JP7274807B1 - LASER PROCESSING DEVICE, LASER PROCESSING METHOD AND PROGRAM - Google Patents

LASER PROCESSING DEVICE, LASER PROCESSING METHOD AND PROGRAM Download PDF

Info

Publication number
JP7274807B1
JP7274807B1 JP2023507390A JP2023507390A JP7274807B1 JP 7274807 B1 JP7274807 B1 JP 7274807B1 JP 2023507390 A JP2023507390 A JP 2023507390A JP 2023507390 A JP2023507390 A JP 2023507390A JP 7274807 B1 JP7274807 B1 JP 7274807B1
Authority
JP
Japan
Prior art keywords
target
optical path
laser
virtual
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023507390A
Other languages
Japanese (ja)
Inventor
文広 糸魚川
覚 前川
修 近田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nagoya Institute of Technology NUC
Original Assignee
Nagoya Institute of Technology NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagoya Institute of Technology NUC filed Critical Nagoya Institute of Technology NUC
Application granted granted Critical
Publication of JP7274807B1 publication Critical patent/JP7274807B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Laser Beam Processing (AREA)

Abstract

光源から照射されるレーザを加工対象物の加工面へと導く導光部と、前記導光部に導かれるレーザの光路を、その光軸が母線となり、かつ、前記加工面と重なる光軸上の位置を頂点とする仮想円錐の円錐面に沿って、その軸線周りに変位させる光路変位部、および、前記加工対象物を、前記仮想円錐の軸線と交差する対象平面に沿って変位させる対象変位部、による変位をそれぞれ制御する制御部と、を備え、前記制御部は、対象開始位置から、前記仮想円錐の頂点を中心に前記対象円弧と同じ半径で描かれる仮想円の円周に沿って、対象終了位置に到達するまで、前記対象変位部に前記加工対象物を所定の対象角速度で変位させる対象制御と、光路開始位置から、前記仮想円錐の軸線周りに、光路終了位置に到達するまで、前記光路変位部にレーザの光路を前記対象角速度と同じ光路角速度で変位させる光路制御と、を同時に実施することで前記加工対象物に前記加工面を形成する、レーザ加工装置。A light guide section for guiding a laser emitted from a light source to a processing surface of an object to be processed; An optical path displacement unit that displaces the object around its axis along a conical surface of a virtual cone whose vertex is the position of, and a target displacement that displaces the workpiece along a target plane that intersects the axis of the virtual cone along the circumference of a virtual circle drawn with the same radius as the target arc from the target start position, centering on the vertex of the virtual cone , a target control for displacing the workpiece at the target displacement portion at a predetermined target angular velocity until the target end position is reached; and from the optical path start position to the optical path end position around the axis of the virtual cone. and an optical path control for displacing the optical path of the laser at the optical path displacement portion at the same optical path angular velocity as the target angular velocity, thereby forming the machining surface on the object to be processed.

Description

本発明は、レーザによる加工を行うレーザ加工装置に関する。 The present invention relates to a laser processing apparatus that performs laser processing.

近年、レーザの光軸方向に延びる円筒状の照射領域を、その光軸と交差する方向へ変位させることにより、この照射領域が通過する加工対象物の表面側に加工面を形成する技術が提案されている（特許文献１）。この加工方法は、機械的な加工方法に比べて機械的損傷を減らし滑らかに加工面を形成できるという点で優れた加工方法である。 In recent years, a technique has been proposed in which a cylindrical irradiation area extending in the direction of the optical axis of a laser is displaced in a direction that intersects the optical axis, thereby forming a processing surface on the surface side of the workpiece through which the irradiation area passes. (Patent Document 1). This processing method is an excellent processing method in that mechanical damage can be reduced and a smooth processed surface can be formed as compared with a mechanical processing method.

特許６５６２５３６号公報Japanese Patent No. 6562536

この種の加工方法は、例えば、すくい面および逃げ面で形成された角部を有する切削工具のように、それぞれ隣接する２つの端面で形成された角部を有する加工対象物における角部の再生、といった用途でも用いられている。具体的には、すくい面または逃げ面の拡がる方向に沿って光軸が延びるようにレーザを照射させ、このレーザを変位させることによって、角部に新たなすくい面または逃げ面を形成することができる。 This type of machining method is used for corner regeneration in workpieces having corners formed by two adjacent end faces, such as cutting tools having corners formed by rake faces and flank faces. It is also used for purposes such as Specifically, a laser is irradiated so that the optical axis extends along the direction in which the rake face or flank face expands, and by displacing the laser, a new rake face or flank face can be formed at the corner. can.

ただ、このレーザによる加工が必ずしも現実的とはいえない加工対象物も存在する。例えば、ボールエンドミルのように、円錐台を軸線周りに所定の角度範囲だけ切り取った形状における円錐台面および底面のなす角部が形成されたものである。この角部では、一方の面（逃げ面）が円錐台面に沿った複雑な曲面形状をなしている。 However, there are objects to be processed for which this laser processing is not necessarily realistic. For example, like a ball end mill, a corner formed by a truncated cone surface and a bottom surface in a shape obtained by cutting a truncated cone by a predetermined angle range around the axis is formed. At this corner, one face (flank face) has a complicated curved shape along the truncated cone face.

このように、角部が複雑な曲面形状の面を有していると、レーザの光軸や加工対象物を複雑に変位させなければ適切に加工面を形成できず、そのために多軸化が必要になるなど装置構成や制御が著しく複雑になってしまう。このようなことから、複雑な曲面形状の加工面に対しては、レーザによる加工が必ずしも現実的ではないという課題があった。 In this way, if the corner has a complicated curved surface shape, the machined surface cannot be properly formed unless the optical axis of the laser and the object to be machined are displaced in a complicated manner. The configuration and control of the device become extremely complicated, such as the need for such a device. For this reason, there has been a problem that laser processing is not always practical for a complicated curved surface to be processed.

本開示はこのような課題を解決するためになされたものであり、その目的は、複雑な曲面形状の加工面であっても、装置構成や制御の複雑化を抑えつつ、レーザによる加工を実現できるようにすることである。 The present disclosure has been made to solve such problems, and the purpose is to realize laser processing while suppressing the complication of the device configuration and control even for a processing surface with a complicated curved surface shape. is to make it possible.

上記課題を解決するため第１局面は、光源から照射されるレーザを加工対象物の加工面へと導く導光部と、前記導光部に導かれるレーザの光路を、その光軸が母線となり、かつ、前記加工面と重なる光軸上の位置を頂点とする仮想円錐の円錐面に沿って、その軸線周りに変位させる光路変位部、および、前記加工対象物を、前記仮想円錐の軸線と交差する対象平面に沿って変位させる対象変位部、による変位をそれぞれ制御する制御部と、を備え、前記対象平面に沿って底面が拡がる仮想円錐台をその軸線周りに所定の角度範囲だけ切り取った形状における円錐台面を、前記加工面として形成する場合において、前記制御部は、前記対象平面上で、前記加工面が前記仮想円錐台の底面周りになす対象円弧の一端が前記仮想円錐の頂点となる対象開始位置から、前記仮想円錐の頂点を中心に前記対象円弧と同じ半径で描かれる仮想円の円周に沿って、前記対象円弧の他端側が前記仮想円錐の頂点と重なる対象終了位置に到達するまで、前記対象変位部に前記加工対象物を所定の対象角速度で変位させる対象制御と、前記対象平面視で、レーザの光軸が、前記対象開始位置にある前記対象円弧の中心と前記仮想円錐の頂点とをつなぐ線分の延びる方向に沿う光路開始位置から、前記仮想円錐の軸線周りに、前記対象終了位置にある前記対象円弧の中心と前記仮想円錐の頂点とをつなぐ線分の延びる方向に沿う光路終了位置に到達するまで、前記光路変位部にレーザの光路を前記対象角速度と同じ光路角速度で変位させる光路制御と、を同時に実施することで前記加工対象物にレーザによる前記加工面を形成する、レーザ加工装置である。 In order to solve the above problems, the first aspect is to provide a light guide section for guiding a laser beam emitted from a light source to a processing surface of an object to be processed, and an optical path of the laser guided to the light guide section, the optical axis of which serves as a generatrix. and an optical path displacement unit that displaces the object along the axis of a virtual cone whose apex is the position on the optical axis that overlaps the processing surface, and the object to be processed is the axis of the virtual cone. and a control unit for controlling displacement by an object displacement part that is displaced along an intersecting object plane, and a virtual truncated cone whose bottom surface expands along the object plane is cut out by a predetermined angle range around its axis. In the case of forming a truncated cone surface in a shape as the processing surface, the control unit determines that one end of a symmetric arc formed by the processing surface around the bottom surface of the virtual truncated cone on the target plane is the vertex of the virtual cone. From the target start position to the target end position where the other end side of the target arc overlaps the apex of the virtual cone along the circumference of the virtual circle drawn with the same radius as the target arc centered on the apex of the virtual cone object control for displacing the object to be processed at a predetermined object angular velocity until it reaches the object displacement portion; A line segment that connects the center of the target arc at the target end position and the apex of the virtual cone around the axis of the virtual cone from the optical path start position along the extending direction of the line segment that connects the apex of the virtual cone. and simultaneously performing optical path control for displacing the optical path of the laser at the same optical path angular velocity as the target angular velocity until the optical path end position along the extending direction is reached. A laser processing device for forming a surface.

また、この局面においては、以下に示す第２局面のようにしてもよい。
第２局面において、前記制御部は、前記仮想円錐台における円錐台面と天面との境界稜線と重なる光軸上の位置を前記仮想円錐の頂点として、前記光路変位部にレーザの光路を変位させる。Further, in this aspect, the following second aspect may be adopted.
In the second aspect, the control unit displaces the optical path of the laser to the optical path displacement unit, with a position on the optical axis that overlaps a boundary ridge between the truncated cone surface and the top surface of the virtual truncated cone as the apex of the virtual cone. .

また、上記各局面においては、以下に示す第３局面のようにしてもよい。
第３局面において、前記導光部は、光源から照射されるレーザが透過する筒状領域内で、該筒状領域の軸線と同軸かつ軸線方向に間隔を空けて配置された一対のウェッジプレートと、前記ウェッジプレートよりもレーザの光路下流側で、前記筒状領域の軸線と同軸に配置され、前記ウェッジプレート透過後のレーザを前記加工面に向けて屈折させるレンズと、前記ウェッジプレートを前記筒状領域の軸線周りに回転させることで、前記ウェッジプレート透過後のレーザを周方向に走査させる回転機構と、を備え、前記光路変位部は、前記回転機構に前記ウェッジプレートを回転させることにより、前記導光部に導かれるレーザの光路を、前記仮想円錐の円錐面に沿って変位させる。Moreover, in each of the above aspects, a third aspect shown below may be used.
In the third aspect, the light guide section includes a pair of wedge plates arranged coaxially with the axis of the cylindrical region and spaced apart in the axial direction within the cylindrical region through which the laser emitted from the light source is transmitted. a lens arranged coaxially with the axis of the cylindrical region on the downstream side of the optical path of the laser from the wedge plate and refracting the laser beam after passing through the wedge plate toward the processing surface; a rotating mechanism that rotates the laser after passing through the wedge plate in the circumferential direction by rotating the wedge plate around the axis of the shaped region, and the optical path displacement unit causes the rotating mechanism to rotate the wedge plate, The optical path of the laser guided to the light guide section is displaced along the conical surface of the virtual cone.

上記局面のレーザ加工装置では、レーザの光路を仮想円錐の円錐面に沿って変位させつつ、加工対象物を仮想円の円周に沿って変位させる。これによって、レーザは、加工対象物における仮想円錐台の母線に沿った状態で、その円錐台面上を軸線周りに相対変位するため、仮想円錐台の円錐台面に沿った加工面が加工対象物に形成される。こうして、円錐台面のような複雑な曲面形状の端面を加工面として形成することができる。 In the laser processing apparatus of the above aspect, the object to be processed is displaced along the circumference of the virtual circle while displacing the optical path of the laser along the conical surface of the virtual cone. As a result, the laser is relatively displaced around the axis on the truncated cone surface in a state along the generatrix of the virtual truncated cone on the object to be processed, so that the machining surface along the truncated cone surface of the virtual truncated cone is on the object to be processed. It is formed. In this way, a complicated curved end face such as a truncated cone can be formed as a machined face.

ここで、加工対象物に対するレーザの相対変位は、光路変位部および対象変位部に対する２軸制御によって実現できるため、複雑な曲面形状の加工面であっても、それ以上の多軸化および複雑な制御を要することなく、レーザによる加工を実現することができる。 Here, since the relative displacement of the laser with respect to the object to be processed can be realized by two-axis control of the optical path displacement portion and the object displacement portion, even if the processing surface has a complicated curved surface shape, it can be multi-axis and complicated. Laser processing can be realized without requiring control.

本開示の一実施形態におけるレーザ加工装置の装置構成を示すブロック図Block diagram showing the device configuration of a laser processing device according to an embodiment of the present disclosure 本開示の一実施形態における加工対象物の先端形状を示す正面図FIG. 4 is a front view showing the tip shape of the object to be processed according to the embodiment of the present disclosure; 本開示の一実施形態における導光部の構成を示す要部断面図Principal part sectional drawing which shows the structure of the light guide part in one Embodiment of this indication 本開示の一実施形態における加工対象物およびレーザの光路が変位する様子を示す正面図（ａ）および右側面図（ｂ）FIG. 4A is a front view (a) and a right side view (b) showing how the workpiece and the optical path of the laser are displaced according to the embodiment of the present disclosure; 本開示の一実施形態における加工処理の処理手順を示すフローチャートFlowchart showing a processing procedure of processing in one embodiment of the present disclosure 本開示の一実施形態における加工対象物およびレーザの光路が変位する様子を示す正面図FIG. 4 is a front view showing how the workpiece and the optical path of the laser are displaced according to the embodiment of the present disclosure;

以下に本発明を実施するための形態を、図面を参照して詳細に説明する。
（１）全体構成Embodiments for carrying out the present invention will be described in detail below with reference to the drawings.
(1) Overall structure

レーザ加工装置１は、図１に示すように、レーザを出力する光源１０と、加工対象物１００を保持する保持部２０と、光源１０から照射されるレーザを加工対象物１００の加工面１１１へと導く導光部３０と、導光部３０に導かれるレーザの光路を変位させる光路変位部４０と、加工対象物１００を変位させる対象変位部５０、レーザ加工装置１全体の動作を制御する制御部６０と、を備える。 As shown in FIG. 1, the laser processing apparatus 1 includes a light source 10 that outputs a laser beam, a holding unit 20 that holds an object 100 to be processed, and a laser beam emitted from the light source 10 onto a processing surface 111 of the object 100 to be processed. A light guide section 30 that guides the light, an optical path displacement section 40 that displaces the optical path of the laser guided to the light guide section 30, a target displacement section 50 that displaces the workpiece 100, and a control that controls the operation of the entire laser processing apparatus 1 a portion 60;

本実施形態において、加工対象物１００は、図２に示すように、棒状に延びる部材の先端側（本実施形態では下端側）に複数の角部１１０が形成されたボールエンドミルである。角部１１０は、それぞれが仮想円錐台を軸線周りに所定の角度範囲（具体的には９０度の範囲）だけ切り取った形状における円錐台面および底面で構成された刃であり、一方の面（逃げ面）が円錐台面に沿った曲面形状をなしている。 In this embodiment, as shown in FIG. 2, the workpiece 100 is a ball end mill in which a plurality of corners 110 are formed on the tip side (lower end side in this embodiment) of a member extending like a bar. The corner portion 110 is a blade composed of a truncated cone surface and a bottom surface in a shape obtained by cutting a virtual truncated cone by a predetermined angle range (specifically, a range of 90 degrees) around the axis. surface) has a curved shape along the truncated cone surface.

光源１０は、パルスレーザを出力するレーザ発振器、レーザの振動数の次数を調整する振動調整器、レーザの出力を調整するアッテネータ、レーザの径を調整するためのビームエキスパンダーなどを備え、これらを経たレーザが光学レンズ経由で出力されるように構成されている。これらのうち、レーザ発振器にはＮｄ：ＹＡＧパルスレーザが用いられている。 The light source 10 includes a laser oscillator that outputs a pulse laser, a vibration regulator that adjusts the order of the laser frequency, an attenuator that adjusts the laser output, a beam expander that adjusts the diameter of the laser, and the like. A laser is configured to output through the optical lens. Among these, an Nd:YAG pulse laser is used as the laser oscillator.

保持部２０は、加工対象物１００を、その先端が下方に位置し、角部における他方の面（すくい面）が後述する対象平面に沿う向きで保持する。 The holding part 20 holds the workpiece 100 with the tip positioned downward and the other face (rake face) of the corner portion oriented along the target plane described later.

導光部３０は、図３に示すように、光源１０から照射されるレーザが透過する筒状領域を包囲する筒状の本体部３１、筒状領域内で本体部３１の軸線３３と同軸かつ軸線３３方向に間隔を空けて配置された一対のウェッジプレート３５、３７、光路下流側のウェッジプレート３７よりもさらに光路下流側に配置されたレンズ３９を備える。 As shown in FIG. 3, the light guide portion 30 includes a cylindrical body portion 31 surrounding a cylindrical region through which the laser emitted from the light source 10 is transmitted, and coaxial with an axis 33 of the body portion 31 within the cylindrical region. A pair of wedge plates 35 and 37 are spaced apart in the direction of the axis 33, and a lens 39 is provided downstream of the wedge plate 37 on the downstream side of the optical path.

これらのうち、ウェッジプレート３５、３７は、光路下流側のウェッジプレート３７を軸線３３方向に沿った任意の位置に変位可能に構成されており（同図矢印参照）、これにより、一対のウェッジプレート３５、３７の間隔を任意に変更することができる。本実施形態では、一対のウェッジプレート３５、３７の間隔が広くなるほど、レーザの透過する位置が軸線３３から径方向に遠くなる。 Of these, the wedge plates 35 and 37 are configured such that the wedge plate 37 on the downstream side of the optical path can be displaced to any position along the direction of the axis 33 (see the arrow in the figure). The interval between 35 and 37 can be changed arbitrarily. In the present embodiment, the wider the distance between the pair of wedge plates 35 and 37, the farther away the laser is transmitted from the axis 33 in the radial direction.

また、レンズ３９は、本体部３１の軸線３３と同軸に配置され、ウェッジプレート３５、３７透過後のレーザを加工対象物１００の加工面１１１に向けて屈折させる光学レンズである。 The lens 39 is an optical lens that is arranged coaxially with the axis 33 of the main body 31 and refracts the laser after passing through the wedge plates 35 and 37 toward the processing surface 111 of the object 100 to be processed.

光路変位部４０は、制御部６０からの指令を受けて本体部３１を軸線３３周りに回転させるアクチュエータであり、この回転に伴って本体部３１内に配置されたウェッジプレート３５、３７を軸線３３周りに回転させる。 The optical path displacement unit 40 is an actuator that receives a command from the control unit 60 and rotates the main body 31 around the axis 33 . Rotate around.

ここで、ウェッジプレート３５、３７を回転させることは、ウェッジプレート３５、３７透過後のレーザをその光軸と交差する平面上で周方向に走査させることを意味する。こうして、ウェッジプレート３５、３７を透過したレーザは、さらにレンズ３９を透過することで、光軸の軸線３３に対する径方向の位置に応じた角度で屈折する。 Here, rotating the wedge plates 35 and 37 means scanning the laser after passing through the wedge plates 35 and 37 in the circumferential direction on a plane intersecting the optical axis thereof. Thus, the laser transmitted through the wedge plates 35 and 37 is further transmitted through the lens 39 and refracted at an angle corresponding to the radial position of the optical axis with respect to the axis 33 .

これによって、レーザは、図４に示すように、その光軸を母線としかつ加工面１１１と重なる光軸上の位置を頂点２１０とする仮想円錐２００の円錐面２２０に沿って、その軸線２３０周りに変位する（同図矢印ａ参照）。 As a result, as shown in FIG. 4, the laser emits light along the conical surface 220 of a virtual cone 200 whose generatrix is the optical axis and whose apex 210 is the position on the optical axis that overlaps the processing surface 111, and around the axis 230. (see arrow a in the figure).

対象変位部５０は、保持部２０を仮想円錐２００の軸線２３０と直交する対象平面（図４（ａ）参照）に沿って変位させるアクチュエータであり、この保持部２０を介してこれに保持される加工対象物１００を変位させる。 The target displacement section 50 is an actuator that displaces the holding section 20 along the target plane (see FIG. 4A) perpendicular to the axis 230 of the virtual cone 200, and is held by the holding section 20. The workpiece 100 is displaced.

（２）制御部６０による加工処理
続いて、制御部６０が内蔵メモリ６１に格納されたプログラムにより実行する加工処理を図５に基づいて説明する。この加工処理は、図示されないインタフェース（操作装置または通信装置） からの起動指令を受けた際に起動される。(2) Processing by Control Unit 60 Processing performed by the control unit 60 according to the program stored in the built-in memory 61 will now be described with reference to FIG. This processing is started when a start command is received from an interface (manipulation device or communication device) (not shown).

なお、本実施形態では、図２に示すように、加工対象物１００の角部１１０をなす一方の面（逃げ面）、つまり、仮想円錐台の円錐台面に沿った曲面形状を加工面１１１として形成する場合を例示する。 In this embodiment, as shown in FIG. 2, one surface (flank surface) forming the corner 110 of the workpiece 100, that is, a curved surface shape along the truncated cone surface of the virtual truncated cone is used as the machining surface 111. A case of forming is exemplified.

この加工処理が起動されると、まず、加工対象物１００が対象開始位置１００ｓに位置決めされる（ｓ１１０）。対象開始位置１００ｓは、図６に示すように、仮想円錐２００の軸線２３０と交差する対象平面上で、加工面１１１が仮想円錐台の底面周りになす対象円弧の一端１１３が仮想円錐２００の頂点２１０となる位置である。ここでは、レーザの光軸が仮想円錐台における円錐台面と天面との境界稜線と重なる位置が、仮想円錐２００の頂点２１０として設定されており（図３（ｂ）参照）、この設定に基づいて以降の処理が実行される。 When this machining process is started, first, the workpiece 100 is positioned at the target start position 100s (s110). As shown in FIG. 6, the target start position 100s is located on the target plane that intersects the axis 230 of the virtual cone 200, and one end 113 of the target arc formed by the machining surface 111 around the bottom surface of the virtual truncated cone is the vertex of the virtual cone 200. 210 is the position. Here, the position where the optical axis of the laser overlaps the boundary ridge between the truncated cone surface and the top surface of the virtual truncated cone is set as the vertex 210 of the virtual cone 200 (see FIG. 3B). and the subsequent processing is executed.

次に、加工対象物１００を変位させる対象制御と、レーザの光路を変位させる光路制御と、が同時に開始される（ｓ１２０）。 Next, object control for displacing the workpiece 100 and optical path control for displacing the optical path of the laser are started simultaneously (s120).

対象制御とは、図６に示すように、加工対象物１００を対象開始位置１００ｓから対象終了位置１００ｅに到達するまで変位させるための制御であり、対象変位部５０への指令により実施される。ここで、対象終了位置１００ｅは、対象平面上で対象円弧の他端１１５が仮想円錐２００の頂点２１０と重なる位置である。 The target control is control for displacing the workpiece 100 from the target start position 100s to the target end position 100e as shown in FIG. Here, the target end position 100e is a position where the other end 115 of the target arc overlaps with the vertex 210 of the virtual cone 200 on the target plane.

そして、対象開始位置１００ｓと対象終了位置１００ｅとの間は、仮想円錐２００の頂点２１０を中心に対象円弧と同じ半径で描かれる仮想円１２０の円周に沿って所定の対象角速度で変位するように、対象変位部５０が制御される（同図矢印ｂ参照）。 Between the target start position 100s and the target end position 100e, displacement is performed at a predetermined target angular velocity along the circumference of a virtual circle 120 drawn with the same radius as the target arc centering on the vertex 210 of the virtual cone 200. Then, the target displacement unit 50 is controlled (see arrow b in the figure).

他方、光路制御は、レーザの光路を光路開始位置３００ｓから光路終了位置３００ｅに到達するまで変位させるための制御であり、光路変位部４０への指令により実施される。ここで、光路開始位置３００ｓは、図６に示すように、レーザの光軸が、対象開始位置１００ｓにある対象円弧の中心１１７と仮想円錐２００の頂点２１０とをつなぐ線分の延びる方向に沿う位置である。また、光路終了位置３００ｅは、対象終了位置１００ｅにある対象円弧の中心１１７と仮想円錐２００の頂点２１０とをつなぐ線分の延びる方向に沿う位置である。 On the other hand, the optical path control is control for displacing the optical path of the laser from the optical path start position 300 s to the optical path end position 300 e , and is performed by a command to the optical path displacement section 40 . Here, as shown in FIG. 6, the optical path start position 300s is along the direction in which the laser optical axis extends along the line segment connecting the center 117 of the target arc at the target start position 100s and the vertex 210 of the virtual cone 200. position. Also, the optical path end position 300e is a position along the extending direction of the line segment connecting the center 117 of the target circular arc at the target end position 100e and the vertex 210 of the virtual cone 200 .

そして、光路開始位置３００ｓと光路終了位置３００ｅとの間は、仮想円錐２００の軸線２３０周りに対象角速度と同じ光路角速度で変位するように、光路変位部４０が制御される。 The optical path displacement section 40 is controlled such that the optical path angular velocity is the same as the target angular velocity between the optical path start position 300s and the optical path end position 300e around the axis 230 of the virtual cone 200 .

こうして、対象制御および光路制御が開始された以降、これら制御が終了するまで待機状態となり（ｓ１３０：ＮＯ）、終了したら（ｓ１３０：ＹＥＳ）、本加工処理が終了する。こうして対象制御と光路制御とを同時に実行することによって加工対象物１００へのレーザによる加工面１１１の形成が実現される。 Thus, after the object control and the optical path control are started, a standby state is set until these controls are finished (s130: NO), and when finished (s130: YES), this processing is finished. By executing the object control and the optical path control at the same time in this way, the formation of the processing surface 111 on the processing object 100 by the laser is realized.

（３）変形例
以上、本発明の実施の形態について説明したが、本発明は、上記実施形態に何ら限定されることはなく、本発明の技術的範囲に属する限り種々の形態をとり得ることはいうまでもない。(3) Modifications Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and can take various forms as long as they fall within the technical scope of the present invention. Needless to say.

例えば、上記実施形態では、導光部３０が、一対のウェッジプレート３５、３７およびレンズ３９により構成されたものを例示した。しかし、この導光部３０としては、レーザの光路を仮想円錐２００の円錐面２２０に沿ってその軸線２３０周りに変位させることができるものであれば上記構成に限られない。 For example, in the above-described embodiment, the light guide section 30 is configured by the pair of wedge plates 35 and 37 and the lens 39 . However, the light guide section 30 is not limited to the above configuration as long as it can displace the optical path of the laser along the conical surface 220 of the virtual cone 200 and around the axis 230 .

また、上記実施形態では、各構成要素を備えたものをレーザ加工装置１としているが、例えば、保持部２０と、光路変位部４０および対象変位部５０に相当するアクチュエータとを備える汎用的な工作機械に対し、光源１０、導光部３０および制御部６０（または当該工作機械の備える制御部に加工処理を実行させるためのプログラム）を搭載することによって、レーザ加工装置１を実現してもよい。 Further, in the above-described embodiment, the laser processing apparatus 1 is provided with each component. The laser processing apparatus 1 may be realized by installing the light source 10, the light guide section 30, and the control section 60 (or a program for causing the control section of the machine tool to perform processing) on the machine. .

また、上記実施形態では、レーザの光軸が仮想円錐台における円錐台面と天面との境界稜線と重なる位置が、仮想円錐２００の頂点２１０として設定される構成を例示した。しかし、仮想円錐２００の頂点２１０としては、加工面１１１において光路上流側の端部から下流側の端部に至る範囲における別の位置（例えば、光路上流側の端部）が設定される構成としてもよい。 Further, in the above-described embodiment, the position where the optical axis of the laser overlaps the boundary ridge between the truncated cone surface and the top surface of the virtual truncated cone is set as the vertex 210 of the virtual cone 200 . However, as the vertex 210 of the virtual cone 200, another position (for example, the upstream end of the optical path) in the range from the upstream end of the optical path to the downstream end of the processing surface 111 is set. good too.

（４）作用効果
上記実施形態に係るレーザ加工装置１では、レーザの光路を仮想円錐２００の円錐面２２０に沿って変位させつつ、加工対象物１００を仮想円１２０の円周に沿って変位させる。これによって、レーザは、加工対象物１００における仮想円錐台の母線に沿った状態で、その円錐台面上を軸線周りに相対変位するため、仮想円錐台の円錐台面に沿った加工面１１１が加工対象物１００に形成される。こうして、円錐台面のような複雑な曲面形状の端面を加工面１１１として形成することができる。(4) Effects In the laser processing apparatus 1 according to the above embodiment, while displacing the optical path of the laser along the conical surface 220 of the virtual cone 200, the workpiece 100 is displaced along the circumference of the virtual circle 120. . As a result, the laser is relatively displaced around the axis on the truncated cone surface in a state along the generatrix of the virtual truncated cone in the workpiece 100, so that the machining surface 111 along the truncated cone surface of the virtual truncated cone is the object to be processed. formed on the object 100 . In this way, a complicated curved end surface such as a truncated cone surface can be formed as the processed surface 111 .

ここで、加工対象物１００に対するレーザの相対変位は、光路変位部４０および対象変位部５０の２軸制御によって実現することができるため、複雑な曲面形状の加工面１１１であっても、それ以上の多軸化および制御を要することなく、レーザによる加工を実現することができる。 Here, since the relative displacement of the laser with respect to the workpiece 100 can be realized by the two-axis control of the optical path displacement section 40 and the target displacement section 50, even the processing surface 111 having a complicated curved surface shape can be displaced more than that. Laser processing can be realized without requiring multi-axis and control.

また、上記実施形態のレーザ加工装置１では、ウェッジプレート３５、３７透過後のレーザがレンズ３９により加工面１１１に向けて屈折するため、光源１０からのレーザをウェッジプレート３５、３７の回転により周方向に走査させることで、レーザの光路を仮想円錐２００の円錐面２２０に沿ってその軸線２３０周りに変位させることができる。 In addition, in the laser processing apparatus 1 of the above-described embodiment, the laser beam after passing through the wedge plates 35 and 37 is refracted toward the processing surface 111 by the lens 39. By scanning in a direction, the optical path of the laser can be displaced along the conical surface 220 of the virtual cone 200 and about its axis 230 .

また、上記実施形態において、汎用的な工作機械に光源１０、導光部３０および制御部６０を搭載することでレーザ加工装置１を実現した場合には、汎用的な工作機械に一部構成要素を搭載するだけで、上記実施形態のレーザ加工装置１を低コストで実現することができる。 Further, in the above embodiment, when the laser processing apparatus 1 is realized by mounting the light source 10, the light guide section 30, and the control section 60 on a general-purpose machine tool, part of the components of the general-purpose machine tool The laser processing apparatus 1 of the above-described embodiment can be realized at a low cost only by mounting the .

本開示のレーザ加工装置は、複雑な曲面形状の加工面であっても、装置構成や制御の複雑化を抑えつつ、レーザによる加工を実現できる。 The laser processing apparatus of the present disclosure can realize laser processing even for a complicated curved surface to be processed while suppressing complication of the apparatus configuration and control.

１…レーザ加工装置、１０…光源、２０…保持部、３０…導光部、３１…本体部、３３…軸線、３５…ウェッジプレート、３７…ウェッジプレート、３９…レンズ、４０…光路変位部、５０…対象変位部、６０…制御部、６１…内蔵メモリ、１００…加工対象物、１００ｅ…対象終了位置、１００ｓ…対象開始位置、１１０…角部、１１１…加工面、１１３…一端、１１５…他端、１１７…中心、１２０…仮想円、２００…仮想円錐、２１０…頂点、２２０…円錐面、２３０…軸線、３００ｅ…光路終了位置、３００ｓ…光路開始位置。 DESCRIPTION OF SYMBOLS 1... Laser processing apparatus, 10... Light source, 20... Holding part, 30... Light guide part, 31... Body part, 33... Axis, 35... Wedge plate, 37... Wedge plate, 39... Lens, 40... Optical path displacement part, 50... Object displacement part 60... Control part 61... Built-in memory 100... Object to be processed 100e... Object end position 100s... Object start position 110... Corner part 111... Machining surface 113... One end 115... Other end 117...Center 120...Virtual circle 200...Virtual cone 210...Vertex 220...Conical surface 230...Axis line 300e...Optical path end position 300s...Optical path start position.

Claims (5)

光源から照射されるレーザを加工対象物の加工面へと導く導光部と、
前記導光部に導かれるレーザの光路を、その光軸が母線となり、かつ、前記加工面と重なる光軸上の位置を頂点とする仮想円錐の円錐面に沿って、その軸線周りに変位させる光路変位部、および、前記加工対象物を、前記仮想円錐の軸線と交差する対象平面に沿って変位させる対象変位部、による変位をそれぞれ制御する制御部と、を備え、
前記対象平面に沿って底面が拡がる仮想円錐台をその軸線周りに所定の角度範囲だけ切り取った形状における円錐台面を、前記加工面として形成する場合において、
前記制御部は、
前記対象平面上で、前記加工面が前記仮想円錐台の底面周りになす対象円弧の一端が前記仮想円錐の頂点となる対象開始位置から、前記仮想円錐の頂点を中心に前記対象円弧と同じ半径で描かれる仮想円の円周に沿って、前記対象円弧の他端側が前記仮想円錐の頂点と重なる対象終了位置に到達するまで、前記対象変位部に前記加工対象物を所定の対象角速度で変位させる対象制御と、
前記対象平面視で、レーザの光軸が、前記対象開始位置にある前記対象円弧の中心と前記仮想円錐の頂点とをつなぐ線分の延びる方向に沿う光路開始位置から、前記仮想円錐の軸線周りに、前記対象終了位置にある前記対象円弧の中心と前記仮想円錐の頂点とをつなぐ線分の延びる方向に沿う光路終了位置に到達するまで、前記光路変位部にレーザの光路を前記対象角速度と同じ光路角速度で変位させる光路制御と、
を同時に実施することで前記加工対象物にレーザによる前記加工面を形成する、
レーザ加工装置。a light guide section that guides the laser emitted from the light source to the processing surface of the object;
The optical path of the laser guided to the light guide part is displaced around the axis along the conical surface of a virtual cone whose optical axis is the generatrix and whose vertex is the position on the optical axis that overlaps with the processing surface. a control unit that controls displacement by an optical path displacement unit and a target displacement unit that displaces the workpiece along a target plane that intersects the axis of the virtual cone,
When forming a truncated cone surface in a shape obtained by cutting a virtual truncated cone whose bottom surface extends along the target plane by a predetermined angle range around its axis as the processing surface,
The control unit
On the target plane, from the target start position where one end of the target arc formed by the machining surface around the bottom surface of the virtual truncated cone is the apex of the virtual cone, the same radius as the target arc centered on the apex of the virtual cone Displace the workpiece at a predetermined target angular velocity along the circumference of the virtual circle drawn by the target displacement portion until the other end of the target arc reaches the target end position overlapping the apex of the virtual cone. object control to cause
In the target plane view, the optical axis of the laser is around the axis of the virtual cone from the optical path start position along the direction in which the line segment connecting the center of the target arc at the target start position and the vertex of the virtual cone extends. the optical path of the laser at the target angular velocity at the optical path displacement portion until reaching the optical path end position along the direction in which the line segment connecting the center of the target arc at the target end position and the vertex of the virtual cone is reached. optical path control to displace at the same optical path angular velocity;
Simultaneously forming the laser processed surface on the object to be processed,
Laser processing equipment. 前記制御部は、前記仮想円錐台における円錐台面と天面との境界稜線と重なる光軸上の位置を前記仮想円錐の頂点として、前記光路変位部にレーザの光路を変位させる、
請求項１に記載のレーザ加工装置。The control unit displaces the optical path of the laser to the optical path displacement unit, with the position on the optical axis overlapping the boundary ridge between the truncated cone surface and the top surface in the virtual truncated cone as the apex of the virtual cone.
The laser processing apparatus according to claim 1. 前記導光部は、光源から照射されるレーザが透過する筒状領域内で、該筒状領域の軸線と同軸かつ軸線方向に間隔を空けて配置された一対のウェッジプレートと、前記ウェッジプレートよりもレーザの光路下流側で、前記筒状領域の軸線と同軸に配置され、前記ウェッジプレート透過後のレーザを前記加工面に向けて屈折させるレンズと、前記ウェッジプレートを前記筒状領域の軸線周りに回転させることで、前記ウェッジプレート透過後のレーザを周方向に走査させる回転機構と、を備え、
前記光路変位部は、前記回転機構に前記ウェッジプレートを回転させることにより、前記導光部に導かれるレーザの光路を、前記仮想円錐の円錐面に沿って変位させる、
請求項１に記載のレーザ加工装置。The light guide section includes a pair of wedge plates arranged coaxially with the axis of the cylindrical region and spaced apart in the axial direction within the cylindrical region through which the laser emitted from the light source is transmitted; a lens disposed on the downstream side of the optical path of the laser and coaxial with the axis of the cylindrical region for refracting the laser beam after passing through the wedge plate toward the processing surface; a rotating mechanism that scans the laser after passing through the wedge plate in the circumferential direction by rotating the wedge plate,
The optical path displacement unit causes the rotating mechanism to rotate the wedge plate, thereby displacing the optical path of the laser guided to the light guide unit along the conical surface of the virtual cone.
The laser processing apparatus according to claim 1. 光源から照射されるレーザを加工対象物の加工面へと導く導光部と、
前記導光部に導かれるレーザの光路を、その光軸が母線となり、かつ、前記加工面と重なる光軸上の位置を頂点とする仮想円錐の円錐面に沿って、その軸線周りに変位させる光路変位部と、
前記加工対象物を、前記仮想円錐の軸線と交差する対象平面に沿って変位させる対象変位部と、
を備えるレーザ加工装置によって、前記加工対象物に前記加工面を形成させるためのレーザ加工方法であって、
前記対象平面に沿って底面が拡がる仮想円錐台をその軸線周りに所定の角度範囲にわたって切り取った形状における円錐台面を、前記加工面として形成する場合において、
前記対象平面上で、前記加工面が前記仮想円錐台の底面周りになす対象円弧の一端が前記仮想円錐の頂点となる対象開始位置から、前記仮想円錐の頂点を中心に前記対象円弧と同じ半径で描かれる仮想円の円周に沿って、前記対象円弧の他端側が前記仮想円錐の頂点と重なる対象終了位置に到達するまで、前記対象変位部に前記加工対象物を所定の対象角速度で変位させる対象制御と、
前記対象平面視で、レーザの光軸が、前記対象開始位置にある前記対象円弧の中心と前記仮想円錐の頂点とをつなぐ線分の延びる方向に沿う光路開始位置から、前記仮想円錐の軸線周りに、前記対象終了位置にある前記対象円弧の中心と前記仮想円錐の頂点とをつなぐ線分の延びる方向に沿う光路終了位置に到達するまで、前記光路変位部にレーザの光路を前記対象角速度と同じ光路角速度で変位させる光路制御と、を同時に実施する、
レーザ加工方法。a light guide section that guides the laser emitted from the light source to the processing surface of the object;
The optical path of the laser guided to the light guide part is displaced around the axis along the conical surface of a virtual cone whose optical axis is the generatrix and whose vertex is the position on the optical axis that overlaps with the processing surface. an optical path displacement section;
a target displacement unit that displaces the workpiece along a target plane that intersects the axis of the virtual cone;
A laser processing method for forming the processing surface on the processing object by a laser processing apparatus comprising
When forming a truncated cone surface in a shape obtained by cutting a virtual truncated cone whose bottom surface extends along the target plane over a predetermined angle range around the axis, as the processing surface,
On the target plane, from the target start position where one end of the target arc formed by the machining surface around the bottom surface of the virtual truncated cone is the apex of the virtual cone, the same radius as the target arc centered on the apex of the virtual cone Displace the workpiece at a predetermined target angular velocity along the circumference of the virtual circle drawn by the target displacement portion until the other end of the target arc reaches the target end position overlapping the apex of the virtual cone. object control to cause
In the target plane view, the optical axis of the laser is around the axis of the virtual cone from the optical path start position along the direction in which the line segment connecting the center of the target arc at the target start position and the vertex of the virtual cone extends. the optical path of the laser at the target angular velocity at the optical path displacement portion until reaching the optical path end position along the direction in which the line segment connecting the center of the target arc at the target end position and the vertex of the virtual cone is reached. Simultaneously performing optical path control to displace at the same optical path angular velocity,
Laser processing method. 請求項１に記載の制御部としてコンピュータを機能させるためのプログラム。 A program for causing a computer to function as the control unit according to claim 1 .
JP2023507390A 2023-01-31 2023-01-31 LASER PROCESSING DEVICE, LASER PROCESSING METHOD AND PROGRAM Active JP7274807B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023002995 2023-01-31

Publications (1)

Publication Number Publication Date
JP7274807B1 true JP7274807B1 (en) 2023-05-17

Family

ID=86332463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023507390A Active JP7274807B1 (en) 2023-01-31 2023-01-31 LASER PROCESSING DEVICE, LASER PROCESSING METHOD AND PROGRAM

Country Status (1)

Country Link
JP (1) JP7274807B1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012006135A (en) * 2010-06-28 2012-01-12 Mitsubishi Materials Corp End mill and manufacturing method therefor
WO2013190977A1 (en) * 2012-06-21 2013-12-27 住友電工ハードメタル株式会社 Cutting tool
JP2014083567A (en) * 2012-10-24 2014-05-12 Mitsubishi Materials Corp Manufacturing method and manufacturing device of cutting tool
JP2017030124A (en) * 2015-08-05 2017-02-09 株式会社山崎 Spherical surface engraving device
JP2019126816A (en) * 2018-01-23 2019-08-01 株式会社ソフトサービス Laser beam machine
JP2020104167A (en) * 2018-12-28 2020-07-09 三星ダイヤモンド工業株式会社 Laser processing device and beam rotator unit

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012006135A (en) * 2010-06-28 2012-01-12 Mitsubishi Materials Corp End mill and manufacturing method therefor
WO2013190977A1 (en) * 2012-06-21 2013-12-27 住友電工ハードメタル株式会社 Cutting tool
JP2014083567A (en) * 2012-10-24 2014-05-12 Mitsubishi Materials Corp Manufacturing method and manufacturing device of cutting tool
JP2017030124A (en) * 2015-08-05 2017-02-09 株式会社山崎 Spherical surface engraving device
JP2019126816A (en) * 2018-01-23 2019-08-01 株式会社ソフトサービス Laser beam machine
JP2020104167A (en) * 2018-12-28 2020-07-09 三星ダイヤモンド工業株式会社 Laser processing device and beam rotator unit

Similar Documents

Publication Publication Date Title
RU2750313C2 (en) Method for laser processing of metal material with a high level of dynamic control of the axes of movement of the laser beam along a pre-selected processing path, as well as a machine and a computer program for implementing this method
US9035217B2 (en) Method for machining material using laser radiation and apparatus for carrying out the method
US11420288B2 (en) Laser machining systems and methods
WO2018211594A1 (en) Additional-processing head and processing machinery
JP6638011B2 (en) Laser processing machine and laser processing method
CN107584204B (en) Method for laser treatment of metallic materials, and associated machine and computer program
JP2009178725A (en) Laser beam machining apparatus and method
KR20180079445A (en) Method for machining a workpiece by a laser beam, laser tool, laser machine, machine controller and tool
JP2016516584A5 (en)
CN105163897A (en) Coordination of beam angle and workpiece movement for taper control
TW201811475A (en) A method of laser processing of a metallic material with control of the transverse power distribution of the laser beam in a working plane, and a machine and computer program for the implementation of said method
KR102375235B1 (en) Laser processing system and laser processing method
JP2009178720A (en) Laser beam machining apparatus
JP7443566B2 (en) Laser cutting method and laser cutting device
JP7274807B1 (en) LASER PROCESSING DEVICE, LASER PROCESSING METHOD AND PROGRAM
CN110977159A (en) Laser light path component for forming annular light spots
JP2023502617A (en) Laser processing system and laser processing method
JP2006150433A (en) Laser beam machining apparatus
JP2020199513A (en) Laser processing machine and control method of laser processing machine
US20210299810A1 (en) Cutting edge machining apparatus and cutting apparatus
EP3865244B1 (en) Laser processing machine and laser processing method
JP2021142546A (en) Optical unit, laser beam machining apparatus and laser beam machining method
JP7144101B2 (en) cutting equipment
JP2003251482A (en) Laser beam machining method and device
WO2024080034A1 (en) Laser machining apparatus, laser machining method, machining program creation method, and machining program configuration method

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230202

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20230202

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230411

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230425

R150 Certificate of patent or registration of utility model

Ref document number: 7274807

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150