JP7147778B2 - 積層基板の製造方法、および製造装置 - Google Patents
積層基板の製造方法、および製造装置 Download PDFInfo
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- JP7147778B2 JP7147778B2 JP2019550958A JP2019550958A JP7147778B2 JP 7147778 B2 JP7147778 B2 JP 7147778B2 JP 2019550958 A JP2019550958 A JP 2019550958A JP 2019550958 A JP2019550958 A JP 2019550958A JP 7147778 B2 JP7147778 B2 JP 7147778B2
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- Crystallography & Structural Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
特許文献1 特開2013-098186号公報
Claims (8)
- 2つの基板を接合して積層基板を製造する製造方法であって、
複数の基板の剛性および面方位の少なくとも一方に関する情報を取得する取得段階と、
互いに接合する2つの基板の間で互いに対応する位置における前記剛性および前記面方位の前記少なくとも一方が異なるように、2つの基板の組み合わせを決定する決定段階と、
を含む製造方法。 - 前記決定段階において、2つの基板の接合後の位置ずれ量が予め定められた閾値以下となる組み合わせを決定する請求項1に記載の製造方法。
- 前記決定段階において、前記2つの基板の一方に対する他方の接合面内での回転の量を決定する段階をさらに含む請求項1または2に記載の製造方法。
- 前記回転の量に基づいて露光をする露光条件を露光装置に出力する段階をさらに含む請求項3に記載の製造方法。
- 前記回転の量に基づいて、前記2つの基板の少なくとも一方を接合時に保持する保持条件を接合装置に出力する段階をさらに含む請求項3または4に記載の製造方法。
- 2つの基板を接合して積層基板を製造する製造装置であって、
複数の基板の剛性および面方位の少なくとも一方に関する情報を取得する取得部と、
互いに接合する2つの基板の間で互いに対応する位置における前記剛性および前記面方位の前記少なくとも一方が異なるように、互いに接合する前記2つの基板の組み合わせを決定する決定部と、
を備える製造装置。 - 2つの基板を接合して積層基板を製造する製造方法であって、
前記2つの基板の剛性分布および結晶構造の少なくとも一方に関する情報を取得する取得段階と、
前記2つの基板における前記剛性分布および前記結晶構造の前記少なくとも一方の組み合わせに基づいて、前記2つの基板を接合するときの前記2つの基板の少なくとも一方を保持する保持力の大きさを決定する決定段階と、
を含む製造方法。 - 2つの基板を接合して積層基板を製造する製造装置であって、
2つの基板を接合する接合部と、
前記2つの基板の少なくとも一方を保持する保持部と
を備え、
接合される2つの基板の第1の組と、接合される2つの基板の第2の組とのそれぞれにおいて、前記2つの基板の剛性および面方位の少なくとも一方の組み合わせが、前記第1の組と前記第2の組とで異なり、
前記第1の組と前記第2の組とで、 前記保持部による保持力が異なる製造装置。
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US20220415673A1 (en) * | 2019-10-10 | 2022-12-29 | Tokyo Electron Limited | Bonding system and inspection method of inspecting combined substrate |
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JP2012038860A (ja) | 2010-08-05 | 2012-02-23 | Nikon Corp | 半導体基板の積層方法、半導体基板の積層装置およびデバイスの製造方法 |
WO2016093284A1 (ja) | 2014-12-10 | 2016-06-16 | 株式会社ニコン | 基板重ね合わせ装置および基板重ね合わせ方法 |
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