JP7342367B2 - electronic control unit - Google Patents

electronic control unit Download PDF

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JP7342367B2
JP7342367B2 JP2019012125A JP2019012125A JP7342367B2 JP 7342367 B2 JP7342367 B2 JP 7342367B2 JP 2019012125 A JP2019012125 A JP 2019012125A JP 2019012125 A JP2019012125 A JP 2019012125A JP 7342367 B2 JP7342367 B2 JP 7342367B2
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heat
electronic component
integrated circuit
heat dissipating
wiring board
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JP2020120063A (en
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利晃 三枝
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Denso Corp
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Denso Corp
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    • H—ELECTRICITY
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
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Description

本発明は電子制御装置に関する。 The present invention relates to an electronic control device.

近年、例えば車両に搭載されるＥＣＵ（Electronic Control Unit）では、マイクロコンピュータのような発熱電子部品の発熱量が増加する傾向にある。このため、配線基板に搭載されたマイクロコンピュータを筐体に放熱材を介して熱伝導可能に密着させることで、マイクロコンピュータの熱を筐体に分散させて放熱するようにしている。 In recent years, for example, in ECUs (Electronic Control Units) mounted on vehicles, the amount of heat generated by heat-generating electronic components such as microcomputers has tended to increase. For this reason, the microcomputer mounted on the wiring board is brought into close contact with the casing via a heat dissipating material so that the heat can be conducted, thereby dispersing the heat of the microcomputer to the casing and dissipating the heat.

特開２００６－０４９５０１号公報Japanese Patent Application Publication No. 2006-049501

マイクロコンピュータを筐体に放熱材を介して熱伝導可能に密着させるには、マイクロコンピュータが搭載された配線基板を筐体に組み付ける際にマイクロコンピュータに放熱材を塗布し、マイクロコンピュータと筐体との間で放熱材を押し潰すようにしている。 In order to attach the microcomputer to the casing through a heat dissipating material so that heat can be conducted, a heat dissipating material is applied to the microcomputer when assembling the wiring board on which the microcomputer is mounted to the casing. The heat dissipating material is crushed between the two.

このとき、放熱材がマイクロコンピュータからはみ出してしまい、マイクロコンピュータの直近に配置しなければいけない例えば発振回路のクリスタルに放熱材が付着することがある。このため、放熱材との容量結合によりクリスタルの発振余裕度の低下が懸念される。
そこで、特許文献１に示すように筐体に放熱材のズレ防止用のメッシュ溝を設けるようにしているが、放熱材の冷熱時のずれを十分に防げていないのが実情である。 At this time, the heat dissipating material may protrude from the microcomputer and may adhere to, for example, the crystal of an oscillation circuit, which must be placed in close proximity to the microcomputer. Therefore, there is a concern that the oscillation margin of the crystal may be reduced due to capacitive coupling with the heat dissipating material.
Therefore, as shown in Patent Document 1, mesh grooves are provided in the housing to prevent the heat dissipating material from shifting, but the reality is that this does not sufficiently prevent the heat dissipating material from shifting during cooling or heating.

本発明は上記事情に鑑みてなされたもので、その目的は、放熱材が付着した場合に特性変動することがある特定電子部品に発熱電子部品からはみ出した放熱材が付着してしまうことを防止できる電子制御装置を提供することにある。 The present invention has been made in view of the above circumstances, and its purpose is to prevent heat dissipating material protruding from heat-generating electronic components from adhering to specific electronic components whose characteristics may change if heat dissipating material adheres to them. Our goal is to provide an electronic control device that can

請求項１の発明によれば、配線基板（５）を筐体（２）に取り付けると、発熱電子部品（９）の表面に塗布された放熱材（２０）が発熱電子部品（９）と筐体（２）との間で押し潰されて塗布領域からはみ出すようになる。このため、塗布領域からはみ出した放熱材（２０）が発熱電子部品（９）に隣接した特定電子部品（１０）に向かうようになる。 According to the invention of claim 1, when the wiring board (5) is attached to the housing (2), the heat dissipating material (20) applied to the surface of the heat generating electronic component (9) connects the heat generating electronic component (9) and the housing. It is crushed between the body (2) and protrudes from the application area. Therefore, the heat dissipating material (20) protruding from the application area is directed toward the specific electronic component (10) adjacent to the heat generating electronic component (9).

ここで、阻止部（２１）は、発熱電子部品（９）と筐体（２）との間で押し潰された放熱材（２０）が特定電子部品（１０）に向かうことを阻止するので、特定電子部品（１０）に放熱材（２０）が付着してその特性が変化してしまうことを防止できる。 Here, the blocking part ( 21 ) prevents the heat dissipating material (20) crushed between the heat generating electronic component (9) and the casing (2) from moving toward the specific electronic component (10). It is possible to prevent the heat dissipating material (20) from adhering to the specific electronic component (10) and changing its characteristics.

第１実施形態における全体構成を模式的に示す縦断面図A vertical cross-sectional view schematically showing the overall configuration in the first embodiment 配線基板の取付け状態で示すケースの下面図Bottom view of the case with the wiring board installed 集積回路装置を模式的に示す縦断面図Vertical cross-sectional view schematically showing an integrated circuit device 塗布領域を模式的に示す配線基板の平面図A plan view of a wiring board schematically showing the coating area 放熱部を模式的に示すケースの下面図Bottom view of the case schematically showing the heat dissipation part 変形形態における溝部を示す放熱部の下面図（その１）Bottom view of the heat dissipation part showing the groove part in a modified form (Part 1) 変形形態における溝部を示す放熱部の下面図（その２）Bottom view of the heat dissipation section showing the groove section in a modified form (part 2) 変形形態における全体構成を模式的に示す縦断面図Vertical cross-sectional view schematically showing the overall configuration in a modified form 第２実施形態における全体構成を模式的に示す縦断面図A vertical cross-sectional view schematically showing the overall configuration in the second embodiment 変形形態における全体構成を模式的に示す縦断面図Vertical cross-sectional view schematically showing the overall configuration in a modified form 第３実施形態における全体構成を模式的に示す縦断面図A vertical cross-sectional view schematically showing the overall configuration in the third embodiment 第４実施形態における全体構成を模式的に示す縦断面図A vertical cross-sectional view schematically showing the overall configuration in the fourth embodiment 第５実施形態における全体構成を模式的に示す縦断面図A vertical cross-sectional view schematically showing the overall configuration in the fifth embodiment

以下、複数の実施形態について図面を参照して説明する。複数の実施形態において、機能的に及び／又は構造的に対応する部分には同一の参照符号を付与する。 Hereinafter, a plurality of embodiments will be described with reference to the drawings. In several embodiments, functionally and/or structurally corresponding parts are provided with the same reference symbols.

（第１実施形態）
本発明を車両に搭載されるＥＣＵに適用した第１実施形態について図１から図５を参照して説明する。
図１に模式的に示すようにＥＣＵ１（電子制御装置に相当）はダイカスト製の容器状のケース２にカバー３を固定して筐体が構成されており、その内部に閉鎖空間４が形成されている。 (First embodiment)
A first embodiment in which the present invention is applied to an ECU mounted on a vehicle will be described with reference to FIGS. 1 to 5.
As schematically shown in FIG. 1, the ECU 1 (corresponding to an electronic control unit) has a housing made up of a die-cast container-shaped case 2 with a cover 3 fixed thereto, and a closed space 4 is formed inside the housing. ing.

図２に示すようにケース２には配線基板５がネジ６によりネジ止めされており、配線基板５の表面がケース２の内面に対向している。ケース２には車両に固定するための取付孔７が一体に形成されている。また、ケース２にはコネクタ８が装着されており、そのコネクタ８を介して配線基板５と外部機器とが接続される。 As shown in FIG. 2, a wiring board 5 is screwed to the case 2 with screws 6, and the surface of the wiring board 5 faces the inner surface of the case 2. A mounting hole 7 for fixing to a vehicle is integrally formed in the case 2. Further, a connector 8 is attached to the case 2, and the wiring board 5 and external equipment are connected via the connector 8.

配線基板５の表面にはマイクロコンピュータを含む電子部品が実装されている。電子部品としては、集積回路装置９（発熱電子部品に相当）、発振回路を構成するクリスタル１０、フリップチップ、ダイオードなどの表面実装部品、抵抗やコンデンサやコイルなどの図示しないディスクリート部品である。図１では集積回路装置９に隣接されて配置され、集積回路装置９と配線基板５の内層配線１１を介して接続されたクリスタル１０のみを図示し、他の電子部品の図示を省略している。 Electronic components including a microcomputer are mounted on the surface of the wiring board 5. The electronic components include an integrated circuit device 9 (corresponding to a heat-generating electronic component), a crystal 10 forming an oscillation circuit, surface-mounted components such as flip chips and diodes, and discrete components (not shown) such as resistors, capacitors, and coils. In FIG. 1, only the crystal 10 placed adjacent to the integrated circuit device 9 and connected to the integrated circuit device 9 via the inner layer wiring 11 of the wiring board 5 is illustrated, and illustration of other electronic components is omitted. .

集積回路装置９は、図３に模式的に示すように多数のバンプとしてのはんだボール１２によりボールグリッドアレイを構成することで配線基板５に電気的に接合されている。集積回路装置９は、インターポーザ１３、はんだボール１４、集積回路１５、ヒートスプレッダ１６から構成されている。 As schematically shown in FIG. 3, the integrated circuit device 9 is electrically connected to the wiring board 5 by forming a ball grid array with a large number of solder balls 12 as bumps. The integrated circuit device 9 includes an interposer 13, solder balls 14, an integrated circuit 15, and a heat spreader 16.

インターポーザ１３上にはんだボール１４を介して集積回路１５が実装されている。インターポーザ１３は内層配線１７が形成されており、その内層配線１７を介して集積回路１５の所定の端子と配線基板５の所定の端子とを電気的に接続する接続回路として機能する。集積回路１５は放熱グリースや放熱ゲルなどの放熱材１８を介してヒートスプレッダ１６に熱伝導状態で接続されている。集積回路１５は図示しない接着材によりインターポーザ１３に固着されている。 An integrated circuit 15 is mounted on the interposer 13 via solder balls 14. The interposer 13 has an inner layer wiring 17 formed thereon, and functions as a connection circuit that electrically connects a predetermined terminal of the integrated circuit 15 and a predetermined terminal of the wiring board 5 via the inner layer wire 17. The integrated circuit 15 is connected to a heat spreader 16 in a thermally conductive manner via a heat dissipating material 18 such as heat dissipating grease or heat dissipating gel. The integrated circuit 15 is fixed to the interposer 13 with an adhesive (not shown).

上述したように配線基板５は筐体内の閉鎖空間４に収納されていることから、配線基板５に実装された電子部品、特に集積回路装置９が高温となることから、集積回路装置９の熱を次のようにして外部に放熱するように構成されている。 As described above, since the wiring board 5 is housed in the closed space 4 within the housing, the electronic components mounted on the wiring board 5, especially the integrated circuit device 9, reach a high temperature. It is configured to radiate heat to the outside in the following manner.

図１に示すように、ケース２において集積回路装置９に対向する部位には膨出状の放熱部１９が一体形成されている。この放熱部１９はケース２を金型成型する際に同時に形成されており、その放熱部１９が集積回路装置９と近接して対向している。集積回路装置９と放熱部１９との間には放熱材２０が充填されており、集積回路装置９は放熱部１９と放熱部１９を介して熱伝導状態に設けられている。これにより、集積回路装置９の熱は放熱材２０を介してケース２に熱拡散されることで外部に放熱される。 As shown in FIG. 1, a bulging heat dissipating portion 19 is integrally formed in a portion of the case 2 that faces the integrated circuit device 9. As shown in FIG. This heat dissipation section 19 is formed at the same time as the case 2 is molded with a metal mold, and the heat dissipation section 19 faces the integrated circuit device 9 in close proximity. A heat radiating material 20 is filled between the integrated circuit device 9 and the heat radiating section 19, and the integrated circuit device 9 is provided in a heat conductive state via the heat radiating section 19 and the heat radiating section 19. Thereby, the heat of the integrated circuit device 9 is diffused into the case 2 via the heat radiating material 20, and is radiated to the outside.

図４に模式的に示すように集積回路装置９の表面には集積回路１５に対応する領域を含んで放熱材２０を塗布する塗布領域Ａが図中に網目で示すように設定されている。この塗布領域Ａは、集積回路装置９の表面においてクリスタル１０の方向となる端縁部から所定領域を除いて設定されている。 As schematically shown in FIG. 4, a coating area A is set on the surface of the integrated circuit device 9, including an area corresponding to the integrated circuit 15, and in which the heat dissipating material 20 is applied, as shown by the mesh in the figure. This application area A is set on the surface of the integrated circuit device 9 excluding a predetermined area from the edge portion facing the crystal 10.

一方、図５に示すようにケース２の放熱部１９には、塗布領域Ａにおいてクリスタル１０の方向となる端縁部に沿って溝部２１（阻止部に相当）が形成されている。この溝部２１は、集積回路装置９と放熱部１９との隙間寸法よりも十分に大きな寸法に設定されている。 On the other hand, as shown in FIG. 5, a groove part 21 (corresponding to a blocking part) is formed in the heat dissipation part 19 of the case 2 along the edge part in the direction of the crystal 10 in the coating area A. This groove portion 21 is set to have a size sufficiently larger than the gap size between the integrated circuit device 9 and the heat radiation portion 19 .

集積回路装置９の発熱領域とケース２の放熱部１９との間に放熱材２０を充填する方法について説明する。
まず、図４に示すように集積回路装置９の表面に設定された塗布領域Ａに放熱材２０を塗布する。この塗布領域Ａは、上述したように集積回路装置９の表面においてクリスタル１０の方向となる端縁部を除外して設定されている。 A method of filling the heat dissipating material 20 between the heat generating region of the integrated circuit device 9 and the heat dissipating section 19 of the case 2 will be described.
First, as shown in FIG. 4, the heat dissipating material 20 is applied to the application area A set on the surface of the integrated circuit device 9. As described above, this coating area A is set on the surface of the integrated circuit device 9 excluding the edge portion facing the crystal 10.

次に、配線基板５をケース２にネジ止めする。このとき、集積回路装置９とケース２の放熱部１９との間は例えば１ｍｍとなるように設定されており、放熱材２０は集積回路装置９と放熱部１９との間で押し潰されることで集積回路装置９と放熱部１９との間に充填される。 Next, the wiring board 5 is screwed to the case 2. At this time, the distance between the integrated circuit device 9 and the heat dissipation section 19 of the case 2 is set to be, for example, 1 mm, and the heat dissipation material 20 is crushed between the integrated circuit device 9 and the heat dissipation section 19. It is filled between the integrated circuit device 9 and the heat radiation section 19.

さて、放熱材２０は流動性を有していることから、集積回路装置９と放熱部１９との間で押し潰された放熱材２０が集積回路装置９からはみ出して集積回路装置９に隣接して配置されたクリスタル１０に付着することが想定される。放熱材２０がクリスタル１０に付着した場合は、放熱材２０との容量結合によりクリスタル１０の発振余裕度の低下が懸念される。 Now, since the heat dissipating material 20 has fluidity, the heat dissipating material 20 crushed between the integrated circuit device 9 and the heat dissipating section 19 protrudes from the integrated circuit device 9 and is adjacent to the integrated circuit device 9. It is assumed that the particles adhere to the crystal 10 placed in the same manner. If the heat dissipation material 20 adheres to the crystal 10, there is a concern that the oscillation margin of the crystal 10 may be reduced due to capacitive coupling with the heat dissipation material 20.

ここで、ケース２の放熱部１９には放熱材２０の塗布領域Ａの端縁部に沿って対向する部位に溝部２１が形成されているので、集積回路装置９と放熱部１９との間で押し潰された放熱材２０の端縁部が溝部２１に到達するようになる。このとき、集積回路装置９と放熱部１９との隙間を拡がる際に作用する放熱材２０に対する抵抗力は比較的大きいことから、放熱材２０は抵抗力の小さい空間に進入するようになる。これにより、放熱材２０の端縁部が溝部２１に到達すると、放熱材２０の端縁部は抵抗力が集積回路装置９と放熱部１９との間よりも小さな溝部２１に進入するようになるので、集積回路装置９と放熱部１９との間で押し潰された放熱材２０が溝部２１を通過することは阻止される。 Here, since the groove portion 21 is formed in the heat dissipating portion 19 of the case 2 at a portion facing each other along the edge portion of the application area A of the heat dissipating material 20, there is a gap between the integrated circuit device 9 and the heat dissipating portion 19. The edge portion of the crushed heat dissipating material 20 reaches the groove portion 21. At this time, since the resistance force against the heat radiation material 20 that acts when widening the gap between the integrated circuit device 9 and the heat radiation section 19 is relatively large, the heat radiation material 20 enters into a space where the resistance force is small. As a result, when the edge of the heat sink 20 reaches the groove 21, the edge of the heat sink 20 enters the groove 21 where the resistance force is smaller than that between the integrated circuit device 9 and the heat sink 19. Therefore, the heat radiation material 20 crushed between the integrated circuit device 9 and the heat radiation part 19 is prevented from passing through the groove part 21.

このような実施形態によれば、次のような効果を奏することができる。
ケース２の放熱部１９において集積回路装置９に対する放熱材２０の塗布領域Ａの端縁部に沿って対向する部位に溝部２１を形成し、集積回路装置９とケース２との間で押し潰されて塗布領域Ａからはみ出した放熱材２０が溝部２１に進入するようにしたので、塗布領域Ａからはみ出した放熱材２０がクリスタル１０に付着することを防止することができる。 According to such an embodiment, the following effects can be achieved.
A groove portion 21 is formed in the heat dissipation portion 19 of the case 2 at a portion facing the integrated circuit device 9 along the edge of the application area A of the heat dissipation material 20, so that the heat dissipation material 20 is crushed between the integrated circuit device 9 and the case 2. Since the heat dissipating material 20 protruding from the coating area A is configured to enter the groove 21, the heat dissipating material 20 protruding from the coating area A can be prevented from adhering to the crystal 10.

（変形形態）
ケース２の放熱部１９に形成する溝部２１の形状は直線状に限定されることなく、図６に示すように矩形状としても良いし、図７に示すように環状としても良い。
また、溝部２１に進入する放熱材２０の量が多い場合には、放熱材２０が溝部２１から溢れ出てクリスタル１０に向かう懸念がある。
そこで、図８に示すように溝部２１の土手部においてクリスタル１０側に位置する土手に壁部２２を一体に形成し、溝部２１からクリスタル１０の方向に溢れ出る放熱材２０を壁部２２により阻止するようにしても良い。 (Deformed form)
The shape of the groove part 21 formed in the heat dissipation part 19 of the case 2 is not limited to a linear shape, but may be a rectangular shape as shown in FIG. 6, or an annular shape as shown in FIG.
Furthermore, if a large amount of the heat dissipating material 20 enters the groove 21, there is a concern that the heat dissipating material 20 will overflow from the groove 21 and head toward the crystal 10.
Therefore, as shown in FIG. 8, a wall 22 is integrally formed on the bank of the groove 21 located on the crystal 10 side, and the wall 22 prevents the heat dissipating material 20 from overflowing from the groove 21 toward the crystal 10. You may also do this.

（第２実施形態）
第２実施形態について図９を参照して説明する。この第２実施形態は、集積回路装置９の表面に溝部２１を設けたことを特徴とする。
図９に示すように集積回路装置９において塗布領域Ａの端縁部に沿って溝部２１が形成されている。集積回路装置９とケース２との間で押し潰された放熱材２０が塗布領域Ａからはみ出して溝部２１に到達すると、放熱材２０の端縁部は抵抗力の小さな溝部２１に進入するようになる。 (Second embodiment)
A second embodiment will be described with reference to FIG. 9. This second embodiment is characterized in that a groove portion 21 is provided on the surface of the integrated circuit device 9.
As shown in FIG. 9, a groove 21 is formed along the edge of the coating area A in the integrated circuit device 9. When the heat dissipating material 20 crushed between the integrated circuit device 9 and the case 2 protrudes from the application area A and reaches the groove 21, the edge of the heat dissipating material 20 enters the groove 21 with a small resistance force. Become.

このような実施形態によれば、集積回路装置９において放熱材２０の塗布領域Ａの端縁部に沿って溝部２１を形成し、集積回路装置９とケース２との間で押し潰された放熱材２０が溝部２１に進入するようにしたので、塗布領域Ａからはみ出した放熱材２０がクリスタル１０に付着することを防止することができる。 According to such an embodiment, the groove portion 21 is formed along the edge of the application area A of the heat dissipation material 20 in the integrated circuit device 9, and the heat dissipation crushed between the integrated circuit device 9 and the case 2 is removed. Since the material 20 enters the groove 21, the heat dissipating material 20 protruding from the application area A can be prevented from adhering to the crystal 10.

（変形形態）
図１０に示すように溝部２１においてクリスタル１０の方向となる土手部に壁部２２を一体に形成し、溝部２１から溢れ出ようとする放熱材２０を壁部２２により阻止するようにしても良い。 (Deformed form)
As shown in FIG. 10, a wall 22 may be integrally formed on the bank in the direction of the crystal 10 in the groove 21, and the wall 22 may prevent the heat dissipating material 20 from overflowing from the groove 21. .

（第３実施形態）
第３実施形態について図１１を参照して説明する。この第３実施形態は、集積回路装置９の表面に壁部を設けたことを特徴とする。
図１１に示すように集積回路装置９の表面には、クリスタル１０の方向に位置する塗布領域Ａの端縁部に沿って壁部２２が一体に設けられている。集積回路装置９の塗布領域Ａに塗布された放熱材２０が押し潰されてクリスタル１０に向かおうとすると、放熱材２０は壁部２２で阻止されるようになる。 (Third embodiment)
A third embodiment will be described with reference to FIG. 11. This third embodiment is characterized in that a wall portion is provided on the surface of the integrated circuit device 9.
As shown in FIG. 11, a wall portion 22 is integrally provided on the surface of the integrated circuit device 9 along the edge of the coating area A located in the direction of the crystal 10. As shown in FIG. When the heat dissipating material 20 applied to the application area A of the integrated circuit device 9 is crushed and tries to move toward the crystal 10, the heat dissipating material 20 is blocked by the wall portion 22.

このような実施形態によれば、集積回路装置９において放熱材２０の塗布領域Ａの端縁部に沿って壁部２２を形成し、集積回路装置９とケース２との間で押し潰された放熱材２０が移動することを阻止するようにしたので、塗布領域Ａからはみ出した放熱材２０がクリスタル１０に付着することを防止することができる。 According to such an embodiment, the wall portion 22 is formed along the edge of the application area A of the heat dissipating material 20 in the integrated circuit device 9, and the wall portion 22 is formed between the integrated circuit device 9 and the case 2. Since the heat dissipating material 20 is prevented from moving, it is possible to prevent the heat dissipating material 20 protruding from the application area A from adhering to the crystal 10.

（第４実施形態）
第４実施形態について図１２を参照して説明する。この第４実施形態は、配線基板５に壁部を設けたことを特徴とする。
図１２に示すように配線基板５において集積回路装置９とクリスタル１０との間には、放熱材２０の塗布領域Ａの端縁部に沿って壁部２２が設けられている。 (Fourth embodiment)
A fourth embodiment will be described with reference to FIG. 12. This fourth embodiment is characterized in that a wall portion is provided on the wiring board 5.
As shown in FIG. 12, a wall portion 22 is provided between the integrated circuit device 9 and the crystal 10 on the wiring board 5 along the edge of the application area A of the heat dissipating material 20. As shown in FIG.

集積回路装置９と放熱部１９との間で押し潰された放熱材２０は、集積回路装置９からはみ出して配線基板５に垂れ、さらにクリスタル１０に向かおうとするものの壁部２２で阻止されるようになる。 The heat dissipating material 20 crushed between the integrated circuit device 9 and the heat dissipating section 19 protrudes from the integrated circuit device 9, hangs down onto the wiring board 5, and attempts to move toward the crystal 10, but is blocked by the wall section 22. It becomes like this.

このような実施形態によれば、配線基板５において放熱材２０の塗布領域Ａの端縁部に沿って壁部２２を形成し、集積回路装置９とケース２との間で押し潰されて配線基板５に垂れた放熱材２０が移動することを阻止するので、塗布領域Ａからはみ出した放熱材２０がクリスタル１０に付着することを防止することができる。 According to this embodiment, the wall portion 22 is formed along the edge of the application area A of the heat dissipating material 20 on the wiring board 5, and is crushed between the integrated circuit device 9 and the case 2 to prevent wiring. Since the heat dissipating material 20 hanging on the substrate 5 is prevented from moving, the heat dissipating material 20 protruding from the application area A can be prevented from adhering to the crystal 10.

（第５実施形態）
第５実施形態について図１３を参照して説明する。この第５実施形態は、配線基板５におけるクリスタル１０の配置を工夫したことを特徴とする。
図１３に示すようにクリスタル１０は、配線基板５の裏面に配置されており集積回路装置９とは反対面に位置している。 (Fifth embodiment)
A fifth embodiment will be described with reference to FIG. 13. This fifth embodiment is characterized in that the arrangement of the crystals 10 on the wiring board 5 is devised.
As shown in FIG. 13, the crystal 10 is arranged on the back surface of the wiring board 5, and is located on the opposite surface from the integrated circuit device 9.

集積回路装置９と放熱部１９との間で押し潰された放熱材２０が集積回路装置９からはみ出して配線基板５に垂れるにしても、クリスタル１０は集積回路装置９と反対面に搭載されているので、放熱材２０がクリスタル１０に向かうことは配線基板５により阻止される。この場合、配線基板５が阻止部として機能することになる。 Even if the heat dissipation material 20 crushed between the integrated circuit device 9 and the heat dissipation section 19 protrudes from the integrated circuit device 9 and hangs onto the wiring board 5, the crystal 10 is mounted on the opposite side to the integrated circuit device 9. Therefore, the wiring board 5 prevents the heat dissipating material 20 from moving toward the crystal 10. In this case, the wiring board 5 will function as a blocking section.

このような実施形態によれば、配線基板５において集積回路装置９の搭載面と反対面にクリスタル１０を実装し、集積回路装置９と放熱部１９との間で押し潰された放熱材２０がクリスタル１０に向かうことを配線基板５により阻止するようにしたので、塗布領域Ａからはみ出した放熱材２０がクリスタル１０に付着することを防止することができる。 According to such an embodiment, the crystal 10 is mounted on the opposite surface of the wiring board 5 to the surface on which the integrated circuit device 9 is mounted, and the heat dissipating material 20 crushed between the integrated circuit device 9 and the heat dissipating section 19 is Since the wiring board 5 prevents the heat dissipating material 20 from moving toward the crystal 10, it is possible to prevent the heat dissipating material 20 protruding from the application area A from adhering to the crystal 10.

（その他の実施形態）
発熱電子部品は集積回路装置に限定されることはなく、ディスクリート部品やユニット部品であっても良い。
特定電子部品はクリスタルに限定されることなく、放熱材２０の付着により特性が変動する電子部品であれば適用可能である。 (Other embodiments)
The heat generating electronic component is not limited to an integrated circuit device, and may be a discrete component or a unit component.
The specific electronic component is not limited to crystal, and any electronic component whose characteristics change due to the attachment of the heat dissipating material 20 can be applied.

ケース２は金型成型品に限定されることなく、板金で製造するようにしても良い。この場合、放熱部１９を別部材としてケース２に固定するようにしても良いが、放熱部１９を省略するようにしても良い。
集積回路装置はＢＧＡに限定されることなく、ＳＩＰ（Single Inline Package）、ＤＩＰ（Dual Inline Package）、ＱＦＰ（Quad Flat Package）、ＰＧＡ（Pin Grid Array）、ＳＯＰ（Small Outline Package）、ＬＧＡ（Land Grid Array）であっても良い。 The case 2 is not limited to a molded product, and may be manufactured from a sheet metal. In this case, the heat radiating part 19 may be fixed to the case 2 as a separate member, but the heat radiating part 19 may be omitted.
Integrated circuit devices are not limited to BGA, but include SIP (Single Inline Package), DIP (Dual Inline Package), QFP (Quad Flat Package), PGA (Pin Grid Array), SOP (Small Outline Package), and LGA (Land). Grid Array).

本開示は、実施形態に準拠して記述されたが、本開示は当該実施形態や構造に限定されるものではないと理解される。本開示は、様々な変形例や均等範囲内の変形をも包含する。加えて、様々な組み合わせや形態、さらには、それらに一要素のみ、それ以上、あるいはそれ以下、を含む他の組み合わせや形態をも、本開示の範疇や思想範囲に入るものである。 Although the present disclosure has been described in accordance with embodiments, it is understood that the present disclosure is not limited to such embodiments or structures. The present disclosure also includes various modifications and equivalent modifications. In addition, various combinations and configurations, as well as other combinations and configurations that include only one, more, or fewer elements, are within the scope and scope of the present disclosure.

図面中、１はＥＣＵ（電子制御装置）、２はケース（筐体）、３はカバー（筐体）、５は配線基板、９は集積回路装置（発熱電子部品）、１０はクリスタル（特定電子部品）、２０は放熱材、２１は溝部、２２は壁部である。
In the drawing, 1 is an ECU (electronic control unit), 2 is a case (casing), 3 is a cover (casing), 5 is a wiring board, 9 is an integrated circuit device (heat-generating electronic component), and 10 is a crystal (specific electronic component). 20 is a heat dissipating material, 21 is a groove, and 22 is a wall.

Claims (3)

筐体（２、３）と、
前記筐体内に配置された配線基板（５）と、
前記配線基板に実装された発熱電子部品（９）と、
前記発熱電子部品の表面に設定された所定の塗布領域に塗布され、前記発熱電子部品と前記筐体との間に充填されることで前記発熱電子部品を前記筐体に熱伝導状態とする流動性を有する放熱材（２０）と、
前記配線基板において前記発熱電子部品に隣接する位置に実装され、前記放熱材が付着した場合に特性が変動する特定電子部品（１０）と、
前記塗布領域と前記特定電子部品との間に設けられ、前記発熱電子部品と前記筐体との間で押し潰された前記放熱材が前記特定電子部品に向かうことを阻止する阻止部（２１、２２）と、
を備え、前記阻止部は、前記発熱電子部品において前記塗布領域の端縁部に設けられ、前記発熱電子部品と前記筐体との間で押し潰された前記放熱材が進入する溝部（２１）であって、前記発熱電子部品の周辺における前記特定部品側の辺部に沿って延び、当該溝部の長手方向端縁が開放される位置まで延在する直線状に形成されている電子制御装置。 casing (2, 3);
a wiring board (5) disposed within the housing;
a heat-generating electronic component (9) mounted on the wiring board;
A fluid that is applied to a predetermined application area set on the surface of the heat-generating electronic component and filled between the heat-generating electronic component and the casing to bring the heat-generating electronic component into a heat conductive state to the casing. a heat dissipating material (20) having
a specific electronic component (10) that is mounted on the wiring board at a position adjacent to the heat-generating electronic component and whose characteristics change when the heat dissipation material is attached;
a blocking part (21, 22) and
The blocking portion is a groove (21) provided at an edge of the application area of the heat generating electronic component, into which the heat dissipating material crushed between the heat generating electronic component and the casing enters. The electronic control device is formed in a straight line that extends along a side of the specific component in the periphery of the heat-generating electronic component and extends to a position where a longitudinal edge of the groove is opened. 前記阻止部は、前記溝部から溢れ出た前記放熱材が前記特定電子部品に向かうことを阻止する壁部（２２）を更に備えている請求項１に記載の電子制御装置。 The electronic control device according to claim 1 , wherein the blocking portion further includes a wall portion (22) that prevents the heat dissipation material overflowing from the groove portion from heading toward the specific electronic component. 前記阻止部は、前記配線基板に設けられ、前記発熱電子部品と前記筐体との間で押し潰された前記放熱材が前記配線基板に垂れて前記特定電子部品に向かうことを阻止する壁部（２２）を更に備えている請求項１に記載の電子制御装置。 The blocking portion is a wall portion that is provided on the wiring board and prevents the heat dissipating material crushed between the heat generating electronic component and the casing from dripping onto the wiring board and heading toward the specific electronic component. The electronic control device according to claim 1, further comprising (22).
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049501A (en) 2004-08-03 2006-02-16 Denso Corp Heat dissipation structure of electronic apparatus
JP2006269639A (en) 2005-03-23 2006-10-05 Denso Corp Heat radiating device and on-vehicle electronic equipment
WO2007096975A1 (en) 2006-02-24 2007-08-30 Fujitsu Limited Semiconductor device
JP2009049333A (en) 2007-08-23 2009-03-05 Sumitomo Electric Ind Ltd Heat dissipater, and optical transceiver with the same
JP2011023459A (en) 2009-07-14 2011-02-03 Denso Corp Electronic control unit
JP2011086666A (en) 2009-10-13 2011-04-28 Denso Corp Cooling device and onboard electronic device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049501A (en) 2004-08-03 2006-02-16 Denso Corp Heat dissipation structure of electronic apparatus
JP2006269639A (en) 2005-03-23 2006-10-05 Denso Corp Heat radiating device and on-vehicle electronic equipment
WO2007096975A1 (en) 2006-02-24 2007-08-30 Fujitsu Limited Semiconductor device
JP2009049333A (en) 2007-08-23 2009-03-05 Sumitomo Electric Ind Ltd Heat dissipater, and optical transceiver with the same
JP2011023459A (en) 2009-07-14 2011-02-03 Denso Corp Electronic control unit
JP2011086666A (en) 2009-10-13 2011-04-28 Denso Corp Cooling device and onboard electronic device

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