JP7057103B2 - Heating device - Google Patents

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JP7057103B2
JP7057103B2 JP2017225447A JP2017225447A JP7057103B2 JP 7057103 B2 JP7057103 B2 JP 7057103B2 JP 2017225447 A JP2017225447 A JP 2017225447A JP 2017225447 A JP2017225447 A JP 2017225447A JP 7057103 B2 JP7057103 B2 JP 7057103B2
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accommodating portion
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holding body
columnar support
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JP2018133557A (en
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雅夫 辻他
和孝 田中
淳 倉野
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NGK Spark Plug Co Ltd
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本明細書に開示される技術は、加熱装置に関する。 The techniques disclosed herein relate to heating devices.

対象物（例えば、半導体ウェハ）を保持しつつ所定の処理温度（例えば、４００～６５０℃程度）に加熱する加熱装置（「サセプタ」とも呼ばれる）が知られている。加熱装置は、例えば、成膜装置（ＣＶＤ成膜装置やスパッタリング成膜装置等）やエッチング装置（プラズマエッチング装置等）といった半導体製造装置の一部として使用される。 A heating device (also referred to as a "susceptor") that heats an object (for example, a semiconductor wafer) to a predetermined processing temperature (for example, about 400 to 650 ° C.) while holding the object (for example, a semiconductor wafer) is known. The heating device is used as a part of a semiconductor manufacturing device such as a film forming apparatus (CVD film forming apparatus, sputtering film forming apparatus, etc.) or an etching apparatus (plasma etching apparatus, etc.).

一般に、加熱装置は、所定の方向（以下、「第１の方向」という）に略直交する保持面および裏面を有する板状の保持体と、第１の方向に延びる柱状であり、保持体の裏面に接合された柱状支持体とを備える（例えば、特許文献１参照）。保持体の内部には、抵抗発熱体が配置されており、保持体の裏面側には、抵抗発熱体に電気的に接続された複数の受電電極（電極パッド）が配置されている。また、柱状支持体には、保持体の裏面側に開口する複数の貫通孔が形成されており、各貫通孔には、各受電電極に対して例えばろう付けにより接合された電極端子が収容されている。電極端子および受電電極を介して抵抗発熱体に電圧が印加されると、抵抗発熱体が発熱し、保持体の保持面上に保持された対象物（例えば、半導体ウェハ）が例えば４００～６５０℃程度に加熱される。 In general, a heating device is a plate-shaped holding body having a holding surface and a back surface substantially orthogonal to a predetermined direction (hereinafter referred to as "first direction"), and a columnar shape extending in the first direction of the holding body. It is provided with a columnar support joined to the back surface (see, for example, Patent Document 1). A resistance heating element is arranged inside the holder, and a plurality of power receiving electrodes (electrode pads) electrically connected to the resistance heating element are arranged on the back surface side of the holder. Further, the columnar support is formed with a plurality of through holes that open on the back surface side of the holding body, and each through hole accommodates an electrode terminal joined to each power receiving electrode by, for example, brazing. ing. When a voltage is applied to the resistance heating element via the electrode terminal and the power receiving electrode, the resistance heating element generates heat, and the object (for example, a semiconductor wafer) held on the holding surface of the holding body is, for example, 400 to 650 ° C. It is heated to the extent.

特許第４４８５６８１号公報Japanese Patent No. 4485681

電極端子は、比較的長尺であるため、揺動することにより電極端子と受電電極との接合部（ろう付け部）に発生する応力（モーメント）によって該接合部が損傷するおそれがある。そのため、電極端子と受電電極との接合部の損傷抑制のためには、上記従来の加熱装置のように、複数の電極端子のそれぞれを貫通孔に個別に収容することにより、各電極端子を収容する貫通孔の内径をできるだけ小さくすることが好ましい。電極端子の外周が貫通孔を構成する内壁に当接することによって電極端子の過度の揺動が規制されるからである。 Since the electrode terminal is relatively long, there is a possibility that the joint portion will be damaged by the stress (moment) generated at the joint portion (brazing portion) between the electrode terminal and the power receiving electrode due to the swinging. Therefore, in order to suppress damage to the joint between the electrode terminal and the power receiving electrode, each of the plurality of electrode terminals is individually housed in the through hole as in the conventional heating device, so that each electrode terminal is housed. It is preferable to make the inner diameter of the through hole as small as possible. This is because the outer periphery of the electrode terminal comes into contact with the inner wall constituting the through hole, so that excessive swing of the electrode terminal is restricted.

一方、保持体の内部の抵抗発熱体で発生した熱は、柱状支持体を介して逃げていくため、この保持体から柱状支持体への放熱抑制のためには、貫通孔の内径を大きくすることにより、保持体と柱状支持体との接触面積をできるだけ小さくすることが好ましい。上記従来の加熱装置では、電極端子を収容する各貫通孔の内径が比較的に小さく、柱状支持体の上記所定の方向に直交する断面積が大きいため、保持体と柱状支持体との接触面積が比較的に大きい。保持体と柱状支持体との接触面積が大きくなると、抵抗発熱体から発せられた熱が保持体から柱状支持体へと伝わる放熱量が多くなることによって、柱状支持体が高温になるおそれがある。このため、例えば柱状支持体に近接配置される部品等として、耐熱性の高い材料によって形成されたものを使用せざるを得なくなるなどの制約が生じるおそれがある。このように、従来の加熱装置では、電極端子と受電電極との接合部の損傷抑制と、保持体から柱状支持体への放熱抑制との両立の点で、向上の余地がある。 On the other hand, the heat generated by the resistance heating element inside the holding body escapes through the columnar support. Therefore, in order to suppress heat dissipation from the holding body to the columnar support, the inner diameter of the through hole is increased. Therefore, it is preferable to make the contact area between the holding body and the columnar support as small as possible. In the conventional heating device, the inner diameter of each through hole accommodating the electrode terminal is relatively small, and the cross-sectional area of the columnar support orthogonal to the predetermined direction is large, so that the contact area between the holding body and the columnar support is large. Is relatively large. When the contact area between the holding body and the columnar support becomes large, the heat dissipated from the resistance heating element from the holding body to the columnar support increases, and the columnar support may become hot. .. For this reason, there may be restrictions such as having to use a part made of a material having high heat resistance as a part or the like that is arranged close to the columnar support. As described above, in the conventional heating device, there is room for improvement in terms of both suppressing damage to the joint portion between the electrode terminal and the power receiving electrode and suppressing heat dissipation from the holding body to the columnar support.

本明細書では、上述した課題を解決することが可能な技術を開示する。 This specification discloses a technique capable of solving the above-mentioned problems.

本明細書に開示される技術は、例えば、以下の形態として実現することが可能である。 The techniques disclosed herein can be realized, for example, in the following forms.

（１）本明細書に開示される加熱装置は、第１の方向に略直交する第１の表面および第２の表面を有する板状であり、内部に抵抗発熱体を有する保持体と、前記第１の方向に延びる柱状であり、前記保持体の前記第２の表面に接合され、セラミックスにより形成された柱状支持体と、を備え、前記保持体の前記第１の表面上に保持された対象物を加熱する加熱装置において、さらに、前記保持体の前記第２の表面側に配置された複数の受電電極と、前記第１の方向に延びる複数本の電極端子であって、それぞれ、前記複数の受電電極に電気的に接続された複数本の電極端子と、を備え、前記柱状支持体は、個別収容部と、前記個別収容部に対して前記第１の方向の少なくとも一方側に位置する共通収容部とを含み、前記個別収容部は、前記第１の方向に延びる複数の個別貫通孔であって、それぞれ、前記複数本の電極端子の内の１本を収容する複数の個別貫通孔が形成されており、前記共通収容部は、前記第１の方向に延び、かつ、前記個別貫通孔より径が大きい共通貫通孔であって、前記個別貫通孔にそれぞれ収容された２本以上の前記電極端子をまとめて収容する共通貫通孔が形成されるとともに、前記第１の方向に直交する断面積が、前記個別収容部の前記第１の方向に直交する断面積より小さく、かつ、前記共通収容部は、少なくとも、前記柱状支持体における前記保持体とは反対側の端部と前記個別収容部との間に配置された第２の共通収容部を含み、前記個別収容部における前記第１の方向の長さ（Ｌ３）は、前記第２の共通収容部における前記第１の方向の長さ（Ｌ２）より短い。本加熱装置によれば、柱状支持体は、電極端子を１本ずつ収容する複数の個別貫通孔が形成された個別収容部を含む。このため、柱状支持体の全長にわたって、全ての電極端子をまとめて収容する共通貫通孔が形成された構成に比べて、電極端子が揺動することにより電極端子と受電電極との接合部に発生する応力によって該接合部が損傷することを抑制することができる。また、柱状支持体は、さらに、個別収容部の各個別貫通孔にそれぞれ収容された２本以上の電極端子をまとめて収容する共通貫通孔が形成された共通収容部を含む。この共通収容部の第１の方向に直交する断面積は、個別収容部の第１の方向に直交する断面積より小さい。これにより、柱状支持体の全長にわたって、個別貫通孔が形成された構成に比べて、抵抗発熱体から発せられた熱が保持体から柱状支持体へと伝わる放熱量を低減することができる。すなわち、本加熱装置によれば、電極端子と受電電極との接合部の損傷抑制と、保持体から柱状支持体への放熱抑制との両立を図ることができる。また、本加熱装置によれば、個別収容部の長さ（Ｌ３）が第２の共通収容部の長さ（Ｌ２）より長い構成に比べて、保持体と共通収容部との距離が近い分だけ、保持体に対する共通収容部による放熱抑制効果が高くなり、その結果、保持体から柱状支持体への放熱をより効果的に抑制することができる。 (1) The heating device disclosed in the present specification is a plate-shaped body having a first surface and a second surface substantially orthogonal to the first direction, and has a holding body having a resistance heating element inside and the above-mentioned. A columnar column extending in a first direction, comprising a columnar support joined to the second surface of the retainer and formed of ceramics, and held onto the first surface of the retainer. In a heating device for heating an object, a plurality of power receiving electrodes arranged on the second surface side of the holding body and a plurality of electrode terminals extending in the first direction, respectively, are described above. A plurality of electrode terminals electrically connected to a plurality of power receiving electrodes are provided, and the columnar support is located on at least one side of the individual accommodating portion and the individual accommodating portion in the first direction. The individual accommodating portion includes a plurality of individual accommodating portions extending in the first direction, each of which accommodates one of the plurality of electrode terminals. A hole is formed, and the common accommodating portion is a common through hole extending in the first direction and having a diameter larger than that of the individual through hole, and two or more of the common accommodating portions are accommodated in the individual through hole. A common through hole for accommodating the electrode terminals of the above is formed, and the cross-sectional area orthogonal to the first direction is smaller than the cross-sectional area orthogonal to the first direction of the individual accommodating portion. The common accommodating portion includes at least a second common accommodating portion arranged between the end portion of the columnar support opposite to the holding body and the individual accommodating portion, and the said in the individual accommodating portion. The length (L3) in the first direction is shorter than the length (L2) in the first direction in the second common accommodating portion. According to the present heating apparatus, the columnar support includes an individual accommodating portion formed with a plurality of individual through holes for accommodating one electrode terminal at a time. For this reason, compared to a configuration in which a common through hole for accommodating all the electrode terminals is formed over the entire length of the columnar support, the electrode terminal swings and is generated at the joint between the electrode terminal and the power receiving electrode. It is possible to prevent the joint from being damaged by the stress. Further, the columnar support further includes a common accommodating portion in which a common through hole for accommodating two or more electrode terminals housed in each individual through hole of the individual accommodating portion is formed. The cross-sectional area orthogonal to the first direction of the common accommodating portion is smaller than the cross-sectional area orthogonal to the first direction of the individual accommodating portion. As a result, it is possible to reduce the amount of heat dissipated from the holder to the columnar support by heat generated from the resistance heating element, as compared with the configuration in which individual through holes are formed over the entire length of the columnar support. That is, according to this heating device, it is possible to suppress damage to the joint portion between the electrode terminal and the power receiving electrode and to suppress heat dissipation from the holder to the columnar support. Further, according to this heating device, the distance between the holding body and the common accommodating portion is shorter than that in the configuration in which the length (L3) of the individual accommodating portion is longer than the length (L2) of the second common accommodating portion. However, the effect of suppressing heat dissipation from the common accommodating portion on the holding body is enhanced, and as a result, heat dissipation from the holding body to the columnar support can be suppressed more effectively.

（２）上記加熱装置において、前記共通収容部は、少なくとも、前記保持体と前記個別収容部との間に配置された第１の共通収容部を含む構成としてもよい。本加熱装置によれば、保持体と個別収容部との間に、断熱性が高い空洞が個別収容部より多く存在する第１の共通収容部が存在するため、保持体と個別収容部とが直接接触している場合に比べて、保持体から柱状支持体への放熱をより効果的に抑制することができる。 (2) In the heating device, the common accommodating portion may include at least a first common accommodating portion arranged between the holding body and the individual accommodating portion. According to this heating device, since there is a first common accommodating portion between the holding body and the individual accommodating portion in which more cavities having high heat insulating properties are present than the individual accommodating portion, the holding body and the individual accommodating portion are separated from each other. It is possible to more effectively suppress heat dissipation from the holding body to the columnar support as compared with the case of direct contact.

（３）上記加熱装置において、前記第１の共通収容部における前記第１の方向の長さ（Ｌ１）は、前記個別収容部における前記第１の方向の長さ（Ｌ３）より短い構成としてもよい。個別収容部における第１の方向の長さが長い程、電極端子が揺動することにより電極端子と受電電極との接合部に発生する応力を低減する効果が大きくなる。一方、保持体と個別収容部との間に共通収容部（第１の共通収容部）が僅かに存在するだけでも、保持体から柱状支持体への放熱の抑制効果があり、第１の共通収容部における第１の方向の長さの相違による放熱の抑制効果の差は比較的に小さい。そこで、本加熱装置によれば、第１の共通収容部における第１の方向の長さ（Ｌ１）が、個別収容部における第１の方向の長さ（Ｌ３）より長い場合に比べて、保持体から柱状支持体への放熱を抑制しつつ、電極端子と受電電極との接合部の損傷をより効果的に抑制することができる。 (3) In the heating device, the length (L1) in the first direction of the first common accommodating portion may be shorter than the length (L3) of the individual accommodating portion in the first direction. good. The longer the length of the individual accommodating portion in the first direction, the greater the effect of reducing the stress generated at the joint portion between the electrode terminal and the power receiving electrode due to the swing of the electrode terminal. On the other hand, even if there is only a small amount of the common accommodation portion (first common accommodation portion) between the holding body and the individual accommodation portion, there is an effect of suppressing heat dissipation from the holding body to the columnar support, and the first common accommodation portion is obtained. The difference in the effect of suppressing heat dissipation due to the difference in length in the first direction in the accommodating portion is relatively small. Therefore, according to this heating device, the length (L1) in the first direction in the first common accommodating portion is longer than the length (L3) in the first direction in the individual accommodating portion. It is possible to more effectively suppress damage to the joint between the electrode terminal and the power receiving electrode while suppressing heat dissipation from the body to the columnar support.

（４）上記加熱装置において、前記第１の共通収容部における前記第１の方向の長さ（Ｌ１）は、前記第２の共通収容部における前記第１の方向の長さ（Ｌ２）より短い構成としてもよい。本加熱装置によれば、第１の共通収容部における第１の方向の長さ（Ｌ１）が、第２の共通収容部における第１の方向の長さ（Ｌ２）より長い場合に比べて、個別収容部が保持体に近い位置に配置されるため、柱状支持体に収容された各電極端子における保持体側の端部の位置変動が抑制される。これにより、例えば加熱装置の製造工程において、柱状支持体に収容された各電極端子における保持体側の端部を、保持体の受電電極にろう付けする際、該保持体側の端部を位置決めしつつ、保持体の受電電極に精度よく固定することができる。また、電極端子が揺動することにより電極端子と受電電極との接合部に発生する応力を低減することができる。したがって、電極端子における保持体側の端部の位置決めと、電極端子と受電電極との接合部に発生する応力の低減とを両立させることができる。 (4) In the heating device, the length (L1) of the first common accommodating portion in the first direction is shorter than the length (L2) of the second common accommodating portion in the first direction. It may be configured. According to the present heating apparatus, the length (L1) in the first direction in the first common accommodation portion is longer than the length (L2) in the first direction in the second common accommodation portion. Since the individual accommodating portion is arranged at a position close to the retainer, the position variation of the end portion on the retainer side in each electrode terminal accommodated in the columnar support is suppressed. Thereby, for example, in the manufacturing process of the heating device, when the end portion on the holding body side of each electrode terminal housed in the columnar support is brazed to the power receiving electrode of the holding body, the end portion on the holding body side is positioned while being positioned. , Can be accurately fixed to the power receiving electrode of the holder. Further, it is possible to reduce the stress generated at the joint portion between the electrode terminal and the power receiving electrode due to the swing of the electrode terminal. Therefore, it is possible to achieve both the positioning of the end portion on the holding body side of the electrode terminal and the reduction of the stress generated at the joint portion between the electrode terminal and the power receiving electrode.

（５）上記加熱装置において、前記保持体と前記個別収容部との間に前記共通収容部が介在しない構成としてもよい。共通収容部の第１の方向に直交する断面において断熱性が高い空洞が存在する領域の面積は、個別収容部の第１の方向に直交する断面において空洞が存在する領域の面積より広い。本加熱装置によれば、この共通収容部が保持体と個別収容部との間に介在しない。このため、個別収容部が保持体に近い位置に配置されるため、柱状支持体に収容された各電極端子における保持体側の端部の位置変動が抑制される。これにより、例えば加熱装置の製造工程において、柱状支持体に収容された各電極端子における保持体側の端部を、保持体の受電電極にろう付けする際、該保持体側の端部を位置決めしつつ、保持体の受電電極に精度よく固定することができる。 (5) In the heating device, the common accommodating portion may not be interposed between the holding body and the individual accommodating portion. The area of the region where the cavity having high heat insulating property is present in the cross section orthogonal to the first direction of the common accommodating portion is larger than the area of the region where the cavity is present in the cross section orthogonal to the first direction of the individual accommodating portion. According to this heating device, this common accommodating portion does not intervene between the holding body and the individual accommodating portion. Therefore, since the individual accommodating portion is arranged at a position close to the holding body, the position variation of the end portion on the holding body side in each electrode terminal accommodated in the columnar support is suppressed. Thereby, for example, in the manufacturing process of the heating device, when the end portion on the holding body side of each electrode terminal housed in the columnar support is brazed to the power receiving electrode of the holding body, the end portion on the holding body side is positioned while being positioned. , Can be accurately fixed to the power receiving electrode of the holder.

（６）上記加熱装置において、さらに、前記柱状支持体の前記保持体とは反対側に配置される連結部材と、前記柱状支持体と前記連結部材との間に配置されるシール部材と、を備える構成としてもよい。本加熱装置によれば、柱状支持体における放熱の抑制効果により、シール部材の熱による劣化を抑制することができる。 (6) In the heating device, a connecting member arranged on the side opposite to the holding body of the columnar support and a sealing member arranged between the columnar support and the connecting member are further provided. It may be configured to be provided. According to this heating device, deterioration due to heat of the seal member can be suppressed due to the effect of suppressing heat dissipation in the columnar support.

なお、本明細書に開示される技術は、種々の形態で実現することが可能であり、例えば、加熱装置、半導体製造装置、それらの製造方法等の形態で実現することが可能である。 The techniques disclosed in the present specification can be realized in various forms, for example, in the form of a heating device, a semiconductor manufacturing device, a manufacturing method thereof, and the like.

本実施形態における加熱装置１００の外観構成を概略的に示す斜視図である。It is a perspective view which shows schematic appearance structure of the heating apparatus 100 in this embodiment. 本実施形態における加熱装置１００の断面構成を概略的に示す説明図である。It is explanatory drawing which shows schematic the cross-sectional structure of the heating apparatus 100 in this embodiment. 本実施形態における加熱装置１００の断面構成を概略的に示す説明図である。It is explanatory drawing which shows schematic the cross-sectional structure of the heating apparatus 100 in this embodiment. 本実施形態における加熱装置１００の断面構成を概略的に示す説明図である。It is explanatory drawing which shows schematic the cross-sectional structure of the heating apparatus 100 in this embodiment. 本実施形態における加熱装置１００の断面構成を概略的に示す説明図である。It is explanatory drawing which shows schematic the cross-sectional structure of the heating apparatus 100 in this embodiment. 本実施形態における加熱装置１００の断面構成を概略的に示す説明図である。It is explanatory drawing which shows schematic the cross-sectional structure of the heating apparatus 100 in this embodiment. 変形例における加熱装置１００Ｘの断面構成を概略的に示す説明図である。It is explanatory drawing which shows schematic the cross-sectional structure of the heating apparatus 100X in the modification.

Ａ．本実施形態：
Ａ－１．加熱装置１００の構成：
図１は、本実施形態における加熱装置１００の外観構成を概略的に示す斜視図であり、図２から図６は、本実施形態における加熱装置１００の断面構成を概略的に示す説明図である。図２には、図３から図６のＩＩ－ＩＩの位置における加熱装置１００のＸＺ断面構成が示されており、図３には、図２のＩＩＩ－ＩＩＩの位置における加熱装置１００のＸＹ断面構成が示されており、図４には、図２のＩＶ－ＩＶの位置における加熱装置１００のＸＹ断面構成が示されており、図５には、図２のＶ－Ｖの位置における加熱装置１００のＸＹ断面構成が示されており、図６には、図２のＶＩ－ＶＩの位置における加熱装置１００のＸＹ断面構成が示されている。なお、図２には、後述する受電電極５４付近の一部分が拡大して示されている。各図には、方向を特定するための互いに直交するＸＹＺ軸が示されている。本明細書では、便宜的に、Ｚ軸正方向を上方向といい、Ｚ軸負方向を下方向というものとするが、加熱装置１００は実際にはそのような向きとは異なる向きで設置されてもよい。 A. This embodiment:
A-1. Configuration of heating device 100:
FIG. 1 is a perspective view schematically showing an external configuration of the heating device 100 in the present embodiment, and FIGS. 2 to 6 are explanatory views schematically showing a cross-sectional configuration of the heating device 100 in the present embodiment. .. FIG. 2 shows the XZ cross-sectional configuration of the heating device 100 at the positions II-II of FIGS. 3 to 6, and FIG. 3 shows the XY cross-section of the heating device 100 at the positions III-III of FIG. The configuration is shown, FIG. 4 shows the XY cross-sectional configuration of the heating device 100 at the IV-IV position of FIG. 2, and FIG. 5 shows the heating device at the VV position of FIG. The XY cross-sectional configuration of 100 is shown, and FIG. 6 shows the XY cross-sectional configuration of the heating device 100 at the position of VI-VI in FIG. Note that FIG. 2 shows an enlarged portion of the vicinity of the power receiving electrode 54, which will be described later. Each figure shows XYZ axes that are orthogonal to each other to identify the direction. In the present specification, for convenience, the Z-axis positive direction is referred to as an upward direction, and the Z-axis negative direction is referred to as a downward direction, but the heating device 100 is actually installed in a direction different from such an orientation. You may.

加熱装置１００は、対象物（例えば、半導体ウェハＷ）を保持しつつ所定の処理温度（例えば、４００～６５０℃程度）に加熱する装置であり、サセプタとも呼ばれる。加熱装置１００は、例えば、成膜装置（ＣＶＤ成膜装置やスパッタリング成膜装置等）やエッチング装置（プラズマエッチング装置等）といった半導体製造装置の一部として使用される。 The heating device 100 is a device that heats an object (for example, a semiconductor wafer W) to a predetermined processing temperature (for example, about 400 to 650 ° C.) while holding the object, and is also called a susceptor. The heating device 100 is used as a part of a semiconductor manufacturing device such as a film forming apparatus (CVD film forming apparatus, sputtering film forming apparatus, etc.) or an etching apparatus (plasma etching apparatus, etc.).

図１および図２に示すように、加熱装置１００は、保持体１０と柱状支持体２０と連結部材８０とを備える。 As shown in FIGS. 1 and 2, the heating device 100 includes a holding body 10, a columnar support 20, and a connecting member 80.

保持体１０は、所定の方向（本実施形態では上下方向）に略直交する保持面Ｓ１および裏面Ｓ２を有する略円板状の部材である。保持体１０は、例えば、ＡｌＮ（窒化アルミニウム）やＡｌ２Ｏ３（アルミナ）を主成分とするセラミックスにより形成されている。なお、ここでいう主成分とは、含有割合（重量割合）の最も多い成分を意味する。保持体１０の直径は、例えば１００ｍｍ以上、５００ｍｍ以下程度であり、保持体１０の厚さ（上下方向における長さ）は、例えば３ｍｍ以上、１０ｍｍ以下程度である。上記所定の方向（上下方向）は、特許請求の範囲における第１の方向に相当し、保持体１０の保持面Ｓ１は、特許請求の範囲における第１の表面に相当し、保持体１０の裏面Ｓ２は、特許請求の範囲における第２の表面に相当する。 The holding body 10 is a substantially disk-shaped member having a holding surface S1 and a back surface S2 that are substantially orthogonal to a predetermined direction (vertical direction in the present embodiment). The retainer 10 is formed of, for example, ceramics containing AlN (aluminum nitride) or Al2O3 ( alumina) as a main component. The main component referred to here means the component having the highest content ratio (weight ratio). The diameter of the holding body 10 is, for example, about 100 mm or more and 500 mm or less, and the thickness (length in the vertical direction) of the holding body 10 is, for example, about 3 mm or more and 10 mm or less. The predetermined direction (vertical direction) corresponds to the first direction in the claims, the holding surface S1 of the holding body 10 corresponds to the first surface in the claims, and the back surface of the holding body 10. S2 corresponds to the second surface in the claims.

柱状支持体２０は、上記所定の方向（上下方向）に延びる略円柱状部材である。柱状支持体２０は、保持体１０と同様に、例えばＡｌＮやＡｌ２Ｏ３を主成分とするセラミックスにより形成されている。柱状支持体２０の外径は、例えば３０ｍｍ以上、９０ｍｍ以下程度であり、柱状支持体２０の高さ（上下方向における長さ）は、例えば１００ｍｍ以上、３００ｍｍ以下程度である。 The columnar support 20 is a substantially columnar member extending in the predetermined direction (vertical direction). Like the holding body 10, the columnar support 20 is made of ceramics containing, for example , AlN or Al2O3 as a main component. The outer diameter of the columnar support 20 is, for example, about 30 mm or more and 90 mm or less, and the height (length in the vertical direction) of the columnar support 20 is, for example, about 100 mm or more and 300 mm or less.

保持体１０と柱状支持体２０とは、保持体１０の裏面Ｓ２と柱状支持体２０の上面Ｓ３とが上下方向に対向するように配置されている。柱状支持体２０は、保持体１０の裏面Ｓ２の中心部付近に、公知の接合材料により形成された接合層３０を介して接合されている。 The holding body 10 and the columnar support 20 are arranged so that the back surface S2 of the holding body 10 and the upper surface S3 of the columnar support 20 face each other in the vertical direction. The columnar support 20 is joined to the vicinity of the center of the back surface S2 of the holding body 10 via a joining layer 30 formed of a known joining material.

図２および図３に示すように、保持体１０の内部には、保持体１０を加熱するヒータとしての抵抗発熱体５０が配置されている。抵抗発熱体５０は、例えば、タングステンやモリブデン等の導電性材料により形成されている。本実施形態では、抵抗発熱体５０は、Ｚ軸方向視で略同心半円状に延びる１対の線状パターン５０Ａ，５０Ｂを構成している。各線状パターン５０Ａ，５０Ｂの一方の端部は、保持体１０の中心部近傍に配置されており、該一方の端部には、保持体１０の中心部近傍に配置された４つのビア導体５２のうちの１つの上端部が接続されている（図２参照）。各線状パターン５０Ａ，５０Ｂの他方の端部は、保持体１０の外周部近傍に配置されており、該他方の端部にはビア導体およびドライバ電極（いずれも図示せず）を介して、上記４つのビア導体５２のうちの１つ（図２に図示せず）の上端部が接続されている。また、保持体１０の裏面Ｓ２側には、同心円上に並んだ４つの凹部１２が形成されており、各凹部１２内には受電電極（電極パッド）５４が設けられている。上述の４つのビア導体５２の下端部のそれぞれは、４つの受電電極５４のそれぞれに接続されている。その結果、抵抗発熱体５０と受電電極５４とがビア導体５２等を介して電気的に接続された状態となっている。 As shown in FIGS. 2 and 3, a resistance heating element 50 as a heater for heating the holding body 10 is arranged inside the holding body 10. The resistance heating element 50 is formed of, for example, a conductive material such as tungsten or molybdenum. In the present embodiment, the resistance heating element 50 constitutes a pair of linear patterns 50A and 50B extending substantially concentrically in a Z-axis direction. One end of each of the linear patterns 50A and 50B is arranged near the center of the holding body 10, and four via conductors 52 arranged near the center of the holding body 10 are arranged at the one end. The upper end of one of them is connected (see FIG. 2). The other end of each of the linear patterns 50A and 50B is arranged in the vicinity of the outer peripheral portion of the holding body 10, and the other end thereof is connected to the other end via a via conductor and a driver electrode (neither is shown). The upper end of one of the four via conductors 52 (not shown in FIG. 2) is connected. Further, four recesses 12 arranged in concentric circles are formed on the back surface S2 side of the holding body 10, and a power receiving electrode (electrode pad) 54 is provided in each recess 12. Each of the lower ends of the four via conductors 52 described above is connected to each of the four power receiving electrodes 54. As a result, the resistance heating element 50 and the power receiving electrode 54 are electrically connected via the via conductor 52 and the like.

図２、図４から図６に示すように、柱状支持体２０には、保持体１０の裏面Ｓ２側に開口する収容空間Ｓが形成されている。収容空間Ｓは、後述の第１の共通貫通孔２２Ａ、個別貫通孔２２Ｂおよび第２の共通貫通孔２２Ｃ等により構成されている。収容空間Ｓの構成については、後に詳述する。収容空間Ｓには、４本の電極端子７０が収容されている（図２には２本の電極端子７０のみ図示）。電極端子７０は、略円柱状の導電性部材であり、例えばニッケルにより形成されている。電極端子７０の保持体１０側の上端部は、金属ろう材５６（例えば金ろう材）を介して受電電極５４に接合されている。なお、電極端子７０の径は、略同一（例えば３ｍｍ以上、６ｍｍ以下）である。図示しない電源から各電極端子７０、各受電電極５４、各ビア導体５２等を介して抵抗発熱体５０に電圧が印加されると、抵抗発熱体５０が発熱し、保持体１０の保持面Ｓ１上に保持された対象物（例えば、半導体ウェハＷ）が所定の温度（例えば、４００～６５０℃程度）に加熱される。 As shown in FIGS. 2 and 4 to 6, the columnar support 20 is formed with a storage space S that opens on the back surface S2 side of the holding body 10. The accommodation space S is composed of a first common through hole 22A, an individual through hole 22B, a second common through hole 22C, and the like, which will be described later. The configuration of the accommodation space S will be described in detail later. Four electrode terminals 70 are accommodated in the accommodation space S (only two electrode terminals 70 are shown in FIG. 2). The electrode terminal 70 is a substantially columnar conductive member, and is formed of, for example, nickel. The upper end of the electrode terminal 70 on the holding body 10 side is joined to the power receiving electrode 54 via a metal brazing material 56 (for example, a gold brazing material). The diameters of the electrode terminals 70 are substantially the same (for example, 3 mm or more and 6 mm or less). When a voltage is applied to the resistance heating element 50 from a power source (not shown) via each electrode terminal 70, each power receiving electrode 54, each via conductor 52, etc., the resistance heating element 50 generates heat and is on the holding surface S1 of the holding body 10. The object (for example, the semiconductor wafer W) held in the above is heated to a predetermined temperature (for example, about 400 to 650 ° C.).

柱状支持体２０には、さらに、高周波体用貫通孔２８が形成されている（図４～図６参照）。高周波体用貫通孔２８は、上下方向と略同一方向に延び、延伸方向にわたって略一定の内径を有する断面略円形の孔である。高周波体用貫通孔２８には、例えばニッケルにより形成された高周波体３２が収容されている。高周波体用貫通孔２８の上端部は、保持体１０に備えられた高周波電極（図示せず）に接続されている。高周波電源（図示せず）から高周波電力が、高周波体３２を介して高周波電極に印加されることによって、保持体１０と半導体ウェハＷとに存在するガスの分子が電離してイオンとなり、プラズマが生成される。 The columnar support 20 is further formed with a through hole 28 for a high frequency body (see FIGS. 4 to 6). The through hole 28 for a high frequency body is a hole having a substantially circular cross section extending in substantially the same direction as the vertical direction and having a substantially constant inner diameter in the stretching direction. The high-frequency body 32 formed of, for example, nickel is housed in the high-frequency body through hole 28. The upper end of the high frequency body through hole 28 is connected to a high frequency electrode (not shown) provided in the holding body 10. When high-frequency power is applied to the high-frequency electrode from the high-frequency power source (not shown) via the high-frequency body 32, gas molecules existing in the holding body 10 and the semiconductor wafer W are ionized into ions, and plasma is generated. Generated.

柱状支持体２０は、連結部材８０を介して、例えば上述のガス供給源や真空ポンプを備える機器（図示せず）に連結される。連結部材８０は、例えば上記所定の方向（上下方向）に延びる略円柱状部材であり、例えばアルミニウム等の金属材料により形成されている。柱状支持体２０と連結部材８０とは、柱状支持体２０の下面Ｓ４と連結部材８０の上面Ｓ５とが上下方向に対向するように配置されている。連結部材８０には、柱状支持体２０の収容空間Ｓ（より具体的には第２の共通貫通孔２２Ｃ）に連通する電極用連結孔８６と、高周波体用貫通孔２８に連通する高周波体用連結孔（図示せず）とが形成されている。また、第２の共通貫通孔２２Ｃと電極用連結孔８６との連通部分には、平板状のキャップ部材９０が配置されており、キャップ部材９０には、４つの電極端子７０の下端部のそれぞれが挿入されることによって、各電極端子７０の下端部を係止する挿入孔９２が形成されている。また、柱状支持体２０の下面Ｓ４と連結部材８０の上面Ｓ５とのそれぞれには、Ｚ方向視で、ガス用連結孔８２、真空用連結孔８４、高周波体用連結孔および測温体用連結孔の全体を囲むように環状の溝が形成されており、該溝内に環状のシール部材９４（例えばフッ素樹脂製のＯリング）が押圧された状態で収容されている。これにより、柱状支持体２０と連結部材８０とが密閉状態で連結されている。 The columnar support 20 is connected via a connecting member 80 to, for example, a device (not shown) including the above-mentioned gas supply source or vacuum pump. The connecting member 80 is, for example, a substantially columnar member extending in the predetermined direction (vertical direction), and is made of a metal material such as aluminum. The columnar support 20 and the connecting member 80 are arranged so that the lower surface S4 of the columnar support 20 and the upper surface S5 of the connecting member 80 face each other in the vertical direction. The connecting member 80 includes an electrode connecting hole 86 communicating with the accommodation space S (more specifically, the second common through hole 22C) of the columnar support 20, and a high frequency body communicating with the high frequency body through hole 28. A connecting hole (not shown) is formed. Further, a flat plate-shaped cap member 90 is arranged in the communication portion between the second common through hole 22C and the electrode connecting hole 86, and the cap member 90 has a lower end portion of each of the four electrode terminals 70. Is inserted to form an insertion hole 92 for locking the lower end of each electrode terminal 70. Further, the lower surface S4 of the columnar support 20 and the upper surface S5 of the connecting member 80 are each connected to the gas connecting hole 82, the vacuum connecting hole 84, the high frequency body connecting hole, and the temperature measuring body in Z direction. An annular groove is formed so as to surround the entire hole, and the annular sealing member 94 (for example, an O-ring made of fluororesin) is housed in the groove in a pressed state. As a result, the columnar support 20 and the connecting member 80 are connected in a sealed state.

Ａ－２．加熱装置１００の製造方法：
加熱装置１００（保持体１０および柱状支持体２０）の製造方法は、例えば以下の通りである。初めに、保持体１０と柱状支持体２０とを作製する。 A-2. Manufacturing method of heating device 100:
The method for manufacturing the heating device 100 (holding body 10 and columnar support 20) is, for example, as follows. First, the holding body 10 and the columnar support 20 are manufactured.

保持体１０の作製方法は、例えば以下の通りである。まず、窒化アルミニウム粉末に、酸化イットリウム（Ｙ２Ｏ３）粉末と、アクリル系バインダと、適量の分散剤および可塑剤とを加えた混合物に、有機溶剤を加え、ボールミルにて混合し、グリーンシート用スラリーを作製する。このグリーンシート用スラリーをキャスティング装置でシート状に成形した後に乾燥させ、グリーンシートを複数枚作製する。 The method for producing the holding body 10 is, for example, as follows. First, an organic solvent is added to a mixture of aluminum nitride powder, yttrium oxide ( Y2O3 ) powder, an acrylic binder, and an appropriate amount of a dispersant and a plasticizer, and the mixture is mixed with a ball mill to form a green sheet. To prepare a slurry for use. This slurry for green sheets is formed into a sheet by a casting device and then dried to prepare a plurality of green sheets.

また、窒化アルミニウム粉末、アクリル系バインダ、有機溶剤の混合物に、タングステンやモリブデン等の導電性粉末を添加して混練することにより、メタライズペーストを作製する。このメタライズペーストを例えばスクリーン印刷装置を用いて印刷することにより、特定のグリーンシートに、後に抵抗発熱体５０や受電電極５４等となる未焼結導体層を形成する。また、グリーンシートにあらかじめビア孔を設けた状態でメタライズペーストを印刷することにより、後にビア導体５２となる未焼結導体部を形成する。 Further, a metallized paste is prepared by adding a conductive powder such as tungsten or molybdenum to a mixture of aluminum nitride powder, an acrylic binder and an organic solvent and kneading the mixture. By printing this metallized paste using, for example, a screen printing device, an unsintered conductor layer that later becomes a resistance heating element 50, a power receiving electrode 54, or the like is formed on a specific green sheet. Further, by printing the metallized paste with the via holes provided in advance on the green sheet, an unsintered conductor portion that will later become the via conductor 52 is formed.

次に、これらのグリーンシートを複数枚（例えば２０枚）熱圧着し、必要に応じて外周を切断して、グリーンシート積層体を作製する。このグリーンシート積層体をマシニングによって切削加工して円板状の成形体を作製し、この成形体を脱脂し、さらにこの脱脂体を焼成して焼成体を作製する。この焼成体の表面を研磨加工する。以上の工程により、保持体１０が作製される。 Next, a plurality of these green sheets (for example, 20 sheets) are thermocompression bonded, and if necessary, the outer periphery is cut to produce a green sheet laminated body. This green sheet laminated body is cut by machining to produce a disk-shaped molded body, the molded body is degreased, and the degreased body is further fired to produce a fired body. The surface of this fired body is polished. The holding body 10 is manufactured by the above steps.

また、柱状支持体２０の作製方法は、例えば以下の通りである。まず、窒化アルミニウム粉末に、酸化イットリウム粉末と、ＰＶＡバインダと、適量の分散剤および可塑剤とを加えた混合物に、有機溶剤を加え、ボールミルにて混合し、スラリーを得る。このスラリーをスプレードライヤーにて顆粒化し、原料粉末を作製する。次に、高周波体用貫通孔２８に対応する中子が配置されたゴム型に原料粉末を充填し、冷間静水圧プレスして成形体を得る。得られた成形体を、マシニング加工することにより、成形体の外径やＺ方向の長さ等について寸法調整を行う。さらに、成形体に、穴加工を施すことにより、共通収容部２０Ａ，２０Ｃの共通貫通孔２２Ａ，２２Ｃを形成し、個別収容部２０Ｂの個別貫通孔２２Ｂを形成する。その後、成形体を脱脂し、さらにこの脱脂体を焼成する。以上の工程により、柱状支持体２０が作製される。 The method for manufacturing the columnar support 20 is, for example, as follows. First, an organic solvent is added to a mixture of aluminum nitride powder, yttrium oxide powder, PVA binder, and an appropriate amount of a dispersant and a plasticizer, and the mixture is mixed with a ball mill to obtain a slurry. This slurry is granulated with a spray dryer to prepare a raw material powder. Next, the raw material powder is filled in the rubber mold in which the core corresponding to the through hole 28 for the high-frequency body is arranged, and cold hydrostatic pressure is pressed to obtain a molded body. By machining the obtained molded body, the outer diameter of the molded body, the length in the Z direction, and the like are adjusted in dimensions. Further, by processing the molded body with holes, the common through holes 22A and 22C of the common accommodating portions 20A and 20C are formed, and the individual through holes 22B of the individual accommodating portions 20B are formed. Then, the molded body is degreased, and the degreased body is further fired. The columnar support 20 is manufactured by the above steps.

次に、保持体１０と柱状支持体２０とを接合する。保持体１０の裏面Ｓ２および柱状支持体２０の上面Ｓ３に対して必要によりラッピング加工を行った後、保持体１０の裏面Ｓ２と柱状支持体２０の上面Ｓ３との少なくとも一方に、例えば希土類や有機溶剤等を混合してペースト状にした公知の接合剤を均一に塗布した後、脱脂処理する。次いで、保持体１０の裏面Ｓ２と柱状支持体２０の上面Ｓ３とを重ね合わせ、焼成を行うことにより、保持体１０と柱状支持体２０とを接合する。 Next, the holding body 10 and the columnar support 20 are joined. After wrapping the back surface S2 of the holding body 10 and the upper surface S3 of the columnar support 20 as necessary, on at least one of the back surface S2 of the holding body 10 and the upper surface S3 of the columnar support 20, for example, rare earths or organic materials. A known bonding agent made into a paste by mixing a solvent or the like is uniformly applied, and then degreasing is performed. Next, the back surface S2 of the holding body 10 and the upper surface S3 of the columnar support 20 are overlapped and fired to join the holding body 10 and the columnar support 20.

保持体１０と柱状支持体２０との接合の後、各電極端子７０を各電極用貫通孔２２内に挿入し、各電極端子７０の上端部を各受電電極５４に例えば金ろう材によりろう付けする。また、高周波体３２を高周波体用貫通孔２８内に挿入し、高周波体３２の上端部を、高周波電極に電気的に接続された電極（図示せず）にろう付けする。以上の製造方法により、上述した構成の加熱装置１００が製造される。 After joining the holding body 10 and the columnar support 20, each electrode terminal 70 is inserted into each electrode through hole 22, and the upper end of each electrode terminal 70 is brazed to each power receiving electrode 54 with, for example, a gold brazing material. do. Further, the high frequency body 32 is inserted into the through hole 28 for the high frequency body, and the upper end portion of the high frequency body 32 is brazed to an electrode (not shown) electrically connected to the high frequency electrode. By the above manufacturing method, the heating device 100 having the above-described configuration is manufactured.

Ａ－３．柱状支持体２０の収容空間Ｓの詳細構成：
次に、柱状支持体２０の収容空間Ｓの詳細構成について説明する。図２に示すように、柱状支持体２０は、第１の共通収容部２０Ａと、個別収容部２０Ｂと、第２の共通収容部２０Ｃとを備える。 A-3. Detailed configuration of the accommodation space S of the columnar support 20:
Next, the detailed configuration of the accommodation space S of the columnar support 20 will be described. As shown in FIG. 2, the columnar support 20 includes a first common accommodating portion 20A, an individual accommodating portion 20B, and a second common accommodating portion 20C.

図２および図４に示すように、第１の共通収容部２０Ａは、個別収容部２０Ｂに対して保持体１０側（すなわち、上側）に位置し、保持体１０の裏面Ｓ２側に開口する第１の共通貫通孔２２Ａが形成されている。第１の共通貫通孔２２Ａは、上下方向と略同一方向に延び、延伸方向にわたって略一定の内径を有する断面略円形の孔である。第１の共通貫通孔２２Ａには、上述の４本の電極端子７０がまとめて収容されている。 As shown in FIGS. 2 and 4, the first common accommodating portion 20A is located on the holding body 10 side (that is, the upper side) with respect to the individual accommodating portion 20B, and is open to the back surface S2 side of the holding body 10. The common through hole 22A of No. 1 is formed. The first common through hole 22A is a hole having a substantially circular cross section extending in substantially the same direction as the vertical direction and having a substantially constant inner diameter in the extending direction. The above-mentioned four electrode terminals 70 are housed together in the first common through hole 22A.

図２および図６に示すように、第２の共通収容部２０Ｃは、個別収容部２０Ｂに対して保持体１０とは反対側（すなわち、下側）に位置し、連結部材８０側に開口する第２の共通貫通孔２２Ｃが形成されている。第２の共通貫通孔２２Ｃは、上下方向と略同一方向に延び、延伸方向にわたって略一定の内径を有する断面略円形の孔である。なお、本実施形態では、第１の共通貫通孔２２Ａと第２の共通貫通孔２２Ｃとは、Ｚ方向視で略同心であり、また、第１の共通貫通孔２２Ａの内径と第２の共通貫通孔２２Ｃの内径とは略同一である。以下、第１の共通収容部２０Ａと第２の共通収容部２０Ｃとをまとめて「共通収容部２０Ａ，２０Ｃ」ともいい、第１の共通貫通孔２２Ａと第２の共通貫通孔２２Ｃとをまとめて「共通貫通孔２２Ａ，２２Ｃ」ともいう。 As shown in FIGS. 2 and 6, the second common accommodating portion 20C is located on the opposite side (that is, the lower side) of the holding body 10 with respect to the individual accommodating portion 20B, and opens to the connecting member 80 side. A second common through hole 22C is formed. The second common through hole 22C is a hole having a substantially circular cross section extending in substantially the same direction as the vertical direction and having a substantially constant inner diameter in the extending direction. In the present embodiment, the first common through hole 22A and the second common through hole 22C are substantially concentric in the Z direction, and the inner diameter of the first common through hole 22A and the second common through hole 22A. It is substantially the same as the inner diameter of the through hole 22C. Hereinafter, the first common accommodating portion 20A and the second common accommodating portion 20C are collectively referred to as "common accommodating portions 20A and 20C", and the first common through hole 22A and the second common through hole 22C are collectively referred to. Also referred to as "common through holes 22A, 22C".

図２および図５に示すように、個別収容部２０Ｂは、４つの個別貫通孔２２Ｂが形成されている。各個別貫通孔２２Ｂは、上下方向と略同一方向に延び、延伸方向にわたって略一定の内径を有する断面略円形の孔である。各個別貫通孔２２Ｂの内径は、共通貫通孔２２Ａ，２２Ｃの内径より小さい。各個別貫通孔２２Ｂの保持体１０側（すなわち、上端側）は、第１の共通収容部２０Ａの第１の共通貫通孔２２Ａに連通しており、各個別貫通孔２２Ｂの保持体１０とは反対側（すなわち、下端側）は、第２の共通収容部２０Ｃの第２の共通貫通孔２２Ｃに連通している。各個別貫通孔２２Ｂには、１つの個別貫通孔２２Ｂにつき、１本の電極端子７０が収容されている。 As shown in FIGS. 2 and 5, the individual accommodating portion 20B is formed with four individual through holes 22B. Each individual through hole 22B is a hole having a substantially circular cross section extending in substantially the same direction as the vertical direction and having a substantially constant inner diameter in the extending direction. The inner diameter of each individual through hole 22B is smaller than the inner diameter of the common through holes 22A and 22C. The holding body 10 side (that is, the upper end side) of each individual through hole 22B communicates with the first common through hole 22A of the first common accommodating portion 20A, and the holding body 10 of each individual through hole 22B is used. The opposite side (that is, the lower end side) communicates with the second common through hole 22C of the second common accommodating portion 20C. Each individual through hole 22B accommodates one electrode terminal 70 for each individual through hole 22B.

このような構成により、４本の電極端子７０は、各共通収容部２０Ａ，２０Ｃにおいて各共通貫通孔２２Ａ，２２Ｃに４本まとめて収容されつつ、個別収容部２０Ｂにおいて４つの個別貫通孔２２Ｂのそれぞれに１本ずつ個別に収容されている。また、各共通収容部２０Ａ，２０Ｃの上下方向に直交する断面積は、個別収容部２０Ｂの上下方向に直交する断面積より小さい。また、第１の共通収容部２０Ａ（第１の共通貫通孔２２Ａ）の上下方向の長さ（Ｌ１）は、第２の共通収容部２０Ｃ（第２の共通貫通孔２２Ｃ）の上下方向の長さ（Ｌ２）より短い。また、第１の共通収容部２０Ａの上下方向の長さ（Ｌ１）は、個別収容部２０Ｂ（個別貫通孔２２Ｂ）の上下方向の長さ（Ｌ３）より短い。なお、個別収容部２０Ｂの上下方向の長さ（Ｌ３）は、柱状支持体２０（収容空間Ｓ）の上下方向の全長（＝Ｌ１＋Ｌ２＋Ｌ３）の１／４０以上、１／２以下であることが好ましい。 With such a configuration, the four electrode terminals 70 are housed together in the common through holes 22A and 22C in the common accommodating portions 20A and 20C, while the four electrode terminals 70 are accommodated in the individual accommodating portions 20B in the four individual through holes 22B. One is individually housed in each. Further, the cross-sectional area orthogonal to the vertical direction of each of the common accommodating portions 20A and 20C is smaller than the cross-sectional area orthogonal to the vertical direction of the individual accommodating portions 20B. Further, the vertical length (L1) of the first common accommodating portion 20A (first common through hole 22A) is the vertical length of the second common accommodating portion 20C (second common through hole 22C). It is shorter than (L2). Further, the vertical length (L1) of the first common accommodating portion 20A is shorter than the vertical length (L3) of the individual accommodating portion 20B (individual through hole 22B). The vertical length (L3) of the individual accommodating portion 20B is preferably 1/40 or more and 1/2 or less of the vertical length (= L1 + L2 + L3) of the columnar support 20 (accommodation space S). ..

なお、上述の高周波体用貫通孔２８は、第１の共通収容部２０Ａと個別収容部２０Ｂと第２の共通収容部２０Ｃとにわたって形成されている。また、各電極端子７０のうち、第１の共通収容部２０Ａと第２の共通収容部２０Ｃとにそれぞれ収容されている部分は、絶縁チューブ４０に挿入されている。これにより、共通貫通孔２２Ａ，２２Ｃ内にまとめて収容された複数本の電極端子７０の間におけるアークの発生が抑制される。 The above-mentioned through hole 28 for a high frequency body is formed over the first common accommodating portion 20A, the individual accommodating portion 20B, and the second common accommodating portion 20C. Further, of each electrode terminal 70, a portion accommodated in the first common accommodating portion 20A and the second common accommodating portion 20C is inserted into the insulating tube 40. As a result, the generation of an arc between the plurality of electrode terminals 70 collectively housed in the common through holes 22A and 22C is suppressed.

Ａ－４．本実施形態の効果：
以上説明したように、本実施形態の加熱装置１００では、柱状支持体２０は、電極端子７０を１本ずつ収容する複数の個別貫通孔２２Ｂが形成された個別収容部２０Ｂを含む。個別収容部２０Ｂの個別貫通孔２２Ｂは、共通収容部２０Ａ，２０Ｃの共通貫通孔２２Ａ，２２Ｃに比べて、内径が小さいことにより、個別収容部２０Ｂにおいて個別貫通孔２２Ｂを形成する内壁が、共通収容部２０Ａ，２０Ｃにおいて共通貫通孔２２Ａ，２２Ｃを形成する内壁に比べて、電極端子７０の外周に近い位置に位置するため、電極端子７０の揺動が規制される。したがって、例えば、柱状支持体２０の上下方向の全長にわたって、４つの電極端子７０をまとめて収容する共通貫通孔が形成された構成に比べて、電極端子７０の揺動により電極端子７０と受電電極５４との接合部（金属ろう材５６）に発生する応力によって該接合部が損傷することを抑制することができる。また、柱状支持体２０は、さらに、共通収容部２０Ａ，２０Ｃを含む。各共通収容部２０Ａ，２０Ｃは、個別収容部２０Ｂの各個別貫通孔２２Ｂにそれぞれ収容された４本の電極端子７０をまとめて収容する共通貫通孔２２Ａ，２２Ｃが形成されている。各共通収容部２０Ａ，２０Ｃの上下方向に直交する断面積は、個別収容部２０Ｂの上下方向に直交する断面積より小さい。したがって、柱状支持体２０の上下方向の全長にわたって、個別貫通孔２２Ｂが形成された構成に比べて、保持体１０と柱状支持体２０との接触面積が小さいため、抵抗発熱体５０から発せられた熱が保持体１０から柱状支持体２０へと伝わる放熱量を低減することができる。すなわち、本実施形態の加熱装置１００によれば、電極端子７０と受電電極５４との接合部の損傷抑制と、保持体１０から柱状支持体２０への放熱抑制との両立を図ることができる。 A-4. Effect of this embodiment:
As described above, in the heating device 100 of the present embodiment, the columnar support 20 includes the individual accommodating portion 20B in which a plurality of individual through holes 22B accommodating the electrode terminals 70 one by one are formed. The individual through holes 22B of the individual accommodating portions 20B have a smaller inner diameter than the common through holes 22A and 22C of the common accommodating portions 20A and 20C, so that the inner walls forming the individual through holes 22B in the individual accommodating portions 20B are common. Since the housing portions 20A and 20C are located closer to the outer periphery of the electrode terminal 70 than the inner wall forming the common through holes 22A and 22C, the swing of the electrode terminal 70 is restricted. Therefore, for example, as compared with the configuration in which a common through hole for accommodating the four electrode terminals 70 is formed over the entire length of the columnar support 20 in the vertical direction, the electrode terminal 70 and the power receiving electrode are oscillated by the swing of the electrode terminal 70. It is possible to prevent the joint portion from being damaged by the stress generated in the joint portion (metal brazing material 56) with the 54. Further, the columnar support 20 further includes common accommodating portions 20A and 20C. Each of the common accommodating portions 20A and 20C is formed with common through holes 22A and 22C for accommodating four electrode terminals 70 accommodating in each individual through hole 22B of the individual accommodating portion 20B. The cross-sectional area orthogonal to the vertical direction of the common accommodating portions 20A and 20C is smaller than the cross-sectional area orthogonal to the vertical direction of the individual accommodating portions 20B. Therefore, since the contact area between the holding body 10 and the columnar support 20 is smaller than the configuration in which the individual through holes 22B are formed over the entire length of the columnar support 20 in the vertical direction, it is emitted from the resistance heating element 50. The amount of heat dissipated from the holder 10 to the columnar support 20 can be reduced. That is, according to the heating device 100 of the present embodiment, it is possible to suppress damage to the joint portion between the electrode terminal 70 and the power receiving electrode 54 and to suppress heat dissipation from the holding body 10 to the columnar support 20.

また、本実施形態の加熱装置１００では、保持体１０と個別収容部２０Ｂとの間に、断熱性が高い空洞が個別収容部２０Ｂより多く存在する第１の共通収容部２０Ａが存在する（図２参照）。このため、保持体１０と個別収容部２０Ｂとが直接接触している構成に比べて、保持体１０から柱状支持体２０への放熱をより効果的に抑制することができる。 Further, in the heating device 100 of the present embodiment, there is a first common accommodating portion 20A in which more cavities having high heat insulating properties are present than the individual accommodating portion 20B between the holding body 10 and the individual accommodating portion 20B (FIG. 2). Therefore, the heat radiation from the holding body 10 to the columnar support 20 can be more effectively suppressed as compared with the configuration in which the holding body 10 and the individual accommodating portion 20B are in direct contact with each other.

また、本実施形態の加熱装置１００では、第１の共通収容部２０Ａの上下方向の長さ（Ｌ１）は、第２の共通収容部２０Ｃの上下方向の長さ（Ｌ２）より短い。このため、第１の共通収容部２０Ａの上下方向の長さ（Ｌ１）が第２の共通収容部２０Ｃの上下方向の長さ（Ｌ２）より長い構成に比べて、個別収容部２０Ｂが保持体１０に近い位置に配置される。その結果、柱状支持体２０に収容された各電極端子７０における上側（保持体１０側）の端部の位置変動が抑制される。これにより、例えば加熱装置１００の製造工程において、柱状支持体２０に収容された各電極端子７０における上側の端部を、保持体１０の受電電極５４にろう付けする際、各電極端子７０における上側の端部を位置決めしつつ、受電電極５４に精度よく固定することができる。また、電極端子７０が揺動することにより電極端子７０と受電電極５４との接合部に発生する応力を低減することができる。したがって、保持体１０から柱状支持体２０への放熱を抑制しつつ、電極端子７０における上側の端部の位置決めと、電極端子７０と受電電極５４との接合部に発生する応力の低減とを両立させることができる。 Further, in the heating device 100 of the present embodiment, the vertical length (L1) of the first common accommodating portion 20A is shorter than the vertical length (L2) of the second common accommodating portion 20C. Therefore, the individual accommodating portion 20B is a holding body as compared with the configuration in which the vertical length (L1) of the first common accommodating portion 20A is longer than the vertical length (L2) of the second common accommodating portion 20C. It is arranged at a position close to 10. As a result, the positional fluctuation of the upper end (retainer 10 side) of each electrode terminal 70 housed in the columnar support 20 is suppressed. Thereby, for example, in the manufacturing process of the heating device 100, when the upper end portion of each electrode terminal 70 housed in the columnar support 20 is brazed to the power receiving electrode 54 of the holding body 10, the upper side of each electrode terminal 70 is brazed. It can be accurately fixed to the power receiving electrode 54 while positioning the end portion of the. Further, it is possible to reduce the stress generated at the joint portion between the electrode terminal 70 and the power receiving electrode 54 due to the swing of the electrode terminal 70. Therefore, while suppressing heat dissipation from the holding body 10 to the columnar support 20, both positioning of the upper end portion of the electrode terminal 70 and reduction of stress generated at the joint portion between the electrode terminal 70 and the power receiving electrode 54 are achieved. Can be made to.

また、個別収容部２０Ｂにおける上下方向の長さ（Ｌ３）が長い程、電極端子７０の揺動が規制されるため、電極端子７０と受電電極５４との接合部に発生する応力を低減する効果が大きくなる。一方、保持体１０と個別収容部２０Ｂとの間に共通収容部（第１の共通収容部２０Ａ）が僅かに存在するだけでも、保持体１０から柱状支持体２０への放熱の抑制効果があり、第１の共通収容部２０Ａにおける上下方向の長さ（Ｌ１）の相違による放熱の抑制効果の差は比較的に小さい。そこで、本実施形態の加熱装置１００では、第１の共通収容部２０Ａの上下方向の長さ（Ｌ１）は、個別収容部２０Ｂ（個別貫通孔２２Ｂ）の上下方向の長さ（Ｌ３）より短い。このため、第１の共通収容部２０Ａの上下方向の長さ（Ｌ１）が、個別収容部２０Ｂ（個別貫通孔２２Ｂ）の上下方向の長さ（Ｌ３）より長い場合に比べて、保持体１０から柱状支持体２０への放熱を抑制しつつ、電極端子７０と受電電極５４との接合部の損傷をより効果的に抑制することができる。また、個別収容部２０Ｂにおける上下方向の長さ（Ｌ３）は、第２の共通収容部２０Ｃにおける上下方向の長さ（Ｌ２）より短い。このため、個別収容部２０Ｂにおける上下方向の長さ（Ｌ３）が第２の共通収容部２０Ｃにおける上下方向の長さ（Ｌ２）より長い場合に比べて、保持体１０から柱状支持体２０への放熱を抑制することができる。 Further, as the length (L3) in the vertical direction of the individual accommodating portion 20B is longer, the swing of the electrode terminal 70 is restricted, so that the effect of reducing the stress generated at the joint portion between the electrode terminal 70 and the power receiving electrode 54 is reduced. Becomes larger. On the other hand, even if the common accommodating portion (first common accommodating portion 20A) is slightly present between the holding body 10 and the individual accommodating portion 20B, there is an effect of suppressing heat dissipation from the holding body 10 to the columnar support 20. , The difference in the effect of suppressing heat dissipation due to the difference in the length (L1) in the vertical direction in the first common accommodating portion 20A is relatively small. Therefore, in the heating device 100 of the present embodiment, the vertical length (L1) of the first common accommodating portion 20A is shorter than the vertical length (L3) of the individual accommodating portion 20B (individual through hole 22B). .. Therefore, the holding body 10 is longer than the vertical length (L1) of the first common accommodating portion 20A than the vertical length (L3) of the individual accommodating portion 20B (individual through hole 22B). It is possible to more effectively suppress damage to the joint portion between the electrode terminal 70 and the power receiving electrode 54 while suppressing heat dissipation from the columnar support 20 to the columnar support 20. Further, the vertical length (L3) of the individual accommodating portion 20B is shorter than the vertical length (L2) of the second common accommodating portion 20C. Therefore, compared to the case where the vertical length (L3) of the individual accommodating portion 20B is longer than the vertical length (L2) of the second common accommodating portion 20C, the holding body 10 is transferred to the columnar support 20. It is possible to suppress heat dissipation.

以上のように、本実施形態の加熱装置１００では、保持体１０から柱状支持体２０への放熱が抑制されるため、シール部材９４の熱による劣化を抑制することができる。本実施形態では、上述したように、抵抗発熱体５０の発熱により、保持面Ｓ１上に保持された半導体ウェハＷが所定の処理温度（例えば、４００～６５０℃程度）に加熱される。しかし、上述したように、柱状支持体２０において放熱抑制効果があるため、柱状支持体２０と連結部材８０とのシールのために、耐熱温度が上記処理温度より低い（例えば２００℃程度）材料で形成されたシール部材９４を使用することができる。 As described above, in the heating device 100 of the present embodiment, heat dissipation from the holding body 10 to the columnar support 20 is suppressed, so that deterioration of the sealing member 94 due to heat can be suppressed. In the present embodiment, as described above, the semiconductor wafer W held on the holding surface S1 is heated to a predetermined processing temperature (for example, about 400 to 650 ° C.) by the heat generated by the resistance heating element 50. However, as described above, since the columnar support 20 has a heat dissipation suppressing effect, a material having a heat resistant temperature lower than the above processing temperature (for example, about 200 ° C.) is used for sealing the columnar support 20 and the connecting member 80. The formed seal member 94 can be used.

Ｂ．変形例：
本明細書で開示される技術は、上述の実施形態に限られるものではなく、その要旨を逸脱しない範囲において種々の形態に変形することができ、例えば次のような変形も可能である。 B. Modification example:
The technique disclosed in the present specification is not limited to the above-described embodiment, and can be transformed into various forms without departing from the gist thereof, and for example, the following modifications are also possible.

上記実施形態における加熱装置１００の構成は、あくまで例示であり、種々変形可能である。例えば、上記実施形態では、保持体１０の外径が柱状支持体２０の外径より大きいとしているが、保持体１０の外径と柱状支持体２０の外径とが略同一であるとしてもよい。また、上記実施形態では、保持体１０および柱状支持体２０のＺ軸方向視の外形が略円形であるとしているが、他の形状であってもよい。また、共通収容部２０Ａ，２０Ｃの共通貫通孔２２Ａ，２２Ｃと個別収容部２０Ｂの個別貫通孔２２Ｂとに収容される電極端子は、抵抗発熱体５０に電気的に接続された端子に限らず、例えば、プラズマを発生させる高周波（ＲＦ）電極に電気的に接続された端子や、静電吸着のための吸着電極に電気的に接続された端子でもよい。また、上記実施形態では、受電電極５４は、保持体１０の裏面Ｓ２に形成された凹部１２内に配置されているが、保持体１０の裏面Ｓ２上に配置されているとしてもよい。要するに、受電電極は、保持体の第２の表面側に配置されていればよい。 The configuration of the heating device 100 in the above embodiment is merely an example and can be variously modified. For example, in the above embodiment, the outer diameter of the holding body 10 is larger than the outer diameter of the columnar support 20, but the outer diameter of the holding body 10 and the outer diameter of the columnar support 20 may be substantially the same. .. Further, in the above embodiment, the outer shape of the holding body 10 and the columnar support 20 in the Z-axis direction is substantially circular, but other shapes may be used. Further, the electrode terminals accommodated in the common through holes 22A and 22C of the common accommodating portions 20A and 20C and the individual through holes 22B of the individual accommodating portions 20B are not limited to the terminals electrically connected to the resistance heating element 50. For example, it may be a terminal electrically connected to a high frequency (RF) electrode that generates plasma, or a terminal electrically connected to an adsorption electrode for electrostatic adsorption. Further, in the above embodiment, the power receiving electrode 54 is arranged in the recess 12 formed in the back surface S2 of the holding body 10, but may be arranged on the back surface S2 of the holding body 10. In short, the power receiving electrode may be arranged on the second surface side of the holding body.

上記実施形態において、保持体１０と個別収容部２０Ｂとの間に、第１の共通収容部２０Ａが介在せずに、保持体１０と個別収容部２０Ｂとが直接接触している構成としてもよい。図７は、変形例における加熱装置１００Ｘの断面構成を概略的に示す説明図である。図２に示す構成と共通する部分について同一符号を付して説明を省略する。図７に示すように、変形例における加熱装置１００Ｘでは、上記実施形態における共通収容部２０Ａが保持体１０と個別収容部２０ＢＸとの間に介在しておらず、個別収容部２０ＢＸの上面Ｓ３Ｘ全体が接合層３０Ｘを介して保持体１０の裏面Ｓ２に接合されている。また、個別収容部２０ＢＸと柱状支持体２０の下面Ｓ４との間には、第２の共通収容部２０ＣＸが配置されている。すなわち、共通収容部は、個別収容部２０ＢＸに対して保持体１０とは反対側だけに位置する。なお、個別収容部２０ＢＸのＸＹ断面構成は、図５に示す構成と同一であり、第２の共通収容部２０ＣＸのＸＹ断面構成は、図６に示す構成と同一である。また、個別収容部２０ＢＸの上下方向の長さ（Ｌ３Ｘ）は、第２の共通収容部２０ＣＸの上下方向の長さ（Ｌ２Ｘ）より短い。このような構成でも、柱状支持体２０に共通収容部（第２の共通貫通孔２２Ｃ）が存在することによって、保持体１０から柱状支持体２０（特に柱状支持体２０の保持体１０とは反対側）への放熱を抑制することができる。また、共通収容部のＸＹ断面において断熱性が高い空洞が存在する領域の面積は、個別収容部のＸＹ断面において空洞が存在する領域の面積より広い（図４から図６参照）。また、変形例における加熱装置１００Ｘでは、個別収容部２０ＢＸの上下方向の長さ（Ｌ３Ｘ）が、第２の共通収容部２０ＣＸの上下方向の長さ（Ｌ２Ｘ）より長い構成に比べて、保持体１０と第２の共通収容部２０ＣＸとの距離が近い分だけ、保持体１０に対する第２の共通収容部２０ＣＸによる放熱抑制効果が高くなり、その結果、保持体１０から柱状支持体２０Ｘへの放熱をより効果的に抑制することができる。 In the above embodiment, the holding body 10 and the individual accommodating portion 20B may be in direct contact with each other without the first common accommodating portion 20A intervening between the holding body 10 and the individual accommodating portion 20B. .. FIG. 7 is an explanatory diagram schematically showing a cross-sectional configuration of the heating device 100X in the modified example. The same reference numerals are given to the parts common to the configuration shown in FIG. 2, and the description thereof will be omitted. As shown in FIG. 7, in the heating device 100X in the modified example, the common accommodating portion 20A in the above embodiment is not interposed between the holding body 10 and the individual accommodating portion 20BX, and the entire upper surface S3X of the individual accommodating portion 20BX is formed. Is bonded to the back surface S2 of the holding body 10 via the bonding layer 30X. Further, a second common accommodating portion 20CX is arranged between the individual accommodating portion 20BX and the lower surface S4 of the columnar support 20. That is, the common accommodating portion is located only on the side opposite to the holding body 10 with respect to the individual accommodating portion 20BX. The XY cross-sectional configuration of the individual accommodating portion 20BX is the same as the configuration shown in FIG. 5, and the XY cross-sectional configuration of the second common accommodating portion 20CX is the same as the configuration shown in FIG. Further, the vertical length (L3X) of the individual accommodating portion 20BX is shorter than the vertical length (L2X) of the second common accommodating portion 20CX. Even in such a configuration, the presence of the common accommodating portion (second common through hole 22C) in the columnar support 20 causes the holding body 10 to be opposed to the columnar support 20 (particularly, the holding body 10 of the columnar support 20). It is possible to suppress heat dissipation to the side). Further, the area of the region where the cavity having high heat insulating property exists in the XY cross section of the common accommodating portion is wider than the area of the region where the cavity exists in the XY cross section of the individual accommodating portion (see FIGS. 4 to 6). Further, in the heating device 100X in the modified example, the holding body has a structure in which the vertical length (L3X) of the individual accommodating portion 20BX is longer than the vertical length (L2X) of the second common accommodating portion 20CX. As the distance between the 10 and the second common accommodating portion 20CX is short, the effect of suppressing heat dissipation by the second common accommodating portion 20CX on the holding body 10 becomes higher, and as a result, heat is dissipated from the holding body 10 to the columnar support 20X. Can be suppressed more effectively.

また、上記実施形態において、柱状支持体２０は、第２の共通収容部２０Ｃを含まず、個別収容部２０Ｂが下面Ｓ４まで延びているとしてもよい。また、柱状支持体２０は、共通収容部を３つ以上含むとしてもよいし、個別収容部を２つ以上含むとしてもよい。 Further, in the above embodiment, the columnar support 20 may not include the second common accommodating portion 20C, and the individual accommodating portion 20B may extend to the lower surface S4. Further, the columnar support 20 may include three or more common accommodating portions, or may include two or more individual accommodating portions.

また、上記実施形態において、第１の共通収容部２０Ａの上下方向の長さ（Ｌ１）は、第２の共通収容部２０Ｃの上下方向の長さ（Ｌ２）より長いとしてもよい。また、第１の共通収容部２０Ａの上下方向の長さ（Ｌ１）が、個別収容部２０Ｂ（個別貫通孔２２Ｂ）の上下方向の長さ（Ｌ３）より長いとしてもよい。 Further, in the above embodiment, the vertical length (L1) of the first common accommodating portion 20A may be longer than the vertical length (L2) of the second common accommodating portion 20C. Further, the vertical length (L1) of the first common accommodating portion 20A may be longer than the vertical length (L3) of the individual accommodating portion 20B (individual through hole 22B).

また、上記実施形態では、共通収容部２０Ａ，２０Ｃにおいて、共通貫通孔２２Ａ，２２Ｃに加えて、高周波体３２（電極端子）を１つだけ収容する高周波体用貫通孔２８が形成されていたが、これに限らず、共通収容部は、電極端子を１つだけ収容する個別貫通孔を備えないとしてもよい。また、共通収容部は、個別貫通孔にそれぞれ収容された２本以上の電極端子をまとめて収容する共通貫通孔が２つ以上形成されているとしてもよい。 Further, in the above embodiment, in the common accommodating portions 20A and 20C, in addition to the common through holes 22A and 22C, a through hole 28 for a high frequency body that accommodates only one high frequency body 32 (electrode terminal) is formed. However, the common accommodating portion may not be provided with an individual through hole for accommodating only one electrode terminal. Further, the common through hole may be formed with two or more common through holes for collectively accommodating two or more electrode terminals housed in the individual through holes.

また、上記実施形態における加熱装置１００を構成する各部材の形成材料は、あくまで例示であり、各部材が他の材料により形成されてもよい。例えば、上記実施形態における加熱装置１００では、保持体１０、柱状支持体２０および連結部材８０は、窒化アルミニウムまたはアルミナを主成分とするセラミックス製であるとしているが、保持体１０と柱状支持体２０と連結部材８０との少なくとも一つが、他のセラミックス製であるとしてもよい。また、保持体１０と連結部材８０との少なくとも一つは、セラミックス以外の材料製（例えば、アルミニウムやアルミニウム合金等の金属製）であるとしてもよい。同様に、電極端子７０等の形成材料も、他の材料であってよい。 Further, the forming material of each member constituting the heating device 100 in the above embodiment is merely an example, and each member may be formed of another material. For example, in the heating device 100 in the above embodiment, the holding body 10, the columnar support 20, and the connecting member 80 are made of ceramics containing aluminum nitride or alumina as a main component, but the holding body 10 and the columnar support 20 are said to be made of ceramics. And at least one of the connecting member 80 may be made of another ceramic. Further, at least one of the holding body 10 and the connecting member 80 may be made of a material other than ceramics (for example, made of metal such as aluminum or an aluminum alloy). Similarly, the forming material such as the electrode terminal 70 may be another material.

上記実施形態の加熱装置１００は、高周波体用貫通孔２８を備えないとしてもよい。また、加熱装置１００は、柱状支持体２０において、高周波体用貫通孔２８とは別に、例えば、パージガス（例えば窒素、アルゴン）等のガスを保持体１０の保持面Ｓ１と半導体ウェハＷとの間に供給するためのガス用貫通孔、半導体ウェハＷを保持体１０の保持面Ｓ１に真空吸着させるための真空用貫通孔や、熱電対や白金抵抗体等の測温体が収容される測温体用貫通孔などが形成されているとしてもよい。また、加熱装置１００は、連結部材８０を備えないとしてもよい。また、本発明は、サセプタに限らず、セラミックス板とベース板とを備え、セラミックス板の表面上に対象物を保持する他の保持装置（例えば、静電チャック等）にも適用可能である。 The heating device 100 of the above embodiment may not be provided with the through hole 28 for a high frequency body. Further, in the columnar support 20, the heating device 100 holds a gas such as a purge gas (for example, nitrogen or argon) between the holding surface S1 of the holding body 10 and the semiconductor wafer W in addition to the through hole 28 for the high frequency body. A through hole for gas for supplying to, a through hole for vacuum for vacuum-adsorbing the semiconductor wafer W to the holding surface S1 of the holding body 10, and a temperature measuring body for accommodating a temperature measuring object such as a thermocouple or a platinum resistor. A through hole for the body may be formed. Further, the heating device 100 may not include the connecting member 80. Further, the present invention is not limited to the susceptor, and can be applied to other holding devices (for example, an electrostatic chuck or the like) provided with a ceramic plate and a base plate and holding an object on the surface of the ceramic plate.

また、上記実施形態における加熱装置１００の製造方法はあくまで一例であり、種々変形可能である。 Further, the method for manufacturing the heating device 100 in the above embodiment is merely an example, and various modifications can be made.

１０：保持体 １２：凹部 ２０：柱状支持体 ２０Ａ：第１の共通収容部 ２０Ｂ，２０ＢＸ：個別収容部 ２０Ｃ，２０ＣＸ：第２の共通収容部 ２２：電極用貫通孔 ２２Ａ：第１の共通貫通孔 ２２Ｂ：個別貫通孔 ２２Ｃ：第２の共通貫通孔 ２８：高周波体用貫通孔 ３０，３０Ｘ：接合層 ３２：高周波体 ４０：絶縁チューブ ５０：抵抗発熱体 ５０Ａ，５０Ｂ：線状パターン ５２：ビア導体 ５４：受電電極 ５６：金属ろう材 ７０：電極端子 ８０：連結部材 ８２：ガス用連結孔 ８４：真空用連結孔 ８６：電極用連結孔 ９０：キャップ部材 ９２：挿入孔 ９４：シール部材 １００，１００ｘ：加熱装置 Ｓ１：保持面 Ｓ２：裏面 Ｓ３，Ｓ３Ｘ：上面 Ｓ４，Ｓ４Ｘ：下面 Ｓ５：上面 Ｓ：収容空間 Ｗ：半導体ウェハ 10: Holder 12: Recess 20: Columnar support 20A: First common housing 20B, 20BX: Individual housing 20C, 20CX: Second common housing 22: Through hole for electrode 22A: First common penetration Hole 22B: Individual through hole 22C: Second common through hole 28: Through hole for high frequency body 30, 30X: Bonding layer 32: High frequency body 40: Insulation tube 50: Resistance heating element 50A, 50B: Linear pattern 52: Via Conductor 54: Power receiving electrode 56: Metal brazing material 70: Electrode terminal 80: Connecting member 82: Gas connecting hole 84: Vacuum connecting hole 86: Electrode connecting hole 90: Cap member 92: Insertion hole 94: Seal member 100, 100x: Heating device S1: Holding surface S2: Back surface S3, S3X: Top surface S4, S4X: Bottom surface S5: Top surface S: Accommodation space W: Semiconductor wafer

Claims (7)

第１の方向に略直交する第１の表面および第２の表面を有する板状であり、内部に抵抗発熱体を有する保持体と、
前記第１の方向に延びる柱状であり、前記保持体の前記第２の表面に接合され、セラミックスにより形成された柱状支持体と、
を備え、前記保持体の前記第１の表面上に保持された対象物を加熱する加熱装置において、さらに、
前記保持体の前記第２の表面側に配置された複数の受電電極と、
前記第１の方向に延びる複数本の電極端子であって、それぞれ、前記複数の受電電極に電気的に接続された複数本の電極端子と、
を備え、
前記柱状支持体は、個別収容部と、前記個別収容部に対して前記第１の方向の少なくとも一方側に位置する共通収容部とを含み、
前記個別収容部は、前記第１の方向に延びる複数の個別貫通孔であって、それぞれ、前記複数本の電極端子の内の１本を収容する複数の個別貫通孔が形成されており、
前記共通収容部は、前記第１の方向に延び、かつ、前記個別貫通孔より径が大きい共通貫通孔であって、前記個別貫通孔にそれぞれ収容された２本以上の前記電極端子をまとめて収容する共通貫通孔が形成されるとともに、前記第１の方向に直交する断面積が、前記個別収容部の前記第１の方向に直交する断面積より小さく、かつ、
前記共通収容部は、少なくとも、前記保持体と前記個別収容部との間に配置された第１の共通収容部と、前記柱状支持体における前記保持体とは反対側の端部と前記個別収容部との間に配置された第２の共通収容部を含み、
前記第１の共通収容部における前記第１の方向の長さ（Ｌ１）は、前記個別収容部における前記第１の方向の長さ（Ｌ３）より短く、
前記個別収容部における前記第１の方向の長さ（Ｌ３）は、前記第２の共通収容部における前記第１の方向の長さ（Ｌ２）より短いことを特徴とする、加熱装置。 A plate-shaped holding body having a first surface and a second surface substantially orthogonal to the first direction and having a resistance heating element inside, and a holding body.
A columnar support extending in the first direction, joined to the second surface of the holding body, and formed of ceramics, and a columnar support.
Further, in a heating device for heating an object held on the first surface of the holder.
A plurality of power receiving electrodes arranged on the second surface side of the holding body, and
A plurality of electrode terminals extending in the first direction, each of which is a plurality of electrode terminals electrically connected to the plurality of power receiving electrodes.
Equipped with
The columnar support includes an individual accommodating portion and a common accommodating portion located on at least one side of the individual accommodating portion in the first direction.
The individual accommodating portion is a plurality of individual through holes extending in the first direction, each of which is formed with a plurality of individual through holes for accommodating one of the plurality of electrode terminals.
The common accommodating portion is a common through hole extending in the first direction and having a diameter larger than that of the individual through holes, and two or more of the electrode terminals accommodated in the individual through holes are collectively combined. A common through hole for accommodating is formed, and the cross-sectional area orthogonal to the first direction is smaller than the cross-sectional area orthogonal to the first direction of the individual accommodating portion.
The common accommodating portion includes at least a first common accommodating portion arranged between the holding body and the individual accommodating portion, and an end portion of the columnar support opposite to the holding body and the individual accommodating portion. Includes a second common containment section located between the sections
The length (L1) in the first direction of the first common accommodating portion is shorter than the length (L3) of the individual accommodating portion in the first direction.
The heating device, characterized in that the length (L3) in the first direction of the individual accommodating portion is shorter than the length (L2) of the first direction in the second common accommodating portion. 第１の方向に略直交する第１の表面および第２の表面を有する板状であり、内部に抵抗発熱体を有する保持体と、 A plate-shaped holding body having a first surface and a second surface substantially orthogonal to the first direction and having a resistance heating element inside, and a holding body.
前記第１の方向に延びる柱状であり、前記保持体の前記第２の表面に接合され、セラミックスにより形成された柱状支持体と、 A columnar support extending in the first direction, joined to the second surface of the holding body, and formed of ceramics, and a columnar support.
を備え、前記保持体の前記第１の表面上に保持された対象物を加熱する加熱装置において、さらに、Further, in a heating device for heating an object held on the first surface of the holder.
前記保持体の前記第２の表面側に配置された複数の受電電極と、 A plurality of power receiving electrodes arranged on the second surface side of the holding body, and
前記第１の方向に延びる複数本の電極端子であって、それぞれ、前記複数の受電電極に電気的に接続された複数本の電極端子と、 A plurality of electrode terminals extending in the first direction, each of which is a plurality of electrode terminals electrically connected to the plurality of power receiving electrodes.
を備え、Equipped with
前記柱状支持体は、個別収容部と、前記個別収容部に対して前記第１の方向の少なくとも一方側に位置する共通収容部とを含み、 The columnar support includes an individual accommodating portion and a common accommodating portion located on at least one side of the individual accommodating portion in the first direction.
前記個別収容部は、前記第１の方向に延びる複数の個別貫通孔であって、それぞれ、前記複数本の電極端子の内の１本を収容する複数の個別貫通孔が形成されており、 The individual accommodating portion is a plurality of individual through holes extending in the first direction, each of which is formed with a plurality of individual through holes for accommodating one of the plurality of electrode terminals.
前記共通収容部は、前記第１の方向に延び、かつ、前記個別貫通孔より径が大きい共通貫通孔であって、前記個別貫通孔にそれぞれ収容された２本以上の前記電極端子をまとめて収容する共通貫通孔が形成されるとともに、前記第１の方向に直交する断面積が、前記個別収容部の前記第１の方向に直交する断面積より小さく、かつ、 The common accommodating portion is a common through hole extending in the first direction and having a diameter larger than that of the individual through holes, and two or more of the electrode terminals accommodated in the individual through holes are collectively combined. A common through hole for accommodating is formed, and the cross-sectional area orthogonal to the first direction is smaller than the cross-sectional area orthogonal to the first direction of the individual accommodating portion.
前記共通収容部は、少なくとも、前記柱状支持体における前記保持体とは反対側の端部と前記個別収容部との間に配置された第２の共通収容部を含み、 The common accommodating portion includes at least a second common accommodating portion arranged between the end portion of the columnar support opposite to the holding body and the individual accommodating portion.
前記個別収容部における前記第１の方向の長さ（Ｌ３）は、前記第２の共通収容部における前記第１の方向の長さ（Ｌ２）より短く、 The length (L3) in the first direction of the individual accommodating portion is shorter than the length (L2) of the first direction in the second common accommodating portion.
前記柱状支持体の前記保持体とは反対側に配置される連結部材と、 A connecting member arranged on the opposite side of the columnar support from the holding body, and
前記柱状支持体と前記連結部材との間に配置されるシール部材と、を備えることを特徴とする、加熱装置。 A heating device comprising: a seal member arranged between the columnar support and the connecting member. 第１の方向に略直交する第１の表面および第２の表面を有する板状であり、内部に抵抗発熱体を有する保持体と、 A plate-shaped holding body having a first surface and a second surface substantially orthogonal to the first direction and having a resistance heating element inside, and a holding body.
前記第１の方向に延びる柱状であり、前記保持体の前記第２の表面に接合され、セラミックスにより形成された柱状支持体と、 A columnar support extending in the first direction, joined to the second surface of the holding body, and formed of ceramics, and a columnar support.
を備え、前記保持体の前記第１の表面上に保持された対象物を加熱する加熱装置において、さらに、Further, in a heating device for heating an object held on the first surface of the holder.
前記保持体の前記第２の表面側に配置された複数の受電電極と、 A plurality of power receiving electrodes arranged on the second surface side of the holding body, and
前記第１の方向に延びる複数本の電極端子であって、それぞれ、前記複数の受電電極に電気的に接続された複数本の電極端子と、 A plurality of electrode terminals extending in the first direction, each of which is a plurality of electrode terminals electrically connected to the plurality of power receiving electrodes.
を備え、Equipped with
前記柱状支持体は、個別収容部と、前記個別収容部に対して前記第１の方向の少なくとも一方側に位置する共通収容部とを含み、 The columnar support includes an individual accommodating portion and a common accommodating portion located on at least one side of the individual accommodating portion in the first direction.
前記個別収容部は、前記第１の方向に延びる複数の個別貫通孔であって、それぞれ、前記複数本の電極端子の内の１本を収容する複数の個別貫通孔が形成されており、 The individual accommodating portion is a plurality of individual through holes extending in the first direction, each of which is formed with a plurality of individual through holes for accommodating one of the plurality of electrode terminals.
前記共通収容部は、前記第１の方向に延び、かつ、前記個別貫通孔より径が大きい共通貫通孔であって、前記個別貫通孔にそれぞれ収容された２本以上の前記電極端子をまとめて収容する共通貫通孔が形成されるとともに、前記第１の方向に直交する断面積が、前記個別収容部の前記第１の方向に直交する断面積より小さく、かつ、 The common accommodating portion is a common through hole extending in the first direction and having a diameter larger than that of the individual through holes, and two or more of the electrode terminals accommodated in the individual through holes are collectively combined. A common through hole for accommodating is formed, and the cross-sectional area orthogonal to the first direction is smaller than the cross-sectional area orthogonal to the first direction of the individual accommodating portion.
前記共通収容部は、少なくとも、前記柱状支持体における前記保持体とは反対側の端部と前記個別収容部との間に配置された第２の共通収容部を含み、 The common accommodating portion includes at least a second common accommodating portion arranged between the end portion of the columnar support opposite to the holding body and the individual accommodating portion.
前記個別収容部における前記第１の方向の長さ（Ｌ３）は、前記第２の共通収容部における前記第１の方向の長さ（Ｌ２）より短く、 The length (L3) in the first direction of the individual accommodating portion is shorter than the length (L2) of the first direction in the second common accommodating portion.
前記個別収容部のうち、前記各個別貫通孔を構成する内周面と前記各電極端子の外周面との間に隙間を有することを特徴とする、加熱装置。 A heating device having a gap between an inner peripheral surface constituting each individual through hole and an outer peripheral surface of each of the electrode terminals among the individual accommodating portions. 第１の方向に略直交する第１の表面および第２の表面を有する板状であり、内部に抵抗発熱体を有する保持体と、 A plate-shaped holding body having a first surface and a second surface substantially orthogonal to the first direction and having a resistance heating element inside, and a holding body.
前記第１の方向に延びる柱状であり、前記保持体の前記第２の表面に接合され、セラミックスにより形成された柱状支持体と、 A columnar support extending in the first direction, joined to the second surface of the holding body, and formed of ceramics, and a columnar support.
を備え、前記保持体の前記第１の表面上に保持された対象物を加熱する加熱装置において、さらに、Further, in a heating device for heating an object held on the first surface of the holder.
前記保持体の前記第２の表面側に配置された複数の受電電極と、 A plurality of power receiving electrodes arranged on the second surface side of the holding body, and
前記第１の方向に延びる複数本の電極端子であって、それぞれ、前記複数の受電電極に電気的に接続された複数本の電極端子と、 A plurality of electrode terminals extending in the first direction, each of which is a plurality of electrode terminals electrically connected to the plurality of power receiving electrodes.
を備え、Equipped with
前記柱状支持体は、個別収容部と、前記個別収容部に対して前記第１の方向の少なくとも一方側に位置する共通収容部とを含み、 The columnar support includes an individual accommodating portion and a common accommodating portion located on at least one side of the individual accommodating portion in the first direction.
前記個別収容部は、前記第１の方向に延びる複数の個別貫通孔であって、それぞれ、前記複数本の電極端子の内の１本を収容する複数の個別貫通孔が形成されており、 The individual accommodating portion is a plurality of individual through holes extending in the first direction, each of which is formed with a plurality of individual through holes for accommodating one of the plurality of electrode terminals.
前記共通収容部は、前記第１の方向に延び、かつ、前記個別貫通孔より径が大きい共通貫通孔であって、前記個別貫通孔にそれぞれ収容された２本以上の前記電極端子をまとめて収容する共通貫通孔が形成されるとともに、前記第１の方向に直交する断面積が、前記個別収容部の前記第１の方向に直交する断面積より小さく、かつ、 The common accommodating portion is a common through hole extending in the first direction and having a diameter larger than that of the individual through holes, and two or more of the electrode terminals accommodated in the individual through holes are collectively combined. A common through hole for accommodating is formed, and the cross-sectional area orthogonal to the first direction is smaller than the cross-sectional area orthogonal to the first direction of the individual accommodating portion.
前記共通収容部は、少なくとも、前記柱状支持体における前記保持体とは反対側の端部と前記個別収容部との間に配置された第２の共通収容部を含み、 The common accommodating portion includes at least a second common accommodating portion arranged between the end portion of the columnar support opposite to the holding body and the individual accommodating portion.
前記個別収容部における前記第１の方向の長さ（Ｌ３）は、前記第２の共通収容部における前記第１の方向の長さ（Ｌ２）より短く、 The length (L3) in the first direction of the individual accommodating portion is shorter than the length (L2) of the first direction in the second common accommodating portion.
前記個別収容部における前記第１の方向の長さ（Ｌ３）は、前記柱状支持体の前記第１の方向の全長の１／４０以上であることを特徴とする、加熱装置。 The heating device, wherein the length (L3) in the individual housing portion in the first direction is 1/40 or more of the total length of the columnar support in the first direction. 請求項２から請求項４までのいずれか一項に記載の加熱装置において、
前記共通収容部は、少なくとも、前記保持体と前記個別収容部との間に配置された第１の共通収容部を含むことを特徴とする、加熱装置。 The heating device according to any one of claims 2 to 4 .
The heating device, characterized in that the common accommodating portion includes at least a first common accommodating portion arranged between the holding body and the individual accommodating portion. 請求項１または請求項５に記載の加熱装置において、
前記第１の共通収容部における前記第１の方向の長さ（Ｌ１）は、前記第２の共通収容部における前記第１の方向の長さ（Ｌ２）より短いことを特徴とする、加熱装置。 In the heating device according to claim 1 or claim 5 .
The heating device, characterized in that the length (L1) of the first common housing portion in the first direction is shorter than the length (L2) of the first common housing portion in the first direction. .. 請求項２から請求項４までのいずれか一項に記載の加熱装置において、
前記保持体と前記個別収容部との間に前記共通収容部が介在しないことを特徴とする、加熱装置。 The heating device according to any one of claims 2 to 4 .
A heating device, characterized in that the common accommodating portion does not intervene between the holding body and the individual accommodating portion.
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Citations (3)

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JP2004356624A (en) 2003-05-07 2004-12-16 Tokyo Electron Ltd Mounting stand structure and heat treatment equipment
JP2006179897A (en) 2001-09-11 2006-07-06 Sumitomo Electric Ind Ltd Workpiece holder, susceptor for semiconductor manufacturing apparatus, and processing apparatus
JP2011165891A (en) 2010-02-09 2011-08-25 Tokyo Electron Ltd Mounting stand structure, and processing device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179897A (en) 2001-09-11 2006-07-06 Sumitomo Electric Ind Ltd Workpiece holder, susceptor for semiconductor manufacturing apparatus, and processing apparatus
JP2004356624A (en) 2003-05-07 2004-12-16 Tokyo Electron Ltd Mounting stand structure and heat treatment equipment
JP2011165891A (en) 2010-02-09 2011-08-25 Tokyo Electron Ltd Mounting stand structure, and processing device

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