JP7109232B2 - モジュール基板用アンテナ、及びそれを用いたモジュール基板 - Google Patents
モジュール基板用アンテナ、及びそれを用いたモジュール基板 Download PDFInfo
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- JP7109232B2 JP7109232B2 JP2018068276A JP2018068276A JP7109232B2 JP 7109232 B2 JP7109232 B2 JP 7109232B2 JP 2018068276 A JP2018068276 A JP 2018068276A JP 2018068276 A JP2018068276 A JP 2018068276A JP 7109232 B2 JP7109232 B2 JP 7109232B2
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- antenna
- module substrate
- ferrite
- capacitor
- laminate
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- 229910000859 α-Fe Inorganic materials 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 39
- 239000003990 capacitor Substances 0.000 claims description 22
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 8
- 239000010410 layer Substances 0.000 description 57
- 239000004020 conductor Substances 0.000 description 17
- 239000011229 interlayer Substances 0.000 description 12
- 239000000696 magnetic material Substances 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000009351 contact transmission Effects 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- -1 for example Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/0026—Multilayer LC-filter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Aerials (AREA)
- Coils Or Transformers For Communication (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
図1は、本実施形態に係るモジュール基板の断面図であり、図2は、本実施形態に係るモジュール基板の分解斜視図である。
次に、本発明の第2の実施形態について説明する。図3は、本発明の第2実施形態に係るモジュール基板の断面図であり、図4は、本発明の第2実施形態に係るモジュール基板の分解斜視図である。なお、上記第1実施形態と同様の構成部分については同一の符号を付してその説明を省略する。
2 積層体
3~6 フェライト層
3a~6a アンテナコイル
3b IC搭載面
7 接続パッド
8 引出し配線
9~11 絶縁層
9a,10a 絶縁層の外表面
12 IC搭載用電極
20a~20c,21a~21f,22a~22h 層間接続導体
23,24 コンデンサ用電極
25 コンデンサ
26,27 絶縁層
30 モジュール基板
Claims (6)
- 複数のフェライト層が積層された積層体と、
前記複数のフェライト層の各々の表面に設けられたアンテナコイルと、
外部回路に接続される接続パッドと、
前記積層体と前記接続パッドとの間に設けられた引出し配線と
を備え、
前記積層体において、2種類の前記アンテナコイルが交互に積層されており、
前記引出し配線と前記接続パッドとの間に、一対のコンデンサ用電極により構成されたコンデンサが設けられていることを特徴とするモジュール基板用アンテナ。 - 前記2種類のアンテナコイルは、アンテナパターンの形状が異なることを特徴とする請求項1に記載のモジュール基板用アンテナ。
- 前記接続パッドが、前記引出し配線を介して、前記積層体における最上層の前記フェライト層のIC搭載面側に設けられたIC搭載用電極に接続されるとともに、該IC搭載面側と反対側に露出して設けられていることを特徴とする請求項1または請求項2に記載のモジュール基板用アンテナ。
- 前記引出し配線が、前記フェライト層の前記アンテナコイルの内側部分を介して、前記IC搭載用電極に接続されていることを特徴とする請求項3に記載のモジュール基板用アンテナ。
- 前記コンデンサは、前記アンテナコイルと並列に接続されており、前記コンデンサと前記アンテナコイルはLC共振回路を形成することを特徴とする請求項1に記載のモジュール基板用アンテナ。
- 請求項1~請求項5のいずれか1項に記載のモジュール基板用アンテナを備えることを特徴とするモジュール基板。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018068276A JP7109232B2 (ja) | 2018-03-30 | 2018-03-30 | モジュール基板用アンテナ、及びそれを用いたモジュール基板 |
US16/367,787 US11551851B2 (en) | 2018-03-30 | 2019-03-28 | Module substrate antenna, and module substrate mounting the same |
TW108111121A TWI735856B (zh) | 2018-03-30 | 2019-03-29 | 模組基板天線,以及用以組設該天線的模組基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018068276A JP7109232B2 (ja) | 2018-03-30 | 2018-03-30 | モジュール基板用アンテナ、及びそれを用いたモジュール基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019180021A JP2019180021A (ja) | 2019-10-17 |
JP7109232B2 true JP7109232B2 (ja) | 2022-07-29 |
Family
ID=68057253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018068276A Active JP7109232B2 (ja) | 2018-03-30 | 2018-03-30 | モジュール基板用アンテナ、及びそれを用いたモジュール基板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11551851B2 (ja) |
JP (1) | JP7109232B2 (ja) |
TW (1) | TWI735856B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021112086A1 (ja) * | 2019-12-03 | 2021-06-10 | 戸田工業株式会社 | モジュール基板用アンテナ、及びそれを用いたモジュール基板 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007088914A1 (ja) | 2006-01-31 | 2007-08-09 | Hitachi Metals, Ltd. | 積層部品及びこれを用いたモジュール |
JP2007214646A (ja) | 2006-02-07 | 2007-08-23 | Fdk Corp | 非接触通信用アンテナ |
WO2012137386A1 (ja) | 2011-04-06 | 2012-10-11 | 株式会社村田製作所 | 積層型インダクタ素子およびその製造方法 |
US20130214889A1 (en) | 2012-02-21 | 2013-08-22 | Samsung Electro-Mechanics Co., Ltd. | Multilayer type inductor and method of manufacturing the same |
JP2013172241A (ja) | 2012-02-20 | 2013-09-02 | Murata Mfg Co Ltd | 積層アンテナ、アンテナ装置及びそれを用いた電子機器 |
WO2016098527A1 (ja) | 2014-12-17 | 2016-06-23 | 株式会社村田製作所 | アンテナモジュールおよび電子機器 |
JP2017188631A (ja) | 2016-04-08 | 2017-10-12 | 株式会社村田製作所 | 積層型電子部品 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4069958B2 (ja) * | 2006-01-19 | 2008-04-02 | 株式会社村田製作所 | 無線icデバイス |
US9397401B2 (en) * | 2008-04-25 | 2016-07-19 | Toda Kogyo Corporation | Magnetic antenna, board mounted with the same, and RF tag |
JP5672874B2 (ja) * | 2010-09-09 | 2015-02-18 | 株式会社村田製作所 | 無線icタグ及びrfidシステム |
TWM535879U (zh) * | 2013-09-09 | 2017-01-21 | Amphenol Taiwan Corp | 可撓式多層線圈裝置 |
CN206532662U (zh) | 2014-04-03 | 2017-09-29 | 株式会社村田制作所 | 层叠型线圈部件和模块部件 |
US9666939B2 (en) * | 2015-02-17 | 2017-05-30 | Joinset Co., Ltd. | Antenna bandwidth expander |
-
2018
- 2018-03-30 JP JP2018068276A patent/JP7109232B2/ja active Active
-
2019
- 2019-03-28 US US16/367,787 patent/US11551851B2/en active Active
- 2019-03-29 TW TW108111121A patent/TWI735856B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007088914A1 (ja) | 2006-01-31 | 2007-08-09 | Hitachi Metals, Ltd. | 積層部品及びこれを用いたモジュール |
JP2007214646A (ja) | 2006-02-07 | 2007-08-23 | Fdk Corp | 非接触通信用アンテナ |
WO2012137386A1 (ja) | 2011-04-06 | 2012-10-11 | 株式会社村田製作所 | 積層型インダクタ素子およびその製造方法 |
JP2013172241A (ja) | 2012-02-20 | 2013-09-02 | Murata Mfg Co Ltd | 積層アンテナ、アンテナ装置及びそれを用いた電子機器 |
US20130214889A1 (en) | 2012-02-21 | 2013-08-22 | Samsung Electro-Mechanics Co., Ltd. | Multilayer type inductor and method of manufacturing the same |
WO2016098527A1 (ja) | 2014-12-17 | 2016-06-23 | 株式会社村田製作所 | アンテナモジュールおよび電子機器 |
JP2017188631A (ja) | 2016-04-08 | 2017-10-12 | 株式会社村田製作所 | 積層型電子部品 |
Also Published As
Publication number | Publication date |
---|---|
US20190304662A1 (en) | 2019-10-03 |
TWI735856B (zh) | 2021-08-11 |
TW201943146A (zh) | 2019-11-01 |
US11551851B2 (en) | 2023-01-10 |
JP2019180021A (ja) | 2019-10-17 |
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