JP7259093B2 - 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 - Google Patents

粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 Download PDF

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Publication number
JP7259093B2
JP7259093B2 JP2021575705A JP2021575705A JP7259093B2 JP 7259093 B2 JP7259093 B2 JP 7259093B2 JP 2021575705 A JP2021575705 A JP 2021575705A JP 2021575705 A JP2021575705 A JP 2021575705A JP 7259093 B2 JP7259093 B2 JP 7259093B2
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Japan
Prior art keywords
copper foil
roughened
carrier
less
cutoff wavelength
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JP2021575705A
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English (en)
Japanese (ja)
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JPWO2021157362A1 (ko
Inventor
眞 細川
哲聡 ▲高▼梨
美智 溝口
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Mitsui Mining and Smelting Co Ltd
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Mitsui Mining and Smelting Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2021575705A 2020-02-04 2021-01-20 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 Active JP7259093B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020016980 2020-02-04
JP2020016980 2020-02-04
PCT/JP2021/001902 WO2021157362A1 (ja) 2020-02-04 2021-01-20 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2021157362A1 JPWO2021157362A1 (ko) 2021-08-12
JP7259093B2 true JP7259093B2 (ja) 2023-04-17

Family

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JP2021575705A Active JP7259093B2 (ja) 2020-02-04 2021-01-20 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Country Status (5)

Country Link
JP (1) JP7259093B2 (ko)
KR (1) KR20220106200A (ko)
CN (1) CN115038819A (ko)
TW (1) TWI756039B (ko)
WO (1) WO2021157362A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022153580A1 (ja) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023281759A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001089892A (ja) 1999-09-21 2001-04-03 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びその製造方法並びにそのキャリア箔付電解銅箔を用いた銅張積層板
JP2005048277A (ja) 2003-07-15 2005-02-24 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法
JP2014506202A (ja) 2010-12-14 2014-03-13 スリーエム イノベイティブ プロパティズ カンパニー 像及びそれを作製する方法
WO2016117587A1 (ja) 2015-01-22 2016-07-28 三井金属鉱業株式会社 キャリア付極薄銅箔及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3392066B2 (ja) * 1998-01-19 2003-03-31 三井金属鉱業株式会社 複合銅箔およびその製造方法並びに該複合銅箔を用いた銅張り積層板およびプリント配線板
WO2016174998A1 (ja) * 2015-04-28 2016-11-03 三井金属鉱業株式会社 粗化処理銅箔及びプリント配線板
WO2017006739A1 (ja) * 2015-07-03 2017-01-12 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN109072472B (zh) * 2016-04-14 2020-10-16 三井金属矿业株式会社 表面处理铜箔、带载体铜箔、以及使用它们的覆铜层叠板及印刷电路板的制造方法
JP6462961B2 (ja) 2016-12-14 2019-01-30 古河電気工業株式会社 表面処理銅箔および銅張積層板
JP6632739B2 (ja) * 2017-04-25 2020-01-22 古河電気工業株式会社 表面処理銅箔
JP7166335B2 (ja) * 2018-03-27 2022-11-07 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
KR102480377B1 (ko) * 2018-08-10 2022-12-23 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001089892A (ja) 1999-09-21 2001-04-03 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びその製造方法並びにそのキャリア箔付電解銅箔を用いた銅張積層板
JP2005048277A (ja) 2003-07-15 2005-02-24 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法
JP2014506202A (ja) 2010-12-14 2014-03-13 スリーエム イノベイティブ プロパティズ カンパニー 像及びそれを作製する方法
WO2016117587A1 (ja) 2015-01-22 2016-07-28 三井金属鉱業株式会社 キャリア付極薄銅箔及びその製造方法

Also Published As

Publication number Publication date
JPWO2021157362A1 (ko) 2021-08-12
KR20220106200A (ko) 2022-07-28
TW202146711A (zh) 2021-12-16
CN115038819A (zh) 2022-09-09
WO2021157362A1 (ja) 2021-08-12
TWI756039B (zh) 2022-02-21

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