JP7102177B2 - Board detection device and board processing device - Google Patents

Board detection device and board processing device Download PDF

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JP7102177B2
JP7102177B2 JP2018047446A JP2018047446A JP7102177B2 JP 7102177 B2 JP7102177 B2 JP 7102177B2 JP 2018047446 A JP2018047446 A JP 2018047446A JP 2018047446 A JP2018047446 A JP 2018047446A JP 7102177 B2 JP7102177 B2 JP 7102177B2
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substrate
passage
detection
air
hole
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JP2019161082A (en
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和広 寺田
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Yamaha Motor Co Ltd
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Description

本明細書では、搬送部により搬送される基板を検出する技術を開示する。 This specification discloses a technique for detecting a substrate transported by a transport unit.

従来、搬送部により搬送される基板の有無を検出可能な技術が知られている。特許文献１のスクリーン印刷装置は、投光部と、この投光部から投光された光のうち、反射部によって反射された光を受光する受光部とを有する反射型の基板検出センサを備えている。搬送コンベアで搬送された基板が基板停止位置に至ると、投光部から投光された光は基板によって遮光されて受光部に受光されないため、投光部から投光された光が受光部に受光されるか否かによって基板の有無が検出される。 Conventionally, there is known a technique capable of detecting the presence or absence of a substrate transported by a transport unit. The screen printing device of Patent Document 1 includes a reflective substrate detection sensor having a light projecting unit and a light receiving unit that receives the light reflected by the reflecting unit among the light projected from the projecting unit. ing. When the substrate conveyed by the conveyor reaches the substrate stop position, the light projected from the light projecting section is blocked by the substrate and is not received by the light receiving section, so that the light projected from the light projecting section is received by the light receiving section. The presence or absence of a substrate is detected depending on whether or not light is received.

特開２００５－９３７６５号公報Japanese Unexamined Patent Publication No. 2005-93765

ところで、特許文献１のように、光の投受光により搬送路上の基板の有無を検出する構成では、投光部から投光された光が基板により遮光される必要があるため、原理的に基板が透明である場合には基板を検出できないという問題がある。 By the way, in a configuration in which the presence or absence of a substrate on a transport path is detected by light emission and reception as in Patent Document 1, the light projected from the light projecting portion needs to be shielded by the substrate. Therefore, in principle, the substrate If is transparent, there is a problem that the substrate cannot be detected.

本明細書に記載された技術は、基板が透明であっても搬送路上の基板を検出することが可能な基板検出装置及び基板処理装置を提供することを目的とする。 An object of the techniques described herein is to provide a substrate detection apparatus and a substrate processing apparatus capable of detecting a substrate on a transport path even if the substrate is transparent.

本明細書に記載された基板検出装置は、基台と、前記基台上の搬送路に沿って基板を搬送する搬送部と、前記搬送路上に搬送された前記基板又は前記基板を支持する基板支持体に対向する対向面、前記対向面に形成される検出穴、及び、前記検出穴に連なる空気の通路を有する通路形成部材と、前記通路の空気を媒体として伝達される物理量に基づいて前記基板を検出する検出部と、を備える。 The substrate detection device described in the present specification includes a base, a transport unit that transports a substrate along a transport path on the base, and the substrate or a substrate that supports the substrate conveyed on the transport path. The passage-forming member having a facing surface facing the support, a detection hole formed in the facing surface, and an air passage connected to the detection hole, and a physical quantity transmitted through the air in the passage as a medium. A detection unit for detecting a substrate is provided.

本構成によれば、基板や基板支持体が検出穴に対向する場合と、基板や基板支持体が検出穴に対向しない場合とで、通路内の空気を媒体として検出部に伝達される物理量が変化するため、基板が透明であっても、通路内の空気を媒体として検出部に伝達された物理量に応じて搬送路上における基板の有無を検出することが可能になる。 According to this configuration, the physical quantity transmitted to the detection unit using the air in the passage as a medium depends on the case where the substrate or the substrate support faces the detection hole and the case where the substrate or the substrate support does not face the detection hole. Because of the change, even if the substrate is transparent, it is possible to detect the presence or absence of the substrate on the transport path according to the physical quantity transmitted to the detection unit using the air in the passage as a medium.

本明細書に記載された技術の実施態様としては以下の態様が好ましい。
前記検出穴は、前記対向面における前記搬送路に沿う方向に複数設けられており、前記検出部は、前記複数の検出穴のうち、前記基板又は前記基板支持体が対向する前記検出穴の位置に応じて異なる物理量に基づいて前記搬送路上における前記基板の位置を検出する。
このようにすれば、基板の有無だけでなく、基板の位置を検出することができる。 The following embodiments are preferred as embodiments of the techniques described herein.
A plurality of the detection holes are provided in the direction along the transport path on the facing surface, and the detection unit is the position of the detection hole with which the substrate or the substrate support faces among the plurality of detection holes. The position of the substrate on the transport path is detected based on different physical quantities.
In this way, not only the presence or absence of the substrate but also the position of the substrate can be detected.

前記検出部は、前記空気の圧力により前記基板を検出する。
前記検出部は、前記空気の流量により前記基板を検出する。 The detection unit detects the substrate by the pressure of the air.
The detection unit detects the substrate by the flow rate of the air.

前記通路は、前記検出穴に連なる第１通路と、前記第１通路とは交差する方向に延びる第２通路と、を備え、前記検出部は、前記第２通路内に音波を発生させる音波発生源と、前記第２通路の空気を介して伝搬される音波を検出する音波検出器と、を備える。
このようにすれば、検出部により空気の圧力や流量を検出しなくても基板を検出することが可能になる。 The passage includes a first passage connected to the detection hole and a second passage extending in a direction intersecting the first passage, and the detection unit generates sound waves for generating sound waves in the second passage. It includes a source and a sound wave detector that detects sound waves propagated through the air in the second passage.
In this way, the substrate can be detected without detecting the air pressure or the flow rate by the detection unit.

前記通路には、加圧された空気が流通する。
このようにすれば、空気の力で基板や基板支持体を通路形成部材の対向面に倣わせることができるため、基板や基板支持体に反りが生じていても安定した搬送が可能になる。 Pressurized air flows through the passage.
In this way, the substrate or the substrate support can be made to imitate the facing surface of the passage forming member by the force of air, so that stable transportation is possible even if the substrate or the substrate support is warped. ..

前記通路形成部材は、加圧された空気が流通する加圧通路と、減圧された空気が流通する減圧通路と、を有し、前記通路形成部材の対向面には、前記加圧通路に連なる加圧穴と、前記減圧通路に連なる減圧穴と、が形成されている。
このようにすれば、基板と対向面との間を流通する空気により、基板や基板支持体と通路形成部材の対向面との間の過度な密着が緩和され、一定のギャップを保つことができるため、基板や基板支持体と通路形成部材の対向面との間のすべり抵抗を小さくすることができ、安定した基板の搬送が可能になる。また、一定のギャップを保つことで、圧力応答、流量応答、周波数応答等が安定するため、基板の検出の精度を高めることが可能になる。 The passage forming member has a pressurized passage through which pressurized air flows and a reduced pressure passage through which decompressed air flows, and the facing surface of the passage forming member is connected to the pressurized passage. A pressure hole and a pressure reducing hole connected to the pressure reducing passage are formed.
In this way, the air flowing between the substrate and the facing surface alleviates excessive adhesion between the substrate or the substrate support and the facing surface of the passage forming member, and a constant gap can be maintained. Therefore, the slip resistance between the substrate or the substrate support and the facing surface of the passage forming member can be reduced, and the substrate can be stably conveyed. Further, by maintaining a constant gap, the pressure response, the flow rate response, the frequency response, and the like are stabilized, so that the accuracy of substrate detection can be improved.

前記通路形成部材は、複数の前記加圧穴と複数の前記減圧穴とが前記基板の搬送方向に間隔を空けて交互に並んでいる。
このようにすれば、基板と通路形成部材の対向面との間に流通する空気について、基板の位置における圧力のばらつきを抑制することができる。 In the passage forming member, the plurality of pressure holes and the plurality of pressure reducing holes are alternately arranged at intervals in the transport direction of the substrate.
In this way, it is possible to suppress the variation in pressure at the position of the substrate with respect to the air flowing between the substrate and the facing surface of the passage forming member.

前記検出部は、前記基板が所定の位置に搬送されたことを検出した時には、前記通路内の空気の加圧を停止し、減圧を行う。
このようにすれば、搬送した基板を所定の位置に保持することができる。 When the detection unit detects that the substrate has been conveyed to a predetermined position, the detection unit stops pressurizing the air in the passage and depressurizes the air.
In this way, the conveyed substrate can be held in a predetermined position.

前記検出部により前記基板が検出されなかったときに報知する報知手段を備える。
このようにすれば、作業者に基板の搬送に異常が生じたことを知らせることができる。 A notification means for notifying when the substrate is not detected by the detection unit is provided.
In this way, it is possible to notify the operator that an abnormality has occurred in the transfer of the substrate.

前記検出部による検出結果に応じて前記基板の搬送速度を検出し、検出した前記搬送速度に応じて前記搬送部を制御する制御手段を備える。
このようにすれば、搬送部により搬送される基板の速度が予め設定されている速度とは異なる場合には、検出部により検出した実際の基板の速度により搬送部の速度を補正すること可能になる。 A control means is provided which detects the transport speed of the substrate according to the detection result by the detection unit and controls the transport unit according to the detected transport speed.
In this way, when the speed of the substrate transported by the transport unit is different from the preset speed, the speed of the transport unit can be corrected by the actual speed of the substrate detected by the detection unit. Become.

前記基板検出装置と、前記検出部により所定位置に搬送されたことが検出された前記基板に対して予め決められた処理を行う処理実行部と、を備える基板処理装置とする。
このようにすれば、基板検出装置の検出結果に基づいて、基板に対して予め決められた電子部品の実装、半田ペーストの塗布、接着剤の塗布、基板検査等の処理を行うことができる。 The substrate processing apparatus includes the substrate detection device and a processing execution unit that performs a predetermined process on the substrate detected to have been conveyed to a predetermined position by the detection unit.
In this way, based on the detection result of the substrate detection device, it is possible to perform processing such as mounting of electronic components, coating of solder paste, coating of adhesive, and substrate inspection on the substrate.

本明細書に記載された技術によれば、基板が透明であっても搬送路上の基板を検出することが可能になる。 According to the technique described herein, it is possible to detect a substrate on a transport path even if the substrate is transparent.

実施形態１の表面実装機を示す平面図Top view showing the surface mounter of the first embodiment 表面実装機の断面図Cross-sectional view of surface mounter 基板がバックアップ装置によりバックアップされた状態を示す表面実装機の断面図Cross-sectional view of the surface mounter showing the state in which the board is backed up by the backup device. 通路形成部材を示す斜視図Perspective view showing a passage forming member 通路形成部材を示す分解斜視図An exploded perspective view showing a passage forming member 通路形成部材を示す平面図Plan view showing a passage forming member 図６のＡ－Ａ断面図AA cross-sectional view of FIG. 圧力センサ等による基板の検出を説明するための図The figure for demonstrating the detection of a substrate by a pressure sensor or the like. 音波を利用した基板の検出を説明するための図Diagram for explaining substrate detection using sound waves 基板の位置による音波の変化を説明するための図Diagram for explaining changes in sound waves depending on the position of the substrate 表面実装機の電気的構成を示す図Diagram showing the electrical configuration of the surface mounter 表面実装機の動作を示すフローチャートFlowchart showing the operation of the surface mounter 実施形態２の 通路形成部材上に基板が搬送された状態を示す図The figure which shows the state which the substrate was conveyed on the passage forming member of Embodiment 2. 図１３に対して搬送速度の検出のために基板表面に検出溝を設けた図FIG. 13 is a diagram in which a detection groove is provided on the surface of the substrate for detecting the transport speed.

＜実施形態１＞
１．表面実装機１０の全体構成
実施形態の表面実装機１０（「基板処理装置」の一例）について図１～図１２を参照しつつ説明する。以下の説明では、基台１１の長辺方向（図１の左右方向）及び搬送コンベア１２の搬送方向をＸ軸方向とし、基台１１の短辺方向（図１の上下方向）をＹ軸方向とし、基台１１の高さ方向（図２の上下方向）をＺ軸方向とする。図１は表面実装機１０の平面図である。 <Embodiment 1>
1. 1. Overall Configuration of Surface Mounter 10 The surface mounter 10 of the embodiment (an example of the "board processing apparatus") will be described with reference to FIGS. 1 to 12. In the following description, the long side direction of the base 11 (horizontal direction in FIG. 1) and the transport direction of the transport conveyor 12 are the X-axis directions, and the short side direction of the base 11 (vertical direction in FIG. 1) is the Y-axis direction. The height direction of the base 11 (vertical direction in FIG. 2) is the Z-axis direction. FIG. 1 is a plan view of the surface mounter 10.

表面実装機１０は、図１に示すように、基台１１と、プリント基板（「基板」の一例。以下では「基板Ｐ」と示す）を搬送方向（Ｘ軸方向）に搬送する一対の搬送コンベア１２（「搬送部」の一例）と、一方の搬送コンベア１２の脇に配され、内部に空気が流通する通路が形成された通路形成部材３０と、電子部品Ｂを吸着して基板Ｐ上に実装するヘッドユニット５０とを備えている。基台１１は、平面視長方形状をなし、平坦な上面を有する。 As shown in FIG. 1, the surface mounter 10 transports a base 11 and a printed circuit board (an example of a “board”; hereinafter referred to as “board P”) in a transport direction (X-axis direction). A conveyor 12 (an example of a "conveying unit"), a passage forming member 30 arranged beside one of the transport conveyors 12 and having a passage through which air flows inside, and an electronic component B are attracted to the substrate P. It is provided with a head unit 50 to be mounted on the. The base 11 has a rectangular shape in a plan view and has a flat upper surface.

搬送コンベア１２は、基板Ｐを基台１１上の搬送路ＬＣに沿って搬送するものであって、図２に示すように、Ｙ軸方向に向かい合う一対の側壁体１３と、搬送方向に沿って循環駆動する一対の搬送ベルト１４とを備えている。基板Ｐは、両搬送ベルト１４に架設する形でセットされる。搬送ベルト１４は、一対のローラ１６を掛け渡して取り付けられている。基板Ｐは、搬送方向の一方側（図１の右側）からコンベアモータ１５（図１１参照）の作動により循環駆動する搬送ベルト１４に沿って基台１１上において実装作業が行われる実装位置に搬入される。そして、この実装位置に停止した状態で電子部品Ｂの実装作業がされた後、搬送ベルト１４に沿って他方側（図１の左側）に搬出される。一対の搬送コンベア１２のうちの一方の内側の隣接する位置には、通路形成部材３０が取り付けられている。 The conveyor 12 transports the substrate P along the transport path LC on the base 11, and as shown in FIG. 2, the transport conveyor 12 has a pair of side wall bodies 13 facing the Y-axis direction and along the transport direction. It includes a pair of conveyor belts 14 that are circulated and driven. The substrate P is set so as to be erected on both transport belts 14. The transport belt 14 is attached by hanging a pair of rollers 16. The substrate P is carried from one side in the transport direction (right side in FIG. 1) to a mounting position where mounting work is performed on the base 11 along the transport belt 14 which is circulated and driven by the operation of the conveyor motor 15 (see FIG. 11). Will be done. Then, after the electronic component B is mounted while stopped at this mounting position, it is carried out to the other side (left side in FIG. 1) along the transport belt 14. A passage forming member 30 is attached to an adjacent position inside one of the pair of conveyors 12.

通路形成部材３０は、Ｘ軸方向に延びる角筒状であって、搬送される基板Ｐの下側に配されており、図５，図７に示すように、通気路本体３１と、通気路本体３１を覆う蓋部３５とを有する。通気路本体３１は、上方側が開放されており、左右に並んだ３つの通気溝３２Ａ～３２Ｃが通気路本体３１の全長に延びている。３つの通気溝３２Ａ～３２Ｃのうち、真ん中の検出溝３２Ｂは、空気を伝達媒体として基板Ｐを検出するために設けられており、左右方向の一方側の加圧溝３２Ａは、圧縮機７５で加圧された空気が流通するために設けられており、左右方向の他方側の減圧溝３２Ｃは、真空ポンプ７６で減圧された空気が流通するために設けられている。通気路本体３１が蓋部３５で覆われると３本の空気の通路３０Ａ～３０Ｃが形成される。 The passage forming member 30 has a square cylinder shape extending in the X-axis direction and is arranged under the substrate P to be conveyed. As shown in FIGS. 5 and 7, the air passage main body 31 and the air passage are provided. It has a lid portion 35 that covers the main body 31. The upper side of the ventilation path main body 31 is open, and three ventilation grooves 32A to 32C arranged side by side extend to the entire length of the ventilation path main body 31. Of the three ventilation grooves 32A to 32C, the detection groove 32B in the middle is provided to detect the substrate P using air as a transmission medium, and the pressure groove 32A on one side in the left-right direction is a compressor 75. It is provided for the flow of pressurized air, and the pressure reducing groove 32C on the other side in the left-right direction is provided for the flow of the air depressurized by the vacuum pump 76. When the air passage main body 31 is covered with the lid portion 35, three air passages 30A to 30C are formed.

加圧溝３２Ａ及び減圧溝３２Ｃは、例えば、通路形成部材３０の端部（通気溝３２Ａ～３２Ｃの端部）に接続された図示しないホース又は配管を介してそれぞれ圧縮機７５及び真空ポンプ７６に接続されている。 The pressurizing groove 32A and the depressurizing groove 32C are connected to the compressor 75 and the vacuum pump 76, respectively, via hoses or pipes (not shown) connected to the ends of the passage forming members 30 (ends of the ventilation grooves 32A to 32C), respectively. It is connected.

蓋部３５は、第１蓋体３６～第３蓋体３８が重ねられて構成されている。各蓋体３６～３８は、共に帯状に延びる平板状であって、下側の第１蓋体３６は、それぞれ加圧溝３２Ａ及び減圧溝３２Ｃに連通する２列の貫通穴３６Ａ，３６Ｃが等間隔に並んで設けられている。真ん中の第２蓋体３７は、斜めに延びる貫通穴３７Ａが並行に並んで設けられている。上側の第３蓋体３８は、第１蓋体３６の半分の間隔で二倍の数の貫通穴３８Ａ，３８Ｃが２列に並んで設けられている。第３蓋体３８の上面は、搬送路ＬＣ上に搬送された基板Ｐに対向する対向面３９とされる。対向面３９の貫通穴３８Ａ，３８Ｃは、加圧された空気が上方に排出される加圧穴３８Ａと、上方の空気を減圧する減圧穴３８Ｃとされる。２列の貫通穴３８Ａ，３８Ｃは、各列ごとに、加圧穴３８Ａと減圧穴３８Ｃとは前後方向に交互に並んで配置されている。また、対向面３９には、基板Ｐの有無を検出するための空気が流通する検出穴３８Ｂが形成されており、検出穴３８Ｂは、２列の貫通穴３８Ａ，３８Ｃの間に所定間隔ごとに配置されている。第１蓋体３６及び第２蓋体３７には、図７に示すように、検出穴３８Ｂに連なる貫通穴３６Ｂ，３７Ｂが形成されている。 The lid portion 35 is configured by stacking the first lid body 36 to the third lid body 38. Each of the lids 36 to 38 has a flat plate shape extending in a strip shape, and the lower first lid 36 has two rows of through holes 36A and 36C communicating with the pressure groove 32A and the pressure reduction groove 32C, respectively. They are provided side by side at intervals. The second lid 37 in the center is provided with through holes 37A extending diagonally side by side in parallel. The upper third lid 38 is provided with twice the number of through holes 38A and 38C arranged side by side in two rows at half the intervals of the first lid 36. The upper surface of the third lid 38 is a facing surface 39 facing the substrate P transported on the transport path LC. The through holes 38A and 38C of the facing surface 39 are a pressure hole 38A in which the pressurized air is discharged upward and a pressure reducing hole 38C in which the air above is depressurized. The two rows of through holes 38A and 38C are arranged so that the pressure holes 38A and the pressure reducing holes 38C are alternately arranged in the front-rear direction in each row. Further, a detection hole 38B through which air for detecting the presence or absence of the substrate P flows is formed on the facing surface 39, and the detection holes 38B are formed at predetermined intervals between the two rows of through holes 38A and 38C. Have been placed. As shown in FIG. 7, through holes 36B and 37B connected to the detection holes 38B are formed in the first lid body 36 and the second lid body 37.

通路形成部材３０は、通気路本体３１上に第１蓋体３６～第３蓋体３８が積層されることにより検出溝３２Ｂに、貫通穴３６Ｂ，３７Ｂ及び検出穴３８Ｂに連なり、空気の通路３０Ｂが形成される。また、加圧溝３２Ａは、貫通穴３６Ａ，３７Ａ及び加圧穴３８Ａに連なる空気の加圧通路３０Ａを形成し、減圧溝３２Ｃは、貫通穴３６Ｃ，３７Ａ及び減圧穴３８Ｃに連なる空気の減圧通路３０Ｃを形成する。通路形成部材３０には、通路３０Ｂの空気を媒体として伝達される物理量を受信するセンサ４１が取り付けられている。 The passage forming member 30 is connected to the through holes 36B and 37B and the detection holes 38B in the detection groove 32B by laminating the first lid body 36 to the third lid body 38 on the ventilation path main body 31, and the air passage 30B. Is formed. Further, the pressure groove 32A forms a pressure passage 30A for air connected to the through holes 36A, 37A and the pressure hole 38A, and the pressure reducing groove 32C forms a pressure reduction passage 30C for air connected to the through holes 36C, 37A and the pressure reducing hole 38C. To form. A sensor 41 that receives a physical quantity transmitted through the air in the passage 30B as a medium is attached to the passage forming member 30.

センサ４１は、例えば、圧力センサ、流量センサ等を用いることができる。センサ４１の取付位置は、例えば、図８に示すように、通路３０Ｂに貫通形成された通気穴４３を介して連通した通路形成部材３０の外部に取り付けることができる。なお、図８では、第２蓋体３７及び第３蓋体３８を設けず、第１蓋体３６の上面を基板Ｐに対向する対向面４２としている。 As the sensor 41, for example, a pressure sensor, a flow rate sensor, or the like can be used. As shown in FIG. 8, the mounting position of the sensor 41 can be mounted on the outside of the passage forming member 30 communicating with the passage 30B through the ventilation hole 43 formed through the passage 30B, for example. In FIG. 8, the second lid 37 and the third lid 38 are not provided, and the upper surface of the first lid 36 is a facing surface 42 facing the substrate P.

ここで、基板Ｐを検出する検出部４０として、上記したセンサ４１に限られず、図９に示すように、音波発生源４５及び音波検出器４６を用いて音波の変化を利用してもよい。具体的には、通路形成部材３０の通路３０Ｂは、検出穴３８Ｂに連なる第１通路３３と、第１通路３３とは交差する方向に延びる第２通路３４と、を備える。第２通路３４の一端側には、音波を発生する音波発生源４５が設けられ、第２通路３４の他端側には、音波を検出する音波検出器４６が設けられる。なお、図９では、第２蓋体３７及び第３蓋体３８を設けず、第１蓋体３６の上面を基板Ｐに対向する対向面４２としている。音波発生源４５は、例えば、リード（楽器）、スピーカー、圧電振動子等を用いることができる。音波検出器４６としては、マイクロホン等の集音器や圧電センサを用いることができる。このようにすれば、基板Ｐの位置により、基板Ｐによって塞がれる（基板が対向する）貫通穴３６Ｂ（検出穴）の位置が異なるため、通路３０Ｂと、貫通孔３６Ｂとによって形成される音波が伝わる領域の共振周波数が変化する。この結果、検出される波長及び周波数が変化する。これにより、図１０（Ａ），（Ｂ）に示すように、基板Ｐが貫通穴３６Ｂ（検出穴３８Ｂ）の塞いだ状態の共振周波数が変化し、音波ＷＡ２は、音波ＷＡ１よりも波長が長くなっている（周波数が低くなっている）。 Here, the detection unit 40 for detecting the substrate P is not limited to the sensor 41 described above, and as shown in FIG. 9, a sound wave generation source 45 and a sound wave detector 46 may be used to utilize changes in sound waves. Specifically, the passage 30B of the passage forming member 30 includes a first passage 33 connected to the detection hole 38B and a second passage 34 extending in a direction intersecting the first passage 33. A sound wave generation source 45 for generating sound waves is provided on one end side of the second passage 34, and a sound wave detector 46 for detecting sound waves is provided on the other end side of the second passage 34. In FIG. 9, the second lid 37 and the third lid 38 are not provided, and the upper surface of the first lid 36 is a facing surface 42 facing the substrate P. As the sound wave generation source 45, for example, a reed (musical instrument), a speaker, a piezoelectric vibrator, or the like can be used. As the sound wave detector 46, a sound collector such as a microphone or a piezoelectric sensor can be used. In this way, since the position of the through hole 36B (detection hole) closed by the substrate P (the substrate faces) differs depending on the position of the substrate P, the sound wave formed by the passage 30B and the through hole 36B The resonance frequency in the region where is transmitted changes. As a result, the detected wavelength and frequency change. As a result, as shown in FIGS. 10A and 10B, the resonance frequency of the substrate P in the closed through hole 36B (detection hole 38B) changes, and the sound wave WA2 has a longer wavelength than the sound wave WA1. (The frequency is low).

図１に示すように、搬送コンベア１２の両側（図１の上下両側）には、Ｘ軸方向に並んで２箇所ずつ、計４箇所にフィーダ型供給装置１８が配されている。フィーダ型供給装置１８には、複数のフィーダ１９が横並び状に整列して取り付けられている。各フィーダ１９は、複数の電子部品Ｂが収容された電子部品供給テープ（不図示）が巻回されたリール（不図示）、及びリールから電子部品供給テープを引き出す電動式の送出装置（不図示）等を備えており、搬送コンベア１２側に位置する端部から電子部品Ｂが一つずつ供給されるようになっている。供給された電子部品Ｂは、実装位置にてバックアップ装置２０によりバックアップされた基板Ｐ上に実装される。 As shown in FIG. 1, feeder type feeders 18 are arranged on both sides of the conveyor 12 (upper and lower sides of FIG. 1) at two locations arranged in the X-axis direction, for a total of four locations. A plurality of feeders 19 are arranged side by side and attached to the feeder type supply device 18. Each feeder 19 has a reel (not shown) around which an electronic component supply tape (not shown) containing a plurality of electronic components B is wound, and an electric sending device (not shown) that pulls out the electronic component supply tape from the reel. ) And the like, and electronic components B are supplied one by one from the end located on the transfer conveyor 12 side. The supplied electronic component B is mounted on the substrate P backed up by the backup device 20 at the mounting position.

バックアップ装置２０は、図２，図３に示すように、基台１１の中央部に取り付けられており、多数個のバックアップピン２２を起立状態に保持したバックアッププレート２１と、バックアッププレート２１を昇降させる昇降軸２６を備えた昇降装置２５とから構成されている。バックアッププレート２１は昇降装置２５の作動により、図２に示す下降位置と、図３に示す上昇位置とに変位可能となっている。バックアッププレート２１を下降位置に位置させると、搬送コンベア１２上を搬送される基板Ｐの下方において、各バックアップピン２２が、基板Ｐから所定距離隔てた離間状態となる。バックアッププレート２１を上昇位置に移動させると、バックアップピン２２が基板Ｐを下から持ち上げてバックアップしつつ、実装位置に停止した基板Ｐを側壁体１３の上部に取り付けられたガイド片２８との間に挟み付けて保持する。 As shown in FIGS. 2 and 3, the backup device 20 is attached to the central portion of the base 11, and raises and lowers the backup plate 21 holding a large number of backup pins 22 in an upright state and the backup plate 21. It is composed of an elevating device 25 provided with an elevating shaft 26. The backup plate 21 can be displaced to the descending position shown in FIG. 2 and the ascending position shown in FIG. 3 by the operation of the elevating device 25. When the backup plate 21 is positioned in the lowered position, the backup pins 22 are separated from the substrate P by a predetermined distance below the substrate P conveyed on the conveyor 12. When the backup plate 21 is moved to the raised position, the backup pin 22 lifts the substrate P from below to back up, and the substrate P stopped at the mounting position is placed between the guide piece 28 attached to the upper part of the side wall body 13. Hold by sandwiching.

ヘッドユニット５０には、図１に示すように、電子部品Ｂの実装動作を行う実装用ヘッド５１が列状をなして複数個搭載されている。各実装用ヘッド５１の先端には電子部品Ｂを負圧によって吸着する吸着ノズルがそれぞれ設けられている。基台１１上であって搬送コンベア１２のＹ方向の両側には、部品認識カメラ２９が一対設置されている。この部品認識カメラ２９は、実装用ヘッド５１の吸着ノズルにより吸着保持された電子部品Ｂを撮影するためのものである。 As shown in FIG. 1, a plurality of mounting heads 51 for mounting the electronic component B are mounted in a row on the head unit 50. At the tip of each mounting head 51, a suction nozzle for sucking the electronic component B by a negative pressure is provided. A pair of component recognition cameras 29 are installed on both sides of the transfer conveyor 12 in the Y direction on the base 11. The component recognition camera 29 is for photographing the electronic component B that is attracted and held by the suction nozzle of the mounting head 51.

２．表面実装機１０の電気的構成
表面実装機１０は、図１１に示すように、実装機本体１０Ａ内に、全体を制御するコントローラ６０を備える。コントローラ６０は、ＣＰＵ等により構成される演算処理部６１、記憶部６２、検出処理部６３、モータ制御部６４、画像処理部６５、及び入出力部６６を備えている。実装機本体１０Ａの外部には、ユーザが操作可能な操作部６８及びディスプレイ等のユーザが視認可能な表示部６９が設けられており、演算処理部６１は、操作部６８及び表示部６９に接続されている。 2. Electrical configuration of the surface mounter 10 As shown in FIG. 11, the surface mounter 10 includes a controller 60 that controls the entire surface mounter body 10A. The controller 60 includes an arithmetic processing unit 61, a storage unit 62, a detection processing unit 63, a motor control unit 64, an image processing unit 65, and an input / output unit 66, which are composed of a CPU or the like. A user-operable operation unit 68 and a user-visible display unit 69 such as a display are provided outside the mounting machine main body 10A, and the arithmetic processing unit 61 is connected to the operation unit 68 and the display unit 69. Has been done.

記憶部６２には表面実装機１０の実装動作を制御するための実装プログラム、及び、搬送コンベア１２等を制御するための各種データが格納されている。また、演算処理部６１が各種演算を行う際の情報を一時記憶させておくための作業領域が割り当てられている。 The storage unit 62 stores a mounting program for controlling the mounting operation of the surface mounting machine 10, and various data for controlling the conveyor 12 and the like. In addition, a work area is allocated for temporarily storing information when the arithmetic processing unit 61 performs various arithmetic operations.

また、記憶部６２には、検出処理部６３に伝達された基板Ｐの検出情報に基づき、基板Ｐの有無や位置を判断するためのデータが記憶されている。具体的には、予め基板Ｐの位置に応じてセンサ４１等の検出部４０で検出される検出信号の波形（波長、周波数、波高値等）を学習させておき、検出信号の波形と基板Ｐの位置との関係の検出データを記憶する。 Further, the storage unit 62 stores data for determining the presence / absence and position of the substrate P based on the detection information of the substrate P transmitted to the detection processing unit 63. Specifically, the waveform (waveform, frequency, peak value, etc.) of the detection signal detected by the detection unit 40 such as the sensor 41 is learned in advance according to the position of the substrate P, and the waveform of the detection signal and the substrate P are learned. Stores the detection data of the relationship with the position of.

検出処理部６３は、入出力部６６を介してセンサ４１から現在の検出信号が入力されるとともに、記憶部６２に記憶された過去の検出信号の波形と基板Ｐの有無や位置との関係の検出データを読み出し、検出信号と検出データとの関係により各検出穴３８Ｂの位置における基板Ｐの有無や基板Ｐの位置を判断する。検出処理部６３は、センサ４１と共に、基板Ｐを検出する検出部４０を構成する。 The detection processing unit 63 receives the current detection signal from the sensor 41 via the input / output unit 66, and the relationship between the waveform of the past detection signal stored in the storage unit 62 and the presence / absence and position of the substrate P. The detection data is read out, and the presence / absence of the substrate P and the position of the substrate P at the positions of the detection holes 38B are determined based on the relationship between the detection signal and the detection data. The detection processing unit 63, together with the sensor 41, constitutes a detection unit 40 that detects the substrate P.

モータ制御部６４は演算処理部６１の指令の下、各モータ７１～７４を通電制御するものであり、搬送コンベア１２を駆動するためのコンベアモータ１５と、電子部品Ｂの実装作業を行うためのＸ軸モータ７１、Ｙ軸モータ７２、Ｚ軸モータ７３及びＲ軸モータ７４が電気的に接続されている。画像処理部６５には、部品認識カメラ２９に電気的に接続されている。入出力部６６には圧縮機７５、真空ポンプ７６及びセンサ４１が電気的に接続されている。 The motor control unit 64 energizes and controls each of the motors 71 to 74 under the command of the arithmetic processing unit 61, and mounts the conveyor motor 15 for driving the transport conveyor 12 and the electronic component B. The X-axis motor 71, the Y-axis motor 72, the Z-axis motor 73, and the R-axis motor 74 are electrically connected. The image processing unit 65 is electrically connected to the component recognition camera 29. A compressor 75, a vacuum pump 76, and a sensor 41 are electrically connected to the input / output unit 66.

３．表面実装機１０の動作
図１２に示すように、ユーザにより操作部６８が操作されると、コントローラ６０は、圧縮機７５及び真空ポンプ７６に駆動信号を出力し、圧縮機７５及び真空ポンプ７６を駆動する（Ｓ１）。また、搬送コンベア１２に駆動信号を出力し、搬送コンベア１２を循環駆動する（Ｓ２）。圧縮機７５及び真空ポンプ７６が駆動すると、加圧穴３８Ａから加圧された空気が噴出され、減圧穴３８Ｃ内に負圧が生じ、減圧穴３８Ｃ内に空気が吸入される。搬送コンベア１２が駆動すると、搬送路ＬＣ上の基板Ｐが搬送方向に搬送される。基板Ｐが通路形成部材３０の上を通ると、基板Ｐは、通路形成部材３０の対向面３９（上面）に対して空気が流通する隙間を空けた状態で搬送され、基板Ｐと対向面３９との間のすべり抵抗が少なくなる。 3. 3. Operation of Surface Mounter 10 As shown in FIG. 12, when the operation unit 68 is operated by the user, the controller 60 outputs a drive signal to the compressor 75 and the vacuum pump 76, and causes the compressor 75 and the vacuum pump 76 to operate. Drive (S1). Further, a drive signal is output to the conveyor 12, and the conveyor 12 is circulated and driven (S2). When the compressor 75 and the vacuum pump 76 are driven, pressurized air is ejected from the pressure reducing hole 38A, a negative pressure is generated in the pressure reducing hole 38C, and air is sucked into the pressure reducing hole 38C. When the transfer conveyor 12 is driven, the substrate P on the transfer path LC is conveyed in the transfer direction. When the substrate P passes over the passage forming member 30, the substrate P is conveyed with a gap through which air flows with respect to the facing surface 39 (upper surface) of the passage forming member 30, and the substrate P and the facing surface 39. The slip resistance between and is reduced.

そして、通路形成部材３０の対向面３９上を移動する基板Ｐは、検出穴３８Ｂの上を通ると複数の検出穴３８Ｂを順番に覆っていく。検出穴３８Ｂ内の空気は、検出穴３８Ｂの上を基板Ｐが通らず、開放された状態では、大気圧とほぼ同じとされているが、検出穴３８Ｂの上を基板Ｐが通ると、検出穴３８Ｂが基板Ｐにより覆われるため、検出穴３８Ｂに連なる通路３０Ｂ内の気圧及び空気の流れが変化する。これにより、通路３０Ｂ内の空気を媒体としてセンサ４１に伝達される物理量（圧力、流量、周波数等）が変化し、センサ４１からの検出信号を受けた検出処理部６３は、記憶部６２に記憶された検出データに基づき基板Ｐの位置を検知し、基板Ｐが電子部品Ｂを実装する実装位置まで移動したか否かを判断する（Ｓ３）。基板Ｐが実装位置に到達していないと判断したときには（Ｓ３で「ＮＯ」）、検出処理部６３は、記憶部６２に記憶されている所定時間（予め設定した基板Ｐが実装位置に到達しているべき時間）が経過した後に（Ｓ９で「ＹＥＳ」）、表示部６９の表示や音声等により、基板Ｐ検出の異常を報知し（Ｓ１０）、搬送コンベア１２の駆動を停止する（Ｓ１１）。 Then, when the substrate P moving on the facing surface 39 of the passage forming member 30 passes over the detection holes 38B, it covers the plurality of detection holes 38B in order. The air in the detection hole 38B is almost the same as the atmospheric pressure when the substrate P does not pass over the detection hole 38B and is open, but when the substrate P passes over the detection hole 38B, it is detected. Since the hole 38B is covered with the substrate P, the air pressure and the air flow in the passage 30B connected to the detection hole 38B change. As a result, the physical quantity (pressure, flow rate, frequency, etc.) transmitted to the sensor 41 using the air in the passage 30B as a medium changes, and the detection processing unit 63 that receives the detection signal from the sensor 41 stores in the storage unit 62. The position of the board P is detected based on the detected detection data, and it is determined whether or not the board P has moved to the mounting position where the electronic component B is mounted (S3). When it is determined that the board P has not reached the mounting position (“NO” in S3), the detection processing unit 63 reaches the mounting position for a predetermined time stored in the storage unit 62 (the preset board P reaches the mounting position). After the elapse of time (“YES” in S9) (“YES” in S9), the abnormality of the substrate P detection is notified by the display or voice of the display unit 69 (S10), and the drive of the transfer conveyor 12 is stopped (S11). ..

Ｓ３にて、検出処理部６３は、基板Ｐが実装位置に到達したと判断したときには（Ｓ３で「ＹＥＳ」）、搬送コンベア１２及び圧縮機７５を停止し、真空ポンプ７６の駆動を継続する（Ｓ４）。これにより、基板Ｐの搬送が停止されるとともに、真空ポンプ７６の駆動により基板Ｐの位置が実装位置に保持される。 When the detection processing unit 63 determines in S3 that the substrate P has reached the mounting position (“YES” in S3), the transfer conveyor 12 and the compressor 75 are stopped, and the vacuum pump 76 is continued to be driven (“YES” in S3). S4). As a result, the transfer of the substrate P is stopped, and the position of the substrate P is held at the mounting position by driving the vacuum pump 76.

次に、検出処理部６３は、基板Ｐの所定の移動距離及び所定の移動距離の移動にかかる時間に基づいて搬送速度を検知し（Ｓ５）、基板Ｐの搬送速度が予め設定されている速度に対して所定範囲内の速度が検出されているか否かを判断する（Ｓ６）。具体的な基板Ｐの搬送速度の検知は、例えば、図１０の複数の検出穴３８Ｂのうち、１つの上流側の検出穴３８Ｂ上を基板が通過したこと検出してから、下流側の検出穴３８Ｂ上を通過するまでの時間と、この時間での基板の移動距離である上流側の検出穴３８Ｂと下流側の検出穴３８Ｂの距離とから搬送速度を求めることができる。そして、基板Ｐの搬送速度が設定されている速度に対して所定範囲内の速度と判断した場合には（Ｓ６で「ＹＥＳ」）、電子部品Ｂの実装作業を行う（Ｓ７）。一方、基板Ｐの搬送速度が設定されている速度に対して所定範囲内の速度でないと判断した場合には（Ｓ６で「ＮＯ」）、基板Ｐの搬送速度に所定以上の誤差を生じているため、誤差に応じて補正した搬送コンベア１２の速度を記憶部６２に記憶し（Ｓ１２）、電子部品Ｂの実装作業を行う（Ｓ７）。電子部品Ｂの実装作業では、バックアップ装置２０を作動する。これにより、基板Ｐがバックアップされ、各種モータ７１～７４を駆動してバックアップされた基板Ｐに対する電子部品Ｂの実装作業を行う。実装作業が完了すると、バックアップ装置２０が基板Ｐを下降させる。そして、圧縮機７５，真空ポンプ７６及び搬送コンベア１２を駆動して部品実装済みの基板Ｐを搬出する（Ｓ８）。 Next, the detection processing unit 63 detects the transfer speed based on the predetermined movement distance of the substrate P and the time required for the movement of the predetermined movement distance (S5), and the transfer speed of the substrate P is set in advance. It is determined whether or not a speed within a predetermined range is detected with respect to (S6). Specific detection of the transport speed of the substrate P is, for example, after detecting that the substrate has passed over one of the detection holes 38B on the upstream side of the plurality of detection holes 38B in FIG. The transport speed can be obtained from the time required for passing over 38B and the distance between the detection hole 38B on the upstream side and the detection hole 38B on the downstream side, which is the moving distance of the substrate at this time. Then, when it is determined that the transfer speed of the substrate P is within a predetermined range with respect to the set speed (“YES” in S6), the mounting work of the electronic component B is performed (S7). On the other hand, when it is determined that the transfer speed of the substrate P is not within a predetermined range with respect to the set speed (“NO” in S6), an error of a predetermined value or more occurs in the transfer speed of the substrate P. Therefore, the speed of the transport conveyor 12 corrected according to the error is stored in the storage unit 62 (S12), and the mounting work of the electronic component B is performed (S7). In the mounting work of the electronic component B, the backup device 20 is operated. As a result, the substrate P is backed up, and various motors 71 to 74 are driven to mount the electronic component B on the backed up substrate P. When the mounting work is completed, the backup device 20 lowers the substrate P. Then, the compressor 75, the vacuum pump 76, and the conveyor 12 are driven to carry out the board P on which the components are mounted (S8).

４．本実施形態の作用、効果
表面実装機１０（基板処理装置）は、基台１１と、基台１１上の搬送路ＬＣに沿って基板Ｐを搬送する搬送コンベア１２（搬送部）と、搬送路ＬＣ上に搬送された基板Ｐに対向する対向面３９（４２）、対向面３９（４２）に形成される検出穴３８Ｂ（３６Ｂ）、及び、検出穴３８Ｂ（３６Ｂ）に連なる空気の通路３０Ａ～３０Ｃを有する通路形成部材３０と、通路３０Ａ～３０Ｃの空気を媒体として伝達される物理量に基づいて基板Ｐを検出する検出部４０と、を備える。
本実施形態によれば、基板Ｐが検出穴３８Ｂ（３６Ｂ）に対向する場合と、基板Ｐが検出穴３８Ｂ（３６Ｂ）に対向しない場合とにより、通路３０Ａ～３０Ｃの通路の空気を媒体として検出部４０に伝達される物理量が変化するため、空気を媒体として検出部４０に伝達された物理量に応じて搬送路ＬＣ上における基板Ｐの有無を検出することが可能になる。これにより、例えば光学的なセンサを用いる場合のように、基板Ｐが透明な場合や、基板Ｐの形状（基板の反り）等により、基板に投光した光が基板Ｐ上で乱反射することがないため、基板Ｐの検出精度を向上させることが可能になる。 4. Actions and effects of this embodiment The surface mounter 10 (board processing device) includes a base 11, a transport conveyor 12 (transport section) that transports the substrate P along a transport path LC on the base 11, and a transport path. The facing surface 39 (42) facing the substrate P conveyed on the LC, the detection holes 38B (36B) formed in the facing surfaces 39 (42), and the air passages 30A to connect to the detection holes 38B (36B). A passage forming member 30 having 30C and a detection unit 40 for detecting a substrate P based on a physical quantity transmitted through air in the passages 30A to 30C are provided.
According to the present embodiment, the air in the passages 30A to 30C is detected as a medium depending on whether the substrate P faces the detection hole 38B (36B) or the substrate P does not face the detection hole 38B (36B). Since the physical quantity transmitted to the unit 40 changes, it is possible to detect the presence or absence of the substrate P on the transport path LC according to the physical quantity transmitted to the detection unit 40 using air as a medium. As a result, the light projected on the substrate may be diffusely reflected on the substrate P due to the transparency of the substrate P or the shape of the substrate P (warp of the substrate), for example, when an optical sensor is used. Therefore, it is possible to improve the detection accuracy of the substrate P.

また、検出穴３８Ｂは、対向面３９における搬送路ＬＣに沿う方向に複数設けられており、検出部４０は、複数の検出穴３８Ｂのうち、基板Ｐが対向する検出穴３８Ｂの位置に応じて異なる物理量に基づいて搬送路ＬＣ上における基板Ｐの位置を検出する。
このようにすれば、複数の検出穴３８Ｂにより、検出部４０で検出される物理量を変化させることができるため、基板Ｐの有無だけでなく、基板Ｐの位置を検出することができる。 Further, a plurality of detection holes 38B are provided in a direction along the transport path LC on the facing surface 39, and the detection unit 40 is provided according to the position of the detection hole 38B on which the substrate P faces, among the plurality of detection holes 38B. The position of the substrate P on the transport path LC is detected based on different physical quantities.
In this way, since the physical quantity detected by the detection unit 40 can be changed by the plurality of detection holes 38B, not only the presence / absence of the substrate P but also the position of the substrate P can be detected.

また、通路３０Ｂは、検出穴３８Ｂ（３６Ｂ）に連なる第１通路３３と、第１通路３３とは交差する方向に延びる第２通路３４と、を備え、検出部４０は、第２通路３４内に音波を発生させる音波発生源４５と、第２通路３４の空気を介して伝搬される音波を検出する音波検出器４６と、を備える。
このようにすれば、検出部４０により空気の圧力や流量を検出しなくても基板Ｐを検出することが可能になる。 Further, the passage 30B includes a first passage 33 connected to the detection hole 38B (36B) and a second passage 34 extending in a direction intersecting the first passage 33, and the detection unit 40 is inside the second passage 34. A sound wave generation source 45 for generating sound waves and a sound wave detector 46 for detecting sound waves propagated through the air in the second passage 34 are provided.
In this way, the substrate P can be detected without the detection unit 40 detecting the air pressure or the flow rate.

また、通路３０Ａ～３０Ｃには、加圧された空気が流通する。
このようにすれば、空気の力で基板Ｐを通路形成部材３０の対向面３９に倣わせることができるため、基板Ｐに反りが生じていても安定した搬送が可能になる。 In addition, pressurized air flows through the passages 30A to 30C.
In this way, since the substrate P can be made to imitate the facing surface 39 of the passage forming member 30 by the force of air, stable transportation is possible even if the substrate P is warped.

また、通路形成部材３０は、加圧された空気が流通する加圧通路３０Ａと、減圧された空気が流通する減圧通路３０Ｃと、を有し、通路形成部材３０の対向面３９には、加圧通路３０Ａに連なる加圧穴３８Ａと、減圧通路３０Ｃに連なる減圧穴３８Ｃと、が形成されている。
このようにすれば、基板Ｐと対向面３９との間を流通する空気により、基板Ｐと対向面３９との間の過度な密着が緩和され、基板Ｐと対向面３９との間に一定のギャップを保つことができるため、安定した基板Ｐの搬送が可能になる。また、基板Ｐと対向面３９との間に一定のギャップを保つことで、圧力応答、流量応答、周波数応答等が安定するため、基板Ｐの検出の精度を高めることが可能になる。 Further, the passage forming member 30 has a pressurized passage 30A through which pressurized air flows and a reduced pressure passage 30C through which depressurized air flows, and is added to the facing surface 39 of the passage forming member 30. A pressure hole 38A connected to the pressure passage 30A and a pressure reducing hole 38C connected to the pressure reducing passage 30C are formed.
In this way, the air flowing between the substrate P and the facing surface 39 alleviates excessive adhesion between the substrate P and the facing surface 39, and is constant between the substrate P and the facing surface 39. Since the gap can be maintained, stable transfer of the substrate P becomes possible. Further, by maintaining a constant gap between the substrate P and the facing surface 39, the pressure response, the flow rate response, the frequency response, and the like are stabilized, so that the detection accuracy of the substrate P can be improved.

また、通路形成部材３０は、複数の加圧穴３８Ａと複数の減圧穴３８Ｃとが基板Ｐの搬送方向に間隔を空けて交互に並んでいる。
このようにすれば、基板Ｐと通路形成部材３０の対向面３９との間に流通する空気について、基板Ｐの位置における圧力のばらつきを抑制することができる。 Further, in the passage forming member 30, a plurality of pressure holes 38A and a plurality of pressure reducing holes 38C are alternately arranged at intervals in the transport direction of the substrate P.
In this way, it is possible to suppress variations in pressure at the position of the substrate P with respect to the air flowing between the substrate P and the facing surface 39 of the passage forming member 30.

また、検出部４０は、基板Ｐが実装位置（所定の位置）に搬送されたことを検出した時には、通路３０Ａ，３０Ｃ内の空気の加圧を停止し、減圧を行う。
このようにすれば、搬送した基板Ｐを実装位置に保持することができる。 Further, when the detection unit 40 detects that the substrate P has been conveyed to the mounting position (predetermined position), the detection unit 40 stops the pressurization of the air in the passages 30A and 30C and depressurizes the air.
In this way, the conveyed substrate P can be held at the mounting position.

また、検出部４０により基板Ｐが検出されなかったときに報知する表示部６９（報知手段）を備える。
このようにすれば、作業者に基板Ｐの搬送に異常が生じたことを知らせることができる。 Further, the detection unit 40 includes a display unit 69 (notification means) for notifying when the substrate P is not detected.
In this way, it is possible to notify the operator that an abnormality has occurred in the transfer of the substrate P.

また、検出部４０による検出結果に応じて基板Ｐの搬送速度を検出し、検出した搬送速度に応じて搬送コンベア１２（搬送部）を制御するコントローラ６０（制御手段）を備える。
このようにすれば、搬送コンベア１２により搬送される基板Ｐの速度が予め設定されている速度とは異なる場合には、検出部４０により検出した実際の基板Ｐの速度により搬送コンベア１２の速度を補正すること可能になる。 Further, the controller 60 (control means) is provided, which detects the transfer speed of the substrate P according to the detection result by the detection unit 40 and controls the transfer conveyor 12 (conveyor unit) according to the detected transfer speed.
In this way, when the speed of the substrate P conveyed by the transfer conveyor 12 is different from the preset speed, the speed of the transfer conveyor 12 is increased by the actual speed of the substrate P detected by the detection unit 40. It becomes possible to correct.

表面実装機１０（基板処理装置）は、基台１１、搬送コンベア１２、通路形成部材３０及び検出部４０を有する基板検出装置と、検出部４０により所定位置に搬送されたことが検出された基板Ｐに対して予め決められた処理を行うコントローラ６０（処理実行部）とを備える。
このようにすれば、基板検出装置の検出結果に基づいて、基板Ｐに対して予め決められた電子部品Ｂの実装、半田ペーストの塗布、接着剤の塗布、基板Ｐ検査等の処理を行うことができる。 The surface mounter 10 (board processing device) includes a substrate detection device having a base 11, a transfer conveyor 12, a passage forming member 30, and a detection unit 40, and a substrate detected by the detection unit 40 to be transported to a predetermined position. It includes a controller 60 (process execution unit) that performs predetermined processing on P.
In this way, based on the detection result of the substrate detection device, processing such as mounting a predetermined electronic component B on the substrate P, applying a solder paste, applying an adhesive, and inspecting the substrate P can be performed. Can be done.

＜実施形態２＞
実施形態２について、図１３，図１４及び図１１を参照しつつ説明する。実施形態１の通路形成部材３０は、検出用の通路３０Ｂと、加圧及び減圧用の通路３０Ａ，３０Ｃとを別々に構成したが、実施形態２では、通路形成部材８０の通路８１，８２は、検出用の通路と加圧又は減圧用の通路との一部を共用するものである。以下では、実施形態１と同一の構成については同一の符号を付して説明を省略する。 <Embodiment 2>
The second embodiment will be described with reference to FIGS. 13, 14, and 11. In the passage forming member 30 of the first embodiment, the passage 30B for detection and the passages 30A and 30C for pressurization and depressurization are separately configured, but in the second embodiment, the passages 81 and 82 of the passage forming member 80 are , A part of the passage for detection and the passage for pressurization or depressurization are shared. Hereinafter, the same configurations as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

通路形成部材８０の通路８１，８２は、通路形成部材８０の上下方向に貫通形成された検出用通路８１と、検出用通路８１に対して分岐し、基板Ｐの搬送方向に沿って延びる送風用通路８２とを有する。検出用通路８１は、対向面８０Ａに貫通形成された検出穴３８Ｂと、対向面８０Ａとは反対側の下面８０Ｂとの間に貫通形成されている。下面８０Ｂには、センサ４１が取り付けられている。 The passages 81 and 82 of the passage forming member 80 are for blowing air that branches from the detection passage 81 formed through the passage forming member 80 in the vertical direction and the detection passage 81 and extends along the conveying direction of the substrate P. It has a passage 82. The detection passage 81 is formed through the detection hole 38B formed through the facing surface 80A and the lower surface 80B on the opposite side of the facing surface 80A. A sensor 41 is attached to the lower surface 80B.

送風用通路８２における外部に露出する開口８２Ａには、圧縮機７５が接続されており、送風用通路８２には、圧縮機７５により加圧された空気が流通する。通路形成部材８０の対向面８０Ａ上を移動する基板Ｐは、検出穴３８Ｂの上を通ると検出穴３８Ｂを覆って基板Ｐと対向面８０Ａとの間に空気が流通する。検出穴３８Ｂに連なる通路８１内の空気は、検出穴３８Ｂの上を基板Ｐが通らず、開放された状態では、大気圧とほぼ同じとされるが、検出穴３８Ｂの上を基板Ｐが通ると、基板Ｐにより検出穴３８Ｂが覆われ、基板Ｐと対向面８０Ａとの間を流通する空気の影響を受けて、通路８１，８２の気圧及び空気の流れが変化する。これにより、空気を媒体としてセンサ４１に伝達される物理量（圧力、流量、周波数等）が変化し、センサ４１からの検出信号を受けた検出処理部６３は、基板Ｐの有無を検出することができる。 A compressor 75 is connected to the opening 82A exposed to the outside in the blower passage 82, and the air pressurized by the compressor 75 flows through the blower passage 82. When the substrate P moving on the facing surface 80A of the passage forming member 80 passes over the detection hole 38B, the substrate P covers the detection hole 38B and air flows between the substrate P and the facing surface 80A. The air in the passage 81 connected to the detection hole 38B is almost the same as the atmospheric pressure in the open state where the substrate P does not pass over the detection hole 38B, but the substrate P passes over the detection hole 38B. The detection hole 38B is covered with the substrate P, and the air pressure and the air flow of the passages 81 and 82 are changed under the influence of the air flowing between the substrate P and the facing surface 80A. As a result, the physical quantities (pressure, flow rate, frequency, etc.) transmitted to the sensor 41 using air as a medium change, and the detection processing unit 63 that receives the detection signal from the sensor 41 can detect the presence or absence of the substrate P. can.

図１３では、１つの検出穴３８Ｂが図示されているが、これに限られず、通路形成部材８０には、複数の検出穴３８Ｂが搬送方向に並んでいるようにしてもよい。また、通路８２には真空ポンプ７６を接続してもよく、この場合、例えば、基板Ｐが実装位置に移動したときには、通路８２に減圧された空気を流通させて基板Ｐの位置を保持するようにしてもよい。
ここで、検出穴３８Ｂが１つの場合であり、基板Pが検出穴３８Bに到達して一定の速度で検出穴３８Bを通過するときの基板Ｐの搬送速度の検出は、次のようにすることができる。例えば、基板Ｐが検出穴３８Ｂに到達し、基板有りが検出されてから基板Ｐが搬送されて基板Ｐが検出穴３８Ｂを通過し、基板無しが検出されるまでの時間Ｔ１及び基板Ｐの搬送方向の寸法Ｌ１を用いて、基板の寸法Ｌ１÷時間Ｔ１から搬送速度を算出することができる。又は、図１４に示すように、通路形成部材８０の対向面８０Ａに、基板搬送方向に沿って延びる検出溝８３を検出穴３８Ｂに連通するように形成し、予め基板Ｐを検出溝８３上で搬送させて、基板Ｐの位置と検出圧力との関係を確認し、この関係と基板Ｐの搬送時の検出圧力の変化とから基板Ｐが異なる２つの位置に到達したそれぞれの時点を検出し、それぞれの時点の時間差Ｔ２と２つの位置の距離Ｌ２とを用いて、距離Ｌ２÷時間差Ｔ２から基板Ｐの搬送速度を算出するようにしてもよい。
実施形態２によれば、実施形態１と比較して通路８１，８２の一部を共用することができるため、通路形成部材８０の構成を簡素化することが可能になる。 Although one detection hole 38B is shown in FIG. 13, the present invention is not limited to this, and a plurality of detection holes 38B may be arranged in the passage forming member 80 in the transport direction. Further, a vacuum pump 76 may be connected to the passage 82. In this case, for example, when the substrate P moves to the mounting position, decompressed air is circulated through the passage 82 to hold the position of the substrate P. It may be.
Here, when there is only one detection hole 38B, the transfer speed of the substrate P when the substrate P reaches the detection hole 38B and passes through the detection hole 38B at a constant speed is detected as follows. Can be done. For example, the time T1 from when the substrate P reaches the detection hole 38B and the presence of the substrate is detected until the substrate P is conveyed, the substrate P passes through the detection hole 38B, and the absence of the substrate is detected, and the substrate P is conveyed. Using the dimension L1 in the direction, the transport speed can be calculated from the dimension L1 ÷ time T1 of the substrate. Alternatively, as shown in FIG. 14, a detection groove 83 extending along the substrate transport direction is formed on the facing surface 80A of the passage forming member 80 so as to communicate with the detection hole 38B, and the substrate P is formed in advance on the detection groove 83. By transporting, the relationship between the position of the substrate P and the detected pressure is confirmed, and from this relationship and the change in the detected pressure during the transport of the substrate P, the respective time points when the substrate P reaches two different positions are detected. The transfer speed of the substrate P may be calculated from the distance L2 ÷ the time difference T2 by using the time difference T2 at each time point and the distance L2 at the two positions.
According to the second embodiment, since a part of the passages 81 and 82 can be shared as compared with the first embodiment, the configuration of the passage forming member 80 can be simplified.

＜他の実施形態＞
本明細書に記載された技術は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本明細書に記載された技術の技術的範囲に含まれる。
（１）上記実施形態では、基板処理装置として表面実装機１０としたが、これに限られず、例えば、基板Ｐに半田ペーストを印刷する印刷機や、基板Ｐ上に接着剤を塗布する塗布装置としてもよい。 <Other embodiments>
The techniques described herein are not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope of the techniques described herein.
(1) In the above embodiment, the surface mounter 10 is used as the substrate processing device, but the present invention is not limited to this, for example, a printing machine for printing solder paste on the substrate P or a coating apparatus for applying an adhesive on the substrate P. May be.

（２）上記実施形態では、基板Ｐを検出する構成としたが、上面に載置された基板Ｐを支持して基板Ｐと共に移動する例えば板状或いはブロック状の治具を基板支持体とし、この基板支持体を検出する構成としてもよい。 (2) In the above embodiment, the substrate P is detected, but a plate-shaped or block-shaped jig that supports the substrate P placed on the upper surface and moves together with the substrate P is used as the substrate support. It may be configured to detect this substrate support.

（３）センサ４１や音波検出器４６の位置は、上記実施形態の位置に限られず、異なる位置に設けることができる。例えば通路３０Ｂ，８２の内部にセンサ４１や音波検出器４６を設けてもよい。
（４）基板Ｐは、リジッド基板に限られず、フレキシブル基板としてもよい。 (3) The positions of the sensor 41 and the sound wave detector 46 are not limited to the positions of the above-described embodiment, and may be provided at different positions. For example, a sensor 41 or a sound wave detector 46 may be provided inside the passages 30B and 82.
(4) The substrate P is not limited to a rigid substrate, and may be a flexible substrate.

（５）通路形成部材３０，８０の位置、形状、大きさは適宜変更することができる。例えば、バックアップ装置２０に代えて通路形成部材を設けてもよく、通路形成部材の通路の減圧穴により基板Ｐを吸着し、通路形成部材にバックアップ装置（吸着ステージ）の機能を持たせるようにしてもよい。
（６）複数の検出手段を組み合わせて基板Ｐの位置を検出してもよい。例えば、空気を媒体とする検出部以外の検出手段（例えば光電センサによる基板の検出）を組み合わせてもよい。 (5) The positions, shapes, and sizes of the passage forming members 30 and 80 can be changed as appropriate. For example, a passage forming member may be provided instead of the backup device 20, and the substrate P is sucked by the pressure reducing hole of the passage of the passage forming member so that the passage forming member has the function of the backup device (suction stage). May be good.
(6) The position of the substrate P may be detected by combining a plurality of detection means. For example, a detection means other than the detection unit using air as a medium (for example, detection of the substrate by a photoelectric sensor) may be combined.

１０：表面実装機（基板処理装置）、１１：基台、１２：搬送コンベア（搬送部）、３０，８０：通路形成部材、３０Ａ～３０Ｃ，８１，８２：通路、３６Ｂ：貫通孔（検出穴）、３９，４２，８０Ａ：対向面、３８Ａ：加圧穴、３８Ｂ： 検出穴、３８Ｃ：減圧穴、４０：検出部、４１：センサ（検出部）、４５：音波発生源（検出部）、４６：音波検出器（検出部）、６０：コントローラ（制御手段、処理実行部）、６３：検出処理部（検出部）、７５：圧縮機、７６：真空ポンプ、Ｐ：基板 10: Surface mounter (board processing device), 11: Base, 12: Conveyance conveyor (conveyor), 30, 80: Passage forming member, 30A to 30C, 81, 82: Passage, 36B: Through hole (detection hole) ), 39, 42, 80A: Facing surface, 38A: Pressurized hole, 38B: Detection hole, 38C: Pressure reducing hole, 40: Detection unit, 41: Sensor (detection unit), 45: Sound source (detection unit), 46 : Sound detector (detection unit), 60: Controller (control means, processing execution unit), 63: Detection processing unit (detection unit), 75: Compressor, 76: Vacuum pump, P: Substrate

Claims (10)

基台と、
前記基台上の搬送路に沿って基板を搬送する搬送部と、
前記搬送路上に搬送された前記基板又は前記基板を支持する基板支持体に対向する対向面、前記対向面に形成される検出穴、及び、前記検出穴に連なる空気の通路を有する通路形成部材と、
前記通路の空気を媒体として伝達される物理量に基づいて前記基板を検出する検出部と、を備え、
前記通路形成部材は、加圧された空気が流通する加圧通路と、減圧された空気が流通する減圧通路と、を有し、前記通路形成部材の対向面には、前記加圧通路に連なる加圧穴と、前記減圧通路に連なる減圧穴と、が形成されており、
前記加圧穴から噴出された前記空気が前記減圧穴内に吸入されることで、前記通路形成部材の上を通る前記基板と前記対向面との間に前記空気が流通し、
前記検出部は、前記基板が所定の位置に搬送されたことを検出した時には、前記通路内の空気の加圧を停止し、減圧を行う、基板検出装置。 Base and
A transport unit that transports the substrate along the transport path on the base, and
A passage forming member having a facing surface facing the substrate or a substrate support supporting the substrate transported on the transport path, a detection hole formed in the facing surface, and an air passage connected to the detection hole. ,
A detection unit that detects the substrate based on a physical quantity transmitted using air in the passage as a medium is provided.
The passage forming member has a pressurized passage through which pressurized air flows and a reduced pressure passage through which decompressed air flows, and the facing surface of the passage forming member is connected to the pressurized passage. A pressure hole and a pressure reducing hole connected to the pressure reducing passage are formed.
When the air ejected from the pressure hole is sucked into the pressure reducing hole, the air flows between the substrate passing over the passage forming member and the facing surface .
When the detection unit detects that the substrate has been conveyed to a predetermined position, the detection unit stops pressurizing the air in the passage and depressurizes the substrate. 前記検出穴は、前記対向面における前記搬送路に沿う方向に複数設けられており、
前記検出部は、前記複数の検出穴のうち、前記基板又は前記基板支持体が対向する前記検出穴の位置に応じて異なる物理量に基づいて前記搬送路上における前記基板の位置を検出する請求項１に記載の基板検出装置。 A plurality of the detection holes are provided in the direction along the transport path on the facing surface.
The detection unit detects the position of the substrate on the transport path based on a physical quantity different depending on the position of the detection hole facing the substrate or the substrate support among the plurality of detection holes. The board detection device according to. 前記検出部は、前記空気の圧力により前記基板を検出する請求項１又は請求項２に記載の基板検出装置。 The substrate detection device according to claim 1 or 2, wherein the detection unit detects the substrate by the pressure of the air. 前記検出部は、前記空気の流量により前記基板を検出する請求項１又は請求項２に記載の基板検出装置。 The substrate detection device according to claim 1 or 2, wherein the detection unit detects the substrate by the flow rate of the air. 前記通路は、前記検出穴に連なる第１通路と、前記第１通路とは交差する方向に延びる第２通路と、を備え、
前記検出部は、前記第２通路内に音波を発生させる音波発生源と、前記第２通路の空気を介して伝搬される音波を検出する音波検出器と、を備える請求項１又は請求項２に記載の基板検出装置。 The passage includes a first passage connected to the detection hole and a second passage extending in a direction intersecting the first passage.
The detection unit includes a sound wave generation source that generates sound waves in the second passage and a sound wave detector that detects sound waves propagated through the air in the second passage according to claim 1 or 2. The substrate detection device according to. 前記通路には、加圧された空気が流通する請求項１から請求項５のいずれか一項に記載の基板検出装置。 The substrate detection device according to any one of claims 1 to 5, wherein pressurized air flows through the passage. 前記通路形成部材は、複数の前記加圧穴と複数の前記減圧穴とが前記基板の搬送方向に間隔を空けて交互に並んでいる請求項１から請求項６のいずれか一項に記載の基板検出装置。 The substrate according to any one of claims 1 to 6, wherein the passage forming member has a plurality of the pressurizing holes and a plurality of the decompression holes arranged alternately at intervals in the transport direction of the substrate. Detection device. 前記検出部により前記基板が検出されなかったときに報知する報知手段を備える請求項１から請求項７のいずれか一項に記載の基板検出装置。 The substrate detection device according to any one of claims 1 to 7 , further comprising a notification means for notifying when the substrate is not detected by the detection unit. 前記検出部による検出結果に応じて前記基板の搬送速度を検出し、検出した前記搬送速度に応じて前記搬送部を制御する制御手段を備える請求項１から請求項８のいずれか一項に記載の基板検出装置。 The invention according to any one of claims 1 to 8 , further comprising a control means for detecting the transport speed of the substrate according to the detection result by the detection unit and controlling the transport unit according to the detected transport speed. Board detector. 請求項１から請求項９のいずれか一項に記載の基板検出装置と、前記検出部により所定位置に搬送されたことが検出された前記基板に対して予め決められた処理を行う処理実行部と、を備える基板処理装置。 The substrate detection device according to any one of claims 1 to 9 , and a processing execution unit that performs predetermined processing on the substrate detected to have been conveyed to a predetermined position by the detection unit. And a substrate processing device.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001093961A (en) 1999-09-27 2001-04-06 Dainippon Screen Mfg Co Ltd Apparatus and method for detecting object and substrate treating apparatus
JP2006199483A (en) 2005-01-24 2006-08-03 Tokyo Electron Ltd Stage device and coating device
JP2009256002A (en) 2008-04-11 2009-11-05 Hitachi Plant Technologies Ltd Tabular body carrying device and its control method
JP2010045072A (en) 2008-08-08 2010-02-25 Ihi Corp Floating-carrying device
JP2012191029A (en) 2011-03-11 2012-10-04 Hitachi High-Tech Instruments Co Ltd Semiconductor element attachment device and attachment method thereof
WO2016035195A1 (en) 2014-09-04 2016-03-10 富士機械製造株式会社 Component mounting device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140498A (en) * 1992-02-16 1994-05-20 Ulvac Japan Ltd Electrostatic attracting device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001093961A (en) 1999-09-27 2001-04-06 Dainippon Screen Mfg Co Ltd Apparatus and method for detecting object and substrate treating apparatus
JP2006199483A (en) 2005-01-24 2006-08-03 Tokyo Electron Ltd Stage device and coating device
JP2009256002A (en) 2008-04-11 2009-11-05 Hitachi Plant Technologies Ltd Tabular body carrying device and its control method
JP2010045072A (en) 2008-08-08 2010-02-25 Ihi Corp Floating-carrying device
JP2012191029A (en) 2011-03-11 2012-10-04 Hitachi High-Tech Instruments Co Ltd Semiconductor element attachment device and attachment method thereof
WO2016035195A1 (en) 2014-09-04 2016-03-10 富士機械製造株式会社 Component mounting device

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