JP2018181947A - Light emitting device - Google Patents

Light emitting device Download PDF

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JP2018181947A
JP2018181947A JP2017075722A JP2017075722A JP2018181947A JP 2018181947 A JP2018181947 A JP 2018181947A JP 2017075722 A JP2017075722 A JP 2017075722A JP 2017075722 A JP2017075722 A JP 2017075722A JP 2018181947 A JP2018181947 A JP 2018181947A
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light emitting
emitting element
light
insulating member
emitting device
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JP7177327B2 (en
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岡田　聡
Satoshi Okada
岡田　　聡
祐太 岡
Yuta Oka
祐太 岡
奈実 阿部
Nami Abe
奈実 阿部
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Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device with improved light extraction efficiency.SOLUTION: A light emitting device includes a conductive support member including a first surface, a projection that is located outside the first surface and higher than the first surface, and a second surface that is located outside the projection and higher than the projection, a light emitting element mounted on the first surface, a first insulating member mounted on the second surface, a wire mounted on the first insulating member, and a resin frame that surrounds the first surface in a plan view and covers at least a part of the first insulating member, and the projection is located on a straight line that connects the light emitting element and the first insulating member.SELECTED DRAWING: Figure 1A

Description

本発明は、発光装置に関する。   The present invention relates to a light emitting device.

特許文献１には、支持体に搭載した発光素子から発する発光と反射光を通過させる貫通孔を有する配線板と、この配線板の下に発光素子を搭載する金属板とを張り合わせた発光装置が開示されている。   Patent Document 1 discloses a light emitting device in which a wiring board having through holes through which light emitted from a light emitting element mounted on a support and reflected light pass and a metal plate mounting the light emitting element under the wiring board are bonded. It is disclosed.

特開２００７−１０９７０１号JP 2007-109701

しかしながら、上記の発光装置は、発光素子から発する光が配線板の貫通孔の壁面に吸収され発光装置の光取り出し効率が低下するおそれがある。
本発明は、光取り出し効率を向上させた発光装置を提供することを目的とする。 However, in the light emitting device described above, light emitted from the light emitting element may be absorbed by the wall surface of the through hole of the wiring board, and the light extraction efficiency of the light emitting device may be reduced.
An object of the present invention is to provide a light emitting device with improved light extraction efficiency.

本発明の一態様に係る発光装置は、第１面と、前記第１面よりも外側にあり且つ前記第１面よりも高さの高い凸部と、前記凸部よりも外側にあり且つ前記凸部よりも高さの低い第２面と、を有する導電性の支持部材と、前記第１面上に載置される発光素子と、前記第２面上に載置される第１絶縁性部材と、前記第１絶縁性部材上に載置される配線と、平面視において前記第１面を囲み、前記第１絶縁性部材の少なくとも一部を被覆する樹脂枠と、を備え、前記発光素子と前記第１絶縁性部材とを結ぶ直線上に前記凸部が位置する。   A light emitting device according to one aspect of the present invention includes a first surface, a convex portion which is outside the first surface and is taller than the first surface, and is outside the convex portion and which is A conductive supporting member having a second surface whose height is lower than that of the convex portion, a light emitting element mounted on the first surface, and a first insulating property mounted on the second surface A member, a wire placed on the first insulating member, and a resin frame surrounding the first surface in plan view and covering at least a part of the first insulating member; The convex portion is positioned on a straight line connecting the element and the first insulating member.

本発明の発光装置によれば、光取り出し効率を向上させた発光装置を提供することができる。   According to the light emitting device of the present invention, it is possible to provide a light emitting device with improved light extraction efficiency.

図１Ａは、実施形態に係る発光装置の概略平面図である。FIG. 1A is a schematic plan view of a light emitting device according to an embodiment. 図１Ｂは、図１の１Ｂ−１Ｂ線における概略断面図である。FIG. 1B is a schematic cross-sectional view taken along line 1B-1B of FIG. 図１Ｃは、変形例１に係る発光装置の概略断面図である。FIG. 1C is a schematic cross-sectional view of a light emitting device according to a first modification. 図１Ｃは、変形例２に係る発光装置の概略断面図である。FIG. 1C is a schematic cross-sectional view of a light emitting device according to a second modification. 図１Ｅは、変形例３に係る発光装置の概略断面図である。FIG. 1E is a schematic cross-sectional view of a light emitting device according to a third modification. 図２は、支持部材の概略平面図である。FIG. 2 is a schematic plan view of the support member. 図３は、実施形態に係る発光装置から樹脂枠、被覆部材、及び、第２絶縁性部材を省略した概略平面図である。FIG. 3 is a schematic plan view in which the resin frame, the covering member, and the second insulating member are omitted from the light emitting device according to the embodiment.

本開示を実施するための形態を、以下に図面を参照しながら説明する。ただし、以下に示す形態は、本開示の技術思想を具体化するための発光装置を例示するものであって、本開示は、発光装置を以下に限定するものではない。   A mode for carrying out the present disclosure will be described below with reference to the drawings. However, the embodiments described below illustrate light emitting devices for embodying the technical concept of the present disclosure, and the present disclosure does not limit the light emitting devices to the following.

また、本明細書は、特許請求の範囲に示される部材を、実施形態の部材に特定するものでは決してない。特に、実施形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限りは、本開示の範囲をそれのみに限定する趣旨ではない。尚、各図面が示す部材の大きさや位置関係等は、説明を明確にするため誇張していることがある。さらに以下の説明において、同一の名称、符号については同一もしくは同質の部材を示しており、詳細説明を適宜省略する。   Further, the present specification does not in any way specify the members described in the claims to the members of the embodiment. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present disclosure to only them, unless there is a specific description. Note that the sizes and positional relationships of members shown in each drawing may be exaggerated for the sake of clarity. Further, in the following description, the same names and reference numerals indicate the same or the same members, and the detailed description will be appropriately omitted.

＜実施形態＞
本発明の実施形態に係る発光装置１０００を図１Ａから図３に基づいて説明する。発光装置１０００は、導電性の支持部材１０と、発光素子２０と、第１絶縁性部材３０と、配線４０と、樹脂枠６０と、を備える。支持部材１０は、第１面１０１と、第１面１０１よりも外側にあり且つ第１面１０１よりも高さの高い凸部１１と、凸部１１よりも外側にあり且つ凸部１１よりも高さの低い第２面１０２と、を有する。発光素子２０は、支持部材１０の第１面１０１上に載置される。第１絶縁性部材３０は、支持部材１０の第２面１０２上に載置される。配線４０は、第１絶縁性部材３０上に載置される。樹脂枠６０は、平面視において第１面１０１を囲み、第１絶縁性部材３０の少なくとも一部を被覆する。凸部１１は、発光素子２０と第１絶縁性部材３０とを結ぶ直線上に位置する。 Embodiment
A light emitting device 1000 according to an embodiment of the present invention will be described based on FIGS. 1A to 3. The light emitting device 1000 includes the conductive support member 10, the light emitting element 20, the first insulating member 30, the wiring 40, and the resin frame 60. The supporting member 10 has a first surface 101, a convex portion 11 which is outside the first surface 101 and is taller than the first surface 101, and is outside the convex portion 11 and is more than the convex portion 11 And a second surface 102 having a low height. The light emitting element 20 is placed on the first surface 101 of the support member 10. The first insulating member 30 is placed on the second surface 102 of the support member 10. The wiring 40 is placed on the first insulating member 30. The resin frame 60 surrounds the first surface 101 in plan view, and covers at least a part of the first insulating member 30. The convex portion 11 is located on a straight line connecting the light emitting element 20 and the first insulating member 30.

樹脂枠６０が、第１絶縁性部材３０の少なくとも一部を被覆することで、発光素子２０から出射する光が第１絶縁性部材３０に遮られて直接当たらなくなる。これにより、発光素子２０から出射する光の一部が、第１絶縁性部材３０に吸収されることを抑制することができるので発光装置の光取り出し効率を向上させることができる。   The resin frame 60 covers at least a part of the first insulating member 30 so that the light emitted from the light emitting element 20 is blocked by the first insulating member 30 and is not directly hit. Thereby, a part of the light emitted from the light emitting element 20 can be suppressed from being absorbed by the first insulating member 30, so that the light extraction efficiency of the light emitting device can be improved.

発光素子２０が出射する光のピーク波長において、樹脂枠６０の反射率は第１絶縁性部材３０の反射率よりも高い。このようにすることで、発光素子２０から出射された光が樹脂枠６０に吸収されにくくなり発光装置の光取り出し効率を向上させることができる。   The reflectance of the resin frame 60 is higher than the reflectance of the first insulating member 30 at the peak wavelength of the light emitted from the light emitting element 20. By doing this, the light emitted from the light emitting element 20 is not easily absorbed by the resin frame 60, and the light extraction efficiency of the light emitting device can be improved.

凸部１１が、発光素子２０と第１絶縁性部材３０とを結ぶ直線上に位置することで、発光素子２０から出射された光の一部は、凸部１１に遮られて第１絶縁性部材３０に直接当たらなくなる。これにより、発光素子２０から出射する光の一部が、第１絶縁性部材３０に吸収されることを抑制することができるので発光装置の光取り出し効率を向上させることができる。   When the convex portion 11 is positioned on a straight line connecting the light emitting element 20 and the first insulating member 30, a part of the light emitted from the light emitting element 20 is blocked by the convex portion 11 and the first insulating property It will not hit the member 30 directly. Thereby, a part of the light emitted from the light emitting element 20 can be suppressed from being absorbed by the first insulating member 30, so that the light extraction efficiency of the light emitting device can be improved.

発光素子２０が出射する光のピーク波長において、凸部１１の反射率は第１絶縁性部材３０の反射率よりも高い。このようにすることで、発光素子２０から出射された光が凸部１１に吸収されにくくなり発光装置の光取り出し効率を向上させることができる。   The reflectance of the convex portion 11 is higher than the reflectance of the first insulating member 30 at the peak wavelength of the light emitted from the light emitting element 20. By doing this, the light emitted from the light emitting element 20 is not easily absorbed by the convex portion 11, and the light extraction efficiency of the light emitting device can be improved.

図１Ｂに示すように、発光素子から出射する光が直接到達する範囲外に第１絶縁性部材が位置していることが好ましい。換言すると、発光素子から出射する光が直接到達する範囲に第１絶縁性部材が位置していないことが好ましい。このようにすることで、発光素子から出射する光が第１絶縁性部材に吸収されることを抑制できる。   As shown to FIG. 1B, it is preferable that the 1st insulating member is located out of the range which the light radiate | emitted from a light emitting element arrives directly. In other words, it is preferable that the first insulating member is not located in the range where the light emitted from the light emitting element directly reaches. By doing this, absorption of light emitted from the light emitting element into the first insulating member can be suppressed.

発光素子から出射する光が直接到達する範囲とは、具体的には、発光素子の表面とその周囲の遮光部材を結ぶ直線で規定することができる。遮光部材には、例えば支持部材１０、第１絶縁性部材３０、配線４０、樹脂枠６０が挙げられる。また、後述する、ワイヤ５０、第２絶縁性部材８０も遮光部材として挙げられる。尚、後述する被覆部材７０は透光性であり、遮光部材ではない。   Specifically, the range in which the light emitted from the light emitting element directly reaches can be defined by a straight line connecting the surface of the light emitting element and the light shielding member therearound. Examples of the light shielding member include the support member 10, the first insulating member 30, the wiring 40, and the resin frame 60. Moreover, the wire 50 and the 2nd insulating member 80 which are mentioned later are mentioned as a light shielding member. The covering member 70 described later is translucent and is not a light shielding member.

図１Ｂに示すように、凸部１１の高さは、発光素子２０の高さよりも高いことが好ましい。このようにすることで、発光素子から出射する光を凸部１１で遮りやすくなるので、発光装置の光取り出し効率が向上する。   As shown in FIG. 1B, the height of the convex portion 11 is preferably higher than the height of the light emitting element 20. By so doing, the light emitted from the light emitting element can be easily blocked by the convex portion 11, so that the light extraction efficiency of the light emitting device is improved.

凸部１１の高さは、第１絶縁性部材３０の高さよりも高いことが好ましい。このようにすることで、発光素子から出射する光が第１絶縁性部材に吸収されることを抑制できるので発光装置の光取り出し効率が向上する。   The height of the convex portion 11 is preferably higher than the height of the first insulating member 30. By so doing, absorption of the light emitted from the light emitting element into the first insulating member can be suppressed, so the light extraction efficiency of the light emitting device is improved.

図２に示すように、凸部１１は第１面１０１を囲むことが好ましい。このようにすることで、図１Ａに示すように、平面視において発光素子が凸部に囲まれるので、発光素子から出射する光が凸部に遮られやすくなる。これにより、発光素子から出射する光が第１絶縁性部材に吸収されることを抑制することができる。   As shown in FIG. 2, the convex portion 11 preferably surrounds the first surface 101. By doing this, as shown in FIG. 1A, since the light emitting element is surrounded by the convex portion in plan view, the light emitted from the light emitting element is easily blocked by the convex portion. Thereby, it can suppress that the light radiate | emitted from a light emitting element is absorbed by a 1st insulating member.

図１Ｂに示すように、凸部１１は、支持部材１０を屈曲させてなることが好ましい。換言すると、断面視において、凸部１１の上面と反対側に位置する第５面１０５が、第１面１０１の反対側に位置する第３面１０３、及び、第２面１０２の反対側に位置する第４面１０４より高い。このようにすることで、平板の支持部材からプレス加工等の公知の方法で凸部を形成することができるので凸部の形成が容易になる。また、平板の支持部材を屈曲させる場合は、第１面１０１と、第２面１０２と、は略同一平面上に位置する。なお、本明細書において略同一平面とは、各面の高低差が、１５μｍ程度の変動は許容されることを意味する。   As shown to FIG. 1B, it is preferable that the convex part 11 makes the support member 10 bend. In other words, in the cross sectional view, the fifth surface 105 located opposite to the upper surface of the protrusion 11 is located opposite the third surface 103 located opposite to the first surface 101 and the second surface 102. Higher than the fourth surface 104. In this way, the projections can be formed from a flat support member by a known method such as pressing, so that the projections can be easily formed. When the flat support member is bent, the first surface 101 and the second surface 102 are located on substantially the same plane. In the present specification, substantially the same plane means that the height difference between the surfaces is allowed to fluctuate by about 15 μm.

凸部１１の側面１１０は垂直であってもよいが、凸部の上面に向かってテーパー状に狭まる形状が好ましい。このようにすることで、発光素子から出射された光が凸部１１の側面１１０に反射された時に上方向に進みやすくなるので、発光装置の光取り出し効率が向上する。   Although the side surface 110 of the convex portion 11 may be vertical, it is preferable that the side surface 110 be tapered toward the upper surface of the convex portion. By doing so, the light emitted from the light emitting element can be easily advanced upward when it is reflected by the side surface 110 of the convex portion 11, so that the light extraction efficiency of the light emitting device is improved.

断面視において、第１面１０１の反対側に位置する第３面１０３と、第２面１０２の反対側に位置する第４面１０４と、は略同一平面上に位置することが好ましい。このようにすることで、発光装置１０００を基板に実装した際に第３面１０３及び第４面１０４から基板に熱を逃がしやすくなる。   In a cross sectional view, it is preferable that the third surface 103 located on the opposite side of the first surface 101 and the fourth surface 104 located on the opposite side of the second surface 102 be located on substantially the same plane. By so doing, when the light emitting device 1000 is mounted on a substrate, heat can be easily dissipated from the third surface 103 and the fourth surface 104 to the substrate.

図１Ｃに示すように、断面視において、第１面１０１の反対側に位置する第３面１０３と、第２面１０２の反対側に位置する第４面１０４と、凸部１１の上面と反対側に位置する第５面１０５と、が略同一平面上に位置していることが好ましい。このようにすることで、発光装置を基板に実装した際に第３面１０３、第４面１０４、及び、第５面１０５から基板に熱を逃がしやすくなる。   As shown in FIG. 1C, in the cross sectional view, the third surface 103 located on the opposite side of the first surface 101, the fourth surface 104 located on the opposite side of the second surface 102, and the upper surface of the convex portion 11 are opposed. It is preferable that the fifth surface 105 located on the side is located on substantially the same plane. By so doing, when the light emitting device is mounted on a substrate, heat can be easily dissipated from the third surface 103, the fourth surface 104, and the fifth surface 105 to the substrate.

発光素子２０は、１つでもよいし、複数でもよい。発光装置が発光素子２０を複数備える場合は各発光素子２０に投入する電流が同じになる直列接続が好ましい。また、図３に示すように、同数の発光素子２０を直列接続した素子群を、配線４０に並列接続してもよい。このようにすることで、各発光素子に投入される電流のバラつきを抑制することができる。   The number of light emitting elements 20 may be one or more. In the case where the light emitting device includes a plurality of light emitting elements 20, it is preferable to use a series connection in which currents supplied to the respective light emitting elements 20 are the same. Further, as shown in FIG. 3, an element group in which the same number of light emitting elements 20 are connected in series may be connected in parallel to the wiring 40. By doing this, it is possible to suppress variations in the current supplied to each light emitting element.

図１Ａに示すように、発光装置１０００は、ワイヤ５０、及び、被覆部材７０を備えていてもよい。ワイヤ５０は、発光素子２０と配線４０とを電気的に接続する。被覆部材７０は、発光素子２０を被覆する。発光装置１０００が樹脂枠６０を備えることにより、被覆部材７０を例えばポッティングにより形成した場合に樹脂枠６０が被覆部材７０を塞き止めるダムとして機能することができる。つまり、樹脂枠６０は、被覆部材７０と接して囲むように形成されている。被覆部材７０の上面は、平坦であっても凸形状や凹形状でもよい。   As shown in FIG. 1A, the light emitting device 1000 may include a wire 50 and a covering member 70. The wire 50 electrically connects the light emitting element 20 and the wiring 40. The covering member 70 covers the light emitting element 20. When the light emitting device 1000 includes the resin frame 60, the resin frame 60 can function as a dam that blocks the covering member 70 when the covering member 70 is formed by potting, for example. That is, the resin frame 60 is formed in contact with and surrounded by the covering member 70. The upper surface of the covering member 70 may be flat, convex or concave.

図１Ｄに示すように、樹脂枠６０は、第１絶縁性部材３０、配線４０、第２面１０２、及び、凸部１１の各部材の少なくとも一部を被覆してもよい。このようにすることで、発光素子から出射する光が樹脂枠に遮られるので、発光素子２０から出射する光が第１絶縁性部材３０及び配線４０に吸収されることを抑制できる。また、凸部１１が樹脂枠６０の内側に位置することが好ましい。つまり、発光素子２０と樹脂枠６０を結ぶ直線上に凸部１１が位置することが好ましい。このようにすることで、樹脂枠６０に照射される発光素子２０からの光の一部を遮ることができる。これにより、発光素子２０から出射する光により樹脂枠６０が劣化することを抑制することができる。   As shown in FIG. 1D, the resin frame 60 may cover at least a part of each member of the first insulating member 30, the wiring 40, the second surface 102, and the convex portion 11. By doing this, the light emitted from the light emitting element is blocked by the resin frame, so that the light emitted from the light emitting element 20 can be suppressed from being absorbed by the first insulating member 30 and the wiring 40. Moreover, it is preferable that the convex part 11 be located inside the resin frame 60. That is, it is preferable that the convex portion 11 be positioned on a straight line connecting the light emitting element 20 and the resin frame 60. By doing this, it is possible to block part of the light from the light emitting element 20 that is irradiated to the resin frame 60. Thereby, it can suppress that the resin frame 60 degrades with the light radiate | emitted from the light emitting element 20. FIG.

図１Ｅに示すように、被覆部材７０は、波長変換部材７１を含有させてもよい。波長変換部材７１は、発光素子２０が発する第一ピーク波長の光を、この第一ピーク波長とは波長の異なる第二ピーク波長の光に波長変換する部材である。被覆部材７０に波長変換部材７１を含有させることにより、発光素子２０が発する第一ピーク波長の光と、波長変換部材７１が発する第二ピーク波長の光とが混色された混色光を出力することができる。例えば、発光素子２０に青色ＬＥＤを、波長変換部材７１にＹＡＧ等の蛍光体を用いれば、青色ＬＥＤの青色光と、この青色光で励起されて蛍光体が発する黄色光とを混合させて得られる白色光を出力する発光装置を構成することができる。   As shown in FIG. 1E, the covering member 70 may contain a wavelength conversion member 71. The wavelength conversion member 71 is a member that converts the light of the first peak wavelength emitted by the light emitting element 20 into light of a second peak wavelength different from the first peak wavelength. By including the wavelength conversion member 71 in the covering member 70, outputting mixed color light in which the light of the first peak wavelength emitted by the light emitting element 20 and the light of the second peak wavelength emitted by the wavelength conversion member 71 are mixed. Can. For example, when a blue LED is used as the light emitting element 20 and a phosphor such as YAG is used as the wavelength conversion member 71, blue light of the blue LED and yellow light which is excited by the blue light and emitted by the phosphor are obtained. Can be configured to output a white light.

波長変換部材７１は被覆部材７０中に均一に分散させてもよいし、被覆部材７０の上面よりも発光素子２０の近傍に波長変換部材７１を偏在させてもよい。このようにすることで、水分に弱い波長変換部材７１を使用しても被覆部材７０が保護層としても機能を果たすので波長変換部材７１の劣化を抑制できる。水分に弱い波長変換物質としては、ＫＳＦ系蛍光体等のフッ化物系蛍光体、硫化物系蛍光体、塩化物系蛍光体、ケイ酸塩系蛍光体、リン酸塩系蛍光体等が挙げられる。   The wavelength conversion member 71 may be dispersed uniformly in the covering member 70, or the wavelength conversion member 71 may be unevenly distributed in the vicinity of the light emitting element 20 than the upper surface of the covering member 70. In this way, even if the wavelength conversion member 71 which is weak to moisture is used, the covering member 70 also functions as a protective layer, so that the deterioration of the wavelength conversion member 71 can be suppressed. Examples of wavelength conversion substances susceptible to moisture include fluoride-based phosphors such as KSF-based phosphors, sulfide-based phosphors, chloride-based phosphors, silicate-based phosphors, phosphate-based phosphors, etc. .

図１Ｅに示すように、被覆部材７０には光拡散材７２を含有させてもよい。光拡散材７２は、被覆部材７０との屈折率差により発光素子２０からの光を反射及び／又は屈折させて拡散させるものでる。これにより、被覆部材７０内での輝度ムラを抑制できる。また、被覆部材７０に波長変換部材７１と光拡散材７２とが含有されている場合は色ムラを抑制できる。   As shown in FIG. 1E, the covering member 70 may contain a light diffusing material 72. The light diffusing material 72 reflects and / or refracts and diffuses the light from the light emitting element 20 due to the difference in refractive index with the covering member 70. Thereby, the brightness non-uniformity in the covering member 70 can be suppressed. In addition, when the wavelength conversion member 71 and the light diffusion material 72 are contained in the covering member 70, color unevenness can be suppressed.

発光装置１０００は、第２絶縁性部材８０を備えていてもよい。第２絶縁性部材８０は、配線４０上に載置される。第２絶縁性部材８０を備えることで、配線４０を保護することができる。第２絶縁性部材８０は第１絶縁性部材３０と同様に発光素子から出射する光が第１絶縁性部材に吸収するおそれがある。このため、発光素子２０と第２絶縁性部材８０とを結ぶ直線上に凸部１１が位置することが好ましい。このようにすることで、第２絶縁性部材８０が発光素子２０から出射する光を吸収することを抑制することができる。   The light emitting device 1000 may include the second insulating member 80. The second insulating member 80 is placed on the wiring 40. By providing the second insulating member 80, the wiring 40 can be protected. Similar to the first insulating member 30, the second insulating member 80 may absorb light emitted from the light emitting element into the first insulating member. Therefore, it is preferable that the convex portion 11 be positioned on a straight line connecting the light emitting element 20 and the second insulating member 80. In this way, the second insulating member 80 can be prevented from absorbing the light emitted from the light emitting element 20.

発光素子が出射する光のピーク波長において、凸部１１の反射率は第２絶縁性部材８０の反射率よりも高い。このようにすることで、発光素子から出射された光が凸部に吸収されにくくなり発光装置の光取り出し効率を向上させることができる。   The reflectance of the convex portion 11 is higher than the reflectance of the second insulating member 80 at the peak wavelength of light emitted from the light emitting element. By doing this, the light emitted from the light emitting element is not easily absorbed by the convex portion, and the light extraction efficiency of the light emitting device can be improved.

発光素子から出射する光が直接到達する範囲外に第２絶縁性部材が位置していることが好ましい。換言すると、発光素子から出射する光が直接到達する範囲に第２絶縁性部材が位置していないことが好ましい。このようにすることで、発光素子から出射する光が第２絶縁性部材に吸収されることを抑制できる。   It is preferable that the second insulating member is located outside the range where the light emitted from the light emitting element directly reaches. In other words, it is preferable that the second insulating member is not located in the range where the light emitted from the light emitting element directly reaches. By doing this, absorption of light emitted from the light emitting element into the second insulating member can be suppressed.

凸部１１の高さは、第２絶縁性部材８０の高さよりも高いことが好ましい。このようにすることで、発光素子から出射する光が第２絶縁性部材に吸収されることを抑制できるので発光装置の光取り出し効率が向上する。   The height of the convex portion 11 is preferably higher than the height of the second insulating member 80. By doing this, absorption of the light emitted from the light emitting element into the second insulating member can be suppressed, so the light extraction efficiency of the light emitting device is improved.

樹脂枠６０が、第２絶縁性部材８０の少なくとも一部を被覆することが好ましい。発光素子２０から出射する光が樹脂枠６０に遮られて当たらなくなる。これにより、発光素子２０から出射する光の一部が、第２絶縁性部材８０に吸収されることを抑制することができるので発光装置の光取り出し効率を向上させることができる。   Preferably, the resin frame 60 covers at least a part of the second insulating member 80. The light emitted from the light emitting element 20 is blocked by the resin frame 60 and disappears. Thereby, a part of the light emitted from the light emitting element 20 can be suppressed from being absorbed by the second insulating member 80, so that the light extraction efficiency of the light emitting device can be improved.

発光素子が出射する光のピーク波長において、樹脂枠６０の反射率は第２絶縁性部材８０の反射率よりも高い。このようにすることで、発光素子から出射された光が樹脂枠６０に吸収されにくくなり発光装置の光取り出し効率を向上させることができる。   The reflectance of the resin frame 60 is higher than the reflectance of the second insulating member 80 at the peak wavelength of the light emitted from the light emitting element. By doing this, the light emitted from the light emitting element is not easily absorbed by the resin frame 60, and the light extraction efficiency of the light emitting device can be improved.

発光装置１０００は、図３に示すように、保護素子９０を備えていてもよい。保護素子９０は、１つでもよいし、複数でもよい。保護素子９０は、発光装置に載置される公知のもののいずれでもよい。   The light emitting device 1000 may include a protective element 90 as shown in FIG. One or more protective elements 90 may be provided. The protective element 90 may be any known one mounted on the light emitting device.

保護素子９０は樹脂枠に一部又は全部が被覆されることが好ましい。これにより、発光素子２０からの光が保護素子９０によって吸収されることを抑制できる。また、発光素子２０のピーク波長に対する反射率が保護素子９０より高い部材で樹脂枠を形成することで発光装置の光取り出し効率を向上する。   It is preferable that the protective element 90 be partially or entirely coated on a resin frame. Thereby, it can suppress that the light from the light emitting element 20 is absorbed by the protection element 90. Further, the resin frame is formed of a member whose reflectance to the peak wavelength of the light emitting element 20 is higher than that of the protective element 90, thereby improving the light extraction efficiency of the light emitting device.

以下に、実施形態の発光装置の各構成部材に適した材料等について説明する。   Below, the material etc. which were suitable for each component of the light-emitting device of embodiment are demonstrated.

（支持部材１０）
支持部材１０は、発光素子や保護素子などの電子部品を配置するためのものである。支持部材１０は、熱伝導率の高い材料によって形成されることが好ましい。例えば、２００Ｗ／（ｍ・Ｋ）程度以上の熱伝導率を有している材料を用いることにより、発光素子２０で発生した熱を支持部材１０に伝導しやすくなる。また、支持部材１０は、反射率の高い材料によって形成されることが好ましい。支持部材１０の反射率が高いことが発光装置の光取り出し効率が向上する。熱伝導率及び反射率の高い材料としては、例えばアルミニウム合金等の金属材料が挙げられる。 (Support member 10)
The support member 10 is for disposing an electronic component such as a light emitting element or a protective element. The support member 10 is preferably formed of a material having high thermal conductivity. For example, by using a material having a thermal conductivity of about 200 W / (m · K) or more, heat generated in the light emitting element 20 can be easily conducted to the support member 10. In addition, the support member 10 is preferably formed of a material having a high reflectance. The high reflectance of the support member 10 improves the light extraction efficiency of the light emitting device. Examples of the material having high thermal conductivity and reflectance include metal materials such as aluminum alloy.

（発光素子２０）
発光素子２０は、電圧を印加することで自ら発光する半導体素子であり、窒化物半導体等から構成される既知の半導体素子を適用できる。発光素子の発光波長は、可視域（３８０〜７８０ｎｍ）を含め、紫外域から赤外域まで選択することができる。例えば、ピーク波長４３０〜４９０ｎｍの発光素子としては、窒化物半導体を用いることができる。その窒化物半導体としては、ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ（０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）等を用いることができる。また、発光素子２０はサブマウントを介して支持部材上に配置されてもよい。 (Light-emitting element 20)
The light emitting element 20 is a semiconductor element that emits light by applying a voltage, and a known semiconductor element formed of a nitride semiconductor or the like can be applied. The emission wavelength of the light emitting element can be selected from the ultraviolet region to the infrared region, including the visible region (380 to 780 nm). For example, as a light emitting element having a peak wavelength of 430 to 490 nm, a nitride semiconductor can be used. As the nitride semiconductor, In X Al Y Ga 1- X-Y N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) , or the like can be used. Also, the light emitting element 20 may be disposed on the support member via the submount.

発光素子２０の形状は、上面視で、三角形、四角形、六角形等の多角形、又はこれらに近似する形状等、任意の形状でよい。また、発光素子２０は、同じ面側にｎ電極及びｐ電極が形成された片面電極である。   The shape of the light emitting element 20 may be any shape such as a triangle, a quadrangle, a polygon such as a hexagon, or a shape approximating these in a top view. The light emitting element 20 is a single-sided electrode in which an n electrode and ap electrode are formed on the same surface side.

発光素子２０は、支持部材の第１面１０１上にフェイスアップ実装される。フェイスアップ実装とは、発光素子２０の電極が形成された面と反対側の面を支持部材１０に向けて実装する形態である。発光素子２０と支持部材の接合部材は、絶縁性の接合部材でも導電性の接合部材でもよく、公知の接合部材を用いてよい。例えば、絶縁性の接合部材としてはエポキシ樹脂、シリコーン樹脂又はこれらの変性樹脂等が挙げられ、導電性の接合部材としては銀、金、パラジウム等の導電性ペーストや、Ａｕ−Ｓｎ共晶等の半田、低融点金属等のろう材等が挙げられる。   The light emitting element 20 is mounted face-up on the first surface 101 of the support member. The face-up mounting is a mode in which the surface opposite to the surface on which the electrodes of the light emitting element 20 are formed is mounted toward the support member 10. The bonding member of the light emitting element 20 and the support member may be either an insulating bonding member or a conductive bonding member, and a known bonding member may be used. For example, examples of the insulating bonding member include epoxy resin, silicone resin, or modified resins thereof, and the conductive bonding member includes conductive paste such as silver, gold, palladium, Au-Sn eutectic, etc. Solder, brazing material such as low melting point metal, etc. may be mentioned.

（第１絶縁性部材３０）
第１絶縁性部材は、支持部材と配線とが短絡しないための部材である。第１絶縁性部材は、支持部材１０の第２面上に載置される。第１絶縁性部材の材料としては、例えば、ガラスエポキシ、樹脂、セラミックス等が挙げられる。 (First insulating member 30)
The first insulating member is a member for preventing a short circuit between the support member and the wiring. The first insulating member is placed on the second surface of the support member 10. Examples of the material of the first insulating member include glass epoxy, resin, and ceramics.

（配線４０）
配線は、ワイヤ等を介して発光素子と電気的に接続される部材である。配線は、第１絶縁性部材上に載置される。配線は、銅、アルミニウム、金、銀、タングステン、鉄、ニッケル等の金属又は鉄−ニッケル合金、燐青銅等の合金等によって形成することができる。配線の厚みは、例えば、５μｍ〜８０μｍが挙げられる。 (Wiring 40)
The wiring is a member electrically connected to the light emitting element through a wire or the like. The wiring is placed on the first insulating member. The wiring can be formed of a metal such as copper, aluminum, gold, silver, tungsten, iron, nickel or an iron-nickel alloy, an alloy such as phosphor bronze, or the like. The thickness of the wiring is, for example, 5 μm to 80 μm.

（ワイヤ５０）
ワイヤ５０は、発光素子２０と配線４０とを電気的に接続するためのものである。ワイヤ５０の材料としては、金、銀、銅、白金、アルミニウム等を含む金属を用いたものが挙げられる。なお、ワイヤ５０の径は特に限定されず、目的及び用途に応じて適宜選択することができる。ワイヤボンディングの方法としては、ボールボンディング、ウェッジボンディング等の公知の方法を用いてよい。 (Wire 50)
The wire 50 is for electrically connecting the light emitting element 20 and the wiring 40. Examples of the material of the wire 50 include those using metals including gold, silver, copper, platinum, aluminum and the like. In addition, the diameter of the wire 50 is not specifically limited, According to the objective and a use, it can select suitably. As a wire bonding method, known methods such as ball bonding and wedge bonding may be used.

（樹脂枠６０）
樹脂枠６０は、環状に支持部材の第１面を囲んで設けられる。樹脂枠６０が発光素子２０を囲んで設けられるため、被覆部材となる未硬化状態の原料を樹脂枠６０内に止めることができる。樹脂枠６０は、樹脂枠６０の元となる未硬化の原料を、樹脂枠６０を形成したい領域に配置し、当該原料を硬化させることにより形成される。 (Resin frame 60)
The resin frame 60 is annularly provided to surround the first surface of the support member. Since the resin frame 60 is provided so as to surround the light emitting element 20, the raw material in an uncured state to be a covering member can be stopped in the resin frame 60. The resin frame 60 is formed by arranging the uncured raw material that is the source of the resin frame 60 in the area where the resin frame 60 is desired to be formed, and curing the raw material.

樹脂枠６０の材料としては、フェノール樹脂、エポキシ樹脂、ＢＴレジンやＰＰＡやシリコーン樹脂などが挙げられる。特に、樹脂枠６０の材料としては、耐光性に優れたシリコーン樹脂が好ましい。また、これらの母体となる樹脂に、発光素子２０からの光を吸収しにくく、かつ、母体となる樹脂に対する屈折率差の大きい反射部材等の粉末を分散することで、効率よく発光素子２０からの光を反射させることができる。反射部材としては、例えば、酸化チタン、酸化アルミニウム、酸化ジルコニウム、酸化マグネシウムを用いることができる。特に、酸化チタンは、水分などに対して比較的安定でかつ高屈折率であるため好ましい。樹脂枠６０は、発光素子２０からの光に対する反射率が６０％以上、好ましくは７０％以上の部材である。このようにすることで、樹脂枠６０に達した光が樹脂枠に吸収されにくくなり、発光装置の光取出し効率が向上する。   Examples of the material of the resin frame 60 include phenol resin, epoxy resin, BT resin, PPA, and silicone resin. In particular, as a material of the resin frame 60, a silicone resin excellent in light resistance is preferable. In addition, it is difficult to absorb the light from the light emitting element 20 into these base resins, and by dispersing the powder such as a reflecting member having a large difference in refractive index with respect to the base resin, the light emitting elements 20 can be efficiently obtained. Light can be reflected. For example, titanium oxide, aluminum oxide, zirconium oxide, or magnesium oxide can be used as the reflective member. In particular, titanium oxide is preferable because it is relatively stable to moisture and the like and has a high refractive index. The resin frame 60 is a member whose reflectance to light from the light emitting element 20 is 60% or more, preferably 70% or more. By doing this, the light reaching the resin frame 60 is less likely to be absorbed by the resin frame, and the light extraction efficiency of the light emitting device is improved.

（被覆部材７０）
被覆部材７０の材料としては、透光性を有する樹脂材料等を用いることができる。被覆部材７０の樹脂材料としては、ポリカーボネート樹脂、エポキシ樹脂、フェノール樹脂、シリコーン樹脂、アクリル樹脂、ポリメチルペンテン樹脂、ポリノルボルネン樹脂、又はこれらの変性樹脂やこれらの樹脂を１種以上含むハイブリッド樹脂等を用いることができる。特に、被覆部材７０の材料としては耐光性に優れたジメチル系シリコーン樹脂、フェニル系シリコーン樹脂が好ましい。 (Covering member 70)
As a material of the covering member 70, a translucent resin material or the like can be used. The resin material of the covering member 70 may be polycarbonate resin, epoxy resin, phenol resin, silicone resin, acrylic resin, polymethylpentene resin, polynorbornene resin, or modified resin of these, hybrid resin containing one or more of these resins, etc. Can be used. In particular, as a material of the covering member 70, a dimethyl silicone resin and a phenyl silicone resin which are excellent in light resistance are preferable.

（波長変換部材７１）
波長変換部材７１としては、発光素子からの発光で励起可能な蛍光体の粒子が使用される。例えば、青色発光素子又は紫外線発光素子で励起可能な蛍光体としては、セリウムで賦活されたイットリウム・アルミニウム・ガーネット系蛍光体（ＹＡＧ：Ｃｅ）、セリウムで賦活されたルテチウム・アルミニウム・ガーネット系蛍光体（ＬＡＧ：Ｃｅ）、ユウロピウムおよび／又はクロムで賦活された窒素含有アルミノ珪酸カルシウム系蛍光体（ＣａＯ−Ａｌ２Ｏ３−ＳｉＯ２：Ｅｕ，Ｃｒ）、ユウロピウムで賦活されたシリケート系蛍光体（（Ｓｒ，Ｂａ）２ＳｉＯ４：Ｅｕ）、βサイアロン蛍光体、ＣＡＳＮ系蛍光体、ＳＣＡＳＮ系蛍光体等の室化物系蛍光体；ＫＳＦ系蛍光体等のフッ化物系蛍光体、硫化物系蛍光体、塩化物系蛍光体、ケイ酸塩系蛍光体、リン酸塩系蛍光体、量子ドット蛍光体などが挙げられる。これらの蛍光体と、青色発光素子又は紫外線発光素子と組み合わせることにより、様々な波長の発光装置を製造することができる。 (Wavelength conversion member 71)
As the wavelength conversion member 71, particles of a phosphor that can be excited by light emission from a light emitting element are used. For example, as a phosphor that can be excited by a blue light emitting element or an ultraviolet light emitting element, a cerium-activated yttrium aluminum garnet phosphor (YAG: Ce), a cerium activated lutetium aluminum garnet phosphor Nitrogen-containing calcium aluminosilicate phosphor activated with (LAG: Ce), europium and / or chromium (CaO-Al 2 O 3 -SiO 2 : Eu, Cr), europium activated silicate-based phosphor ((Sr , Ba) 2 SiO 4 : Eu), β-sialon phosphors, CASN phosphors, SCASN phosphors and other room-based phosphors; KSF phosphors and other fluoride-based phosphors, sulfide phosphors, Chloride phosphors, silicate phosphors, phosphate phosphors, quantum dot phosphors and the like can be mentioned. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, light emitting devices of various wavelengths can be manufactured.

（光拡散材７２）
光拡散材７２の材料として、酸化チタン、酸化ジルコニウム、酸化アルミニウム、酸化ケイ素などを用いることができる。特に、酸化チタンは、水分などに対して比較的安定でかつ高屈折率であるため好ましい。 (Light diffusing material 72)
As a material of the light diffusion material 72, titanium oxide, zirconium oxide, aluminum oxide, silicon oxide or the like can be used. In particular, titanium oxide is preferable because it is relatively stable to moisture and the like and has a high refractive index.

（第２絶縁性部材８０）
第２絶縁性部材は、配線を保護するための部材である。また、配線上に第２絶縁性部材が載置されることで、配線と導電性の部材とが接して発光装置が短絡することを抑制できる。第２絶縁性部材の材料としては、第１絶縁性部材と同様の材料を用いることができる。 (Second insulating member 80)
The second insulating member is a member for protecting the wiring. In addition, by placing the second insulating member on the wiring, it is possible to suppress a short circuit of the light emitting device due to the contact between the wiring and the conductive member. As a material of the second insulating member, the same material as the first insulating member can be used.

（保護素子９０）
保護素子９０は、例えば、発光素子に逆方向に電圧が印加されたときに、逆方向に流れる電流を阻止したり、発光素子の動作電圧より高い順方向電圧が印加されたときに発光素子に過電流が流れるのを阻止したりすることができる保護回路や静電保護素子が挙げられる。具体的には、ツェナーダイオードが利用できる。 (Protective element 90)
For example, when a voltage is applied to the light emitting element in the reverse direction, the protective element 90 blocks a current flowing in the reverse direction, or when a forward voltage higher than the operating voltage of the light emitting element is applied to the light emitting element. There are protective circuits and electrostatic protective elements that can block the flow of overcurrent. Specifically, a zener diode can be used.

以上、本発明に係るいくつかの実施形態について例示したが、本発明は上述した実施形態に限定されるものではなく、本発明の要旨を逸脱しない限り任意のものとすることができることは言うまでもない。   As mentioned above, although some embodiments according to the present invention have been illustrated, it is needless to say that the present invention is not limited to the above-described embodiments, and can be arbitrary without departing from the scope of the present invention. .

１０００ 発光装置
１０ 支持部材
１０１ 第１面
１１ 凸部
１０２ 第２面
２０ 発光素子
３０ 第１絶縁性部材
４０ 配線
５０ ワイヤ
６０ 樹脂枠
７０ 被覆部材
７１ 波長変換部材
７２ 光拡散材
８０ 第２絶縁性部材
９０ 保護素子 1000 light emitting device 10 support member 101 first surface 11 convex portion 102 second surface 20 light emitting element 30 first insulating member 40 wiring 50 wire 60 resin frame 70 covering member 71 wavelength conversion member 72 light diffusion member 80 second insulating member 90 protection element

Claims (8)

第１面と、前記第１面よりも外側にあり且つ前記第１面よりも高さの高い凸部と、前記凸部よりも外側にあり且つ前記凸部よりも高さの低い第２面と、を有する導電性の支持部材と、
前記第１面上に載置される発光素子と、
前記第２面上に載置される第１絶縁性部材と、
前記第１絶縁性部材上に載置される配線と、
平面視において前記第１面を囲み、前記第１絶縁性部材の少なくとも一部を被覆する樹脂枠と、を備え、
前記発光素子と前記第１絶縁性部材とを結ぶ直線上に前記凸部が位置する発光装置。 A first surface, a convex portion which is outside the first surface and is higher than the first surface, and a second surface which is outside the convex portion and which is lower than the convex portion A conductive support member having
A light emitting element mounted on the first surface;
A first insulating member placed on the second surface;
A wire placed on the first insulating member;
A resin frame surrounding the first surface in plan view and covering at least a part of the first insulating member;
The light emitting device, wherein the convex portion is positioned on a straight line connecting the light emitting element and the first insulating member. 前記発光素子から出射する光が直接到達する範囲外に前記第１絶縁性部材が位置している請求項１に記載の発光装置。 The light emitting device according to claim 1, wherein the first insulating member is located out of the range where the light emitted from the light emitting element directly reaches. 前記凸部の高さは、前記発光素子の高さよりも高い請求項１又は請求項２に記載の発光装置。 The light emitting device according to claim 1, wherein a height of the convex portion is higher than a height of the light emitting element. 平面視において、前記凸部は前記第１面を囲む請求項１〜３のいずれか１項に記載の発光装置。 The light emitting device according to any one of claims 1 to 3, wherein the convex portion surrounds the first surface in a plan view. 前記凸部は、前記支持部材を屈曲させてなる請求項１〜４のいずれか１項に記載の発光装置。 The light emitting device according to any one of claims 1 to 4, wherein the convex portion is formed by bending the support member. 前記発光素子と前記配線とを電気的に接続するワイヤと、
前記発光素子を被覆する被覆部材と、を備える請求項１〜５のいずれか１項に記載の発光装置。 A wire electrically connecting the light emitting element and the wire;
The covering member which covers the said light emitting element, The light-emitting device of any one of Claims 1-5. 前記樹脂枠は、前記配線の少なくとも一部を被覆する請求項１〜６のいずれか１項に記載の発光装置。 The light emitting device according to any one of claims 1 to 6, wherein the resin frame covers at least a part of the wiring. 前記樹脂枠は、前記第１絶縁性部材、前記配線、前記第２面、及び、前記凸部、の各部材の少なくとも一部を被覆する請求項１〜６のいずれか１項に記載の発光装置。 The light emission according to any one of claims 1 to 6, wherein the resin frame covers at least a part of each member of the first insulating member, the wiring, the second surface, and the convex portion. apparatus.
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