JP7162521B2 - 多段式ハンドおよびこれを備える搬送ロボット - Google Patents
多段式ハンドおよびこれを備える搬送ロボット Download PDFInfo
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- JP7162521B2 JP7162521B2 JP2018239742A JP2018239742A JP7162521B2 JP 7162521 B2 JP7162521 B2 JP 7162521B2 JP 2018239742 A JP2018239742 A JP 2018239742A JP 2018239742 A JP2018239742 A JP 2018239742A JP 7162521 B2 JP7162521 B2 JP 7162521B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/907—Devices for picking-up and depositing articles or materials with at least two picking-up heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0095—Gripping heads and other end effectors with an external support, i.e. a support which does not belong to the manipulator or the object to be gripped, e.g. for maintaining the gripping head in an accurate position, guiding it or preventing vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/04—Detection means
- B65G2203/042—Sensors
- B65G2203/044—Optical
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S294/00—Handling: hand and hoist-line implements
- Y10S294/902—Gripping element
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/30—End effector
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims (7)
- 上下方向に並ぶ複数のハンドを有し、各ハンドのハンド間ピッチ間隔を変更可能であり、各ハンドはワークのクランプおよびクランプ解除を行うクランプ部材を有する多段式ハンドにおいて、
上記クランプ部材は、上記各ハンドに対し、前後方向に移動可能に支持されており、
上記クランプ部材はさらに、前方側に形成された固定ばね受け部材と、後方側に前後方向に相対移動可能に設けた移動ばね受け部材との間に介装した圧縮型ばね部材を有し、
上記移動ばね受け部材は、前後方向に駆動され、後方移動時に上記クランプ部材に係合する移動体の前面に対し、上下方向に低抵抗で相対移動可能に弾性接触させられていることを特徴とする、多段式ハンド。 - 上記クランプ部材は、前後方向に延びるロッドと、当該ロッドの先端に形成され、クランプ時にワークを押圧するクランプ体とを含み、上記ハンドに設けたホルダにより上記ロッドの上記固定ばね受け部材よりも前方の部位が前後方向移動可能に支持されており、上記圧縮型ばね部材は、上記ロッドに套挿した圧縮コイルばねである、請求項1に記載の多段式ハンド。
- 上記移動ばね受け部材は、上記移動体の前面に接触して転動するローラを含む、請求項2に記載の多段式ハンド。
- 上記各ハンドは、上記クランプ部材のクランプ作動時、上記クランプ体がワークを適正に押圧していないことを光学的に検出する光学検出手段を有する、請求項3に記載の多段式ハンド。
- 上記光学検出手段は、上記ハンドの適部に設けた受発光素子と、上記クランプ体に形成した反射状態変更部とを含む、請求項4に記載の多段式ハンド。
- 上記反射状態変更部は、上記クランプ体に上下貫通状に設けた貫通孔である、請求項5に記載の多段式ハンド。
- 請求項1ないし6のいずれかに記載の多段式ハンドを備える、搬送ロボット。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018239742A JP7162521B2 (ja) | 2018-12-21 | 2018-12-21 | 多段式ハンドおよびこれを備える搬送ロボット |
TW108140619A TWI814941B (zh) | 2018-12-21 | 2019-11-08 | 多段式手臂及具有此手臂之搬運機器人 |
KR1020190167220A KR20200078356A (ko) | 2018-12-21 | 2019-12-13 | 다단식 핸드 및 이를 구비하는 반송 로봇 |
US16/719,128 US11414278B2 (en) | 2018-12-21 | 2019-12-18 | Multi-level hand apparatus and conveying robot provided with the same |
CN201911335467.0A CN111354669A (zh) | 2018-12-21 | 2019-12-20 | 多层式托手以及具备其的搬运机器人 |
Applications Claiming Priority (1)
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JP2018239742A JP7162521B2 (ja) | 2018-12-21 | 2018-12-21 | 多段式ハンドおよびこれを備える搬送ロボット |
Publications (2)
Publication Number | Publication Date |
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JP2020102531A JP2020102531A (ja) | 2020-07-02 |
JP7162521B2 true JP7162521B2 (ja) | 2022-10-28 |
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JP2018239742A Active JP7162521B2 (ja) | 2018-12-21 | 2018-12-21 | 多段式ハンドおよびこれを備える搬送ロボット |
Country Status (5)
Country | Link |
---|---|
US (1) | US11414278B2 (ja) |
JP (1) | JP7162521B2 (ja) |
KR (1) | KR20200078356A (ja) |
CN (1) | CN111354669A (ja) |
TW (1) | TWI814941B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI755135B (zh) | 2020-09-03 | 2022-02-11 | 日商川崎重工業股份有限公司 | 基板保持手及基板搬送機器人 |
JP2022051281A (ja) * | 2020-09-18 | 2022-03-31 | 日本電産サンキョー株式会社 | 産業用ロボット |
CN115847464A (zh) * | 2022-11-30 | 2023-03-28 | 西安奕斯伟材料科技有限公司 | 一种机械手及机械手夹取状态检测方法 |
Citations (4)
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JP2006054455A (ja) | 2004-08-12 | 2006-02-23 | Semes Co Ltd | 基板移送装置 |
JP2010179420A (ja) | 2009-02-06 | 2010-08-19 | Nidec Sankyo Corp | 産業用ロボット |
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-
2018
- 2018-12-21 JP JP2018239742A patent/JP7162521B2/ja active Active
-
2019
- 2019-11-08 TW TW108140619A patent/TWI814941B/zh active
- 2019-12-13 KR KR1020190167220A patent/KR20200078356A/ko not_active Application Discontinuation
- 2019-12-18 US US16/719,128 patent/US11414278B2/en active Active
- 2019-12-20 CN CN201911335467.0A patent/CN111354669A/zh active Pending
Patent Citations (4)
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JP2006054455A (ja) | 2004-08-12 | 2006-02-23 | Semes Co Ltd | 基板移送装置 |
JP2010179420A (ja) | 2009-02-06 | 2010-08-19 | Nidec Sankyo Corp | 産業用ロボット |
JP2013135099A (ja) | 2011-12-27 | 2013-07-08 | Kawasaki Heavy Ind Ltd | 基板保持装置 |
JP2018192599A (ja) | 2017-05-19 | 2018-12-06 | 川崎重工業株式会社 | 接触検知器、ハンド、ロボット、及びロボットシステム |
Also Published As
Publication number | Publication date |
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US11414278B2 (en) | 2022-08-16 |
TWI814941B (zh) | 2023-09-11 |
JP2020102531A (ja) | 2020-07-02 |
US20200198902A1 (en) | 2020-06-25 |
CN111354669A (zh) | 2020-06-30 |
TW202025376A (zh) | 2020-07-01 |
KR20200078356A (ko) | 2020-07-01 |
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