JP7181489B2 - Light emitting device and manufacturing method thereof - Google Patents

Light emitting device and manufacturing method thereof Download PDF

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JP7181489B2
JP7181489B2 JP2021178872A JP2021178872A JP7181489B2 JP 7181489 B2 JP7181489 B2 JP 7181489B2 JP 2021178872 A JP2021178872 A JP 2021178872A JP 2021178872 A JP2021178872 A JP 2021178872A JP 7181489 B2 JP7181489 B2 JP 7181489B2
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frame
light emitting
light
emitting device
lead
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JP2022023959A (en
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宏明 宇川
竜一 仲神
隆二 村中
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Nichia Corp
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Nichia Corp
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Description

本開示は、発光装置及びその製造方法に関するものである。 TECHNICAL FIELD The present disclosure relates to a light emitting device and manufacturing method thereof.

発光ダイオードまたはレーザーダイオードのような発光素子を用いた発光装置は、室内照明等の一般照明、車載用光源、液晶ディスプレイのバックライト等を含む多くの分野で用いられている。これらの発光装置で求められる性能は日増しに高まっており、さらなる信頼性の向上が要求されている。 2. Description of the Related Art Light-emitting devices using light-emitting elements such as light-emitting diodes or laser diodes are used in many fields including general lighting such as room lighting, vehicle-mounted light sources, backlights for liquid crystal displays, and the like. Performance required for these light-emitting devices is increasing day by day, and further improvement in reliability is required.

発光装置としては、リードの上面に載置された発光素子と、発光素子の周囲を取り囲む樹脂枠と、樹脂枠内に充填され、発光素子を封止する第一封止樹脂と、樹脂枠及び第一封止樹脂を覆う第二封止樹脂と、を備える発光装置が知られている（例えば、特許文献１参照）。 The light emitting device includes a light emitting element placed on the upper surface of the lead, a resin frame surrounding the light emitting element, a first sealing resin filled in the resin frame and sealing the light emitting element, a resin frame and A light-emitting device including a second sealing resin that covers the first sealing resin is known (see Patent Document 1, for example).

特開２０１４－２０９６０２号公報JP 2014-209602 A

しかしながら、発光装置においては、用途が広がるにつれて、光取出し性及び配光性をさらに向上させることが求められている。
そこで、本開示に係る実施形態は、光取出し性及び配光性に優れた発光装置及びその製造方法を提供することを課題とする。 However, in the light-emitting device, further improvement in light-extraction property and light-distribution property is demanded as the use spreads.
Accordingly, an object of the embodiments of the present disclosure is to provide a light-emitting device with excellent light-extraction properties and light distribution properties, and a method for manufacturing the same.

上記課題を解決するために、本開示の実施形態に係る発光装置は、第１リードと、第２リードと、前記第１リードと前記第２リードを固定する固定部材と、を有する基体と、前記基体の上面に載置された発光素子と、前記発光素子を囲むように、前記基体の上面に設けられた枠体と、上面視において前記枠体の外周側に露出した前記固定部材の少なくとも一部の上面を覆い、かつ、前記枠体の外側面に接する反射材を含有する第１部材と、前記発光素子、前記枠体及び前記第１部材を覆う第２部材と、を備え、前記第１部材は、断面視において傾斜領域を有し、前記傾斜領域の高さが前記枠体の上端よりも低く形成されている。 In order to solve the above problems, a light emitting device according to an embodiment of the present disclosure includes a base having a first lead, a second lead, and a fixing member fixing the first lead and the second lead; At least a light emitting element placed on the upper surface of the base, a frame provided on the upper surface of the base so as to surround the light emitting element, and the fixing member exposed to the outer peripheral side of the frame when viewed from above. A first member that covers a part of the upper surface and contains a reflective material that is in contact with the outer surface of the frame, and a second member that covers the light emitting element, the frame and the first member, The first member has an inclined region in a cross-sectional view, and the height of the inclined region is formed lower than the upper end of the frame.

本開示の実施形態に係る発光装置の製造方法は、第１リードと第２リードとが固定部材により固定された基体の上面に発光素子を載置する工程と、前記基体の上面に前記発光素子を囲み、前記固定部材の少なくとも一部の上面を覆うように反射材を含有する第１部材を設ける工程と、前記第１部材の内側面及び前記基体の上面に接して、断面視において前記基体からの高さが前記第１部材よりも高く、かつ、前記発光素子を囲むように前記基体の上面に枠体を設ける工程と、前記発光素子、前記枠体及び前記第１部材を覆う第２部材を設ける工程と、を含む。 A method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes steps of placing a light-emitting element on the upper surface of a base to which a first lead and a second lead are fixed by a fixing member; and providing a first member containing a reflective material so as to cover an upper surface of at least a portion of the fixing member; a step of providing a frame on the upper surface of the base body so that the height from the base is higher than that of the first member and surrounds the light emitting element; and a second step of covering the light emitting element, the frame and the first member. and C. providing a member.

本開示の実施形態に係る発光装置の製造方法は、第１リードと第２リードとが固定部材により固定された基体の上面に発光素子を載置する工程と、前記発光素子を囲むように前記基体の上面に枠体を設ける工程と、前記枠体の外側面及び前記基体の上面に接して、前記枠体の外周側に露出した前記固定部材の少なくとも一部の上面を覆い、かつ、断面視において前記基体からの高さが前記枠体よりも低くなるように反射材を含有する第１部材を設ける工程と、前記発光素子、前記枠体及び前記第１部材を覆う第２部材を設ける工程と、を含む。 A method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes steps of placing a light-emitting element on the upper surface of a base to which a first lead and a second lead are fixed by a fixing member; a step of providing a frame on the upper surface of a base body, covering the upper surface of at least a part of the fixing member exposed to the outer peripheral side of the frame body in contact with the outer surface of the frame body and the upper surface of the base body, and forming a cross-sectional providing a first member containing a reflective material so that the height from the base is lower than the frame when viewed; and providing a second member covering the light emitting element, the frame and the first member. and

本開示の実施形態に係る発光装置及びその製造方法によれば、光取出し性及び配光性に優れる。 The light-emitting device and the manufacturing method thereof according to the embodiments of the present disclosure are excellent in light extraction and light distribution.

第１実施形態に係る発光装置の構成を模式的に示す平面図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows typically the structure of the light-emitting device which concerns on 1st Embodiment. 図１ＡのＩＢ－ＩＢ線における断面図である。FIG. 1B is a cross-sectional view taken along line IB-IB of FIG. 1A; 図１Ｂを部分的に拡大した断面図である。FIG. 1C is a partially enlarged cross-sectional view of FIG. 1B; 図１Ｃの第１部材の他の形態を示す断面図である。1D is a cross-sectional view showing another form of the first member of FIG. 1C; FIG. 図１Ｃの第１部材の他の形態を示す断面図である。1D is a cross-sectional view showing another form of the first member of FIG. 1C; FIG. 図１Ｃの第１部材の他の形態を示す断面図である。1D is a cross-sectional view showing another form of the first member of FIG. 1C; FIG. 図１Ｃの第１部材の他の形態を示す断面図である。1D is a cross-sectional view showing another form of the first member of FIG. 1C; FIG. 第１実施形態に係る発光装置において、枠体、第１部材及び第２部材を省略して描いた平面図である。FIG. 2 is a plan view of the light emitting device according to the first embodiment, omitting the frame, the first member, and the second member. 第１実施形態に係る発光装置において、枠体及び第２部材を省略して描いた平面図である。FIG. 2 is a plan view of the light-emitting device according to the first embodiment, with the frame and the second member omitted; 第１実施形態に係る発光装置において、第２部材を省略して描いた平面図である。FIG. 2 is a plan view of the light emitting device according to the first embodiment, with the second member omitted; 第１部材の作用効果を説明する断面図である。It is sectional drawing explaining the effect of a 1st member. 第１部材の作用効果を説明する断面図である。It is sectional drawing explaining the effect of a 1st member. 第１実施形態に係る発光装置の第１の製造方法の流れを示すフローチャートである。4 is a flow chart showing the flow of the first method for manufacturing the light emitting device according to the first embodiment; 図２のＶＩＩＡ－ＶＩＩＡ線における断面図であって、第１実施形態に係る発光装置の第１の製造方法の製造工程において発光素子を載置した基体を模式的に示す断面図である。FIG. 3 is a cross-sectional view taken along line VIIA-VIIA of FIG. 2, and is a cross-sectional view schematically showing a substrate on which a light-emitting element is placed in a manufacturing process of the first manufacturing method of the light-emitting device according to the first embodiment; 図３のＶＩＩＢ－ＶＩＩＢ線における断面図であって、第１実施形態に係る発光装置の第１の製造方法の製造工程において第１部材を設けた基体を模式的に示す断面図である。FIG. 4 is a cross-sectional view taken along the line VIIB-VIIB of FIG. 3, and is a cross-sectional view schematically showing the substrate provided with the first member in the manufacturing process of the first manufacturing method of the light emitting device according to the first embodiment; 図４のＶＩＩＣ－ＶＩＩＣ線における断面図であって、第１実施形態に係る発光装置の第１の製造方法の製造工程において枠体を設けた基体を模式的に示す断面図である。FIG. 5 is a cross-sectional view taken along the line VIIC-VIIC of FIG. 4, and is a cross-sectional view schematically showing a base provided with a frame in the manufacturing process of the first manufacturing method of the light emitting device according to the first embodiment; 第１実施形態に係る発光装置の第１の製造方法の製造工程において、第２部材を設ける方法を模式的に示す断面図である。FIG. 4A is a cross-sectional view schematically showing a method of providing a second member in the manufacturing process of the first manufacturing method of the light emitting device according to the first embodiment; 第１実施形態に係る発光装置の第２の製造方法の流れを示すフローチャートである。6 is a flow chart showing the flow of a second method for manufacturing the light emitting device according to the first embodiment; 第１実施形態に係る発光装置の第２の製造方法の製造工程において枠体を設けた基体を模式的に示す断面図である。FIG. 10 is a cross-sectional view schematically showing a base provided with a frame in the manufacturing process of the second manufacturing method of the light emitting device according to the first embodiment; 第１実施形態に係る発光装置の第２の製造方法の製造工程において第１部材を設けた基体を模式的に示す断面図である。FIG. 10 is a cross-sectional view schematically showing the base on which the first member is provided in the manufacturing process of the second manufacturing method of the light emitting device according to the first embodiment; 第２実施形態に係る発光装置の構成を模式的に示す断面図である。FIG. 4 is a cross-sectional view schematically showing the configuration of a light emitting device according to a second embodiment; 第２実施形態に係る発光装置の第１の製造方法の流れを示すフローチャートである。6 is a flow chart showing the flow of a first method for manufacturing a light emitting device according to a second embodiment; 第２実施形態に係る発光装置の第２の製造方法の流れを示すフローチャートである。9 is a flow chart showing the flow of a second method for manufacturing a light emitting device according to the second embodiment;

実施形態を、以下に図面を参照しながら説明する。但し、以下に示す形態は、本実施形態の技術思想を具現化するための発光装置を例示するものであって、以下に限定するものではない。また、実施形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限り、本発明の範囲をそれのみに限定する趣旨ではなく、単なる説明例にすぎない。なお、各図面が示す部材の大きさ、位置関係等は、説明を明確にするため誇張していることがある。また、以下の説明において、同一の名称、符号については同一もしくは同質の部材を示しており詳細説明を適宜省略する。 Embodiments are described below with reference to the drawings. However, the embodiments shown below are examples of light-emitting devices for embodying the technical idea of the present embodiment, and are not limited to the following. In addition, unless there is a specific description, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention, but are merely illustrative examples. It's nothing more than Note that the sizes, positional relationships, etc. of members shown in each drawing may be exaggerated for clarity of explanation. Further, in the following description, the same names and symbols indicate the same or homogeneous members, and detailed description thereof will be omitted as appropriate.

［第１実施形態］
＜発光装置＞
はじめに、第１実施形態に係る発光装置について説明する。
図１Ａは、第１実施形態に係る発光装置の構成を模式的に示す平面図である。図１Ｂは、図１ＡのＩＢ－ＩＢ線における断面図である。図１Ｃは、図１Ｂを部分的に拡大した断面図である。図１Ｄは、図１Ｃの第１部材の他の形態を示す断面図である。図１Ｅは、図１Ｃの第１部材の他の形態を示す断面図である。図１Ｆは、図１Ｃの第１部材の他の形態を示す断面図である。図１Ｇは、図１Ｃの第１部材の他の形態を示す断面図である。図２は、第１実施形態に係る発光装置において、枠体、第１部材及び第２部材を省略して描いた平面図である。図３は、第１実施形態に係る発光装置において、枠体及び第２部材を省略して描いた平面図である。図４は、第１実施形態に係る発光装置において、第２部材を省略して描いた平面図である。図５Ａは、第１部材の作用効果を説明する断面図である。図５Ｂは、第１部材の作用効果を説明する断面図である。 [First embodiment]
<Light emitting device>
First, the light emitting device according to the first embodiment will be described.
1A is a plan view schematically showing the configuration of a light emitting device according to a first embodiment; FIG. FIG. 1B is a cross-sectional view taken along line IB--IB of FIG. 1A. FIG. 1C is a partially enlarged sectional view of FIG. 1B. FIG. 1D is a cross-sectional view showing another form of the first member of FIG. 1C. FIG. 1E is a cross-sectional view showing another form of the first member of FIG. 1C. FIG. 1F is a cross-sectional view showing another form of the first member of FIG. 1C. FIG. 1G is a cross-sectional view showing another form of the first member of FIG. 1C. FIG. 2 is a plan view of the light emitting device according to the first embodiment, omitting the frame, first member, and second member. FIG. 3 is a plan view of the light emitting device according to the first embodiment, with the frame and the second member omitted. FIG. 4 is a plan view of the light emitting device according to the first embodiment, with the second member omitted. FIG. 5A is a cross-sectional view for explaining the effects of the first member. FIG. 5B is a cross-sectional view explaining the effects of the first member.

図１Ａ～図４に示すように、発光装置１０は、第１リード２０Ａと、第２リード２０Ｂと、第１リード２０Ａと第２リード２０Ｂを固定する固定部材２０Ｃと、を有する基体２０と、基体２０の上面に載置された発光素子４０と、発光素子４０を囲むように、基体２０の上面に設けられた枠体５０と、上面視において枠体５０の外周側に露出した固定部材２０Ｃの少なくとも一部の上面を覆い、かつ、枠体５０の外側面に接する反射材を含有する第１部材３０と、発光素子４０、枠体５０及び第１部材３０を覆う第２部材７０と、を備え、第１部材３０は、断面視において傾斜領域３１を有し、傾斜領域３１の高さＨ１が枠体５０の上端の高さＨ２よりも低く形成されている。以下、各構成について説明する。 As shown in FIGS. 1A to 4, the light emitting device 10 includes a base 20 having a first lead 20A, a second lead 20B, and a fixing member 20C for fixing the first lead 20A and the second lead 20B, A light-emitting element 40 placed on the upper surface of the base 20, a frame 50 provided on the upper surface of the base 20 so as to surround the light-emitting element 40, and a fixing member 20C exposed on the outer peripheral side of the frame 50 in top view. A first member 30 containing a reflective material that covers at least a portion of the upper surface of the frame 50 and is in contact with the outer surface of the frame 50, a second member 70 that covers the light emitting element 40, the frame 50 and the first member 30; The first member 30 has an inclined region 31 in a cross-sectional view, and the height H1 of the inclined region 31 is lower than the height H2 of the upper end of the frame 50 . Each configuration will be described below.

（基体）
図２に示すように、基体２０は、第１リード２０Ａと、第２リード２０Ｂと、第１リード２０Ａと第２リード２０Ｂとを離間した状態で固定する固定部材２０Ｃと、を有している。第１リード２０Ａの上面、第２リード２０Ｂの上面及び固定部材２０Ｃの上面が面一状とすることができる。また、第１リード２０Ａの下面、第２リード２０Ｂの下面及び固定部材２０Ｃの下面が面一状とすることができる。
第１リード２０Ａは、例えば、基体２０の中央にほぼ多角形に形成され、発光素子４０を載置する載置部２１Ａと、基体２０の一端側に配置される端子部２３Ａと、載置部２１Ａと端子部２３Ａとを接続する接続部２２Ａと、を有している。接続部２２Ａの幅Ｗ２２は、載置部２１Ａの幅Ｗ２１及び端子部２３Ａの幅Ｗ２３よりも狭くなるように形成されている。端子部２３Ａの幅Ｗ２３は、載置部２１Ａの幅Ｗ２１よりも広く基体２０と同等に形成されている。なお、接続部２２Ａは、発光素子４０のワイヤ６０が接続する領域を有する。ここで、第１リード２０Ａ及び第２リード２０Ｂにおいて、幅とは、載置部２１Ａから接続部２２Ａが延伸する方向に直交する方向の最大長さをいう。
また、載置部２１Ａは、ほぼ八角形に形成されている。そして、載置部２１Ａは、接続部２２Ａの幅Ｗ２２と同じ長さの第１辺２１Ａ１と、第１辺２１Ａ１に平行でかつ対向する第２辺２１Ａ２と、第１辺２１Ａ１及び第２辺２１Ａ２に直交する第３辺２１Ａ３と、第１辺２１Ａ１及び第２辺２１Ａ２に直交し第３辺２１Ａ３と対向する第４辺２１Ａ４と、第１辺２１Ａ１と第３辺２１Ａ３とを結ぶ傾斜した第５辺２１Ａ５と、第１辺２１Ａ１と第４辺２１Ａ４とを結ぶ傾斜した第６辺２１Ａ６と、第２辺２１Ａ２と第３辺２１Ａ３とを結ぶ傾斜した第７辺２１Ａ７と、第２辺２１Ａ２と第４辺２１Ａ４とを結ぶ傾斜した第８辺２１Ａ８と、を有している。さらに、載置部２１Ａは、第３辺２１Ａ３及び第４辺２１Ａ４に辺から突出して形成された凸部を有している。 (substrate)
As shown in FIG. 2, the substrate 20 has a first lead 20A, a second lead 20B, and a fixing member 20C that fixes the first lead 20A and the second lead 20B in a spaced apart state. . The upper surface of the first lead 20A, the upper surface of the second lead 20B, and the upper surface of the fixing member 20C can be flush with each other. Also, the lower surface of the first lead 20A, the lower surface of the second lead 20B, and the lower surface of the fixing member 20C can be flush.
The first lead 20A is formed, for example, in a substantially polygonal shape in the center of the substrate 20, and includes a mounting portion 21A on which the light emitting element 40 is mounted, a terminal portion 23A arranged on one end side of the substrate 20, and a mounting portion. It has a connecting portion 22A that connects 21A and the terminal portion 23A. The width W22 of the connection portion 22A is formed to be narrower than the width W21 of the mounting portion 21A and the width W23 of the terminal portion 23A. The width W23 of the terminal portion 23A is wider than the width W21 of the mounting portion 21A and is formed to be the same as the base 20. As shown in FIG. The connecting portion 22A has a region to which the wire 60 of the light emitting element 40 is connected. Here, in the first lead 20A and the second lead 20B, the width means the maximum length in the direction perpendicular to the direction in which the connecting portion 22A extends from the mounting portion 21A.
Further, the mounting portion 21A is formed in a substantially octagonal shape. The mounting portion 21A includes a first side 21A1 having the same length as the width W22 of the connecting portion 22A, a second side 21A2 parallel to and facing the first side 21A1, the first side 21A1 and the second side 21A2. a fourth side 21A4 perpendicular to the first side 21A1 and the second side 21A2 and facing the third side 21A3; and an inclined fifth side 21A3 connecting the first side 21A1 and the third side 21A3. a sloped sixth side 21A6 connecting the first side 21A1 and the fourth side 21A4; a sloped seventh side 21A7 connecting the second side 21A2 and the third side 21A3; and an inclined eighth side 21A8 connecting the four sides 21A4. Further, the mounting portion 21A has protrusions formed to protrude from the third side 21A3 and the fourth side 21A4.

第２リード２０Ｂは、載置部２１Ａの第２辺２１Ａ２、第７辺２１Ａ７及び第８辺２１Ａ８との間隔がほぼ一定となるように配置されている。また、第２リード２０Ｂは、端子部２３Ａの幅Ｗ２３とほぼ同じ幅を有し、長軸方向の一端部と他端部が載置部２１Ａ側に屈曲して面積が広くなるように接続端部２０Ｂ１、２０Ｂ２等が形成されている。一方の接続端部２０Ｂ１は、保護素子９０を載置する領域を有している。また、他方の接続端部２０Ｂ２は、発光素子４０のワイヤ６０を接続する領域を有している。 The second lead 20B is arranged so that the intervals between the second side 21A2, the seventh side 21A7 and the eighth side 21A8 of the mounting portion 21A are substantially constant. The second lead 20B has a width W23 substantially equal to the width W23 of the terminal portion 23A. Parts 20B1, 20B2, etc. are formed. One connection end portion 20B1 has a region on which the protective element 90 is placed. The other connection end portion 20B2 has a region to which the wire 60 of the light emitting element 40 is connected.

平面視において、第１リード２０Ａの面積が第２リード２０Ｂの面積より大きい方が好ましい。第１リード２０Ａの載置部２１Ａの上面には発光素子４０が載置されるので、第１リード２０Ａの載置部２１Ａの面積が大きいことで、発光素子４０で発生した熱を第１リード２０Ａに伝導しやすくなる。これにより、発光素子４０の温度上昇を抑制できるので発光装置１０の信頼性を向上できる。 In plan view, it is preferable that the area of the first lead 20A is larger than the area of the second lead 20B. Since the light emitting element 40 is mounted on the upper surface of the mounting portion 21A of the first lead 20A, the large area of the mounting portion 21A of the first lead 20A allows the heat generated by the light emitting element 40 to be transferred to the first lead. It becomes easier to conduct to 20A. As a result, the temperature rise of the light emitting element 40 can be suppressed, so the reliability of the light emitting device 10 can be improved.

第１リード２０Ａ及び／又は第２リード２０Ｂの端面は凹部あるいは凸部を備えることが好ましい。第１リード２０Ａ及び／又は第２リード２０Ｂと、固定部材２０Ｃと、が接触する箇所に凹部あるいは凸部を備えることで、第１リード２０Ａ及び／又は第２リード２０Ｂと、固定部材２０Ｃと、の接触面積を大きくすることができる。これにより、第１リード２０Ａ及び／又は第２リード２０Ｂと固定部材２０Ｃとの密着性を向上させることができる。 It is preferable that the end faces of the first lead 20A and/or the second lead 20B have concave portions or convex portions. By providing concave portions or convex portions where the first lead 20A and/or the second lead 20B and the fixing member 20C are in contact with each other, the first lead 20A and/or the second lead 20B and the fixing member 20C, contact area can be increased. Thereby, the adhesion between the first lead 20A and/or the second lead 20B and the fixing member 20C can be improved.

第１リード２０Ａ及び第２リード２０Ｂは、発光素子４０等の電子部品に外部電源からの電圧を印加するために用いられる。第１リード２０Ａ及び第２リード２０Ｂは、熱伝導率の比較的大きな材料で形成することが好ましい。例えば、２００Ｗ／（ｍ・Ｋ）程度以上の熱伝導率を有している材料を用いることにより、発光素子４０で発生した熱を第１リード２０Ａに伝導しやすくなる。 The first lead 20A and the second lead 20B are used to apply a voltage from an external power supply to electronic components such as the light emitting element 40. As shown in FIG. The first lead 20A and the second lead 20B are preferably made of a material with relatively high thermal conductivity. For example, by using a material having a thermal conductivity of about 200 W/(m·K) or more, the heat generated by the light emitting element 40 can be easily conducted to the first lead 20A.

第１リード２０Ａ及び第２リード２０Ｂは、打ち抜き加工や切断加工等が容易な強度の高い材料で形成されることが好ましい。例えば、銅、アルミニウム、金、銀、タングステン、鉄、ニッケル等の金属又はこれらの合金、燐青銅、鉄入り銅等の単層又は積層体を基材とすることができる。なお、金属層は、第１リード２０Ａ及び第２リード２０Ｂの全面に設けられてもよいし、部分的に設けられてもよい。また、片方のリードのみに設けられてもよい。 The first lead 20A and the second lead 20B are preferably made of a material with high strength that can be easily punched or cut. For example, the base material can be a single layer or laminate of metals such as copper, aluminum, gold, silver, tungsten, iron and nickel, alloys thereof, phosphor bronze, iron-containing copper and the like. The metal layer may be provided on the entire surface of the first lead 20A and the second lead 20B, or may be provided partially. Alternatively, it may be provided only on one lead.

第１リード２０Ａ及び第２リード２０Ｂは、表面に反射膜を備えていてもよい。反射膜は、アルミニウム、銅、金等の１又は２以上の金属を用いることができる。特に、反射膜に銀を用いることが好ましい。このようにすることで、発光装置１０の光取り出し効率を向上させることができる。 The first lead 20A and the second lead 20B may have a reflective film on their surfaces. One or more metals such as aluminum, copper, and gold can be used for the reflective film. In particular, it is preferable to use silver for the reflective film. By doing so, the light extraction efficiency of the light emitting device 10 can be improved.

第１リード２０Ａ及び第２リード２０Ｂに反射膜を形成する方法は、めっき法、蒸着法、スパッタ法、イオンビームアシスト蒸着法等の種々の方法が挙げられる。その膜厚は、発光素子４０からの光を有効に反射させることができる膜厚であればよく、例えば２０ｎｍ～１０μｍ程度であり、５０ｎｍ～５μｍ程度が好ましく、１００ｎｍ～３μｍ程度がより好ましい。なお、第１リード２０Ａ及び第２リード２０Ｂの厚み及び形状は、当該分野で公知の範囲において適宜設定することができる。 Various methods such as a plating method, a vapor deposition method, a sputtering method, and an ion beam assist vapor deposition method can be used to form the reflective films on the first lead 20A and the second lead 20B. The film thickness may be any film thickness that can effectively reflect the light from the light emitting element 40, and is, for example, about 20 nm to 10 μm, preferably about 50 nm to 5 μm, more preferably about 100 nm to 3 μm. The thickness and shape of the first lead 20A and the second lead 20B can be appropriately set within a range known in the art.

固定部材２０Ｃは、第１リード２０Ａの周りと、第２リード２０Ｂと第１リード２０Ａとの間と、第２リード２０Ｂの一端部と他端部の周りとに設けられて、第１リード２０Ａと第２リード２０Ｂとを固定する。この固定部材２０Ｃは、例えば、端子部２３Ａと接続部２２Ａと載置部２１Ａの２つの傾斜した第５辺２１Ａ５及び第６辺２１Ａ６との間の接続部２２Ａから離れるにしたがって間隔が広くなった領域（樹脂注入部）から成形樹脂を注入して、第１リード２０Ａの周りと、第２リード２０Ｂと第１リード２０Ａとの間と、第２リード２０Ｂの一端部と他端部の周りとに成形樹脂を充填することにより形成される。このように、樹脂注入部から成形樹脂を注入することにより、樹脂注入部から離れた、例えば、第２リード２０Ｂと第１リード２０Ａとの間の領域にも容易に成形樹脂を充填することができる。また、第１リード２０Ａの載置部２１Ａの形状をほぼ多角形とし、角の部分に傾斜した第５辺２１Ａ５、第６辺２１Ａ６、第７辺２１Ａ７及び第８辺２１Ａ８を設けているので、第１リード２０Ａの周りと、第２リード２０Ｂと第１リード２０Ａとの間と、第２リード２０Ｂの一端部と他端部の周りとに成形樹脂を導きやすくなる。 The fixing member 20C is provided around the first lead 20A, between the second lead 20B and the first lead 20A, and around one end and the other end of the second lead 20B. and the second lead 20B are fixed. The fixing member 20C is arranged such that, for example, the distance between the terminal portion 23A, the connecting portion 22A, and the two slanted fifth sides 21A5 and sixth sides 21A6 of the mounting portion 21A increases with increasing distance from the connecting portion 22A. Molding resin is injected from a region (resin injection portion) to surround the first lead 20A, between the second lead 20B and the first lead 20A, and around one end and the other end of the second lead 20B. It is formed by filling molding resin into the . By injecting the molding resin from the resin injection portion in this way, it is possible to easily fill the molding resin even in a region away from the resin injection portion, for example, between the second lead 20B and the first lead 20A. can. In addition, since the mounting portion 21A of the first lead 20A has a substantially polygonal shape and is provided with inclined fifth side 21A5, sixth side 21A6, seventh side 21A7 and eighth side 21A8 at the corners, It becomes easier to guide the molding resin around the first lead 20A, between the second lead 20B and the first lead 20A, and around one end and the other end of the second lead 20B.

固定部材２０Ｃの材料としては、エポキシ樹脂、シリコーン樹脂、ＢＴレジン、ポリアミド樹脂、ポリイミド樹脂、ナイロン樹脂、不飽和ポリエステル等の樹脂が挙げられ、セラミックスでもよい。これらの材料に、当該分野で公知の着色剤、充填剤、強化繊維等を含有させてもよい。着色剤として、酸化チタン、酸化亜鉛等の白色のフィラーを用いると発光装置の光取り出し効率を向上させることができる。また、熱放射係数の大きいカーボンブラック等の黒色フィラーを含有させることにより、発光素子４０からの熱を効率的に逃がすことができ、さらに、樹脂の強度を高めることができる。充填剤としては、酸化ケイ素、酸化アルミニウム等が挙げられる。強化繊維としては、ガラス、珪酸カルシウム、チタン酸カリウム等が挙げられる。
以上の説明では、第１リード２０Ａが、発光素子４０を載置する載置部２１Ａを有しているが、第２リード２０Ｂが載置部を有してもよい。以下の各構成の説明では、第１リード２０Ａが載置部２１Ａを有する場合を例にとって説明する。 Examples of materials for the fixing member 20C include resins such as epoxy resin, silicone resin, BT resin, polyamide resin, polyimide resin, nylon resin, and unsaturated polyester, and ceramics may also be used. These materials may contain coloring agents, fillers, reinforcing fibers, etc. known in the art. When a white filler such as titanium oxide or zinc oxide is used as the coloring agent, the light extraction efficiency of the light emitting device can be improved. In addition, by including a black filler such as carbon black having a large thermal radiation coefficient, the heat from the light emitting element 40 can be efficiently released, and the strength of the resin can be increased. Examples of fillers include silicon oxide and aluminum oxide. Examples of reinforcing fibers include glass, calcium silicate, potassium titanate, and the like.
In the above description, the first lead 20A has the mounting portion 21A on which the light emitting element 40 is mounted, but the second lead 20B may have the mounting portion. In the following description of each configuration, the case where the first lead 20A has the mounting portion 21A will be described as an example.

（発光素子４０）
発光素子４０は、第１リード２０Ａの載置部２１Ａの上面に載置される。発光素子４０は、電圧を印加することで自ら発光する半導体素子であり、上面に発光面を有する。載置部２１Ａの上面に載置される発光素子４０の個数は、特に限定されない。図面においては２個の発光素子４０が載置部２１Ａの上面に載置されているが、１個又は３個以上の発光素子４０が載置部２１Ａの上面に載置されていてもよい。 (Light emitting element 40)
The light emitting element 40 is mounted on the upper surface of the mounting portion 21A of the first lead 20A. The light-emitting element 40 is a semiconductor element that emits light by itself when voltage is applied, and has a light-emitting surface on its upper surface. The number of light emitting elements 40 placed on the upper surface of the placement portion 21A is not particularly limited. Although two light emitting elements 40 are mounted on the upper surface of the mounting portion 21A in the drawing, one or more than three light emitting elements 40 may be mounted on the upper surface of the mounting portion 21A.

発光素子４０は、基体２０側に配置されるサファイア等からなる素子基板４１と、素子基板４１に設けられた窒化物半導体等から構成される半導体層４２と、を備えることが好ましい。発光素子４０の発光波長は、可視域（３８０～７８０ｎｍ）を含め、紫外域から赤外域まで選択することができる。例えば、ピーク波長４３０～４９０ｎｍの発光素子４０では、窒化物半導体として、ＩｎＸＡｌＹＧａ１－Ｘ－ＹＮ（０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）等を用いることができる。また、発光素子４０はサブマウントを介して第１リード２０Ａの上面に配置されてもよい。 The light emitting element 40 preferably includes an element substrate 41 made of sapphire or the like arranged on the base 20 side, and a semiconductor layer 42 made of a nitride semiconductor or the like provided on the element substrate 41 . The emission wavelength of the light emitting element 40 can be selected from the ultraviolet region to the infrared region, including the visible region (380 to 780 nm). For example, in the light emitting element 40 with a peak wavelength of 430 to 490 nm, In X Al Y Ga 1-XY N (0≦X, 0≦Y, X+Y≦1) or the like can be used as the nitride semiconductor. Also, the light emitting element 40 may be arranged on the upper surface of the first lead 20A via a submount.

発光素子４０の形状は、上面視で、三角形、四角形、六角形等の多角形、又はこれらに近似する形状等、任意の形状でよい。また、発光素子４０は、同じ面側にｎ電極４３及びｐ電極４４が形成された片面電極の構成、あるいは、ｎ電極４３とｐ電極４４が異なる２つの面（例えば上面と下面）に各々形成された両面電極の構成であってもよい。発光素子４０のｎ電極４３とｐ電極４４は、それぞれワイヤ６０を介して第１リード２０Ａと第２リード２０Ｂとに接続される。なお、発光素子４０のｎ電極４３とｐ電極４４は、それぞれ第２リード２０Ｂと第１リード２０Ａとに直接接続される構成であってもよい。ワイヤ６０には、金、アルミニウム、銅、銀等の導電性に優れた金属材料を用いることができる。 The shape of the light emitting element 40 may be an arbitrary shape such as a triangle, a square, a polygon such as a hexagon, or a shape similar to these when viewed from above. In addition, the light emitting element 40 has a single-sided electrode configuration in which the n-electrode 43 and the p-electrode 44 are formed on the same surface side, or the n-electrode 43 and the p-electrode 44 are formed on two different surfaces (for example, the upper surface and the lower surface). It may be a double-sided electrode configuration. The n-electrode 43 and p-electrode 44 of the light emitting element 40 are connected to the first lead 20A and the second lead 20B via wires 60, respectively. The n-electrode 43 and the p-electrode 44 of the light emitting element 40 may be directly connected to the second lead 20B and the first lead 20A, respectively. The wire 60 can be made of a highly conductive metal material such as gold, aluminum, copper, or silver.

発光素子４０が片面電極の場合は、第１リード２０Ａの上面にフェイスアップ実装される。フェイスアップ実装とは、発光素子４０の電極形成面と反対側の面を基体２０に向けて実装する形態である。発光素子４０と第１リード２０Ａの接合部材は、絶縁性の接合部材でも導電性の接合部材でもよく、公知の接合部材を用いることができる。例えば、絶縁性の接合部材としてはエポキシ樹脂、シリコーン樹脂又はこれらの変性樹脂等が挙げられ、導電性の接合部材としては銀、金、パラジウム等の導電性ペーストや、Ａｕ－Ｓｎ共晶等の半田、低融点金属等のろう材等が挙げられる。
発光素子４０が両面電極の場合は、発光素子４０と第１リード２０Ａとの接合部材として、導電性の接合部材であればよく公知の接合部材を用いてよい。例えば、導電性の接合部材としては銀、金、パラジウム等の導電性ペーストや、Ａｕ－Ｓｎ共晶等の半田、低融点金属等のろう材等が挙げられる。 When the light emitting element 40 is a single-sided electrode, it is mounted face up on the upper surface of the first lead 20A. Face-up mounting is a form in which the surface of the light-emitting element 40 opposite to the surface on which the electrodes are formed faces the base 20 . A bonding member between the light emitting element 40 and the first lead 20A may be an insulating bonding member or a conductive bonding member, and a known bonding member can be used. For example, insulating bonding members include epoxy resins, silicone resins, modified resins thereof, and the like, and conductive bonding members include conductive pastes such as silver, gold, and palladium, and Au—Sn eutectic. Brazing materials such as solder and low-melting-point metals can be used.
When the light emitting element 40 is a double-sided electrode, any known bonding member may be used as the bonding member between the light emitting element 40 and the first lead 20A as long as it is a conductive bonding member. Examples of conductive joining members include conductive paste such as silver, gold and palladium, solder such as Au—Sn eutectic, brazing material such as low melting point metal, and the like.

（枠体）
図４に示すように、枠体５０は、発光素子４０を囲むように、基体２０の上面に設けられた環状の枠体である。枠体５０の内縁と外縁の形状は、上面視において円形状、楕円形状、正方形、六角形、八角形等の多角形状、多角形状の角部を面取りした形状等、様々な形状にしてもよい。枠体５０は、枠体５０の元となる未硬化の原料を、枠体５０を形成したい領域に配置し、当該原料を硬化させることにより形成することができる。 (frame body)
As shown in FIG. 4 , the frame 50 is an annular frame provided on the upper surface of the base 20 so as to surround the light emitting element 40 . The shape of the inner edge and outer edge of the frame body 50 may be various shapes such as a circular shape, an elliptical shape, a polygonal shape such as a square, a hexagon, and an octagon, and a shape in which the corners of the polygonal shape are chamfered when viewed from above. . The frame 50 can be formed by arranging an uncured raw material, which is the base of the frame 50, in a region where the frame 50 is desired to be formed, and curing the raw material.

枠体５０は、第１リード２０Ａと固定部材２０Ｃとの連結部を覆うように、境界上に設けられている。すなわち、枠体５０の内側に第１リード２０Ａの載置部２１Ａのみが露出し、枠体５０の内側に固定部材２０Ｃが露出しないように設けられることが好ましい。枠体５０の内側に固定部材２０Ｃが露出しないため、固定部材２０Ｃに含有される黒色フィラー等に発光素子からの光が吸収されることがない。その結果、発光素子からの光が載置部２１Ａの上面で反射されるため、発光装置１０の光取出し性が向上する。
また、枠体５０の断面径Ｄ２（図１Ｂ参照）の大きさは、枠体５０の内側には第１リード２０Ａの載置部２１Ａが露出し、枠体５０の外側には第１リード２０Ａ（端子部２３Ａ）及び第２リード２０Ｂの一部と固定部材２０Ｃの一部とが露出するように、適宜設定される。 The frame body 50 is provided on the boundary so as to cover the connecting portion between the first lead 20A and the fixed member 20C. That is, it is preferable that only the mounting portion 21A of the first lead 20A is exposed inside the frame 50 and the fixing member 20C is not exposed inside the frame 50. FIG. Since the fixing member 20C is not exposed inside the frame 50, the black filler or the like contained in the fixing member 20C does not absorb the light from the light emitting element. As a result, the light from the light emitting element is reflected on the upper surface of the mounting portion 21A, so that the light extraction efficiency of the light emitting device 10 is improved.
The size of the cross-sectional diameter D2 (see FIG. 1B) of the frame 50 is such that the mounting portion 21A for the first lead 20A is exposed inside the frame 50, and the first lead 20A is outside the frame 50. (terminal portion 23A), a portion of the second lead 20B, and a portion of the fixing member 20C are appropriately set.

枠体５０の断面形状（図１Ｂ、１Ｃ参照）は、特に限定されず、部分円を含む円形状、部分楕円を含む楕円形状、矩形形状等の様々な形状を有することができ、半楕円形状が好ましい。また、枠体５０の断面形状は、外側面と内側面が対称の形状でも良いし、非対称の形状にすることもできる。非対称の場合、枠体５０の外側面の傾斜具合を内側面の傾斜具合より緩やかにしても良い。 The cross-sectional shape of the frame 50 (see FIGS. 1B and 1C) is not particularly limited, and may have various shapes such as a circular shape including a partial circle, an elliptical shape including a partial ellipse, a rectangular shape, and a semi-elliptical shape. is preferred. In addition, the cross-sectional shape of the frame 50 may be a symmetrical shape between the outer surface and the inner surface, or may be an asymmetrical shape. In the asymmetrical case, the slope of the outer surface of the frame 50 may be gentler than the slope of the inner surface.

枠体５０を構成する材料としては、樹脂、セラミックス、表面が絶縁コートされた金属体等が挙げられる。樹脂材料としては、フェノール樹脂、エポキシ樹脂、ＢＴレジンやＰＰＡやシリコーン樹脂等である。特に、枠体５０の材料としては、耐光性に優れたシリコーン樹脂が好ましい。枠体５０は、枠体５０の母体となる母材樹脂が、第１部材３０の母材樹脂と同一材料であることが好ましい。これにより、枠体５０と第１部材３０との密着性が向上する。 Examples of the material forming the frame body 50 include resin, ceramics, and a metal body whose surface is coated with insulation. Examples of the resin material include phenol resin, epoxy resin, BT resin, PPA, and silicone resin. In particular, as the material of the frame 50, a silicone resin having excellent light resistance is preferable. It is preferable that the base material resin of the frame body 50 is the same material as the base material resin of the first member 30 . This improves the adhesion between the frame 50 and the first member 30 .

枠体５０は、母材樹脂に、発光素子４０からの光を吸収しにくく、かつ、母材樹脂に対する屈折率差の大きい反射部材等の粉末を分散することで、効率よく発光素子４０からの光を反射させることができる。反射部材としては、例えば、酸化チタン、酸化アルミニウム、酸化ジルコニウム、酸化マグネシウムを用いることができる。特に、酸化チタンは、水分などに対して比較的安定でかつ高屈折率であるため好ましい。枠体５０は、発光素子４０からの光に対する反射率が６０％以上、好ましくは９０％以上の部材である。酸化チタン等の反射部材の充填量は樹脂流動性などの成形条件によって適宜選択されるが、例えば、酸化チタンを用いる場合は、好ましくは２０～６０ｗｔ％、より好ましくは２５～３５ｗｔ％配合させるのが好ましい。このようにすることで、枠体５０に達した光が枠体５０に吸収されにくくなり、発光装置１０の光取出し性が向上する。 The frame body 50 is made by dispersing powder such as a reflective member that does not easily absorb the light from the light emitting element 40 and has a large difference in refractive index with respect to the base material resin. Can reflect light. As the reflecting member, for example, titanium oxide, aluminum oxide, zirconium oxide, and magnesium oxide can be used. In particular, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index. The frame 50 is a member having a reflectance of 60% or more, preferably 90% or more, with respect to the light from the light emitting element 40 . The filling amount of the reflective member such as titanium oxide is appropriately selected depending on molding conditions such as resin fluidity. is preferred. By doing so, the light reaching the frame 50 is less likely to be absorbed by the frame 50, and the light extraction property of the light emitting device 10 is improved.

（第１部材）
図３、図４に示すように、第１部材３０は、上面視において、枠体５０の外周側に形成されている。第１部材３０は、枠体５０から露出した固定部材２０Ｃの少なくとも一部の上面を覆い、かつ、第１部材３０の内側面が枠体５０に接する部材である。
第１部材３０が、固定部材２０Ｃの少なくとも一部の上面を覆うと発光装置１０の光取出し性及び配光性が向上する。さらに、第１部材３０が、枠体５０の外周側で露出した固定部材２０Ｃの上面全域を覆うと、より一層発光装置１０の光取出し性及び配光性が向上する。なお、第１部材３０の内側面が枠体５０に接するため、第１部材３０と枠体５０との密着性が向上する。 (First member)
As shown in FIGS. 3 and 4, the first member 30 is formed on the outer peripheral side of the frame 50 when viewed from above. The first member 30 is a member that covers the upper surface of at least a portion of the fixing member 20</b>C exposed from the frame 50 and that the inner surface of the first member 30 contacts the frame 50 .
When the first member 30 covers at least a part of the upper surface of the fixing member 20C, the light extraction and light distribution properties of the light emitting device 10 are improved. Furthermore, when the first member 30 covers the entire upper surface of the fixing member 20C exposed on the outer peripheral side of the frame 50, the light extraction and light distribution properties of the light emitting device 10 are further improved. In addition, since the inner surface of the first member 30 is in contact with the frame 50, the adhesion between the first member 30 and the frame 50 is improved.

具体的には、図５Ａに示すように、発光素子４０から出射された光Ｌ１の一部は、第２部材７０のレンズ部７１表面で反射され、レンズ部７１を通過して枠体５０の外側に戻される。固定部材２０Ｃが光吸収する材料である場合、戻された光Ｌ２は固定部材２０Ｃに吸収されるおそれがあるが、固定部材２０Ｃは第１部材３０に覆われているため、戻された光Ｌ２は固定部材２０Ｃに吸収されることなく反射光Ｌ３として外側に出射される。その結果、発光装置１０の光取出し性が向上する。
図５Ｂに示すように、照明器具等では複数の発光装置１０、１１が隣り合わせで使用される。このような場合でも、発光装置１０の第１部材３０で反射された反射光Ｌ３は、隣り合う発光装置１１の固定部材２０Ｃに吸収されることなく、固定部材２０Ｃを覆う第１部材３０で反射され、反射光Ｌ４として外側に出射される。その結果、複数の発光装置１０、１１のそれぞれの光取出し性の低下を防止できる。 Specifically, as shown in FIG. 5A, part of the light L1 emitted from the light emitting element 40 is reflected by the surface of the lens portion 71 of the second member 70, passes through the lens portion 71, and passes through the frame 50. returned to the outside. If the fixing member 20C is made of a material that absorbs light, the returned light L2 may be absorbed by the fixing member 20C. is emitted outside as reflected light L3 without being absorbed by the fixing member 20C. As a result, the light extraction property of the light emitting device 10 is improved.
As shown in FIG. 5B, a plurality of light emitting devices 10 and 11 are used side by side in a lighting fixture or the like. Even in such a case, the reflected light L3 reflected by the first member 30 of the light emitting device 10 is not absorbed by the fixing member 20C of the adjacent light emitting device 11, and is reflected by the first member 30 covering the fixing member 20C. and is emitted to the outside as reflected light L4. As a result, it is possible to prevent deterioration in the light extraction performance of each of the plurality of light emitting devices 10 and 11 .

図１Ｃに示すように、第１部材３０は、断面視において傾斜領域３１（上端Ｕから外側の領域）を有し、傾斜領域３１の高さＨ１が枠体５０の上端の高さＨ２よりも低く形成されている。
第１部材３０が傾斜領域３１を有するため、第２部材７０のレンズ部７１から戻された光Ｌ２は、傾斜領域３１によって外側側方に反射光Ｌ３として反射する。その結果、発光装置１０の配光性が向上する。
傾斜領域３１の高さＨ１、すなわち、傾斜領域３１の基体２０からの高さの最大値は、取出し光の光束が向上するため、枠体５０の上端の基体２０からの高さＨ２の１／３以上が好ましい。 As shown in FIG. 1C, the first member 30 has an inclined region 31 (a region outside the upper end U) in a cross-sectional view, and the height H1 of the inclined region 31 is higher than the height H2 of the upper end of the frame 50. formed low.
Since the first member 30 has the inclined region 31 , the light L2 returned from the lens portion 71 of the second member 70 is reflected outward and laterally by the inclined region 31 as reflected light L3. As a result, the light distribution of the light emitting device 10 is improved.
The height H1 of the inclined region 31, that is, the maximum value of the height of the inclined region 31 from the substrate 20 is 1/1/1 of the height H2 of the upper end of the frame 50 from the substrate 20 because the luminous flux of the extracted light is improved. 3 or more is preferable.

図１Ｃに示すように、第１部材３０は、その傾斜領域３１が、断面視において凸となる湾曲形状であり、第１部材３０と枠体５０とが接し、第１部材３０の上端Ｕが枠体５０に接していても良い。そして、上端Ｕに近づくにつれて高くなる傾斜領域３１の傾斜具合は、傾斜面と基体２０の上面とで形成される角度で定義される傾斜角度θが３０～６０度であることが好ましい。傾斜領域３１の傾斜具合が前記であると、第１部材３０と第２部材７０との接触面積が、傾斜領域３１が平坦形状である場合と比べて増えるため、第１部材３０と第２部材７０との密着性が向上する。また、第１部材３０の内側面も断面視において凸となる湾曲形状であると、第１部材３０と枠体５０との接触面積が増加するため、第１部材３０と枠体５０との密着性が向上する。また、第１部材３０は、断面視において上端Ｕから底辺に降ろした垂線Ｙ１に対し、左右対象でも良いし、左右非対称でも良い。左右非対称の場合は、図１Ｃのように、第１部材３０の外側面（傾斜領域３１）の傾斜具合を内側面の傾斜具合より緩やかにすることができる。 As shown in FIG. 1C, the first member 30 has an inclined region 31 that has a curved shape that is convex in a cross-sectional view. It may be in contact with the frame body 50 . The degree of inclination of the inclined region 31, which increases toward the upper end U, is preferably such that the inclination angle θ defined by the angle formed by the inclined surface and the upper surface of the base 20 is 30 to 60 degrees. When the inclination of the inclined region 31 is as described above, the contact area between the first member 30 and the second member 70 increases compared to when the inclined region 31 is flat. Adhesion with 70 is improved. In addition, if the inner surface of the first member 30 also has a curved shape that is convex in a cross-sectional view, the contact area between the first member 30 and the frame 50 increases, so that the contact between the first member 30 and the frame 50 increases. improve sexuality. Further, the first member 30 may be left-right symmetrical or left-right asymmetrical with respect to a perpendicular line Y1 extending from the upper end U to the bottom side in a cross-sectional view. In the case of left-right asymmetry, as shown in FIG. 1C, the degree of inclination of the outer surface (inclined region 31) of the first member 30 can be made gentler than the degree of inclination of the inner surface.

傾斜領域３１がこのような凸となる湾曲形状を有するため、第１部材３０では、レンズ部７１から戻された光Ｌ２が広範囲に反射、すなわち、反射光Ｌ３として外側側方に反射するだけでなく、反射光Ｌ５として上方にも反射する。
また、図１Ｃにおいて、第１部材３０の外側面と枠体５０の外側面とが繋がる個所に窪みがあるため、窪みの分だけ第２部材７０との接触面積が増え、第２部材７０と第１部材３０と枠体５０との密着性がさらに向上する。 Since the inclined region 31 has such a convex curved shape, the first member 30 reflects the light L2 returned from the lens portion 71 over a wide range, that is, only reflects it outward and laterally as the reflected light L3. Instead, it is also reflected upward as reflected light L5.
In addition, in FIG. 1C, since there is a depression at a location where the outer surface of the first member 30 and the outer surface of the frame 50 are connected, the contact area with the second member 70 increases by the amount of the depression, and the contact area with the second member 70 increases. Adhesion between the first member 30 and the frame 50 is further improved.

第１部材３０の形状は、図１Ｄに示すように、その傾斜領域３１が、断面視において凸となる湾曲形状であり、第１部材３０の上端Ｕが、枠体５０側に位置しても良い。なお、上端Ｕが枠体５０側に位置するとは、上端Ｕから底辺に降ろした垂線Ｙ１が、底辺の中央点Ｃを通る垂線Ｙ２に対して枠体５０側にあることを意味する。枠体５０が第１部材３０の上端Ｕに接さないで内側面（上端Ｕから内側の領域）側のみと接する場合、戻された光Ｌ２の多くを第１部材３０の外側面（傾斜領域３１）に当てることができるので、外側側方への反射光Ｌ３を増やすことができる。また、第１部材３０は、枠体５０の外側面の下端が第１部材３０の外側面（傾斜領域３１）と接する構成にすることができる。 As shown in FIG. 1D, the shape of the first member 30 is such that the inclined region 31 thereof has a convex curved shape in a cross-sectional view. good. In addition, that the upper end U is positioned on the frame 50 side means that the perpendicular Y1 drawn from the upper end U to the base is on the frame 50 side with respect to the perpendicular Y2 passing through the center point C of the base. When the frame 50 does not contact the upper end U of the first member 30 but contacts only the inner side surface (the region inside from the upper end U), most of the returned light L2 is 31), it is possible to increase the reflected light L3 toward the outer side. Further, the first member 30 can be configured such that the lower end of the outer surface of the frame 50 is in contact with the outer surface (inclined region 31 ) of the first member 30 .

第１部材３０は、図１Ｅに示すように、その傾斜領域３１が凸となる湾曲形状であり、枠体５０の外側面の下端が基体２０と接する構成にすることができる。このような第１部材３０であっても、戻された光Ｌ２の多くを第１部材３０の傾斜領域３１に当てることができるので、外側側方への反射光Ｌ３を増やすことができる。 As shown in FIG. 1E , the first member 30 has a curved shape in which the inclined region 31 is convex, and the lower end of the outer surface of the frame 50 can be configured to be in contact with the base 20 . Even with such a first member 30, most of the returned light L2 can be applied to the inclined region 31 of the first member 30, so that the reflected light L3 toward the outer side can be increased.

第１部材３０の形状は、図１Ｆに示すような形状であってもよい。第１部材３０は、その傾斜領域３１が、断面視において枠体５０の下端に向かって凹となる湾曲形状であり、第１部材３０と枠体５０とが接し、第１部材３０の上端Ｕが枠体５０に接していても良い。このような傾斜領域３１であると、第１部材３０と第２部材７０との接触面積が（傾斜領域が平坦形状である場合と比べて）増えるため、第１部材３０と第２部材７０との密着性が向上する。また、第１部材３０の内側面も断面視において凹となる湾曲形状であると、第１部材３０と枠体５０との接触面積が増加するため、第１部材３０と枠体５０との密着性が向上する。また、第１部材３０は、断面視において上端Ｕから底辺に降ろした垂線Ｙ１に対し、左右対象でも良いし、左右非対称でも良い。また、傾斜領域３１がこのような凹となる湾曲形状を有するため、第１部材３０では、レンズ部７１から戻された光Ｌ２が反射光Ｌ３として側方に反射する割合が多くなる。 The shape of the first member 30 may be a shape as shown in FIG. 1F. The first member 30 has a curved shape in which the inclined region 31 is concaved toward the lower end of the frame 50 in a cross-sectional view. may be in contact with the frame body 50 . With such an inclined region 31, the contact area between the first member 30 and the second member 70 increases (compared to when the inclined region has a flat shape). The adhesion of is improved. In addition, if the inner surface of the first member 30 also has a curved shape that is concave in a cross-sectional view, the contact area between the first member 30 and the frame 50 increases. improve sexuality. Further, the first member 30 may be left-right symmetrical or left-right asymmetrical with respect to a perpendicular line Y1 extending from the upper end U to the bottom side in a cross-sectional view. In addition, since the inclined region 31 has such a concave curved shape, in the first member 30, the proportion of the light L2 returned from the lens portion 71 that is reflected sideways as the reflected light L3 increases.

第１部材３０は、図１Ｇに示すように、その傾斜領域３１が凹となる湾曲形状であり、枠体５０の外側面の下端が基体２０と接する構成にすることができる。このような第１部材３０であっても、戻り光Ｌ２の多くを第１部材３０の傾斜領域３１に当てることができるので、外側側方への反射光Ｌ３を増やすことができる。 As shown in FIG. 1G, the first member 30 has a curved shape in which the inclined region 31 is concave, and the lower end of the outer surface of the frame 50 can be configured to be in contact with the base 20 . Even with such a first member 30, most of the return light L2 can be applied to the inclined region 31 of the first member 30, so that the reflected light L3 to the outer side can be increased.

なお、第１部材３０の傾斜領域３１は、断面視において凸状又は凹状の湾曲形状に限定されず、凸状と凹状とが隣接する波形形状、又は、複数の凸状が互いに隣接する波形形状にすることもできる。第１部材３０の傾斜領域３１が平坦形状であれば、光を乱反射させることなく取り出すことができるため、光取出し効率が向上する。 Note that the inclined region 31 of the first member 30 is not limited to a convex or concave curved shape in a cross-sectional view, but a wavy shape in which a convex shape and a concave shape are adjacent to each other, or a wavy shape in which a plurality of convex shapes are adjacent to each other. can also be If the inclined region 31 of the first member 30 has a flat shape, the light can be extracted without irregular reflection, so that the light extraction efficiency is improved.

第１部材３０は、上面視において枠体５０の外周に沿って全周に連続的に設けられる構成にすることができる。また、連続的に設けられた第１部材３０は、基体２０が矩形で枠体５０が円環である場合、枠体５０からの露出面積が多い固定部材２０Ｃの四隅を覆う第１部材３０の高さＨ１を、四隅以外を覆う第１部材３０の高さＨ１よりも高くしてもよい。これにより、基体２０の四隅と四隅以外とで第１部材３０の高さＨ１が変わることで、第１部材３０の上面に重なる枠体５０の高さＨ２が全周において波打つように変化し、枠体５０の高さＨ２が不均一な構成となる。この結果、枠体５０の高さＨ２が均一の場合と比較して、第２部材７０との接触面積が増加し、枠体５０と第２部材７０との密着性が向上する。また、四隅以外を覆う第１部材３０の高さＨ１を、四隅を覆う第１部材３０の高さＨ１より低くすることにより、第１部材３０を設ける際の注入量を最小限に抑えることができ、タクトが良好となる。 The first member 30 can be configured to be continuously provided along the outer periphery of the frame 50 in top view. Further, when the base body 20 is rectangular and the frame body 50 is circular, the continuously provided first member 30 covers the four corners of the fixing member 20</b>C, which has a large exposed area from the frame body 50 . The height H1 may be higher than the height H1 of the first member 30 that covers areas other than the four corners. As a result, the height H1 of the first member 30 changes between the four corners and the corners other than the four corners of the base body 20, so that the height H2 of the frame body 50 overlapping the upper surface of the first member 30 fluctuates over the entire circumference, The height H2 of the frame 50 becomes non-uniform. As a result, compared with the case where the height H2 of the frame 50 is uniform, the contact area with the second member 70 increases, and the adhesion between the frame 50 and the second member 70 improves. In addition, by making the height H1 of the first member 30 that covers areas other than the four corners lower than the height H1 of the first member 30 that covers the four corners, the amount of injection when providing the first member 30 can be minimized. and the takt time is improved.

図４で示すように、第１部材３０は、上面視において枠体５０の外周に沿って断続的に設けられる構成としてもよい。断続的に設けられる第１部材３０の個数は、特に限定されず、レンズ部７１から戻される光の反射効率を考慮して適宜設定される。なお、基体２０が矩形で枠体５０が円環である場合には、第１部材３０を、枠体５０からの露出面積が多い固定部材２０Ｃの少なくとも四隅を覆うように設けることが好ましい。これにより、レンズ部７１から戻された光を十分に第１部材３０で反射することができ、発光装置１０の光取出し性及び配光性が十分なものとなる。なお、第１部材３０を断続的に設ける場合でも、枠体５０における基板２０の四隅の領域と四隅以外の領域とで高さが変われば、第
２部材７０との接触面積が増加し、枠体５０と第２部材の密着性が向上する。 As shown in FIG. 4, the first member 30 may be intermittently provided along the outer circumference of the frame 50 in top view. The number of intermittently provided first members 30 is not particularly limited, and is appropriately set in consideration of the reflection efficiency of light returned from the lens portion 71 . When the base body 20 is rectangular and the frame 50 is circular, it is preferable to provide the first member 30 so as to cover at least four corners of the fixing member 20C, which has a large exposed area from the frame 50 . As a result, the light returned from the lens portion 71 can be sufficiently reflected by the first member 30, and the light extraction and light distribution properties of the light emitting device 10 are sufficient. Even when the first members 30 are provided intermittently, if the heights of the four corner regions of the substrate 20 in the frame 50 and the regions other than the four corners are different, the contact area with the second member 70 increases and the frame Adhesion between the body 50 and the second member is improved.

第１部材３０は、樹脂、セラミックス等の母材に反射材を含有させた部材である。母材としては、フェノール樹脂、エポキシ樹脂、ＢＴレジンやＰＰＡやシリコーン樹脂等の樹脂が好ましい。特に、母材樹脂としては、耐光性に優れたシリコーン樹脂が好ましい。第１部材３０は、第１部材３０の母体となる母材樹脂が、枠体５０の母材樹脂と同一材料であることが好ましい。これにより、枠体５０と第１部材３０との密着性が向上する。 The first member 30 is a member in which a base material such as resin or ceramics contains a reflective material. As the base material, resins such as phenol resin, epoxy resin, BT resin, PPA, and silicone resin are preferable. In particular, as the base material resin, a silicone resin having excellent light resistance is preferable. As for the first member 30 , it is preferable that the base material resin of the first member 30 is the same material as the base material resin of the frame body 50 . This improves the adhesion between the frame 50 and the first member 30 .

第１部材３０は、母材樹脂に、発光素子４０からの光を吸収されにくく、かつ、母材樹脂に対する屈折率差の大きい粉末等の反射材を分散することで、効率よく発光素子４０からの光を反射させることができる。
反射材は、発光素子４０からの光に対する反射率が９０％以上、好ましくは９５％以上の部材である。このようにすることで、第１部材３０に達したレンズ部７１から戻された光Ｌ２が第１部材３０で吸収されにくくなり、発光装置１０の光取出し性が向上する。
反射材としては、例えば、酸化チタン、酸化アルミニウム、酸化ジルコニウム、酸化マグネシウムを用いることができる。特に、酸化チタンは、水分などに対して比較的安定でかつ高屈折率であるため好ましい。第１部材３０における酸化チタンの含有量は、１０～６０質量％であることが好ましい。 In the first member 30, light from the light emitting element 40 is hardly absorbed in the base material resin, and a reflecting material such as powder having a large refractive index difference with respect to the base material resin is dispersed. of light can be reflected.
The reflective material is a member having a reflectance of 90% or more, preferably 95% or more, with respect to the light from the light emitting element 40 . By doing so, the light L2 returned from the lens portion 71 reaching the first member 30 is less likely to be absorbed by the first member 30, and the light extraction property of the light emitting device 10 is improved.
As the reflector, for example, titanium oxide, aluminum oxide, zirconium oxide, and magnesium oxide can be used. In particular, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index. The content of titanium oxide in the first member 30 is preferably 10 to 60% by mass.

（第２部材）
図１Ａ、図１Ｂに示すように、第２部材７０は、発光素子４０、枠体５０及び第１部材３０を覆うように形成される。第２部材７０を枠体５０の外側まで覆うことで、第２部材の接触面積が増え、第２部材７０が剥がれないようにすることができる。また、第２部材７０は、第１部材３０の外側において、基体２０の第１リード２０Ａと第２リード２０Ｂのそれぞれ少なくとも一部を覆うように形成されることもできる。これにより、第２部材７０の剥がれが一層低減される。 (Second member)
As shown in FIGS. 1A and 1B, the second member 70 is formed to cover the light emitting element 40, the frame 50 and the first member 30. As shown in FIGS. By covering the second member 70 to the outside of the frame 50, the contact area of the second member is increased, and the second member 70 can be prevented from peeling off. Also, the second member 70 can be formed outside the first member 30 so as to cover at least a portion of each of the first lead 20A and the second lead 20B of the substrate 20 . This further reduces the peeling of the second member 70 .

第２部材７０は、様々な形状を有していてもよい。第２部材７０の形状としては、例えば、板状、上面凸状レンズ形状、上面凹状レンズ形状、フレネルレンズ形状、凸状レンズの中央付近に凹部を設けたレンズ形状等を例示することができる。このような形状とすることで、第２部材７０における取出し光の指向特性を調整することができる。 The second member 70 may have various shapes. Examples of the shape of the second member 70 include a plate shape, a lens shape with a convex upper surface, a lens shape with a concave upper surface, a Fresnel lens shape, and a lens shape in which a concave portion is provided near the center of a convex lens. With such a shape, the directivity of the extracted light in the second member 70 can be adjusted.

第２部材７０は、レンズ形状とした場合、発光素子４０の上方に設けられた出射面が凸状の湾曲形状のレンズ部７１と、第１部材３０の上方に位置するようにレンズ部７１の下部から外側に延びる鍔部７２と、を有しても良い。このような構成によれば、第２部材７０は、鍔部７２を有するため、発光素子４０から発せられた光が鍔部７２の上面および側面で反射することでより広範囲に拡散され、配光性が向上する。 When the second member 70 has a lens shape, a curved lens portion 71 having a convex emission surface provided above the light emitting element 40 and a lens portion 71 positioned above the first member 30 are arranged. and a collar portion 72 extending outwardly from the lower portion. According to such a configuration, the second member 70 has the collar portion 72. Therefore, the light emitted from the light emitting element 40 is reflected by the upper surface and the side surface of the collar portion 72, thereby being diffused over a wider range and distributed. improve sexuality.

第２部材７０は、光を取り出すことが可能な透光性材料で構成されている。第２部材７０を構成する透光性材料としては、シリコーン樹脂、エポキシ樹脂等の樹脂、又は、ガラスを例示することができる。
第２部材７０の断面径Ｄ３（図１Ｂ参照）は、第２部材７０が、発光素子４０、枠体５０及び第１部材３０を覆うことが可能であれば、如何なる大きさであってもよい。第２部材７０の断面径Ｄ３は、発光素子４０の発光面積を考慮して適宜決定される。
第２部材７０の屈折率は、第２部材７０の屈折率と大気の屈折率との差が適切な範囲であれば、如何なるものであってもよい。第２部材７０の屈折率は、１．４～１．６程度であることが好ましい。第２部材７０の屈折率がこのような範囲であれば、光取出し性を向上させることができる。 The second member 70 is made of a translucent material capable of extracting light. Examples of translucent materials forming the second member 70 include resins such as silicone resins and epoxy resins, and glass.
The cross-sectional diameter D3 (see FIG. 1B) of the second member 70 may be any size as long as the second member 70 can cover the light emitting element 40, the frame 50 and the first member 30. . The cross-sectional diameter D3 of the second member 70 is appropriately determined in consideration of the light emitting area of the light emitting element 40 .
The refractive index of the second member 70 may be any value as long as the difference between the refractive index of the second member 70 and the refractive index of the atmosphere is within an appropriate range. The refractive index of the second member 70 is preferably about 1.4 to 1.6. If the refractive index of the second member 70 is within such a range, it is possible to improve the light extraction property.

第１実施形態に係る発光装置１０は、図１Ａに示すように、保護素子９０を備えてもよい。保護素子９０は、第２リード２０Ｂの接続端部２１Ｂ１に載置され、ワイヤ６０で第１リード２０Ａの載置部２１Ａに電気的に接続されている。なお、保護素子９０の載置位置については前記に限定されず、第１リード２０Ａの載置部２１Ａに載置されていてもよい。
保護素子９０は、例えば、発光素子４０に逆方向の電圧が印加されたときに、逆方向に流れる電流を阻止したり、発光素子４０の動作電圧よりも高い順方向の電圧が印加されたときに、発光素子４０に過電流が流れるのを阻止したりする。保護素子９０としては、保護回路や静電保護素子が挙げられ、具体的には、ツェナーダイオードが利用できる。 The light emitting device 10 according to the first embodiment may include a protective element 90 as shown in FIG. 1A. The protective element 90 is mounted on the connecting end portion 21B1 of the second lead 20B and electrically connected to the mounting portion 21A of the first lead 20A by the wire 60. As shown in FIG. The mounting position of the protective element 90 is not limited to the above, and may be mounted on the mounting portion 21A of the first lead 20A.
For example, when a reverse voltage is applied to the light emitting element 40, the protection element 90 blocks current flowing in the reverse direction, and when a forward voltage higher than the operating voltage of the light emitting element 40 is applied, In addition, it prevents overcurrent from flowing through the light emitting element 40 . The protective element 90 may be a protective circuit or an electrostatic protective element, and specifically, a Zener diode can be used.

＜発光装置の製造方法＞
次に、第１実施形態に係る発光装置の２つの製造方法について説明する。
（第１の製造方法）
図６は、第１実施形態に係る発光装置の第１の製造方法の流れを示すフローチャートである。図７Ａは、図２のＶＩＩＡ－ＶＩＩＡ線における断面図であって、第１実施形態に係る発光装置の第１の製造方法の製造工程において発光素子を載置した基体を模式的に示す断面図である。図７Ｂは、図３のＶＩＩＢ－ＶＩＩＢ線における断面図であって、第１実施形態に係る発光装置の第１の製造方法の製造工程において第１部材を設けた基体を模式的に示す断面図である。図７Ｃは、図４のＶＩＩＣ－ＶＩＩＣ線における断面図であって、第１実施形態に係る発光装置の第１の製造方法の製造工程において枠体を設けた基体を模式的に示す断面図である。図７Ｄは、第１実施形態に係る発光装置の第１の製造方法の製造工程において、第２部材を設ける方法を模式的に示す断面図である。なお、図７Ａ～図７Ｃにおいては、ワイヤの記載を省略している。 <Method for manufacturing light-emitting device>
Next, two methods for manufacturing the light emitting device according to the first embodiment will be described.
(First manufacturing method)
FIG. 6 is a flow chart showing the flow of the first manufacturing method for the light emitting device according to the first embodiment. 7A is a cross-sectional view taken along line VIIA-VIIA of FIG. 2, and is a cross-sectional view schematically showing a substrate on which a light-emitting element is placed in a manufacturing process of the first manufacturing method of the light-emitting device according to the first embodiment; FIG. is. 7B is a cross-sectional view taken along line VIIB-VIIB of FIG. 3, and is a cross-sectional view schematically showing the substrate provided with the first member in the manufacturing process of the first manufacturing method of the light-emitting device according to the first embodiment; FIG. is. 7C is a cross-sectional view taken along line VIIC-VIIC of FIG. 4, and is a cross-sectional view schematically showing the base body provided with the frame in the manufacturing process of the first manufacturing method of the light-emitting device according to the first embodiment; FIG. be. 7D is a cross-sectional view schematically showing a method of providing a second member in the manufacturing process of the first manufacturing method of the light emitting device according to the first embodiment; FIG. 7A to 7C, illustration of wires is omitted.

図６、図７Ａ～図７Ｄに示すように、発光装置１０の製造方法は、第１リード２０Ａと第２リード２０Ｂとが固定部材２０Ｃにより固定された基体２０の上面に発光素子４０を載置する工程Ｓ１と、基体２０の上面に発光素子４０を囲み、固定部材２０Ｃの少なくとも一部の上面を覆うように反射材を含有する第１部材３０を設ける工程Ｓ２と、第１部材３０の内側面及び基体２０の上面に接して、断面視において基体２０からの高さが第１部材３０よりも高く、かつ、発光素子４０を囲むように基体２０の上面に枠体５０を設ける工程Ｓ３と、発光素子４０、枠体５０及び第１部材３０を覆う第２部材７０を設ける工程Ｓ４と、を含む。以下、各工程について説明する。 As shown in FIGS. 6 and 7A to 7D, the method for manufacturing the light emitting device 10 includes placing the light emitting element 40 on the upper surface of the substrate 20 to which the first lead 20A and the second lead 20B are fixed by the fixing member 20C. a step S2 of providing a first member 30 containing a reflective material so as to surround the light emitting element 40 on the upper surface of the base 20 and cover at least a part of the upper surface of the fixing member 20C; step S3 of providing a frame 50 on the upper surface of the base 20 so as to be in contact with the side surface and the upper surface of the base 20, have a higher height from the base 20 than the first member 30 in a cross-sectional view, and surround the light emitting element 40; and a step S4 of providing a second member 70 covering the light emitting element 40, the frame 50 and the first member 30. Each step will be described below.

（１）発光素子を載置する工程Ｓ１
図７Ａに示すように、発光素子を載置する工程Ｓ１は、第１リード２０Ａと第２リード２０Ｂとが固定部材２０Ｃにより固定された基体２０の上面に発光素子４０を載置する工程である。好ましくは、第１リード２０Ａの載置部２１Ａに発光素子４０を載置する。
発光素子を載置する工程Ｓ１では、２つの発光素子４０（図１Ａ参照）の基体２０への搭載は公知の方法で行い、公知の接合部材を用いて、２つの発光素子４０の素子基板４１側の下面と基体２０の上面とを接合する。次に、図１Ａに示すように、一方の発光素子４０のｎ電極４３を、ワイヤ６０を介して第１リード２０Ａに電気的に接続する。また、他方の発光素子４０のｐ電極４４を、ワイヤ６０を介して第２リード２０Ｂに電気的に接続する。さらに、一方の発光素子４０のｐ電極４４と他方の発光素子４０のｎ電極４３とをワイヤ６０を介して電気的に接続する。なお、保護素子９０を、ワイヤ６０を介して第１リード２０Ａに電気的に接続してもよい。ワイヤボンディングの方法としては、ボールボンディング、ウェッジボンディング等の公知の方法を用いてもよい。 (1) Step S1 of placing a light emitting element
As shown in FIG. 7A, the step S1 of placing the light emitting element is a step of placing the light emitting element 40 on the upper surface of the substrate 20 to which the first lead 20A and the second lead 20B are fixed by the fixing member 20C. . Preferably, the light emitting element 40 is mounted on the mounting portion 21A of the first lead 20A.
In the step S1 of mounting the light emitting elements, the two light emitting elements 40 (see FIG. 1A) are mounted on the base 20 by a known method, and the element substrates 41 of the two light emitting elements 40 are attached using a known bonding member. The bottom surface of the side and the top surface of the substrate 20 are joined. Next, as shown in FIG. 1A, the n-electrode 43 of one light-emitting element 40 is electrically connected to the first lead 20A through the wire 60. Then, as shown in FIG. Also, the p-electrode 44 of the other light-emitting element 40 is electrically connected to the second lead 20B via the wire 60 . Furthermore, the p-electrode 44 of one light-emitting element 40 and the n-electrode 43 of the other light-emitting element 40 are electrically connected via a wire 60 . Note that the protective element 90 may be electrically connected to the first lead 20A via the wire 60. FIG. As a wire bonding method, a known method such as ball bonding or wedge bonding may be used.

（２）第１部材を設ける工程Ｓ２
図７Ｂに示すように、第１部材を設ける工程Ｓ２は、基体２０の上面に反射材を含有する第１部材３０を設ける工程である。第１部材を設ける工程Ｓ２が、枠体を設ける工程Ｓ３に先立って行われるため、基体２０の上面における第１部材３０の設置エリアの確認が容易となり、第１部材３０を精度よく設けることができる。第１部材を基体２０に塗布する際、リードの位置認証が必要となるが、第１部材を設ける工程Ｓ２が枠体を設ける工程Ｓ３に先立って行われることで、リードの位置情報が少なくなるので、リードの位置認証が精度良くできる。
第１部材を設ける工程Ｓ２では、第１部材３０の母材が樹脂からなる場合、第１部材３０を、母材樹脂が未硬化の状態で、２つの発光素子４０（図１Ａ参照）を囲み、固定部材２０Ｃの少なくとも一部の上面を覆うように、基体２０の上面に公知の方法で注入、配置する。第１部材３０は、次の枠体を設ける工程Ｓ３で枠体５０と共に硬化させても良いし、枠体５０を設ける工程Ｓ３の前で硬化させてもよい。第１部材３０の未硬化状態での粘度を調整することによって、硬化状態での第１部材３０の傾斜領域３１の断面視における形状を、凸又は凹となる湾曲形状（図１Ｃ、図１Ｄ、図１Ｆ参照）、平坦形状等に調整できる。
なお、第１部材を設ける工程Ｓ２では、樹脂又はセラミックス等からなる固形物を作製し、固定部材２０Ｃの少なくとも一部の上面を覆うように基体２０の上面に配置してもよい。
また、第１部材３０の注入は、連続的に注入しても良いし、断続的に注入しても良い。断続的に注入する場合は、固定部材２０Ｃの四隅それぞれに注入するだけでも良いし、固定部材２０Ｃの四隅それぞれに注入した後、固定部材２０Ｃの四隅間を結ぶ箇所に注入して第１部材３０が上面視で環状に繋がるように注入しても良い。 (2) Step S2 of providing the first member
As shown in FIG. 7B, the step S2 of providing the first member is a step of providing the first member 30 containing a reflective material on the upper surface of the base 20 . Since the step S2 of providing the first member is performed prior to the step S3 of providing the frame, it becomes easy to confirm the installation area of the first member 30 on the upper surface of the base 20, and the first member 30 can be provided with high accuracy. can. When the first member is applied to the substrate 20, positional authentication of the leads is required. However, by performing the step S2 of providing the first member prior to the step S3 of providing the frame, positional information of the leads is reduced. Therefore, lead position authentication can be performed with high accuracy.
In the step S2 of providing the first member, when the base material of the first member 30 is made of resin, the first member 30 surrounds the two light emitting elements 40 (see FIG. 1A) while the base material resin is in an uncured state. , is injected and placed on the upper surface of the substrate 20 by a known method so as to cover at least a portion of the upper surface of the fixing member 20C. The first member 30 may be cured together with the frame body 50 in the step S3 of providing the next frame body, or may be cured before the step S3 of providing the frame body 50 . By adjusting the viscosity of the first member 30 in the uncured state, the cross-sectional shape of the inclined region 31 of the first member 30 in the cured state is changed to a convex or concave curved shape (FIGS. 1C, 1D, 1F), flat shape, etc.
In addition, in the step S2 of providing the first member, a solid material made of resin, ceramics, or the like may be prepared and placed on the upper surface of the base 20 so as to cover at least a portion of the upper surface of the fixing member 20C.
Injection of the first member 30 may be performed continuously or intermittently. In the case of intermittent injection, the first member 30 may be injected only into each of the four corners of the fixing member 20C, or after injecting into each of the four corners of the fixing member 20C, the first member 30 is injected into a portion connecting the four corners of the fixing member 20C. may be injected so as to be connected in a ring when viewed from above.

（３）枠体を設ける工程Ｓ３
図７Ｃに示すように、枠体を設ける工程Ｓ３は、基体２０の上面に枠体５０を設ける工程である。枠体を設ける工程Ｓ３では、枠体５０を、母材樹脂が未硬化状態で、第１部材３０の内側面及び基体２０の上面に接して、断面視において基体２０からの高さが第１部材３０より高く、かつ、２つの発光素子４０（図１Ａ参照）を囲むように基体２０の上面に注入、配置し、硬化させる。なお、図７Ｃでは、枠体５０は、枠体５０の外側面の下端が第１部材３０の上端に接するように設けられているが、枠体５０の外側面の下端が第１部材３０の上端より外側の外側面で接する（傾斜領域３１と接する）ように設けることもできるし、枠体５０の外側面の下端が第１部材３０の上端より内側の内側面で接するように設けることもできる。枠体５０が、枠体５０の外側面の下端が第１部材３０の上端より外側の外側面で接するように設ける場合、第１部材３０と枠体５０の接触面積が増え、第１部材３０と枠体５０の密着性が向上する。 (3) Step S3 of providing a frame
As shown in FIG. 7C, the step S3 of providing a frame is a step of providing a frame 50 on the upper surface of the base 20 . In the step S3 of providing the frame, the frame 50 is placed in contact with the inner surface of the first member 30 and the upper surface of the base 20 while the base material resin is in an uncured state so that the height from the base 20 in a cross-sectional view is the first. It is injected, placed and cured on the upper surface of the substrate 20 so as to be higher than the member 30 and surround the two light emitting elements 40 (see FIG. 1A). Note that in FIG. 7C , the frame 50 is provided so that the lower end of the outer surface of the frame 50 contacts the upper end of the first member 30 , but the lower end of the outer surface of the frame 50 contacts the upper end of the first member 30 . It can be provided so as to contact with the outer surface outside the upper end (in contact with the inclined region 31), or it can be provided so that the lower end of the outer surface of the frame 50 contacts with the inner surface inside the upper end of the first member 30. can. When the frame 50 is provided so that the lower end of the outer surface of the frame 50 is in contact with the outer surface outside the upper end of the first member 30, the contact area between the first member 30 and the frame 50 increases, and the first member 30 and the adhesion of the frame 50 is improved.

（４）第２部材を設ける工程Ｓ４
図７Ｄに示すように、第２部材を設ける工程Ｓ４は、発光素子４０、枠体５０及び第１部材３０を覆う第２部材７０を設ける工程である。また、第２部材を設ける工程Ｓ４では、第２部材７０を、第１部材３０の外側において第１リード２０Ａと第２リード２０Ｂのそれぞれ少なくとも一部を覆うように設けてもよい。 (4) Step S4 of providing a second member
As shown in FIG. 7D, the step S4 of providing the second member is a step of providing the second member 70 covering the light emitting element 40, the frame 50 and the first member 30. As shown in FIG. In step S4 of providing the second member, the second member 70 may be provided outside the first member 30 so as to cover at least part of each of the first lead 20A and the second lead 20B.

第２部材を設ける工程Ｓ４は、例えばトランスファー成形により第２部材７０を設けることが好ましい。トランスファー成形では、まず、基体２０の上面に、第２部材７０の形状、例えばレンズ部７１と鍔部７２とに対応した形状の空洞部分を有する上金型１０１を、当該空洞部分が発光素子４０、枠体５０及び第１部材３０を覆うように配置する。次に、下金型１０２を、発光素子４０、枠体５０及び第１部材３０が設けられていない基体２０の下面を覆うように配置する。このように配置された状態においては、上金型１０１のレンズ部７１に対応する空洞部分の縁部は、枠体５０の外側に配置され、枠体５０は上金型１０１の空洞部分表面に接触しないことが好ましい。その後、この空洞部分に、注入口１０１ａから第２部材７０を構成する未硬化の樹脂又はガラスを流し込み、これを硬化させる。これによって、基体２０の上面に、発光素子４０、枠体５０及び第１部材３０を覆う第２部材７０が設けられる。また、第１部材３０の外側において第１リード２０Ａと第２リード２０Ｂのそれぞれ少なくとも一部を覆う第２部材７０も設けてもよい。 In step S4 of providing the second member, the second member 70 is preferably provided by, for example, transfer molding. In transfer molding, first, an upper mold 101 having a hollow portion having a shape corresponding to the shape of the second member 70 , for example, the lens portion 71 and the flange portion 72 , is placed on the upper surface of the base 20 . , so as to cover the frame 50 and the first member 30 . Next, the lower mold 102 is arranged so as to cover the lower surface of the base 20 where the light emitting element 40, the frame 50 and the first member 30 are not provided. In this arrangement, the edge of the hollow portion corresponding to the lens portion 71 of the upper mold 101 is arranged outside the frame 50 , and the frame 50 is placed on the surface of the hollow portion of the upper mold 101 . No contact is preferred. After that, an uncured resin or glass constituting the second member 70 is poured into this hollow portion from the injection port 101a and cured. Thereby, the second member 70 covering the light emitting element 40 , the frame 50 and the first member 30 is provided on the upper surface of the base 20 . Also, a second member 70 covering at least a part of each of the first lead 20A and the second lead 20B outside the first member 30 may be provided.

（第２の製造方法）
図８は、第１実施形態に係る発光装置の第２の製造方法の流れを示すフローチャートである。図９Ａは、第１実施形態に係る発光装置の第２の製造方法の製造工程において枠体を設けた基体を模式的に示す断面図である。図９Ｂは、第１実施形態に係る発光装置の第２の製造方法の製造工程において第１部材を設けた基体を模式的に示す断面図である。なお、図９Ａ、図９Ｂにおいては、ワイヤの記載を省略している。 (Second manufacturing method)
FIG. 8 is a flow chart showing the flow of the second method for manufacturing the light emitting device according to the first embodiment. 9A is a cross-sectional view schematically showing a base provided with a frame in a manufacturing process of a second manufacturing method for a light emitting device according to Embodiment 1. FIG. 9B is a cross-sectional view schematically showing the base on which the first member is provided in the manufacturing process of the second manufacturing method of the light emitting device according to the first embodiment; FIG. It should be noted that wires are omitted in FIGS. 9A and 9B.

第１実施形態に係る発光装置の第２の製造方法は、枠体を設ける工程Ｓ３を、第１部材を設ける工程Ｓ２に先立って行うこと以外は、前記した第１の製造方法（図６参照）と同様である。
図９Ａに示すように、枠体を設ける工程Ｓ３では、枠体５０を、母材樹脂が未硬化状態で、発光素子４０を囲むように基体２０の上面に注入、配置する。枠体５０の硬化は、第１部材を設ける工程Ｓ２の前で行うのが好ましい。これにより、枠体５０の形状が第１部材３０の形成時に変化せず、所定の形状を維持することができる。枠体５０の母材樹脂を未硬化状態で、固定部材２０Ｃと第１リード２０Ａとの境界上に注入、配置することができる。
図９Ｂに示すように、第１部材を設ける工程Ｓ２では、反射材を含有する第１部材３０を、母材樹脂が未硬化状態で、枠体５０の外側面及び基体２０の上面に接して、枠体５０の外周側に露出した固定部材２０Ｃの少なくとも一部の上面を覆い、かつ、断面視において基体２０からの高さが枠体５０よりも低くなるように注入、配置する。第１部材３０の粘度を調整することによって、第１部材３０の傾斜領域３１の断面視における形状を、基体２０からの高さが枠体５０に近づくにつれて高くなり、凸又は凹となる湾曲形状（図１Ｅ、図１Ｇ参照）、平坦形状等に調整できる。
第１部材を設ける工程Ｓ２を、枠体を設ける工程Ｓ３を行った後に行う場合は、第１部材３０の傾斜領域３１の断面視における形状を制御し易い。その結果、第１部材３０の形状制御によって、発光装置１０の配光性が制御できる。さらに、第１部材３０を塗布する量を最小限に抑えることができ、製造効率が向上する。 The second manufacturing method of the light emitting device according to the first embodiment is the same as the first manufacturing method (see FIG. 6) except that the step S3 of providing the frame body is performed prior to the step S2 of providing the first member. ).
As shown in FIG. 9A, in step S3 of providing the frame, the frame 50 is injected and placed on the upper surface of the base 20 so as to surround the light emitting element 40 while the base material resin is in an uncured state. Curing of the frame 50 is preferably performed before step S2 of providing the first member. Thereby, the shape of the frame 50 does not change when the first member 30 is formed, and a predetermined shape can be maintained. The base material resin of the frame 50 can be injected and arranged in an uncured state on the boundary between the fixing member 20C and the first lead 20A.
As shown in FIG. 9B, in step S2 of providing the first member, the first member 30 containing the reflective material is placed in contact with the outer surface of the frame 50 and the upper surface of the base 20 while the base material resin is in an uncured state. , the upper surface of at least a portion of the fixing member 20C exposed on the outer peripheral side of the frame 50 is covered, and the height from the base 20 is lower than that of the frame 50 in a cross-sectional view. By adjusting the viscosity of the first member 30, the cross-sectional shape of the inclined region 31 of the first member 30 increases as the height from the base 20 approaches the frame 50, and becomes a curved shape that becomes convex or concave. (See FIGS. 1E and 1G), and can be adjusted to a flat shape or the like.
When the step S2 of providing the first member is performed after the step S3 of providing the frame, it is easy to control the shape of the inclined region 31 of the first member 30 in a cross-sectional view. As a result, the light distribution of the light emitting device 10 can be controlled by controlling the shape of the first member 30 . Furthermore, the amount of the first member 30 to be applied can be minimized, improving manufacturing efficiency.

［第２実施形態］
＜発光装置＞
はじめに、第２実施形態に係る発光装置ついて説明する。図１０は、第２実施形態に係る発光装置の構成を模式的に示す断面図である。なお、第１実施形態に係る発光装置と同一構成については、同一符号を付して、説明を省略する。 [Second embodiment]
<Light emitting device>
First, a light emitting device according to the second embodiment will be described. FIG. 10 is a cross-sectional view schematically showing the configuration of the light emitting device according to the second embodiment. Note that the same reference numerals are given to the same configurations as those of the light emitting device according to the first embodiment, and the description thereof is omitted.

図１０に示すように、発光装置１０Ａは、前記発光装置１０と同一構成に加えて、枠体５０の内側に設けられ、発光素子４０を覆う第３部材８０をさらに備える。そして、第２部材７０は、発光素子４０、第３部材８０、枠体５０及び第１部材３０を覆う。また、発光装置１０Ａは、第３部材８０が蛍光体を含有することが好ましい。
第３部材８０を備えることにより、発光装置１０Ａへ外部から塵埃等が混入することをより抑制でき、また、ワイヤ６０を保護することができ、信頼性が向上する。第３部材８０が蛍光体を含有することにより、発光素子４０から出射された光の波長を変換できるため、取出し光の色調を調整できる。また、蛍光体で波長変換された光は無指向で全方向に光放射されるため、レンズ部７１から戻されて枠体５０の外周側に露出する固定部材２０Ｃに当たる光も増加する。固定部材２０Ｃの上面は第１部材３０で覆われ、レンズ部７１から戻された光は第１部材３０で上方および側方に反射されて取出し光となる。その結果、発光装置１０Ａにおける光取出し性及び配光性が向上する。 As shown in FIG. 10, the light emitting device 10A further includes a third member 80 provided inside the frame 50 and covering the light emitting element 40, in addition to the same configuration as the light emitting device 10 described above. The second member 70 covers the light emitting element 40 , the third member 80 , the frame 50 and the first member 30 . Also, in the light emitting device 10A, the third member 80 preferably contains a phosphor.
By providing the third member 80, it is possible to further suppress dust and the like from entering the light emitting device 10A from the outside, protect the wire 60, and improve reliability. Since the third member 80 contains the phosphor, the wavelength of the light emitted from the light emitting element 40 can be converted, so that the color tone of the extracted light can be adjusted. In addition, since the light wavelength-converted by the phosphor is omnidirectionally emitted in all directions, the amount of light returned from the lens portion 71 and striking the fixing member 20C exposed on the outer peripheral side of the frame 50 also increases. The upper surface of the fixed member 20C is covered with the first member 30, and the light returned from the lens portion 71 is reflected upward and sideways by the first member 30 to become extracted light. As a result, the light extraction property and light distribution property of the light emitting device 10A are improved.

（第３部材８０）
第３部材８０は、発光素子４０を覆い、発光素子４０を枠体５０の内側に封入する部材である。第３部材は、図１０に示すように断面視において枠体５０の高さを越え、発光素子４０の直上が高くなるように中央が上に向かって湾曲して枠体５０の内側面と接するように設けられても良いし、枠体５０の高さを超えない高さで枠体５０の内側面に接するように設けられても良い。前者の場合は、第３部材８０と第２部材７０の界面に生じる反射光を抑制する効果が得られる。
第３部材８０を構成する材料としては、透光性を有する樹脂又はガラス等を用いることができる。特に、第３部材８０に樹脂を用いることが好ましい。第１部材３０及び枠体５０の母材がそれぞれ樹脂である場合は、第３部材８０も樹脂であることで、第３部材８０と第１部材３０との密着性、及び、第３部材８０と枠体５０との密着性を向上させることができる。第３部材８０の樹脂としては、ポリカーボネート樹脂、エポキシ樹脂、フェノール樹脂、シリコーン樹脂、アクリル樹脂、ポリメチルペンテン樹脂、ポリノルボルネン樹脂、又はこれらの変性樹脂やこれらの樹脂を１種以上含むハイブリッド樹脂等を用いることができる。特に、第３部材８０の材料としては耐光性に優れたジメチル系シリコーン樹脂、フェニル系シリコーン樹脂が好ましい。第３部材８０は、蛍光体を含むことが好ましく、光拡散剤を含んでもよい。また、第３部材８０が蛍光体を含有する場合には、第３部材８０の上面形状は、発光効率を考慮して、蛍光体と発光素子４０との距離が近くなるように中央が下に向かって湾曲する形状が好ましい。 (Third member 80)
The third member 80 is a member that covers the light emitting element 40 and encloses the light emitting element 40 inside the frame 50 . As shown in FIG. 10, the third member exceeds the height of the frame 50 in a cross-sectional view, and the center is curved upward so that the area directly above the light emitting element 40 is higher and contacts the inner surface of the frame 50. , or may be provided so as to be in contact with the inner surface of the frame 50 at a height not exceeding the height of the frame 50 . In the former case, the effect of suppressing reflected light generated at the interface between the third member 80 and the second member 70 is obtained.
As a material forming the third member 80, translucent resin, glass, or the like can be used. In particular, it is preferable to use resin for the third member 80 . When the base materials of the first member 30 and the frame body 50 are each made of resin, the third member 80 is also made of resin. and the frame body 50 can be improved. The resin of the third member 80 includes polycarbonate resin, epoxy resin, phenol resin, silicone resin, acrylic resin, polymethylpentene resin, polynorbornene resin, modified resins thereof, hybrid resins containing one or more of these resins, and the like. can be used. In particular, as the material of the third member 80, dimethyl-based silicone resin and phenyl-based silicone resin, which are excellent in light resistance, are preferable. The third member 80 preferably contains a phosphor and may contain a light diffusing agent. Further, when the third member 80 contains a phosphor, the upper surface shape of the third member 80 is designed so that the distance between the phosphor and the light-emitting element 40 is close, with the center downward, in consideration of the luminous efficiency. A curved shape is preferred.

（蛍光体）
蛍光体としては、発光素子４０からの発光で励起して、発光素子４０から出射あるいは第１部材３０で反射した光の波長を変換可能な蛍光体の粒子が使用される。例えば、青色発光素子又は紫外線発光素子で励起可能な蛍光体としては、セリウムで賦活されたイットリウム・アルミニウム・ガーネット系蛍光体（ＹＡＧ：Ｃｅ）、セリウムで賦活されたルテチウム・アルミニウム・ガーネット系蛍光体（ＬＡＧ：Ｃｅ）、ユウロピウムおよび／又はクロムで賦活された窒素含有アルミノ珪酸カルシウム系蛍光体（ＣａＯ－Ａｌ２Ｏ３－ＳｉＯ２：Ｅｕ，Ｃｒ）、ユウロピウムで賦活されたシリケート系蛍光体（（Ｓｒ，Ｂａ）２ＳｉＯ４：Ｅｕ）、βサイアロン蛍光体、ＣＡＳＮ系蛍光体、ＳＣＡＳＮ系蛍光体等の室化物系蛍光体；ＫＳＦ系蛍光体等のフッ化物系蛍光体、硫化物系蛍光体、塩化物系蛍光体、ケイ酸塩系蛍光体、リン酸塩系蛍光体、量子ドット蛍光体などが挙げられる。これらの蛍光体と、青色発光素子又は紫外線発光素子と組み合わせることにより、様々な波長の発光装置１０を製造することができる。 (Phosphor)
As the phosphor, phosphor particles that can convert the wavelength of the light emitted from the light emitting element 40 or reflected by the first member 30 by being excited by the light emitted from the light emitting element 40 are used. For example, phosphors that can be excited by a blue light emitting device or an ultraviolet light emitting device include a cerium-activated yttrium aluminum garnet phosphor (YAG:Ce), a cerium activated lutetium aluminum garnet phosphor. (LAG:Ce), nitrogen-containing calcium aluminosilicate phosphor activated with europium and/or chromium (CaO—Al 2 O 3 —SiO 2 :Eu, Cr), silicate phosphor activated with europium (( Sr, Ba) 2 SiO 4 :Eu), β-SiAlON phosphors, CASN phosphors, SCASN phosphors, and other room compound phosphors; KSF phosphors, and other fluoride phosphors, sulfide phosphors , chloride-based phosphors, silicate-based phosphors, phosphate-based phosphors, quantum dot phosphors, and the like. By combining these phosphors with blue light emitting elements or ultraviolet light emitting elements, light emitting devices 10 with various wavelengths can be manufactured.

（光拡散剤）
光拡散剤の材料として、酸化チタン、酸化ジルコニウム、酸化アルミニウム、酸化ケイ素などを用いることができる。特に、酸化チタンは、水分などに対して比較的安定でかつ高屈折率であるため好ましい。 (light diffusing agent)
Titanium oxide, zirconium oxide, aluminum oxide, silicon oxide, or the like can be used as the material of the light diffusing agent. In particular, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index.

＜発光装置の製造方法＞
次に、第２実施形態に係る発光装置の２つの製造方法について説明する。図１１は、第２実施形態に係る発光装置の第１の製造方法の流れを示すフローチャートである。図１２は、第２実施形態に係る発光装置の第２の製造方法の流れを示すフローチャートである。なお、第１実施形態に係る発光装置の製造方法と同一工程については、同一符号を付して、説明を省略する。 <Method for manufacturing light-emitting device>
Next, two methods for manufacturing the light emitting device according to the second embodiment will be described. FIG. 11 is a flow chart showing the flow of the first manufacturing method for the light emitting device according to the second embodiment. FIG. 12 is a flow chart showing the flow of the second manufacturing method for the light emitting device according to the second embodiment. The same steps as in the method of manufacturing the light emitting device according to the first embodiment are denoted by the same reference numerals, and descriptions thereof are omitted.

（第１の製造方法）
図１１に示すように、発光装置１０Ａの第１の製造方法は、発光装置１０の製造方法（図６参照）と同一工程に加えて、枠体を設ける工程Ｓ４の後に、第３部材を設ける工程Ｓ５をさらに含む。
発光装置１０Ａの第１の製造方法では、第１部材３０の傾斜領域３１は、断面視において基体２０の上方に向かって凸となる湾曲形状（図１Ｃ、図１Ｄ参照）や断面視において枠体５０の下端に向かって凹となる湾曲形状（図１Ｆ参照）等となる。また、第２部材を設ける工程Ｓ４では、発光素子４０、第３部材８０、枠体５０及び第１部材３０を覆う第２部材７０を設けることとする。
発光装置１０Ａの第１の製造方法では、第３部材を設ける工程Ｓ５を含むことにより、発光装置１０Ａの信頼性、及び、取出し光の色調性が向上する。 (First manufacturing method)
As shown in FIG. 11, in the first method for manufacturing the light emitting device 10A, in addition to the same steps as the method for manufacturing the light emitting device 10 (see FIG. 6), the third member is provided after the step S4 of providing the frame. Further includes step S5.
In the first method for manufacturing the light-emitting device 10A, the inclined region 31 of the first member 30 has a curved shape (see FIGS. 1C and 1D) that protrudes upward from the base 20 in a cross-sectional view, or a frame shape in a cross-sectional view. It has a curved shape that becomes concave toward the lower end of 50 (see FIG. 1F), or the like. In step S4 of providing the second member, the second member 70 covering the light emitting element 40, the third member 80, the frame 50 and the first member 30 is provided.
In the first manufacturing method of the light emitting device 10A, including the step S5 of providing the third member improves the reliability of the light emitting device 10A and the color tone of the extracted light.

（１）第３部材を設ける工程Ｓ５
第３部材を設ける工程Ｓ５は、枠体５０の内側に発光素子４０を覆う第３部材８０を設ける工程である。第３部材８０を設ける方法は、ポッティングやスプレー等の公知の方法によって行う。
第３部材８０は、発光素子４０の直上が高くなるように中央が上に向かって湾曲するように形成することとして説明したが、一様に同じ高さとなるように形成してもよいし、中央が下に向かって湾曲するように形成してもよい。 (1) Step S5 of providing a third member
The step S<b>5 of providing the third member is a step of providing the third member 80 covering the light emitting element 40 inside the frame 50 . The third member 80 is provided by a known method such as potting or spraying.
Although the third member 80 has been described as being curved upward at the center so that the height directly above the light emitting element 40 is higher, the third member 80 may be formed to have the same height uniformly. You may form so that the center may curve downward.

第１部材３０を枠体５０に先立って製造する第１の製造方法では、上面視において基体２０が矩形で、枠体５０が円環であり、第１部材３０が枠体５０の外周に沿って全周に連続的に設けられた発光装置１０Ａを製造する際は、第１部材を設ける工程Ｓ２を、以下の手順で行うことが好ましい。
第１部材を設ける工程Ｓ２における第１部材３０の注入量を、枠体５０の外側に露出した固定部材２０Ｃの四隅の位置で多く、四隅以外の位置で少なくすることが好ましい。これにより、枠体を設ける工程Ｓ３では、第１部材３０と接する枠体５０の上端が全周において波打つように変化し、枠体５０の高さが不均一な構成となる。そして、第２部材を設ける工程Ｓ４は、枠体５０の高さが不均一であるため、枠体５０の高さが均一な場合と比較して、枠体５０と第２部材７０との接触面積が増加し、枠体５０と第２部材７０との密着性が向上する。 In the first manufacturing method in which the first member 30 is manufactured prior to the frame 50, the base 20 is rectangular in top view, the frame 50 is ring-shaped, and the first member 30 is formed along the outer periphery of the frame 50. When manufacturing the light-emitting device 10A continuously provided on the entire periphery, it is preferable to perform the step S2 of providing the first member according to the following procedure.
It is preferable that the injection amount of the first member 30 in the step S2 of providing the first member is large at the four corner positions of the fixing member 20C exposed to the outside of the frame 50 and small at positions other than the four corners. As a result, in the step S3 of providing the frame, the upper end of the frame 50 in contact with the first member 30 undulates over the entire circumference, and the height of the frame 50 becomes uneven. In step S4 of providing the second member, since the height of the frame 50 is uneven, the contact between the frame 50 and the second member 70 is less than when the height of the frame 50 is uniform. The area is increased, and the adhesion between the frame 50 and the second member 70 is improved.

（第２の製造方法）
図１２に示すように、発光装置１０Ａの第２の製造方法は、発光装置１０の第２の製造方法（図８参照）と同一工程に加えて、第１部材を設ける工程Ｓ２の後に、第３部材を設ける工程Ｓ５をさらに含む。そして、発光装置１０Ａの第２の製造方法では、第１部材３０の傾斜領域３１は、断面視において枠体５０の下端に向かって凹となる湾曲形状（図１Ｇ参照）や断面視において凸となる湾曲形状（図１Ｅ参照）等にすることができる。また、第２部材を設ける工程Ｓ４では、発光素子４０、第３部材８０、枠体５０及び第１部材３０を覆う第２部材７０を設けるものとする。
発光装置１０Ａの第２の製造方法では、第３部材を設ける工程Ｓ５を含むことにより、発光装置１０Ａの信頼性、及び、取出し光の色調性が向上する。 (Second manufacturing method)
As shown in FIG. 12, in the second manufacturing method of the light emitting device 10A, in addition to the same steps as the second manufacturing method of the light emitting device 10 (see FIG. 8), after the step S2 of providing the first member, a second A step S5 of providing three members is further included. In the second method for manufacturing the light emitting device 10A, the inclined region 31 of the first member 30 has a curved shape that is concave toward the lower end of the frame 50 in cross-section (see FIG. 1G) or a convex shape in cross-section. A curved shape (see FIG. 1E) or the like can be used. In step S4 of providing the second member, the second member 70 covering the light emitting element 40, the third member 80, the frame 50 and the first member 30 is provided.
In the second manufacturing method of the light emitting device 10A, including the step S5 of providing the third member improves the reliability of the light emitting device 10A and the color tone of the extracted light.

前記した実施形態では、発明を実施するための形態をより具体的に説明したが、本発明の趣旨はこれらの記載に限定されるものではなく、特許請求の範囲の記載に基づいて広く解釈されなければならない。また、これらの記載に基づいて種々変更、改変などしたものも本発明の趣旨に含まれることはいうまでもない。 In the above-described embodiments, the modes for carrying out the invention have been described more specifically, but the spirit of the invention is not limited to these descriptions, and can be broadly interpreted based on the description of the scope of claims. There must be. In addition, it goes without saying that various changes and modifications based on these descriptions are also included in the gist of the present invention.

１０ 発光装置
１０Ａ 発光装置
１１ 発光装置
２０ 基体
２０Ａ 第１リード
２１Ａ 載置部
２１Ａ１ 第１辺
２１Ａ２ 第２辺
２１Ａ３ 第３辺
２１Ａ４ 第４辺
２１Ａ５ 第５辺
２１Ａ６ 第６辺
２１Ａ７ 第７辺
２１Ａ８ 第８辺
２２Ａ 接続部
２３Ａ 端子部
２０Ｂ 第２リード
２０Ｃ 固定部材
３０ 第１部材
３１ 傾斜領域
４０ 発光素子
４１ 素子基板
４２ 半導体層
４３ ｎ電極
４４ ｐ電極
５０ 枠体
６０ ワイヤ
７０ 第２部材
７１ レンズ部
７２ 鍔部
８０ 第３部材
９０ 保護素子
Ｃ 中央点
Ｕ 上端
Ｌ１ 光
Ｌ２ 光
Ｌ３ 反射光
Ｌ４ 反射光
Ｌ５ 反射光
Ｙ１ 垂線
Ｙ２ 垂線
Ｓ１ 工程
Ｓ２ 工程
Ｓ３ 工程
Ｓ４ 工程
Ｓ５ 工程 10 Light-emitting device 10A Light-emitting device 11 Light-emitting device 20 Substrate 20A First lead 21A Mounting portion 21A1 First side 21A2 Second side 21A3 Third side 21A4 Fourth side 21A5 Fifth side 21A6 Sixth side 21A7 Seventh side 21A8 Eighth Side 22A Connection portion 23A Terminal portion 20B Second lead 20C Fixing member 30 First member 31 Inclined region 40 Light emitting element 41 Element substrate 42 Semiconductor layer 43 n-electrode 44 p-electrode 50 Frame 60 Wire 70 Second member 71 Lens portion 72 Flange Part 80 Third member 90 Protective element C Center point U Upper end L1 Light L2 Light L3 Reflected light L4 Reflected light L5 Reflected light Y1 Perpendicular line Y2 Perpendicular line S1 Step S2 Step S3 Step S4 Step S5 Step

Claims (14)

第１リードと、第２リードと、前記第１リードと前記第２リードを固定する固定部材と、を有する基体と、
前記基体の上面に載置された発光素子と、
前記発光素子を囲むように、前記基体の上面に設けられた枠体と、
上面視において前記枠体の外周側に露出した前記固定部材の少なくとも一部の上面を覆い、かつ、前記枠体の下に互いに離隔して断続的に配置され、反射材を含有する複数の第１部材と、
前記発光素子、前記枠体及び前記第１部材を覆う第２部材と、を備え、
前記第１部材は、断面視において前記枠体から露出する外側面に傾斜領域を有し、
前記枠体は、前記第１部材が配置された領域と、前記第１部材が配置されていない領域とで高さが異なる発光装置。 a base having a first lead, a second lead, and a fixing member fixing the first lead and the second lead;
a light emitting element mounted on the upper surface of the base;
a frame provided on the upper surface of the base so as to surround the light emitting element;
A plurality of second electrodes that cover an upper surface of at least a portion of the fixing member exposed on the outer peripheral side of the frame when viewed from the top, are intermittently arranged under the frame while being separated from each other , and contain a reflective material. 1 member;
A second member that covers the light emitting element, the frame and the first member,
The first member has an inclined region on the outer surface exposed from the frame in a cross-sectional view,
In the light emitting device, the frame body has a region where the first member is arranged and a region where the first member is not arranged. 前記第１部材の母材は、樹脂である請求項１に記載の発光装置。 The light emitting device according to claim 1, wherein the base material of the first member is resin. 前記枠体の内側に設けられ、前記発光素子を覆う第３部材をさらに備え、
前記第２部材は、前記発光素子、前記第３部材、前記枠体及び前記第１部材を覆う請求項１又は請求項２に記載の発光装置。 Further comprising a third member provided inside the frame and covering the light emitting element,
3. The light emitting device according to claim 1, wherein the second member covers the light emitting element, the third member, the frame and the first member. 前記第３部材は、蛍光体を含有する請求項３に記載の発光装置。 The light emitting device according to claim 3, wherein the third member contains phosphor. 前記枠体は、前記固定部材と前記第１リードとの境界上に設けられている請求項１乃至請求項４のいずれか一項に記載の発光装置。 The light emitting device according to any one of claims 1 to 4, wherein the frame is provided on a boundary between the fixing member and the first lead. 前記傾斜領域は、断面視において凸となる湾曲形状である請求項１乃至請求項５のいずれか一項に記載の発光装置。 The light-emitting device according to any one of claims 1 to 5, wherein the inclined region has a curved shape that is convex in a cross-sectional view. 前記傾斜領域は、断面視において凸となる湾曲形状であり、前記第１部材の上端が、前記枠体側に位置し、かつ、前記枠体と接しない請求項１乃至請求項５のいずれか一項に記載の発光装置。 6. The inclined region according to any one of claims 1 to 5, wherein the inclined region has a curved shape that is convex in a cross-sectional view, and the upper end of the first member is located on the frame body side and does not contact the frame body. 11. The light-emitting device according to Item 1. 前記傾斜領域は、断面視において前記枠体の下端に向かって凹となる湾曲形状である請求項１乃至請求項５のいずれか一項に記載の発光装置。 The light-emitting device according to any one of claims 1 to 5, wherein the inclined region has a curved shape that is concave toward the lower end of the frame in a cross-sectional view. 前記基体は上面視形状が矩形であり、前記第１部材は、前記枠体の外周側に露出した前記固定部材の少なくとも４隅の位置に設けられる請求項１乃至請求項８のいずれか一項に記載の発光装置。 9. The base body has a rectangular top view shape, and the first members are provided at positions of at least four corners of the fixing member exposed on the outer peripheral side of the frame. The light-emitting device according to . 前記反射材は、酸化チタンである請求項１乃至請求項９のいずれか一項に記載の発光装置。 10. The light-emitting device according to claim 1, wherein said reflector is titanium oxide. 前記枠体と前記第１部材とは、同一材料の母材樹脂を含有する請求項１乃至請求項１０のいずれか一項に記載の発光装置。 The light-emitting device according to any one of claims 1 to 10, wherein the frame and the first member contain base material resin of the same material. 前記第２部材は、透光性材料からなり、前記発光素子の上方に設けられたレンズ部と、前記第１部材の上方に位置するように前記レンズ部の下部から外側に延びる鍔部と、を有する請求項１乃至請求項１１のいずれか一項に記載の発光装置。 The second member is made of a translucent material, and includes a lens portion provided above the light emitting element, a flange portion extending outward from a lower portion of the lens portion so as to be positioned above the first member, 12. The light-emitting device according to any one of claims 1 to 11. 第１リードと第２リードとが固定部材により固定された基体の上面に発光素子を載置する工程と、
前記基体の上面に互いに離隔して前記発光素子を断続的に囲み、前記固定部材の少なくとも一部の上面を覆うように反射材を含有する複数の第１部材を設ける工程と、
前記第１部材の内側面及び前記基体の上面に接して、かつ、前記発光素子を囲むように前記基体の上面に枠体を設ける工程と、
前記発光素子、前記枠体及び前記第１部材を覆う第２部材を設ける工程と、を含み、
前記枠体を設ける工程は、前記第１部材が配置された領域と、前記第１部材が配置されていない領域とで前記枠体の高さを変えている発光装置の製造方法。 placing the light emitting element on the upper surface of the substrate to which the first lead and the second lead are fixed by the fixing member;
providing a plurality of first members spaced apart from each other on the upper surface of the base body intermittently surrounding the light emitting element and containing a reflective material so as to cover at least a portion of the upper surface of the fixing member;
providing a frame on the upper surface of the base so as to be in contact with the inner surface of the first member and the upper surface of the base and surround the light emitting element;
providing a second member that covers the light emitting element, the frame, and the first member;
In the step of providing the frame, the height of the frame is changed between the area where the first member is arranged and the area where the first member is not arranged. 前記枠体を設ける工程の後に、前記枠体の内側に、前記発光素子を覆う第３部材を設ける工程をさらに含み、
前記第２部材を設ける工程では、前記発光素子、前記第３部材、前記枠体及び前記第１部材を覆う前記第２部材を設ける請求項１３に記載の発光装置の製造方法。 After the step of providing the frame, further comprising providing a third member that covers the light emitting element inside the frame,
14. The method of manufacturing a light emitting device according to claim 13, wherein in the step of providing the second member, the second member covering the light emitting element, the third member, the frame and the first member is provided.
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