JP7265930B2 - Heating device and method for manufacturing the heating device - Google Patents

Heating device and method for manufacturing the heating device Download PDF

Info

Publication number
JP7265930B2
JP7265930B2 JP2019095077A JP2019095077A JP7265930B2 JP 7265930 B2 JP7265930 B2 JP 7265930B2 JP 2019095077 A JP2019095077 A JP 2019095077A JP 2019095077 A JP2019095077 A JP 2019095077A JP 7265930 B2 JP7265930 B2 JP 7265930B2
Authority
JP
Japan
Prior art keywords
terminal
power supply
holder
heating device
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019095077A
Other languages
Japanese (ja)
Other versions
JP2020191199A (en
Inventor
和孝 田中
貴久 駒津
雅夫 辻他
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Spark Plug Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP2019095077A priority Critical patent/JP7265930B2/en
Publication of JP2020191199A publication Critical patent/JP2020191199A/en
Application granted granted Critical
Publication of JP7265930B2 publication Critical patent/JP7265930B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

本明細書に開示される技術は、加熱装置に関する。 The technology disclosed in this specification relates to a heating device.

対象物（例えば、半導体ウェハ）を保持しつつ所定の処理温度（例えば、４００～６５０℃程度）に加熱する加熱装置（「サセプタ」とも呼ばれる）が知られている。加熱装置は、例えば、成膜装置（ＣＶＤ成膜装置やスパッタリング成膜装置等）やエッチング装置（プラズマエッチング装置等）といった半導体製造装置の一部として使用される。 2. Description of the Related Art A heating device (also called a “susceptor”) is known that holds an object (eg, a semiconductor wafer) and heats it to a predetermined processing temperature (eg, about 400 to 650° C.). A heating apparatus is used as part of a semiconductor manufacturing apparatus such as, for example, a film forming apparatus (CVD film forming apparatus, sputtering film forming apparatus, etc.) or an etching apparatus (plasma etching apparatus, etc.).

一般に、加熱装置は、所定の方向に略直交する表面（以下、「保持面」という。）と、保持面とは反対側の表面（以下、「裏面」という。）とを有する保持体を備える。保持体には、発熱抵抗体であるヒータ電極が配置されている。ヒータ電極には、ビア導体等を介して給電電極（「電極パッド」とも呼ばれる。）が電気的に接続されている。給電電極は、保持体の裏面に配置されている。給電電極には、接続部（例えばロウ付け）により端子部材が接合されている。端子部材および給電電極を介してヒータ電極に電圧が印加されると、ヒータ電極が発熱し、保持体の保持面上に保持された対象物が加熱される。また、柱状支持体には、保持体の裏面側に開口する複数の貫通孔が形成されており、各貫通孔には、各給電電極に対して例えばロウ付けにより接続された端子部材が収容されている。端子部材および給電電極を介して発熱抵抗体に電圧が印加されると、発熱抵抗体が発熱し、保持体の保持面上に保持された対象物（例えば、半導体ウェハ）が例えば４００～６５０℃程度に加熱される。 In general, a heating device includes a holder having a surface (hereinafter referred to as "holding surface") substantially orthogonal to a predetermined direction and a surface opposite to the holding surface (hereinafter referred to as "back surface"). . A heater electrode, which is a heating resistor, is arranged on the holder. A power supply electrode (also called an "electrode pad") is electrically connected to the heater electrode through a via conductor or the like. The feed electrode is arranged on the back surface of the holder. A terminal member is joined to the power supply electrode by a connecting portion (for example, brazing). When a voltage is applied to the heater electrode through the terminal member and the power supply electrode, the heater electrode generates heat to heat the object held on the holding surface of the holder. Further, the columnar support has a plurality of through holes that open to the back side of the holder, and each through hole accommodates a terminal member that is connected to each power supply electrode by, for example, brazing. ing. When a voltage is applied to the heating resistor via the terminal member and the power supply electrode, the heating resistor generates heat, and the object (eg, semiconductor wafer) held on the holding surface of the holder is heated to 400 to 650° C., for example. heated to some extent.

特開２０１８－１３３５５７号公報JP 2018-133557 A

端子部材は、比較的長尺であるため、揺動することにより端子部材と給電電極とを接合する接続部（例えばロウ付け部）に発生する応力（モーメント）によって、該接続部（例えばロウ付け部）付近（換言すれば、給電電極付近）において保持体にクラックが発生したり、端子部材が給電電極から脱離したりするおそれがある。このため、上記従来の加熱装置のように、複数の端子部材のそれぞれを貫通孔に個別に収容することにより、端子部材を支持することが好ましい。 Since the terminal member is relatively long, the stress (moment) generated in the connecting portion (for example, brazing portion) that joins the terminal member and the power supply electrode by swinging causes the connecting portion (for example, brazing Part) (in other words, near the power supply electrode), there is a risk that a crack may occur in the holder, or the terminal member may detach from the power supply electrode. For this reason, it is preferable to support the terminal members by individually accommodating the plurality of terminal members in the through-holes as in the conventional heating device.

上記従来の加熱装置においては、柱状支持体自体に貫通孔が形成されている。このような構成では、柱状支持体において、貫通孔のある部分と、貫通孔のない部分とで、保持体からの熱引きの大きさが異なり、保持面上に温度特異点が発生する原因となる。このため、当該貫通孔の大きさ（例えば、貫通孔の径）をできるだけ小さくすることが好ましい。貫通孔の大きさを小さくすることに応じて、貫通孔に収容される端子部材の大きさ（例えば、端子部材の径）も小さくすることが必要である。しかしながら、端子部材と給電電極との接続強度を確保するためには、十分な大きさの（例えば、第１の方向視において、接続部の径が端子部材の径より大きい）接続部が必要である。 In the above conventional heating device, through holes are formed in the columnar support itself. In such a structure, the portion of the columnar support with the through holes and the portion without the through holes receive different amounts of heat from the support, which may cause a temperature singularity on the support surface. Become. Therefore, it is preferable to make the size of the through-hole (for example, the diameter of the through-hole) as small as possible. As the size of the through hole is reduced, the size of the terminal member accommodated in the through hole (for example, the diameter of the terminal member) also needs to be reduced. However, in order to ensure the strength of the connection between the terminal member and the power supply electrode, it is necessary to have a sufficiently large connecting portion (for example, the diameter of the connecting portion is larger than the diameter of the terminal member when viewed in the first direction). be.

ここで、従来の加熱装置においては、柱状支持体を保持体に接合後、接続部を柱状支持体に形成された貫通孔内に挿通し、当該接続部を介して、端子部材を給電電極に接合している。そのため、第１の方向視において、端子部材の径より大きい径を有する接続部を上記貫通孔内に挿通するためには、当該貫通孔の全体において、当該貫通孔の大きさ（例えば、貫通孔の径）を接続部の大きさ（例えば、接続部の径）よりも大きい径とする必要がある。しかしながら、上記貫通孔の径を接続部の径より大きくすると、貫通孔の径は端子部材の径より大きくなる。このため、当該貫通孔の内部で端子部材が揺動し、給電電極付近において保持体にクラックが発生したり、端子部材が給電電極から脱離したりするおそれがある。 Here, in the conventional heating device, after the columnar support is joined to the holder, the connection portion is inserted into the through hole formed in the columnar support, and the terminal member is connected to the power supply electrode via the connection portion. are joined. Therefore, in order to insert a connecting portion having a larger diameter than the diameter of the terminal member into the through-hole when viewed from the first direction, the size of the through-hole as a whole (for example, through-hole diameter) should be larger than the size of the connecting portion (for example, the diameter of the connecting portion). However, if the diameter of the through-hole is made larger than the diameter of the connecting portion, the diameter of the through-hole becomes larger than the diameter of the terminal member. Therefore, the terminal member swings inside the through-hole, and there is a risk that a crack may occur in the holder near the power supply electrode, or the terminal member may be detached from the power supply electrode.

また、上記貫通孔の全体における径を、端子部材の径および接続部の径よりも大きくすることが必要であると、換言すれば、貫通孔の全体における径を十分に小さくすることができないと、柱状支持体において、貫通孔のある部分と、貫通孔のない部分とで、保持体からの熱引きの大きさが異なるため、保持面上に温度特異点が発生する原因となり、ひいては、保持面の温度が不均一になるおそれがある。このように、従来の加熱装置では、給電電極付近の保持体におけるクラック発生の抑制、または、端子部材の給電電極からの脱離の抑制と、保持面の均熱性との両立の点で、向上の余地がある。 Moreover, it is necessary to make the diameter of the entire through-hole larger than the diameter of the terminal member and the diameter of the connecting portion. In the columnar support, the amount of heat drawn from the holding body differs between the part with the through hole and the part without the through hole, which causes a temperature singularity on the holding surface. Surface temperature may become uneven. As described above, in the conventional heating device, it is possible to suppress the occurrence of cracks in the holder near the power supply electrode, or to suppress the detachment of the terminal member from the power supply electrode, and to achieve uniform heating of the holding surface. There is room for

なお、このような課題は、保持体と、保持体に配置された発熱抵抗体と、発熱抵抗体と電気的に接続された給電電極と、端子部材と、端子部材の一方の端部に接合され、当該端子部材と給電電極とを電気的に接続する接続部とを備え、保持体の表面上に対象物を保持する加熱装置一般に共通の課題である。 In addition, such a problem consists of a holder, a heating resistor arranged on the holder, a power supply electrode electrically connected to the heating resistor, a terminal member, and a terminal member joined to one end of the terminal member. This is a problem common to all heating devices that include a connecting portion that electrically connects the terminal member and the power supply electrode and that holds an object on the surface of a holder.

本明細書では、上述した課題を解決することが可能な技術を開示する。 This specification discloses a technology capable of solving the above-described problems.

本明細書に開示される技術は、例えば、以下の形態として実現することが可能である。 The technology disclosed in this specification can be implemented, for example, in the following forms.

（１）本明細書に開示される加熱装置は、第１の方向に略直交する第１の表面および第２の表面を有する板状であり、発熱抵抗体を有する保持体と、前記第１の方向に延びる柱状であり、前記保持体の前記第２の表面に接合された柱状支持体と、前記保持体の前記第２の表面に配置された複数の給電電極と、前記第１の方向に延びる複数の端子部材であって、それぞれ、前記複数の給電電極に電気的に接続された複数の端子部材と、前記端子部材の一方の端部に接合され、前記端子部材と前記給電電極とを電気的に接続する接続部と、を備え、前記保持体の前記第１の表面上に保持された対象物を加熱する加熱装置において、さらに、前記柱状支持体の内部に、前記柱状支持体とは別体として設けられた収容部材、を備え、前記収容部材には、前記第１の方向に延びる複数の貫通孔が形成されており、前記貫通孔の数は、前記端子部材の数と同数以上であり、前記複数の端子部材は、それぞれ、前記複数の貫通孔の内の異なる貫通孔に収容され、前記貫通孔の少なくとも一部の径は、前記端子部材のうちの前記収容部材に収容された部分の少なくとも一部の径と同径である。 (1) The heating device disclosed in this specification is a plate-like holder having a first surface and a second surface substantially orthogonal to a first direction, and has a heating resistor; a columnar support joined to the second surface of the holder; a plurality of power supply electrodes arranged on the second surface of the holder; and a plurality of terminal members electrically connected to the plurality of power supply electrodes, respectively, and joined to one end of the terminal member to connect the terminal member and the power supply electrode. and a connecting portion for electrically connecting the columnar support to the object held on the first surface of the holder, further comprising: the columnar support inside the columnar support; a housing member provided separately from the terminal member, wherein the housing member is formed with a plurality of through holes extending in the first direction, and the number of the through holes is equal to the number of the terminal members. The plurality of terminal members are equal in number or more, and the plurality of terminal members are accommodated in different through-holes among the plurality of through-holes, and the diameter of at least a part of the through-holes is equal to or larger than the accommodating member among the terminal members. It has the same diameter as the diameter of at least a portion of the accommodated portion.

このように、本加熱装置では、上記収容部材が柱状支持体とは別体であるため、柱状支持体と収容部材とが一体である構成と比較して、柱状支持体の製造が容易である。また、収容部材が柱状支持体とは別体であることにより、柱状支持体を保持体に接合し、接続部（端子部材との接続前の状態である接続前接続部）を配置した後に、収容部材を配置することができる。すなわち、本加熱装置では、上記接続前接続部を収容部材に形成された貫通孔に挿通することを要しないため、貫通孔の全体に亘って当該貫通孔の径を接続部（接続前接続部）の大きさに合わせる必要がなく、接続部（接続前接続部）の大きさ（例えば、径）を十分に確保できる。換言すれば、貫通孔のうち接続部に対応する必要な部分のみ、接続部に対応する大きさ（径）とすることができる。このため、接続部に対応する必要な部分以外は、端子部材の大きさ（例えば、径）に合わせて貫通孔の大きさ（例えば、径）を小さくすることができる。このように、本加熱装置では、接続部の大きさ（例えば、径）を十分に確保できるため、端子部材と給電電極との間の接続強度を向上させ、ひいては、端子部材の給電電極からの脱離を抑制することができる。また、貫通孔の大きさ（例えば、径）を小さくすることができるため、保持面上に温度特異点が発生することを抑制することができ、ひいては、保持面の均熱性を確保することができる。 As described above, in the present heating apparatus, since the accommodating member is separate from the columnar support, it is easier to manufacture the columnar support than in a structure in which the columnar support and the accommodating member are integrated. . Further, since the housing member is separate from the columnar support, after the columnar support is joined to the holder and the connection portion (the pre-connection connection portion that is in a state before connection with the terminal member) is arranged, A containment member can be arranged. That is, in the present heating device, since it is not necessary to insert the pre-connection connecting portion into the through-hole formed in the housing member, the diameter of the through-hole is set to the connecting portion (pre-connection connecting portion) throughout the through-hole. ), and the size (for example, diameter) of the connecting portion (pre-connecting connecting portion) can be sufficiently secured. In other words, only the necessary portion of the through-hole corresponding to the connecting portion can have a size (diameter) corresponding to the connecting portion. Therefore, the size (eg, diameter) of the through-hole can be reduced in accordance with the size (eg, diameter) of the terminal member, except for the required portion corresponding to the connecting portion. As described above, in the present heating device, since a sufficient size (for example, diameter) of the connecting portion can be secured, the strength of the connection between the terminal member and the power supply electrode can be improved. Detachment can be suppressed. In addition, since the size (e.g., diameter) of the through-hole can be reduced, it is possible to suppress the occurrence of a temperature singularity on the holding surface, thereby ensuring uniform heating of the holding surface. can.

また、本加熱装置における収容部材には、第１の方向に延びる複数の貫通孔が形成されており、上記複数の端子部材が、それぞれ、当該複数の貫通孔のうちの異なる貫通孔に収容されている。更には、当該貫通孔の少なくとも一部の径は、上記端子部材のうちの収容部材に収容された部分の少なくとも一部の径と同径である。このため、収容部材に形成された貫通孔の少なくとも一部の内周面、すなわち、端子部材のうちの収容部材に収容された部分の少なくとも一部の径と同径である貫通孔の内周面によって、端子部材を支持することができる。従って、本加熱装置によれば、保持面の均熱性を確保するとともに、端子部材の揺動を抑制しつつ、端子部材と給電電極との間の接続強度を向上させ、ひいては、給電電極付近の保持体におけるクラック発生を抑制し、または、端子部材の給電電極からの脱離の抑制することができる。 Further, a plurality of through-holes extending in the first direction are formed in the housing member of the present heating device, and the plurality of terminal members are respectively housed in different through-holes of the plurality of through-holes. ing. Furthermore, the diameter of at least part of the through hole is the same as the diameter of at least part of the portion of the terminal member accommodated in the accommodation member. Therefore, the inner circumference of the through-hole having the same diameter as the diameter of at least part of the inner peripheral surface of the through-hole formed in the accommodating member, that is, the diameter of at least part of the portion of the terminal member accommodated in the accommodating member The surface can support the terminal member. Therefore, according to the present heating device, it is possible to ensure uniform heating of the holding surface, suppress the swinging of the terminal member, improve the connection strength between the terminal member and the power supply electrode, and further improve the strength of the connection between the terminal member and the power supply electrode. It is possible to suppress the occurrence of cracks in the holder, or to suppress the detachment of the terminal member from the power supply electrode.

（２）上記加熱装置において、前記保持体は、前記第２の表面に凹部を有し、前記収容部材は、前記保持体の前記第２の表面に対向する表面に、前記凹部と係合し、かつ、前記第１の方向に略直交する第２の方向への相対移動が規制されるように設けられた凸部を有する構成としてもよい。本加熱装置によれば、保持体の第２の表面に形成された給電電極に対する端子部材の第２の方向への相対移動が規制される。従って、本加熱装置によれば、端子部材と給電電極との間に位置する接続部に第２の方向の応力が集中することを抑制することができ、ひいては、給電電極付近の保持体におけるクラック発生の抑制、または、端子部材の給電電極からの脱離の抑制をより効果的に抑制することができる。 (2) In the above heating device, the holding body has a recess on the second surface, and the housing member is engaged with the recess on a surface facing the second surface of the holding body. Further, it may have a convex portion provided so as to restrict relative movement in a second direction substantially perpendicular to the first direction. According to this heating device, relative movement of the terminal member in the second direction with respect to the power supply electrode formed on the second surface of the holder is restricted. Therefore, according to the present heating device, it is possible to suppress concentration of the stress in the second direction on the connection portion located between the terminal member and the power supply electrode, and furthermore, cracks in the holder near the power supply electrode can be suppressed. It is possible to more effectively suppress the generation or the suppression of detachment of the terminal member from the power supply electrode.

（３）上記加熱装置において、さらに、前記接続部は、前記給電電極と前記端子部材との間に配置された、導電性を有する緩衝部材と、前記端子部材と前記緩衝部材とを接合する第１のロウ付け部と、前記給電電極と前記緩衝部材とを接合する第２のロウ付け部と、を備え、前記緩衝部材の形成材料における熱膨張係数は、前記給電電極の形成材料における熱膨張係数以上であり、かつ、前記端子部材の形成材料における熱膨張係数以下である構成としてもよい。本加熱装置によれば、緩衝部材が、給電電極と端子部材との間の熱膨張差を緩和する機能を担うことができる。従って、本加熱装置によれば、給電電極付近の保持体におけるクラック発生の抑制、または、端子部材の給電電極からの脱離の抑制をより効果的に抑制することができる。 (3) In the above heating device, the connecting portion further includes a buffer member having conductivity disposed between the power supply electrode and the terminal member, and a second buffer member that joins the terminal member and the buffer member. and a second brazing portion that joins the power supply electrode and the buffer member, wherein the thermal expansion coefficient of the material forming the buffer member is equal to the thermal expansion of the material forming the power supply electrode. The coefficient of thermal expansion may be equal to or greater than the thermal expansion coefficient of the material forming the terminal member. According to this heating device, the buffer member can have a function of alleviating the difference in thermal expansion between the power supply electrode and the terminal member. Therefore, according to the present heating device, it is possible to more effectively suppress the occurrence of cracks in the holder near the power supply electrode, or the suppression of detachment of the terminal member from the power supply electrode.

（４）上記加熱装置において、前記収容部材に形成された前記貫通孔の、前記保持体の前記第２の表面に対向する側の端部は、径が拡大された拡径部、を備え、前記接続部の少なくとも一部分は、前記拡径部を画定する内面と、前記収容部材における前記保持体の前記第２の表面に対向する表面で形成される拡径空間内に配置されている構成としてもよい。本加熱装置によれば、充分な量の接続部を配置することができ、ひいては、給電電極と端子部材との間の接合をより強固にすることができる。従って、本加熱装置によれば、給電電極付近の保持体におけるクラック発生の抑制、または、端子部材の給電電極からの脱離の抑制をより効果的に抑制することができる。 (4) In the above heating device, the end of the through-hole formed in the housing member on the side facing the second surface of the holder includes an enlarged diameter portion having an enlarged diameter, At least a portion of the connecting portion is arranged in an enlarged diameter space formed by an inner surface defining the enlarged diameter portion and a surface of the housing member facing the second surface of the holder. good too. According to this heating device, it is possible to arrange a sufficient amount of connecting portions, and as a result, it is possible to strengthen the joint between the power supply electrode and the terminal member. Therefore, according to the present heating device, it is possible to more effectively suppress the occurrence of cracks in the holder near the power supply electrode, or the suppression of detachment of the terminal member from the power supply electrode.

（５）上記加熱装置において、前記収容部材の形成材料における熱伝導率は、前記保持体の形成材料における熱伝導率より低い構成としてもよい。本加熱装置によれば、収容部材の形成材料における熱伝導率が、保持体の形成材料における熱伝導率と同等以上である構成と比較して、保持体からの収容部材を介した熱引きを抑制することができる。 (5) In the above heating device, the thermal conductivity of the material forming the housing member may be lower than the thermal conductivity of the material forming the holder. According to the present heating device, compared to a structure in which the thermal conductivity of the material forming the housing member is equal to or greater than the thermal conductivity of the material forming the holder, the heat transfer from the holder through the housing member is reduced. can be suppressed.

（６）本明細書に開示される加熱装置の製造方法は、第１の方向に略直交する第１の表面および第２の表面を有する板状であり、発熱抵抗体を有する保持体、を備え、前記保持体の前記第１の表面上に保持された対象物を加熱する加熱装置の製造方法において、複数の給電電極が前記第２の表面に配置された前記保持体を準備する第１の工程と、前記保持体と、柱状支持体と、前記保持体と前記柱状支持体との間に配置された接合前接合部とを配置し、かつ、加熱することにより、前記保持体と前記柱状支持体とを接合する接合部を形成する第２の工程と、前記複数の給電電極の、前記保持体における前記第２の表面に対向する表面とは反対側の表面に、複数の接続前接続部を配置する第３の工程と、前記第１の方向に延びる複数の貫通孔が形成された収容部材を、前記第１の方向において、前記複数の貫通孔と前記複数の給電電極とがそれぞれ重なるように、前記柱状支持体の内部に配置する第４の工程と、前記複数の貫通孔内へ複数の端子部材をそれぞれ挿入し、加熱することにより、前記複数の端子部材と前記複数の給電電極とを前記接続する複数の接続部を介してそれぞれ接続する形成する第５の工程と、を備え、前記収容部材に形成された前記貫通孔の少なくとも一部の径は、前記端子部材のうちの前記収容部材に収容される部分の少なくとも一部の径と同径である構成としてもよい。 (6) A method for manufacturing a heating device disclosed in the present specification includes a plate-like holder having a first surface and a second surface substantially perpendicular to a first direction and having a heating resistor. In the method of manufacturing a heating device that heats an object held on the first surface of the holding body, the first step is to prepare the holding body having a plurality of power supply electrodes arranged on the second surface. , arranging and heating the holding body, the columnar support, and the pre-bonding joint portion arranged between the holding body and the columnar support, and heating the holding body and the a second step of forming a joint portion that joins the columnar support; a third step of arranging a connecting portion; a fourth step of arranging the plurality of terminal members inside the columnar support so as to overlap each other; inserting the plurality of terminal members into the plurality of through-holes; and a fifth step of forming a connection between the power supply electrode and the power supply electrode via the plurality of connecting portions, wherein the diameter of at least a portion of the through hole formed in the housing member is equal to the diameter of the terminal member. The diameter may be the same as that of at least a portion of the portion housed in the housing member.

本加熱装置の製造方法では、上記本加熱装置による効果と同様に、柱状支持体と収容部材とが一体である構成と比較して、柱状支持体の製造が容易である。また、上記本加熱装置による効果と同様に、接続部の大きさ（例えば、径）を十分に確保できるため、端子部材と給電電極との間の接続強度を向上させ、ひいては、端子部材の給電電極からの脱離を抑制することが可能な加熱装置を製造することができる。また、上記本加熱装置による効果と同様に、貫通孔の大きさ（例えば、径）を小さくすることができるため、保持面上に温度特異点が発生することを抑制することができ、ひいては、保持面の均熱性を確保することが可能な加熱装置を製造することができる。更には、本加熱装置の製造方法では、収容部材に形成された貫通孔の少なくとも一部の径は、端子部材のうちの収容部材に収容される部分の少なくとも一部の径と同径である。このため、収容部材に形成された貫通孔の少なくとも一部の内周面、すなわち、端子部材のうちの収容部材に収容された部分の少なくとも一部の径と同径である貫通孔の内周面によって、端子部材を支持することが可能な加熱装置を製造することができる。従って、本加熱装置の製造方法によれば、端子部材の揺動を抑制しつつ、端子部材と給電電極との間の接続強度を向上させ、ひいては、給電電極付近の保持体におけるクラック発生を抑制し、または、端子部材の給電電極からの脱離の抑制することが可能な加熱装置を製造することができる。 In the manufacturing method of the present heating device, similarly to the effect of the present heating device, the columnar support is easier to manufacture than the configuration in which the columnar support and the housing member are integrated. In addition, since the size (e.g., diameter) of the connecting portion can be sufficiently ensured, the strength of the connection between the terminal member and the power supply electrode can be improved, and thus the power supply to the terminal member can be improved. A heating device capable of suppressing detachment from the electrode can be manufactured. In addition, since the size (e.g., diameter) of the through-holes can be reduced in the same manner as the effect of the present heating device, it is possible to suppress the occurrence of temperature singularities on the holding surface. It is possible to manufacture a heating device capable of ensuring uniform heating of the holding surface. Furthermore, in the manufacturing method of the heating device, the diameter of at least part of the through hole formed in the housing member is the same as the diameter of at least part of the portion of the terminal member that is housed in the housing member. . Therefore, the inner circumference of the through-hole having the same diameter as the diameter of at least part of the inner peripheral surface of the through-hole formed in the accommodating member, that is, the diameter of at least part of the portion of the terminal member accommodated in the accommodating member The surface allows the production of a heating device capable of supporting the terminal members. Therefore, according to the manufacturing method of the present heating device, it is possible to improve the connection strength between the terminal member and the power supply electrode while suppressing the swinging of the terminal member, thereby suppressing the occurrence of cracks in the holder near the power supply electrode. Alternatively, it is possible to manufacture a heating device capable of suppressing detachment of the terminal member from the power supply electrode.

なお、本明細書に開示される技術は、種々の形態で実現することが可能であり、例えば、加熱装置、半導体製造装置、それらの製造方法等の形態で実現することが可能である。 Note that the technology disclosed in this specification can be implemented in various forms, such as a heating apparatus, a semiconductor manufacturing apparatus, and a manufacturing method thereof.

本実施形態における加熱装置１００の外観構成を概略的に示す斜視図である。1 is a perspective view schematically showing an external configuration of a heating device 100 according to this embodiment; FIG. 第１実施形態における加熱装置１００のＸＺ断面構成を概略的に示す説明図である。It is an explanatory view showing roughly the XZ section composition of heating device 100 in a 1st embodiment. 第１実施形態における加熱装置１００のＸＹ断面構成を概略的に示す説明図である。It is an explanatory view showing roughly XY section composition of heating device 100 in a 1st embodiment. 第１実施形態における加熱装置１００のＸ１部を拡大して示す説明図である。It is explanatory drawing which expands and shows the X1 part of the heating apparatus 100 in 1st Embodiment. 第１実施形態における加熱装置１００のＸＹ断面構成を概略的に示す説明図である。It is an explanatory view showing roughly XY section composition of heating device 100 in a 1st embodiment. 第１実施形態における加熱装置１００の製造方法を示すフローチャートである。4 is a flow chart showing a method of manufacturing the heating device 100 according to the first embodiment. 第１実施形態における加熱装置１００の製造方法の概要を示す説明図である。FIG. 4 is an explanatory diagram showing an outline of a method for manufacturing the heating device 100 according to the first embodiment; 第２実施形態における加熱装置１００ａのＸＺ断面構成を概略的に示す説明図である。It is explanatory drawing which shows roughly the XZ cross-sectional structure of the heating apparatus 100a in 2nd Embodiment.

Ａ．第１実施形態：
Ａ－１．加熱装置１００の構成：
図１は、第１実施形態における加熱装置１００の外観構成を概略的に示す斜視図であり、図２から図５は、第１実施形態における加熱装置１００の断面構成を概略的に示す説明図である。図２には、図３および図５のＩＩ－ＩＩの位置における加熱装置１００のＸＺ断面構成が示されており、図３には、図２のＩＩＩ－ＩＩＩの位置における加熱装置１００のＸＹ断面構成が示されており、図４には、図２のＸ１部が拡大して示されており、図５には、図２のＶ－Ｖの位置における加熱装置１００のＸＹ断面構成が示されている。各図には、方向を特定するための互いに直交するＸＹＺ軸が示されている。本明細書では、便宜的に、Ｚ軸正方向を上方向といい、Ｚ軸負方向を下方向というものとするが、加熱装置１００は実際にはそのような向きとは異なる向きで設置されてもよい。 A. First embodiment:
A-1. Configuration of heating device 100:
FIG. 1 is a perspective view schematically showing the external configuration of the heating device 100 according to the first embodiment, and FIGS. 2 to 5 are explanatory diagrams schematically showing the cross-sectional configuration of the heating device 100 according to the first embodiment. is. 2 shows the XZ cross-sectional configuration of the heating device 100 at the position II-II in FIGS. 3 and 5, and FIG. 3 shows the XY cross-sectional configuration of the heating device 100 at the position III-III in FIG. 4 shows an enlarged view of the X1 part of FIG. 2, and FIG. 5 shows the XY cross-sectional structure of the heating device 100 at the position VV of FIG. ing. Each figure shows mutually orthogonal XYZ axes for specifying directions. In this specification, for the sake of convenience, the positive direction of the Z-axis is referred to as the upward direction, and the negative direction of the Z-axis is referred to as the downward direction. may

加熱装置１００は、対象物（例えば、半導体ウェハＷ）を保持しつつ所定の処理温度（例えば、４００～６５０℃程度）に加熱する装置であり、サセプタとも呼ばれる。加熱装置１００は、例えば、成膜装置（ＣＶＤ成膜装置やスパッタリング成膜装置等）やエッチング装置（プラズマエッチング装置等）といった半導体製造装置の一部として使用される。 The heating device 100 is a device that holds an object (eg, a semiconductor wafer W) and heats it to a predetermined processing temperature (eg, about 400 to 650° C.), and is also called a susceptor. The heating apparatus 100 is used as part of a semiconductor manufacturing apparatus such as, for example, a film forming apparatus (CVD film forming apparatus, sputtering film forming apparatus, etc.) or an etching apparatus (plasma etching apparatus, etc.).

図１および図２に示すように、加熱装置１００は、保持体１０と柱状支持体２０とを備える。 As shown in FIGS. 1 and 2, the heating device 100 includes a holder 10 and a columnar support 20. As shown in FIG.

保持体１０は、所定の方向（本実施形態ではＺ軸方向）に略直交する表面（以下、「保持面Ｓ１」という。）と、保持面Ｓ１とは反対側の表面（以下、「裏面Ｓ２」という。）と、を有する略円板状の部材である。保持体１０は、窒化アルミニウム（ＡｌＮ）を主成分とするセラミックス焼結体により形成されている。なお、ここでいう主成分とは、含有割合（重量割合）の最も多い成分を意味する。保持体１０の直径は、例えば１００ｍｍ以上、５００ｍｍ以下程度であり、保持体１０の厚さ（上下方向における長さ）は、例えば３ｍｍ以上、２０ｍｍ以下程度である。保持面Ｓ１は、特許請求の範囲における第１の表面に相当し、裏面Ｓ２は、特許請求の範囲における第２の表面に相当し、Ｚ軸方向は、特許請求の範囲における第１の方向に相当する。 The holder 10 has a surface (hereinafter referred to as “holding surface S1”) substantially orthogonal to a predetermined direction (the Z-axis direction in this embodiment) and a surface opposite to the holding surface S1 (hereinafter referred to as “back surface S2 ) and is a substantially disc-shaped member. The holder 10 is made of a ceramic sintered body containing aluminum nitride (AlN) as a main component. In addition, the main component here means the component with the highest content ratio (weight ratio). The diameter of the holder 10 is, for example, about 100 mm or more and 500 mm or less, and the thickness (length in the vertical direction) of the holder 10 is, for example, about 3 mm or more and 20 mm or less. The holding surface S1 corresponds to the first surface in the claims, the back surface S2 corresponds to the second surface in the claims, and the Z-axis direction corresponds to the first direction in the claims. Equivalent to.

図２および図３に示すように、保持体１０の内部には、発熱抵抗体であるヒータ電極５０が配置されている。ヒータ電極５０は、例えば、タングステンまたはモリブデン等の金属を含む材料により形成されている。本実施形態では、ヒータ電極５０は、Ｚ軸方向視で略同心円状に延びる線状のパターンを構成している。ヒータ電極５０の線状パターンの両端部は、保持体１０の中心部近傍に配置されており、各端部にはビア導体５２の上端部が接続されている。図２および図４に示すように、保持体１０の裏面Ｓ２には、一対の第１の凹部１２が形成されており、各第１の凹部１２の位置には、導電性の給電電極５４が設けられている。Ｙ軸方向視において、第１の凹部１２の深さは、０．５ｍｍ以上、５ｍｍ以下である。本実施形態では、給電電極５４は、Ｚ軸方向視で略円形であり、タングステンを含む材料（例えば、タングステンと窒化アルミニウムとの混合材料）により形成されている。また、本実施形態では、給電電極５４の全体が、保持体１０の裏面Ｓ２に露出している。ただし、給電電極５４の少なくとも一部が保持体１０の裏面Ｓ２に露出している限りにおいて、給電電極５４の一部が保持体１０の内部に埋設されていてもよい。ビア導体５２の下端部は、給電電極５４に接続されている。その結果、ヒータ電極５０と給電電極５４とがビア導体５２を介して電気的に接続された状態となっている。なお、給電電極５４の形成材料における熱膨張係数は、例えば、４Ｘ１０－６／℃以上、６Ｘ１０－６／℃以下である。ヒータ電極５０は、特許請求の範囲における発熱抵抗体に相当する。 As shown in FIGS. 2 and 3, inside the holder 10, a heater electrode 50, which is a heating resistor, is arranged. The heater electrode 50 is made of, for example, a material containing metal such as tungsten or molybdenum. In this embodiment, the heater electrode 50 forms a linear pattern extending substantially concentrically when viewed in the Z-axis direction. Both ends of the linear pattern of heater electrode 50 are arranged near the center of holder 10 , and upper ends of via conductors 52 are connected to the respective ends. As shown in FIGS. 2 and 4, a pair of first recesses 12 are formed on the rear surface S2 of the holder 10, and conductive feed electrodes 54 are provided at the positions of each of the first recesses 12. is provided. As viewed in the Y-axis direction, the depth of the first recess 12 is 0.5 mm or more and 5 mm or less. In this embodiment, the power supply electrode 54 has a substantially circular shape when viewed in the Z-axis direction, and is made of a material containing tungsten (for example, a mixed material of tungsten and aluminum nitride). In addition, in this embodiment, the entire power supply electrode 54 is exposed on the rear surface S2 of the holder 10 . However, as long as at least a portion of power supply electrode 54 is exposed on rear surface S<b>2 of holder 10 , part of power supply electrode 54 may be embedded inside holder 10 . A lower end portion of the via conductor 52 is connected to the feeding electrode 54 . As a result, the heater electrode 50 and the power supply electrode 54 are electrically connected through the via conductors 52 . The thermal expansion coefficient of the material forming the feed electrode 54 is, for example, 4×10 −6 /° C. or more and 6×10 −6 /° C. or less. The heater electrode 50 corresponds to a heating resistor in the claims.

図２および図５に示すように、本実施形態では、保持体１０の裏面Ｓ２には、複数の（３つの）第２の凹部１４が形成されている。本実施形態において、各第２の凹部１４は、Ｚ軸方向において、第１の凹部１２よりも外側に形成されている。Ｚ軸方向視において、第２の凹部１４の径は、１ｍｍ以上、５ｍｍ以下である。また、Ｙ軸方向視において、第２の凹部１４の深さは、０．５ｍｍ以上、５ｍｍ以下である。各第２の凹部１４の機能については、後述する。第２の凹部１４は、特許請求の範囲における凹部に相当する。 As shown in FIGS. 2 and 5, in this embodiment, a plurality (three) of second recesses 14 are formed on the rear surface S2 of the holder 10. As shown in FIG. In this embodiment, each second recess 14 is formed outside the first recess 12 in the Z-axis direction. As viewed in the Z-axis direction, the diameter of the second recess 14 is 1 mm or more and 5 mm or less. Further, the depth of the second concave portion 14 is 0.5 mm or more and 5 mm or less when viewed in the Y-axis direction. The function of each second recess 14 will be described later. The second recess 14 corresponds to the recess in the claims.

柱状支持体２０は、上記所定の方向（上下方向）に延びる略円柱状部材である。柱状支持体２０は、保持体１０と同様に、窒化アルミニウムを主成分とするセラミックス焼結体により形成されている。柱状支持体２０の外径は、例えば３０ｍｍ以上、９０ｍｍ以下程度であり、柱状支持体２０の高さ（上下方向における長さ）は、例えば１００ｍｍ以上、３００ｍｍ以下程度である。 The columnar support 20 is a substantially cylindrical member extending in the predetermined direction (vertical direction). Like the holder 10, the columnar support 20 is made of a ceramic sintered body containing aluminum nitride as a main component. The outer diameter of the columnar support 20 is, for example, approximately 30 mm or more and 90 mm or less, and the height (vertical length) of the columnar support 20 is, for example, approximately 100 mm or more and 300 mm or less.

保持体１０と柱状支持体２０とは、保持体１０の裏面Ｓ２と柱状支持体２０の上面Ｓ３とが上下方向に対向するように配置されている。柱状支持体２０は、保持体１０の裏面Ｓ２の中心部付近に、公知の接合材料により形成された接合部３０を介して接合されている。 The holder 10 and the columnar support 20 are arranged such that the back surface S2 of the holder 10 and the upper surface S3 of the columnar support 20 face each other in the vertical direction. The columnar support 20 is joined near the center of the rear surface S2 of the holder 10 via a joint 30 made of a known joint material.

図２に示すように、柱状支持体２０には、保持体１０の裏面Ｓ２側に開口する収容空間２２が形成されている。収容空間２２内（柱状支持体２０の内部）には、柱状支持体２０とは別体として設けられた、上記所定の方向（上下方向）に延びる収容部材９０が備えられている。本実施形態において、収容部材９０の形成材料における熱伝導率は、保持体１０の形成材料における熱伝導率より低い。また、収容部材９０の形成材料としては、例えばアルミナ等のセラミックスを用いることができる。収容部材９０の外径は、柱状支持体２０の内径と略同一（クリアランス：１ｍｍ以下）であり、例えば１５ｍｍ以上、８０ｍｍ以下程度であり、収容部材９０の高さ（上下方向における長さ、部分Ｐに相当）は、例えば１０ｍｍ以上、５０ｍｍ以下程度である。 As shown in FIG. 2, the columnar support 20 is formed with a housing space 22 that opens toward the rear surface S2 of the holder 10 . Inside the housing space 22 (inside the columnar support 20), a housing member 90 is provided separately from the columnar support 20 and extends in the predetermined direction (vertical direction). In this embodiment, the thermal conductivity of the material forming the housing member 90 is lower than the thermal conductivity of the material forming the holder 10 . Ceramics such as alumina, for example, can be used as the material for forming the housing member 90 . The outer diameter of the housing member 90 is substantially the same as the inner diameter of the columnar support 20 (clearance: 1 mm or less), for example, about 15 mm or more and 80 mm or less. P) is, for example, about 10 mm or more and 50 mm or less.

図２および図５に示すように、収容部材９０には、Ｚ軸方向に延びる複数の（本実施形態では４つの）貫通孔９２が形成されている。複数の貫通孔９２には、複数の（本実施形態では４つの（図５参照））端子部材７０が収容されている。本実施形態において、貫通孔９２の数は、端子部材７０の数と同じであるため、一の貫通孔９２に対して、一の端子部材７０が収容される。図２および図４に示すように、本実施形態において、貫通孔９２の内径Ｄｈは、貫通孔９２の長手方向の全体に亘って、同径であり、当該貫通孔９２に収容されている端子部材７０のうちの収容部材９０に収容された部分Ｐの外径Ｄｔと同径である。このため、貫通孔９２の全内周面Ｓ７で、端子部材７０を支持することができ、端子部材７０の揺動を抑制することができる。ここで、「同径」とは、両者の径が完全に一致する構成のみでなく、略同径である構成を含むことを意味する。すなわち、貫通孔９２の内径Ｄｈが、端子部材７０のうちの部分Ｐの外径Ｄｔより僅かに大きい（例えば２００μｍ以内）構成であってもよい。貫通孔９２の内径Ｄｈは、端子部材７０における部分Ｐの外径Ｄｔに依存するが、例えば、１ｍｍ以上、７ｍｍ以下である。貫通孔９２の内径Ｄｈは、特許請求の範囲における貫通孔９２の少なくとも一部の径に相当し、端子部材７０における部分Ｐの外径Ｄｔは、特許請求の範囲における端子部材７０のうちの収容部材９０に収容された部分Ｐの少なくとも一部の径に相当する。 As shown in FIGS. 2 and 5, the housing member 90 is formed with a plurality of (four in this embodiment) through holes 92 extending in the Z-axis direction. A plurality of (four (see FIG. 5) in this embodiment) terminal members 70 are accommodated in the plurality of through holes 92 . In the present embodiment, since the number of through holes 92 is the same as the number of terminal members 70 , one terminal member 70 is accommodated in one through hole 92 . As shown in FIGS. 2 and 4, in the present embodiment, the inner diameter Dh of the through-hole 92 is the same throughout the lengthwise direction of the through-hole 92, and the terminal accommodated in the through-hole 92 is the same diameter. It has the same diameter as the outer diameter Dt of the portion P of the member 70 that is housed in the housing member 90 . Therefore, the terminal member 70 can be supported by the entire inner peripheral surface S<b>7 of the through hole 92 , and swinging of the terminal member 70 can be suppressed. Here, "same diameter" means not only a configuration in which both diameters are completely the same, but also a configuration in which both diameters are substantially the same. That is, the inner diameter Dh of the through hole 92 may be slightly larger than the outer diameter Dt of the portion P of the terminal member 70 (for example, within 200 μm). The inner diameter Dh of the through hole 92 depends on the outer diameter Dt of the portion P of the terminal member 70, but is, for example, 1 mm or more and 7 mm or less. The inner diameter Dh of the through hole 92 corresponds to the diameter of at least a portion of the through hole 92 in the claims, and the outer diameter Dt of the portion P of the terminal member 70 corresponds to the accommodation diameter of the terminal member 70 in the claims. It corresponds to the diameter of at least part of the portion P accommodated in the member 90 .

図２および図５に示すように、本実施形態では、収容部材９０の上面Ｓ４（保持体１０の裏面Ｓ２に対向する表面）には、複数の（３つの）凸部９４が形成されている。Ｚ軸方向視において、各凸部９４は、上述の保持体１０の裏面Ｓ２に形成された複数の（３つの）第２の凹部１４と重なるように形成されている。具体的には、本実施形態において、各凸部９４は、Ｚ軸方向視において、収容部材９０の上面Ｓ４の外周部において、等間隔に配置されている。また、本実施形態において、Ｚ軸方向視において、凸部９４の外径は、第２の凹部１４の内径と略同一であり、１ｍｍ以上、５ｍｍ以下である。また、Ｙ軸方向視において、凸部９４の高さは、第２の凹部１４の深さと略同一であり、０．５ｍｍ以上、５ｍｍ以下である。収容部材９０に形成された各凸部９４と、保持体１０の裏面Ｓ２に形成された各第２の凹部１４とが、係合することにより、保持体１０に対する収容部材９０の面方向への相対移動（例えば、Ｚ軸を中心とした相対回転）が規制される。なお、図５において、第２の凹部１４および凸部９４として図示された点線は、収容部材９０における位置関係を説明するために便宜上図示された点線である。 As shown in FIGS. 2 and 5, in the present embodiment, a plurality (three) of protrusions 94 are formed on the upper surface S4 of the housing member 90 (the surface facing the rear surface S2 of the holder 10). . As viewed in the Z-axis direction, each convex portion 94 is formed so as to overlap with a plurality of (three) second concave portions 14 formed on the rear surface S2 of the holder 10 described above. Specifically, in the present embodiment, the convex portions 94 are arranged at equal intervals on the outer peripheral portion of the upper surface S4 of the housing member 90 as viewed in the Z-axis direction. In addition, in the present embodiment, the outer diameter of the convex portion 94 is substantially the same as the inner diameter of the second concave portion 14 when viewed in the Z-axis direction, and is 1 mm or more and 5 mm or less. In addition, when viewed in the Y-axis direction, the height of the protrusion 94 is substantially the same as the depth of the second recess 14, and is 0.5 mm or more and 5 mm or less. Engagement between the protrusions 94 formed on the housing member 90 and the second recesses 14 formed on the rear surface S2 of the holder 10 allows the housing member 90 to move toward the holder 10 in the plane direction. Relative movement (for example, relative rotation about the Z axis) is restricted. In FIG. 5 , the dotted lines illustrated as the second concave portion 14 and the convex portion 94 are dotted lines that are illustrated for convenience to explain the positional relationship in the housing member 90 .

上述の端子部材７０は、例えばＺ軸方向視で略円形の柱状部材であり、ニッケル（Ｎｉ）含む材料（例えば、純ニッケルやニッケルを含む合金（例えばコバール））により形成されている。端子部材７０の形成材料における熱膨張係数は、例えば、５Ｘ１０－６／℃以上、１８Ｘ１０－６／℃以下である。また、端子部材７０における部分Ｐの外径Ｄｔは、収容部材９０の貫通孔９２の内径Ｄｈに依存するが、例えば、１ｍｍ以上、７ｍｍ以下である。また、図２に示すように、各端子部材７０における部分Ｐの下側には、支持部７２が形成されている。支持部７２の上面Ｓ６は、収容部材９０の下面Ｓ５に当接している。このように、端子部材７０の支持部７２により、収容部材９０は、下方向への移動が規制されている。Ｚ軸方向視において、支持部７２は、例えば、貫通孔９２の内径Ｄｈより２ｍｍ程度大きい径を有する円形状である。なお、Ｚ軸方向において、端子部材７０における、保持体１０の裏面Ｓ２から支持部７２の上面Ｓ６までの長さは、収容部材９０における、凸部９４の上面から下面Ｓ５までの長さより短い。収容部材９０の凸部９４を、保持体１０の第２の凹部１４に、確実に係合させるためである。 The terminal member 70 described above is, for example, a substantially circular columnar member as viewed in the Z-axis direction, and is made of a material containing nickel (Ni) (for example, pure nickel or an alloy containing nickel (for example, Kovar)). The thermal expansion coefficient of the material forming the terminal member 70 is, for example, 5×10 −6 /° C. or more and 18×10 −6 /° C. or less. Also, the outer diameter Dt of the portion P of the terminal member 70 depends on the inner diameter Dh of the through hole 92 of the housing member 90, but is, for example, 1 mm or more and 7 mm or less. Further, as shown in FIG. 2, a support portion 72 is formed below the portion P of each terminal member 70 . The upper surface S<b>6 of the support portion 72 is in contact with the lower surface S<b>5 of the housing member 90 . In this manner, the downward movement of the housing member 90 is restricted by the support portion 72 of the terminal member 70 . When viewed in the Z-axis direction, the support portion 72 has a circular shape having a diameter approximately 2 mm larger than the inner diameter Dh of the through hole 92, for example. In the Z-axis direction, the length from the rear surface S2 of the holder 10 to the upper surface S6 of the support portion 72 in the terminal member 70 is shorter than the length from the upper surface of the protrusion 94 to the lower surface S5 in the housing member 90. This is to ensure that the convex portion 94 of the housing member 90 is engaged with the second concave portion 14 of the holder 10 .

端子部材７０の上端部には、端子部材７０と給電電極５４とを電気的に接続する接続部６５が接合されている。本実施形態において、接続部６５は、緩衝部材６０と、電極側ロウ付け部８１と、端子側ロウ付け部８２とから構成されている。 A connecting portion 65 that electrically connects the terminal member 70 and the power supply electrode 54 is joined to the upper end portion of the terminal member 70 . In this embodiment, the connecting portion 65 is composed of the cushioning member 60 , the electrode-side brazing portion 81 , and the terminal-side brazing portion 82 .

緩衝部材６０は、Ｚ軸方向において各端子部材７０の上端部と各給電電極５４との間に配置されている。緩衝部材６０は、例えばＺ軸方向視で略円形の板状部材であり、タングステンを含む導電性を有する材料（例えば、純タングステンやタングステンを含む合金）により形成されている。緩衝部材６０は、端子部材７０と給電電極５４との間の熱膨張差を緩和する機能を担う部材である。本実施形態において、緩衝部材６０の形成材料における熱膨張係数は、給電電極５４の形成材料における熱膨張係数と等しく、かつ、端子部材７０の形成材料における熱膨張係数より小さい。具体的には、緩衝部材６０の形成材料における熱膨張係数は、４Ｘ１０－６／℃以上、６Ｘ１０－６／℃以下であることが好ましい。緩衝部材６０の直径は、例えば４．５ｍｍ～１０．０ｍｍである。本実施形態において、緩衝部材６０の厚さｔは、第１の凹部１２の深さより小さく、例えば０．５ｍｍ～２ｍｍである。 The buffer member 60 is arranged between the upper end portion of each terminal member 70 and each power supply electrode 54 in the Z-axis direction. The buffer member 60 is, for example, a substantially circular plate-like member when viewed in the Z-axis direction, and is made of a conductive material containing tungsten (for example, pure tungsten or an alloy containing tungsten). The buffer member 60 is a member that functions to reduce the difference in thermal expansion between the terminal member 70 and the power supply electrode 54 . In this embodiment, the coefficient of thermal expansion of the material forming the buffer member 60 is equal to the coefficient of thermal expansion of the material forming the power supply electrode 54 and smaller than the coefficient of thermal expansion of the material forming the terminal member 70 . Specifically, the thermal expansion coefficient of the material forming the buffer member 60 is preferably 4×10 −6 /° C. or more and 6×10 −6 /° C. or less. The diameter of the cushioning member 60 is, for example, 4.5 mm to 10.0 mm. In this embodiment, the thickness t of the cushioning member 60 is smaller than the depth of the first recess 12, eg, 0.5 mm to 2 mm.

緩衝部材６０の上面は、電極側ロウ付け部８１により、給電電極５４の下面（露出面）と接合（ロウ付け）されている。また、緩衝部材６０の下面は、端子側ロウ付け部８２により、端子部材７０と接合されている。電極側ロウ付け部８１および端子側ロウ付け部８２は、例えば、Ｎｉ系（Ｎｉ－Ｃｒ系合金等）、Ａｕ系（純Ａｕ、Ａｕ－Ｎｉ系合金等）、Ａｇ系（純Ａｇ等）のロウ材である。電極側ロウ付け部８１は、特許請求の範囲における第２のロウ付け部に相当し、端子側ロウ付け部８２は、特許請求の範囲における第１のロウ付け部に相当する。 The upper surface of the buffer member 60 is joined (brazed) to the lower surface (exposed surface) of the power supply electrode 54 by the electrode-side brazing portion 81 . A lower surface of the cushioning member 60 is joined to the terminal member 70 by a terminal-side brazing portion 82 . The electrode-side brazing portion 81 and the terminal-side brazing portion 82 are made of, for example, Ni-based (Ni--Cr-based alloys, etc.), Au-based (pure Au, Au--Ni-based alloys, etc.), Ag-based (pure Ag, etc.) It is brazing material. The electrode-side brazing portion 81 corresponds to the second brazing portion in the claims, and the terminal-side brazing portion 82 corresponds to the first brazing portion in the claims.

本実施形態において、接続部６５を構成する緩衝部材６０、電極側ロウ付け部８１および端子側ロウ付け部８２のうち、端子側ロウ付け部８２は、Ｚ軸方向視における外径が最も小さい（図４参照）。従って、図５の拡大図に示すように、本実施形態において、Ｚ軸方向視において、この端子側ロウ付け部８２の最外縁Ｅｂは、貫通孔９２の最内縁Ｅｎを取り囲んでいる。換言すれば、本実施形態において、Ｚ軸方向視において、接続部６５の最外縁は、収容部材９０における貫通孔９２の最内縁Ｅｎを取り囲んでいる。なお、図５において、端子側ロウ付け部８２として図示された点線は、収容部材９０の貫通孔９２と比較するために便宜上図示された点線である。 In the present embodiment, among the buffer member 60, the electrode-side brazing portion 81, and the terminal-side brazing portion 82 that constitute the connection portion 65, the terminal-side brazing portion 82 has the smallest outer diameter when viewed in the Z-axis direction ( See Figure 4). Therefore, as shown in the enlarged view of FIG. 5, in this embodiment, the outermost edge Eb of the terminal-side brazing portion 82 surrounds the innermost edge En of the through-hole 92 when viewed in the Z-axis direction. In other words, in the present embodiment, the outermost edge of the connecting portion 65 surrounds the innermost edge En of the through hole 92 in the housing member 90 when viewed in the Z-axis direction. In FIG. 5 , the dotted line shown as the terminal-side brazing portion 82 is a dotted line shown for convenience of comparison with the through hole 92 of the housing member 90 .

図示しない電源から各端子部材７０、各緩衝部材６０、各給電電極５４、各ビア導体５２を介してヒータ電極５０に電圧が印加されると、ヒータ電極５０が発熱し、保持体１０の保持面Ｓ１上に保持された対象物（例えば、半導体ウェハＷ）が所定の温度（例えば、４００～６５０℃程度）に加熱される。 When a voltage is applied from a power supply (not shown) to the heater electrodes 50 through the terminal members 70, the buffer members 60, the power supply electrodes 54, and the via conductors 52, the heater electrodes 50 generate heat, and the holding surface of the holder 10 is deformed. An object (for example, a semiconductor wafer W) held on S1 is heated to a predetermined temperature (for example, about 400 to 650.degree. C.).

Ａ－２．加熱装置１００の製造方法：
次に、第１実施形態における加熱装置１００の製造方法について説明する。図６は、第１実施形態における加熱装置１００の製造方法を示すフローチャートである。また、図７は、第１実施形態における加熱装置１００の製造方法の概要を示す説明図である。 A-2. Manufacturing method of heating device 100:
Next, a method for manufacturing the heating device 100 according to the first embodiment will be described. FIG. 6 is a flow chart showing a method for manufacturing the heating device 100 according to the first embodiment. 7A and 7B are explanatory diagrams showing an overview of the manufacturing method of the heating device 100 according to the first embodiment.

加熱装置１００（保持体１０および柱状支持体２０）の製造方法は、例えば以下の通りである。初めに、保持体１０を準備する（Ｓ１１０）。 A method of manufacturing the heating device 100 (the holder 10 and the columnar support 20) is, for example, as follows. First, the holder 10 is prepared (S110).

保持体１０の作製方法は、例えば以下の通りである。まず、窒化アルミニウム粉末１００重量部に、酸化イットリウム（Ｙ２Ｏ３）粉末１重量部と、アクリル系バインダ２０重量部と、適量の分散剤および可塑剤とを加えた混合物に、トルエン等の有機溶剤を加え、ボールミルにて混合し、グリーンシート用スラリーを作製する。このグリーンシート用スラリーをキャスティング装置でシート状に成形した後に乾燥させ、グリーンシートを複数枚作製する。 A method for manufacturing the holder 10 is, for example, as follows. First, to a mixture of 100 parts by weight of aluminum nitride powder, 1 part by weight of yttrium oxide (Y 2 O 3 ) powder, 20 parts by weight of an acrylic binder, and appropriate amounts of a dispersant and a plasticizer, an organic solvent such as toluene is added. A solvent is added and mixed in a ball mill to prepare a green sheet slurry. This green sheet slurry is formed into a sheet by a casting apparatus and then dried to produce a plurality of green sheets.

また、窒化アルミニウム粉末、アクリル系バインダ、有機溶剤の混合物に、タングステンやモリブデン等の導電性粉末を添加して混練することにより、メタライズペーストを作製する。このメタライズペーストを例えばスクリーン印刷装置を用いて印刷することにより、特定のグリーンシートに、後にヒータ電極５０や給電電極５４等となる未焼結導体層を形成する。また、グリーンシートにあらかじめビア孔を設けた状態でメタライズペーストを印刷することにより、後にビア導体５２となる未焼結導体部を形成する。 Alternatively, a metallizing paste is prepared by adding a conductive powder such as tungsten or molybdenum to a mixture of aluminum nitride powder, an acrylic binder, and an organic solvent and kneading the mixture. By printing this metallizing paste using, for example, a screen printer, an unsintered conductor layer that will later become the heater electrode 50, the power supply electrode 54, and the like is formed on a specific green sheet. In addition, by printing the metallizing paste in a state where the via holes are provided in advance in the green sheet, an unsintered conductor portion which becomes the via conductor 52 later is formed.

次に、これらのグリーンシートを複数枚（例えば２０枚）熱圧着し、必要に応じて外周を切断して、グリーンシート積層体を作製する。このグリーンシート積層体をマシニングによって切削加工して円板状の成形体を作製し、この成形体を脱脂し、さらにこの脱脂体を焼成して焼成体を作製する。この焼成体の表面を研磨加工する。以上の工程により、保持体１０を準備することができる。ステップＳ１１０は、特許請求の範囲における第１の工程に相当する。 Next, a plurality (for example, 20) of these green sheets are thermocompressed, and the periphery is cut as necessary to produce a green sheet laminate. This green sheet laminate is cut by machining to produce a disk-shaped molded body, the molded body is degreased, and the degreased body is fired to manufacture a fired body. The surface of this sintered body is polished. Through the steps described above, the holder 10 can be prepared. Step S110 corresponds to the first step in the claims.

次に、保持体１０と、予め準備した柱状支持体２０とを、接合部３０を介して接合する（Ｓ１２０、図７（Ａ）参照）。すなわち、保持体１０の裏面Ｓ２および柱状支持体２０の上面Ｓ３に対して必要によりラッピング加工を行った後、保持体１０の裏面Ｓ２と柱状支持体２０の上面Ｓ３との少なくとも一方に、例えば希土類や有機溶剤等を混合してペースト状にした公知の接合剤（接合前接合部３０Ｐ）を均一に塗布した後、脱脂処理する。次いで、保持体１０の裏面Ｓ２と柱状支持体２０の上面Ｓ３とを重ね合わせ、真空中または減圧した窒素ガスやアルゴンガス等の不活性ガス中で、所定の条件（例えば、第１の温度Ｔ１：１４００℃～１８５０℃程度、圧力：０．５ＭＰａ～１０ＭＰａ程度）でホットプレス焼成することにより、保持体１０と柱状支持体２０とを接合する接合部３０を形成する。ステップＳ１２０は、特許請求の範囲における第２の工程に相当する。 Next, the holder 10 and the columnar support 20 prepared in advance are joined via the joining portion 30 (S120, see FIG. 7A). That is, after the rear surface S2 of the holder 10 and the upper surface S3 of the columnar support 20 are subjected to lapping as necessary, at least one of the rear surface S2 of the holder 10 and the upper surface S3 of the columnar support 20 is coated with, for example, a rare earth element. After uniformly applying a known bonding agent (pre-bonding bonding portion 30P) made into a paste by mixing an organic solvent or the like, degreasing treatment is performed. Next, the back surface S2 of the holder 10 and the top surface S3 of the columnar support 20 are superimposed, and placed under a predetermined condition (for example, the first temperature T1) in a vacuum or in an inert gas such as a reduced pressure nitrogen gas or argon gas. : about 1400° C. to 1850° C., pressure: about 0.5 MPa to 10 MPa. Step S120 corresponds to the second step in the claims.

なお、柱状支持体２０の作製方法は、例えば以下の通りである。まず、窒化アルミニウム粉末１００重量部に、酸化イットリウム粉末１重量部と、ＰＶＡバインダ３重量部と、適量の分散剤および可塑剤とを加えた混合物に、メタノール等の有機溶剤を加え、ボールミルにて混合し、スラリーを得る。このスラリーをスプレードライヤーにて顆粒化し、原料粉末を作製する。次に、収容空間２２に対応する中子が配置されたゴム型に原料粉末を充填し、冷間静水圧プレスして成形体を得る。得られた成形体を脱脂し、さらにこの脱脂体を焼成する。以上の工程により、柱状支持体２０が作製される。 A method for manufacturing the columnar support 20 is, for example, as follows. First, an organic solvent such as methanol is added to a mixture of 100 parts by weight of aluminum nitride powder, 1 part by weight of yttrium oxide powder, 3 parts by weight of a PVA binder, and appropriate amounts of a dispersant and a plasticizer, followed by a ball mill. Mix to obtain a slurry. This slurry is granulated with a spray dryer to produce a raw material powder. Next, the raw material powder is filled into a rubber mold in which a core corresponding to the housing space 22 is arranged, and is subjected to cold isostatic pressing to obtain a compact. The molded body obtained is degreased, and the degreased body is fired. Through the steps described above, the columnar support 20 is manufactured.

保持体１０と柱状支持体２０との接合の後、各給電電極５４の下面に、各接続前接続部６５Ｐの上面を配置する（Ｓ１３０、図７（Ｂ）参照）。具体的には、各接続前接続部６５Ｐを構成する各緩衝部材６０の上面および下面に、ロウ材（例えば、Ｎｉ系、Ａｕ系、Ａｇ系のロウ材）を配置し、当該ロウ材が配置された各接続前接続部６５Ｐの上面を、各給電電極５４の下面に配置する。なお、後述のステップＳ１５０において、各緩衝部材６０の上面に配置されたロウ材から電極側ロウ付け部８１が形成され、各緩衝部材６０の下面に配置されたロウ材から端子側ロウ付け部８２が形成される。ステップＳ１３０は、特許請求の範囲における第３の工程に相当する。 After the holding member 10 and the columnar support member 20 are joined, the upper surface of each pre-connection connecting portion 65P is placed on the lower surface of each power supply electrode 54 (S130, see FIG. 7B). Specifically, a brazing material (for example, Ni-based, Au-based, or Ag-based brazing material) is placed on the upper and lower surfaces of each cushioning member 60 that constitutes each pre-connection connecting portion 65P, and the brazing material is placed. The upper surface of each pre-connection connecting portion 65</b>P thus formed is arranged on the lower surface of each feeding electrode 54 . In step S150, which will be described later, the electrode-side brazing portion 81 is formed from the brazing material placed on the upper surface of each buffer member 60, and the terminal-side brazing portion 82 is formed from the brazing material placed on the lower surface of each buffer member 60. is formed. Step S130 corresponds to the third step in the claims.

次に、柱状支持体２０の内部へ、予め準備された収容部材９０を配置する（Ｓ１４０、図７（Ｃ）参照）。具体的には、Ｚ軸方向において、収容部材９０に形成された各貫通孔９２と、各給電電極５４とがそれぞれ重なるように、収容部材９０を柱状支持体２０の収容空間２２へ配置する。本実施形態では、更に、収容部材９０に形成された凸部９４と、保持体１０の裏面Ｓ２に形成された第２の凹部１４とが係合するように、収容部材９０を配置する。ステップＳ１４０は、特許請求の範囲における第４の工程に相当する。 Next, the accommodating member 90 prepared in advance is placed inside the columnar support 20 (S140, see FIG. 7C). Specifically, the housing member 90 is placed in the housing space 22 of the columnar support 20 so that the through holes 92 formed in the housing member 90 and the power supply electrodes 54 overlap each other in the Z-axis direction. Further, in this embodiment, the housing member 90 is arranged so that the projection 94 formed on the housing member 90 and the second recess 14 formed on the rear surface S2 of the holder 10 are engaged. Step S140 corresponds to the fourth step in the claims.

なお、収容部材９０の作製方法は、例えば以下の通りである。まず、柱状支持体２０の作製方法と同様に、窒化アルミニウム粉末１００重量部に、酸化イットリウム粉末１重量部と、ＰＶＡバインダ３重量部と、適量の分散剤および可塑剤とを加えた混合物に、メタノール等の有機溶剤を加え、ボールミルにて混合し、スラリーを得る。このスラリーをスプレードライヤーにて顆粒化し、原料粉末を作製する。次に、収容部材９０が型取られたゴム型に原料粉末を充填し、冷間静水圧プレスして成形体を得る。得られた成形体を脱脂し、さらにこの脱脂体を焼成する。以上の工程により、収容部材９０が作製される。 A method for manufacturing the housing member 90 is, for example, as follows. First, in the same manner as in the method for producing the columnar support 20, a mixture of 100 parts by weight of aluminum nitride powder, 1 part by weight of yttrium oxide powder, 3 parts by weight of PVA binder, and appropriate amounts of a dispersant and a plasticizer was added. An organic solvent such as methanol is added and mixed in a ball mill to obtain a slurry. This slurry is granulated with a spray dryer to produce a raw material powder. Next, the raw material powder is filled into the rubber mold in which the housing member 90 has been molded, and is subjected to cold isostatic pressing to obtain a compact. The molded body obtained is degreased, and the degreased body is fired. The housing member 90 is manufactured by the above steps.

柱状支持体２０の収容空間２２へ、収容部材９０を配置した後、各端子部材７０を、収容部材９０に形成された各貫通孔９２内に挿入し、各接続部６５を介して各給電電極５４と接続する（Ｓ１５０、図７（Ｄ）参照）。具体的には、各端子部材７０を各貫通孔９２内に挿入し、各端子部材７０の上端部を各緩衝部材６０の下面に配置されたロウ材へ配置する。その後、真空中または減圧した窒素ガスやアルゴンガス等の不活性ガス中で、所定の条件（例えば、第２の温度Ｔ２：６００℃～１０００℃程度）で加熱することにより、各端子部材７０と、各給電電極５４とを接続する接続部６５を形成する。これにより、各給電電極５４と各緩衝部材６０とをロウ付けする電極側ロウ付け部８１が形成され、各緩衝部材６０と各端子部材７０とをロウ付けする端子側ロウ付け部８２が形成される。なお、電極側ロウ付け部８１および端子側ロウ付け部８２を形成するための第２の温度Ｔ２は、接合部３０を形成するための第１の温度Ｔ１より低い温度を要する。ステップＳ１５０は、特許請求の範囲における第５の工程に相当する。主として以上の製造方法により、上述した構成の加熱装置１００が製造される。 After arranging the housing member 90 in the housing space 22 of the columnar support 20 , each terminal member 70 is inserted into each through hole 92 formed in the housing member 90 and connected to each power supply electrode via each connection portion 65 . 54 (S150, see FIG. 7(D)). Specifically, each terminal member 70 is inserted into each through hole 92 , and the upper end portion of each terminal member 70 is placed on the brazing material arranged on the lower surface of each buffer member 60 . After that, each terminal member 70 is heated under predetermined conditions (for example, second temperature T2: about 600° C. to 1000° C.) in a vacuum or an inert gas such as nitrogen gas or argon gas under reduced pressure. , to form a connection portion 65 for connecting each power supply electrode 54 . As a result, electrode-side brazing portions 81 for brazing the power supply electrodes 54 and the buffer members 60 are formed, and terminal-side brazing portions 82 for brazing the buffer members 60 and the terminal members 70 are formed. be. The second temperature T2 for forming the electrode-side brazing portion 81 and the terminal-side brazing portion 82 requires a lower temperature than the first temperature T1 for forming the joining portion 30. FIG. Step S150 corresponds to the fifth step in the claims. The heating device 100 having the configuration described above is manufactured mainly by the manufacturing method described above.

Ａ－３．第１実施形態の効果：
以上説明したように、本実施形態の加熱装置１００は、保持面Ｓ１および裏面Ｓ２を有する板状であり、ヒータ電極５０を有する保持体１０と、保持体１０の裏面Ｓ２に接合された柱状支持体２０と、保持体１０の裏面Ｓ２に配置された複数の給電電極５４と、複数の給電電極５４にそれぞれ電気的に接続された複数の端子部材７０と、端子部材７０の一方の端部に接合され、端子部材７０と給電電極５４とを電気的に接続する接続部６５と、を備え、保持体１０の保持面Ｓ１上に保持された半導体ウェハＷといった対象物を加熱する加熱装置である。本実施形態の加熱装置１００は、さらに、柱状支持体２０の内部に、柱状支持体２０とは別体として設けられた収容部材９０を備える。 A-3. Effect of the first embodiment:
As described above, the heating device 100 of the present embodiment has a plate shape having a holding surface S1 and a back surface S2. a plurality of power supply electrodes 54 arranged on the back surface S2 of the holder 10; a plurality of terminal members 70 electrically connected to the plurality of power supply electrodes 54; The heating device includes a connecting portion 65 that is joined and electrically connects the terminal member 70 and the power supply electrode 54, and heats an object such as a semiconductor wafer W held on the holding surface S1 of the holding body 10. . The heating device 100 of this embodiment further includes a housing member 90 provided inside the columnar support 20 as a separate member from the columnar support 20 .

このように、本実施形態の加熱装置１００では、収容部材９０が柱状支持体２０とは別体であるため、柱状支持体２０と収容部材９０とが一体である構成と比較して、柱状支持体２０の製造が容易である。また、収容部材９０が柱状支持体２０とは別体であることにより、柱状支持体２０を保持体１０に接合し、接続部６５の端子部材７０との接続前の状態である接続前接続部６５Ｐを配置した後に、収容部材９０を配置することができる。すなわち、本実施形態の加熱装置１００では、接続前接続部６５Ｐを収容部材９０に形成された貫通孔９２に挿通することを要しないため、貫通孔９２の全体に亘って当該貫通孔９２の内径Ｄｈを接続前接続部６５Ｐの大きさに合わせる必要がなく、接続前接続部６５Ｐひいては接続部６５の大きさ（例えば、径）を十分に確保できる。換言すれば、貫通孔９２のうち接続部６５に対応する必要な部分のみ、接続部６５に対応する大きさ（径）とすることができる。このため、接続部６５に対応する必要な部分以外は、端子部材７０の大きさ（例えば、外径Ｄｔ）に合わせて貫通孔９２の大きさ（例えば、内径Ｄｈ）を小さくすることができる。このように、本実施形態の加熱装置１００では、接続部６５の大きさ（例えば、径）を十分に確保できるため、端子部材７０と給電電極５４との間の接続強度を向上させ、ひいては、端子部材７０の給電電極５４からの脱離を抑制することができる。また、貫通孔９２の大きさ（例えば、内径Ｄｈ）を小さくすることができるため、保持面Ｓ１上に温度特異点が発生することを抑制することができ、ひいては、保持面Ｓ１の均熱性を確保することができる。 As described above, in the heating device 100 of the present embodiment, since the housing member 90 is separate from the columnar support 20, compared to the configuration in which the columnar support 20 and the housing member 90 are integrated, the columnar support can be reduced. The body 20 is easy to manufacture. Further, since the housing member 90 is separate from the columnar support 20, the columnar support 20 is joined to the holding member 10, and the pre-connection connection portion, which is the state before the connection portion 65 is connected to the terminal member 70, is provided. After placing 65P, the containing member 90 can be placed. That is, in the heating device 100 of the present embodiment, since it is not necessary to insert the pre-connection connecting portion 65P into the through-hole 92 formed in the housing member 90, the inner diameter of the through-hole 92 extends over the entire through-hole 92. It is not necessary to match Dh with the size of the pre-connection connecting portion 65P, and the size (for example, diameter) of the pre-connection connecting portion 65P and the connecting portion 65 can be sufficiently secured. In other words, only the necessary portion of the through-hole 92 corresponding to the connection portion 65 can have a size (diameter) corresponding to the connection portion 65 . Therefore, the size (eg, inner diameter Dh) of the through-hole 92 can be reduced in accordance with the size (eg, outer diameter Dt) of the terminal member 70 except for the required portion corresponding to the connecting portion 65 . As described above, in the heating device 100 of the present embodiment, the size (for example, the diameter) of the connecting portion 65 can be sufficiently secured, so that the strength of connection between the terminal member 70 and the power supply electrode 54 can be improved. Detachment of the terminal member 70 from the power supply electrode 54 can be suppressed. In addition, since the size (for example, the inner diameter Dh) of the through-hole 92 can be reduced, it is possible to suppress the occurrence of a temperature singularity on the holding surface S1, thereby improving the temperature uniformity of the holding surface S1. can be secured.

また、収容部材９０には、Ｚ軸方向に延びる複数の貫通孔９２が形成されている。本実施形態において、貫通孔９２の数は、端子部材７０の数と同数であり、複数の端子部材７０は、それぞれ、複数の貫通孔９２の内の異なる貫通孔９２に収容されている。また、貫通孔９２の内径Ｄｈは、端子部材７０のうちの収容部材９０に収容された部分Ｐの外径Ｄｔと同径である。このため、収容部材９０に形成された貫通孔９２の内周面Ｓ７、すなわち、端子部材７０のうちの収容部材９０に収容された部分Ｐの外径Ｄｔと同径である貫通孔９２の内周面Ｓ７によって、端子部材７０を支持することができる。従って、本実施形態の加熱装置１００によれば、端子部材７０の揺動を抑制しつつ、端子部材７０と給電電極５４との間の接続強度を向上させ、ひいては、給電電極５４付近の保持体１０におけるクラック発生を抑制し、または、端子部材７０の給電電極５４からの脱離の抑制することができる。 A plurality of through holes 92 extending in the Z-axis direction are formed in the housing member 90 . In this embodiment, the number of through-holes 92 is the same as the number of terminal members 70 , and the plurality of terminal members 70 are housed in different through-holes 92 among the plurality of through-holes 92 . Further, the inner diameter Dh of the through hole 92 is the same diameter as the outer diameter Dt of the portion P of the terminal member 70 accommodated in the accommodating member 90 . For this reason, the inner peripheral surface S7 of the through hole 92 formed in the housing member 90, that is, the inner diameter of the through hole 92 having the same diameter as the outer diameter Dt of the portion P of the terminal member 70 that is housed in the housing member 90. The terminal member 70 can be supported by the peripheral surface S7. Therefore, according to the heating device 100 of the present embodiment, the strength of the connection between the terminal member 70 and the power supply electrode 54 is improved while suppressing the swinging of the terminal member 70 . 10 can be suppressed, or detachment of the terminal member 70 from the power supply electrode 54 can be suppressed.

本実施形態の加熱装置１００では、保持体１０は、裏面Ｓ２に第２の凹部１４を有し、収容部材９０は、上面に第２の凹部１４と係合し、かつ、面方向への相対移動が規制されるように設けられた凸部９４を有する。これにより、保持体１０の裏面Ｓ２に形成された給電電極５４に対する端子部材７０の面方向への相対移動が規制される。従って、本実施形態の加熱装置１００によれば、端子部材７０と給電電極５４との間に位置する接続部６５に面方向の応力が集中することを抑制することができ、ひいては、給電電極５４付近の保持体１０におけるクラック発生の抑制、または、端子部材７０の給電電極５４からの脱離の抑制をより効果的に抑制することができる。 In the heating device 100 of the present embodiment, the holding body 10 has the second recess 14 on the back surface S2, and the housing member 90 engages the second recess 14 on the top surface and faces the surface direction. It has a convex portion 94 provided so as to restrict its movement. As a result, relative movement of the terminal member 70 in the planar direction with respect to the power supply electrode 54 formed on the rear surface S2 of the holder 10 is restricted. Therefore, according to the heating device 100 of the present embodiment, it is possible to suppress concentration of stress in the plane direction on the connecting portion 65 located between the terminal member 70 and the power supply electrode 54 , and furthermore, the power supply electrode 54 It is possible to more effectively suppress the occurrence of cracks in the nearby holder 10 or suppress the detachment of the terminal member 70 from the power supply electrode 54 .

本実施形態の加熱装置１００では、接続部６５は、緩衝部材６０と、電極側ロウ付け部８１と、端子側ロウ付け部８２とを備える。緩衝部材６０は、給電電極５４と端子部材７０との間に配置され、導電性を有する。電極側ロウ付け部８１は、給電電極５４と緩衝部材６０とを接合し、端子側ロウ付け部８２は、端子部材７０と緩衝部材６０とを接合する。また、緩衝部材６０の形成材料における熱膨張係数は、給電電極５４の形成材料における熱膨張係数以上であり、かつ、端子部材７０の形成材料における熱膨張係数以下である。このため、緩衝部材６０が、給電電極５４と端子部材７０との間の熱膨張差を緩和する機能を担うことができる。従って、本実施形態の加熱装置１００によれば、給電電極５４付近の保持体１０におけるクラック発生の抑制、または、端子部材７０の給電電極５４からの脱離の抑制をより効果的に抑制することができる。 In the heating device 100 of the present embodiment, the connecting portion 65 includes the cushioning member 60 , the electrode-side brazing portion 81 , and the terminal-side brazing portion 82 . The buffer member 60 is arranged between the power supply electrode 54 and the terminal member 70 and has conductivity. The electrode-side brazing portion 81 joins the power supply electrode 54 and the buffer member 60 , and the terminal-side brazing portion 82 joins the terminal member 70 and the buffer member 60 . The thermal expansion coefficient of the material forming the buffer member 60 is equal to or greater than the thermal expansion coefficient of the material forming the power supply electrode 54 and equal to or smaller than the thermal expansion coefficient of the material forming the terminal member 70 . Therefore, the buffer member 60 can have the function of alleviating the difference in thermal expansion between the power supply electrode 54 and the terminal member 70 . Therefore, according to the heating device 100 of the present embodiment, it is possible to more effectively suppress the occurrence of cracks in the holder 10 near the power supply electrode 54 or the suppression of the detachment of the terminal member 70 from the power supply electrode 54. can be done.

本実施形態の加熱装置１００では、収容部材９０の形成材料における熱伝導率は、保持体１０の形成材料における熱伝導率より低い。このため、収容部材９０の形成材料における熱伝導率が、保持体１０の形成材料における熱伝導率と同等以上である構成と比較して、保持体１０からの収容部材９０を介した熱引きを抑制することができる。 In the heating device 100 of the present embodiment, the thermal conductivity of the material forming the housing member 90 is lower than the thermal conductivity of the material forming the holder 10 . For this reason, compared to a configuration in which the material forming the housing member 90 has a thermal conductivity equal to or greater than that of the material forming the holder 10, heat transfer from the holder 10 via the housing member 90 is reduced. can be suppressed.

本実施形態の加熱装置１００の製造方法では、Ｚ軸方向に略直交する保持面Ｓ１および裏面Ｓ２を有する板状であり、ヒータ電極５０を有する保持体１０を備え、保持体１０の保持面Ｓ１上に保持された半導体ウェハＷといった対象物を加熱する加熱装置１００の製造方法において、複数の給電電極５４が裏面Ｓ２に配置された保持体１０を準備する第１の工程（Ｓ１１０）と、保持体１０と、柱状支持体２０と、保持体１０と柱状支持体２０との間に配置された接合前接合部３０Ｐとを配置し、かつ、加熱することにより、保持体１０と柱状支持体２０とを接合する接合部３０を形成する第２の工程（Ｓ１２０）と、複数の給電電極５４の下面に、複数の接続前接続部６５Ｐを配置する第３の工程（Ｓ１３０）と、Ｚ軸方向に延びる複数の貫通孔９２が形成された収容部材９０を、Ｚ軸方向において、複数の貫通孔９２と複数の給電電極５４とがそれぞれ重なるように、柱状支持体２０の内部（収容空間２２）に配置する第４の工程（Ｓ１４０）と、複数の貫通孔９２内へ複数の端子部材７０をそれぞれ挿入し、加熱することにより、複数の端子部材７０と複数の給電電極５４とを接続する複数の接続部６５を形成する第５の工程（Ｓ１５０）とを備える。また、収容部材９０に形成された貫通孔９２の少なくとも一部の内径Ｄｈは、端子部材７０のうちの収容部材９０に収容される部分Ｐの少なくとも一部の外径Ｄｔと同径である。 In the manufacturing method of the heating device 100 of the present embodiment, the plate-like holder 10 having the holding surface S1 and the back surface S2 substantially perpendicular to the Z-axis direction and having the heater electrode 50 is provided. In the manufacturing method of the heating device 100 for heating the object such as the semiconductor wafer W held thereon, a first step (S110) of preparing the holding body 10 having the plurality of power supply electrodes 54 arranged on the rear surface S2; By arranging and heating the body 10, the columnar support 20, and the pre-bonding joint portion 30P arranged between the holder 10 and the columnar support 20, the holder 10 and the columnar support 20 are bonded together. a second step (S120) of forming a joint portion 30 that joins the two, a third step (S130) of arranging a plurality of pre-connection connection portions 65P on the lower surfaces of the plurality of power supply electrodes 54, and a Z-axis direction An accommodating member 90 formed with a plurality of through holes 92 extending to the inside of the columnar support 20 (accommodating space 22) such that the plurality of through holes 92 and the plurality of power supply electrodes 54 respectively overlap in the Z-axis direction. and a plurality of terminal members 70 are inserted into the plurality of through holes 92 and heated to connect the plurality of terminal members 70 and the plurality of power supply electrodes 54 . and a fifth step (S150) of forming the connecting portion 65 of the. At least a portion of the through hole 92 formed in the housing member 90 has an inner diameter Dh that is the same as an outer diameter Dt of at least a portion P of the terminal member 70 that is housed in the housing member 90 .

このため、本実施形態の加熱装置１００の製造方法では、上記本実施形態の加熱装置１００による効果と同様に、柱状支持体２０と収容部材９０とが一体である構成と比較して、柱状支持体２０の製造が容易である。また、上記本実施形態の加熱装置１００による効果と同様に、接続部６５の大きさ（例えば、径）を十分に確保できるため、端子部材７０と給電電極５４との間の接続強度を向上させ、ひいては、端子部材７０の給電電極５４からの脱離を抑制することが可能な加熱装置１００を製造することができる。また、上記本実施形態の加熱装置１００による効果と同様に、貫通孔９２の大きさ（例えば、内径Ｄｈ）を小さくすることができるため、保持面Ｓ１上に温度特異点が発生することを抑制することができ、ひいては、保持面Ｓ１の均熱性を確保することが可能な加熱装置１００を製造することができる。更には、本実施形態の加熱装置１００の製造方法では、収容部材９０に形成された貫通孔９２の内径Ｄｈは、端子部材７０のうちの収容部材９０に収容される部分の外径Ｄｔと同径である。このため、収容部材９０に形成された貫通孔９２の内周面Ｓ７、すなわち、端子部材７０のうちの収容部材９０に収容された部分Ｐの外径Ｄｔと同径である貫通孔９２の内周面Ｓ７によって、端子部材７０を支持することが可能な加熱装置１００を製造することができる。従って、本実施形態の加熱装置１００の製造方法によれば、端子部材７０の揺動を抑制しつつ、端子部材７０と給電電極５４との間の接続強度を向上させ、ひいては、給電電極５４付近の保持体１０におけるクラック発生を抑制し、または、端子部材７０の給電電極５４からの脱離の抑制することが可能な加熱装置１００を製造することができる。 For this reason, in the method for manufacturing the heating device 100 of the present embodiment, similarly to the effect of the heating device 100 of the present embodiment, compared to the structure in which the columnar support 20 and the housing member 90 are integrated, the columnar support The body 20 is easy to manufacture. Further, as with the effect of the heating device 100 of the present embodiment, the size (for example, the diameter) of the connection portion 65 can be sufficiently secured, so that the connection strength between the terminal member 70 and the power supply electrode 54 can be improved. Furthermore, it is possible to manufacture the heating device 100 capable of suppressing detachment of the terminal member 70 from the power supply electrode 54 . Further, as with the effect of the heating device 100 of the present embodiment, the size of the through-hole 92 (for example, the inner diameter Dh) can be reduced, thereby suppressing the occurrence of a temperature singularity on the holding surface S1. It is possible to manufacture the heating device 100 capable of ensuring uniform heating of the holding surface S1. Furthermore, in the manufacturing method of the heating device 100 of the present embodiment, the inner diameter Dh of the through hole 92 formed in the housing member 90 is the same as the outer diameter Dt of the portion of the terminal member 70 that is housed in the housing member 90 . diameter. For this reason, the inner peripheral surface S7 of the through hole 92 formed in the housing member 90, that is, the inner diameter of the through hole 92 having the same diameter as the outer diameter Dt of the portion P of the terminal member 70 that is housed in the housing member 90. The heating device 100 capable of supporting the terminal member 70 can be manufactured by the peripheral surface S7. Therefore, according to the method of manufacturing the heating device 100 of the present embodiment, it is possible to improve the connection strength between the terminal member 70 and the power supply electrode 54 while suppressing the swinging of the terminal member 70 . It is possible to manufacture the heating device 100 that can suppress the occurrence of cracks in the holder 10 or suppress the detachment of the terminal member 70 from the power supply electrode 54 .

本実施形態では、保持体１０と柱状支持体２０とを接合する接合部３０を形成した（Ｓ１２０、第１の温度Ｔ１）後、複数の接続前接続部６５Ｐを配置し（Ｓ１３０）、複数の端子部材７０と複数の給電電極５４とを接続する複数の接続部６５を形成している（Ｓ１５０、第２の温度Ｔ２）。接続部６５を形成するための第２の温度Ｔ２は、接合部３０を形成するための第１の温度Ｔ１より低い温度を要する。第２の温度Ｔ２が第１の温度Ｔ１以上であると、接続部６５が軟化し、給電電極５４から剥がれるおそれがあるためである。従って、本実施形態の加熱装置１００の製造方法によれば、さらに、接続部６５の給電電極５４からの剥がれを抑制することができる。 In the present embodiment, after forming the joint portion 30 for joining the holding member 10 and the columnar support member 20 (S120, first temperature T1), a plurality of pre-connection connection portions 65P are arranged (S130), and a plurality of A plurality of connection portions 65 connecting the terminal member 70 and the plurality of power supply electrodes 54 are formed (S150, second temperature T2). The second temperature T2 for forming the connecting portion 65 requires a temperature lower than the first temperature T1 for forming the bonding portion 30. FIG. This is because, if the second temperature T2 is equal to or higher than the first temperature T1, the connection portion 65 may be softened and peeled off from the power supply electrode 54 . Therefore, according to the method for manufacturing the heating device 100 of the present embodiment, it is possible to further suppress the peeling of the connection portion 65 from the power supply electrode 54 .

Ｂ．第２実施形態：
図８は、第２実施形態の加熱装置１００ａの構成を概略的に示す説明図である。図８には、第２実施形態の加熱装置１００ａの構成のうち図４に示す部分（Ｘ１部）と同等の部分の構成が拡大して示されている。図８に示すように、第２実施形態の加熱装置１００ａは、接続部６５に代えて接続部６５ａを、収容部材９０に代えて収容部材９０ａを備えている点で、上述した第１実施形態の加熱装置１００の構成と異なる。以下では、第２実施形態の加熱装置１００ａの構成のうち、上述した第１実施形態の加熱装置１００ａの構成（図４等参照）と同一の構成については、同一の符号を付すことによってその説明を適宜省略する。 B. Second embodiment:
FIG. 8 is an explanatory diagram schematically showing the configuration of the heating device 100a of the second embodiment. FIG. 8 shows an enlarged view of the configuration of a portion of the heating device 100a of the second embodiment that is equivalent to the portion (X1 section) shown in FIG. As shown in FIG. 8, the heating device 100a of the second embodiment has a connecting portion 65a instead of the connecting portion 65, and an accommodating member 90a instead of the accommodating member 90, which is the same as the heating device 100a of the first embodiment described above. is different from the configuration of the heating device 100 of . In the following, of the configuration of the heating device 100a of the second embodiment, the configuration that is the same as the configuration of the heating device 100a of the first embodiment described above (see FIG. 4, etc.) will be described by attaching the same reference numerals. are omitted as appropriate.

本実施形態の接続部６５ａは、第１実施形態の接続部６５と同様に、端子部材７０と給電電極５４とを電気的に接続し、端子部材７０の上端部に接合されている。本実施形態において、接続部６５ａは、緩衝部材６０ａと、電極側ロウ付け部８１と、端子側ロウ付け部８２とから構成されている。第１実施形態の緩衝部材６０と同様に、緩衝部材６０ａは、Ｚ軸方向において各端子部材７０の上端部と各給電電極５４との間に配置されている。緩衝部材６０ａは、例えば板状部材であり、タングステンを含む導電性を有する材料により形成されている。第１実施形態の緩衝部材６０と同様に、緩衝部材６０ａの形成材料における熱膨張係数は、給電電極５４の形成材料における熱膨張係数以上であり、かつ、端子部材７０の形成材料における熱膨張係数以下である。緩衝部材６０ａの直径は、例えば４．５ｍｍ～１０．０ｍｍである。本実施形態において、緩衝部材６０ａの厚さｔａは、第１の凹部１２の深さより大きく、例えば２ｍｍ～５ｍｍである。 The connection portion 65a of the present embodiment electrically connects the terminal member 70 and the power supply electrode 54 and is joined to the upper end portion of the terminal member 70, similarly to the connection portion 65 of the first embodiment. In the present embodiment, the connecting portion 65a is composed of the cushioning member 60a, the electrode-side brazing portion 81, and the terminal-side brazing portion . Similar to the cushioning member 60 of the first embodiment, the cushioning member 60a is arranged between the upper end portion of each terminal member 70 and each feeding electrode 54 in the Z-axis direction. The buffer member 60a is, for example, a plate-like member and is made of a conductive material containing tungsten. As with the cushioning member 60 of the first embodiment, the thermal expansion coefficient of the material forming the cushioning member 60a is greater than or equal to the thermal expansion coefficient of the material forming the power supply electrode 54, and the thermal expansion coefficient of the material forming the terminal member 70 It is below. The diameter of the cushioning member 60a is, for example, 4.5 mm to 10.0 mm. In this embodiment, the thickness ta of the cushioning member 60a is larger than the depth of the first recess 12, for example 2 mm to 5 mm.

本実施形態では、柱状支持体２０の収容空間２２内（柱状支持体２０の内部）には、収容部材９０ａが備えられている。収容部材９０ａは、第１実施形態の収容部材９０と同様に、柱状支持体２０とは別体として設けられた、上記所定の方向（上下方向）に延びる部材である。収容部材９０ａの形成材料については、第１実施形態の収容部材９０と同様である。すなわち、収容部材９０ａの形成材料における熱伝導率は、柱状支持体２０の形成材料における熱伝導率より低い。また、収容部材９０の形成材料としては、例えばアルミナ等のセラミックスを用いることができる。また、第１実施形態の収容部材９０と同様に、収容部材９０ａの外径は、柱状支持体２０の内径と略同一であり、例えば１５ｍｍ以上、８０ｍｍ以下程度であり、収容部材９０の高さ（上下方向における長さ、部分Ｐに相当）は、例えば１０ｍｍ以上、５０ｍｍ以下程度である。また、第１実施形態の収容部材９０と同様に、収容部材９０ａには、Ｚ軸方向に延びる複数の（本実施形態では４つの）貫通孔９２が形成されており、一の貫通孔９２に対して、一の端子部材７０が収容される。 In this embodiment, a housing member 90a is provided in the housing space 22 of the columnar support 20 (inside the columnar support 20). The housing member 90a is a member that extends in the predetermined direction (vertical direction) and is provided separately from the columnar support 20, like the housing member 90 of the first embodiment. The material for forming the housing member 90a is the same as that of the housing member 90 of the first embodiment. That is, the thermal conductivity of the material forming the housing member 90 a is lower than the thermal conductivity of the material forming the columnar support 20 . Ceramics such as alumina, for example, can be used as the material for forming the housing member 90 . Further, similarly to the housing member 90 of the first embodiment, the housing member 90a has an outer diameter substantially equal to the inner diameter of the columnar support 20, for example, about 15 mm or more and 80 mm or less. (The length in the vertical direction, corresponding to the portion P) is, for example, about 10 mm or more and 50 mm or less. Further, similarly to the housing member 90 of the first embodiment, the housing member 90a is formed with a plurality of (four in this embodiment) through-holes 92 extending in the Z-axis direction. On the other hand, one terminal member 70 is accommodated.

図８に示すように、本実施形態では、収容部材９０ａに形成された貫通孔９２は、その上端部（すなわち、保持体１０の裏面Ｓ２に対向する側の端部）に、拡径部９６を備えている。本実施形態において、拡径部９６の内径Ｄｅは、貫通孔９２の内径Ｄｈより大きい。換言すれば、拡径部９６は、貫通孔９２と比較して、拡大された径を有している。また、拡径部９６の内径Ｄｅは、保持体１０の裏面Ｓ２に形成された第１の凹部１２の内径Ｄｄより大きい。 As shown in FIG. 8, in the present embodiment, the through hole 92 formed in the housing member 90a has an enlarged diameter portion 96 at its upper end (that is, the end facing the back surface S2 of the holder 10). It has In this embodiment, the inner diameter De of the expanded diameter portion 96 is larger than the inner diameter Dh of the through hole 92 . In other words, the enlarged diameter portion 96 has an enlarged diameter compared to the through hole 92 . In addition, the inner diameter De of the expanded diameter portion 96 is larger than the inner diameter Dd of the first recess 12 formed in the rear surface S2 of the holder 10 .

本実施形態では、貫通孔９２の上端部が拡径部９６を備えていることにより、当該上端部付近において、拡径空間９８を有している。本実施形態において、拡径空間９８内には、接続部６５ａの一部分が配置されている。このように、本実施形態の加熱装置１００ａでは、貫通孔９２が拡径部９６を備えているため、第１実施形態における緩衝部材６０の厚さｔより厚い厚さｔａを有する緩衝部材６０ａを第１の凹部１２内に配置することができる。このため、本実施形態では、緩衝部材６０ａが緩衝部材６０と比較して、給電電極５４と端子部材７０との間の熱膨張差を緩和する機能をより効果的に発揮することができる。なお、拡径空間９８は、拡径部９６を画定する内周面Ｓ８および底面Ｓ９と、収容部材９０ａの上面Ｓ４ａ（保持体１０の裏面Ｓ２に対向する表面）で形成される空間である。ここで、拡径部９６を画定する底面Ｓ９は、当該底面Ｓ９を面方向に延長した面を含む面であり、収容部材９０ａの上面Ｓ４ａは、当該上面Ｓ４ａを面方向に延長した面を含む面である。拡径部９６を画定する内周面Ｓ８および底面Ｓ９は、特許請求の範囲における拡径部を画定する内面に相当し、収容部材９０ａの上面Ｓ４ａは、特許請求の範囲における収容部材における保持体の第２の表面に対向する表面に相当する。 In the present embodiment, the upper end portion of the through hole 92 is provided with the enlarged diameter portion 96 so that the enlarged diameter space 98 is formed in the vicinity of the upper end portion. In this embodiment, a portion of the connecting portion 65a is arranged in the expanded diameter space 98 . As described above, in the heating device 100a of the present embodiment, since the through hole 92 has the enlarged diameter portion 96, the cushioning member 60a having the thickness ta larger than the thickness t of the cushioning member 60 in the first embodiment is used. It can be arranged in the first recess 12 . For this reason, in the present embodiment, the cushioning member 60 a can exhibit the function of alleviating the difference in thermal expansion between the power supply electrode 54 and the terminal member 70 more effectively than the cushioning member 60 . The enlarged diameter space 98 is a space defined by the inner peripheral surface S8 and the bottom surface S9 that define the enlarged diameter portion 96, and the upper surface S4a of the housing member 90a (the surface facing the rear surface S2 of the holder 10). Here, the bottom surface S9 defining the expanded diameter portion 96 is a surface including a surface extending the bottom surface S9 in the planar direction, and the upper surface S4a of the housing member 90a includes a surface extending the upper surface S4a in the planar direction. It is the surface. The inner peripheral surface S8 and the bottom surface S9 defining the enlarged diameter portion 96 correspond to the inner surface defining the enlarged diameter portion in the claims, and the upper surface S4a of the housing member 90a corresponds to the holding body of the housing member in the claims. corresponds to the surface facing the second surface of the .

本実施形態の加熱装置１００ａでは、収容部材９０ａに形成された貫通孔９２の上端部（保持体１０の裏面Ｓ２に対向する側の端部）が、拡径部９６を備えていることにより、当該上端部付近において、拡径空間９８を有している。また、端子部材７０に接合された接続部６５ａの少なくとも一部分（本実施形態において、緩衝部材６０ａの一部分および端子側ロウ付け部８２）が、上記拡径空間９８内に配置されている。このため、本実施形態の加熱装置１００ａでは、充分な量の接続部６５ａ（本実施形態において、例えば、厚さの厚い緩衝部材６０ａ）を配置することができ、ひいては、給電電極５４と端子部材７０との間の熱膨張差をより効果的に担うことができる。また、従って、本実施形態の加熱装置１００ａによれば、給電電極５４付近の保持体１０におけるクラック発生の抑制、または、端子部材７０の給電電極５４からの脱離の抑制をより効果的に抑制することができる。 In the heating device 100a of the present embodiment, the upper end portion of the through hole 92 formed in the housing member 90a (the end portion on the side facing the back surface S2 of the holder 10) is provided with the enlarged diameter portion 96. It has an enlarged diameter space 98 near the upper end. At least a portion of the connecting portion 65a joined to the terminal member 70 (in this embodiment, a portion of the cushioning member 60a and the terminal-side brazing portion 82) is arranged within the expanded diameter space 98. As shown in FIG. For this reason, in the heating device 100a of the present embodiment, a sufficient amount of connection portions 65a (in the present embodiment, for example, the thick cushioning member 60a) can be arranged, and the power supply electrode 54 and the terminal member can be arranged. 70 can be more effectively borne. Further, according to the heating device 100a of the present embodiment, therefore, it is possible to more effectively suppress the occurrence of cracks in the holder 10 near the power supply electrode 54, or the suppression of the detachment of the terminal member 70 from the power supply electrode 54. can do.

また、一般的な加熱装置１００では、保持体１０の厚さが薄い。このため、保持体１０の裏面Ｓ２に形成される第１の凹部１２の深さを深くしないことが好ましい。保持体１０内において、保持面Ｓ１とヒータ電極５０との間の距離を確保しつつ、第１の凹部１２の底面とヒータ電極５０との間の距離を確保するためである。本実施形態の加熱装置１００では、収容部材９０ａに形成された貫通孔９２の上端部が拡径部９６を備えているため、第１の凹部１２の深さを深くすることなく、上記充分な量の接続部６５ａを配置することができる。 Moreover, in the general heating device 100, the thickness of the holder 10 is thin. Therefore, it is preferable not to deepen the depth of the first concave portion 12 formed on the back surface S2 of the holder 10 . This is to secure the distance between the bottom surface of the first concave portion 12 and the heater electrode 50 while securing the distance between the holding surface S<b>1 and the heater electrode 50 in the holder 10 . In the heating device 100 of the present embodiment, since the upper end portion of the through hole 92 formed in the housing member 90a is provided with the enlarged diameter portion 96, the depth of the first recess portion 12 is not increased, and the above sufficient A number of connections 65a can be provided.

Ｃ．変形例：
本明細書で開示される技術は、上述の実施形態に限られるものではなく、その要旨を逸脱しない範囲において種々の形態に変形することができ、例えば次のような変形も可能である。 C. Variant:
The technology disclosed in this specification is not limited to the above-described embodiments, and can be modified in various forms without departing from the scope of the invention. For example, the following modifications are possible.

上記実施形態では、収容部材９０に形成された貫通孔９２の数が、端子部材７０の数と同数としたが、これに限定されない。例えば、貫通孔９２の数は、端子部材７０の数より多くてもよい。また、上記実施形態では、端子部材７０は、間接的にヒータ電極５０に接続しているが、これに限定されない。例えば、端子部材７０は、ヒータ電極５０以外の内部電極（ＲＦ電極等）に接続していてもよい。 In the above embodiment, the number of through-holes 92 formed in the housing member 90 is the same as the number of terminal members 70, but the present invention is not limited to this. For example, the number of through holes 92 may be greater than the number of terminal members 70 . Moreover, although the terminal member 70 is indirectly connected to the heater electrode 50 in the above embodiment, the present invention is not limited to this. For example, the terminal member 70 may be connected to an internal electrode (RF electrode or the like) other than the heater electrode 50 .

上記実施形態では、収容部材９０に形成された貫通孔９２の内径Ｄｈ、および、端子部材７０のうちの収容部材９０に収容された部分Ｐの外径Ｄｔは、貫通孔９２の長手方向の全体に亘ってそれぞれ同径であり、かつ、内径Ｄｈと外径Ｄｔとは同径であることとしたが、これに限定されない。例えば、端子部材７０のうちの収容部材９０に収容された部分Ｐの少なくとも一部分における外径Ｄｔが、貫通孔９２の内径Ｄｈと同径である構成であってもよい。すなわち、端子部材７０のうちの収容部材９０に収容された部分Ｐの上記少なくとも一部分以外の部分、貫通孔９２の内径Ｄｈより小さい径であってもよい。 In the above-described embodiment, the inner diameter Dh of the through hole 92 formed in the housing member 90 and the outer diameter Dt of the portion P of the terminal member 70 that is housed in the housing member 90 are the entire longitudinal direction of the through hole 92. , and the inner diameter Dh and the outer diameter Dt are the same, but the present invention is not limited to this. For example, the outer diameter Dt of at least a portion of the portion P of the terminal member 70 accommodated in the accommodation member 90 may be the same as the inner diameter Dh of the through hole 92 . That is, the portion of the terminal member 70 other than the at least one portion of the portion P housed in the housing member 90 may have a smaller diameter than the inner diameter Dh of the through hole 92 .

上記実施形態では、Ｚ軸方向において、接続部６５の最外縁は、収容部材９０における貫通孔９２の最内縁Ｅｎを取り囲んでいるとしたが、これに限定されない。例えば、貫通孔９２の最内縁Ｅｎが、接続部６５の最外縁を取り囲んでいてもよい。また、接続部６５を構成する緩衝部材６０と、電極側ロウ付け部８１と、端子側ロウ付け部８２との少なくとも１つの最外縁が、貫通孔９２の最内縁Ｅｎを取り囲んでいるとしてもよい。 In the above embodiment, the outermost edge of the connecting portion 65 surrounds the innermost edge En of the through-hole 92 in the housing member 90 in the Z-axis direction, but the present invention is not limited to this. For example, the innermost edge En of the through hole 92 may surround the outermost edge of the connecting portion 65 . At least one of the outermost edges of the cushioning member 60 , the electrode-side brazing portion 81 , and the terminal-side brazing portion 82 forming the connection portion 65 may surround the innermost edge En of the through-hole 92 . .

上記実施形態では、保持体１０の裏面Ｓ２には３つの第２の凹部１４が形成され、収容部材９０の上面Ｓ４には３つの凸部９４が形成されているがこれに限定されない。例えば、保持体１０の裏面Ｓ２および収容部材９０の上面Ｓ４には、それぞれ第２の凹部１４および凸部９４が形成されていなくてもよい。または、例えば、それぞれ２つ以下の、または、４つ以上の第２の凹部１４および凸部９４が形成されていてもよい。また、第２の凹部１４は、第１の凹部１２よりも外側に形成されていなくてもよく、凸部９４は、収容部材９０の上面Ｓ４の外周部において等間隔に配置されていなくてもよい。例えば、第２の凹部１４および凸部９４は、それぞれ保持体１０の裏面Ｓ２および収容部材９０の上面Ｓ４のそれぞれ中央部に配置されていてもよい。また、例えば、第２の凹部１４は、Ｚ軸方向視において、第１の凹部１２で形成される円周上に形成されていてもよい。 In the above embodiment, the back surface S2 of the holder 10 is formed with three second recesses 14, and the upper surface S4 of the housing member 90 is formed with three protrusions 94, but the present invention is not limited to this. For example, the second concave portion 14 and the convex portion 94 may not be formed on the rear surface S2 of the holder 10 and the upper surface S4 of the housing member 90, respectively. Alternatively, for example, two or less or four or more second recesses 14 and protrusions 94 may be formed. Further, the second recess 14 may not be formed outside the first recess 12, and the protrusions 94 may not be arranged at regular intervals on the outer peripheral portion of the upper surface S4 of the housing member 90. good. For example, the second concave portion 14 and the convex portion 94 may be arranged at the center portions of the rear surface S2 of the holder 10 and the upper surface S4 of the housing member 90, respectively. Further, for example, the second recess 14 may be formed on the circumference formed by the first recess 12 when viewed in the Z-axis direction.

上記実施形態では、接続部６５（接続部６５ａ）は、緩衝部材６０（緩衝部材６０ａ）と、電極側ロウ付け部８１と、端子側ロウ付け部８２とを備えているが、これに限定されない。例えば、接続部６５（接続部６５ａ）が、端子側ロウ付け部８２のみから構成されていてもよい。この構成において、端子側ロウ付け部８２の上面は、給電電極５４に接合（ロウ付け）される。 In the above embodiment, the connection portion 65 (connection portion 65a) includes the buffer member 60 (buffer member 60a), the electrode-side brazing portion 81, and the terminal-side brazing portion 82, but is not limited to this. . For example, the connecting portion 65 (connecting portion 65 a ) may be composed of only the terminal-side brazing portion 82 . In this configuration, the upper surface of the terminal-side brazing portion 82 is joined (brazed) to the power supply electrode 54 .

上記実施形態において、緩衝部材６０（緩衝部材６０ａ）の形成材料における熱膨張係数は、給電電極５４の形成材料における熱膨張係数を超えてもよく、または、給電電極５４の形成材料における熱膨張係数未満であってもよい。また、緩衝部材６０（緩衝部材６０ａ）の形成材料における熱膨張係数は、端子部材７０の形成材料における熱膨張係数以上であってもよい。 In the above embodiment, the coefficient of thermal expansion of the material forming the buffer member 60 (buffer member 60a) may exceed the coefficient of thermal expansion of the material forming the power supply electrode 54, or the coefficient of thermal expansion of the material forming the power supply electrode 54 may be less than Further, the coefficient of thermal expansion of the material forming the buffer member 60 (buffer member 60 a ) may be greater than or equal to the coefficient of thermal expansion of the material forming the terminal member 70 .

上記実施形態において、収容部材９０の形成材料における熱伝導率が、柱状支持体２０の形成材料における熱伝導率と同等以上であってもよい。 In the above embodiment, the thermal conductivity of the material forming the housing member 90 may be equal to or greater than the thermal conductivity of the material forming the columnar support 20 .

上記実施形態において、端子部材７０に形成された支持部７２は、Ｚ軸方向視において、円形状でなくてもよく、例えば、矩形状や、複数の突起から形成される歯車状であってもよい。 In the above embodiment, the support portion 72 formed on the terminal member 70 may not have a circular shape when viewed in the Z-axis direction, and may have, for example, a rectangular shape or a gear shape formed from a plurality of projections. good.

第２実施形態において、収容部材９０ａの貫通孔９２ａに形成された拡径部９６の内径Ｄｅは、保持体１０の裏面Ｓ２に形成された第１の凹部１２の内径Ｄｄと同等であってもよい。 In the second embodiment, even if the inner diameter De of the expanded diameter portion 96 formed in the through hole 92a of the housing member 90a is equal to the inner diameter Dd of the first recess 12 formed in the rear surface S2 of the holder 10, good.

第２実施形態において、保持体１０の裏面Ｓ２には第１の凹部１２が形成されていなくてもよい。このような構成においても、収容部材９０ａに形成された貫通孔９２の上端部が拡径部９６を備えていることにより、充分な量の接続部６５ａ（緩衝部材６０ａ、電極側ロウ付け部８１および端子側ロウ付け部８２）を配置することができる。このため、接続部６５ａと給電電極５４（または端子部材７０）との接合をより強固にすることができる。このため、端子部材７０と給電電極５４との接続強度を向上させることができる。 In the second embodiment, the first concave portion 12 may not be formed on the rear surface S2 of the holding member 10 . Also in such a configuration, since the upper end portion of the through hole 92 formed in the housing member 90a is provided with the enlarged diameter portion 96, a sufficient amount of the connection portion 65a (buffer member 60a, electrode-side brazing portion 81) is provided. and a terminal-side brazing portion 82) can be arranged. Therefore, the connection between the connection portion 65a and the power supply electrode 54 (or the terminal member 70) can be made stronger. Therefore, the connection strength between the terminal member 70 and the power supply electrode 54 can be improved.

また、上記実施形態の加熱装置１００が、さらに、熱電対や白金抵抗体等の測温体や、高周波電極（ＲＦ電極）等の他の構成部材を備えるとしてもよい。 In addition, the heating device 100 of the above-described embodiment may further include other components such as a thermocouple, a platinum resistor, or other temperature detector, or a high-frequency electrode (RF electrode).

また、上記実施形態の加熱装置１００における各部材を形成する材料は、あくまで例示であり、各部材が他の材料により形成されてもよい。また、上記実施形態における加熱装置１００の製造方法は、あくまで一例であり、種々変形可能である。 Further, the materials forming each member in the heating device 100 of the above-described embodiment are merely examples, and each member may be formed of another material. Moreover, the manufacturing method of the heating device 100 in the above-described embodiment is merely an example, and various modifications are possible.

１０：保持体 １２：第１の凹部 １４：第２の凹部 ２０：柱状支持体 ２２：収容空間 ３０：接合部 ３０Ｐ：接合前接合部 ５０：ヒータ電極 ５２：ビア導体 ５４：給電電極 ６０：緩衝部材 ６０ａ：緩衝部材 ６５：接続部 ６５Ｐ：接続前接続部 ６５ａ：接続部 ７０：端子部材 ７２：支持部 ８１：電極側ロウ付け部 ８２：端子側ロウ付け部 ９０：収容部材 ９０ａ：収容部材 ９２：貫通孔 ９２ａ：貫通孔 ９４：凸部 ９６：拡径部 ９８：拡径空間 １００：加熱装置 １００ａ：加熱装置 Ｐ：部分 Ｓ１：保持面 Ｓ２：裏面 Ｓ３：上面 Ｓ４：上面 Ｓ４ａ：上面 Ｓ５：下面 Ｓ６：上面 Ｓ７：内周面 Ｓ８：内周面 Ｓ９：底面 Ｗ：半導体ウェハ 10: Holder 12: First concave portion 14: Second concave portion 20: Columnar support 22: Accommodating space 30: Joint portion 30P: Joint portion before joining 50: Heater electrode 52: Via conductor 54: Feeding electrode 60: Buffer Member 60a: Buffer member 65: Connection portion 65P: Pre-connection connection portion 65a: Connection portion 70: Terminal member 72: Support portion 81: Electrode-side brazing portion 82: Terminal-side brazing portion 90: Accommodating member 90a: Accommodating member 92 : Through hole 92a: Through hole 94: Protruding portion 96: Expanded diameter portion 98: Expanded diameter space 100: Heating device 100a: Heating device P: Part S1: Holding surface S2: Back surface S3: Upper surface S4: Upper surface S4a: Upper surface S5: Lower surface S6: Upper surface S7: Inner peripheral surface S8: Inner peripheral surface S9: Bottom surface W: Semiconductor wafer

Claims (4)

第１の方向に略直交する第１の表面および第２の表面を有する板状であり、発熱抵抗体を有する保持体と、
前記第１の方向に延びる柱状であり、前記保持体の前記第２の表面に接合された柱状支持体と、
前記保持体の前記第２の表面に配置された複数の給電電極と、
前記第１の方向に延びる複数の端子部材であって、それぞれ、前記複数の給電電極に電気的に接続された複数の端子部材と、
前記端子部材の一方の端部に接合され、前記端子部材と前記給電電極とを電気的に接続する接続部と、
を備え、前記保持体の前記第１の表面上に保持された対象物を加熱する加熱装置において、さらに、
前記柱状支持体の内部に、前記柱状支持体とは別体として設けられた収容部材、を備え、
前記収容部材には、前記第１の方向に延びる複数の貫通孔が形成されており、
前記貫通孔の数は、前記端子部材の数と同数以上であり、
前記複数の端子部材は、それぞれ、前記複数の貫通孔の内の異なる貫通孔に収容され、
前記貫通孔の少なくとも一部の径は、前記端子部材のうちの前記収容部材に収容された部分の少なくとも一部の径と同径であり、
前記保持体は、前記第２の表面に凹部を有し、
前記収容部材は、前記保持体の前記第２の表面に対向する表面に、前記凹部と係合し、かつ、前記第１の方向に略直交する第２の方向への相対移動が規制されるように設けられた凸部を有する、
ことを特徴とする加熱装置。 a plate-like holder having a first surface and a second surface substantially perpendicular to the first direction and having a heating resistor;
a columnar support member extending in the first direction and joined to the second surface of the holder;
a plurality of power supply electrodes arranged on the second surface of the holding body;
a plurality of terminal members extending in the first direction, each terminal member being electrically connected to the plurality of power supply electrodes;
a connecting portion that is joined to one end of the terminal member and electrically connects the terminal member and the power supply electrode;
A heating device for heating an object held on the first surface of the holding body, further comprising:
a housing member provided inside the columnar support as a separate member from the columnar support;
a plurality of through holes extending in the first direction are formed in the housing member,
The number of through-holes is equal to or greater than the number of terminal members,
the plurality of terminal members are accommodated in different through holes among the plurality of through holes,
At least a portion of the through hole has a diameter equal to a diameter of at least a portion of a portion of the terminal member accommodated in the accommodation member,
the holding body has a recess in the second surface,
The housing member engages with the recess on a surface facing the second surface of the holding body, and is restricted in relative movement in a second direction substantially orthogonal to the first direction. having a convex portion provided as
A heating device characterized by: 第１の方向に略直交する第１の表面および第２の表面を有する板状であり、発熱抵抗体を有する保持体と、
前記第１の方向に延びる柱状であり、前記保持体の前記第２の表面に接合された柱状支持体と、
前記保持体の前記第２の表面に配置された複数の給電電極と、
前記第１の方向に延びる複数の端子部材であって、それぞれ、前記複数の給電電極に電気的に接続された複数の端子部材と、
前記端子部材の一方の端部に接合され、前記端子部材と前記給電電極とを電気的に接続する接続部と、
を備え、前記保持体の前記第１の表面上に保持された対象物を加熱する加熱装置において、さらに、
前記柱状支持体の内部に、前記柱状支持体とは別体として設けられた収容部材、を備え、
前記収容部材には、前記第１の方向に延びる複数の貫通孔が形成されており、
前記貫通孔の数は、前記端子部材の数と同数以上であり、
前記複数の端子部材は、それぞれ、前記複数の貫通孔の内の異なる貫通孔に収容され、
前記貫通孔の少なくとも一部の径は、前記端子部材のうちの前記収容部材に収容された部分の少なくとも一部の径と同径であり、
前記収容部材に形成された前記貫通孔の、前記保持体の前記第２の表面に対向する側の端部は、径が拡大された拡径部、を備え、
前記接続部の少なくとも一部分は、前記拡径部を画定する内面と、前記収容部材における前記保持体の前記第２の表面に対向する表面で形成される拡径空間内に配置されている、
ことを特徴とする加熱装置。 a plate-like holder having a first surface and a second surface substantially perpendicular to the first direction and having a heating resistor;
a columnar support member extending in the first direction and joined to the second surface of the holder;
a plurality of power supply electrodes arranged on the second surface of the holding body;
a plurality of terminal members extending in the first direction, each terminal member being electrically connected to the plurality of power supply electrodes;
a connecting portion that is joined to one end of the terminal member and electrically connects the terminal member and the power supply electrode;
A heating device for heating an object held on the first surface of the holding body, further comprising:
a housing member provided inside the columnar support as a separate member from the columnar support;
a plurality of through holes extending in the first direction are formed in the housing member,
The number of through-holes is equal to or greater than the number of terminal members,
the plurality of terminal members are accommodated in different through holes among the plurality of through holes,
At least a portion of the through hole has a diameter equal to a diameter of at least a portion of a portion of the terminal member accommodated in the accommodation member,
an end portion of the through hole formed in the housing member on a side facing the second surface of the holding body includes an enlarged diameter portion having an enlarged diameter;
At least part of the connecting portion is arranged in an enlarged diameter space formed by an inner surface defining the enlarged diameter portion and a surface of the housing member facing the second surface of the holder,
A heating device characterized by: 第１の方向に略直交する第１の表面および第２の表面を有する板状であり、発熱抵抗体を有する保持体と、
前記第１の方向に延びる柱状であり、前記保持体の前記第２の表面に接合された柱状支持体と、
前記保持体の前記第２の表面に配置された複数の給電電極と、
前記第１の方向に延びる複数の端子部材であって、それぞれ、前記複数の給電電極に電気的に接続された複数の端子部材と、
前記端子部材の一方の端部に接合され、前記端子部材と前記給電電極とを電気的に接続する接続部と、
を備え、前記保持体の前記第１の表面上に保持された対象物を加熱する加熱装置において、さらに、
前記柱状支持体の内部に、前記柱状支持体とは別体として設けられた収容部材、を備え、
前記収容部材には、前記第１の方向に延びる複数の貫通孔が形成されており、
前記貫通孔の数は、前記端子部材の数と同数以上であり、
前記複数の端子部材は、それぞれ、前記複数の貫通孔の内の異なる貫通孔に収容され、
前記貫通孔の少なくとも一部の径は、前記端子部材のうちの前記収容部材に収容された部分の少なくとも一部の径と同径であり、
前記収容部材の形成材料における熱伝導率は、前記保持体の形成材料における熱伝導率より低い、
ことを特徴とする加熱装置。 a plate-like holder having a first surface and a second surface substantially perpendicular to the first direction and having a heating resistor;
a columnar support member extending in the first direction and joined to the second surface of the holder;
a plurality of power supply electrodes arranged on the second surface of the holding body;
a plurality of terminal members extending in the first direction, each terminal member being electrically connected to the plurality of power supply electrodes;
a connecting portion that is joined to one end of the terminal member and electrically connects the terminal member and the power supply electrode;
A heating device for heating an object held on the first surface of the holding body, further comprising:
a housing member provided inside the columnar support as a separate member from the columnar support;
a plurality of through holes extending in the first direction are formed in the housing member,
The number of through-holes is equal to or greater than the number of terminal members,
the plurality of terminal members are accommodated in different through holes among the plurality of through holes,
At least a portion of the through hole has a diameter equal to a diameter of at least a portion of a portion of the terminal member accommodated in the accommodation member,
The thermal conductivity of the material forming the housing member is lower than the thermal conductivity of the material forming the holder.
A heating device characterized by: 第１の方向に略直交する第１の表面および第２の表面を有する板状であり、発熱抵抗体を有する保持体、を備え、前記保持体の前記第１の表面上に保持された対象物を加熱する加熱装置の製造方法において、
複数の給電電極が前記第２の表面に配置された前記保持体を準備する第１の工程と、
前記保持体と、柱状支持体と、前記保持体と前記柱状支持体との間に配置された接合前接合部とを配置し、かつ、加熱することにより、前記保持体と前記柱状支持体とを接合する接合部を形成する第２の工程と、
前記複数の給電電極の、前記保持体における前記第２の表面に対向する表面とは反対側の表面に、複数の接続前接続部を配置する第３の工程と、
前記第１の方向に延びる複数の貫通孔が形成された収容部材を、前記第１の方向において、前記複数の貫通孔と前記複数の給電電極とがそれぞれ重なるように、前記柱状支持体の内部に配置する第４の工程と、
前記複数の貫通孔内へ複数の端子部材をそれぞれ挿入し、加熱することにより、前記複数の端子部材と前記複数の給電電極とを接続する複数の接続部を形成する第５の工程と、を備え、
前記収容部材に形成された前記貫通孔の少なくとも一部の径は、前記端子部材のうちの前記収容部材に収容される部分の少なくとも一部の径と同径である、
ことを特徴とする加熱装置の製造方法。 A plate-shaped holder having a first surface and a second surface substantially orthogonal to a first direction and having a heat generating resistor, an object held on the first surface of the holder In a method for manufacturing a heating device that heats an object,
a first step of providing the holder having a plurality of feed electrodes disposed on the second surface;
By arranging and heating the holding body, the columnar support, and the pre-bonding joint portion arranged between the holding body and the columnar support, the holding body and the columnar support are separated from each other. a second step of forming a joint that joins the
a third step of arranging a plurality of pre-connection connecting portions on the surfaces of the plurality of power supply electrodes on the side opposite to the surface of the holding body facing the second surface;
A housing member having a plurality of through holes extending in the first direction is disposed inside the columnar support so that the plurality of through holes and the plurality of power supply electrodes respectively overlap in the first direction. a fourth step of placing in
a fifth step of inserting a plurality of terminal members into the plurality of through holes and heating them to form a plurality of connection portions connecting the plurality of terminal members and the plurality of power supply electrodes; prepared,
At least a portion of the through hole formed in the housing member has a diameter equal to a diameter of at least a portion of a portion of the terminal member that is housed in the housing member.
A method of manufacturing a heating device, characterized by:
JP2019095077A 2019-05-21 2019-05-21 Heating device and method for manufacturing the heating device Active JP7265930B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019095077A JP7265930B2 (en) 2019-05-21 2019-05-21 Heating device and method for manufacturing the heating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019095077A JP7265930B2 (en) 2019-05-21 2019-05-21 Heating device and method for manufacturing the heating device

Publications (2)

Publication Number Publication Date
JP2020191199A JP2020191199A (en) 2020-11-26
JP7265930B2 true JP7265930B2 (en) 2023-04-27

Family

ID=73455100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019095077A Active JP7265930B2 (en) 2019-05-21 2019-05-21 Heating device and method for manufacturing the heating device

Country Status (1)

Country Link
JP (1) JP7265930B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220084328A (en) * 2019-11-14 2022-06-21 교세라 가부시키가이샤 Systems for ceramic structures and wafers

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179897A (en) 2001-09-11 2006-07-06 Sumitomo Electric Ind Ltd Workpiece holder, susceptor for semiconductor manufacturing apparatus, and processing apparatus
JP2008130609A (en) 2006-11-16 2008-06-05 Ngk Insulators Ltd Heating apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179897A (en) 2001-09-11 2006-07-06 Sumitomo Electric Ind Ltd Workpiece holder, susceptor for semiconductor manufacturing apparatus, and processing apparatus
JP2008130609A (en) 2006-11-16 2008-06-05 Ngk Insulators Ltd Heating apparatus

Also Published As

Publication number Publication date
JP2020191199A (en) 2020-11-26

Similar Documents

Publication Publication Date Title
CN107872903B (en) Heating device
JP6767833B2 (en) Heating device
JP7265930B2 (en) Heating device and method for manufacturing the heating device
CN107889289B (en) Heating device
JP7249901B2 (en) Manufacturing method of holding device
JP2022048064A (en) Holding device
JP7227806B2 (en) holding device
JP6917180B2 (en) Heating device
JP7208801B2 (en) holding device
JP2017224710A (en) Manufacturing method of holding device
KR102527439B1 (en) Electrode embedded member and its manufacturing method, electrostatic chuck, ceramic heater
JP2020126913A (en) Ceramic member
JP7265941B2 (en) zygote
JP7386624B2 (en) Holding device and method for manufacturing the holding device
JP7240232B2 (en) holding device
JP7057103B2 (en) Heating device
JP2022123591A (en) Retainer
JP6903512B2 (en) Joined body
JP7098376B2 (en) Heating device
TW202333267A (en) Substrate holder and method of producing substrate holder
KR20230140367A (en) Substrate holding member
JP2021170567A (en) Holding device and manufacturing method thereof
JP2021015928A (en) Retainer
JP2020177735A (en) Manufacturing method of electrode embedded member
JP2020033236A (en) Conjugate

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220401

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20221228

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230110

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230131

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230404

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230417

R150 Certificate of patent or registration of utility model

Ref document number: 7265930

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150