JP7270057B2 - 樹脂組成物、該樹脂組成物を含むプリプレグ及び積層板並びにプリント回路基板 - Google Patents
樹脂組成物、該樹脂組成物を含むプリプレグ及び積層板並びにプリント回路基板 Download PDFInfo
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Description
48~54重量部のノンハロゲンエポキシ樹脂と、
16~31重量部の式(I)で表される化合物であって、
15~32重量部のシアネート樹脂とを含む、ことを特徴とする。
16~31重量部の式(I)で表される化合物であって、
15~32重量部のシアネート樹脂とを含む、エポキシ樹脂組成物。
KES-7695M75: DCPD構造を含むエポキシ樹脂(KOLON社から購入)。
NC-3000H: ビフェニルノボラック型エポキシ樹脂(日本化薬社から購入)。
E15-152T: 式(I)で表される化合物(ICL社から購入)であって、nは約3.0。
HM1100: ホスホネートポリマー(FRX Polymers社から購入)。
HPC-8000-65T:活性エステル樹脂(日本DIC社から購入)。
CE01PS: ビスフェノールA型シアネート樹脂(揚州天啓社から購入)。
PT60S: フェノール型シアネート樹脂(LONZA社から購入)。
DMAP: 硬化促進剤、4-ジメチルアミノピリジン(広栄化学社から購入)。
イソオクタン酸亜鉛: 硬化促進剤(Alfa Aesar社から購入)。
容器を取り、54重量部のエポキシ樹脂KES-7695M75及び31重量部の式(I)で表される化合物E15-152Tを加え、メチルエチルケトン(MEK)及びジメチルホルムアミド(DMF)を適量加え、完全に溶解するまで撹拌し、次に15重量部のシアネート樹脂CE01PS、事前に溶解された硬化促進剤DMAP及びイソオクタン酸亜鉛を加え、続けて均一に撹拌し、最後に溶剤で液体固形成分の含有量を70%調整して接着液を調製した。ガラス繊維クロスを用いて上記接着液に浸漬させ、適当な厚みに制御した後、乾燥させて溶剤を除去し、プリプレグを得た。製造したプリプレグを6枚重ね合わせ、その両側に銅箔をそれぞれ1枚被覆して、ホットプレス機に入れて前記エポキシ樹脂銅張積層板を製造した。物理的データを表1に示した。
製造プロセスは実施例1と同じであり、処方組成とその物理的指標を表1に示した。
製造プロセスは実施例1と同じであり、処方組成とその物理的指標を表1に示した。
Claims (9)
- 前記ノンハロゲンエポキシ樹脂は、ビフェニルノボラック型エポキシ樹脂、DCPD型ノボラック型エポキシ樹脂、アルキレンノボラック型エポキシ樹脂、ビスフェノールAノボラック型エポキシ樹脂、ビスフェノールAP型エポキシ樹脂、ビスフェノールTMC型エポキシ樹脂及びそれらの組合せからなる群から選ばれる、ことを特徴とする請求項1に記載の樹脂組成物。
- 前記シアネート樹脂は、ビスフェノールA型シアネート樹脂、ビスフェノールF型シアネート樹脂、ジシクロペンタジエン型シアネート樹脂、フェノールノボラック型シアネート樹脂及びそれらの組合せからなる群から選ばれる、ことを特徴とする請求項1に記載の樹脂組成物。
- 前記樹脂組成物は硬化促進剤をさらに含む、ことを特徴とする請求項1に記載の樹脂組成物。
- 前記樹脂組成物はノンハロゲン難燃剤をさらに含む、ことを特徴とする請求項1に記載の樹脂組成物。
- 前記樹脂組成物はフィラーをさらに含む、ことを特徴とする請求項1に記載の樹脂組成物。
- 強化材に対して、請求項1に記載の樹脂組成物を浸漬又は塗布して半硬化させることにより得られる、プリプレグ。
- 少なくとも1枚の請求項7に記載のプリプレグを含む、積層板。
- 少なくとも1枚の請求項7に記載のプリプレグ又は少なくとも1枚の請求項8に記載の積層板を含む、プリント回路基板。
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CN201910205606.1 | 2019-03-18 | ||
PCT/CN2019/081744 WO2020186572A1 (zh) | 2019-03-18 | 2019-04-08 | 一种树脂组合物、包含其的预浸料以及层压板和印制电路板 |
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JP2017147422A (ja) | 2016-02-19 | 2017-08-24 | 日立化成株式会社 | 多層プリント配線板用の接着フィルム |
WO2018031103A1 (en) | 2016-08-11 | 2018-02-15 | Icl-Ip America Inc. | Curable epoxy composition |
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