JP7152617B2 - 放熱シート - Google Patents
放熱シート Download PDFInfo
- Publication number
- JP7152617B2 JP7152617B2 JP2021548353A JP2021548353A JP7152617B2 JP 7152617 B2 JP7152617 B2 JP 7152617B2 JP 2021548353 A JP2021548353 A JP 2021548353A JP 2021548353 A JP2021548353 A JP 2021548353A JP 7152617 B2 JP7152617 B2 JP 7152617B2
- Authority
- JP
- Japan
- Prior art keywords
- boron nitride
- nitride particles
- particle size
- heat
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/285—Ammonium nitrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019173834 | 2019-09-25 | ||
JP2019173834 | 2019-09-25 | ||
PCT/JP2020/025719 WO2021059648A1 (ja) | 2019-09-25 | 2020-06-30 | 放熱シート |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021059648A1 JPWO2021059648A1 (zh) | 2021-04-01 |
JP7152617B2 true JP7152617B2 (ja) | 2022-10-12 |
Family
ID=75164971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021548353A Active JP7152617B2 (ja) | 2019-09-25 | 2020-06-30 | 放熱シート |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7152617B2 (zh) |
CN (1) | CN114467367B (zh) |
WO (1) | WO2021059648A1 (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012133587A1 (ja) | 2011-03-28 | 2012-10-04 | 日立化成工業株式会社 | 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂シート積層体、樹脂シート積層体硬化物及びその製造方法、半導体装置、並びにled装置 |
JP2017036190A (ja) | 2015-08-12 | 2017-02-16 | 三菱化学株式会社 | 窒化ホウ素凝集粒子組成物、bn凝集粒子含有樹脂組成物及びそれらの成形体、並びに窒化ホウ素凝集粒子の製造方法、 |
JP2019006837A (ja) | 2015-10-29 | 2019-01-17 | 日東電工株式会社 | 熱伝導性シート及び半導体モジュール |
WO2019065150A1 (ja) | 2017-09-28 | 2019-04-04 | 富士フイルム株式会社 | 放熱シートおよび放熱シート付きデバイス |
JP2019116401A (ja) | 2017-12-27 | 2019-07-18 | 昭和電工株式会社 | 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材 |
JP2019137608A (ja) | 2014-02-05 | 2019-08-22 | 三菱ケミカル株式会社 | 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、成形体、及びシート |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5340202B2 (ja) * | 2010-02-23 | 2013-11-13 | 三菱電機株式会社 | 熱硬化性樹脂組成物、bステージ熱伝導性シート及びパワーモジュール |
JP6274014B2 (ja) * | 2013-05-27 | 2018-02-07 | 三菱ケミカル株式会社 | 窒化ホウ素凝集粒子、凝集bn粒子含有樹脂組成物及び放熱シート |
CN107848801B (zh) * | 2015-09-03 | 2021-01-12 | 昭和电工株式会社 | 六方晶氮化硼粉末、其制造方法、树脂组合物及树脂片 |
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2020
- 2020-06-30 WO PCT/JP2020/025719 patent/WO2021059648A1/ja active Application Filing
- 2020-06-30 CN CN202080065988.3A patent/CN114467367B/zh active Active
- 2020-06-30 JP JP2021548353A patent/JP7152617B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012133587A1 (ja) | 2011-03-28 | 2012-10-04 | 日立化成工業株式会社 | 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂シート積層体、樹脂シート積層体硬化物及びその製造方法、半導体装置、並びにled装置 |
JP2019137608A (ja) | 2014-02-05 | 2019-08-22 | 三菱ケミカル株式会社 | 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、成形体、及びシート |
JP2017036190A (ja) | 2015-08-12 | 2017-02-16 | 三菱化学株式会社 | 窒化ホウ素凝集粒子組成物、bn凝集粒子含有樹脂組成物及びそれらの成形体、並びに窒化ホウ素凝集粒子の製造方法、 |
JP2019006837A (ja) | 2015-10-29 | 2019-01-17 | 日東電工株式会社 | 熱伝導性シート及び半導体モジュール |
WO2019065150A1 (ja) | 2017-09-28 | 2019-04-04 | 富士フイルム株式会社 | 放熱シートおよび放熱シート付きデバイス |
JP2019116401A (ja) | 2017-12-27 | 2019-07-18 | 昭和電工株式会社 | 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材 |
Also Published As
Publication number | Publication date |
---|---|
CN114467367A (zh) | 2022-05-10 |
CN114467367B (zh) | 2024-05-07 |
WO2021059648A1 (ja) | 2021-04-01 |
JPWO2021059648A1 (zh) | 2021-04-01 |
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