JP7277192B2 - LIQUID EJECTION HEAD AND MANUFACTURING METHOD THEREOF - Google Patents

LIQUID EJECTION HEAD AND MANUFACTURING METHOD THEREOF Download PDF

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JP7277192B2
JP7277192B2 JP2019053122A JP2019053122A JP7277192B2 JP 7277192 B2 JP7277192 B2 JP 7277192B2 JP 2019053122 A JP2019053122 A JP 2019053122A JP 2019053122 A JP2019053122 A JP 2019053122A JP 7277192 B2 JP7277192 B2 JP 7277192B2
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recording element
substrate
element substrate
sealing resin
support substrate
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JP2020152004A (en
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新平 大▲高▼
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Canon Inc
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Description

本発明は液体吐出ヘッド及びその製造方法に関する。 The present invention relates to a liquid ejection head and a manufacturing method thereof.

インクジェット記録装置などの液体吐出装置に用いられる液体吐出ヘッドには、吐出口を有する記録素子基板と電気配線基板とを有するものがある。このような構成の液体吐出ヘッドでは、記録素子基板の供給路から供給された液体を吐出口へ導く流路中にエネルギー発生素子が配置されている。このエネルギー発生素子を駆動するための電気信号を電気配線基板から記録素子基板に伝達するために、電気配線基板と記録素子基板とは、フライングリードやボンディングワイヤーを用いて接続される。電気配線基板と記録素子基板とを電気的に接続するリードやワイヤーは、吐出される液体に触れないように絶縁保護される。一般的には、リードやワイヤーの下方には低粘度の封止樹脂を塗布し、その上方には高粘度の封止樹脂を塗布して、上下両方の封止樹脂を硬化することで、リードやワイヤーを封止樹脂中に埋包して絶縁保護する。封止樹脂の例としては、熱硬化性、ＵＶ硬化性、または湿気硬化性のエポキシ樹脂やアクリル樹脂の組成物が挙げられる。リードやワイヤーの下方に低粘度の封止樹脂を塗布することで、封止樹脂が万遍なく行き渡り、空隙を生じて絶縁の信頼性を損なうことがない。 2. Description of the Related Art Some liquid ejection heads used in liquid ejection apparatuses such as ink jet recording apparatuses have a recording element substrate having ejection ports and an electric wiring substrate. In the liquid ejection head having such a configuration, the energy generating element is arranged in the flow path that guides the liquid supplied from the supply path of the recording element substrate to the ejection port. In order to transmit an electric signal for driving the energy generating element from the electric wiring board to the recording element board, the electric wiring board and the recording element board are connected using flying leads or bonding wires. Leads and wires that electrically connect the electric wiring board and the recording element board are insulated and protected so as not to come into contact with the ejected liquid. In general, low-viscosity encapsulation resin is applied below the leads and wires, high-viscosity encapsulation resin is applied above them, and both the upper and lower encapsulation resins are cured to remove the leads. and wires are embedded in the encapsulating resin for insulation protection. Examples of encapsulating resins include thermosetting, UV curable, or moisture curable epoxy and acrylic compositions. By applying a low-viscosity sealing resin under the leads and wires, the sealing resin spreads evenly and does not create voids and impair the reliability of insulation.

複数の記録素子基板が並べて配置された構成の液体吐出ヘッドでは、支持基板上に接合された複数の記録素子基板が、それぞれの一部が支持基板からせり出した状態で互いに固定される場合がある。記録素子基板が支持基板からせり出すことにより、支持基板に邪魔されずに記録素子基板同士を近接させて一直線に並べて配置して、長尺の液体吐出ヘッドを形成することができる。 In a liquid ejection head having a configuration in which a plurality of recording element substrates are arranged side by side, the plurality of recording element substrates bonded to the support substrate may be fixed to each other in a state in which a part of each protrudes from the support substrate. . Since the recording element substrate protrudes from the support substrate, the recording element substrates can be arranged close to each other in a straight line without being obstructed by the support substrate, thereby forming a long liquid ejection head.

しかし、記録素子基板の一部が支持基板からはみ出していると、このはみ出した部分の、記録素子基板の支持基板と接合される側の面（接合側の面と称する）が露出する。そして、この露出部分に存在する各種の構成材料の膨潤変形や溶出などが生じるおそれがある。このような構成材料の膨潤変形や溶出などを抑制するためには、記録素子基板の接合側の面の露出部分を何らかの部材で被覆して保護することが好ましい。被覆材料としては、電気的接続部のリードやワイヤーを絶縁保護する封止樹脂と同じ材料が好適に用いられる。しかし、記録素子基板の接合側の面の、支持基板の側面から外側にせり出して露出した部分に封止樹脂を直接塗布するためには、微細な部位へ封止樹脂を塗布可能な高精度な塗布装置が必要であり、製造コストが高くなる。そこで、支持基板の、記録素子基板が積層されている面（被積層面と称する）の上で、記録素子基板の１つの辺に沿って封止樹脂を塗布し、この封止樹脂を毛細管現象によって拡散させることが考えられる。それにより、記録素子基板の接合側の面の露出部分に封止樹脂が広く行き渡ると期待できる。この方法では、高精度な塗布装置が不要で製造コストが低く抑えられる。しかし、記録素子基板の形状によっては、毛細管現象によって封止樹脂を必要な部分に良好に行き渡らせることができない場合がある。そこで、特許文献１に記載の液体記録ヘッドでは、記録素子基板の全周にわたってデバイスホールを設け、デバイスホールの内部に封止樹脂を充填して、記録素子基板の接合面に封止樹脂を塗布して被覆している。 However, if a part of the recording element substrate protrudes from the support substrate, the protruding surface of the recording element substrate on the side to be bonded to the support substrate (referred to as the bonding side surface) is exposed. Then, there is a possibility that various constituent materials present in the exposed portion may undergo swelling deformation, elution, or the like. In order to suppress such swelling deformation and elution of the constituent material, it is preferable to protect the exposed portion of the joining side surface of the recording element substrate by covering it with some kind of member. As the coating material, the same material as the sealing resin that insulates and protects the leads and wires of the electrical connection is preferably used. However, in order to directly apply the sealing resin to the portion of the bonding side of the recording element substrate that protrudes outward from the side surface of the support substrate, a high-precision method capable of applying the sealing resin to minute portions is required. A coating device is required, which increases manufacturing costs. Therefore, a sealing resin is applied along one side of the recording element substrate on the surface of the supporting substrate on which the recording element substrate is laminated (referred to as a surface to be laminated), and the sealing resin is caused by capillary action. It is conceivable to diffuse by As a result, it can be expected that the sealing resin will spread widely over the exposed portion of the bonding side surface of the recording element substrate. This method does not require a high-precision coating device, and the manufacturing cost can be kept low. However, depending on the shape of the recording element substrate, it may not be possible to spread the sealing resin well over the necessary portions due to capillary action. Therefore, in the liquid recording head disclosed in Patent Document 1, a device hole is provided along the entire circumference of the recording element substrate, the inside of the device hole is filled with a sealing resin, and the sealing resin is applied to the bonding surface of the recording element substrate. and covered.

特開２０１１―２４０５４９号公報JP 2011-240549 A

しかし、特許文献１のように記録素子基板の全周にわたって封止樹脂で被覆すると、封止樹脂が邪魔になって、記録素子基板同士を近接して一直線に並べて配置することが困難になり、部品サイズが大きくなってしまう。 However, when the entire circumference of the recording element substrate is covered with a sealing resin as in Patent Document 1, the sealing resin becomes an obstacle, making it difficult to arrange the recording element substrates close to each other in a straight line. The part size becomes large.

そこで、本発明の目的は、記録素子基板の接合側の面の、支持基板からせり出して露出している部分を良好に被覆でき、かつ製造コストの上昇及び部品の大型化を抑えることができる液体吐出ヘッド及びその製造方法を提供することにある。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a liquid capable of satisfactorily covering the exposed portion of the joint side surface of the recording element substrate protruding from the supporting substrate and suppressing an increase in the manufacturing cost and an increase in the size of the parts. An object of the present invention is to provide an ejection head and a manufacturing method thereof.

本発明の液体吐出ヘッドは、支持基板と、一部が前記支持基板の上に積層されている記録素子基板と、前記記録素子基板の前記支持基板と接合される側の面の少なくとも一部に設けられた保護層と、少なくとも一部が前記支持基板の上に前記記録素子基板と並べて積層されている電気配線基板と、前記記録素子基板の端子と前記電気配線基板の端子とを接続するワイヤーと、前記支持基板の、前記記録素子基板が積層されている面の上で、前記記録素子基板の１つの辺に沿って設けられて前記ワイヤーと前記支持基板との間の空間を覆う第一の封止樹脂と、を有する液体吐出ヘッドであって、前記記録素子基板は、前記第一の封止樹脂が設けられている前記辺が延びる方向の両側部における前記支持基板の２つの側面のそれぞれから外側にせり出しており、前記第一の封止樹脂は、前記記録素子基板が前記支持基板の前記側面からせり出している部分では前記保護層を覆っており、前記記録素子基板の前記第一の封止樹脂が設けられている前記辺と前記支持基板の２つの前記側面が交わる部分のそれぞれにおいて、前記支持基板の、前記記録素子基板が積層されている面の側で、前記辺と前記側面のそれぞれとがなす角度が９０度よりも大きいことを特徴とする。 The liquid ejection head of the present invention includes a support substrate, a recording element substrate partly laminated on the support substrate, and at least a part of the surface of the recording element substrate bonded to the support substrate. a protective layer provided; an electric wiring board, at least a part of which is laminated on the support substrate side by side with the recording element substrate; and wires connecting terminals of the recording element substrate and terminals of the electric wiring substrate. and, on the surface of the support substrate on which the recording element substrate is laminated, a first wire is provided along one side of the recording element substrate to cover the space between the wire and the support substrate. and a sealing resin , wherein the recording element substrate is provided with two parts of the support substrate on both sides in the direction in which the side on which the first sealing resin is provided extends. The first sealing resin covers the protective layer in the portion where the recording element substrate protrudes from the side surface of the support substrate, and the recording element substrate protrudes outward from the side surface. At each of the portions where the side on which the first sealing resin is provided and the two side surfaces of the support substrate intersect , the side of the support substrate on which the recording element substrate is laminated is provided. and each of the side faces is larger than 90 degrees.

本発明の液体吐出ヘッドの製造方法は、支持基板の上に、記録素子基板の一部と電気配線基板の少なくとも一部とを並べて積層するステップと、前記記録素子基板の端子と前記電気配線基板の端子とをワイヤーで接続するステップと、前記支持基板の、前記記録素子基板および前記電気配線基板が積層されている面の上に、前記記録素子基板の１つの辺に沿って、かつ前記ワイヤーと前記支持基板との間の空間を封止するように、第一の封止樹脂を塗布するステップと、前記記録素子基板の前記支持基板と接合される側の面の少なくとも一部に保護層を設けるステップと、を有し、前記支持基板の上に前記記録素子基板の一部を積層する際に、前記記録素子基板が、前記第一の封止樹脂が設けられている前記辺が延びる方向の両側部における前記支持基板の２つの側面のそれぞれから外側にせり出すように、かつ、前記記録素子基板の前記第一の封止樹脂が設けられている前記辺と前記支持基板の２つの前記側面とが交わるそれぞれの部分において、前記支持基板の、前記記録素子基板が積層されている面の側で、前記辺と前記側面とがなす角度が９０度よりも大きくなるように、前記記録素子基板を配置し、前記第一の封止樹脂を塗布する際に、前記記録素子基板が前記支持基板の前記側面からせり出している部分では前記保護層を覆うように前記第一の封止樹脂を塗布することを特徴とする。 A method of manufacturing a liquid ejection head according to the present invention includes the steps of: laminating a portion of a recording element substrate and at least a portion of an electric wiring substrate side by side on a support substrate; a step of connecting the terminals of the support substrate with a wire, on the surface of the support substrate on which the recording element substrate and the electric wiring substrate are laminated, along one side of the recording element substrate and the wire a step of applying a first sealing resin so as to seal a space between the recording element substrate and the support substrate; and, when laminating a part of the recording element substrate on the support substrate, the recording element substrate extends at the side where the first sealing resin is provided. Two sides of the support substrate and the side on which the first sealing resin of the recording element substrate is provided protrude outward from each of the two side surfaces of the support substrate on both sides in the direction. In each portion where the side faces intersect , the angle formed by the side and the side is greater than 90 degrees on the side of the surface of the support substrate on which the recording element substrate is laminated. When the recording element substrate is arranged and the first sealing resin is applied, the first sealing is performed so as to cover the protective layer in the portion where the recording element substrate protrudes from the side surface of the supporting substrate. It is characterized by applying resin .

本発明によると、記録素子基板の接合側の面の、支持基板からせり出して露出している部分を良好に被覆でき、かつ製造コストの上昇及び部品の大型化を抑えることができる。 According to the present invention, it is possible to satisfactorily cover the portion of the joint side surface of the recording element substrate that protrudes from the supporting substrate and is exposed, and to suppress an increase in manufacturing cost and an increase in the size of parts.

本発明の一実施形態の液体吐出ヘッドを示す斜視図と平面図である。1A and 1B are a perspective view and a plan view showing a liquid ejection head according to an embodiment of the present invention; FIG. 図１（ｂ）のＡ－Ａ線断面図およびＢ－Ｂ線断面図と、第二の封止樹脂を塗布した状態のＡ－Ａ線断面図である。FIG. 1B is a sectional view taken along the line AA and a sectional view taken along the line BB, and a sectional view taken along the line AA in a state where the second sealing resin is applied. 本発明の実施例1の液体吐出ヘッドを示す斜視図と、そのＣ－Ｃ線断面図と、Ｄ－Ｄ線断面図である。1 is a perspective view showing a liquid ejection head according to Example 1 of the present invention, a cross-sectional view taken along the line CC, and a cross-sectional view taken along the line DD. 図３（ａ）のＥ部分の拡大図と、比較例の液体吐出ヘッドのＥ部分の位置の拡大図と、流体が拡散する２つの辺のなす鋭角と拡散状態とを示す説明図である。FIG. 3A is an enlarged view of part E in FIG. 3A, an enlarged view of the position of part E of a liquid ejection head of a comparative example, and an explanatory view showing an acute angle formed by two sides along which fluid diffuses and a diffusion state. 流体が拡散する２つの辺のなす鈍角と拡散状態とを示す説明図と、図３（ａ）のＥ部分における断面図である。FIG. 3A is an explanatory view showing an obtuse angle formed by two sides where a fluid diffuses and a diffusion state, and a cross-sectional view of part E in FIG. 本発明の実施例２の液体吐出ヘッドの要部を示す斜視図と平面図である。FIG. 10A is a perspective view and a plan view showing a main part of a liquid ejection head according to Example 2 of the present invention; 図６（ｂ）のＦ－Ｆ線断面図と、Ｇ－Ｇ線断面図と、Ｈ－Ｈ線断面図である。FIG. 6(b) is a cross-sectional view taken along line FF, a cross-sectional view along line GG, and a cross-sectional view along line HH.

以下、本発明の実施の形態について図面を参照して説明する。
図１（ａ）に本発明の一実施形態の液体吐出ヘッドの斜視図を示し、図１（ｂ）にその平面図を示す。この液体吐出ヘッドでは、液体を吐出する吐出口１０１ａを有する記録素子基板１０１と、図示しない電気配線を有する電気配線基板１０２とが、接着剤を用いて支持基板１０３上に接合されている。それにより、記録素子基板１０１の一部が支持基板１０３の上に積層され、支持基板１０３の、記録素子基板１０１が積層されている面（被積層面）の上に、電気配線基板１０２が、記録素子基板１０１と並べて積層されている。図示しないが、記録素子基板１０１には、吐出すべき液体（例えば液体インク）が供給される供給路と、供給路と各吐出口１０１ａとをそれぞれ連通させる流路とが設けられている。この流路には、各吐出口１０１ａに対応して、液体を吐出するエネルギーを発生するエネルギー発生素子（例えば発熱素子）がそれぞれ配置されている。また、図示しないが、記録素子基板１０１には、エネルギー発生素子に接続された電気配線が設けられている。電気配線基板１０２は、例えばＦＰＣ（フレキシブルプリント基板）やＴＡＢ（Tape Automated Bonding）であり、エネルギー発生素子の駆動用の電気信号等を、図示しない液体吐出装置本体から記録素子基板１０１に伝達するものである。一般に、電気配線基板１０２は、図示しないコンタクトピンやコネクター等によって液体吐出装置本体と電気的に接続されている。従って、記録素子基板１０１の供給路から流路内に液体が供給され、液体吐出装置本体から電気配線基板１０２を介して記録素子基板１０１の電気配線に電気信号が伝達される。それにより、記録素子基板１０１の電気配線に接続されているエネルギー発生素子が駆動されて、エネルギー（例えば熱エネルギー）を発生する。このエネルギーが付与された流路内の液体が、吐出口１０１ａから外部に吐出する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1(a) shows a perspective view of a liquid ejection head according to one embodiment of the present invention, and FIG. 1(b) shows a plan view thereof. In this liquid ejection head, a recording element substrate 101 having ejection openings 101a for ejecting liquid and an electric wiring substrate 102 having electric wiring (not shown) are bonded onto a support substrate 103 using an adhesive. As a result, a part of the recording element substrate 101 is laminated on the support substrate 103, and the electric wiring substrate 102 is formed on the surface of the support substrate 103 on which the recording element substrate 101 is laminated (surface to be laminated). It is stacked side by side with the recording element substrate 101 . Although not shown, the printing element substrate 101 is provided with a supply path for supplying a liquid to be ejected (for example, liquid ink) and a flow path for communicating the supply path with each ejection port 101a. In this channel, an energy generating element (for example, a heating element) for generating energy for ejecting liquid is arranged corresponding to each ejection port 101a. Although not shown, the recording element substrate 101 is provided with electrical wiring connected to the energy generating elements. The electric wiring board 102 is, for example, an FPC (Flexible Printed Circuit Board) or TAB (Tape Automated Bonding), and transmits electric signals for driving the energy generating elements from the main body of the liquid ejection apparatus (not shown) to the recording element substrate 101 . is. In general, the electric wiring board 102 is electrically connected to the main body of the liquid ejecting apparatus by contact pins, connectors, or the like (not shown). Accordingly, the liquid is supplied from the supply path of the recording element substrate 101 into the flow path, and an electric signal is transmitted from the liquid ejecting apparatus main body to the electric wiring of the recording element substrate 101 through the electric wiring substrate 102 . As a result, the energy generating elements connected to the electrical wiring of the recording element substrate 101 are driven to generate energy (for example, thermal energy). The liquid in the channel to which this energy has been applied is ejected to the outside from the ejection port 101a.

このような構成の液体吐出ヘッドでは、記録素子基板１０１と電気配線基板１０２とが互いに電気的に接続されている。電気的な接続方法としては、ボンディングワイヤーやフライングリード等を用いる方法が広く知られている。図１に示す例では、記録素子基板１０１の端子１０７と電気配線基板１０２の端子１０９とが、ワイヤー１０４によって接続されている。支持基板１０３には記録素子基板１０１の供給路に通じる液体供給路があり、液体記録装置本体から記録素子基板１０１への液体の供給を可能にしている。 In such a liquid ejection head, the recording element substrate 101 and the electric wiring substrate 102 are electrically connected to each other. As an electrical connection method, a method using bonding wires, flying leads, or the like is widely known. In the example shown in FIG. 1, terminals 107 of the recording element substrate 101 and terminals 109 of the electric wiring substrate 102 are connected by wires 104 . The support substrate 103 has a liquid supply path that communicates with the supply path of the recording element substrate 101 , and allows liquid to be supplied from the liquid recording apparatus main body to the recording element substrate 101 .

前述したように記録素子基板１０１の端子１０７と電気配線基板１０２の端子１０９とを接続するワイヤー１０４は、封止樹脂によって絶縁保護される。具体的には、支持基板１０３とワイヤー１０４との間の空間に第一の封止樹脂１０５が塗布されて固化しており、ワイヤー１０４の下部を絶縁保護している。第一の封止樹脂１０５は硬化可能な流体状の樹脂を塗布することによって形成され、ワイヤー１０４の下方を十分に被覆している。第一の封止樹脂１０５としては、エポキシ樹脂、アクリル樹脂、エポキシアクリレート樹脂、イミド樹脂、アミド樹脂等が挙げられる。第１の封止樹脂１０５の硬化方法としては、硬化剤を混合する２液混合硬化、加熱による熱硬化、紫外線照射によるＵＶ硬化等が挙げられる。特に好ましくは、熱硬化型のエポキシ樹脂が第一の封止樹脂１０５として用いられる。 As described above, the wires 104 connecting the terminals 107 of the recording element substrate 101 and the terminals 109 of the electric wiring substrate 102 are insulated and protected by the sealing resin. Specifically, a first sealing resin 105 is applied to the space between the support substrate 103 and the wire 104 and solidified to insulate and protect the lower portion of the wire 104 . The first sealing resin 105 is formed by applying a curable fluid resin, and fully covers the lower portion of the wire 104 . Examples of the first sealing resin 105 include epoxy resin, acrylic resin, epoxy acrylate resin, imide resin, and amide resin. As a method for curing the first sealing resin 105, there are two-liquid mixed curing by mixing a curing agent, thermal curing by heating, UV curing by ultraviolet irradiation, and the like. A thermosetting epoxy resin is particularly preferably used as the first sealing resin 105 .

一例では、第一の封止樹脂１０５はワイヤー１０４の上方から塗布される。図１に示すワイヤー１０４は、外径が３０μｍであり１００μｍのピッチで並べて配置されており、ワイヤー１０４の外表面同士の間には７０μｍの隙間がある。ワイヤー１０４の上方から第一の封止樹脂１０５を塗布すると、ワイヤー１０４同士の間の７０μｍの隙間から第一の封止樹脂１０５がワイヤー１０４の下方へ降下する。それにより、図１（ｂ）のＡ－Ａ線の位置における断面図である図２（ａ）に示すように、ワイヤー１０４と支持基板１０３との間の空間が第一の封止樹脂１０５で満たされる。このようにワイヤー１０４の上方から第一の封止樹脂１０５を塗布して、ワイヤー１０４の下方の空間を封止樹脂で満たすためには、第一の封止樹脂１０５がワイヤー１０４同士の間の隙間を通過できる程度の低粘度である必要がある。仮に第一の封止樹脂１０５の粘度が高過ぎると、ワイヤー１０４の上方に第一の封止樹脂１０５が留まってしまい、ワイヤー１０４の下方まで第一の封止樹脂１０５が到達しない。そのため、第一の封止樹脂１０５の粘度は０．１～１００Ｐａ・ｓであり、より好ましくは１～８０Ｐａ・ｓである。 In one example, the first sealing resin 105 is applied from above the wires 104 . The wires 104 shown in FIG. 1 have an outer diameter of 30 μm, are arranged side by side at a pitch of 100 μm, and have a gap of 70 μm between the outer surfaces of the wires 104 . When the first sealing resin 105 is applied from above the wires 104 , the first sealing resin 105 falls below the wires 104 through the gap of 70 μm between the wires 104 . As a result, as shown in FIG. 2A, which is a cross-sectional view taken along line AA in FIG. It is filled. In order to apply the first sealing resin 105 from above the wires 104 and fill the spaces below the wires 104 with the sealing resin, the first sealing resin 105 must be applied between the wires 104 . The viscosity must be low enough to pass through gaps. If the viscosity of the first sealing resin 105 is too high, the first sealing resin 105 stays above the wire 104 and does not reach below the wire 104 . Therefore, the viscosity of the first sealing resin 105 is 0.1 to 100 Pa·s, more preferably 1 to 80 Pa·s.

このようにワイヤー１０４の下方に塗布された第一の封止樹脂１０５は低粘度であるため、ワイヤー１０４の直下から周囲に濡れ広がって拡散する。図１（ｂ）のＢ－Ｂ線の位置における断面図である図２（ｂ）に示すように、第一の封止樹脂１０５は、毛細管現象によって、記録素子基板１０１と支持基板１０３との接合部（接合辺）１０６に沿って拡散する。具体的には、支持基板１０３の、記録素子基板１０１が積層されている面（被積層面）の上で、記録素子基板１０１の１つの辺１０６に沿って、第一の封止樹脂１０５が設けられる。この第一の封止樹脂１０５の毛細管現象による拡散は、辺１０６に沿って生じる。図１に示すように電気配線基板１０２と支持基板１０３との接合部も存在するが、本実施形態の電気配線基板１０２は表面がアミド樹脂やイミド樹脂で被覆されたＴＡＢやＦＰＣである。このアミド樹脂やイミド樹脂に対して、第一の封止樹脂１０５は濡れ性が悪いので、電気配線基板１０２の辺（接合部）に沿って拡散することはない。 Since the first sealing resin 105 applied below the wires 104 in this way has a low viscosity, it spreads and spreads from directly below the wires 104 to the surroundings. As shown in FIG. 2B, which is a cross-sectional view taken along line BB in FIG. It diffuses along the joint (joint side) 106 . Specifically, the first sealing resin 105 is applied along one side 106 of the recording element substrate 101 on the surface of the support substrate 103 on which the recording element substrate 101 is laminated (surface to be laminated). be provided. Diffusion of the first sealing resin 105 due to capillary action occurs along the side 106 . As shown in FIG. 1, there is a junction between the electric wiring board 102 and the support substrate 103, but the electric wiring board 102 of this embodiment is TAB or FPC whose surface is coated with amide resin or imide resin. Since the first sealing resin 105 has poor wettability with respect to this amide resin or imide resin, it does not diffuse along the sides (joint portions) of the electric wiring board 102 .

ワイヤー１０４の下方に第一の封止樹脂１０５を塗布した後に、その上方に、図２（ｃ）に示すように第二の封止樹脂１０８を塗布する。第二の封止樹脂１０８は、第一の封止樹脂１０５とワイヤー１０４を覆って絶縁保護するものであり、第一の封止樹脂１０５と同様に流体状のエポキシ樹脂、アクリル樹脂、エポキシアクリレート樹脂、イミド樹脂、アミド樹脂等が使用できる。第二の封止樹脂１０８は、ワイヤー１０４の上方に留まるように、１００～８００Ｐａ・ｓ程度、より好ましくは１００～４００Ｐａ・ｓの粘度を有している。ワイヤー１０４の下方に第一の封止樹脂１０５を塗布し、ワイヤー１０４の上方に第二の封止樹脂１０８を塗布した後に、第一の封止樹脂１０５と第二の封止樹脂１０８とを硬化させ、ワイヤー１０４を絶縁保護する。 After applying the first sealing resin 105 below the wire 104, the second sealing resin 108 is applied above it as shown in FIG. 2(c). The second sealing resin 108 covers the first sealing resin 105 and the wire 104 to insulate and protect them. Resins, imide resins, amide resins, etc. can be used. The second sealing resin 108 has a viscosity of about 100 to 800 Pa·s, more preferably 100 to 400 Pa·s so that it stays above the wire 104 . After applying the first sealing resin 105 below the wire 104 and applying the second sealing resin 108 above the wire 104, the first sealing resin 105 and the second sealing resin 108 are applied. Allow to cure and insulate wire 104 .

［実施例１］
以上説明した構成を有する液体吐出ヘッドの実施例１について、図３を参照して説明する。まず、斜視図である図３（ａ）と図３（ａ）のＣ－Ｃ線断面図である図３（ｂ）とに示すように、記録素子基板１０１と電気配線基板１０２とを支持基板１０３上に配置し、接着剤を用いて支持基板１０３に固定する。そして、ワイヤー１０４の一端を記録素子基板１０１の端子１０７に、他端を電気配線基板１０２の端子１０９にそれぞれ接続する。こうして、記録素子基板１０１と電気配線基板１０２とを、支持基板１０３を介して機械的に接続するとともに、ワイヤー１０４を介して電気的に接続する。本実施例のワイヤー１０４は直径が２５μｍの金製のワイヤーであり、ワイヤー１０４同士の間のピッチは１００μｍである。図３（ｂ）に示すように、ワイヤー１０４は、記録素子基板１０１の端子１０７と電気配線基板１０２の端子１０９とにのみ接触しており、それ以外の部分には接していない。ワイヤー１０４が端子１０７、端子１０９以外の部分（特に記録素子基板１０１の端縁部等）に触れていないため、漏電やショートやワイヤー１０４の損傷が抑えられる。 [Example 1]
Embodiment 1 of the liquid ejection head having the configuration described above will be described with reference to FIG. First, as shown in FIG. 3A, which is a perspective view, and FIG. 3B, which is a cross-sectional view taken along the line CC of FIG. 103 and fixed to the support substrate 103 using an adhesive. One end of the wire 104 is connected to the terminal 107 of the recording element substrate 101 and the other end is connected to the terminal 109 of the electric wiring substrate 102 . Thus, the recording element substrate 101 and the electric wiring substrate 102 are mechanically connected through the support substrate 103 and electrically connected through the wires 104 . The wires 104 in this embodiment are gold wires with a diameter of 25 μm, and the pitch between the wires 104 is 100 μm. As shown in FIG. 3B, the wires 104 are in contact only with the terminals 107 of the recording element substrate 101 and the terminals 109 of the electric wiring substrate 102, and are not in contact with other portions. Since the wires 104 do not touch portions other than the terminals 107 and 109 (particularly, the edges of the printing element substrate 101, etc.), electrical leakage, short circuits, and damage to the wires 104 can be suppressed.

液体吐出ヘッドから吐出される液体がワイヤー１０４に接触して電気的なショートを引き起こすことを防ぐために、ワイヤー１０４を絶縁保護する。具体的には、第一の封止樹脂１０５をワイヤー１０４の上方から塗布して、ワイヤー１０４同士の間の隙間を通過させ、図２（ａ）に示すように、ワイヤー１０４の下方を第１の封止樹脂で満たす。本実施例の第一の封止樹脂１０５は、粘度４０Ｐａ・sの熱硬化性のアミン硬化系のエポキシ樹脂組成物である。この第一の封止樹脂１０５は粘度が低いため、支持基板１０３の上を伝ってワイヤー１０４の直下以外の部分にも濡れ広がって拡散する。特に、図１と図２（ｂ）とに示すように、第一の封止樹脂１０５は、毛細管現象によって記録素子基板１０１と支持基板１０３との接合部（１つの辺１０６）に沿って拡散する。この拡散は記録素子基板１０１と支持基板１０３との接合部の辺１０６が延びる限り続き、特に第一の封止樹脂１０５が加熱されて低粘度化すると拡散はより拡大する。 In order to prevent the liquid ejected from the liquid ejection head from contacting the wire 104 and causing an electrical short, the wire 104 is insulated and protected. Specifically, the first sealing resin 105 is applied from above the wires 104, passed through the gaps between the wires 104, and as shown in FIG. of sealing resin. The first sealing resin 105 of this embodiment is a thermosetting amine-cured epoxy resin composition having a viscosity of 40 Pa·s. Since the first sealing resin 105 has a low viscosity, it spreads and spreads along the support substrate 103 to areas other than directly under the wires 104 . In particular, as shown in FIGS. 1 and 2B, the first sealing resin 105 diffuses along the joint (one side 106) between the recording element substrate 101 and the support substrate 103 by capillary action. do. This diffusion continues as long as the side 106 of the joint between the recording element substrate 101 and the support substrate 103 extends, and in particular, when the first sealing resin 105 is heated to have a low viscosity, the diffusion further expands.

本実施例の記録素子基板１０１は、図３（ａ）とそのＤ－Ｄ線断面図である図３（ｃ）に示すように、支持基板１０３の側面１０３ａのそれぞれから外側にせり出した状態で固定されている。図３（ｃ）に示すように、本実施例の記録素子基板１０１の支持基板１０３と接合される側の面（裏面または接合側の面と称する）に、図示しない流路を保護するための樹脂膜１１１が形成されている。記録素子基板１０１の、支持基板１０３の側面１０３ａのそれぞれから外側にせり出した部分においては、樹脂膜１１１が露出している。仮に、樹脂膜１１１が外力などの影響で剥離や変形すると、流路からの液体の漏れ等を生じるおそれがあるため、樹脂膜１１１が損傷しないように封止樹脂で被覆することが好ましい。本実施例では、前述したように毛細管現象によって記録素子基板１０１と支持基板１０３との接合部（辺１０６）に沿って第一の封止樹脂１０５が拡散している。記録素子基板１０１と支持基板１０３との接合部の辺１０６が延びる限り拡散する第一の封止樹脂１０５は、支持基板１０３の側面１０３ａと交わる位置、すなわち図３（ａ）のＥ部分に到達する。さらに、第一の封止樹脂１０５の拡散は、Ｅ部分を通過して、記録素子基板１０１が支持基板１０３の側面１０３ａから外部にせり出した部分にまで至る。その際に、記録素子基板１０１と支持基板１０３との接合部の辺１０６に沿って拡散してきた経路の延長線上に拡散し続けるのみならず、記録素子基板１０１の接合側の面に拡散する。すなわち、記録素子基板１０１の、支持基板１０３の側面１０３ａから外側にせり出している部分の接合側の面に第一の封止樹脂１０５を行きわたらせて、第一の封止樹脂１０５によって樹脂膜１１１を覆う。図３（ａ）のＥ部分と反対側の側面１０３ａからせり出した部分においても同様に第一の封止樹脂１０５が拡散する。 As shown in FIG. 3(a) and FIG. 3(c), which is a cross-sectional view taken along line DD, the recording element substrate 101 of this embodiment protrudes outward from each of the side surfaces 103a of the supporting substrate 103. Fixed. As shown in FIG. 3C, on the surface of the recording element substrate 101 of the present embodiment that is bonded to the support substrate 103 (referred to as the back surface or the surface on the bonding side), a film for protecting the flow path (not shown) is formed. A resin film 111 is formed. The resin film 111 is exposed at portions of the recording element substrate 101 that protrude outward from the side surfaces 103a of the support substrate 103 . If the resin film 111 were to be peeled off or deformed under the influence of an external force or the like, liquid would leak from the flow path. In this embodiment, the first sealing resin 105 is diffused along the joint (side 106) between the recording element substrate 101 and the support substrate 103 by capillary action as described above. The first sealing resin 105, which diffuses as far as the edge 106 of the joining portion between the recording element substrate 101 and the support substrate 103 extends, reaches the position where it intersects the side surface 103a of the support substrate 103, that is, the portion E in FIG. 3A. do. Furthermore, the diffusion of the first sealing resin 105 passes through the E portion and reaches the portion where the printing element substrate 101 protrudes from the side surface 103a of the support substrate 103 to the outside. At that time, the ink not only continues to diffuse along the extension of the diffusion path along the side 106 of the joint between the recording element substrate 101 and the support substrate 103, but also diffuses to the surface of the recording element substrate 101 on the joint side. That is, the first sealing resin 105 is spread over the joint side surface of the portion of the recording element substrate 101 that protrudes outward from the side surface 103 a of the support substrate 103 , and the resin film 111 is formed by the first sealing resin 105 . cover the Similarly, the first sealing resin 105 is diffused in the portion protruding from the side surface 103a on the opposite side to the portion E in FIG. 3(a).

本実施例では、図４（ａ）に示すように、Ｅ部分において支持基板１０３の側面１０３ａが部分的に曲面１０３ｂになっていると特に効果的である。このＥ部分とは、第一の封止樹脂１０５が毛細管現象にて拡散する経路である記録素子基板１０１と支持基板１０３との接合部の辺１０６と、支持基板１０３の側面１０３ａとが交わる位置のことである。第一の封止樹脂１０５が毛細管現象によって拡散する経路中には、９０°未満の鋭角部が存在しない構成になっている。その結果、毛細管現象によってＥ部分まで拡散してきた第一の封止樹脂１０５は、良好に濡れ広がって拡散する。それにより、流路を保護する樹脂膜１１１が第一の封止樹脂１０５で覆われて保護されるため、流路からの液体の漏れ等の問題が回避できる可能性が高い。このようにＥ部分が曲面１０３ｂになっている支持基板１０３は、切削機械を用いた加工で容易に形成でき、また、この支持基板１０３の形状に対応した金型を用いて大量生産することもできる。 In this embodiment, as shown in FIG. 4A, it is particularly effective if the side surface 103a of the support substrate 103 is partially curved 103b at the E portion. This portion E is a position where a side 106 of the joining portion between the recording element substrate 101 and the support substrate 103, which is a path through which the first sealing resin 105 diffuses by capillary action, and the side surface 103a of the support substrate 103 intersect. It's about. A path through which the first sealing resin 105 diffuses by capillarity does not have an acute angle of less than 90°. As a result, the first sealing resin 105 that has diffused to the E portion due to capillary action spreads and spreads well. As a result, the resin film 111 that protects the flow path is covered and protected by the first sealing resin 105, so that problems such as liquid leakage from the flow path can be avoided with a high possibility. The support substrate 103 having the curved surface 103b at the portion E can be easily formed by processing using a cutting machine, and can be mass-produced using a mold corresponding to the shape of the support substrate 103. can.

この原理について説明すると、毛細管現象は、流体が濡れ広がってきた経路から、それに屈曲する方向にも濡れ広がる場合、その屈曲角度が９０°未満の鋭角であるか、９０°を超える鈍角であるかによって、濡れ広がり方に差が生じる。図４（ｂ）に示すように、流体が濡れ広がってきた経路から、その経路に対して鋭角αをなして屈曲する方向には流体は濡れ広がりにくい。例えば、図４（ｃ）に模式的に示す例では、辺１１２が辺１１３と９０°未満の鋭角αで交わっている。流体１１４が辺１１２に沿って濡れ広がってきて、辺１１２と鋭角αをなして交わる辺１１３に沿う方向にも濡れ広がろうとすると、流体１１４が辺１１２から辺１１３まで回り込む距離が長い。そのため、流体１１４の濡れ広がりが抑制されてしまう。 To explain this principle, capillary action is determined whether the bending angle is an acute angle of less than 90° or an obtuse angle of more than 90° when the fluid is wetted and spreads from the path along which the fluid has spread. A difference arises in the way of wetting and spreading. As shown in FIG. 4(b), it is difficult for the fluid to wet and spread in a direction that bends at an acute angle α with respect to the route along which the fluid has wetted and spread. For example, in the example schematically shown in FIG. 4C, the side 112 intersects with the side 113 at an acute angle α of less than 90°. When the fluid 114 wets and spreads along the side 112 and tries to spread along the side 113 that intersects with the side 112 at an acute angle α, the distance that the fluid 114 wraps around from the side 112 to the side 113 is long. Therefore, wetting and spreading of the fluid 114 is suppressed.

一方、図５（ａ）に模式的に示すように辺１１２と辺１１３とが９０°を超える鈍角βで交わる場合にも、流体１１４が辺１１２から辺１１３まで回り込むが、その回り込む距離は、図３（ｆ）に示す鋭角αの場合と比べると短い。従って、２つの辺１１２，１１３が交わる角度が鋭角αである場合よりも、鈍角βである場合の方が、流体１１４の濡れ広がりが抑制される程度は小さい。 On the other hand, when the sides 112 and 113 intersect at an obtuse angle β exceeding 90° as schematically shown in FIG. It is shorter than the acute angle α shown in FIG. 3(f). Therefore, the extent to which the wetting and spreading of the fluid 114 is suppressed is smaller when the two sides 112 and 113 intersect at an obtuse angle β than when the angle at which the two sides 112 and 113 intersect is an acute angle α.

この原理に基づくと、第一の封止樹脂１０５の拡散経路である記録素子基板１０１と支持基板１０３との接合部の辺１０６が、支持基板１０３の側面１０３ａと鋭角αをなすように交わると、第一の封止樹脂１０５の拡散が抑えられる。その結果、記録素子基板１０１の接合側の面の樹脂膜１１１を、第一の封止樹脂１０５によって十分に被覆できない可能性がある。そこで、本実施例では、第一の封止樹脂１０５の拡散経路である辺１０６と支持基板１０３の側面１０３ａとが支持基板１０３の記録素子基板１０１が積層されている面の側でなす角度を９０°より大きい鈍角βにする。さらに、図４（ａ）に示す構成では、第一の封止樹脂１０５の拡散経路の辺１０６と交わる位置で、支持基板１０３の側面１０３ａを部分的に曲面１０３ｂにしている。仮に曲面１０３ｂが設けられていない構成では、第一の封止樹脂１０５の拡散経路である辺１０６と支持基板１０３の側面１０３ａとがなす角度が鋭角である場合に、その支持基板１０３の側面１０３ａに曲面１０３ｂを形成する。それにより、この曲面１０３ｂ（正確には曲面１０３ｂの接線Ｔ）の位置で、第一の封止樹脂１０５の拡散経路である辺１０６と支持基板１０３の側面１０３ａとがなす角度が鈍角になる。それにより、図５（ａ）を参照して説明した通り、第一の封止樹脂１０５の、支持基板１０３の側面１０３ａに沿う拡散が抑制されず円滑に進行する。その結果、図５（ｂ）に示すように、基板素子基板１０１の接合側の面の樹脂膜１１１を第一の封止樹脂１０５で良好に被覆でき、信頼性の高い液体吐出ヘッドを得ることができる。 Based on this principle, if the side 106 of the junction between the recording element substrate 101 and the support substrate 103, which is the diffusion path of the first sealing resin 105, intersects the side surface 103a of the support substrate 103 so as to form an acute angle α. , diffusion of the first sealing resin 105 is suppressed. As a result, there is a possibility that the resin film 111 on the bonding side surface of the recording element substrate 101 cannot be sufficiently covered with the first sealing resin 105 . Therefore, in this embodiment, the angle formed by the side 106, which is the diffusion path of the first sealing resin 105, and the side surface 103a of the support substrate 103 is The obtuse angle β is greater than 90°. Furthermore, in the configuration shown in FIG. 4A, the side surface 103a of the support substrate 103 is partially curved 103b at the position where it intersects with the side 106 of the diffusion path of the first sealing resin 105 . In a configuration in which the curved surface 103b is not provided, if the angle formed by the side 106, which is the diffusion path of the first sealing resin 105, and the side surface 103a of the support substrate 103 is an acute angle, the side surface 103a of the support substrate 103 to form a curved surface 103b. As a result, at the position of this curved surface 103b (more precisely, the tangent line T of the curved surface 103b), the angle formed by the side 106, which is the diffusion path of the first sealing resin 105, and the side surface 103a of the support substrate 103 becomes an obtuse angle. As a result, as described with reference to FIG. 5A, diffusion of the first sealing resin 105 along the side surface 103a of the support substrate 103 proceeds smoothly without being suppressed. As a result, as shown in FIG. 5B, the resin film 111 on the bonding side surface of the substrate element substrate 101 can be satisfactorily covered with the first sealing resin 105, and a highly reliable liquid discharge head can be obtained. can be done.

以上説明したようにワイヤー１０４の下方を第一の封止樹脂１０５で満たした後に、その上方に第二の封止樹脂１０８を塗布する（図２（ｃ）参照）。本実施例の第二の封止樹脂１０８は、粘度２００Ｐａ・ｓのアミン硬化型のエポキシ樹脂組成物である。第一および第二の封止樹脂１０５，１０８を加熱して硬化させて、ワイヤー１０４の下方を第一の封止樹脂で封止し、ワイヤー１０４の上方を第二の封止樹脂１０８で封止する。こうして、本実施例の液体吐出ヘッドを作製した。 After filling the wire 104 below with the first sealing resin 105 as described above, the second sealing resin 108 is applied above it (see FIG. 2(c)). The second sealing resin 108 of this embodiment is an amine-curable epoxy resin composition with a viscosity of 200 Pa·s. The first and second sealing resins 105 and 108 are heated and cured to seal the lower part of the wire 104 with the first sealing resin and the upper part of the wire 104 with the second sealing resin 108. stop. Thus, the liquid ejection head of this example was manufactured.

［実施例２］
本実施例は、実施例１とは支持基板１０３が異なり、それ以外は実施例１と同様の構成および方法である。ここでは、主に実施例１と異なる部分について説明する。図６（ａ）は本実施例の液体吐出ヘッドの要部の斜視図であり、図６（ｂ）はその平面図である。図７（ａ）は図６（ｂ）のＦ－Ｆ線断面図であり、図７（ｂ）は図６（ｂ）のＧ－Ｇ線断面図であり、図７（ｃ）は図６（ｂ）のＨ－Ｈ線断面図である。本実施例の支持基板１０３は、図６（ａ），６（ｂ）に示すように、図３（ａ）のＥ部分において支持基板１０３が部分的に面取りされている。この面取り部分１０３ｃにより、第一の封止樹脂１０５の拡散経路である辺１０６と支持基板１０３の側面１０３ａとがなす角が鈍角βになっている。より詳細には、辺１０６と、支持基板１０３の記録素子基板１０１が積層された面の、辺１０６と交わる端縁１０３ｄとがなす角が鈍角βになっている。その結果、前述した原理に基づいて、実施例１と同様に第一の封止樹脂１０５の毛細管現象による良好な濡れ広がりが確保される。この面取り部分１０３ｃの下面はスロープ形状になっている。図７（ａ）～７（ｃ）に示すように、記録素子基板１０１の辺１０６から離れるにつれて、Ｆ－Ｆ線の位置、Ｇ－Ｇ線の位置、Ｈ－Ｈ線の位置の順番に、徐々に支持基板１０３が記録素子基板１０１に近づいている。毛細管現象は、第一の封止樹脂１０５が濡れ広がる経路が細いほど促進されるので、スロープ形状によって第一の封止樹脂１０５の拡散が促進される。すなわち、図７（ａ）～７（ｃ）に示すように、面取り部１０３ｃによって生じた溝部１１０により、記録素子基板１０１の接合側の面への第一の封止樹脂１０５の拡散がより活発になる。この面取り部１０３ｃとスロープ形状とにより、第一の封止樹脂１０５の毛細管現象による拡散がより確実になり、記録素子基板１０１の接合側の面の樹脂膜１１１が第一の封止樹脂１０５により被覆される信頼性が高い。 [Example 2]
The present embodiment differs from the first embodiment in the supporting substrate 103, and has the same configuration and method as the first embodiment. Here, mainly different parts from the first embodiment will be explained. FIG. 6(a) is a perspective view of the essential part of the liquid ejection head of this embodiment, and FIG. 6(b) is a plan view thereof. 7(a) is a cross-sectional view taken along line FF of FIG. 6(b), FIG. 7(b) is a cross-sectional view taken along line GG of FIG. 6(b), and FIG. It is a cross-sectional view taken along the line HH of (b). As shown in FIGS. 6(a) and 6(b), the support substrate 103 of this embodiment is partially chamfered at the portion E in FIG. 3(a). Due to this chamfered portion 103c, the angle formed by the side 106, which is the diffusion path of the first sealing resin 105, and the side surface 103a of the support substrate 103 is an obtuse angle β. More specifically, the angle formed by the side 106 and the edge 103d of the surface of the support substrate 103 on which the printing element substrates 101 are laminated is an obtuse angle β. As a result, good wetting and spreading of the first sealing resin 105 due to the capillary action is ensured, as in the first embodiment, based on the principle described above. The lower surface of this chamfered portion 103c has a slope shape. As shown in FIGS. 7(a) to 7(c), as the distance from the side 106 of the recording element substrate 101 increases, the position of the FF line, the position of the GG line, and the position of the HH line are arranged in this order. The support substrate 103 gradually approaches the printing element substrate 101 . Capillary action is promoted as the path through which the first sealing resin 105 spreads is narrower, so the slope shape promotes the diffusion of the first sealing resin 105 . That is, as shown in FIGS. 7A to 7C, the first sealing resin 105 is more actively diffused to the bonding side surface of the recording element substrate 101 by the groove portion 110 produced by the chamfered portion 103c. become. Due to the chamfered portion 103c and the slope shape, the diffusion of the first sealing resin 105 due to capillary action becomes more reliable, and the resin film 111 on the bonding side surface of the recording element substrate 101 is formed by the first sealing resin 105. Highly reliable coated.

このようにして、第一の封止樹脂１０５を塗布した後に、その上に第二の封止樹脂１０８を塗布した。本実施例の第二の封止樹脂１０８は、粘度２５０Ｐａ・ｓの酸無水物硬化型のエポキシ樹脂組成物である。第二の封止樹脂１０８を塗布した後に加熱処理を行い、第一の封止樹脂１０５および第二の封止樹脂１０８を硬化して、液体吐出ヘッドを作製した。 After applying the first sealing resin 105 in this manner, the second sealing resin 108 was applied thereon. The second sealing resin 108 of this embodiment is an acid anhydride-curable epoxy resin composition having a viscosity of 250 Pa·s. After applying the second sealing resin 108, heat treatment was performed to cure the first sealing resin 105 and the second sealing resin 108, thereby producing a liquid ejection head.

以上説明したように、本発明では、記録素子基板１０１の一部が支持基板１０３の両側面１０３ａからそれぞれの外側にせり出している。そして、第一の封止樹脂１０５の拡散経路である辺１０６と支持基板１０３の側面１０３ａとが支持基板１０３の記録素子基板１０１が積層されている面の側でなす角度が９０度より大きい鈍角である。すなわち、辺１０６と、支持基板１０３の記録素子基板１０１が積層されている面の、辺１０６と交わる端縁とが、支持基板１０３の記録素子基板１０１が積層されている面の側でなす角度が９０度より大きい鈍角である。また、辺１０６の延びる方向の記録素子基板１０１の両側部において、辺１０６とそれぞれの側面１０３ａとがなす角度がいずれも９０度より大きい鈍角となっている。そのため、辺１０６に沿って拡散してきた第一の封止樹脂１０５が、記録素子基板１０１の、支持基板１０３からせり出している部分において、支持基板１０３の側面１０３ａに沿う方向にも円滑に拡散する。それにより、記録素子基板１０１の接合側の面の露出部分の樹脂膜１１１を良好に覆うことができる。 As described above, in the present invention, part of the recording element substrate 101 protrudes from both side surfaces 103a of the support substrate 103 to the outside. The angle formed by the side 106, which is the diffusion path of the first sealing resin 105, and the side surface 103a of the support substrate 103 on the side of the surface of the support substrate 103 on which the recording element substrate 101 is laminated is an obtuse angle greater than 90 degrees. is. That is, the angle formed between the side 106 and the edge of the support substrate 103 on which the recording element substrates 101 are stacked and which intersects with the side 106 on the side of the support substrate 103 on which the recording element substrates 101 are stacked. is an obtuse angle greater than 90 degrees. Also, on both sides of the recording element substrate 101 in the direction in which the side 106 extends, the angles formed by the side 106 and the respective side surfaces 103a are both obtuse angles larger than 90 degrees. Therefore, the first sealing resin 105 that has diffused along the side 106 smoothly diffuses also in the direction along the side surface 103a of the support substrate 103 in the portion of the recording element substrate 101 protruding from the support substrate 103. . As a result, the exposed portion of the resin film 111 on the bonding side surface of the recording element substrate 101 can be satisfactorily covered.

この点について補足すると、第一の封止樹脂１０５は、ワイヤー１０４の下方を覆いながら、記録素子基板１０１と支持基板１０３との接合部の辺１０６に沿って拡散する。そして、支持基板１０３の側面１０３ａの位置で記録素子基板１０１と支持基板１０３との接合部の辺１０６は終端する。従って、辺１０６に沿って拡散してきた第一の封止樹脂１０５は、辺１０６の終端部から先は自由に拡散できる状態になり、その拡散方向はあまり規定されない。ただし、支持基板１０３の側面１０３ａが、第一の封止樹脂１０５の拡散を案内するように作用すると考えられる。すなわち、支持基板１０３の側面１０３ａが、記録素子基板１０１が支持基板の側面１０３ａからせり出した部分における拡散方向をある程度規定する可能性がある。この支持基板１０３の側面１０３ａと第一の封止樹脂１０５の拡散経路である辺１０６とが支持基板１０３の記録素子基板１０１が積層されている面の側でなす角度が鈍角であると、前述した通り第一の封止樹脂１０５の拡散が抑制されずに円滑に進行しやすい。 To supplement this point, the first sealing resin 105 spreads along the side 106 of the junction between the recording element substrate 101 and the support substrate 103 while covering the wires 104 below. The side 106 of the joining portion between the recording element substrate 101 and the support substrate 103 terminates at the position of the side surface 103a of the support substrate 103 . Therefore, the first sealing resin 105 that has diffused along the side 106 is in a state of being able to freely diffuse beyond the end of the side 106, and the diffusion direction is not very defined. However, it is considered that the side surface 103 a of the support substrate 103 acts to guide the diffusion of the first sealing resin 105 . In other words, the side surface 103a of the support substrate 103 may define the diffusion direction in the portion where the recording element substrate 101 protrudes from the side surface 103a of the support substrate to some extent. The angle formed by the side surface 103a of the support substrate 103 and the side 106, which is the diffusion path of the first sealing resin 105, on the surface of the support substrate 103 on which the recording element substrate 101 is laminated is an obtuse angle. As described above, diffusion of the first sealing resin 105 is not suppressed and tends to proceed smoothly.

この構成は、平面形状が正方形や長方形ではなく、鈍角と鋭角を備える平行四辺形状である記録素子基板１０１を有する液体吐出ヘッドにおいて特に効果的である。平行四辺形状の記録素子基板１０１の場合、一方の側部では第一の封止樹脂１０５の拡散経路である辺１０６と支持基板１０３の側面１０３ａとがなす角度が鈍角であっても、他方の側部では鋭角になる場合がある。そのような場合には、鋭角になる側部において、第一の封止樹脂１０５の拡散経路である辺１０６と支持基板１０３の側面１０３ａとが交わる部分（Ｅ部分）において、支持基板１０３の側面１０３ａを部分的に曲面１０３ｂまたは面取り部１０３ｃに形成する。それによって、辺１０６と支持基板１０３の側面１０３ａとは部分的に鈍角をなして交差する。すなわち、両側の側面１０３ａと辺１０６とがそれぞれなす角がいずれも鈍角となる。その結果、第一の封止樹脂１０５の拡散があまり抑制されず良好に拡散し、記録素子基板１０１の接合側の面の樹脂膜１１１を含む露出部分を良好に被覆して絶縁保護できる。また、本発明では、特別に精密な封止樹脂の塗布装置は必要で無く、製造コストの上昇が抑えられる。そして、記録素子基板１０１の全周にわたって封止樹脂で被覆するわけではないので、記録素子基板同士を近接して一直線に並べて配置することができ、部品サイズを小さく抑えられる。 This configuration is particularly effective in a liquid ejection head having a recording element substrate 101 whose planar shape is not a square or rectangle but a parallelogram with obtuse and acute angles. In the case of the parallelogram-shaped recording element substrate 101, even if the angle formed by the side 106, which is the diffusion path of the first sealing resin 105, and the side surface 103a of the support substrate 103 is obtuse on one side, There may be sharp angles on the sides. In such a case, the side surface of the support substrate 103 (E portion) where the side 106, which is the diffusion path of the first sealing resin 105, and the side surface 103a of the support substrate 103 intersect in the side portion forming an acute angle. 103a is partially formed into curved surface 103b or chamfered portion 103c. As a result, the side 106 and the side surface 103a of the support substrate 103 partially intersect at an obtuse angle. That is, the angles formed by the side surfaces 103a on both sides and the sides 106 are both obtuse angles. As a result, the diffusion of the first sealing resin 105 is not greatly suppressed and is diffused satisfactorily, and the exposed portion including the resin film 111 on the joint side surface of the recording element substrate 101 can be satisfactorily covered and protected for insulation. In addition, the present invention does not require a particularly precise encapsulating resin coating device, thereby suppressing an increase in manufacturing cost. In addition, since the recording element substrate 101 is not covered with the sealing resin all around, the recording element substrates can be arranged close to each other in a straight line, and the component size can be reduced.

１０１ 記録素子基板
１０３ 支持基板
１０３ａ 側面
１０５ 第一の封止樹脂
１０６ 辺 101 recording element substrate 103 support substrate 103a side surface 105 first sealing resin 106 side

Claims (8)

支持基板と、一部が前記支持基板の上に積層されている記録素子基板と、前記記録素子基板の前記支持基板と接合される側の面の少なくとも一部に設けられた保護層と、少なくとも一部が前記支持基板の上に前記記録素子基板と並べて積層されている電気配線基板と、前記記録素子基板の端子と前記電気配線基板の端子とを接続するワイヤーと、前記支持基板の、前記記録素子基板が積層されている面の上で、前記記録素子基板の１つの辺に沿って設けられて前記ワイヤーと前記支持基板との間の空間を覆う第一の封止樹脂と、を有する液体吐出ヘッドであって、
前記記録素子基板は、前記第一の封止樹脂が設けられている前記辺が延びる方向の両側部における前記支持基板の２つの側面のそれぞれから外側にせり出しており、
前記第一の封止樹脂は、前記記録素子基板が前記支持基板の前記側面からせり出している部分では前記保護層を覆っており、
前記記録素子基板の前記第一の封止樹脂が設けられている前記辺と前記支持基板の２つの前記側面が交わる部分のそれぞれにおいて、前記支持基板の、前記記録素子基板が積層されている面の側で、前記辺と前記側面のそれぞれとがなす角度が９０度よりも大きいことを特徴とする、液体吐出ヘッド。 a support substrate, a recording element substrate partially laminated on the support substrate, a protective layer provided on at least a portion of a surface of the recording element substrate that is bonded to the support substrate, and at least an electric wiring board partially laminated on the supporting substrate side by side with the recording element substrate; wires connecting terminals of the recording element substrate and terminals of the electric wiring substrate; a first sealing resin provided along one side of the recording element substrate on the surface on which the recording element substrate is laminated and covering the space between the wire and the support substrate; A liquid ejection head that
The recording element substrate protrudes outward from each of the two side surfaces of the support substrate on both sides in the direction in which the side on which the first sealing resin is provided extends,
The first sealing resin covers the protective layer in a portion where the recording element substrate protrudes from the side surface of the support substrate,
The surface of the support substrate on which the recording element substrate is laminated at each of the portions where the side of the recording element substrate provided with the first sealing resin and the two side surfaces of the support substrate intersect. side, the angle formed by the side and each of the side surfaces is greater than 90 degrees. 前記支持基板は、前記記録素子基板の前記第一の封止樹脂が設けられている前記辺と前記支持基板の前記側面の少なくとも一方とが交わる部分に曲面または面取り部を有し、前記支持基板の、前記記録素子基板が積層されている面の側で、前記記録素子基板の前記第一の封止樹脂が設けられている前記辺と、前記曲面の接線または面取り部の前記辺と交わる端縁とがなす角度は９０度よりも大きいことを特徴とする、請求項１に記載の液体吐出ヘッド。 The support substrate has a curved surface or a chamfered portion at a portion where the side of the recording element substrate provided with the first sealing resin and at least one of the side surfaces of the support substrate intersect, and the support substrate , on the side of the surface on which the recording element substrate is laminated, the edge where the side of the recording element substrate provided with the first sealing resin intersects with the tangent line of the curved surface or the side of the chamfered portion 2. The liquid ejection head according to claim 1, wherein the angle formed with the edge is greater than 90 degrees. 前記保護層は樹脂膜であることを特徴とする、請求項１または２に記載の液体吐出ヘッド。 3. The liquid ejection head according to claim 1, wherein said protective layer is a resin film . 前記ワイヤーおよび前記第一の封止樹脂を覆う第二の封止樹脂をさらに有することを特徴とする、請求項１から３のいずれか１項に記載の液体吐出ヘッド。 4. The liquid ejection head according to claim 1, further comprising a second sealing resin covering said wire and said first sealing resin. 前記第一の封止樹脂は前記第二の封止樹脂よりも粘度が低いことを特徴とする、請求項４に記載の液体吐出ヘッド。 5. The liquid ejection head according to claim 4 , wherein said first sealing resin has a lower viscosity than said second sealing resin. 前記記録素子基板の平面形状は鈍角と鋭角を備える平行四辺形状である、請求項１から５のいずれか１項に記載の液体吐出ヘッド。 6. The liquid ejection head according to claim 1, wherein the planar shape of the recording element substrate is a parallelogram having obtuse and acute angles. 支持基板の上に、記録素子基板の一部と電気配線基板の少なくとも一部とを並べて積層するステップと、
前記記録素子基板の端子と前記電気配線基板の端子とをワイヤーで接続するステップと、
前記支持基板の、前記記録素子基板および前記電気配線基板が積層されている面の上に、前記記録素子基板の１つの辺に沿って、かつ前記ワイヤーと前記支持基板との間の空間を封止するように、第一の封止樹脂を塗布するステップと、
前記記録素子基板の前記支持基板と接合される側の面の少なくとも一部に保護層を設けるステップと、を有し、
前記支持基板の上に前記記録素子基板の一部を積層する際に、前記記録素子基板が、前記第一の封止樹脂が設けられている前記辺が延びる方向の両側部における前記支持基板の２つの側面のそれぞれから外側にせり出すように、かつ、前記記録素子基板の前記第一の封止樹脂が設けられている前記辺と前記支持基板の２つの前記側面とが交わるそれぞれの部分において、前記支持基板の、前記記録素子基板が積層されている面の側で、前記辺と前記側面とがなす角度が９０度よりも大きくなるように、前記記録素子基板を配置し、
前記第一の封止樹脂を塗布する際に、前記記録素子基板が前記支持基板の前記側面からせり出している部分では前記保護層を覆うように前記第一の封止樹脂を塗布することを特徴とする、液体吐出ヘッドの製造方法。 Laminating a part of the recording element substrate and at least a part of the electric wiring board side by side on the support substrate;
connecting the terminals of the recording element substrate and the terminals of the electric wiring substrate with wires;
on the surface of the support substrate on which the recording element substrate and the electric wiring substrate are laminated, along one side of the recording element substrate and to seal the space between the wire and the support substrate; applying a first sealing resin so as to stop;
providing a protective layer on at least part of a surface of the recording element substrate that is to be bonded to the support substrate ;
When a part of the recording element substrate is laminated on the support substrate, the recording element substrate is provided with the first sealing resin on both sides of the support substrate in the direction in which the side extends. and protrudes outward from each of the two side surfaces of the recording element substrate, and at each portion where the side of the recording element substrate on which the first sealing resin is provided and the two side surfaces of the support substrate intersect arranging the recording element substrate on the side of the surface of the supporting substrate on which the recording element substrate is laminated such that the angle formed by the side and the side surface is greater than 90 degrees ;
When applying the first sealing resin, the first sealing resin is applied so as to cover the protective layer in a portion where the recording element substrate protrudes from the side surface of the support substrate. A method for manufacturing a liquid ejection head. 前記支持基板は、前記記録素子基板の前記第一の封止樹脂が設けられている前記辺と前記支持基板の前記側面の少なくとも一方とが交わる部分に、曲面または面取り部を有し、
前記支持基板の上に前記記録素子基板の一部を積層する際に、前記支持基板の、前記記録素子基板が積層されている面の側で、前記記録素子基板の前記第一の封止樹脂が設けられている前記辺と、前記曲面の接線または面取り部とがなす角度が９０度よりも大きくなるように、前記記録素子基板を配置することを特徴とする、請求項７に記載の液体吐出ヘッドの製造方法。 the support substrate has a curved surface or a chamfered portion at a portion where the side of the recording element substrate provided with the first sealing resin and at least one of the side surfaces of the support substrate intersect;
When a part of the recording element substrate is laminated on the supporting substrate, the first sealing resin for the recording element substrate is applied to the surface of the supporting substrate on which the recording element substrate is laminated. 8. The liquid according to claim 7 , wherein the recording element substrate is arranged so that the angle formed by the side provided with the tangent to the curved surface or the chamfered portion is greater than 90 degrees. A method for manufacturing an ejection head.
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