JP7192252B2 - In-vehicle electronic equipment - Google Patents

In-vehicle electronic equipment Download PDF

Info

Publication number
JP7192252B2
JP7192252B2 JP2018103502A JP2018103502A JP7192252B2 JP 7192252 B2 JP7192252 B2 JP 7192252B2 JP 2018103502 A JP2018103502 A JP 2018103502A JP 2018103502 A JP2018103502 A JP 2018103502A JP 7192252 B2 JP7192252 B2 JP 7192252B2
Authority
JP
Japan
Prior art keywords
cover
circuit board
case
electronic device
outside air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018103502A
Other languages
Japanese (ja)
Other versions
JP2019206295A5 (en
JP2019206295A (en
Inventor
侯宏 松岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2018103502A priority Critical patent/JP7192252B2/en
Priority to PCT/JP2019/013252 priority patent/WO2019230170A1/en
Publication of JP2019206295A publication Critical patent/JP2019206295A/en
Publication of JP2019206295A5 publication Critical patent/JP2019206295A5/ja
Application granted granted Critical
Publication of JP7192252B2 publication Critical patent/JP7192252B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0212—Condensation eliminators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Casings For Electric Apparatus (AREA)

Description

本発明は、例えば自動車等の車両に搭載される車載用電子装置に関する。 The present invention relates to an in-vehicle electronic device mounted in a vehicle such as an automobile.

例えば、自動車等の車両には、例えばディスプレイユニットやエンジン制御用ＥＣＵ等の各種の電子装置が搭載される。この種の電子装置は、ケース内に回路基板を収容して構成されるが、特に冷却ファンを備え、外気をケース内に取込んで部品の冷却を図るようにしたものでは、低温の状態で、高湿度の空気がケース内に浸入すると、回路基板の表面等における結露が発生し、ひいては腐食等につながる虞がある。そこで、従来では、回路基板上の結露の虞のある部分に、防湿剤を塗布することが一般に行われている。 For example, vehicles such as automobiles are equipped with various electronic devices such as a display unit and an engine control ECU. This type of electronic device is constructed by housing a circuit board in a case. If high-humidity air enters the case, condensation may occur on the surface of the circuit board, etc., which may lead to corrosion or the like. Therefore, conventionally, it is common practice to apply a moisture-proof agent to the portion of the circuit board where dew condensation may occur.

また、電子装置における回路基板の表面部に対する塵埃などの侵入を防止するために、例えば次のような構成も考えられている、即ち、特許文献１では、光ディスク装置において、ステンレスの薄板からなる保護カバーを設けることが開示されている。或いは、特許文献２においては、デジタルカメラにおいて、光学フィルタ部分への塵埃の侵入を防止するために、光学フィルタをエラストマ（ゴム材）でカバーすることが開示されている。 In addition, in order to prevent dust from entering the surface of the circuit board in an electronic device, for example, the following configuration has been considered. Providing a cover is disclosed. Alternatively, Patent Document 2 discloses that an optical filter is covered with an elastomer (rubber material) in order to prevent dust from entering the optical filter portion in a digital camera.

特開２００４－１１０９７３号公報JP-A-2004-110973 特許第５９０１３４７号公報Japanese Patent No. 5901347

しかしながら、上記のように、回路基板に防湿剤を塗布する構成では、塗布作業や管理に工数がかかり、製造コストがアップしてしまう事情がある。また、コネクタ等に防湿剤が付着してしまうと、機能不良を招いてしまう虞もある。金属製の保護カバーを設ける構成では、保護カバー自体が高価となると共に、回路基板との間のクリアランスを小さく確保することが難しく、絶縁不良等の問題があった。或いは、エラストマでカバーする構成では、車両という高温、高湿の環境下での使用において、ゴム材料の変形や劣化の問題があった。 However, as described above, in the configuration in which the moisture-proof agent is applied to the circuit board, the number of man-hours required for the application work and management increases, resulting in an increase in the manufacturing cost. Also, if the moisture-proof agent adheres to the connector or the like, there is a possibility that it may lead to malfunction. In the configuration in which a protective cover made of metal is provided, the protective cover itself is expensive, and it is difficult to secure a small clearance from the circuit board, resulting in problems such as poor insulation. Alternatively, in the configuration covered with an elastomer, there is a problem of deformation or deterioration of the rubber material when used in a high-temperature, high-humidity environment such as a vehicle.

本発明は上記事情に鑑みてなされたもので、その目的は、結露や塵埃等からの回路基板の保護を効果的に行うことができながら、そのための構成を簡単に済ませることができる車載用電子装置を提供するにある。 SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an in-vehicle electronic device capable of effectively protecting a circuit board from condensation, dust, etc., while simplifying the configuration for that purpose. to provide equipment.

上記目的を達成するために、本発明の車載用電子装置（１）は、車両に搭載される電子装置（１）であって、ケース（２）と、前記ケース（２）内に設けられた回路基板（３）と、前記回路基板（３）の少なくとも一部を覆うように設けられる保護用のカバー（１１）とを備え、前記カバー（１１）は、プラスチック製シートの成形品からなると共に、表面側突起部（１２）及び裏面側突起部（１３）を一体に有し、前記表面側突起部（１２）が前記ケース（２）の内壁面に当接し、前記裏面側突起部（１３）が前記回路基板（３）の表面に当接した状態で設けられ、前記ケース（２）には、外気を導入するための外気流入口（７）が設けられており、前記カバー（１１）は、前記回路基板（３）のうち少なくとも前記外気流入口（７）に臨む部分を覆うように設けられている。 In order to achieve the above object, a vehicle electronic device (1) of the present invention is an electronic device (1) to be mounted on a vehicle, comprising a case (2) and a A circuit board (3) and a protective cover (11) provided so as to cover at least a part of the circuit board (3), the cover (11) being made of a molded plastic sheet. , a surface-side protrusion (12) and a back-side protrusion (13) integrally provided, the front-side protrusion (12) abutting the inner wall surface of the case (2), and the back-side protrusion (13) ) is provided in contact with the surface of the circuit board (3), the case (2) is provided with an outside air inlet (7) for introducing outside air, and the cover (11) is provided so as to cover at least a portion of the circuit board (3) facing the outside air inlet (7) .

これによれば、回路基板が保護用のカバーによって覆われることにより、回路基板に対する結露の防止や、塵埃の付着の防止を図ることができる。このとき、保護用のカバーは、プラスチック製シートの成形品から構成されるので、回路基板の表面形状に倣った立体形状を容易に形成でき、カバーの厚み自体を薄くして小さなクリアランスでも配置することが可能となる。また安価に済ませることができる。カバーは、絶縁材製なので、金属製のカバーと異なり、回路基板との間のクリアランスを小さくしても、絶縁不良の問題が生ずることはないことは勿論である。 According to this, by covering the circuit board with the protective cover, dew condensation on the circuit board and adhesion of dust can be prevented. At this time, since the protective cover is made of a molded plastic sheet, it can be easily formed into a three-dimensional shape that follows the surface shape of the circuit board, and the thickness of the cover itself is made thin so that it can be placed even with a small clearance. becomes possible. Moreover, it can be completed at low cost. Since the cover is made of an insulating material, unlike a metal cover, even if the clearance between the cover and the circuit board is made small, the problem of insulation failure does not occur.

ここで、ケース内にプラスチック製のカバーを設ける場合、車両振動に伴うカバーの振動音の発生が懸念される。ところが、カバーの表面側に設けられた表面側突起部がケースの内壁面に当接し、カバーの裏面側に設けられた裏面側突起部が回路基板の表面に当接するので、カバーがケースと回路基板との間に挟まれて保持される形態となり、カバーの振動を規制して異音の発生を防止することができる。従って、結露や塵埃等からの回路基板の保護を効果的に行うことができながら、そのための構成を簡単に済ませることができるという優れた効果を得ることができる。 Here, when a cover made of plastic is provided in the case, there is concern that the cover may generate vibration noise due to vehicle vibration. However, the front-side protrusions provided on the front side of the cover abut against the inner wall surface of the case, and the back-side protrusions provided on the back side of the cover abut against the surface of the circuit board. and the circuit board, and the vibration of the cover can be regulated to prevent the occurrence of abnormal noise. Therefore, it is possible to effectively protect the circuit board from dew condensation, dust, etc., and at the same time, it is possible to obtain the excellent effect of simplifying the configuration for that purpose.

一実施形態を示すもので、車載用電子装置の分解斜視図1 shows an embodiment, and is an exploded perspective view of an in-vehicle electronic device. 第２ケースを取外した状態の要部の斜視図Perspective view of essential parts with the second case removed 第２回路基板上にカバーを配置した状態の斜視図A perspective view of a state in which a cover is arranged on the second circuit board. 表面側突起部部分を示す断面図Cross-sectional view showing the projection part on the front side 裏面側突起部部分を示す断面図Cross-sectional view showing the back side projection part

以下、車載用電子装置として例えば車両用のディスプレイユニットに適用した一実施形態について、図面を参照しながら説明する。本実施形態に係る車載用電子装置１（以下、単に「電子装置１」という）は、例えばナビゲーションシステムを構成するディスプレイユニットからなり、自動車のインストルメントパネルの中央部分に搭載される。尚、図面では、実際の車載時（使用状態）には前面（正面）側に配置される液晶パネル側を、下向きに置いた形態で示している。 An embodiment applied to, for example, a vehicle display unit as an in-vehicle electronic device will be described below with reference to the drawings. An in-vehicle electronic device 1 (hereinafter simply referred to as "electronic device 1") according to the present embodiment comprises, for example, a display unit that constitutes a navigation system, and is mounted in the central portion of an instrument panel of an automobile. In the drawing, the liquid crystal panel side, which is arranged on the front side (front side) when actually mounted on a vehicle (used state), is shown facing downward.

図１は、電子装置１の全体の外観を概略的に示している。この電子装置１は、ケース２内に、プリント配線板に各種部品を実装してなる回路基板３、４を収容して構成される。このとき、本実施形態では、回路基板３、４がケース２内に２枚が設けられ、そのうち図で手前側（使用状態では下側）の回路基板を第１の回路基板３、奥側（使用状態では上側）の回路基板を第２の回路基板４と称する。 FIG. 1 schematically shows the overall appearance of an electronic device 1. As shown in FIG. This electronic device 1 is configured by accommodating circuit boards 3 and 4 each having various components mounted on a printed wiring board in a case 2 . At this time, in this embodiment, two circuit boards 3 and 4 are provided in the case 2, of which the circuit board on the front side in the figure (lower side in the state of use) is the first circuit board 3, and the circuit board on the back side ( The circuit board on the upper side when in use is referred to as a second circuit board 4 .

前記ケース２は、図で上下方向（使用状態では前後方向）に薄型のほぼ矩形箱状をなし、図で下側の第１ケース５と、図で上側の第２ケース６とを突き合わせて接合して構成される。そのうち第１ケース５は、図２にも一部示すように、例えばプラスチックから、図で上面が開口した薄型ほぼ矩形箱状に構成されている。図示はしないが、この第１ケース５の下面側（車載時には前面側）には、液晶パネルが設けられている。 The case 2 has a thin, substantially rectangular box shape in the vertical direction in the figure (front and back direction in use), and the first case 5 on the lower side in the figure and the second case 6 on the upper side in the figure are butted and joined. configured as Among them, the first case 5, as partially shown in FIG. 2, is made of plastic, for example, and has a thin, substantially rectangular box shape with an open top. Although not shown, a liquid crystal panel is provided on the bottom side of the first case 5 (the front side when mounted).

前記第２ケース６は、例えば金属から、図で下面が開口した矩形蓋状に構成され、前記第１ケース５の図で上面の開口部を塞ぐように設けられる。この第２ケース６の中央部には、ファン取付部６ａが設けられており、冷却用のファン装置（図示せず）が装着されるようになっている。さらに、第２ケース６には、外部接続用の複数個のコネクタ８（一部のみ図示）が配置される開口６ｂなどが設けられている。尚、第２ケース６の図で前端下辺部には、図で手前側に延びる延出部６ｃが一体に設けられている。 The second case 6 is made of metal, for example, and has a rectangular lid shape with an open lower surface in the figure, and is provided so as to close the upper opening of the first case 5 in the figure. A fan mounting portion 6a is provided in the central portion of the second case 6, and a cooling fan device (not shown) is mounted thereon. Further, the second case 6 is provided with openings 6b and the like in which a plurality of connectors 8 (only some of which are shown) for external connection are arranged. An extending portion 6c extending toward the near side in the drawing is integrally provided at the lower side portion of the front end of the second case 6 in the drawing.

このとき、ケース２の図で前面部（使用状態では底面部）には、第１ケース５と第２ケース６の延出部６ｃとの間に位置して外気流入口７が設けられている。これにて、前記ファン装置が駆動されると、図１に矢印Ａで示すように、外気流入口７からケース２内に外気が吸い込まれて、内部の電子部品等の冷却に寄与した後、図で上面側（使用状態では背面側）に排出されるようになっている。 At this time, the outside air inlet 7 is provided between the extension 6c of the first case 5 and the second case 6 on the front surface (bottom surface in use) of the case 2 in the figure. . Thus, when the fan device is driven, outside air is sucked into the case 2 from the outside air inlet 7 as indicated by arrow A in FIG. In the figure, it is designed to be discharged to the top side (the back side in use).

前記第１の回路基板３は、図２、図３にも示すように、横長な形状をなし、その上面には、電気回路を構成する複数個の部品９（一部のみ図示）が実装されている。この場合、第１の回路基板３は、ケース２（第１ケース５）内の図で手前側に配置され、従って、第１の回路基板３の上面部は、前記外気流入口７に臨む部位に配置されている。図１に示すように、第２の回路基板４は、第１の回路基板３より図で前後方向に大型なほぼ正方形状をなし、ケース２（第１ケース５）内の第１の回路基板３の奥側に位置して配設されている、前記コネクタ８は、第２の回路基板４上に実装されている。 As shown in FIGS. 2 and 3, the first circuit board 3 has a horizontally long shape, and a plurality of components 9 (only some of which are shown) constituting an electric circuit are mounted on the upper surface thereof. ing. In this case, the first circuit board 3 is arranged on the front side in the drawing inside the case 2 (first case 5), and therefore the upper surface of the first circuit board 3 faces the outside air inlet 7. are placed in As shown in FIG. 1, the second circuit board 4 has a substantially square shape that is larger in the front-rear direction than the first circuit board 3, and is located inside the case 2 (first case 5). The connector 8 located on the far side of the circuit board 3 is mounted on the second circuit board 4 .

さて、本実施形態では、前記回路基板３、４のうち、第１の回路基板３の上面を覆うように、保護用のカバー１１が設けられる。図１～図３に示すように、このカバー１１は、プラスチック製シートの成型品からなり、全体として、第１の回路基板３の上面の電子部品９を含めた凹凸形状に沿うように、僅かなクリアランスを確保した状態で上面ほぼ全体を覆うような形状、つまり薄型の矩形蓋形状に形成されている。より具体的には、このカバー１１を構成するプラスチック製シートは、例えばポリプロピレン（ＰＰ）の厚み寸法が０．５ｍｍのシート（フィルム）からなり、いわゆる真空成型によりカバー１１が成形されている。 Now, in this embodiment, a protective cover 11 is provided so as to cover the upper surface of the first circuit board 3 of the circuit boards 3 and 4 . As shown in FIGS. 1 to 3, the cover 11 is made of a molded plastic sheet, and as a whole, is slightly bent so as to follow the uneven shape including the electronic components 9 on the upper surface of the first circuit board 3. It is formed in a shape that covers almost the entire top surface while securing a sufficient clearance, that is, in a thin rectangular lid shape. More specifically, the plastic sheet forming the cover 11 is, for example, a polypropylene (PP) sheet (film) having a thickness of 0.5 mm, and the cover 11 is formed by so-called vacuum forming.

周知のように、真空成型とは、シートを加熱して軟化させた状態で、真空引きにより成形型の表面に密着させて成形する方法である。尚、図２、図３に示すように、第１の回路基板３の上面に実装されている部品９のうち、高さ寸法の大きい一部の部品９に関しては、カバー１１に開口１１ａが形成され、部品９がその開口１１ａから上方に突出するように配置される。 As is well known, vacuum molding is a method in which a sheet is softened by heating and then vacuumed to adhere to the surface of a mold for molding. Incidentally, as shown in FIGS. 2 and 3, among the components 9 mounted on the top surface of the first circuit board 3, for some components 9 having a large height dimension, an opening 11a is formed in the cover 11. and the component 9 is arranged to protrude upward from its opening 11a.

そして、カバー１１には、その表面側に位置して表面側突起部１２が一体に形成され、裏面側に位置して裏面側突起部１３が一体に形成されている。そのうち表面側突起部１２は、図３に示すように、カバー１１の図で前側寄り部位の中心線Ｃに沿う位置に、図４にも示すように、例えば直径４ｍｍ程度で丸く膨らんだ形態に１個が設けられている。また、表面側突起部１２の厚み方向（図で上方）への突出寸法は、例えば０．６ｍｍ程度とされている。この表面側突起部１２は、先端が前記ケース２、つまり第２ケース６の延出部６ｃの内壁面に当接する。 Further, the cover 11 is integrally formed with a surface-side protrusion 12 positioned on the front side thereof, and integrally formed with a back-side protrusion 13 positioned on the back side thereof. As shown in FIG. 3, the surface-side protrusion 12 is positioned along the center line C of the front-side portion of the cover 11, as shown in FIG. 4. As shown in FIG. One is provided. The projection dimension in the thickness direction (upward in the drawing) of the surface-side projecting portion 12 is, for example, about 0.6 mm. The tip of the surface-side protrusion 12 contacts the inner wall surface of the extension 6c of the case 2, that is, the second case 6. As shown in FIG.

前記裏面側突起部１３は、図５にも示すように、カバー１１の図で前端部位の、中心線Ｃに対して左右に対称的な位置に、各２個ずつが横方向に並んで設けられている。これら裏面側突起部１３は、先端が丸みを帯びた円筒状に裏面側に突出するように形成されており、厚み方向（図で下方）への突出寸法は、例えば０．６ｍｍ程度とされている。これら裏面側突起部１３は、先端が第１の回路基板３の表面に当接する。これにて、カバー１１は、第２ケース６と第１の回路基板３との間に挟まれて保持される形態となる。この場合、表面側突起部１２及び裏面側突起部１３の図で高さ方向の干渉量は、例えば０．３ｍｍ程度となる。 As shown in FIG. 5, the back side protrusions 13 are provided in pairs in the horizontal direction at positions symmetrical to the left and right with respect to the center line C of the front end portion of the cover 11 in the figure. It is These back-side protrusions 13 are formed in a cylindrical shape with rounded ends so as to protrude to the back side, and the protrusion dimension in the thickness direction (downward in the drawing) is set to, for example, about 0.6 mm. there is The tips of these rear-surface-side projections 13 are in contact with the surface of the first circuit board 3 . As a result, the cover 11 is sandwiched and held between the second case 6 and the first circuit board 3 . In this case, the amount of interference in the height direction of the front-side protrusion 12 and the rear-side protrusion 13 is, for example, about 0.3 mm.

このとき、前記第１の回路基板３には、両側前後の各コーナー部分や、それ以外の要所に位置して、ねじ挿通穴が形成されており、図２等に示すように、第１ケース５の内壁部に形成されたねじボス部（図示せず）に対して、ねじ（ビス）１４による取付け固定がなされる。本実施形態では、図３に示すように、カバー１１にも、４つのコーナー部などに、第１の回路基板３のねじ挿通穴に重なる位置に、ねじ挿通用の穴１１ｂが形成されており、ねじ１４によるいわゆる共締めにより第１の回路基板３と併せて第１ケース５に固定されている。 At this time, the first circuit board 3 is formed with screw insertion holes positioned at respective front and rear corners on both sides and at other important points. It is attached and fixed by screws 14 to screw bosses (not shown) formed on the inner wall of the case 5 . In this embodiment, as shown in FIG. 3, the cover 11 also has holes 11b for screw insertion formed at four corners or the like at positions overlapping the screw insertion holes of the first circuit board 3. , and are fixed to the first case 5 together with the first circuit board 3 by so-called co-tightening with screws 14 .

次に、上記のように構成された電子装置１の作用・効果について述べる。上記構成の電子装置１においては、第１の回路基板３が保護用のカバー１１によって覆われることにより、第１の回路基板３に対する結露の防止や、塵埃の付着の防止を図ることができる。このとき、カバー１１は、プラスチック製シートの成形品から構成されるので、第１の回路基板３の表面形状に倣った立体形状を容易に形成でき、カバー１１の厚み自体を薄くして小さなクリアランスでも配置することが可能となる。また、カバー１１を安価に済ませることができる。カバー１１は、絶縁材製なので、金属製のカバーと異なり、第１の回路基板３との間のクリアランスを小さくしても、絶縁不良の問題が生ずることがないことは勿論である。 Next, functions and effects of the electronic device 1 configured as described above will be described. In the electronic device 1 configured as described above, by covering the first circuit board 3 with the protective cover 11, it is possible to prevent dew condensation on the first circuit board 3 and prevent dust from adhering to it. At this time, since the cover 11 is formed of a molded plastic sheet, it is possible to easily form a three-dimensional shape that follows the surface shape of the first circuit board 3, and the thickness of the cover 11 itself is reduced to provide a small clearance. It can be placed though. Also, the cover 11 can be made inexpensively. Since the cover 11 is made of an insulating material, unlike a metal cover, even if the clearance between the cover 11 and the first circuit board 3 is reduced, the problem of poor insulation does not occur.

ここで、ケース２内にプラスチック製のカバー１１を設ける場合、車両振動に伴うカバー１１の振動音の発生が懸念される。ところが、カバー１１の表面側に設けられた表面側突起部１２が第２ケース６の延出部６ｃの内壁面に当接し、カバー１１の裏面側に設けられた裏面側突起部１３が第１の回路基板３の表面に当接する。これにより、カバー１１がケース２と第１の回路基板３との間に挟まれて保持される形態となり、カバー１１の振動を規制して異音の発生を防止することができる。従って、本実施形態によれば、結露や塵埃等からの回路基板３の保護を効果的に行うことができながら、そのための構成を簡単に済ませることができるという優れた効果を得ることができる。 Here, when the cover 11 made of plastic is provided in the case 2, there is concern that the cover 11 may generate vibration noise due to vehicle vibration. However, the front-side protrusion 12 provided on the front side of the cover 11 abuts the inner wall surface of the extension 6c of the second case 6, and the back-side protrusion 13 provided on the back side of the cover 11 is the first contact. abuts on the surface of the circuit board 3. As a result, the cover 11 is sandwiched and held between the case 2 and the first circuit board 3, and the vibration of the cover 11 can be regulated to prevent abnormal noise. Therefore, according to this embodiment, it is possible to effectively protect the circuit board 3 from dew condensation, dust, and the like, and to achieve the excellent effect of simplifying the configuration for that purpose.

特に本実施形態では、ファン装置を備え、ケース２に設けられた外気流入口７から外気を取入れる構成とされているが、カバー１１は、外気流入口７に臨む部分である第１の回路基板３の図で上面を覆うように設けられている。これにより、ケース２内において最も結露が生じやすい部分である第１の回路基板３の表面部を、カバー１１により覆うことができる、従って、結露が生じたとしてもカバー１１の表面側になるので、第１の回路基板３上の結露やそれに伴う不具合を未然に防止することができる。 In particular, in the present embodiment, a fan device is provided and outside air is taken in from the outside air inlet 7 provided in the case 2. The cover 11 is a portion facing the outside air inlet 7, which is the first circuit. It is provided so as to cover the upper surface of the substrate 3 in the drawing. As a result, the cover 11 can cover the surface of the first circuit board 3, which is the portion of the case 2 where condensation is most likely to occur. , dew condensation on the first circuit board 3 and problems associated therewith can be prevented.

また、本実施形態では、１個の表面側突起部１２をカバー１１のうち中心線Ｃに沿う位置に設け、複数個の裏面側突起部１３を、カバー１１のうち中心線Ｃに対して左右対称的な位置に設けるようにした。これにより、カバー１１が、ケース２と第１の回路基板３との間に安定して保持されるようになる。 Further, in the present embodiment, one front side protrusion 12 is provided on the cover 11 at a position along the center line C, and a plurality of back side protrusions 13 are provided on the left and right sides of the center line C on the cover 11. I set them in symmetrical positions. This allows the cover 11 to be stably held between the case 2 and the first circuit board 3 .

本実施形態では、カバー１１を構成するプラスチック製シートとして、ポリプロピレンを採用した。材料としてのポリプロピレンは、安価、軽量であり、絶縁性に優れ、薄いシートでも一定の強度（剛性）が得られる。真空成型などの成形性も良い。ゴム等と比べて熱や温度変化に強く熱的に安定している、金属に比べて熱容量も小さい、等のメリットを得ることができる。 In this embodiment, polypropylene is used as the plastic sheet forming the cover 11 . Polypropylene as a material is inexpensive, lightweight, and excellent in insulating properties, and a certain strength (rigidity) can be obtained even in a thin sheet. Moldability such as vacuum molding is also good. It is more resistant to heat and temperature changes than rubber and is thermally stable, and has a smaller heat capacity than metal.

尚、上記実施形態では、カバー１１の取付けにあたっては、ケース２（第１ケース５）に対して、第１の回路基板３と共にねじ止め（共締め）する構成としたが、そのような固定手段を特に設けることなく、ケースと回路基板との間に挟持して保持する構成とすることも可能である。また、上記実施形態では、カバー１１を、ＰＰ製としたが、ポリエチレンテレフタレート（ＰＥＴ）から構成しても良く、ＰＰ製の場合と同様の作用・効果を得ることができる。ファン装置を備えないものであっても、同様にカバー１１を設けることにより、結露や塵埃等からの回路基板を保護することができる。 In the above embodiment, the cover 11 is attached to the case 2 (first case 5) by screwing (co-tightening) together with the first circuit board 3. It is also possible to adopt a configuration in which the circuit board is sandwiched and held between the case and the circuit board without providing a special . Further, in the above embodiment, the cover 11 is made of PP, but it may be made of polyethylene terephthalate (PET), and the same functions and effects as those made of PP can be obtained. Even if the fan device is not provided, the circuit board can be protected from dew condensation, dust, etc. by similarly providing the cover 11 .

その他、上記実施形態では、ディスプレイユニットに適用したが、エンジンＥＣＵ等様々な用途、種類の車両用電子装置全般に適用することが可能である。ケースの形状や、外気流入口の配置などについても様々な変更が可能であることは勿論である。本開示は、実施例に準拠して記述されたが、本開示は当該実施例や構造に限定されるものではないと理解される。本開示は、様々な変形例や均等範囲内の変形をも包含する。加えて、様々な組み合わせや形態、さらには、それらに一要素のみ、それ以上、あるいはそれ以下、を含む他の組み合わせや形態をも、本開示の範疇や思想範囲に入るものである。 In addition, in the above-described embodiment, the present invention is applied to the display unit, but it can be applied to various applications and types of vehicle electronic devices in general, such as an engine ECU. It goes without saying that the shape of the case and the arrangement of the outside air inlets can also be changed in various ways. Although the present disclosure has been described with reference to examples, it is understood that the present disclosure is not limited to such examples or structures. The present disclosure also includes various modifications and modifications within the equivalent range. In addition, various combinations and configurations, as well as other combinations and configurations, including single elements, more, or less, are within the scope and spirit of this disclosure.

図面中、１は車載用電子装置、２はケース、３は第１の回路基板、４は第２の回路基板、５は第１ケース、６は第２ケース、７は外気流入口、９は電子部品、１１はカバー、１２は表面側突起部、１３は裏面側突起部、Ｃは中心線を示す。 In the drawings, 1 is an in-vehicle electronic device, 2 is a case, 3 is a first circuit board, 4 is a second circuit board, 5 is a first case, 6 is a second case, 7 is an outside air inlet, and 9 is An electronic component, 11 is a cover, 12 is a projection on the front side, 13 is a projection on the back side, and C is the center line.

Claims (3)

車両に搭載される電子装置（１）であって、
ケース（２）と、
前記ケース（２）内に設けられた回路基板（３）と、
前記回路基板（３）の少なくとも一部を覆うように設けられる保護用のカバー（１１）とを備え、
前記カバー（１１）は、プラスチック製シートの成形品からなると共に、表面側突起部（１２）及び裏面側突起部（１３）を一体に有し、
前記表面側突起部（１２）が前記ケース（２）の内壁面に当接し、前記裏面側突起部（１３）が前記回路基板（３）の表面に当接した状態で設けられ、
前記ケース（２）には、外気を導入するための外気流入口（７）が設けられており、前記カバー（１１）は、前記回路基板（３）のうち少なくとも前記外気流入口（７）に臨む部分を覆うように設けられている車載用電子装置。 An electronic device (1) mounted on a vehicle,
case (2);
a circuit board (3) provided in the case (2);
A protective cover (11) provided to cover at least a portion of the circuit board (3),
The cover (11) is made of a molded plastic sheet and integrally has a surface-side protrusion (12) and a back-side protrusion (13),
The front-side protrusions (12) are provided in contact with the inner wall surface of the case (2), and the back-side protrusions (13) are provided in contact with the surface of the circuit board (3) ,
The case (2) is provided with an outside air inlet (7) for introducing outside air, and the cover (11) is provided at least in the outside air inlet (7) of the circuit board (3). An in-vehicle electronic device provided so as to cover the facing part . 前記表面側突起部及び／又は裏面側突起部は、前記カバーのうち中心線に対して対称的な位置に設けられている請求項１記載の車載用電子装置。 2. The in-vehicle electronic device according to claim 1 , wherein the front-side protrusion and/or the back-side protrusion are provided on the cover at symmetrical positions with respect to a center line . 前記カバーを構成するプラスチック製シートは、ポリプロピレン又はポリエチレンテレフタレートからなる請求項１又は２記載の車載用電子装置。 3. The in-vehicle electronic device according to claim 1, wherein the plastic sheet forming the cover is made of polypropylene or polyethylene terephthalate .
JP2018103502A 2018-05-30 2018-05-30 In-vehicle electronic equipment Active JP7192252B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018103502A JP7192252B2 (en) 2018-05-30 2018-05-30 In-vehicle electronic equipment
PCT/JP2019/013252 WO2019230170A1 (en) 2018-05-30 2019-03-27 Vehicle-mounted electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018103502A JP7192252B2 (en) 2018-05-30 2018-05-30 In-vehicle electronic equipment

Publications (3)

Publication Number Publication Date
JP2019206295A JP2019206295A (en) 2019-12-05
JP2019206295A5 JP2019206295A5 (en) 2020-07-27
JP7192252B2 true JP7192252B2 (en) 2022-12-20

Family

ID=68696934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018103502A Active JP7192252B2 (en) 2018-05-30 2018-05-30 In-vehicle electronic equipment

Country Status (2)

Country Link
JP (1) JP7192252B2 (en)
WO (1) WO2019230170A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2021221637A1 (en) * 2021-08-25 2023-03-16 Redarc Technologies Pty Ltd Electronics housing assembly
JP2023047976A (en) * 2021-09-27 2023-04-06 株式会社デンソー Control device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009087554A (en) 2007-09-27 2009-04-23 Hitachi Maxell Ltd Battery pack
JP2012132432A (en) 2010-11-30 2012-07-12 Panasonic Corp Inverter device integrated electric compressor
JP2013105965A (en) 2011-11-16 2013-05-30 Daikin Ind Ltd Seal structure of electrical part
JP2017130335A (en) 2016-01-20 2017-07-27 アルプス電気株式会社 Electronic device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009087554A (en) 2007-09-27 2009-04-23 Hitachi Maxell Ltd Battery pack
JP2012132432A (en) 2010-11-30 2012-07-12 Panasonic Corp Inverter device integrated electric compressor
JP2013105965A (en) 2011-11-16 2013-05-30 Daikin Ind Ltd Seal structure of electrical part
JP2017130335A (en) 2016-01-20 2017-07-27 アルプス電気株式会社 Electronic device

Also Published As

Publication number Publication date
JP2019206295A (en) 2019-12-05
WO2019230170A1 (en) 2019-12-05

Similar Documents

Publication Publication Date Title
US7978459B2 (en) Electrical junction box
KR102552749B1 (en) Printed circuit board unit
US9496693B2 (en) Electronic component unit and wire harness
US7184273B2 (en) Electronic device with protective housing having enhanced rigidity
JP7192252B2 (en) In-vehicle electronic equipment
WO2016110914A1 (en) Electronic apparatus for vehicle
JP2008224428A (en) Sensor device
JP2017162854A (en) Electronic controller
KR20100017751A (en) Housing consisting of shells assembled together to protect an electronic device
JP2013206969A (en) Electronic apparatus
JP4887906B2 (en) Automotive electronics
WO2021125074A1 (en) Camera module, spacer component, and method for manufacturing camera module
JP5929692B2 (en) Electrical junction box
JP5848653B2 (en) Electronic equipment
JP6887918B2 (en) Electrical junction box
JP2017175854A (en) Electronic control device
JP2019206295A5 (en)
US10285284B2 (en) Method for molding outer case of electronic-circuit unit
JP2004260959A (en) Waterproof structure of electric connection box
JP2005160206A (en) Waterproof structure of electronic unit
JP2002364872A (en) Air conditioner
JP2017174992A (en) Electronic control unit
JP2017171220A (en) Electronic control device
JP7224789B2 (en) Vehicle electronic control unit
JPH0679186U (en) Fixed structure of cover

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200612

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210402

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220531

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221108

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20221121

R151 Written notification of patent or utility model registration

Ref document number: 7192252

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151