JP7359629B2 - Water-stopping structure for wire end splices and water-stopping method for wire end splices - Google Patents

Water-stopping structure for wire end splices and water-stopping method for wire end splices Download PDF

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JP7359629B2
JP7359629B2 JP2019182023A JP2019182023A JP7359629B2 JP 7359629 B2 JP7359629 B2 JP 7359629B2 JP 2019182023 A JP2019182023 A JP 2019182023A JP 2019182023 A JP2019182023 A JP 2019182023A JP 7359629 B2 JP7359629 B2 JP 7359629B2
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wire end
photocurable resin
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end splice
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JP2021058067A (en
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聖享 山本
康也 望月
健司 高塚
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Yazaki Corp
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Description

本発明は、電線端末スプライス部の止水構造及び電線端末スプライス部の止水方法に関する。 The present invention relates to a water-stopping structure for an electric wire end splice portion and a water-stopping method for an electric wire end splice portion.

従来、自動車に配索されるワイヤハーネスの各電線を互いに電気的に接続する場合、複数の電線の絶縁被覆が除去されて露出された端末の導体露出部分（端末の素線）を互いに熱圧着等のジョイントによって電線端末スプライス部を形成することによって接続する。このようなワイヤハーネスを車両に搭載する場合、電線端末スプライス部の素線間に止水（防水）処理を施すようにしている。 Conventionally, when electrically connecting the wires of a wire harness installed in a car, the insulation coatings of multiple wires are removed and the exposed conductor parts (terminal wires) are bonded together by thermocompression. Connect by forming a wire end splice with a joint such as. When such a wire harness is mounted on a vehicle, water-stopping (waterproofing) treatment is applied between the wires at the wire end splice portion.

例えば、特許文献１には、有底円筒形のキャップ内に未硬化樹脂を注入し、次に、キャップ内の未硬化樹脂の中に電線端末スプライス部及びその近傍を挿入し、次に、未硬化樹脂を硬化させて固定する電線端末スプライス部の止水構造及び止水方法が記載されている。 For example, in Patent Document 1, uncured resin is injected into a cylindrical cap with a bottom, the electric wire end splice portion and its vicinity are inserted into the uncured resin in the cap, and then the uncured resin is injected into the cap. A water-stopping structure and a water-stopping method for a wire end splice portion in which a cured resin is cured and fixed are described.

特開平１０－２４３５３９号公報Japanese Patent Application Publication No. 10-243539

特許文献１に記載の電線端末スプライス部の止水構造及び止水方法において、未硬化樹脂として光硬化性樹脂を用いた場合、ワイヤハーネス工場で樹脂を注入するため、ディスペンサー等の専用の設備が各ワイヤハーネス工場で必要となり、コスト高で作業性が悪い。また、光硬化性樹脂の場合、材料に光が当たらないように管理する必要がある。 In the water stop structure and water stop method for electric wire end splice parts described in Patent Document 1, when a photocurable resin is used as the uncured resin, special equipment such as a dispenser is required to inject the resin at a wire harness factory. It is required at each wire harness factory, and is expensive and has poor workability. In addition, in the case of photocurable resin, it is necessary to manage the material so that it is not exposed to light.

本発明は、このような従来技術が有する課題に鑑みてなされたものである。そして、本発明の目的は、電線端末スプライス部の素線間の止水を行う際に、作業性の向上及び低コスト化を図ることができる電線端末スプライス部の止水構造及び電線端末スプライス部の止水方法を提供することにある。 The present invention has been made in view of the problems of the prior art. It is an object of the present invention to provide a water-stopping structure for a wire end splice portion, which can improve workability and reduce costs when water is stopped between strands of the wire end splice portion, and a wire end splice portion. The objective is to provide a water stoppage method.

本発明の態様に係る電線端末スプライス部の止水構造は、複数の電線の絶縁被覆が除去された端末をジョイントしてなる電線端末スプライス部と、前記電線端末スプライス部及びその近傍を被う有底筒形で合成樹脂製のキャップと、前記キャップ内において前記電線端末スプライス部及びその近傍と前記キャップ間を閉塞固定する光硬化性樹脂層と、を備え、前記キャップは、該キャップ内に光硬化性樹脂が予め注入された状態で該キャップを密閉する封止部材を有し、前記封止部材は、前記キャップ内の前記光硬化性樹脂が硬化後または硬化前に取り除かれる構造である。 A water-stopping structure for a wire end splice portion according to an aspect of the present invention includes a wire end splice portion formed by jointing the ends of a plurality of wires from which insulation coatings have been removed, and a wire end splice portion that covers the wire end splice portion and its vicinity. The cap has a cylindrical bottom shape and is made of synthetic resin, and a photocurable resin layer that seals and fixes the electric wire end splice portion and its vicinity and the cap between the caps. It has a sealing member that seals the cap in a state in which a curable resin is injected in advance, and the sealing member has a structure that is removed after or before the photocurable resin in the cap is cured.

前記封止部材は、前記キャップの開口を開閉する合成樹脂製の蓋体であることが好ましい。 Preferably, the sealing member is a lid made of synthetic resin that opens and closes the opening of the cap.

前記封止部材は、前記キャップ内に前記光硬化性樹脂を注入後にその上に注入される熱硬化性樹脂の薄膜層であることが好ましい。 Preferably, the sealing member is a thin layer of thermosetting resin that is injected onto the photocurable resin after the photocurable resin is injected into the cap.

本発明の別の態様に係る電線端末スプライス部の止水方法は、有底筒形で合成樹脂製のキャップの開口から光硬化性樹脂を予め注入し、前記光硬化性樹脂の注入後に前記キャップの開口を封止部材で密閉したものを使用し、前記封止部材を取り除いた後または取り除きながら前記キャップ内の前記光硬化性樹脂の中に複数の電線の絶縁被覆が除去された端末をジョイントしてなる電線端末スプライス部及びその近傍を挿入し、前記光硬化性樹脂を硬化させて前記電線端末スプライス部及びその近傍と前記キャップ間を閉塞固定する方法である。 A water-stopping method for a wire end splice portion according to another aspect of the present invention includes injecting a photocurable resin in advance through an opening of a bottomed cylindrical cap made of synthetic resin, and then injecting the photocurable resin into the cap. The opening of the cap is sealed with a sealing member, and after or while removing the sealing member, the terminals of the plurality of electric wires from which the insulation coating has been removed are jointed into the photocurable resin in the cap. In this method, the electric wire end splice portion and its vicinity are inserted, and the photocurable resin is cured to close and fix the space between the electric wire end splice portion and its vicinity and the cap.

本発明によれば、電線端末スプライス部の素線間の止水を行う際に、作業性の向上及び低コスト化を図ることができる電線端末スプライス部の止水構造及び電線端末スプライス部の止水方法を提供することができる。 According to the present invention, there is provided a water stop structure for a wire end splice portion and a water stopper for the wire end splice portion that can improve workability and reduce costs when water is stopped between wires at the wire end splice portion. water method can be provided.

本発明の第１実施形態に係る電線端末スプライス部の止水構造の一例を示す断面図である。FIG. 2 is a cross-sectional view showing an example of a water-stopping structure of the electric wire end splice portion according to the first embodiment of the present invention. 上記止水構造に用いられるキャップの斜視図である。It is a perspective view of the cap used for the above-mentioned water stop structure. （ａ）は上記キャップのキャップ本体と蓋体とを連結するヒンジ部の平面図、（ｂ）は同ヒンジ部の側面図である。(a) is a plan view of a hinge portion that connects the cap body and the lid body of the cap, and (b) is a side view of the hinge portion. 上記キャップに光硬化性樹脂を注入する状態を示す説明図である。It is an explanatory view showing the state where photocurable resin is injected into the above-mentioned cap. 上記光硬化性樹脂を注入して蓋体を閉じたキャップの断面図である。It is a sectional view of the cap in which the above-mentioned photocurable resin is injected and the lid body is closed. （ａ）は上記光硬化性樹脂を注入して蓋体を閉じたキャップを収容した梱包容器の上蓋をする前の斜視図、（ｂ）は同上蓋をした状態の梱包容器の斜視図である。(a) is a perspective view of a packaging container containing a cap in which the photocurable resin is injected and the lid is closed, before the top lid is put on, and (b) is a perspective view of the packaging container with the top lid closed. . 上記キャップ内の光硬化性樹脂の中に電線端末スプライス部を挿入する前の状態を示す断面図である。FIG. 3 is a cross-sectional view showing a state before the electric wire end splice portion is inserted into the photocurable resin in the cap. 上記キャップ内の光硬化性樹脂の中に電線端末スプライス部及びその近傍を挿入した状態を示す断面図である。FIG. 3 is a sectional view showing a state in which the electric wire end splice portion and its vicinity are inserted into the photocurable resin in the cap. 上記キャップ内の光硬化性樹脂が硬化した後でキャップの蓋体を切断して取り除いた状態を示す断面図である。FIG. 3 is a cross-sectional view showing a state in which the lid of the cap is cut and removed after the photocurable resin inside the cap has hardened. 本発明の第２実施形態の電線端末スプライス部の止水構造を示す斜視図である。It is a perspective view which shows the water stop structure of the electric wire end splice part of 2nd Embodiment of this invention. 上記第２実施形態の止水構造に用いられるキャップの斜視図である。It is a perspective view of the cap used for the water stop structure of the said 2nd Embodiment. 上記第２実施形態の止水構造のキャップに光硬化性樹脂を注入する状態を示す説明図である。It is an explanatory view showing the state where photocurable resin is injected into the cap of the water stop structure of the above-mentioned 2nd embodiment. 上記第２実施形態の止水構造のキャップに更に熱硬化性樹脂を注入する状態を示す説明図である。It is an explanatory view showing the state where thermosetting resin is further injected into the cap of the water stop structure of the above-mentioned 2nd embodiment. 上記熱硬化性樹脂が硬化した状態のキャップの断面図である。It is a sectional view of the cap in a state where the thermosetting resin is cured. （ａ）は上記止水構造のキャップ内の光硬化性樹脂の中に電線端末スプライス部を挿入する前の状態を示す断面図、（ｂ）は上記熱硬化性樹脂を突き破ってキャップ内の光硬化性樹脂の中に電線端末スプライス部及びその近傍を挿入した状態を示す断面図である。(a) is a cross-sectional view showing the state before the electric wire end splice part is inserted into the photocurable resin in the cap with the water-stopping structure, and (b) is a sectional view showing the state where the wire end splice part is inserted into the photocurable resin inside the cap with the above-mentioned water-stopping structure. FIG. 3 is a cross-sectional view showing a state in which a wire end splice portion and its vicinity are inserted into a curable resin.

以下、図面を用いて本発明の実施形態に係る電線端末スプライス部の止水構造について詳細に説明する。 EMBODIMENT OF THE INVENTION Hereinafter, the water stop structure of the electric wire end splice part based on embodiment of this invention is demonstrated in detail using drawings.

図１は第１実施形態の止水方法で形成された電線端末スプライス部の止水構造を示す。図２と図３は止水方法に用いられるキャップを示す。図４～図６は部品工場でキャップに光硬化性樹脂が注入されてから出荷するまでを示す。図７～図９は止水方法の工程を示す。 FIG. 1 shows a water-stopping structure of a wire end splice portion formed by the water-stopping method of the first embodiment. 2 and 3 show a cap used in the water stop method. FIGS. 4 to 6 show the process from injecting photocurable resin into the cap at a parts factory to shipping. 7 to 9 show the steps of the water stop method.

図１に示すように、この第１実施形態の電線端末スプライス部の止水構造１０Ａは、電線端末スプライス部１４と、電線端末スプライス部１４及びその近傍を被う有底筒形で合成樹脂製のキャップ２０と、これらを閉塞固定する光硬化性樹脂層３１と、を備えている。 As shown in FIG. 1, the water-stopping structure 10A of the electric wire end splice portion of the first embodiment has a bottomed cylindrical shape that covers the electric wire end splice portion 14 and the vicinity thereof, and is made of synthetic resin. The cap 20 is provided with a photocurable resin layer 31 for closing and fixing these.

電線端末スプライス部１４は、複数の電線１１の端末で絶縁被覆１２を剥離して芯線（素線）１３を露出させ、これら芯線１３を積層して超音波溶着等の熱圧着でジョイントして矩形状の塊としたものである。この電線端末スプライス部１４及びその近傍で露出の芯線１３と絶縁被覆１２を包囲するキャップ２０の相互間は、キャップ２０内に予め注入されている光硬化性樹脂３０にワイヤハーネス工場で光を照射して硬化した光硬化性樹脂層３１により閉塞固定されている。 The wire end splice portion 14 is formed by peeling off the insulation coating 12 at the ends of the plurality of wires 11 to expose the core wires (strands) 13, stacking these core wires 13 and joining them by thermocompression bonding such as ultrasonic welding to form a rectangular shape. It is a block of shapes. Between the wire end splice portion 14 and the cap 20 that surrounds the exposed core wire 13 and the insulation coating 12 in the vicinity thereof, a photocurable resin 30 that has been injected into the cap 20 in advance is irradiated with light at a wire harness factory. It is closed and fixed by a photocurable resin layer 31 that has been cured.

図２、図３に示すように、キャップ２０は、光透過性の透明材料で形成されていて、有底円筒形のキャップ本体２１と、このキャップ本体２１の開口２１ａを開閉する蓋体（封止部材）２２と、を有している。このキャップ本体２１と蓋体２２はヒンジ部２３を介して連結されている。このヒンジ部２３の上下面には、中央に楕円形の孔部２３ｂを有した切断用のＶ字状の切込み２３ａが形成されている。このヒンジ部２３は、キャップ本体２１内の光硬化性樹脂３０が硬化した後で切断され、キャップ本体２１から蓋体２２が取り除かれる。 As shown in FIGS. 2 and 3, the cap 20 is made of a light-transmitting transparent material, and includes a cylindrical cap body 21 with a bottom, and a lid body (sealing body) that opens and closes an opening 21a of the cap body 21. (stop member) 22. The cap body 21 and the lid body 22 are connected via a hinge portion 23. A V-shaped notch 23a for cutting is formed on the upper and lower surfaces of the hinge portion 23, with an elliptical hole 23b in the center. This hinge portion 23 is cut after the photocurable resin 30 inside the cap body 21 is cured, and the lid body 22 is removed from the cap body 21.

図４、図５に示すように、キャップ２０のキャップ本体２１内には、部品工場にて、ディスペンサー等の専用の設備４０により光硬化性樹脂３０が予め注入される。この光硬化性樹脂３０が注入されたキャップ本体２１の開口２１ａは、蓋体２２により密閉される。そして、図６（ａ），（ｂ）に示すように、非光透過性の梱包容器５０の各収容スペース５１内に倒れないように収容される。この梱包容器５０は、非光透過性の上蓋５２で覆われて梱包された後で、部品工場から出荷されて各ワイヤハーネス工場に供給される。 As shown in FIGS. 4 and 5, a photocurable resin 30 is injected into the cap body 21 of the cap 20 in advance at a parts factory using dedicated equipment 40 such as a dispenser. The opening 21 a of the cap body 21 into which the photocurable resin 30 is injected is sealed by the lid 22 . Then, as shown in FIGS. 6(a) and 6(b), it is accommodated in each accommodation space 51 of the non-light-transmitting packaging container 50 so as not to fall down. After this packaging container 50 is covered with a non-light-transparent upper lid 52 and packed, it is shipped from a parts factory and supplied to each wire harness factory.

この第１実施形態の電線端末スプライス部の止水構造１０Ａを形成する際に、透明なキャップ２０の開口２１ａから光硬化性樹脂３０を部品工場で予め注入し、光硬化性樹脂３０の注入後にキャップ２０の開口２１ａを蓋体２２で密閉したものを使用する。 When forming the water stop structure 10A of the electric wire end splice portion of the first embodiment, the photocurable resin 30 is injected in advance through the opening 21a of the transparent cap 20 at a parts factory, and after the photocurable resin 30 is injected, A cap 20 whose opening 21a is sealed with a lid 22 is used.

次に、電線端末スプライス部の止水構造１０Ａの形成工程を図７～図９に沿って説明する。 Next, the process of forming the water stop structure 10A at the wire end splice portion will be explained with reference to FIGS. 7 to 9.

まず、図７に示すように、予め光硬化性樹脂３０が注入されている透明なキャップ２０のキャップ本体２１の開口２１ａを閉じている蓋体２２を開ける。 First, as shown in FIG. 7, the lid 22 that closes the opening 21a of the cap body 21 of the transparent cap 20 into which the photocurable resin 30 is injected in advance is opened.

次に、図８に示すように、開口２１ａから蓋体２２を開けて取り外したキャップ本体２１の光硬化性樹脂３０の中に、電線端末スプライス部１４及びその近傍（絶縁被覆１２と芯線１３）を挿入する。 Next, as shown in FIG. 8, the electric wire end splice portion 14 and its vicinity (insulating coating 12 and core wire 13) are placed in the photocurable resin 30 of the removed cap body 21 by opening the lid 22 from the opening 21a. Insert.

そして、透明なキャップ２０のキャップ本体２１に光を照射し、キャップ本体２１内の光硬化性樹脂３０を硬化させて電線端末スプライス部１４及びその近傍とキャップ本体２１相互間を硬化した光硬化性樹脂層３１で閉塞固定する。その後、図９に示すように、ヒンジ部２３を切断して、蓋体２２を除去して廃棄することで、図１に示す電線端末スプライス部の止水構造１０Ａがワイヤハーネス工場で形成される。なお、ワイヤハーネスを車両に搭載する場合に、その配索経路上で蓋体２２が邪魔にならないときは、蓋体２２をキャップ本体２１に付けたままで良く、除去する必要はない。 Then, the cap body 21 of the transparent cap 20 is irradiated with light to harden the photocurable resin 30 inside the cap body 21, and the photocurable resin 30 is cured at the wire end splice portion 14 and its vicinity and between the cap bodies 21. It is closed and fixed with a resin layer 31. Thereafter, as shown in FIG. 9, the hinge portion 23 is cut and the lid body 22 is removed and discarded, thereby forming the water stop structure 10A for the wire end splice portion shown in FIG. 1 at the wire harness factory. . Note that when the wire harness is mounted on a vehicle, if the lid 22 does not get in the way on the wiring route, the lid 22 may remain attached to the cap body 21 and does not need to be removed.

このように、電線端末スプライス部１４の芯線１３間の止水を行う際に、キャップ２０のキャップ本体２１には蓋体２２が一体成形されており、部品工場でキャップ本体２１内に光硬化性樹脂３０を注入し、その後蓋をした状態で各ワイヤハーネス工場へ供給する。よって、部品工場のみキャップ２０に光硬化性樹脂３０を注入するディスペンサー等の専用の設備４０を設置すれば、各ワイヤハーネス工場には設置する必要がなく、かつ、材料管理の必要もないため、その分、低コスト化を図ることができる。つまり、各ワイヤハーネス工場における光硬化性樹脂３０のキャップ２０への注入作業及び材料管理の削減を図ることができる。さらに、各ワイヤハーネス工場に対する設備投資の削減を図ることができる。これらにより、電線端末スプライス部の止水構造１０Ａをワイヤハーネス工場で形成する際に、作業性の向上及び低コスト化をより一段と図ることができる。 In this way, when water is to be stopped between the core wires 13 of the wire end splice section 14, the lid body 22 is integrally molded on the cap body 21 of the cap 20, and a photocurable resin is applied inside the cap body 21 at the parts factory. The resin 30 is injected and then the cap is supplied to each wire harness factory. Therefore, if a dedicated equipment 40 such as a dispenser for injecting the photocurable resin 30 into the cap 20 is installed only at the parts factory, there is no need to install it at each wire harness factory, and there is no need for material management. Accordingly, cost reduction can be achieved. In other words, it is possible to reduce the work of injecting the photocurable resin 30 into the cap 20 and the material management at each wire harness factory. Furthermore, it is possible to reduce capital investment for each wire harness factory. As a result, when forming the water stop structure 10A of the electric wire end splice portion at a wire harness factory, it is possible to further improve workability and reduce costs.

図１０は第２実施形態の止水方法で形成された電線端末スプライス部の止水構造を示す。図１１は止水方法に用いられるキャップを示す。図１２～図１４は部品工場におけるキャップへの各樹脂の注入を示す。図１５（ａ），（ｂ）は止水方法の工程を示す。 FIG. 10 shows a water-stopping structure of a wire end splice portion formed by the water-stopping method of the second embodiment. FIG. 11 shows a cap used in the water stop method. 12 to 14 show the injection of each resin into the cap at a parts factory. FIGS. 15(a) and 15(b) show the steps of the water stopping method.

図１０、図１５（ｂ）に示すように、この電線端末スプライス部の止水構造１０Ｂは、電線端末スプライス部１４と、電線端末スプライス部１４及びその近傍を被う有底筒形で合成樹脂製のキャップ２０と、これらを閉塞固定する光硬化性樹脂層３１を備えている。この電線端末スプライス部１４及びその近傍で露出の芯線１３と絶縁被覆１２を包囲するキャップ２０の相互間は、キャップ２０内に予め注入されている光硬化性樹脂３０にワイヤハーネス工場で光を照射して硬化した光硬化性樹脂層３１により閉塞固定されている。 As shown in FIGS. 10 and 15(b), the water stop structure 10B of the electric wire end splice portion is made of synthetic resin and has a cylindrical shape with a bottom that covers the electric wire end splice portion 14 and the vicinity thereof. The cap 20 has a photocurable resin layer 31 for sealing and fixing the cap 20. Between the wire end splice portion 14 and the cap 20 that surrounds the exposed core wire 13 and the insulation coating 12 in the vicinity thereof, a photocurable resin 30 that has been injected into the cap 20 in advance is irradiated with light at a wire harness factory. It is closed and fixed by a photocurable resin layer 31 that has been cured.

図１１に示すように、キャップ２０は、光透過性の透明材料で形成されていて、有底円筒形のキャップ本体２１を有している。また、図１２、図１３に示すように、キャップ２０のキャップ本体２１内には、部品工場にて、ディスペンサー等の専用の設備４０により光硬化性樹脂３０が予め注入される。この光硬化性樹脂３０が注入された後で、キャップ本体２１内の光硬化性樹脂３０の上には、ディスペンサー等の専用の設備４０により比重の軽い熱硬化性樹脂３５が更に少量注入される。この少量の熱硬化性樹脂３５の硬化により、図１４に示すように、キャップ本体２１の開口２１ａを密閉する封止部材としての薄膜層３６が形成される。このキャップ本体２１の開口２１ａが封止部材としての薄膜層３６で密閉されたキャップ２０は、図６（ａ），（ｂ）に示すように、非光透過性の梱包容器５０の各収容スペース５１内に倒れないように収容される。そして、梱包容器５０は、非光透過性の上蓋５２で覆われて梱包された後で、部品工場から出荷されて各ワイヤハーネス工場に供給される。 As shown in FIG. 11, the cap 20 is made of a light-transmitting transparent material and has a cap body 21 in the shape of a cylinder with a bottom. Further, as shown in FIGS. 12 and 13, a photocurable resin 30 is injected into the cap body 21 of the cap 20 in advance at a parts factory using dedicated equipment 40 such as a dispenser. After this photocurable resin 30 is injected, a small amount of a thermosetting resin 35 with a light specific gravity is injected onto the photocurable resin 30 inside the cap body 21 using a special equipment 40 such as a dispenser. . By curing this small amount of thermosetting resin 35, a thin film layer 36 is formed as a sealing member for sealing the opening 21a of the cap body 21, as shown in FIG. The cap 20, in which the opening 21a of the cap body 21 is sealed with a thin film layer 36 as a sealing member, is provided in each accommodation space of a non-light-transparent packaging container 50, as shown in FIGS. 6(a) and 6(b). 51 so as not to fall. After the packaging container 50 is covered with a non-light-transparent upper lid 52 and packed, it is shipped from a parts factory and supplied to each wire harness factory.

この第２実施形態の電線端末スプライス部の止水構造１０Ｂを形成する際に、透明なキャップ２０の開口２１ａから光硬化性樹脂３０と比重の軽い熱硬化性樹脂３５を部品工場で順に予め注入し、熱硬化性樹脂３５が硬化した薄膜層３６で密閉したものを使用する。 When forming the water stop structure 10B of the electric wire end splice portion of the second embodiment, a photocurable resin 30 and a thermosetting resin 35 with a light specific gravity are injected in advance in order from the opening 21a of the transparent cap 20 at a parts factory. However, the thermosetting resin 35 is sealed with a thin film layer 36 that is cured.

次に、電線端末スプライス部の止水構造１０Ｂの形成工程を図１５（ａ），（ｂ）で説明する。 Next, the process of forming the water stop structure 10B at the wire end splice portion will be described with reference to FIGS. 15(a) and 15(b).

まず、図１５（ａ）に示すように、予め光硬化性樹脂３０が注入されている透明なキャップ２０のキャップ本体２１の開口２１ａから電線端末スプライス部１４及びその近傍（絶縁被覆１２と芯線１３）を挿入する。 First, as shown in FIG. 15(a), from the opening 21a of the cap body 21 of the transparent cap 20 into which the photocurable resin 30 has been injected in advance, the electric wire end splice portion 14 and its vicinity (insulating coating 12 and core wire 13) are opened. ).

そして、図１５（ｂ）に示すように、塊状の電線端末スプライス部１４でキャップ本体２１内の熱硬化性樹脂３５が硬化してなる薄膜層３６を突き破って取り除きながらキャップ本体２１内の光硬化性樹脂３０の中に電線端末スプライス部１４及びその近傍を挿入する。 Then, as shown in FIG. 15(b), while the bulk electric wire end splice portion 14 breaks through and removes the thin film layer 36 formed by hardening the thermosetting resin 35 inside the cap body 21, the inside of the cap body 21 is photocured. The wire end splice portion 14 and its vicinity are inserted into the plastic resin 30.

次に、透明なキャップ２０のキャップ本体２１に光を照射し、キャップ本体２１内の光硬化性樹脂３０を硬化させて電線端末スプライス部１４及びその近傍とキャップ本体２１相互間を硬化した光硬化性樹脂層３１で閉塞固定する。これにより、図１０に示す電線端末スプライス部の止水構造１０Ｂがワイヤハーネス工場で形成される。 Next, the cap body 21 of the transparent cap 20 is irradiated with light to harden the photocurable resin 30 inside the cap body 21, thereby photocuring the wire end splice portion 14 and its vicinity and between the cap bodies 21. It is closed and fixed with a synthetic resin layer 31. As a result, the water stop structure 10B for the electric wire end splice portion shown in FIG. 10 is formed at the wire harness factory.

このように、第２実施形態の電線端末スプライス部の止水構造１０Ｂ及び止水方法では、光硬化性樹脂３０が予め注入された透明なキャップ２０を熱硬化性樹脂３５が硬化してなる薄膜層３６で密閉させたことにより、前記第１実施形態と同様の作用・効果を奏する。 As described above, in the water stop structure 10B and the water stop method for electric wire end splice portions of the second embodiment, a thin film formed by hardening the thermosetting resin 35 on the transparent cap 20 in which the photocurable resin 30 is injected in advance. By sealing with the layer 36, the same functions and effects as in the first embodiment can be achieved.

以上、各実施形態を説明したが、実施形態はこれらに限定されるものではなく、各実施形態の要旨の範囲内で種々の変形が可能である。 Although each embodiment has been described above, the embodiment is not limited to these, and various modifications can be made within the scope of the gist of each embodiment.

すなわち、前記各実施形態によれば、透明のキャップを用いたが、半透明のキャップを用いても良い。 That is, according to each of the embodiments described above, a transparent cap is used, but a translucent cap may also be used.

また、前記各実施形態によれば、電線の端末にスプライス部を形成したが、電線の中途にスプライス部を形成したものに前記各実施形態を適用できることは勿論である。 Further, according to each of the above embodiments, the splice portion is formed at the end of the electric wire, but it goes without saying that the above embodiments can be applied to a wire in which the splice portion is formed in the middle of the electric wire.

１０Ａ，１０Ｂ 電線端末スプライス部の止水構造
１１ 電線
１２ 絶縁被覆
１３ 露出した芯線（端末）
１４ 電線端末スプライス部
２０ 有底筒形で合成樹脂製のキャップ
２１ａ 開口
２２ 蓋体（封止部材）
３０ 光硬化性樹脂
３１ 光硬化性樹脂層
３５ 熱硬化性樹脂
３６ 薄膜層（封止部材） 10A, 10B Water-stop structure at wire end splice portion 11 Electric wire 12 Insulation coating 13 Exposed core wire (terminal)
14 Wire end splice part 20 Bottomed cylindrical cap made of synthetic resin 21a Opening 22 Lid body (sealing member)
30 Photocurable resin 31 Photocurable resin layer 35 Thermosetting resin 36 Thin film layer (sealing member)

Claims (1)

有底筒形で合成樹脂製のキャップの開口から光硬化性樹脂を予め注入し、前記光硬化性樹脂の注入後に前記キャップの開口を封止部材で密閉したものを使用し、
前記封止部材を取り除いた後または取り除きながら前記キャップ内の前記光硬化性樹脂の中に複数の電線の絶縁被覆が除去された端末をジョイントしてなる電線端末スプライス部及びその近傍を挿入し、
前記光硬化性樹脂を硬化させて前記電線端末スプライス部及びその近傍と前記キャップ間を閉塞固定し、
前記封止部材は、前記キャップ内に前記光硬化性樹脂を注入後にその上に注入される熱硬化性樹脂の薄膜層である電線端末スプライス部の止水方法。 A photocurable resin is injected in advance through the opening of a synthetic resin cap having a cylindrical shape with a bottom, and after the photocurable resin is injected, the opening of the cap is sealed with a sealing member,
After or while removing the sealing member, inserting an electric wire end splice portion formed by joining the ends of a plurality of electric wires from which the insulation coating has been removed into the photocurable resin in the cap, and the vicinity thereof;
curing the photocurable resin to close and fix the wire end splice portion and its vicinity and the cap ;
The sealing member is a thin film layer of a thermosetting resin that is injected onto the photocurable resin after the photocurable resin is injected into the cap.
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Citations (2)

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Publication number Priority date Publication date Assignee Title
WO2005071792A1 (en) 2004-01-27 2005-08-04 Yazaki Corporation Method for waterproofing connection part of covered wire
JP5138678B2 (en) 2006-05-19 2013-02-06 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド Control of formation of cohesive point defects and oxygen clusters induced from silicon single crystal side surface during CZ growth

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JPS5130639Y2 (en) * 1973-04-20 1976-08-02
JPS5138678U (en) * 1974-09-17 1976-03-23
JPS53121481U (en) * 1977-03-07 1978-09-27
JP2013081341A (en) * 2011-10-05 2013-05-02 Fukushima Nitto Shinko Kk Terminal cap and terminal treatment method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005071792A1 (en) 2004-01-27 2005-08-04 Yazaki Corporation Method for waterproofing connection part of covered wire
JP5138678B2 (en) 2006-05-19 2013-02-06 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド Control of formation of cohesive point defects and oxygen clusters induced from silicon single crystal side surface during CZ growth

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