JP7189036B2 - light receiving and emitting device - Google Patents

light receiving and emitting device Download PDF

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JP7189036B2
JP7189036B2 JP2019014809A JP2019014809A JP7189036B2 JP 7189036 B2 JP7189036 B2 JP 7189036B2 JP 2019014809 A JP2019014809 A JP 2019014809A JP 2019014809 A JP2019014809 A JP 2019014809A JP 7189036 B2 JP7189036 B2 JP 7189036B2
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optical waveguide
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light emitting
receiving device
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JP2020122878A (en
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祥哲 板倉
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Kyocera Corp
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本開示は、受発光装置に関するものである。 The present disclosure relates to a light receiving and emitting device.

近年、通信における情報量の増加に伴い、光ファイバを用いた光通信が用いられるようになってきている。例えば特許文献１は、波長選択性を有する多層膜フィルタを光導波路の途中に挿入することによって、発光素子を出射した送信光と外部から光導波路に入射した受信光とを分離する一芯双方向型の受発光装置を開示している。 2. Description of the Related Art In recent years, with the increase in the amount of information in communications, optical communications using optical fibers have come to be used. For example, Patent Literature 1 discloses a single-core bidirectional method that separates transmission light emitted from a light-emitting element and reception light that enters an optical waveguide from the outside by inserting a multilayer film filter having wavelength selectivity in the middle of the optical waveguide. type light emitting and receiving device.

特開２００７－１４７７４０号公報JP 2007-147740 A

特許文献１に開示された技術では、波長選択性を有する多層膜フィルタを光導波路の途中に挿入するため、受発光装置が大型化、高コスト化する問題があった。また、特許文献１に開示された受発光装置を複数用いて光通信システムを構築する場合、送信光と受信光とが同一波長でないことにより、複数の受発光装置を同一構成にできないため、光通信システムが高コスト化する問題があった。 In the technique disclosed in Patent Document 1, since a multilayer film filter having wavelength selectivity is inserted in the middle of an optical waveguide, there is a problem that the size and cost of the light receiving and emitting device are increased. Further, when constructing an optical communication system using a plurality of the light emitting/receiving devices disclosed in Patent Document 1, it is not possible to configure the plurality of light emitting/receiving devices to have the same configuration because the transmitted light and the received light do not have the same wavelength. There is a problem that the cost of the communication system increases.

本開示の一つの態様の受発光装置は、主面に凹部が設けられている基体と、
前記凹部に収容された発光素子と、
前記凹部に収容された受光素子と、
前記凹部に収容された光導波路体であって、前記凹部の開口または側壁に臨む第１面、前記発光素子の発光面に向かい合う第２面、および前記受光素子の受光面に向かい合う第３面を含み、内部に前記発光素子が発する光および外部からの光が通る第１光導波路、前記外部からの光のうちの一部を通過させるリング共振器、ならびに前記リング共振器を通過した、前記受光素子によって受光される前記外部からの光のうちの一部が通る第２光導波路が設けられ、前記第１光導波路は、一端部が前記第１面に位置し、他端部が前記第２面に位置しており、前記第２光導波路は、一端部が前記第３面に位置し、他端部が、前記リング共振器を介して、前記第１光導波路に光学的に結合されており、前記リング共振器は、前記第１光導波路に光学的に結合する第１部分と、前記第２光導波路に光学的に結合する第２部分とを有し、前記第２部分は、前記第２部分における光の伝搬方向と前記第２光導波路が延びる方向とが平行となるように配設されており、前記リング共振器は、前記発光素子から発せられ前記第１導波路を通る光および前記外部からの光のうちの、前記リング共振器の共振条件を満たす前記外部からの光だけを、前記第２光導波路に移すように構成されている光導波路体と、を備えることを特徴とする。
A light emitting/receiving device according to one aspect of the present disclosure includes a base having a concave portion on its main surface,
a light emitting element accommodated in the recess;
a light receiving element accommodated in the recess;
The optical waveguide body accommodated in the recess has a first surface facing the opening or side wall of the recess, a second surface facing the light emitting surface of the light emitting element, and a third surface facing the light receiving surface of the light receiving element. a first optical waveguide through which light emitted by the light emitting element and light from the outside pass; a ring resonator that allows a portion of the light from the outside to pass through ; and a ring resonator that passes through the ring resonator. A second optical waveguide is provided through which part of the external light received by the light receiving element passes, and the first optical waveguide has one end located on the first surface and the other end. is located on the second surface, and the second optical waveguide has one end located on the third surface and the other end connected to the first optical waveguide through the ring resonator. optically coupled , the ring resonator having a first portion optically coupled to the first optical waveguide and a second portion optically coupled to the second optical waveguide; The second portion is arranged such that the propagation direction of light in the second portion is parallel to the direction in which the second optical waveguide extends, and the ring resonator emits light from the light emitting element. an optical waveguide body configured to transfer only the external light that satisfies a resonance condition of the ring resonator, out of the light passing through one waveguide and the external light, to the second optical waveguide; , is provided.

本開示の一つの態様の受発光装置によれば、簡易な構成のリング共振器を用いて、外部からの光から受信光を分波することができるため、受発光装置を小型化および低コスト化することが可能になる。また、本開示の一つの態様の受発光装置によれば、送信光の波長と受信光の波長とを同一波長とすることができるため、低コストであり、かつ汎用性の高い光通信システムを構築することが可能になる。 According to the light emitting/receiving device of one aspect of the present disclosure, it is possible to demultiplex the received light from the light from the outside using a ring resonator with a simple configuration, so that the size and cost of the light emitting/receiving device can be reduced. It becomes possible to convert Further, according to the light emitting and receiving device of one aspect of the present disclosure, the wavelength of the transmission light and the wavelength of the reception light can be the same wavelength, so that a low-cost and highly versatile optical communication system can be realized. becomes possible to build.

本開示の一実施形態に係る受発光装置を模式的に示す斜視図である。1 is a perspective view schematically showing a light emitting/receiving device according to an embodiment of the present disclosure; FIG. 本開示の一実施形態に係る受発光装置を模式的に示す断面図である。1 is a cross-sectional view schematically showing a light emitting/receiving device according to an embodiment of the present disclosure; FIG. 本開示の他の実施形態に係る受発光装置を模式的に示す断面図である。FIG. 4 is a cross-sectional view schematically showing a light emitting/receiving device according to another embodiment of the present disclosure; 本開示の他の実施形態に係る受発光装置を模式的に示す断面図である。FIG. 4 is a cross-sectional view schematically showing a light emitting/receiving device according to another embodiment of the present disclosure; 本開示の他の実施形態に係る受発光装置を模式的に示す断面図である。FIG. 4 is a cross-sectional view schematically showing a light emitting/receiving device according to another embodiment of the present disclosure; 本開示の他の実施形態に係る受発光装置を模式的に示す断面図である。FIG. 4 is a cross-sectional view schematically showing a light emitting/receiving device according to another embodiment of the present disclosure;

以下、添付図面を参照して、本開示の受発光装置の実施形態について説明する。 Hereinafter, embodiments of the light receiving and emitting device of the present disclosure will be described with reference to the accompanying drawings.

図１は、本開示の一実施形態に係る受発光装置を模式的に示す斜視図であり、図２は、本開示の一実施形態に係る受発光装置を模式的に示す断面図である。図１では、蓋体を省略して図示しており、図２は、図１の切断面線Ａ－Ａで切断した断面図を示している。 FIG. 1 is a perspective view schematically showing a light emitting/receiving device according to an embodiment of the present disclosure, and FIG. 2 is a cross-sectional view schematically showing the light emitting/receiving device according to an embodiment of the present disclosure. In FIG. 1, the lid is omitted, and FIG. 2 shows a cross-sectional view cut along the cross-sectional line AA in FIG.

本実施形態の受発光装置１は、基体１０と、発光素子２０と、受光素子３０と、光導波路体４０とを備えている。 The light emitting/receiving device 1 of this embodiment includes a substrate 10 , a light emitting element 20 , a light receiving element 30 and an optical waveguide body 40 .

基体１０は、板状の形状を有している。基体１０は、平面視したときの形状が、例えば矩形状、正方形状、円形状等であってもよく、その他の形状であってもよい。基体１０の主面１０ａには、凹部１１が設けられている。凹部１１は、その開口形状が、例えば矩形状、正方形状、円形状等であってもよく、その他の形状であってもよい。また、凹部１１は、主面１０ａに平行な断面の断面形状が深さ方向に一様な形状であってもよく、所定の深さまでは、断面形状が開口形状と同じで一様であり、所定の深さ以降は、断面形状が小さくなって底部まで一様であるような、段差付きの凹部であってもよい。 The base 10 has a plate-like shape. The shape of the substrate 10 when viewed from above may be, for example, a rectangular shape, a square shape, a circular shape, or any other shape. A recess 11 is provided on the main surface 10 a of the base 10 . The opening shape of the recess 11 may be, for example, rectangular, square, circular, or any other shape. Further, the recess 11 may have a uniform cross-sectional shape in the depth direction of the cross section parallel to the main surface 10a, and the cross-sectional shape is the same as the opening shape up to a predetermined depth, After the predetermined depth, the recess may have a stepped shape such that the cross-sectional shape becomes smaller and uniform to the bottom.

基体１０は、複数の誘電体層が積層されて形成されていてもよい。基体１０は、誘電体層がセラミック材料から成るセラミック配線基板であってもよい。セラミック配線基板で用いられるセラミック材料としては、例えば、酸化アルミニウム質焼結体、ムライト質焼結体、炭化ケイ素質焼結体、窒化アルミニウム質焼結体、ガラスセラミック焼結体等が挙げられる。基体１０がセラミック配線基板である場合、誘電体層には、発光素子および受光素子と外部回路との電気的接続のための接続パッド、内部配線導体、外部接続端子等の各導体が配設される。 The substrate 10 may be formed by laminating a plurality of dielectric layers. The substrate 10 may be a ceramic wiring board whose dielectric layer is made of a ceramic material. Examples of ceramic materials used in ceramic wiring boards include aluminum oxide sintered bodies, mullite sintered bodies, silicon carbide sintered bodies, aluminum nitride sintered bodies, and glass ceramic sintered bodies. When the substrate 10 is a ceramic wiring board, the dielectric layer is provided with conductors such as connection pads, internal wiring conductors, and external connection terminals for electrical connection between the light-emitting element and the light-receiving element and an external circuit. be.

基体１０は、誘電体層が有機材料から成る有機配線基板であってもよい。有機配線基板は、例えば、プリント配線基板、ビルドアップ配線基板、フレキシブル配線基板等である。有機配線基板に用いられる有機材料としては、例えば、エポキシ樹脂、ポリイミド樹脂、ポリエステル樹脂、アクリル樹脂、フェノール樹脂、フッ素樹脂等が挙げられる。 The substrate 10 may be an organic wiring board in which the dielectric layer is made of an organic material. Examples of organic wiring boards include printed wiring boards, build-up wiring boards, and flexible wiring boards. Examples of organic materials used for organic wiring boards include epoxy resins, polyimide resins, polyester resins, acrylic resins, phenolic resins, and fluorine resins.

発光素子２０は、凹部１１に収容されている。発光素子２０は、外部へ送信すべき光通信用の波長帯域の光（以下、送信光ともいう）を含む赤外光、可視光等を発する素子である。発光素子２０は、端面発光型の発光素子であてもよく、面発光型の発光素子であってもよい。発光素子２０は、例えば、ＬＤ（Laser Diode）、ＶＣＳＥＬ（Vertical Cavity Surface Emitting Laser）、ＬＥＤ（Light Emitting Diode）等である。なお、受発光装置１は、発光素子２０と外部回路とを電気的に接続するためのボンディングワイヤ、配線導体等を有しているが、図では省略している。 Light emitting element 20 is housed in recess 11 . The light emitting element 20 is an element that emits infrared light, visible light, or the like including light in the wavelength band for optical communication to be transmitted to the outside (hereinafter also referred to as transmission light). The light-emitting element 20 may be an edge-emitting light-emitting element or a surface-emitting light-emitting element. The light emitting element 20 is, for example, an LD (Laser Diode), a VCSEL (Vertical Cavity Surface Emitting Laser), an LED (Light Emitting Diode), or the like. Although the light emitting/receiving device 1 has bonding wires, wiring conductors, etc. for electrically connecting the light emitting element 20 and an external circuit, they are omitted in the drawing.

受光素子３０は、凹部１１に収容されている。受光素子３０は、外部から受信すべき光通信用の波長帯域の光（以下、受信光ともいう）を検知する素子である。受光素子３０は、面受光型の受光素子であってもよく、端面受光型の受光素子であってもよい。受光素子３０は、例えば、ＰＤ（photo diode）である。なお、受発光装置１は、受光素子２０と外部回路とを電気的に接続するためのボンディングワイヤ、配線導体等を有しているが、図では省略している。 The light receiving element 30 is housed in the concave portion 11 . The light-receiving element 30 is an element that detects light in the wavelength band for optical communication to be received from the outside (hereinafter also referred to as received light). The light receiving element 30 may be a surface light receiving type light receiving element or an edge light receiving type light receiving element. The light receiving element 30 is, for example, a PD (photo diode). The light receiving and emitting device 1 has bonding wires, wiring conductors, etc. for electrically connecting the light receiving element 20 and an external circuit, but they are omitted in the drawing.

光導波路体４０は、凹部１１に収容されている。光導波路体４０は、光導波路と該光導波路を取り囲むクラッド部材とを含む構造体であり、第１面４０ａ、第２面４０ｂおよび第３面４０ｃを含んでいる。第１面４０ａは、凹部１１の開口１１ａに臨んでいる。また、第２面４０ｂは、発光素子２０の発光面２０ａに臨んでおり、第３面４０ｃは、受光素子３０の受光面３０ａに臨んでいる。光導波路体４０は、第１面４０ａ、第２面４０ｂおよび第３面４０ｃのいずれとも異なる面が、凹部１１の底面１１ｃに接合されることで、凹部１１内に保持されていてもよい。 The optical waveguide body 40 is housed in the recess 11 . The optical waveguide body 40 is a structure including an optical waveguide and a clad member surrounding the optical waveguide, and includes a first surface 40a, a second surface 40b and a third surface 40c. The first surface 40 a faces the opening 11 a of the recess 11 . The second surface 40 b faces the light emitting surface 20 a of the light emitting element 20 , and the third surface 40 c faces the light receiving surface 30 a of the light receiving element 30 . The optical waveguide body 40 may be held in the recess 11 by bonding a surface different from any of the first surface 40a, the second surface 40b, and the third surface 40c to the bottom surface 11c of the recess 11 .

光導波路体４０は、内部に第１光導波路４１、第２光導波路４２および少なくとも１つのリング共振器４３を有している。また、光導波路体４０は、クラッド部材４４を有している。クラッド部材４４は、第１光導波路４１、第２光導波路４２およびリング共振器４３を囲んでいる。 The optical waveguide body 40 has a first optical waveguide 41, a second optical waveguide 42 and at least one ring resonator 43 inside. The optical waveguide body 40 also has a clad member 44 . A clad member 44 surrounds the first optical waveguide 41 , the second optical waveguide 42 and the ring resonator 43 .

第１光導波路４１、第２光導波路４２、リング共振器４３およびクラッド部材４４は、ガラス、有機材料、樹脂材料等から成る。第１光導波路４１、第２光導波路４２およびリング共振器４３の屈折率は、クラッド部材４４の屈折率よりも大きい。第１光導波路４１、第２光導波路４２およびリング共振器４３は、クラッド部材４４とは異なる材料を含んでいるが、第１光導波路４１、第２光導波路４２およびリング共振器４３と、クラッド部材４４とは一体的に形成されている。 The first optical waveguide 41, the second optical waveguide 42, the ring resonator 43, and the clad member 44 are made of glass, organic material, resin material, or the like. The refractive indices of the first optical waveguide 41 , the second optical waveguide 42 and the ring resonator 43 are higher than the refractive index of the cladding member 44 . Although the first optical waveguide 41, the second optical waveguide 42 and the ring resonator 43 contain a material different from that of the clad member 44, the first optical waveguide 41, the second optical waveguide 42 and the ring resonator 43 and the clad It is integrally formed with the member 44 .

第１光導波路４１は、発光素子２０が発する光および外部からの光が通る光導波路である。第１光導波路４１は、一端部（以下、第１端部ともいう）４１ａが第１面４０ａに位置し、他端部（以下、第２端部ともいう）４１ｂが第２面４０ｂに位置している。 The first optical waveguide 41 is an optical waveguide through which light emitted by the light emitting element 20 and light from the outside pass. The first optical waveguide 41 has one end (hereinafter also referred to as the first end) 41a positioned on the first surface 40a and the other end (hereinafter also referred to as the second end) 41b positioned on the second surface 40b. is doing.

第２光導波路４２は、リング共振器４３を介して、第１光導波路４１に光学的に結合されている。第２光導波路４２は、リング共振器４３を通過した、外部からの光のうちの一部である、受光素子３０によって受光される光（受信光）が通る光導波路である。第２光導波路４２は、一端部（以下、第３端部ともいう）４２ａが第３面４０ｃに位置し、他端部（以下、第４端部ともいう）４２ｂが、リング共振器４３を介して、第１光導波路４１に光学的に結合されている。 The second optical waveguide 42 is optically coupled to the first optical waveguide 41 via the ring resonator 43 . The second optical waveguide 42 is an optical waveguide through which light (received light) received by the light receiving element 30 , which is part of the external light that has passed through the ring resonator 43 , passes. The second optical waveguide 42 has one end (hereinafter also referred to as the third end) 42 a positioned on the third surface 40 c and the other end (hereinafter also referred to as the fourth end) 42 b extending through the ring resonator 43 . It is optically coupled to the first optical waveguide 41 via.

リング共振器４３は、合分波機能を有する光学素子であり、受発光装置１では、外部からの光のうちの一部の光を通過させる光学フィルタの役割を果たしている。受発光装置１のリング共振器４３は、第１光導波路４１を伝搬する外部からの光のうち共振条件を満たす光を第２光導波路４２に移すように構成されている。共振条件は、リング共振器４３の屈折率をｎとし、リング共振器４３の半径をｒとし、第２光導波路４２に移される光の波長をλとするとき、２πｎｒ＝ｍλ（ｍは正の整数）で与えられる。 The ring resonator 43 is an optical element having a multiplexing/demultiplexing function, and in the light emitting/receiving device 1 plays a role of an optical filter that allows a part of the external light to pass through. The ring resonator 43 of the light emitting/receiving device 1 is configured to transfer the light that satisfies the resonance conditions among the external light propagated through the first optical waveguide 41 to the second optical waveguide 42 . The resonance conditions are 2πnr=mλ (where m is a positive integer).

リング共振器４３は、第１光導波路４１に光学的に結合する第１部分４３ａ、および第２光導波路４２に光学的に結合する第２部分４３ｂを有している。リング共振器４３は、例えば図２に示すように、第１部分４３ａが、第１光導波路４１における第１端部４１ａと第２端部４１ｂとの間の中間部分４１ｃに近接するとともに、中間部分４１ｃと略平行に延びるように配設されている。また、リング共振器４３は、例えば図２に示すように、第２部分４３ｂが、第２光導波路４２の第４端部４２ｂに近接し、且つ第２部分４３ｂにおける受信光の伝搬方向が、第４端部４２ｂにおける、第２光導波路４２が延びる方向（第４端部４２ｂから第３端部４２ａに向かう方向）と略平行となるように配設されている。リング共振器４３によれば、第１光導波路４１を伝搬する発光素子２０が発する光および外部からの光のうちリング共振器４３の共振条件を満たす外部からの光だけを、第２光導波路４２に移すことができる。 The ring resonator 43 has a first portion 43 a optically coupled to the first optical waveguide 41 and a second portion 43 b optically coupled to the second optical waveguide 42 . For example, as shown in FIG. 2, the ring resonator 43 has a first portion 43a close to an intermediate portion 41c between the first end 41a and the second end 41b of the first optical waveguide 41, and an intermediate portion 41c between the first end 41a and the second end 41b. It is arranged so as to extend substantially parallel to the portion 41c. 2, the second portion 43b of the ring resonator 43 is close to the fourth end portion 42b of the second optical waveguide 42, and the propagation direction of the received light in the second portion 43b is The fourth end portion 42b is arranged substantially parallel to the direction in which the second optical waveguide 42 extends (the direction from the fourth end portion 42b to the third end portion 42a). According to the ring resonator 43, of the light emitted by the light emitting element 20 propagating through the first optical waveguide 41 and the external light, only the external light that satisfies the resonance condition of the ring resonator 43 is transferred to the second optical waveguide 42. can be moved to

受発光装置１は、多層膜フィルタ、ハーフミラー等と比較して簡易な構成のリング共振器４３を用いて、外部からの光から受信光を分波する構成となっている。それゆえ、受発光装置１によれば、受発光装置の小型化および低コスト化を実現できる。また、受発光装置１によれば、送信光と受信光とを同一波長とすることができるため、同一構成の受発光装置１を複数備えた、低コストの光通信システムを構築することが可能になる。 The light emitting/receiving device 1 uses a ring resonator 43 that has a simpler configuration than a multilayer filter, a half mirror, or the like, and separates received light from external light. Therefore, according to the light emitting/receiving device 1, it is possible to reduce the size and cost of the light emitting/receiving device. In addition, according to the light emitting/receiving device 1, the transmitted light and the received light can be made to have the same wavelength. Therefore, it is possible to construct a low-cost optical communication system equipped with a plurality of light emitting/receiving devices 1 having the same configuration. become.

例えば図１，２に示すように、受発光装置１では、光導波路体４０の第１面４０ａは、主面１０ａに沿って延びている。第２面４０ｂは、第１面４０ａと底面１１ｃとの間に位置するとともに、主面１０ａと交差する方向に延びている。第３面４０ｃは、第１面４０ａよりも底面１１ｃ側に位置し、底面１１ｃに向かい合う（臨む）とともに、主面１０ａに沿って延びている。第１光導波路４１および第２光導波路４２は、光路すなわち光の伝搬方向を湾曲（変換）させる湾曲部４１ｄ，４２ｃを有している。したがって、受発光装置１によれば、発光素子２０として、底面１１ｃに搭載され、発光面２０ａが主面１０ａと交差する方向に延びる、周知の端面発光型発光素子を用いることができる。また、受光素子３０として、底面１１ｃに搭載され、受光面３０ａが主面１０ａに沿って延びる、周知の面受光型受光素子を用いることができる。それゆえ、受発光装置１によれば、受発光装置の低コスト化を実現できる。 For example, as shown in FIGS. 1 and 2, in the light emitting/receiving device 1, the first surface 40a of the optical waveguide body 40 extends along the main surface 10a. The second surface 40b is positioned between the first surface 40a and the bottom surface 11c and extends in a direction intersecting with the main surface 10a. The third surface 40c is located closer to the bottom surface 11c than the first surface 40a, faces the bottom surface 11c, and extends along the main surface 10a. The first optical waveguide 41 and the second optical waveguide 42 have bending portions 41d and 42c that bend (convert) the optical path, that is, the propagation direction of light. Therefore, according to the light emitting/receiving device 1, as the light emitting element 20, it is possible to use a well-known edge emitting light emitting element mounted on the bottom surface 11c and having the light emitting surface 20a extending in the direction intersecting the main surface 10a. Further, as the light receiving element 30, a known surface light receiving type light receiving element mounted on the bottom surface 11c and having a light receiving surface 30a extending along the main surface 10a can be used. Therefore, according to the light emitting/receiving device 1, the cost of the light emitting/receiving device can be reduced.

受発光装置１は、例えば図１，２に示すように、凹部１１の開口１１ａに位置し、開口１１ａを封止（密封）する透光性の蓋体５０を有していてもよい。これにより、凹部１１を封止することができるので、受発光装置１の長期信頼性を向上させることができる。蓋体５０は、例えば板状の形状を有している。蓋体５０は、エポキシ系、シリコン系、熱可塑性樹脂等の樹脂系接合材によって基体１０に接合されていてもよい。 For example, as shown in FIGS. 1 and 2, the light emitting/receiving device 1 may have a translucent lid 50 located in the opening 11a of the recess 11 and sealing (sealing) the opening 11a. Thereby, since the concave portion 11 can be sealed, the long-term reliability of the light receiving and emitting device 1 can be improved. The lid body 50 has, for example, a plate-like shape. The lid body 50 may be bonded to the base 10 with a resin-based bonding material such as an epoxy-based, silicon-based, or thermoplastic resin.

受発光装置１が蓋体５０を有する場合、送信光は、蓋体５０を介して凹部１１内から外部に出射し、受信光は、蓋体５０を介して外部から凹部１１内に入射する。蓋体５０は、送信光の波長および受信光の波長に対して、７０％以上の透過率を有する材料で形成されていてもよく、８０％以上の透過率を有する材料で形成されていてもよく、９０％以上の透過率を有する材料で形成されていてもよい。 When the light emitting/receiving device 1 has the lid 50 , the transmitted light is emitted from the recess 11 to the outside through the lid 50 , and the received light enters the recess 11 from the outside through the lid 50 . The lid 50 may be formed of a material having a transmittance of 70% or more, or may be formed of a material having a transmittance of 80% or more with respect to the wavelength of the transmitted light and the wavelength of the received light. Alternatively, it may be made of a material having a transmittance of 90% or more.

図１，２では、光導波路体４０が、直方体であって、該直方体の連続する２つの面に開口し、受光素子３０を収容する切欠き部を有している例を示したが、光導波路体４０は、上記構成の第１面４０ａ、第２面４０ｂおよび第３面４０ｃを含む形状であればよく、その形状は、図１，２に示す形状に限定されない。光導波路体４０は、例えば、直方体であって、該直方体に形成された発光素子２０を収容する切欠き部、および受光素子３０を主要する切欠き部の両方を有していてもよい。 FIGS. 1 and 2 show an example in which the optical waveguide body 40 is a rectangular parallelepiped, and has a cutout portion that opens to two continuous surfaces of the rectangular parallelepiped and accommodates the light receiving element 30. The wave body 40 may have a shape including the first surface 40a, the second surface 40b and the third surface 40c having the above configuration, and the shape is not limited to the shape shown in FIGS. The optical waveguide body 40 may be, for example, a rectangular parallelepiped, and may have both a cutout portion for accommodating the light emitting element 20 formed in the rectangular parallelepiped shape and a cutout portion mainly for the light receiving element 30 .

図１，２では、発光素子２０および受光素子３０の両方が、凹部１１の底面１１ｃに搭載されている例を示したが、受発光装置１は、発光素子２０が、底面１１ｃに配設されたサブマウント上に搭載されている構成であってもよい。このような構成によれば、発光素子２０と第１光導波路４１の第２端部４１ｂとの位置合わせができるため、送信光の出射効率に優れた受発光装置とすることができる。また、受発光装置１は、受光素子３０が、底面１１ｃに配設されたサブマウント上に搭載されている構成であってもよい。このような構成によれば、受光素子３０と第２光導波路４２の第３端部４２ａとの距離を小さくできるため、受信光の検知効率に優れた受発光装置とすることができる。 1 and 2 show an example in which both the light-emitting element 20 and the light-receiving element 30 are mounted on the bottom surface 11c of the recess 11. It may be configured to be mounted on a submount. According to such a configuration, the light emitting element 20 and the second end portion 41b of the first optical waveguide 41 can be aligned, so that the light receiving and emitting device can have excellent output efficiency of the transmitted light. Further, the light receiving and emitting device 1 may have a configuration in which the light receiving element 30 is mounted on a submount provided on the bottom surface 11c. With such a configuration, the distance between the light receiving element 30 and the third end portion 42a of the second optical waveguide 42 can be reduced, so that the light receiving/emitting device can have excellent detection efficiency of received light.

図１，２では、第１光導波路４１の径が、第１光導波路４１が延びる方向において一定である例を示したが、第１光導波路４１は、第１端部４１ａが第１面４０ａに向かってテーパー状に広がっていてもよい。これにより、外部からの光を、第１光導波路４１に効率的に入射させることができる。また、第１光導波路４１は、第２端部４１ｂが第２面４０ｂに向かってテーパー状に広がっていてもよい。これにより、発光素子２０が発する光を、第１光導波路４１に効率的に入射させることができる。 1 and 2 show an example in which the diameter of the first optical waveguide 41 is constant in the direction in which the first optical waveguide 41 extends. It may taper towards the . This allows light from the outside to enter the first optical waveguide 41 efficiently. Further, the first optical waveguide 41 may have a second end portion 41b that widens in a tapered shape toward the second surface 40b. Thereby, the light emitted by the light emitting element 20 can be efficiently incident on the first optical waveguide 41 .

以下、本開示の受発光装置の他の実施形態について説明する。 Other embodiments of the light receiving and emitting device of the present disclosure will be described below.

図３は、本開示の他の実施形態に係る受発光装置を模式的に示す断面図である。図３は、図２に示した断面図に対応する。 FIG. 3 is a cross-sectional view schematically showing a light emitting/receiving device according to another embodiment of the present disclosure. FIG. 3 corresponds to the cross-sectional view shown in FIG.

本実施形態の受発光装置１Ａは、上記実施形態の受発光装置１に対して、発光素子２０、受光素子３０、および光導波路体４０の構成が異なっており、その他については、同様の構成であるので、同様の構成には受発光装置１と同じ参照符号を付して詳細な説明は省略する。 A light emitting/receiving device 1A of the present embodiment differs from the light emitting/receiving device 1 of the above-described embodiment in the configurations of a light emitting element 20, a light receiving element 30, and an optical waveguide body 40, and otherwise has the same configuration. Therefore, the same reference numerals as those of the light emitting/receiving device 1 are assigned to the same configurations, and detailed description thereof will be omitted.

受発光装置１Ａでは、例えば図３に示すように、発光素子２０は、凹部１１の底面１１ｃに搭載されており、発光面２０ａは、主面１０ａに沿って延びている。また、受光素子３０は、凹部１１の底面１１ｃに配設されたサブマウント１２上に搭載されており、受光素子３０の受光面３０ａは、主面１０ａと交差する方向に延びている。 In the light emitting/receiving device 1A, for example, as shown in FIG. 3, the light emitting element 20 is mounted on the bottom surface 11c of the recess 11, and the light emitting surface 20a extends along the main surface 10a. Further, the light receiving element 30 is mounted on the submount 12 arranged on the bottom surface 11c of the recess 11, and the light receiving surface 30a of the light receiving element 30 extends in a direction intersecting the main surface 10a.

例えば図３に示すように、光導波路体４０の第１面４０ａは、凹部１１の開口１１ａに臨むとともに、主面１０ａに沿って延びている。第２面４０ｂは、第１面４０ａよりも凹部１１の底面１１ｃ側に位置し、底面１１ｃに向かい合う（臨む）とともに、主面１０ａに沿って延びている。第３面４０ｃは、第１面４０ａと第２面との間に位置するとともに、前記主面と交差する方向に延びている。光導波路体４０は、例えばエポキシ系、アクリル系等の透光性接合材を用いて、第２面４０ｂが発光面２０ａに接合され、第３面４０ｃが受光面３０ａに接合されることで、凹部１１内に保持されていてもよい。光導波路体４０は、底面１１ｃに配設されたサブマウント上に固定されることで、凹部１１内に保持されていてもよい。 For example, as shown in FIG. 3, the first surface 40a of the optical waveguide body 40 faces the opening 11a of the recess 11 and extends along the main surface 10a. The second surface 40b is positioned closer to the bottom surface 11c of the recess 11 than the first surface 40a, faces the bottom surface 11c, and extends along the main surface 10a. The third surface 40c is located between the first surface 40a and the second surface and extends in a direction intersecting the main surface. In the optical waveguide body 40, the second surface 40b is bonded to the light emitting surface 20a and the third surface 40c is bonded to the light receiving surface 30a using a translucent bonding material such as epoxy or acrylic. It may be held within the recess 11 . The optical waveguide body 40 may be held in the recess 11 by being fixed on a submount provided on the bottom surface 11c.

第１光導波路４１は、主面１０ａと交差する方向に直線状に延びており、第２光導波路４２は、主面１０ａに沿う方向に直線状に延びている。受発光装置１Ａのリング共振器４３は、受発光装置１のリング共振器４３と同様に、第１光導波路４１および第２光導波路４２に光学的に結合されており、第１光導波路４１を伝搬する外部からの光のうち共振条件を満たす光だけを第２光導波路４２に移すように構成されている。 The first optical waveguide 41 extends linearly in a direction intersecting the principal surface 10a, and the second optical waveguide 42 linearly extends in a direction along the principal surface 10a. The ring resonator 43 of the light emitting/receiving device 1A is optically coupled to the first optical waveguide 41 and the second optical waveguide 42 in the same manner as the ring resonator 43 of the light emitting/receiving device 1. It is configured to transfer only the light that satisfies the resonance conditions among the propagating light from the outside to the second optical waveguide 42 .

受発光装置１Ａによれば、受発光装置１の場合と同様に、受発光装置の小型化および低コスト化を実現することができるとともに、低コストの光通信システムを構築することが可能になる。また、受発光装置１Ａでは、第１光導波路４１および第２光導波路４２が、湾曲部を有しておらず、直線状に延びているため、光ファイバの曲がり損失に起因する、光の伝搬ロスを低減することができる。それゆえ、受発光装置１Ａによれば、送信光の出射効率および受信光の検知効率に優れた受発光装置を提供することができる。 According to the light emitting/receiving device 1A, similarly to the light emitting/receiving device 1, it is possible to reduce the size and cost of the light emitting/receiving device, and to construct a low-cost optical communication system. . In addition, in the light emitting/receiving device 1A, the first optical waveguide 41 and the second optical waveguide 42 do not have a curved portion and extend linearly. Loss can be reduced. Therefore, according to the light emitting/receiving device 1A, it is possible to provide a light emitting/receiving device excellent in output efficiency of transmitted light and detection efficiency of received light.

図４は、本開示の他の実施形態に係る受発光装置を模式的に示す断面図である。図４は、図２，３に示した断面図に対応する。本実施形態の受発光装置１Ｂは、上記実施形態の受発光装置１Ａに対して、光導波路体４０の第１面４０ａの構成が異なっており、その他については、同様の構成であるので、同様の構成には受発光装置１Ａと同じ参照符号を付して詳細な説明は省略する。 FIG. 4 is a cross-sectional view schematically showing a light emitting/receiving device according to another embodiment of the present disclosure. FIG. 4 corresponds to the cross-sectional views shown in FIGS. The light emitting/receiving device 1B of this embodiment differs from the light emitting/receiving device 1A of the above-described embodiment in the configuration of the first surface 40a of the optical waveguide body 40, and the rest of the configuration is the same. The same reference numerals as those of the light emitting/receiving device 1A are attached to the configuration of , and detailed description thereof will be omitted.

受発光装置１Ｂでは、例えば図４に示すように、光導波路体４０の第１面４０ａが、蓋体５０における底面１１ｃ側の内面５０ａの一部に当接している。光導波路体４０および蓋体５０は、同一の材料を用いて、一体的に形成されていてもよい。また、蓋体５０の内部に、第１光導波路４１に接続され、発光素子２０が発する光および外部からの光が通る光導波路が設けられていてもよい。 In the light emitting/receiving device 1B, for example, as shown in FIG. 4, the first surface 40a of the optical waveguide member 40 is in contact with part of the inner surface 50a of the lid member 50 on the bottom surface 11c side. The optical waveguide body 40 and the lid body 50 may be integrally formed using the same material. Further, an optical waveguide connected to the first optical waveguide 41 and through which the light emitted by the light emitting element 20 and the light from the outside pass may be provided inside the lid 50 .

受発光装置１Ｂによれば、受発光装置１，１Ａの場合と同様に、受発光装置の小型化および低コスト化を実現できるとともに、低コストの光通信システムを構築することが可能になる。さらに、受発光装置１Ｂは、受発光装置１Ａと同様に、第１光導波路４１および第２光導波路４２が、湾曲部を有しておらず、直線状に延びているため、光ファイバの曲がり損失に起因する、光の伝搬ロスを低減することができる。それゆえ、受発光装置１Ａによれば、送信光の出射効率および受信光の検知効率に優れた受発光装置を提供することができる。 According to the light emitting/receiving device 1B, similarly to the light emitting/receiving devices 1 and 1A, it is possible to reduce the size and cost of the light emitting/receiving device, and to construct a low-cost optical communication system. Furthermore, in the light emitting/receiving device 1B, similarly to the light emitting/receiving device 1A, the first optical waveguide 41 and the second optical waveguide 42 do not have curved portions and extend linearly. Light propagation loss caused by loss can be reduced. Therefore, according to the light emitting/receiving device 1A, it is possible to provide a light emitting/receiving device excellent in output efficiency of transmitted light and detection efficiency of received light.

また、受発光装置１Ｂでは、光導波路体４０と蓋体５０との間の空間結合部（空隙）が存在しないため、光が光導波路体４０と蓋体５０との間を伝搬する際の、空間結合部における光の伝搬ロスを低減できるため、送信光の出射効率および受信光の検知効率を向上させることができる。さらに、受発光装置１Ｂでは、光導波路体４０と蓋体５０との間の空間結合部を排除することにより、受発光装置を低背化することができる。 Further, in the light receiving and emitting device 1B, since there is no spatial coupling portion (gap) between the optical waveguide body 40 and the lid body 50, when light propagates between the optical waveguide body 40 and the lid body 50, Since the propagation loss of light in the spatial coupling portion can be reduced, the output efficiency of transmitted light and the detection efficiency of received light can be improved. Furthermore, in the light emitting/receiving device 1B, the height of the light emitting/receiving device can be reduced by eliminating the spatial coupling portion between the optical waveguide body 40 and the lid body 50 .

図５は、本開示の他の実施形態に係る受発光装置を模式的に示す断面図である。図５は、図２～４に示した断面図に対応する。本実施形態の受発光装置１Ｃは、上記実施形態の受発光装置１，１Ａ，１Ｂに対して、基体１０、発光素子２０、受光素子３０および光導波路体４０の構成が異なっており、その他については、同様の構成であるので、同様の構成には受発光装置１と同じ参照符号を付して詳細な説明は省略する。 FIG. 5 is a cross-sectional view schematically showing a light emitting/receiving device according to another embodiment of the present disclosure. FIG. 5 corresponds to the cross-sectional views shown in FIGS. A light emitting/receiving device 1C of the present embodiment differs from the light emitting/receiving devices 1, 1A, and 1B of the above embodiments in the configurations of the substrate 10, the light emitting element 20, the light receiving element 30, and the optical waveguide body 40. has the same configuration, the same reference numerals as those of the light receiving and emitting device 1 are assigned to the same configurations, and detailed description thereof will be omitted.

受発光装置１Ｃでは、例えば図５に示すように、発光素子２０は、凹部１１の底面１１ｃに配設されたサブマウント１２上に搭載されており、発光面２０ａは、主面１０ａと交差する方向に延びている。受光素子３０は、凹部１１の底面１１ｃに搭載されており、受光面３０ａは、主面１０ａに沿って延びている。 In the light emitting/receiving device 1C, for example, as shown in FIG. 5, the light emitting element 20 is mounted on the submount 12 arranged on the bottom surface 11c of the recess 11, and the light emitting surface 20a intersects the main surface 10a. extending in the direction The light receiving element 30 is mounted on the bottom surface 11c of the recess 11, and the light receiving surface 30a extends along the main surface 10a.

例えば図５に示すように、光導波路体４０の第１面４０ａおよび第２面４０ｂは、凹部１１の側壁１１ｂに臨むとともに、主面１０ａと交差する方向に延びている。第３面４０ｃは、底面１１ｃに向かい合う（臨む）とともに、主面１０ａに沿って延びている。光導波路体４０は、例えばエポキシ系、アクリル系等の透光性接接合材を用いて、第２面４０ｂが発光面２０ａに接合され、第３面４０ｃが受光面３０ａに接合されることで、凹部１１内に保持されていてもよい。光導波路体４０は、底面１１ｃに配設されたサブマウント上に固定されることで、凹部１１内に保持されていてもよい。 For example, as shown in FIG. 5, the first surface 40a and the second surface 40b of the optical waveguide body 40 face the side wall 11b of the recess 11 and extend in a direction intersecting the main surface 10a. The third surface 40c faces (facing) the bottom surface 11c and extends along the main surface 10a. The second surface 40b of the optical waveguide body 40 is bonded to the light emitting surface 20a, and the third surface 40c is bonded to the light receiving surface 30a using a translucent bonding material such as epoxy or acrylic. , may be held in the recess 11 . The optical waveguide body 40 may be held in the recess 11 by being fixed on a submount provided on the bottom surface 11c.

受発光装置１Ｃでは、例えば図５に示すように、第１光導波路４１は、主面１０ａに沿う方向に直線状に延び、第２光導波路４２は、主面１０ａと交差する方向に直線状に延びている。また、受発光装置１Ｃのリング共振器４３は、受発光装置１，１Ａ，１Ｂのリング共振器４３と同様に、第１光導波路４１および第２光導波路４２に光学的に結合されており、第１光導波路４１を伝搬する外部からの光のうち共振条件を満たす光だけを第２光導波路４２に移すように構成されている。 In the light emitting/receiving device 1C, for example, as shown in FIG. 5, the first optical waveguide 41 extends linearly in the direction along the main surface 10a, and the second optical waveguide 42 extends linearly in the direction intersecting the main surface 10a. extends to The ring resonator 43 of the light emitting/receiving device 1C is optically coupled to the first optical waveguide 41 and the second optical waveguide 42 in the same manner as the ring resonators 43 of the light emitting/receiving devices 1, 1A, and 1B. It is configured such that only the light that satisfies the resonance conditions among the external light propagating through the first optical waveguide 41 is transferred to the second optical waveguide 42 .

受発光装置１Ｃでは、例えば図５に示すように、凹部１１の側壁１１ｂに貫通孔１３が設けられており、送信光は、貫通孔１３を介して、凹部１１内から外部に出射する。また、受信光は、貫通孔１３を介して、外部から凹部１１内に入射する。 In the light receiving and emitting device 1C, for example, as shown in FIG. Also, the received light enters the concave portion 11 from the outside through the through hole 13 .

受発光装置１Ｃは、貫通孔１３を塞ぐ、透光性の窓部材１４を有していてもよい。窓部材１４は、エポキシ系、シリコン系、熱可塑性樹脂等の樹脂系接合材によって貫通孔１３の内周面に接合されていてもよい。受発光装置１Ｃが窓部材１４を有する場合、送信光は、窓部材１４を介して凹部１１内から外部に出射し、受信光は、窓部材１４を介して外部から凹部１１内に入射する。窓部材１４は、送信光の波長および受信光の波長に対して、７０％以上の透過率を有する材料で形成されていてもよく、８０％以上の透過率を有する材料で形成されていてもよく、９０％以上の透過率を有する材料で形成されていてもよい。 The light emitting/receiving device 1</b>C may have a translucent window member 14 that closes the through hole 13 . The window member 14 may be bonded to the inner peripheral surface of the through hole 13 with a resin-based bonding material such as epoxy, silicon, or thermoplastic resin. When the light emitting/receiving device 1</b>C has the window member 14 , transmitted light is emitted from the concave portion 11 to the outside through the window member 14 , and received light enters the concave portion 11 from the outside through the window member 14 . The window member 14 may be formed of a material having a transmittance of 70% or more, or may be formed of a material having a transmittance of 80% or more with respect to the wavelength of the transmitted light and the wavelength of the received light. Alternatively, it may be made of a material having a transmittance of 90% or more.

受発光装置１Ｃは、例えば図５に示すように、凹部１１の開口１１ａに位置し、開口１１ａを封止（密封）する蓋体５０を有していてもよい。蓋体５０は、例えば板状の形状を有している。蓋体５０は、エポキシ系、シリコン系、熱可塑性樹脂等の樹脂系接合材によって主面１０ａに接合されていてもよい。受発光装置１Ｃの蓋体５０は、透光性の部材であってもよく、遮光性の部材であってもよい。蓋体５０が遮光性の部材である場合には、不要な光が蓋体５０を介して外部から凹部１１内に入射することを抑制できるため、受信光の検知効率に優れた受発光装置を提供することができる。受発光装置１Ｃが、貫通孔１３を塞ぐ窓部材１４と開口１１ａを封止する蓋部５０とを有している場合には、受発光装置の長期信頼性を向上させることができる。 For example, as shown in FIG. 5, the light emitting/receiving device 1C may have a lid 50 that is located in the opening 11a of the recess 11 and seals (seales) the opening 11a. The lid body 50 has, for example, a plate-like shape. The lid body 50 may be bonded to the main surface 10a with a resin-based bonding material such as an epoxy-based, silicon-based, or thermoplastic resin. The lid 50 of the light emitting/receiving device 1C may be a translucent member or a light shielding member. When the lid 50 is a light-shielding member, unnecessary light can be suppressed from entering the concave portion 11 from the outside through the lid 50. Therefore, a light receiving and emitting device having excellent detection efficiency of received light can be provided. can provide. When the light emitting/receiving device 1C has the window member 14 that closes the through hole 13 and the lid portion 50 that seals the opening 11a, the long-term reliability of the light emitting/receiving device can be improved.

受発光装置１Ｃによれば、受発光装置１，１Ａ，１Ｂと同様に、受発光装置の小型化および低コスト化を実現することができるとともに、低コストの光通信システムを構築することが可能になる。また、受発光装置１Ｃでは、第１光導波路４１および第２光導波路４２が、湾曲部を有しておらず、直線状に延びているため、光ファイバの曲がり損失に起因する、光の伝搬ロスを低減することができる。それゆえ、受発光装置１Ｃによれば、送信光の出射効率および受信光の検知効率に優れた受発光装置を提供することができる。 According to the light emitting/receiving device 1C, similarly to the light emitting/receiving devices 1, 1A, and 1B, it is possible to reduce the size and cost of the light emitting/receiving device, and to construct a low-cost optical communication system. become. In addition, in the light emitting/receiving device 1C, the first optical waveguide 41 and the second optical waveguide 42 do not have a curved portion and extend linearly. Loss can be reduced. Therefore, according to the light emitting/receiving device 1C, it is possible to provide a light emitting/receiving device excellent in output efficiency of transmitted light and detection efficiency of received light.

また、受発光装置１Ｃは、送信光および受信光が主面１０ａと平行に伝搬する構成であり、これにより、受発光装置の設計自由度を向上させることができる。 In addition, the light emitting/receiving device 1C has a configuration in which transmitted light and received light propagate parallel to the main surface 10a, thereby improving the degree of freedom in designing the light emitting/receiving device.

図６は、本開示の他の実施形態に係る受発光装置を模式的に示す断面図である。図６は、図２～５に示した断面図に対応する。本実施形態の受発光装置１Ｄは、上記実施形態の受発光装置１Ｂに対して、リング共振器４３の構成が異なっており、その他については、同様の構成であるので、同様の構成には受発光装置１と同じ参照符号を付して詳細な説明は省略する。 FIG. 6 is a cross-sectional view schematically showing a light emitting/receiving device according to another embodiment of the present disclosure. FIG. 6 corresponds to the cross-sectional views shown in FIGS. The light emitting/receiving device 1D of the present embodiment differs from the light emitting/receiving device 1B of the above-described embodiment in the configuration of the ring resonator 43, and otherwise has the same configuration. The same reference numerals as those of the light emitting device 1 are attached, and detailed description thereof is omitted.

受発光装置１Ｄは、複数のリング共振器４３を含んでいる。複数のリング共振器４３は、複数のリング共振器４３の半径および複数のリング共振器４３の屈折率の少なくとも一方が互いに異なっており、これにより、複数のリング共振器４３は、共振周波数が互いに異なっている。 The light emitting/receiving device 1</b>D includes a plurality of ring resonators 43 . The plurality of ring resonators 43 are different from each other in at least one of the radius of the plurality of ring resonators 43 and the refractive index of the plurality of ring resonators 43, whereby the plurality of ring resonators 43 have resonance frequencies different from each other. different.

受発光装置１Ｄによれば、受発光装置１，１Ａ，１Ｂ，１Ｃと同様に、受発光装置の小型化および低コスト化を実現することができるとともに、低コストの光通信システムを構築することが可能になる。また、受発光装置１Ｄでは、第１光導波路４１および第２光導波路４２が、湾曲部を有しておらず、直線状に延びているため、光ファイバの曲がり損失に起因する、光の伝搬ロスを低減することができる。それゆえ、受発光装置１Ｄによれば、送信光の出射効率および受信光の検知効率に優れた受発光装置を提供することができる。 According to the light emitting/receiving device 1D, similarly to the light emitting/receiving devices 1, 1A, 1B, and 1C, it is possible to reduce the size and cost of the light emitting/receiving device, and to construct a low-cost optical communication system. becomes possible. Further, in the light emitting/receiving device 1D, the first optical waveguide 41 and the second optical waveguide 42 do not have a curved portion and extend linearly. Loss can be reduced. Therefore, according to the light emitting/receiving device 1D, it is possible to provide a light emitting/receiving device having excellent emission efficiency of transmitted light and detection efficiency of received light.

また、受発光装置１Ｄによれば、受信光として、複数の波長の光を用いることができるため、より低コストの光通信システムを構築することが可能になる。 Further, according to the light emitting/receiving device 1D, light of a plurality of wavelengths can be used as received light, so that it is possible to construct an optical communication system at a lower cost.

次に、受発光装置の製造方法について説明する。基体１０が、セラミック配線基板であり、セラミック材料がアルミナである場合、アルミナ（Ａｌ２Ｏ３）やシリカ（ＳｉＯ２）、カルシア（ＣａＯ）、マグネシア（ＭｇＯ）等の原料粉末に適当な有機溶剤、溶媒を添加混合して泥漿状とし、これを周知のドクターブレード法やカレンダーロール法等によってシート状に成形してセラミックグリーンシート（以下、グリーンシートともいう）を得る。その後、グリーンシートを所定形状に打ち抜き加工するとともに、タングステン（Ｗ）およびガラス材料等の原料粉末に有機溶剤、溶媒を添加混合して金属ペーストとし、これをグリーンシート表面にスクリーン印刷法等の印刷法でパターン印刷する。また、内部配線導体は、グリーンシートに貫通孔を設け、スクリーン印刷法等によって金属ペーストを貫通孔に充填させる。接続パッドおよび外部接続端子は、金属ペーストによってグリーンシートの表面に形成される。このようにして得られたグリーンシートを複数枚積層し、これを１６００℃の温度で同時焼成することによって基体１０が作製される。 Next, a method for manufacturing the light emitting/receiving device will be described. When the substrate 10 is a ceramic wiring board and the ceramic material is alumina, an organic solvent suitable for raw material powders such as alumina (Al 2 O 3 ), silica (SiO 2 ), calcia (CaO), magnesia (MgO), etc. A solvent is added and mixed to form a slurry, which is formed into a sheet by a well-known doctor blade method, calender roll method, or the like to obtain a ceramic green sheet (hereinafter also referred to as a green sheet). After that, the green sheet is punched into a predetermined shape, and an organic solvent and a solvent are added and mixed to raw material powders such as tungsten (W) and glass material to make a metal paste, which is printed on the surface of the green sheet by screen printing or the like. The pattern is printed according to the method. The internal wiring conductor is formed by forming a through-hole in the green sheet and filling the through-hole with a metal paste by a screen printing method or the like. Connection pads and external connection terminals are formed on the surface of the green sheet with metal paste. A substrate 10 is produced by laminating a plurality of green sheets thus obtained and co-firing them at a temperature of 1600.degree.

一方、ガラス材料を、切削、切断等により所定の形状に切り出して、光導波路体４０を準備する。第１光導波路４１、第２光導波路４２およびリング共振器４３は、レーザ光で屈折率を変化させる等の微細加工により、クラッド部材４４の内部に屈折率が異なる材料を導線の形に作ることで作製してもよい。第１光導波路４１、第２光導波路４２およびリング共振器４３は、屈折率の異なる透明体を接合し、目的の方位に切り出したりする方法等により作製してもよい。 On the other hand, an optical waveguide body 40 is prepared by cutting a glass material into a predetermined shape by cutting, cutting, or the like. The first optical waveguide 41, the second optical waveguide 42, and the ring resonator 43 are formed by forming materials having different refractive indexes in the inside of the cladding member 44 in the form of conducting wires by microfabrication such as changing the refractive index with laser light. can be made with The first optical waveguide 41, the second optical waveguide 42, and the ring resonator 43 may be manufactured by a method such as joining transparent bodies having different refractive indices and cutting them in a desired orientation.

なお、上記では、内部配線導体は、基体１０の厚み方向に一直線状に形成される構成としているが、内部配線導体は、一直線状である必要はなく、基体１０内で、内層配線導体等によってずれて形成されていてもよい。 In the above description, the internal wiring conductors are formed in a straight line in the thickness direction of the substrate 10. However, the internal wiring conductors do not need to be formed in a straight line. They may be formed in a staggered manner.

以上、本開示の実施形態について詳細に説明したが、また、本開示は上述の実施の形態に限定されるものではなく、本開示の要旨を逸脱しない範囲内において、種々の変更、改良等が可能である。上記各実施形態をそれぞれ構成する全部または一部を、適宜、矛盾しない範囲で組み合わせ可能であることは、言うまでもない。 Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various modifications, improvements, etc. can be made without departing from the gist of the present disclosure. It is possible. It goes without saying that all or part of each of the above-described embodiments can be appropriately combined within a non-contradictory range.

１，１Ａ，１Ｂ，１Ｃ，１Ｄ 受発光装置
１０ 基体
１０ａ 主面
１１ 凹部
１１ａ 開口
１１ｂ 側壁
１１ｃ 底面
１２ サブマウント
１３ 貫通孔
１４ 窓部材
２０ 発光素子
２０ａ 発光面
３０ 受光素子
３０ａ 受光面
４０ 光導波路体
４０ａ 第１面
４０ｂ 第２面
４０ｃ 第３面
４１ 第１光導波路
４１ａ 一端部（第１端部）
４１ｂ 他端部（第２端部）
４１ｃ 中間部分
４１ｄ 湾曲部
４２ 第２光導波路
４２ａ 一端部（第３端部）
４２ｂ 他端部（第４端部）
４２ｃ 湾曲部
４３ リング共振器
４３ａ 第１部分
４３ｂ 第２部分
４４ クラッド部材
５０ 蓋体
５０ａ 内面 Reference Signs List 1, 1A, 1B, 1C, 1D light emitting/receiving device 10 substrate 10a main surface 11 recessed portion 11a opening 11b side wall 11c bottom surface 12 submount 13 through hole 14 window member 20 light emitting element 20a light emitting surface 30 light receiving element 30a light receiving surface 40 optical waveguide body 40a First surface 40b Second surface 40c Third surface 41 First optical waveguide 41a One end (first end)
41b other end (second end)
41c Intermediate portion 41d Curved portion 42 Second optical waveguide 42a One end (third end)
42b other end (fourth end)
42c curved portion 43 ring resonator 43a first portion 43b second portion 44 clad member 50 lid 50a inner surface

Claims (9)

主面に凹部が設けられている基体と、
前記凹部に収容された発光素子と、
前記凹部に収容された受光素子と、
前記凹部に収容された光導波路体であって、前記凹部の開口または側壁に臨む第１面、前記発光素子の発光面に向かい合う第２面、および前記受光素子の受光面に向かい合う第３面を含み、内部に前記発光素子が発する光および外部からの光が通る第１光導波路、前記外部からの光のうちの一部を通過させるリング共振器、ならびに前記リング共振器を通過した、前記受光素子によって受光される前記外部からの光のうちの一部が通る第２光導波路が設けられ、前記第１光導波路は、一端部が前記第１面に位置し、他端部が前記第２面に位置しており、前記第２光導波路は、一端部が前記第３面に位置し、他端部が、前記リング共振器を介して、前記第１光導波路に光学的に結合されており、前記リング共振器は、前記第１光導波路に光学的に結合する第１部分と、前記第２光導波路に光学的に結合する第２部分とを有し、前記第２部分は、前記第２部分における光の伝搬方向と前記第２光導波路が延びる方向とが平行となるように配設されており、前記リング共振器は、前記発光素子から発せられ前記第１導波路を通る光および前記外部からの光のうちの、前記リング共振器の共振条件を満たす前記外部からの光だけを、前記第２光導波路に移すように構成されている光導波路体と、
を備える受発光装置。 a base having a concave portion on its main surface;
a light emitting element accommodated in the recess;
a light receiving element accommodated in the recess;
The optical waveguide body accommodated in the recess has a first surface facing the opening or side wall of the recess, a second surface facing the light emitting surface of the light emitting element, and a third surface facing the light receiving surface of the light receiving element. a first optical waveguide through which light emitted by the light emitting element and light from the outside pass; a ring resonator that allows a portion of the light from the outside to pass through ; and a ring resonator that passes through the ring resonator. A second optical waveguide is provided through which part of the external light received by the light receiving element passes, and the first optical waveguide has one end located on the first surface and the other end. is located on the second surface, and the second optical waveguide has one end located on the third surface and the other end connected to the first optical waveguide through the ring resonator. optically coupled , the ring resonator having a first portion optically coupled to the first optical waveguide and a second portion optically coupled to the second optical waveguide; The second portion is arranged such that the propagation direction of light in the second portion is parallel to the direction in which the second optical waveguide extends, and the ring resonator emits light from the light emitting element. an optical waveguide body configured to transfer only the external light that satisfies a resonance condition of the ring resonator, out of the light passing through one waveguide and the external light, to the second optical waveguide; ,
A light emitting/receiving device comprising: 前記光導波路体は、前記第１光導波路、前記第２光導波路、および前記リング共振器を囲むクラッド部材を有しており、
前記第１光導波路、前記第２光導波路、および前記リング共振器の屈折率が、前記クラッド部材の屈折率よりも大きい、請求項１に記載の受発光装置。 The optical waveguide body has a clad member surrounding the first optical waveguide, the second optical waveguide, and the ring resonator,
2. The light emitting/receiving device according to claim 1, wherein the first optical waveguide, the second optical waveguide, and the ring resonator have a higher refractive index than the clad member. 前記光導波路体の前記第１面は、前記凹部の前記開口に臨むとともに、前記主面に沿っており、
前記光導波路体の前記第２面は、前記第１面と前記凹部の底面との間に位置するとともに、前記主面と交差する方向に沿っており、
前記光導波路体の前記第３面は、前記第１面よりも前記底面側に位置し、前記底面に向かい合うとともに、前記主面に沿っており、
前記第１光導波路および前記第２光導波路は、各々、光路を湾曲させる湾曲部を有している、請求項１または２に記載の受発光装置。 the first surface of the optical waveguide body faces the opening of the recess and extends along the main surface,
the second surface of the optical waveguide body is positioned between the first surface and the bottom surface of the recess and extends along a direction intersecting the main surface;
the third surface of the optical waveguide body is located closer to the bottom surface than the first surface, faces the bottom surface, and extends along the main surface;
3. The light emitting/receiving device according to claim 1, wherein each of said first optical waveguide and said second optical waveguide has a curved portion for curving an optical path. 前記開口を封止する透光性の蓋体をさらに備えることを特徴とする請求項１～３のいずれかに記載の受発光装置。 4. The light emitting/receiving device according to claim 1, further comprising a translucent lid that seals the opening. 前記光導波路体の前記第１面は、前記凹部の前記開口に臨むとともに、前記主面に沿っており、
前記光導波路体の前記第２面は、前記第１面よりも前記凹部の底面側に位置し、前記底面に向かい合うとともに、前記主面に沿っており、
前記光導波路体の前記第３面は、前記第１面と前記第３面との間に位置するとともに、前記主面と交差する方向に沿っており、
前記第１光導波路は、前記主面と交差する方向に直線状に延びており、
前記第２光導波路は、前記主面に沿って直線状に延びている、請求項１または２に記載の受発光装置。 the first surface of the optical waveguide body faces the opening of the recess and extends along the main surface,
the second surface of the optical waveguide body is positioned closer to the bottom surface of the recess than the first surface, faces the bottom surface, and extends along the main surface;
the third surface of the optical waveguide body is positioned between the first surface and the third surface and extends along a direction intersecting the main surface;
The first optical waveguide extends linearly in a direction intersecting the main surface,
3. The light emitting/receiving device according to claim 1, wherein said second optical waveguide extends linearly along said main surface. 前記開口を封止する透光性の蓋体をさらに備える、請求項５に記載の受発光装置。 6. The light receiving and emitting device according to claim 5, further comprising a translucent lid that seals said opening. 前記光導波路体の前記第１面は、前記蓋体における前記底面側の面の一部に当接している、請求項６に記載の受発光装置。 7. The light emitting/receiving device according to claim 6, wherein said first surface of said optical waveguide body is in contact with a part of said bottom surface side surface of said cover body. 前記光導波路体の前記第１面および前記第２面は、前記凹部の前記側壁に臨むとともに、前記主面と交差する方向に沿っており、
前記光導波路体の前記第３面は、前記凹部の底面に向かい合うとともに、前記主面に沿っており、
前記第１光導波路は、前記主面に沿って直線状に延びており、
前記第２光導波路は、前記主面と交差する方向に直線状に延びており、
前記側壁に前記発光素子が発する光および外部からの光が通過する貫通孔が設けられている、請求項１または２に記載の受発光装置。 the first surface and the second surface of the optical waveguide body face the sidewall of the recess and extend in a direction intersecting the main surface;
the third surface of the optical waveguide body faces the bottom surface of the recess and extends along the main surface;
The first optical waveguide extends linearly along the main surface,
The second optical waveguide extends linearly in a direction intersecting the main surface,
3. The light emitting/receiving device according to claim 1, wherein the side wall is provided with a through hole through which light emitted from the light emitting element and light from the outside pass. 前記開口を封止する蓋体と、
前記貫通孔を塞ぐ、透光性の窓部材と、をさらに備える、請求項８に記載の受発光装置。 a lid that seals the opening;
The light emitting/receiving device according to claim 8, further comprising a translucent window member that closes the through hole.
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