JP7177123B2 - キャリア搬送装置およびそれを備える搬送体制御システム - Google Patents
キャリア搬送装置およびそれを備える搬送体制御システム Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C13/00—Other constructional features or details
- B66C13/18—Control systems or devices
- B66C13/40—Applications of devices for transmitting control pulses; Applications of remote control devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C19/00—Cranes comprising trolleys or crabs running on fixed or movable bridges or gantries
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/03—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using magnetic or electromagnetic means
- F16F15/035—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using magnetic or electromagnetic means by use of eddy or induced-current damping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
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- Manufacturing & Machinery (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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Description
速度調整部は駆動ホイール130の回転速度を調整する。
110:本体部
111:把持部
112:昇降部
120:駆動制御部
130:駆動ホイール
140:ガイドホイール
150:キャリア
210:レール
220:レール支持部
310:プレート
321,322:連結部材
331,332:マグネット部材
510:速度測定センサ
520:制御部
600:搬送体制御システム
610:搬送体制御装置
620:データベース
Claims (16)
- ウエハが収納されたキャリアを搬送するキャリア搬送装置であって、
前記キャリアを把持する把持部と、
前記把持部を昇降させる昇降部とを含み、
前記把持部および前記昇降部は、マグネット部材およびプレートを用いて非接触式ダンピング構造で連結され、相対的運動が抑制され、
前記キャリア搬送装置の速度を測定する速度測定センサと、
前記キャリア搬送装置の速度に基づいて前記マグネット部材の強度を調整する制御部とをさらに含む、キャリア搬送装置。 - 前記把持部および前記昇降部は、前記マグネット部材および前記プレートの間に形成される電流を用いて相対的運動が抑制される、請求項1に記載のキャリア搬送装置。
- 前記電流は、エディカレント(Eddy Current)である、請求項2に記載のキャリア搬送装置。
- 前記昇降部は複数の連結部材を用いて前記把持部と連結され、
前記マグネット部材は前記連結部材の端部に設置され、
前記プレートは前記マグネット部材に隣接して前記把持部に設置される、請求項1に記載のキャリア搬送装置。 - 前記マグネット部材は、電磁石である、請求項1に記載のキャリア搬送装置。
- 前記プレートは、非鉄金属を素材にして形成される、請求項1に記載のキャリア搬送装置。
- 前記把持部および前記昇降部は、前記キャリア搬送装置が走行する時、相対的運動が抑制される、請求項1に記載のキャリア搬送装置。
- 前記マグネット部材の強度に応じて前記把持部と前記昇降部との間のダンピングが制御される、請求項1に記載のキャリア搬送装置。
- 前記速度測定センサは、前記プレートの表面に設置される、請求項1に記載のキャリア搬送装置。
- 前記把持部および前記昇降部を含む本体部を支持し、駆動力を生成する駆動制御部と、
前記駆動制御部の側面に設置され、前記駆動力に基づいてレール上で移動する駆動ホイールと、
前記駆動制御部の下部に設置され、前記駆動ホイールが前記レール上で離脱することを防止するガイドホイールをさらに含む、請求項1に記載のキャリア搬送装置。 - ウエハが収納されたキャリアを搬送するキャリア搬送装置であって、
前記キャリアを把持し、プレートを含む把持部と、
前記把持部を昇降させ、マグネット部材を含む昇降部とを含み、
前記把持部および前記昇降部は、前記マグネット部材および前記プレートを用いて非接触式ダンピング構造で連結され、
前記キャリア搬送装置が走行する時前記マグネット部材および前記プレートの間に形成されるエディカレントを用いて前記把持部および前記昇降部の相対的運動が抑制され、
前記キャリア搬送装置の速度を測定する速度測定センサと、
前記キャリア搬送装置の速度に基づいて前記マグネット部材の強度を調整する制御部とをさらに含む、キャリア搬送装置。 - 天井に設置されるレールと、
前記レール上で走行し、ウエハが収納されたキャリアを目的地まで搬送する複数のキャリア搬送装置と、
前記キャリア搬送装置の移動を制御する搬送体制御装置とを含み、
前記キャリア搬送装置は、
前記キャリアを把持する把持部と、
前記把持部を昇降させる昇降部とを含み、
前記把持部および前記昇降部は、マグネット部材およびプレートを用いて非接触式ダンピング構造で連結され、相対的運動が抑制され、
前記キャリア搬送装置は、
前記キャリア搬送装置の速度を測定する速度測定センサと、
前記キャリア搬送装置の速度に基づいて前記マグネット部材の強度を調整する制御部をさらに含む、搬送体制御システム。 - 前記把持部および前記昇降部は、前記マグネット部材および前記プレートの間に形成される電流を用いて相対的運動が抑制される、請求項12に記載の搬送体制御システム。
- 前記昇降部は、複数の連結部材を用いて前記把持部と連結され、
前記マグネット部材は、前記連結部材の端部に設置され、
前記プレートは、前記マグネット部材に隣接して前記把持部に設置される、請求項12に記載の搬送体制御システム。 - 前記把持部および前記昇降部は、前記キャリア搬送装置が走行する時、相対的運動が抑制される、請求項12に記載の搬送体制御システム。
- 前記マグネット部材の強度に応じて前記把持部と前記昇降部との間のダンピングが制御される、請求項12に記載の搬送体制御システム。
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KR1020190095994A KR102228145B1 (ko) | 2019-08-07 | 2019-08-07 | 캐리어 반송 장치 및 이를 구비하는 반송체 제어 시스템 |
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JP2005194009A (ja) | 2004-01-05 | 2005-07-21 | Asyst Shinko Inc | 懸垂型搬送台車 |
JP2008138871A (ja) | 2006-11-08 | 2008-06-19 | Asml Netherlands Bv | 渦電流ダンパおよび渦電流ダンパを有するリソグラフィ装置 |
JP2020193058A (ja) | 2019-05-27 | 2020-12-03 | 株式会社ダイフク | 物品搬送体 |
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JPH06218690A (ja) * | 1993-01-26 | 1994-08-09 | Hitachi Ltd | 磁気的に結合された駆動装置の振動減衰方法 |
JPH06336335A (ja) * | 1993-05-25 | 1994-12-06 | Hitachi Ltd | 磁気的に結合された搬送装置の減衰装置 |
US5601027A (en) * | 1993-11-22 | 1997-02-11 | Ebara Corporation | Positioning system with damped magnetic attraction stopping assembly |
JP2001195129A (ja) * | 2000-01-13 | 2001-07-19 | Toshiba Corp | 搬送ユニット、搬送装置及び搬送装置の制御システム |
KR20050011207A (ko) | 2003-07-22 | 2005-01-29 | 삼성전자주식회사 | 전자석식 웨이퍼 캐리어 이송 장치 |
KR101901029B1 (ko) | 2016-11-29 | 2018-09-21 | 세메스 주식회사 | Oht 장치 |
KR101957960B1 (ko) * | 2017-06-14 | 2019-07-04 | 세메스 주식회사 | 자기 부상 이송 장치 |
KR102059567B1 (ko) * | 2017-08-21 | 2019-12-27 | 피에스케이홀딩스 (주) | 기판 반송 장치 |
JP2020500257A (ja) | 2017-10-27 | 2020-01-09 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 堆積システムにおいてキャリアを非接触搬送するための装置、キャリアを非接触搬送するためのシステム、堆積システムにおいて非接触搬送されるキャリア、及び堆積システムにおいてキャリアを非接触搬送するための方法 |
KR102202077B1 (ko) * | 2017-11-30 | 2021-01-12 | 세메스 주식회사 | Oht 장치의 비히클 |
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JP2005194009A (ja) | 2004-01-05 | 2005-07-21 | Asyst Shinko Inc | 懸垂型搬送台車 |
JP2008138871A (ja) | 2006-11-08 | 2008-06-19 | Asml Netherlands Bv | 渦電流ダンパおよび渦電流ダンパを有するリソグラフィ装置 |
JP2020193058A (ja) | 2019-05-27 | 2020-12-03 | 株式会社ダイフク | 物品搬送体 |
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US20210043486A1 (en) | 2021-02-11 |
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