、3-ブロモアセナフチレン、4-クロロアセナフチレン、4-ブロモアセナフチレン、5-クロロアセナフチレン、5-ブロモアセナフチレン等が挙げられる。また、前記アセナフチレン化合物(B)は、上記例示化合物を単独で用いてもよいし、2種以上を組み合わせて用いてもよい。
前記化合物(A)の含有量は、前記化合物(A)と前記アセナフチレン化合物(B)との合計質量100質量部に対して、50~95質量部であることが好ましく、65~95質量部であることがより好ましい。また、前記アセナフチレン化合物(B)の含有量は、前記化合物(A)と前記アセナフチレン化合物(B)との合計質量100質量部に対して、5~50質量部であることが好ましく、5~35質量部であることがより好ましい。前記化合物(A)の含有量が少なすぎると、すなわち、前記アセナフチレン化合物(B)の含有量が多すぎると、低誘電正接を充分に発揮できない傾向がある。また、前記化合物(A)の含有量が多すぎると、すなわち、前記アセナフチレン化合物(B)の含有量が少なすぎると、耐熱性を充分に発揮できない傾向がある。よって、前記化合物(A)、及び前記アセナフチレン化合物(B)の各含有量が、上記範囲内であれば、得られた樹脂組成物が、誘電特性が低く、かつ、耐熱性の高い硬化物を好適に得ることができる。
本実施形態に係る樹脂組成物は、本発明の効果を損なわない範囲で、必要に応じて、前記化合物(A)、及び前記アセナフチレン化合物(B)以外の成分(その他の成分)を含有してもよい。本実施の形態に係る樹脂組成物に含有されるその他の成分としては、例えば、前記アセナフチレン化合物(B)以外の硬化剤、シランカップリング剤、難燃剤、開始剤、消泡剤、酸化防止剤、熱安定剤、帯電防止剤、紫外線吸収剤、染料や顔料、滑剤、及び無機充填材等の添加剤をさらに含んでもよい。また、前記樹脂組成物には、前記化合物(A)以外にも、ポリフェニレンエーテル、エポキシ樹脂、不飽和ポリエステル樹脂、及び熱硬化性ポリイミド樹脂等の樹脂を含有してもよい。
前記樹脂組成物を製造する方法としては、特に限定されず、例えば、前記化合物(A)、及び前記アセナフチレン化合物(B)を、所定の含有量となるように混合する方法等が挙げられる。具体的には、有機溶媒を含むワニス状の組成物を得る場合は、後述する方法等が挙げられる。
図1は、本発明の実施形態に係るプリプレグ1の一例を示す概略断面図である。
図2は、本発明の実施形態に係る金属張積層板11の一例を示す概略断面図である。
図3は、本発明の実施形態に係る配線板21の一例を示す概略断面図である。
図4は、本実施の形態に係る樹脂付き金属箔31の一例を示す概略断面図である。
図5は、本実施の形態に係る樹脂付きフィルム41の一例を示す概略断面図である。
本実施例において、樹脂組成物を調製する際に用いる各成分について説明する。
変性PPE1:前記式(1)で表される基を分子末端に有する変性ポリフェニレンエーテル化合物であり、具体的には、ポリフェニレンエーテルとクロロメチルスチレンとを反応させて得られた変性ポリフェニレンエーテル化合物である。すなわち、分子中に前記式(1)で表される基を少なくとも1つ有する化合物(A)である。
ここで、εは、吸光係数を示し、4700L/mol・cmである。また、OPLは、セル光路長であり、1cmである。
前記式中、Bは、空試験に要した0.1mol/Lのチオ硫酸ナトリウム標準溶液の滴定量(cc)を示し、Aは、中和に要した0.1mol/Lのチオ硫酸ナトリウム標準溶液の滴定量(cc)を示し、Fは、チオ硫酸ナトリウムの力価を示す。
重合体1:日鉄ケミカル&マテリアル株式会社製のODV-XET(X03)(分子中に前記式(2)で表される構造単位を有する重合体:炭素-炭素不飽和二重結合を芳香族環に2つ結合した2官能芳香族化合物に由来の構造単位を有し、前記式(1)で表される基を少なくとも1つ有する芳香族重合体であり、上記式(15)~(17)で表される構造単位を有する化合物(分子中に前記式(1)で表される基を少なくとも1つ有する化合物(A))、重量平均分子量Mw:26300、前記式(1)で表され、R1~R3が水素原子である基に含まれるビニル基の当量(ビニル当量):510)
重合体2:日鉄ケミカル&マテリアル株式会社製のODV-XET(X04)(分子中に前記式(2)で表される構造単位を有する重合体:炭素-炭素不飽和二重結合を芳香族環に2つ結合した2官能芳香族化合物に由来の構造単位を有し、前記式(1)で表される基を少なくとも1つ有する芳香族重合体であり、上記式(15)~(17)で表される構造単位を有する化合物(分子中に前記式(1)で表される基を少なくとも1つ有する化合物(A))、重量平均分子量Mw:31100、前記式(1)で表され、R1~R3が水素原子である基に含まれるビニル基の当量(ビニル当量):380)
重合体3:日鉄ケミカル&マテリアル株式会社製のODV-XET(X05)(分子中に前記式(2)で表される構造単位を有する重合体:炭素-炭素不飽和二重結合を芳香族環に2つ結合した2官能芳香族化合物に由来の構造単位を有し、前記式(1)で表される基を少なくとも1つ有する芳香族重合体であり、上記式(15)~(17)で表される構造単位を有する化合物(分子中に前記式(1)で表される基を少なくとも1つ有する化合物(A))、重量平均分子量Mw:39500、前記式(1)で表され、R1~R3が水素原子である基に含まれるビニル基の当量(ビニル当量):320)
なお、重合体1~3の、前記式(1)で表され、R1~R3が水素原子である基に含まれるビニル基の当量(ビニル当量)は、ウィイス法によるヨウ素価測定により算出した。具体的には、まず、測定対象物である化合物を、濃度が0.3g/35mL~0.3g/25mLとなるようにクロロホルムに溶解させた。この溶液中に存在する二重結合に対して、過剰量の塩化ヨウ素を添加した。そうすることによって、二重結合と塩化ヨウ素とが反応し、この反応が充分に進行した後、その反応後の溶液に20質量%のヨウ化カリウム水溶液を添加することによって、反応後の溶液に残存するヨウ素分がI3 -の形で水相に抽出された。このI3 -が抽出された水相を、チオ硫酸ナトリウム水溶液(0.1mol/Lのチオ硫酸ナトリウム標準溶液)により滴定し、ヨウ素価を算出した。ヨウ素価の算出には、下記式を用いた。
前記式中、Bは、空試験に要した0.1mol/Lのチオ硫酸ナトリウム標準溶液の滴定量(cc)を示し、Aは、中和に要した0.1mol/Lのチオ硫酸ナトリウム標準溶液の滴定量(cc)を示し、Fは、チオ硫酸ナトリウムの力価を示す。
アセナフチレン:JFEケミカル株式会社製のアセナフチレン
DVB:ジビニルベンゼン(日鉄ケミカル&マテリアル株式会社製のDVB810)
TAIC:トリアリルイソシアヌレート(日本化成株式会社製のTAIC)
TMPT:トリメチロールプロパントリメタクリレート(新中村化学工業株式会社製のTMPT)
ポリブタジエン:日本曹達株式会社製のB-1000
メタクリル変性PPE:ポリフェニレンエーテルの末端水酸基をメタクリル基で変性した変性ポリフェニレンエーテル(上記式(18)で表され、式(18)中、Yがジメチルメチレン基(式(12)で表され、式(12)中のR40及びR41がメチル基である基)であるメタクリル変性ポリフェニレンエーテル化合物、SABICイノベーティブプラスチックス社製のSA9000、重量平均分子量Mw2000、末端官能基数2個)
充填材(シリカ):ビニルシラン処理された球状シリカ(株式会社アドマテックス製のSC2300-SVJ)
開始剤(過酸化物):α,α’-ジ(t-ブチルパーオキシ)ジイソプロピルベンゼン(日油株式会社製のパーブチルP(PBP))
開始剤(アゾ開始剤):富士フイルム和光純薬株式会社製のVAm-110(2,2’-アゾビス(N-ブチル-2-メチルプロピオンアミド))
(調製方法)
まず、充填材以外の上記各成分を表3~6に記載の組成(質量部)で、固形分濃度が55質量%となるように、トルエンに添加し、混合させた。その混合物を60分間攪拌した。その後、得られた液体に充填材を添加し、ビーズミルで充填材を分散させた。そうすることによって、ワニス状の樹脂組成物(ワニス)が得られた。
セイコーインスツルメンツ株式会社製の粘弾性スペクトロメータ「DMS6100」を用いて、プリプレグのTgを測定した。このとき、曲げモジュールで周波数を10Hzとして動的粘弾性測定(DMA)を行い、昇温速度5℃/分の条件で室温から320℃まで昇温した際のtanδが極大を示す温度をTgとした。
前記評価基板を作製する際に、プリプレグを重ねる枚数を6枚にすることによって、両面に厚み35μmの銅箔が接着された、厚み約0.8mmの銅箔張積層板(金属箔張積層板)を得た。この形成された銅箔張積層板の両面銅箔をエッチングして除去した。このようにして得られた評価用積層体を、IPC TM650に準拠して、TMA法によるガラス転移温度(Tg)を評価した。測定には、熱機会分析(TMA)装置(株式会社日立ハイテクサイエンス製のTMA7100)を用い、30~300℃の範囲で測定した。
前記評価基板を作製する際に、プリプレグを重ねる枚数を6枚にすることによって、両面に厚み35μmの銅箔が接着された、厚み約0.8mmの銅箔張積層板(金属箔張積層板)を得た。IPC TM650に準拠して、前記評価基板の耐熱性(TMA法:T-260及びT-288)を評価した。
前記評価基板を作製する際に、プリプレグを重ねる枚数を6枚にすることによって、両面に厚み35μmの銅箔が接着された、厚み約0.8mmの銅箔張積層板(金属箔張積層板)を得た。この形成された銅箔張積層板を50mm×50mmに切断し、両面銅箔をエッチングして除去した。このようにして得られた評価用積層体を、温度121℃相対湿度100%の条件下で6時間保持した。その後、この評価用積層体を、288℃の半田槽中に10秒間浸漬した。そして、浸漬した積層体に、ミーズリングや膨れ等の発生の有無を目視で観察した。ミーズリングや膨れ等の発生が確認されなければ、「◎」と評価した。また、別途、288℃の半田槽の代わりに、260℃の半田槽を用いて、同様の評価を行った。288℃の場合、ミーズリングや膨れ等の発生が確認されたが、260℃の場合、ミーズリングや膨れ等の発生が確認されなければ、「○」と評価した。260℃の場合でも、ミーズリングや膨れ等の発生が確認されれば、「×」と評価した。
10GHzにおける評価基板の誘電正接を、空洞共振器摂動法で測定した。具体的には、ネットワーク・アナライザ(キーサイト・テクノロジー株式会社製のN5230A)を用い、10GHzにおける評価基板の誘電正接を測定した。
前記吸水処理前の誘電正接の測定で用いた評価基板を、JIS C 6481を参考にして吸湿処理させ、この吸湿処理させた評価基板の誘電正接(吸湿後の誘電正接)を、前記吸水処理前の誘電正接の測定と同様の方法で測定した。なお、前記吸湿処理としては、前記評価基板を恒温空気(50℃)中で24時間処理し、恒温水(23℃)中で24時間処理した後、評価基板上の水分を、乾燥した清浄な布で充分にふき取った。
吸水処理前の誘電正接と吸水処理後の誘電正接の差(吸水処理後の誘電正接-吸水処理前の誘電正接)を算出した。
Claims (18)
- 分子中に下記式(1)で表される基を少なくとも1つ有する化合物(A)と、
アセナフチレン化合物(B)とを含み、
前記化合物(A)が、下記式(1)で表される基を分子末端に有する変性ポリフェニレンエーテル化合物、及び分子中に下記式(2)で表される構造単位を有する重合体の少なくともいずれか一方を含み、
前記化合物(A)の含有量は、前記化合物(A)と前記アセナフチレン化合物(B)との合計質量100質量部に対して、50~95質量部であり、
前記アセナフチレン化合物(B)の含有量は、前記化合物(A)と前記アセナフチレン化合物(B)との合計質量100質量部に対して、5~50質量部であることを特徴とする樹脂組成物。
- 前記化合物(A)の重量平均分子量が、1200~40000である請求項1に記載の樹脂組成物。
- 前記化合物(A)の、前記式(1)で表され、R1~R3が水素原子である基に含まれるビニル基の当量が、250~1200である請求項1又は請求項2に記載の樹脂組成物。
- 前記化合物(A)が、前記変性ポリフェニレンエーテル化合物と、前記重合体とを含む請求項1~3のいずれか1項に記載の樹脂組成物。
- 前記変性ポリフェニレンエーテル化合物の含有量が、前記変性ポリフェニレンエーテル化合物と前記重合体と前記アセナフチレン化合物(B)との合計100質量部に対して、5~50質量部である請求項1~4のいずれか1項に記載の樹脂組成物。
- 前記重合体の含有量が、前記変性ポリフェニレンエーテル化合物と前記重合体と前記アセナフチレン化合物(B)との合計100質量部に対して、20~70質量部である請求項1~4のいずれか1項に記載の樹脂組成物。
- 前記重合体が、前記式(2)で表される構造単位として、炭素-炭素不飽和二重結合を芳香族環に2つ結合した2官能芳香族化合物に由来の構造単位を有する芳香族重合体を含む請求項1~6のいずれか1項に記載の樹脂組成物。
- 前記芳香族重合体が、炭素-炭素不飽和二重結合を芳香族環に1つ結合した単官能芳香族化合物に由来の構造単位をさらに有する請求項7に記載の樹脂組成物。
- 前記式(2)で表される構造単位が、下記式(3)で表される構造単位を含む請求項1~8のいずれか1項に記載の樹脂組成物。
- 前記式(3)で表される構造単位が、下記式(4)で表される構造単位を含む請求項9に記載の樹脂組成物。
- 前記重合体が、下記式(5)で表される構造単位を分子中にさらに有する重合体を含む請求項1~10のいずれか1項に記載の樹脂組成物。
- 前記式(5)で表される構造単位におけるアリール基が、炭素数1~6のアルキル基を有するアリール基を含む請求項11に記載の樹脂組成物。
- 前記重合体と前記アセナフチレン化合物(B)との含有比が、質量比で、50:50~95:5である請求項1~12のいずれか1項に記載の樹脂組成物。
- 請求項1~13のいずれか1項に記載の樹脂組成物又は前記樹脂組成物の半硬化物と、繊維質基材とを備えるプリプレグ。
- 請求項1~13のいずれか1項に記載の樹脂組成物又は前記樹脂組成物の半硬化物を含む樹脂層と、支持フィルムとを備える樹脂付きフィルム。
- 請求項1~13のいずれか1項に記載の樹脂組成物又は前記樹脂組成物の半硬化物を含む樹脂層と、金属箔とを備える樹脂付き金属箔。
- 請求項1~13のいずれか1項に記載の樹脂組成物の硬化物又は請求項14に記載のプリプレグの硬化物を含む絶縁層と、金属箔とを備える金属張積層板。
- 請求項1~13のいずれか1項に記載の樹脂組成物の硬化物又は請求項14に記載のプリプレグの硬化物を含む絶縁層と、配線とを備える配線板。
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JP2017025228A (ja) | 2015-07-24 | 2017-02-02 | 三菱瓦斯化学株式会社 | プリプレグ |
JP2018039995A (ja) | 2016-08-31 | 2018-03-15 | 新日鉄住金化学株式会社 | 可溶性多官能ビニル芳香族共重合体、その製造方法、硬化性樹脂組成物及びその硬化物 |
WO2019208471A1 (ja) | 2018-04-27 | 2019-10-31 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
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WO2020017399A1 (ja) | 2020-01-23 |
JPWO2020017399A1 (ja) | 2021-08-19 |
US20210269595A1 (en) | 2021-09-02 |
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