JP2022050146A - Liquid discharge head and method for manufacturing the same - Google Patents

Abstract

To provide a liquid discharge head which keeps a height of a sealing agent low while maintaining sufficient sealing by a sealing agent and has good production efficiency, in an electric connection part between an element substrate and an electric wiring board, and a method for manufacturing the same.SOLUTION: A liquid discharge head has an element substrate 2, and an electric wiring board 3 partially joined to the element substrate 2. A terminal 11 of the element substrate 2 and a lead wire 13a of the electric wiring board 3 are electrically connected to each other, and an electric connection part between the terminal 11 and the lead 13a are sealed by a sealing agent 18. The element substrate 2 and the electric wiring board 3 are joined to each other by an adhesive 17, and a bank-like part 17b is formed around the sealing agent 18 by the adhesive 17.SELECTED DRAWING: Figure 1

Description

本発明は液体吐出ヘッドとその製造方法に関する。 The present invention relates to a liquid discharge head and a method for manufacturing the same.

液体吐出ヘッドの素子基板には、液体を吐出するためのエネルギーを発生するエネルギー発生素子（例えば電気熱変換素子）が設けられている。エネルギー発生素子に電気信号を供給するための電気配線基板が素子基板に重ね合わせられ、電気配線基板のリードと素子基板の端子とが電気接続される。素子基板と電気配線基板とは接着剤により互いに固定される。電気接続部の腐食や断線を防ぐために、電気接続部を封止剤で封止することによって保護する。 The element substrate of the liquid discharge head is provided with an energy generating element (for example, an electric heat conversion element) that generates energy for discharging the liquid. An electric wiring board for supplying an electric signal to the energy generating element is superposed on the element board, and the lead of the electric wiring board and the terminal of the element board are electrically connected. The element substrate and the electrical wiring board are fixed to each other by an adhesive. To prevent corrosion and disconnection of the electrical connection, protect the electrical connection by sealing it with a sealant.

液体吐出装置の一例であるインクジェット記録装置に用いられる液体吐出ヘッドでは、記録媒体への液滴の着弾精度向上のために吐出口と記録媒体との間の間隔を小さくすることが望まれている。しかし、素子基板と電気配線基板との電気接続部を封止する封止剤が、吐出口と記録媒体との間の間隔の短縮の妨げになる可能性がある。そこで、特許文献１には、電気接続部の周囲にチクソ性の高い封止剤でダムを形成して硬化させ、ダムの内側に流動性の高い封止剤を流し込み、蓋を載せて硬化させることで封止剤の高さを低く抑えるように制御する技術が開示されている。 In a liquid ejection head used in an inkjet recording apparatus which is an example of a liquid ejection device, it is desired to reduce the distance between the ejection port and the recording medium in order to improve the landing accuracy of droplets on the recording medium. .. However, the sealant that seals the electrical connection between the element substrate and the electrical wiring board may hinder the shortening of the distance between the ejection port and the recording medium. Therefore, in Patent Document 1, a dam is formed around the electrical connection portion with a sealing agent having a high ticking property and cured, a highly fluid sealing agent is poured inside the dam, and a lid is placed on the dam to cure the dam. Therefore, a technique for controlling the height of the encapsulant to be kept low is disclosed.

特許4939184号公報Japanese Patent No. 4939184

特許文献１に記載の方法では、封止剤の硬化工程を２回、すなわちチクソ性の高い封止剤でダムを形成した後と、ダムの内側に流動性の高い封止剤を流し込んだ後とに行う必要がある。また、ダムの内側に流し込む封止剤の塗布量にバラつきがあると、蓋を載せた際にダムから封止剤が溢れてしまい、不要な箇所に封止剤が付着する可能性がある。さらに、塗布工程のみでダムの高さを一定にすることは困難であり、ダムの上端と蓋との間に隙間が生じる可能性がある。その場合、ダムの内側に流し込む流動性の高い封止剤が隙間から漏れ出して、封止剤の最低限の高さを確保できず、電気接続部を十分に封止できないおそれがある。 In the method described in Patent Document 1, the curing step of the encapsulant is performed twice, that is, after the dam is formed with the encapsulant having a high thixo property and after the encapsulant having a high fluidity is poured into the inside of the dam. You need to do it. Further, if the amount of the sealant applied to the inside of the dam varies, the sealant may overflow from the dam when the lid is placed, and the sealant may adhere to unnecessary places. Furthermore, it is difficult to keep the height of the dam constant only in the coating process, and there is a possibility that a gap may be created between the upper end of the dam and the lid. In that case, the highly fluid sealant flowing into the dam may leak from the gap, the minimum height of the sealant cannot be secured, and the electrical connection portion may not be sufficiently sealed.

本発明の目的は、素子基板と電気配線基板との電気接続部の、封止剤による十分な封止を維持しつつ、封止剤の高さを低く抑えることができ、かつ生産効率が良い液体吐出ヘッドとその製造方法を提供することにある。 An object of the present invention is that the height of the sealant can be kept low while maintaining sufficient sealing of the electrical connection portion between the element substrate and the electric wiring board with the sealant, and the production efficiency is good. It is an object of the present invention to provide a liquid discharge head and a method for manufacturing the same.

本発明の液体吐出ヘッドは、素子基板と、前記素子基板に部分的に接合された電気配線基板とを有し、前記素子基板の端子と前記電気配線基板のリードとが電気接続されており、前記端子と前記リードとの電気接続部が封止剤によって封止されており、接着剤によって前記素子基板と前記電気配線基板とが互いに接合されるとともに、前記接着剤によって前記封止剤の周囲に土手状部が形成されていることを特徴とする。 The liquid discharge head of the present invention has an element substrate and an electric wiring board partially bonded to the element substrate, and terminals of the element substrate and leads of the electric wiring board are electrically connected. The electrical connection between the terminal and the lead is sealed with a sealant, the element substrate and the electrical wiring board are bonded to each other by an adhesive, and the periphery of the sealant is bonded by the adhesive. It is characterized in that a bank-shaped portion is formed on the surface.

本発明によると、素子基板と電気配線基板との電気接続部の、封止剤による十分な封止を維持しつつ、封止剤の高さを低く抑えることができ、かつ生産効率が良い液体吐出ヘッドとその製造方法を提供することができる。 According to the present invention, the height of the sealant can be kept low while maintaining sufficient sealing of the electrical connection portion between the element substrate and the electric wiring board with the sealant, and the production efficiency is good. A discharge head and a method for manufacturing the same can be provided.

本発明の第１の実施形態の液体吐出ヘッドの要部を示す概略断面図と概略平面図である。It is a schematic cross-sectional view and a schematic plan view which show the main part of the liquid discharge head of 1st Embodiment of this invention. 図１に示す液体吐出ヘッドの素子基板の要部を示す概略断面図と概略平面図である。It is a schematic cross-sectional view and a schematic plan view which shows the main part of the element substrate of the liquid discharge head shown in FIG. 図１に示す液体吐出ヘッドの電気配線基板の要部を示す概略断面図と概略平面図である。It is a schematic cross-sectional view and a schematic plan view which shows the main part of the electric wiring board of the liquid discharge head shown in FIG. 図１に示す液体吐出ヘッドの製造方法の一工程を示す概略断面図と概略平面図である。It is a schematic cross-sectional view and a schematic plan view which shows one process of the manufacturing method of the liquid discharge head shown in FIG. 図１に示す液体吐出ヘッドの製造方法の、図４に示す工程に続く工程を示す概略断面図と概略平面図とである。It is a schematic cross-sectional view and a schematic plan view which shows the process following the process shown in FIG. 4 of the manufacturing method of the liquid discharge head shown in FIG. 図１に示す液体吐出ヘッドの製造方法の、図５に示す工程に続く工程を示す概略断面図と概略平面図である。It is a schematic cross-sectional view and the schematic plan view which shows the process following the process shown in FIG. 5 of the manufacturing method of the liquid discharge head shown in FIG. 図１に示す液体吐出ヘッドの製造方法の、図６に示す工程に続く工程を示す概略断面図と概略平面図である。It is a schematic cross-sectional view and the schematic plan view which shows the process following the process shown in FIG. 6 of the manufacturing method of the liquid discharge head shown in FIG. 本発明の第２の実施形態の液体吐出ヘッドの要部を示す概略断面図である。It is a schematic sectional drawing which shows the main part of the liquid discharge head of the 2nd Embodiment of this invention. 図８に示す液体吐出ヘッドの電気配線基板の要部を示す概略平面図である。It is a schematic plan view which shows the main part of the electric wiring board of the liquid discharge head shown in FIG.

以下、本発明の実施形態について図面に基づいて説明する。
［第１の実施形態］
図１（ａ），１（ｂ）は液体吐出ヘッドの要部を示す概略断面図と概略平面図である。図１に示すように、この液体吐出ヘッドでは、支持部材１上に素子基板２と電気配線基板３が搭載されている。図２（ａ），２（ｂ）は素子基板２の要部を示す概略断面図と概略平面図である。図３（ａ），３（ｂ）は電気配線基板３の要部を示す概略断面図と概略平面図とである。図１（ａ），２（ａ），３（ａ）はそれぞれ図１（ｂ），２（ｂ），３（ｂ）のＡ－Ａ線断面図である。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[First Embodiment]
1 (a) and 1 (b) are a schematic cross-sectional view and a schematic plan view showing a main part of a liquid discharge head. As shown in FIG. 1, in this liquid discharge head, the element substrate 2 and the electrical wiring substrate 3 are mounted on the support member 1. 2 (a) and 2 (b) are a schematic cross-sectional view and a schematic plan view showing a main part of the element substrate 2. 3 (a) and 3 (b) are a schematic cross-sectional view and a schematic plan view showing a main part of the electric wiring board 3. 1 (a), 2 (a), and 3 (a) are sectional views taken along line AA of FIGS. 1 (b), 2 (b), and 3 (b), respectively.

［素子基板］
図２に示すように、素子基板２は基板４と吐出口形成部材５とを有する。基板４はシリコン等からなり、液体を吐出するためのエネルギーを発生するエネルギー発生素子（例えば電気熱変換素子や圧電素子）６と、支持部材１との間に共通液室７を構成する凹部と、液体供給路８とが設けられている。共通液室７は、基板４の吐出口形成部材５と接合される面（第１の面４ａ）と反対側であって、支持部材１に接合される面（第２の面４ｂ）に設けられた大面積の凹部からなる。液体供給路８は共通液室７に連通するとともに、第１の面４ａに開口する孔部からなる。１つの共通液室７に複数の液体供給路８が連通している。基板４に重なるように設けられている吐出口形成部材５には、基板４との間に圧力室９を構成する凹部と、外部に対して開口する吐出口１０とを有している。圧力室９は、吐出口形成部材５の基板４と接合される面（第２の面５ｂ）に設けられた凹部からなる。電気配線基板３と基板４との接合方向に見た平面図、すなわち図１（ａ），２（ａ）の上方から見た平面図において、圧力室９の内部にエネルギー発生素子６が位置するとともに、液体供給路８が連通している。吐出口１０は、圧力室９に連通するとともに、第２の面５ｂと反対側であって外部に露出した面（第１の面５ａ）に開口して外部に開放された孔部である。吐出口形成部材５は、吐出する液体（例えば液体インク）と接触するため、耐液体性（耐インク性）を有する材料、例えば感光性樹脂からなることが好ましい。基板４の第１の面４ａの、吐出口形成部材５が設けられていない位置に、外部からの電気信号を入力するための端子（パッド）１１が形成されている。端子１１は、図示しない配線を介してエネルギー発生素子６と接続されている。 [Element board]
As shown in FIG. 2, the element substrate 2 has a substrate 4 and a discharge port forming member 5. The substrate 4 is made of silicon or the like, and has a recess forming a common liquid chamber 7 between an energy generating element (for example, an electric heat conversion element or a piezoelectric element) 6 for generating energy for discharging a liquid and a support member 1. , A liquid supply path 8 is provided. The common liquid chamber 7 is provided on the side opposite to the surface (first surface 4a) joined to the discharge port forming member 5 of the substrate 4 and on the surface (second surface 4b) joined to the support member 1. It consists of a large area of recesses. The liquid supply path 8 communicates with the common liquid chamber 7 and includes a hole that opens in the first surface 4a. A plurality of liquid supply paths 8 communicate with one common liquid chamber 7. The discharge port forming member 5 provided so as to overlap the substrate 4 has a recess forming a pressure chamber 9 between the discharge port forming member 5 and the substrate 4, and a discharge port 10 that opens to the outside. The pressure chamber 9 is composed of a recess provided on a surface (second surface 5b) joined to the substrate 4 of the discharge port forming member 5. The energy generating element 6 is located inside the pressure chamber 9 in the plan view of the electrical wiring board 3 and the board 4 in the joining direction, that is, in the plan view seen from above of FIGS. 1 (a) and 1 (a). At the same time, the liquid supply path 8 communicates with each other. The discharge port 10 is a hole that communicates with the pressure chamber 9 and is open to the outside by opening to a surface (first surface 5a) that is opposite to the second surface 5b and is exposed to the outside. Since the discharge port forming member 5 comes into contact with the liquid to be discharged (for example, liquid ink), it is preferably made of a material having liquid resistance (ink resistance), for example, a photosensitive resin. A terminal (pad) 11 for inputting an electric signal from the outside is formed at a position on the first surface 4a of the substrate 4 where the discharge port forming member 5 is not provided. The terminal 11 is connected to the energy generating element 6 via a wiring (not shown).

［電気配線基板］
図１に示すように、基板４の第２の面４ｂ（図１（ａ）の下側の面）に電気配線基板３の一端部が固定されている。本実施形態の電気配線基板３はいわゆるＦＰＣ（フレキシブルプリント基板、Flexible Printed Circuits）からなる。電気配線基板３を構成するＦＰＣは、図３に示すように、ポリイミド樹脂などからなるベースフィルム１２の上に、パターニングされた銅箔などからなる配線１３が形成されている。配線１３は、基板４の端子１１と接続される部分（リード１３ａ）を除いて、ポリイミド樹脂などからなるカバーフィルム１４で覆われている。ベースフィルム１２と配線１３とカバーフィルム１４とは、それぞれ接着フィルム（図示せず）等で接合されている。図１に示すように、リード１３ａは、ボンディングワイヤー１５によって、基板４の端子１１に接続されている。この接続部（電気接続部）は封止剤（封止樹脂）１８によって封止されている。この電気接続部および封止に関しては後述する。なお、電気配線基板３は、積層された複数の配線層を有するＦＰＣから構成されていてもよい。また、電気配線基板３は、ＴＡＢ（Tape Automated Bonding）などから構成されていてもよい。 [Electrical wiring board]
As shown in FIG. 1, one end of the electrical wiring board 3 is fixed to the second surface 4b (lower surface of FIG. 1A) of the substrate 4. The electrical wiring board 3 of this embodiment is made of so-called FPCs (Flexible Printed Circuits). As shown in FIG. 3, in the FPC constituting the electric wiring board 3, a wiring 13 made of patterned copper foil or the like is formed on a base film 12 made of a polyimide resin or the like. The wiring 13 is covered with a cover film 14 made of a polyimide resin or the like, except for a portion (lead 13a) connected to the terminal 11 of the substrate 4. The base film 12, the wiring 13, and the cover film 14 are bonded to each other by an adhesive film (not shown) or the like. As shown in FIG. 1, the lead 13a is connected to the terminal 11 of the substrate 4 by the bonding wire 15. This connection portion (electrical connection portion) is sealed with a sealing agent (sealing resin) 18. The electrical connection and sealing will be described later. The electrical wiring board 3 may be composed of an FPC having a plurality of laminated wiring layers. Further, the electric wiring board 3 may be composed of TAB (Tape Automated Bonding) or the like.

［支持部材］
図１に示すように、支持部材１は、素子基板２および電気配線基板３を支持するとともに、素子基板２に液体を供給する流路部材である。支持部材１には、基板４の共通液室７に連通する流路１６が設けられている。流路１６は、図示しない液体容器（液体タンク）に接続されている。 [Support member]
As shown in FIG. 1, the support member 1 is a flow path member that supports the element substrate 2 and the electrical wiring substrate 3 and supplies a liquid to the element substrate 2. The support member 1 is provided with a flow path 16 that communicates with the common liquid chamber 7 of the substrate 4. The flow path 16 is connected to a liquid container (liquid tank) (not shown).

［液体吐出ヘッドの動作］
以上説明した構成の液体吐出ヘッドでは、図示しない液体容器から、流路１６、共通液室７、液体供給路８を介して、圧力室９に液体が供給される。また、図示しない装置本体から、電気配線基板３の配線１３、ボンディングワイヤー１５、端子１１、図示しない配線を介して、エネルギー発生素子６に電気信号が供給される。電気信号が供給されたエネルギー発生素子６（例えば電気熱変換素子）が駆動されて、圧力室９内の液体にエネルギー（例えば熱）を付与する。エネルギーを付与された液体は、吐出口１０から外部の記録媒体に向けて吐出される。液体吐出によって記録を行う場合には、記録媒体に液滴を高精度に着弾させる必要がある。 [Operation of liquid discharge head]
In the liquid discharge head having the above-described configuration, liquid is supplied from a liquid container (not shown) to the pressure chamber 9 via the flow path 16, the common liquid chamber 7, and the liquid supply passage 8. Further, an electric signal is supplied from the main body of the device (not shown) to the energy generating element 6 via the wiring 13, the bonding wire 15, the terminal 11, and the wiring (not shown) of the electric wiring board 3. The energy generating element 6 (for example, an electric heat conversion element) to which an electric signal is supplied is driven to apply energy (for example, heat) to the liquid in the pressure chamber 9. The energized liquid is discharged from the discharge port 10 toward an external recording medium. When recording is performed by ejecting a liquid, it is necessary to land the droplet on the recording medium with high accuracy.

［液体吐出ヘッドの製造方法］
前述した液体吐出ヘッドの製造方法について説明する。図４（ａ），４（ｂ）は、この液体吐出ヘッドの製造方法の一工程を示す概略断面図と概略平面図である。図５（ａ），５（ｂ）は、液体吐出ヘッドの製造方法の、図４に示す工程に続く工程を示す概略断面図と概略平面図である。図６（ａ），６（ｂ）は、液体吐出ヘッドの製造方法の、図５に示す工程に続く工程を示す概略断面図と概略平面図である。図７（ａ），７（ｂ）は、液体吐出ヘッドの製造方法の、図６に示す工程に続く工程を示す概略断面図と概略平面図である。図４（ａ），５（ａ），６（ａ），７（ａ）はそれぞれ図４（ｂ），５（ｂ），６（ｂ），７（ｂ）のＡ－Ａ線断面図である。 [Manufacturing method of liquid discharge head]
The method for manufacturing the liquid discharge head described above will be described. 4 (a) and 4 (b) are a schematic cross-sectional view and a schematic plan view showing one step of the method for manufacturing the liquid discharge head. 5 (a) and 5 (b) are schematic cross-sectional views and schematic plan views showing the steps following the steps shown in FIG. 4 of the method for manufacturing a liquid discharge head. 6 (a) and 6 (b) are schematic cross-sectional views and schematic plan views showing the steps following the steps shown in FIG. 5 of the method for manufacturing a liquid discharge head. 7 (a) and 7 (b) are schematic cross-sectional views and schematic plan views showing the steps following the steps shown in FIG. 6 of the method for manufacturing a liquid discharge head. 4 (a), 5 (a), 6 (a), and 7 (a) are sectional views taken along line AA of FIGS. 4 (b), 5 (b), 6 (b), and 7 (b), respectively. be.

前述した液体吐出ヘッドを製造する際には、エネルギー発生素子６が設けられている基板４の第１の面４ａに、吐出口形成部材５を設ける。基板４には、共通液室７を構成する凹部と液体供給路８とが設けられ、吐出口形成部材５には圧力室９を構成する凹部と吐出口１０とが設けられる。これらの凹部や液体供給路８や吐出口１０の形成は、基板４上に吐出口形成部材５を設ける前であっても後であってもよい。 When manufacturing the liquid discharge head described above, the discharge port forming member 5 is provided on the first surface 4a of the substrate 4 on which the energy generating element 6 is provided. The substrate 4 is provided with a recess constituting the common liquid chamber 7 and a liquid supply path 8, and the discharge port forming member 5 is provided with a recess constituting the pressure chamber 9 and a discharge port 10. The recesses, the liquid supply path 8, and the discharge port 10 may be formed before or after the discharge port forming member 5 is provided on the substrate 4.

図４（ａ），４（ｂ）に示すように、ＦＰＣからなる電気配線基板３の一端部の、カバーフィルム１４で覆われておらずベースフィルム１２が露出している部分の、リード１３ａと重ならない位置に接着剤１７を塗布する。このとき、電気配線基板３と素子基板２とを接合する部分１７ａに加え、封止剤の流動を抑えるための土手状部１７ｂとなる位置にも接着剤１７を塗布する。土手状部１７ｂとなる位置とは、電気配線基板３の幅方向（図４（ｂ）の上下方向）の両端部で、後工程で配置されるボンディングワイヤー１５と、電気配線基板３の端縁部との間の位置である。一例としては、接着剤１７は、粘度が８６［Ｐａ・ｓ］程度のエポキシ系熱硬化型樹脂である。しかし、これに限定されず、塗布後に高さを含む寸法および形状を維持できれば、粘度が異なっていてもよく、さらに他の接着剤であってもよい。 As shown in FIGS. 4A and 4B, the lead 13a and the lead 13a of one end of the electric wiring board 3 made of FPC, which is not covered with the cover film 14 and the base film 12 is exposed. The adhesive 17 is applied to the positions where they do not overlap. At this time, in addition to the portion 17a for joining the electric wiring board 3 and the element substrate 2, the adhesive 17 is also applied to the position of the bank-shaped portion 17b for suppressing the flow of the sealing agent. The positions of the bank-shaped portions 17b are both ends in the width direction of the electrical wiring board 3 (vertical direction in FIG. 4B), the bonding wires 15 arranged in the subsequent process, and the edge edges of the electrical wiring board 3. The position between the parts. As an example, the adhesive 17 is an epoxy-based thermosetting resin having a viscosity of about 86 [Pa · s]. However, the present invention is not limited to this, and the viscosity may be different as long as the dimensions and shape including the height can be maintained after application, and other adhesives may be used.

電気配線基板３の、素子基板２に接合する箇所に塗布する接着剤１７ａの量は少ない方が望ましく、後の封止工程および封止剤の硬化工程まで素子基板２と電気配線基板３の接合状態を保持できる程度の量があればよい。このように接着剤１７ａの塗布量を少なくすることで、素子基板２と接合する時に接着剤がはみ出して、はみ出した接着剤が後工程で接合される支持部材１と干渉して接合不良や液体の漏れを引き起こすことを抑えられる。第１の実施形態では、電気配線基板３の、素子基板２に接合する箇所に塗布する接着剤１７ａは、電気配線基板３からの高さが５０［μｍ］程度、幅が２００［μｍ］程度である。 It is desirable that the amount of the adhesive 17a applied to the portion of the electric wiring board 3 to be joined to the element substrate 2 is small, and the element substrate 2 and the electric wiring board 3 are joined until the subsequent sealing step and the curing agent curing step. It suffices if there is an amount that can maintain the state. By reducing the amount of the adhesive 17a applied in this way, the adhesive squeezes out when it is bonded to the element substrate 2, and the squeezed out adhesive interferes with the support member 1 to be bonded in the subsequent process, resulting in poor bonding or liquid. Can be suppressed from causing leakage. In the first embodiment, the adhesive 17a applied to the portion of the electrical wiring board 3 to be joined to the element substrate 2 has a height of about 50 [μm] and a width of about 200 [μm] from the electrical wiring board 3. Is.

電気配線基板３の、素子基板２に接合する箇所以外に設けられる接着剤からなる土手状部１７ｂは、電気配線基板３の一端部の、カバーフィルム１４で覆われておらずベースフィルム１２が露出している部分の外周に沿って設けられている。ただし、カバーフィルム１４の端面に沿う箇所には土手状部１７ｂは設けられていない。第１の実施形態では、土手状部１７ｂの電気配線基板３からの高さが８００［μｍ］程度、幅が２００［μｍ］程度である。土手状部１７ｂの上面は、素子基板２と電気配線基板３とが接合された状態で素子基板２の上面と同程度の高さに位置する。土手状部１７ｂの高さについては後述する。 The bank-shaped portion 17b made of an adhesive provided on the electrical wiring board 3 other than the portion to be joined to the element substrate 2 is not covered with the cover film 14 at one end of the electrical wiring board 3, and the base film 12 is exposed. It is provided along the outer circumference of the portion where the wire is formed. However, the bank-shaped portion 17b is not provided at a portion along the end surface of the cover film 14. In the first embodiment, the height of the bank-shaped portion 17b from the electrical wiring board 3 is about 800 [μm], and the width is about 200 [μm]. The upper surface of the bank-shaped portion 17b is located at the same height as the upper surface of the element substrate 2 in a state where the element substrate 2 and the electric wiring board 3 are joined. The height of the bank-shaped portion 17b will be described later.

このように、本実施形態では接着剤１７の一部１７ａによって、素子基板２と電気配線基板３とを接合し、接着剤１７の他の部分によって、封止剤１８の漏れ出しを抑える土手状部１７ｂを構成している。接着剤１７の、素子基板２に接合する部分１７ａと、土手状部１７ｂとの、電気配線基板３からの高さの差は、塗布速度と塗布圧力の一方または両方を異ならせて塗布量に差を設けることによって生じさせることができる。また、塗布速度や塗布圧力を概ね一定にして、土手状部１７ｂを形成する位置には接着剤の塗布を複数回繰り返すこと、すなわち接着剤の吐出部を複数回往復させながら塗布することにより、土手状部１７ｂを高くすることもできる。 As described above, in the present embodiment, the element substrate 2 and the electric wiring board 3 are joined by a part 17a of the adhesive 17, and the other part of the adhesive 17 suppresses the leakage of the sealant 18. It constitutes a part 17b. The difference in height from the electrical wiring board 3 between the portion 17a of the adhesive 17 to be joined to the element substrate 2 and the bank-shaped portion 17b is different in one or both of the coating speed and the coating pressure to determine the coating amount. It can be caused by making a difference. Further, the coating speed and the coating pressure are kept substantially constant, and the adhesive is repeatedly applied to the position where the bank-shaped portion 17b is formed, that is, the adhesive discharge portion is reciprocated and applied a plurality of times. The bank-shaped portion 17b can also be raised.

図５（ａ），５（ｂ）に示すように、接着剤１７が塗布された電気配線基板３と素子基板２とを、接着剤１７の塗布面と基板４の第２の面４ｂとが向かい合う状態で、部分的に重ね合わせる。そして、基板４の端子１１と電気配線基板３のリード１３ａとをボンディングワイヤー１５によって電気接続する。本実施形態では、直径２５［μｍ］の金製のボンディングワイヤー１５を用いたボールボンディングによって電気接続を行う。ただし、アルミワイヤーを用いたウエッジボンディングなどによって電気接続を行うこともできる。 As shown in FIGS. 5A and 5B, the electric wiring board 3 coated with the adhesive 17 and the element substrate 2 are provided with the coated surface of the adhesive 17 and the second surface 4b of the substrate 4. Partially overlap while facing each other. Then, the terminal 11 of the substrate 4 and the lead 13a of the electrical wiring board 3 are electrically connected by the bonding wire 15. In the present embodiment, electrical connection is performed by ball bonding using a gold bonding wire 15 having a diameter of 25 [μm]. However, electrical connection can also be made by wedge bonding using aluminum wire or the like.

次に、素子基板２の端子１１と電気配線基板３のリード１３ａとの電気接続部を封止して保護するための封止剤１８を設ける。本実施形態では、２段階に分けて封止剤１８を塗布し、先に塗布する封止剤を下部封止剤１８ａと称し、後に塗布する封止剤を上部封止剤１８ｂと称する。まず、図６（ａ），６（ｂ）に示すように、ボンディングワイヤー１５と基板４および電気配線基板３との間の空間に、流動性の高い下部封止剤１８ａを塗布する。通常、下部封止剤１８ａは、ボンディングワイヤー１５と基板４および電気配線基板３との間の空間を十分に満たすために、その空間の体積よりも過剰に塗布する。そのため、過剰な下部封止剤１８ａがボンディングワイヤー１５の下から周囲に広がる。しかし、広がった下部封止剤１８ａは、接着剤１７の土手状部１７ｂによって堰き止められ、電気配線基板３の端縁部を伝って基板４の裏面（第２の面４ｂ）に回り込むことが抑えられる。 Next, a sealing agent 18 for sealing and protecting the electrical connection portion between the terminal 11 of the element substrate 2 and the lead 13a of the electrical wiring board 3 is provided. In the present embodiment, the sealant 18 is applied in two stages, the sealant to be applied first is referred to as a lower sealant 18a, and the sealant to be applied later is referred to as an upper sealant 18b. First, as shown in FIGS. 6A and 6B, a highly fluid lower sealant 18a is applied to the space between the bonding wire 15 and the substrate 4 and the electrical wiring substrate 3. Usually, the lower sealant 18a is applied in excess of the volume of the space in order to sufficiently fill the space between the bonding wire 15 and the substrate 4 and the electrical wiring board 3. Therefore, the excess lower sealing agent 18a spreads from under the bonding wire 15 to the periphery. However, the spread lower sealing agent 18a may be blocked by the bank-shaped portion 17b of the adhesive 17 and wrap around the back surface (second surface 4b) of the substrate 4 along the edge portion of the electrical wiring board 3. It can be suppressed.

次に、図７（ａ）、７（ｂ）に示すように、ボンディングワイヤー１５の上方、すなわち下部封止剤１８ａの上に上部封止剤１８ｂを塗布する。その後、下部封止剤１８ａと上部封止剤１８ｂを一括して加熱して硬化させる。この時、下部封止剤１８ａおよび上部封止剤１８ｂを局所的に加熱してもよいが、素子基板２および電気配線基板３を全体的に加熱してもよい。下部封止剤１８ａおよび上部封止剤１８ｂを硬化させることにより、ボンディングワイヤー１５を含む基板４の端子１１と電気配線基板３のリード１３ａとの電気接続部が封止されて保護され、腐食や断線が抑えられる。こうして素子基板２と電気配線基板３との結合体を形成する。この結合体を支持部材１に接合して、図１に示す液体吐出ヘッドの要部を形成する。 Next, as shown in FIGS. 7 (a) and 7 (b), the upper sealant 18b is applied above the bonding wire 15, that is, on the lower sealant 18a. Then, the lower sealant 18a and the upper sealant 18b are collectively heated and cured. At this time, the lower sealing agent 18a and the upper sealing agent 18b may be locally heated, but the element substrate 2 and the electrical wiring substrate 3 may be heated as a whole. By curing the lower sealant 18a and the upper sealant 18b, the electrical connection portion between the terminal 11 of the substrate 4 including the bonding wire 15 and the lead 13a of the electrical wiring board 3 is sealed and protected, and corrosion or corrosion occurs. Disconnection is suppressed. In this way, a coupling body of the element substrate 2 and the electrical wiring substrate 3 is formed. This coupling body is joined to the support member 1 to form a main part of the liquid discharge head shown in FIG.

以上説明したように、本実施形態の液体吐出ヘッドでは、接着剤からなる土手状部１７ｂが、ボンディングワイヤー１５を含む基板４の端子１１と電気配線基板３のリード１３ａとの電気接続部の周囲に設けられている。言い換えると、封止剤１８の、少なくとも電気配線基板３に接する部分は、土手状部１７ｂに少なくとも部分的に囲まれた領域内に位置している。ボンディングワイヤー１５の周囲に広がった封止剤１８（特に下部封止剤１８ａ）は、土手状部１７ｂに堰き止められる。従って、広がった封止剤１８が基板４の裏面（第２の面４ｂ）に回り込んで支持部材１に干渉して接合不良や液体の漏れを引き起こすことが抑えられる。この土手状部１７ｂは、基板４と電気配線基板３とを接合するために用いられる接着剤１７を利用して形成される。土手状部１７ｂを形成するための接着剤の塗布や硬化は、基板４と電気配線基板３とを接合する部分１７ａの塗布や硬化と同じ工程において行うことができる。従って、封止剤１８を堰き止めるための土手状部１７ｂの形成のために製造工程が煩雑になることはほとんどなく生産効率が良好で、製造コストはあまり上昇しない。 As described above, in the liquid discharge head of the present embodiment, the bank-shaped portion 17b made of an adhesive is around the electrical connection portion between the terminal 11 of the substrate 4 including the bonding wire 15 and the lead 13a of the electrical wiring board 3. It is provided in. In other words, the portion of the sealant 18 in contact with at least the electrical wiring board 3 is located in a region at least partially surrounded by the bank-shaped portion 17b. The sealant 18 (particularly the lower sealant 18a) spread around the bonding wire 15 is dammed by the bank-shaped portion 17b. Therefore, it is possible to prevent the spread sealing agent 18 from wrapping around the back surface (second surface 4b) of the substrate 4 and interfering with the support member 1 to cause poor bonding or liquid leakage. The bank-shaped portion 17b is formed by using an adhesive 17 used for joining the substrate 4 and the electric wiring board 3. The application and curing of the adhesive for forming the bank-shaped portion 17b can be performed in the same process as the application and curing of the portion 17a that joins the substrate 4 and the electrical wiring substrate 3. Therefore, the production process is hardly complicated due to the formation of the embankment-like portion 17b for blocking the sealant 18, the production efficiency is good, and the production cost does not increase so much.

接着剤からなる土手状部１７ｂは、電気接続部から電気配線基板３の端縁部に向かって広がる下部封止剤１８ａを堰き止めて基板４の第２の面４ｂへの回り込みを抑制できる高さを有する必要がある。下部封止剤１８ａは、ボンディングワイヤー１５と電気配線基板３との間の空間を隙間なく確実に満たすために、その空間の体積よりも過剰に塗布される。そして、過剰に塗布された下部封止剤１８ａの一部が周囲に広がる。広がる下部封止剤１８ａの量は、下部封止剤１８ａの塗布量のばらつきや粘度の経時変化や、素子基板２や電気配線基板３等の製造公差や加工のばらつきに伴うボンディングワイヤー１５と電気配線基板３との間の空間の体積のばらつき等に応じて決まる。このように広がる下部封止剤１８ａの量を考慮して、下部封止剤１８ａを堰き止めるための土手状部１７ｂの高さの下限値を設定することが好ましい。 The bank-shaped portion 17b made of an adhesive has a high height capable of blocking the lower sealing agent 18a spreading from the electrical connection portion toward the edge portion of the electrical wiring board 3 and suppressing the wraparound of the substrate 4 to the second surface 4b. Must have. The lower sealant 18a is applied in excess of the volume of the space in order to surely fill the space between the bonding wire 15 and the electric wiring board 3 without any gaps. Then, a part of the excessively applied lower sealing agent 18a spreads around. The amount of the lower sealing agent 18a that spreads is the bonding wire 15 and electricity due to variations in the coating amount of the lower sealing agent 18a, changes in viscosity over time, manufacturing tolerances of the element substrate 2 and the electrical wiring substrate 3, and variations in processing. It is determined according to the variation in the volume of the space between the wiring board 3 and the like. Considering the amount of the lower sealant 18a spreading in this way, it is preferable to set the lower limit of the height of the embankment-like portion 17b for blocking the lower sealant 18a.

土手状部１７ｂの高さは、基板４の端子１１と電気配線基板３のリード１３ａとを接続するボンディングワイヤー１５の湾曲部の頂点（ループトップ）以下の高さであることが望ましい。電気絶縁の観点より、素子基板２の上面（第１の面５ａ）から封止剤１８の上面までの高さが規定されることが多く、また、流動性の低い上部封止剤１８ｂは、ボンディングワイヤー１５の湾曲部の頂点を基準として封止形状が決定される。土手状部１７ｂの高さがボンディングワイヤー１５の湾曲部の頂点（ループトップ）以下の高さであると、土手状部１７ｂの高さによらず、ループトップを基準として封止剤１８の上面位置が決定されるため、上部封止剤１８ｂの塗布制御が容易になる。また、素子基板２の上面（第１の面５ａ）から封止剤１８の上面までの高さの規定を満足しやすくなり高さ規定外の発生率の低減にもつながる。なお、土手状部１７ｂの先端部から、すなわち図４（ａ）の上方から見た平面における土手状部１７ｂの位置は、前述したように広がる下部封止剤１８ａの量を考慮して決定することが好ましい。 The height of the bank-shaped portion 17b is preferably a height equal to or lower than the apex (loop top) of the curved portion of the bonding wire 15 connecting the terminal 11 of the substrate 4 and the lead 13a of the electrical wiring board 3. From the viewpoint of electrical insulation, the height from the upper surface (first surface 5a) of the element substrate 2 to the upper surface of the encapsulant 18 is often defined, and the upper encapsulant 18b having low fluidity is used. The sealing shape is determined with reference to the apex of the curved portion of the bonding wire 15. When the height of the bank-shaped portion 17b is equal to or lower than the apex (loop top) of the curved portion of the bonding wire 15, the upper surface of the sealing agent 18 is referred to the loop top regardless of the height of the bank-shaped portion 17b. Since the position is determined, the coating control of the upper encapsulant 18b becomes easy. Further, the height regulation from the upper surface (first surface 5a) of the element substrate 2 to the upper surface of the encapsulant 18 can be easily satisfied, which leads to a reduction in the occurrence rate of non-high height regulation. The position of the bank-shaped portion 17b from the tip of the bank-shaped portion 17b, that is, the position of the bank-shaped portion 17b on the plane seen from above in FIG. 4A is determined in consideration of the amount of the lower sealing agent 18a spreading as described above. Is preferable.

［第２の実施形態］
次に本発明の第２の実施形態について説明する。図８は、本発明の第２の実施形態の液体吐出ヘッドの要部を示す、図９のＡ－Ａ線の位置で切断した概略断面図である。図９は、本実施形態の液体吐出ヘッドの電気配線基板３の要部を示す概略平面図である。本実施形態では、電気配線基板３への接着剤１７の塗布位置および形状が、第１の実施形態と異なる。その点について以下に説明し、それ以外の構成や方法については、第１の実施形態と同様であるので説明を省略する。 [Second Embodiment]
Next, a second embodiment of the present invention will be described. FIG. 8 is a schematic cross-sectional view taken along the line AA of FIG. 9, showing a main part of the liquid discharge head according to the second embodiment of the present invention. FIG. 9 is a schematic plan view showing a main part of the electric wiring board 3 of the liquid discharge head of the present embodiment. In the present embodiment, the coating position and shape of the adhesive 17 on the electric wiring board 3 are different from those in the first embodiment. This point will be described below, and the other configurations and methods are the same as those in the first embodiment, and thus the description thereof will be omitted.

第１の実施形態では、図４（ｂ）に示すように、接着剤１７は、電気配線基板３の一端部の、カバーフィルム１４で覆われずベースフィルム１２が露出している部分の外周に沿う箇所のうち、カバーフィルム１４の端面に沿う箇所を除く箇所に形成されている。すなわち、第１の実施形態の接着剤１７の、電気配線基板３と基板４との接合方向に見た平面形状、すなわち図４（ａ）の上方から見た平面形状は、矩形を構成する辺のうちの１辺を除く３辺からなるコ字状である。 In the first embodiment, as shown in FIG. 4B, the adhesive 17 is applied to the outer periphery of one end of the electrical wiring board 3 where the base film 12 is exposed without being covered by the cover film 14. It is formed at a portion along the portion other than the portion along the end surface of the cover film 14. That is, the planar shape of the adhesive 17 of the first embodiment seen in the joining direction between the electrical wiring substrate 3 and the substrate 4, that is, the planar shape seen from above in FIG. 4A is a side forming a rectangle. It is a U-shape consisting of three sides excluding one side.

第２の実施形態では、図９に示すように、接着剤１７は、電気配線基板３の一端部の、カバーフィルム１４で覆われずベースフィルム１２が露出している部分の外周に沿う箇所の、カバーフィルム１４の端面に沿う箇所を含めて全体に形成している。すなわち、第２の実施形態の接着剤１７の、電気配線基板３と基板４との接合方向に見た平面形状、すなわち図８の上方から見た平面形状は矩形状（ロ字状）である。本実施形態では、封止剤１８の塗布領域が全方向において土手状部１７ｂまたは基板４の側面に囲まれているため堰き止められる封止剤１８の量が多く、粘度の経時変化に伴う塗布量のばらつきの影響を受けにくく、封止剤１８の周囲への広がりをより抑制できる。 In the second embodiment, as shown in FIG. 9, the adhesive 17 is located at one end of the electrical wiring board 3 along the outer periphery of the portion not covered by the cover film 14 and where the base film 12 is exposed. , The cover film 14 is formed as a whole including a portion along the end face. That is, the planar shape of the adhesive 17 of the second embodiment seen in the joining direction between the electric wiring board 3 and the substrate 4, that is, the planar shape seen from above in FIG. 8 is rectangular (square). .. In the present embodiment, since the coating area of the sealing agent 18 is surrounded by the bank-shaped portion 17b or the side surface of the substrate 4 in all directions, the amount of the sealing agent 18 that can be blocked is large, and the coating agent 18 is applied as the viscosity changes with time. It is not easily affected by the variation in the amount, and the spread of the sealant 18 to the periphery can be further suppressed.

本実施形態の土手状部１７ｂは、全ての箇所において一定の高さ（４００［μｍ］程度）と、一定の幅（２００［μｍ］程度）を有している。ただし、土手状部１７ｂの高さをすべて一定にする必要はなく、図示しないが、基板４と対向する位置において他の部分よりも低くして接着剤１７の使用量を削減した構成にすることもできる。 The embankment-shaped portion 17b of the present embodiment has a constant height (about 400 [μm]) and a constant width (about 200 [μm]) at all points. However, it is not necessary to make all the heights of the bank-shaped portions 17b constant, and although not shown, the height is set to be lower than the other portions at the position facing the substrate 4 to reduce the amount of the adhesive 17 used. You can also.

２ 素子基板
３ 電気配線基板
１１ 端子
１３ａ リード
１７ 接着剤
１７ｂ 土手状部
１８ 封止剤 2 Element board 3 Electrical wiring board 11 Terminal 13a Lead 17 Adhesive 17b Bank-shaped part 18 Encapsulant

Claims (14)

素子基板と、前記素子基板に部分的に接合された電気配線基板とを有し、
前記素子基板の端子と前記電気配線基板のリードとが電気接続されており、前記端子と前記リードとの電気接続部が封止剤によって封止されており、
接着剤によって前記素子基板と前記電気配線基板とが互いに接合されるとともに、前記接着剤によって前記封止剤の周囲に土手状部が形成されていることを特徴とする液体吐出ヘッド。 It has an element substrate and an electrical wiring board partially bonded to the element substrate.
The terminal of the element board and the lead of the electric wiring board are electrically connected, and the electric connection portion between the terminal and the lead is sealed with a sealant.
A liquid discharge head characterized in that the element substrate and the electric wiring board are bonded to each other by an adhesive, and a bank-shaped portion is formed around the sealant by the adhesive. 前記土手状部の前記電気配線基板からの高さは、前記素子基板と前記電気配線基板とを接合する箇所の接着剤の高さよりも高い、請求項１に記載の液体吐出ヘッド。 The liquid discharge head according to claim 1, wherein the height of the bank-shaped portion from the electric wiring board is higher than the height of the adhesive at the portion where the element board and the electric wiring board are joined. 前記端子と前記リードとはワイヤーを介して電気接続され、前記土手状部の前記電気配線基板からの高さは、前記ワイヤーの湾曲部の頂点の前記電気配線基板からの高さ以下である、請求項１または２に記載の液体吐出ヘッド。 The terminal and the lead are electrically connected via a wire, and the height of the bank-shaped portion from the electric wiring board is equal to or less than the height of the apex of the curved portion of the wire from the electric wiring board. The liquid discharge head according to claim 1 or 2. 前記電気配線基板は、ベースフィルムと、前記ベースフィルムに設けられた配線と、前記ベースフィルムおよび前記配線を部分的に覆うカバーフィルムとを有するフレキシブルプリント基板であり、前記配線の前記カバーフィルムで覆われていない部分が前記リードを構成し、
前記接着剤は、前記ベースフィルムの前記カバーフィルムで覆われていない部分であって前記リードに重ならない位置に設けられている、請求項１から３のいずれか１項に記載の液体吐出ヘッド。 The electrical wiring board is a flexible printed circuit board having a base film, wiring provided on the base film, and a cover film that partially covers the base film and the wiring, and is covered with the cover film of the wiring. The unbroken part constitutes the lead,
The liquid discharge head according to any one of claims 1 to 3, wherein the adhesive is a portion of the base film that is not covered with the cover film and is provided at a position that does not overlap the leads. 前記接着剤は、前記ベースフィルムの前記カバーフィルムで覆われていない部分の外周に沿って形成されている、請求項４に記載の液体吐出ヘッド。 The liquid discharge head according to claim 4, wherein the adhesive is formed along the outer periphery of a portion of the base film that is not covered with the cover film. 前記接着剤は、前記電気配線基板と前記基板との接合方向に見た平面形状が矩形状である、請求項５に記載の液体吐出ヘッド。 The liquid discharge head according to claim 5, wherein the adhesive has a rectangular planar shape when viewed in the joining direction between the electrical wiring board and the board. 前記接着剤は、前記ベースフィルムの前記カバーフィルムで覆われていない部分の外周に沿う箇所のうち、前記カバーフィルムの端面に沿う箇所を除く箇所に形成されている、請求項４に記載の液体吐出ヘッド。 The liquid according to claim 4, wherein the adhesive is formed at a portion along the outer periphery of a portion of the base film that is not covered with the cover film, except for a portion along the end face of the cover film. Discharge head. 前記接着剤は、前記電気配線基板と前記基板との接合方向に見た平面形状が、矩形を構成する辺のうちの１辺を除く３辺からなる、請求項７に記載の液体吐出ヘッド。 The liquid discharge head according to claim 7, wherein the adhesive has a planar shape seen in the joining direction between the electrical wiring board and the board, which is composed of three sides excluding one of the sides constituting the rectangle. 前記封止剤の前記電気配線基板に接する部分は、前記土手状部に少なくとも部分的に囲まれた領域内に位置している、請求項１から８のいずれか１項に記載の液体吐出ヘッド。 The liquid discharge head according to any one of claims 1 to 8, wherein the portion of the sealant in contact with the electrical wiring board is located in a region at least partially surrounded by the bank-shaped portion. .. 素子基板または電気配線基板に接着剤を塗布する工程と、前記素子基板と前記電気配線基板とを部分的に重なり合うように接合する工程と、前記素子基板の端子と前記電気配線基板のリードとを電気接続する工程と、前記端子と前記リードとの電気接続部を封止剤によって封止する工程と、を含み、
前記素子基板と前記電気配線基板とを接合する工程では、前記接着剤の一部によって、前記素子基板と前記電気配線基板とを接合し、
前記電気接続部を封止剤によって封止する工程よりも前に、前記封止する工程で前記封止剤が塗布される領域の周囲に、前記接着剤の他の部分によって土手状部を形成することを特徴とする、液体吐出ヘッドの製造方法。 The step of applying an adhesive to the element board or the electric wiring board, the step of joining the element board and the electric wiring board so as to partially overlap, and the terminal of the element board and the lead of the electric wiring board. It includes a step of electrically connecting and a step of sealing the electrical connection portion between the terminal and the lead with a sealant.
In the step of joining the element substrate and the electric wiring board, the element substrate and the electric wiring board are joined by a part of the adhesive.
Prior to the step of sealing the electrical connection portion with the sealant, a bank-like portion is formed by other parts of the adhesive around the region to which the sealant is applied in the sealing step. A method for manufacturing a liquid discharge head. 前記土手状部の前記電気配線基板からの高さは、前記素子基板と前記電気配線基板とを接合する箇所の接着剤の高さよりも高い、請求項１０に記載の液体吐出ヘッドの製造方法。 The method for manufacturing a liquid discharge head according to claim 10, wherein the height of the bank-shaped portion from the electric wiring board is higher than the height of the adhesive at the portion where the element board and the electric wiring board are joined. 前記土手状部になる部分に対する接着剤の塗布と、前記素子基板と前記電気配線基板とを接合する箇所に対する接着剤の塗布とで、塗布速度と塗布圧力の一方または両方を異ならせることによって、前記土手状部の前記電気配線基板からの高さを、前記素子基板と前記電気配線基板とを接合する箇所の接着剤の高さよりも高くする、請求項１１に記載の液体吐出ヘッドの製造方法。 By applying the adhesive to the portion to be the bank-like portion and applying the adhesive to the portion where the element substrate and the electric wiring board are joined, one or both of the coating speed and the coating pressure are made different. The method for manufacturing a liquid discharge head according to claim 11, wherein the height of the bank-shaped portion from the electric wiring board is made higher than the height of the adhesive at the portion where the element board and the electric wiring board are joined. .. 前記土手状部になる部分に対して接着剤の塗布を複数回繰り返すことによって、前記土手状部の前記電気配線基板からの高さを、前記素子基板と前記電気配線基板とを接合する箇所の接着剤の高さよりも高くする、請求項１１に記載の液体吐出ヘッドの製造方法。 By repeating the application of the adhesive to the embankment-like portion a plurality of times, the height of the embankment-like portion from the electric wiring board can be adjusted to the height of the portion where the element substrate and the electric wiring board are joined. The method for manufacturing a liquid discharge head according to claim 11, wherein the height is higher than the height of the adhesive. 前記端子と前記リードとをワイヤーを介して電気接続し、
前記ワイヤーの下方に位置する下部封止剤と、前記ワイヤーの上方に位置する上部封止剤とによって、前記電気接続部を封止する、請求項１０から１３のいずれか１項に記載の液体吐出ヘッドの製造方法。 The terminal and the lead are electrically connected via a wire, and the terminal is electrically connected.
The liquid according to any one of claims 10 to 13, wherein the electrical connection portion is sealed by the lower sealant located below the wire and the upper sealant located above the wire. How to manufacture the discharge head.

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