JP7337503B2 - 試験装置 - Google Patents
試験装置 Download PDFInfo
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- JP7337503B2 JP7337503B2 JP2019004261A JP2019004261A JP7337503B2 JP 7337503 B2 JP7337503 B2 JP 7337503B2 JP 2019004261 A JP2019004261 A JP 2019004261A JP 2019004261 A JP2019004261 A JP 2019004261A JP 7337503 B2 JP7337503 B2 JP 7337503B2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31725—Timing aspects, e.g. clock distribution, skew, propagation delay
- G01R31/31726—Synchronization, e.g. of test, clock or strobe signals; Signals in different clock domains; Generation of Vernier signals; Comparison and adjustment of the signals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31712—Input or output aspects
- G01R31/31713—Input or output interfaces for test, e.g. test pins, buffers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31908—Tester set-up, e.g. configuring the tester to the device under test [DUT], down loading test patterns
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31723—Hardware for routing the test signal within the device under test to the circuits to be tested, e.g. multiplexer for multiple core testing, accessing internal nodes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31724—Test controller, e.g. BIST state machine
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequences
- G01R31/318314—Tools, e.g. program interfaces, test suite, test bench, simulation hardware, test compiler, test program languages
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/3193—Tester hardware, i.e. output processing circuits with comparison between actual response and known fault free response
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
- G06F11/26—Functional testing
- G06F11/273—Tester hardware, i.e. output processing circuits
- G06F11/2733—Test interface between tester and unit under test
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Computer Hardware Design (AREA)
- Quality & Reliability (AREA)
- Tests Of Electronic Circuits (AREA)
Description
本実施の形態では、DUT110が、単一のデバイス側通信回路114を備える場合を説明したが、DUT110は、プロトコルが異なる複数のデバイス側通信回路114を備えることができる。たとえばDUT110は、I2C,HDMI、WiFi,Bluetoothの4つのプロトコルの通信回路を備えてもよい。この場合、MIU220には、DUT110が備える複数のプロトコルに準拠する複数のテスター側通信回路224が実装される。
メインコントローラ210は、ATEではなく、汎用的なコンピュータやワークステーションであってもよい。
110 DUT
112 第1プロセッサ
114 デバイス側通信回路
200 試験装置
210 メインコントローラ
220 MIU
222 テスター側プロセッサ
224 テスター側通信回路
CH 伝送チャンネル
PRG テストプログラム
SCR_DUT デバイス用スクリプト
SCR_MIU テスター用スクリプト
Claims (5)
- デバイス側通信回路と、プログラム制御可能なデバイス側プロセッサと、を有する被試験デバイスの試験装置であって、
前記試験装置を統合的に制御するメインコントローラと、
プログラム制御可能なテスター側プロセッサと、前記デバイス側通信回路との間で伝送チャンネルを形成するテスター側通信回路と、を含むインタフェースユニットと、
を備え、
前記デバイス側プロセッサがデバイス用スクリプトを実行することにより、前記被試験デバイスが主導権を有する非同期の試験が行われ、
前記デバイス側通信回路と前記テスター側通信回路はI2C(Inter IC)またはSPI(Serial Peripheral Interface)に準拠し、マスター、スレーブの関係は入れ替え可能であることを特徴とする試験装置。 - 試験に先立って前記試験装置から前記被試験デバイスに、前記デバイス用スクリプトをロード可能であることを特徴とする請求項1に記載の試験装置。
- 前記デバイス用スクリプトのロードは、前記デバイス側通信回路と前記テスター側通信回路の間のインタフェースとは別の、有線のインタフェースを介して行われることを特徴とする請求項2に記載の試験装置。
- 前記インタフェースユニットは、前記伝送チャンネルを介して前記テスター側通信回路が受信したデータにもとづいて前記被試験デバイスの良否を判定し、判定結果が前記メインコントローラに提供されることを特徴とする請求項1から3のいずれかに記載の試験装置。
- 前記テスター側プロセッサは、前記デバイス用スクリプトとともに試験のシーケンスを規定するテスター用スクリプトを実行することを特徴とする請求項1から4のいずれかに記載の試験装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019004261A JP7337503B2 (ja) | 2019-01-15 | 2019-01-15 | 試験装置 |
US16/580,444 US11137446B2 (en) | 2019-01-15 | 2019-09-24 | Test apparatus and test method |
KR1020190117944A KR20200088757A (ko) | 2019-01-15 | 2019-09-25 | 시험 장치, 시험 방법, 인터페이스 유닛 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019004261A JP7337503B2 (ja) | 2019-01-15 | 2019-01-15 | 試験装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020112469A JP2020112469A (ja) | 2020-07-27 |
JP7337503B2 true JP7337503B2 (ja) | 2023-09-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019004261A Active JP7337503B2 (ja) | 2019-01-15 | 2019-01-15 | 試験装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11137446B2 (ja) |
JP (1) | JP7337503B2 (ja) |
KR (1) | KR20200088757A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023078573A1 (en) * | 2021-11-08 | 2023-05-11 | Advantest Corporation | Automated test equipment, device under test, test setup methods using a measurement request |
TWI808694B (zh) * | 2022-03-23 | 2023-07-11 | 英業達股份有限公司 | 以電路板之電路傳送指令測試連接介面之裝置、系統及方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007114373A (ja) | 2005-10-19 | 2007-05-10 | Canon Inc | クリーニング装置、プロセスカートリッジ及び画像形成装置 |
JP2007113940A (ja) | 2005-10-18 | 2007-05-10 | Denso Corp | 車両用経路探索装置 |
JP2010523945A (ja) | 2007-04-03 | 2010-07-15 | スキャニメトリクス,インコーポレイテッド | アクティブプローブ集積回路を用いた電子回路試験 |
JP2017504797A (ja) | 2014-01-03 | 2017-02-09 | ライトポイント・コーポレイションLitePoint Corporation | 標準テスト機器を使用して、様々な性能特性及び要件を有するデータパケット送受信器をテストするシステム及び方法 |
JP2017129544A (ja) | 2016-01-22 | 2017-07-27 | 東京エレクトロン株式会社 | 基板検査装置及びプログラム |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6055658A (en) * | 1995-10-02 | 2000-04-25 | International Business Machines Corporation | Apparatus and method for testing high speed components using low speed test apparatus |
KR20050041134A (ko) | 2003-10-30 | 2005-05-04 | 삼성전자주식회사 | 프로세서가 내장된 반도체 집적 회로를 셋 실장테스트하는 자동 테스트 시스템 및 그것에 관한 자동테스트 방법 |
JP2005309543A (ja) | 2004-04-16 | 2005-11-04 | Sharp Corp | テストボード、cpu内蔵半導体集積回路のテストシステム、そのテスト方法、セルフテストプログラムおよび可読記録媒体 |
US7487422B2 (en) * | 2005-04-29 | 2009-02-03 | Teradyne, Inc. | Delayed processing of site-aware objects |
US7596730B2 (en) * | 2006-03-31 | 2009-09-29 | Advantest Corporation | Test method, test system and assist board |
WO2007113940A1 (ja) * | 2006-04-04 | 2007-10-11 | Panasonic Corporation | 半導体検査装置 |
US8170828B2 (en) * | 2009-06-05 | 2012-05-01 | Apple Inc. | Test method using memory programmed with tests and protocol to communicate between device under test and tester |
KR101509423B1 (ko) | 2013-10-23 | 2015-04-07 | (주)에프씨아이 | 복수의 인터페이스 포트를 갖는 멀티 수신 칩 시스템 |
-
2019
- 2019-01-15 JP JP2019004261A patent/JP7337503B2/ja active Active
- 2019-09-24 US US16/580,444 patent/US11137446B2/en active Active
- 2019-09-25 KR KR1020190117944A patent/KR20200088757A/ko not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007113940A (ja) | 2005-10-18 | 2007-05-10 | Denso Corp | 車両用経路探索装置 |
JP2007114373A (ja) | 2005-10-19 | 2007-05-10 | Canon Inc | クリーニング装置、プロセスカートリッジ及び画像形成装置 |
JP2010523945A (ja) | 2007-04-03 | 2010-07-15 | スキャニメトリクス,インコーポレイテッド | アクティブプローブ集積回路を用いた電子回路試験 |
JP2017504797A (ja) | 2014-01-03 | 2017-02-09 | ライトポイント・コーポレイションLitePoint Corporation | 標準テスト機器を使用して、様々な性能特性及び要件を有するデータパケット送受信器をテストするシステム及び方法 |
JP2017129544A (ja) | 2016-01-22 | 2017-07-27 | 東京エレクトロン株式会社 | 基板検査装置及びプログラム |
Also Published As
Publication number | Publication date |
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US20200225286A1 (en) | 2020-07-16 |
KR20200088757A (ko) | 2020-07-23 |
JP2020112469A (ja) | 2020-07-27 |
US11137446B2 (en) | 2021-10-05 |
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