JP7089575B2 - リソグラフィ装置およびデバイス製造方法 - Google Patents
リソグラフィ装置およびデバイス製造方法 Download PDFInfo
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- JP7089575B2 JP7089575B2 JP2020201538A JP2020201538A JP7089575B2 JP 7089575 B2 JP7089575 B2 JP 7089575B2 JP 2020201538 A JP2020201538 A JP 2020201538A JP 2020201538 A JP2020201538 A JP 2020201538A JP 7089575 B2 JP7089575 B2 JP 7089575B2
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
本出願は、2016年12月14日に出願された欧州出願第16203967.1号および2017年3月27日に出願された欧州出願第17163003.1号の優先権を主張し、それらの全体が本明細書に援用される。
Claims (13)
- リソグラフィ装置のための流体ハンドリング構造であって、前記流体ハンドリング構造は、第1の一連の開口部が形成されている抽出器と、第2の一連の開口部が前記抽出器の径方向外側に形成されているガスナイフシステムと、前記抽出器と前記ガスナイフシステムの間にガスを提供するように構成された少なくとも1つの更なる開口部と、を備え、第1の一連の開口部、第2の一連の開口部、および前記少なくとも1つの更なる開口部は、基板および/または前記基板を支持するように構成された支持テーブルに向けられており、第1および第2の一連の開口部および前記少なくとも1つの更なる開口部の第1サブセットが第1チャンバと流体連絡し、第1および第2の一連の開口部および前記少なくとも1つの更なる開口部の第2サブセットが第2チャンバと流体連絡している流体ハンドリング構造。
- 前記第2の一連の開口部および前記少なくとも1つの更なる開口部を通じた流体流量は、前記支持テーブルの移動方向に従って制御可能である請求項1に記載の流体ハンドリング構造。
- 前記流体流量は、前記支持テーブル上で前記流体ハンドリング構造の経路に残存する液浸流体をブルドーザー効果により遠ざけるように、前記流体ハンドリング構造の前縁で増加される請求項2に記載の流体ハンドリング構造。
- 前記流体流量は、前記流体ハンドリング構造の経路における液浸流体を液浸空間に再び吸収しまたは前記第1の一連の開口部により抽出することができるように、減少される請求項2に記載の流体ハンドリング構造。
- 前記流体流量は、液浸流体の漏れが起こりにくくなるように、前記流体ハンドリング構造の後縁で増加される請求項2に記載の流体ハンドリング構造。
- 間に前記第1チャンバおよび前記第2チャンバを定めるように合わさっている第1部材および第2部材を備える請求項1から5のいずれかに記載の流体ハンドリング構造。
- 前記第2部材は、
前記第2の一連の開口部の第1側にある第1部分と、
前記第1側とは反対の、前記第2の一連の開口部の第2側にある第2部分と、
前記第1部分から前記第2部分へと前記第2の一連の開口部のうち2つの隣接する開口部の間を延在している接続部分とを備える請求項6に記載の流体ハンドリング構造。 - 凹部が、前記第1部材において、前記第2の一連の開口部の前記第2側に形成され、前記第2部分が前記凹部内へと延在している請求項7に記載の流体ハンドリング構造。
- 前記接続部分が、前記第2部分よりも細くなっている請求項8に記載の流体ハンドリング構造。
- 一部が前記第2部分に定められ一部が前記第1部材に定められた側面を有してキャビティが形成されている請求項7から9のいずれかに記載の流体ハンドリング構造。
- 前記第1チャンバと第2チャンバとの間にシールを形成するように前記キャビティに配置されている第3部材をさらに備え、前記シールは、前記第3部材と前記第1部材との間に、および、前記第3部材と前記第2部分との間に、形成される請求項10に記載の流体ハンドリング構造。
- 前記第2部分の前縁と前記凹部が共にラビリンスシールを形成するように構築された相補的表面を有する請求項8または9に記載の流体ハンドリング構造。
- 請求項1から12のいずれかに記載の流体ハンドリング構造を備える液浸リソグラフィ装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16203967 | 2016-12-14 | ||
EP16203967.1 | 2016-12-14 | ||
EP17163003 | 2017-03-27 | ||
EP17163003.1 | 2017-03-27 |
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JP2019531466A Division JP6806906B2 (ja) | 2016-12-14 | 2017-11-01 | リソグラフィ装置およびデバイス製造方法 |
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JP2021043468A JP2021043468A (ja) | 2021-03-18 |
JP7089575B2 true JP7089575B2 (ja) | 2022-06-22 |
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JP2020201538A Active JP7089575B2 (ja) | 2016-12-14 | 2020-12-04 | リソグラフィ装置およびデバイス製造方法 |
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Country | Link |
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US (3) | US11372336B2 (ja) |
JP (2) | JP6806906B2 (ja) |
KR (3) | KR102412406B1 (ja) |
CN (2) | CN113960889A (ja) |
NL (1) | NL2019842A (ja) |
TW (2) | TWI651601B (ja) |
WO (1) | WO2018108380A1 (ja) |
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KR102669931B1 (ko) * | 2019-04-17 | 2024-05-27 | 에이에스엠엘 네델란즈 비.브이. | 디바이스 제조 방법 및 컴퓨터 프로그램 |
CN114939688B (zh) * | 2022-05-04 | 2023-08-08 | 全南群英达电子有限公司 | 一种磁头生产用钻孔装置 |
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- 2017-11-01 JP JP2019531466A patent/JP6806906B2/ja active Active
- 2017-11-01 CN CN202111222387.1A patent/CN113960889A/zh active Pending
- 2017-11-01 WO PCT/EP2017/077950 patent/WO2018108380A1/en active Application Filing
- 2017-11-01 CN CN201780077686.6A patent/CN110088686B/zh active Active
- 2017-11-01 KR KR1020197019316A patent/KR102256686B1/ko active IP Right Grant
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- 2017-11-01 NL NL2019842A patent/NL2019842A/en unknown
- 2017-11-01 US US16/464,361 patent/US11372336B2/en active Active
- 2017-11-17 TW TW106139813A patent/TWI651601B/zh active
- 2017-11-17 TW TW107140076A patent/TWI686681B/zh active
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Also Published As
Publication number | Publication date |
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KR102256686B1 (ko) | 2021-05-26 |
US11372336B2 (en) | 2022-06-28 |
TWI651601B (zh) | 2019-02-21 |
KR102412406B1 (ko) | 2022-06-22 |
CN113960889A (zh) | 2022-01-21 |
JP2020502568A (ja) | 2020-01-23 |
NL2019842A (en) | 2018-06-18 |
JP6806906B2 (ja) | 2021-01-06 |
KR20190088553A (ko) | 2019-07-26 |
CN110088686A (zh) | 2019-08-02 |
US20210096471A1 (en) | 2021-04-01 |
TWI686681B (zh) | 2020-03-01 |
KR102328077B1 (ko) | 2021-11-17 |
US11774857B2 (en) | 2023-10-03 |
TW201921160A (zh) | 2019-06-01 |
CN110088686B (zh) | 2021-11-16 |
JP2021043468A (ja) | 2021-03-18 |
US20220308459A1 (en) | 2022-09-29 |
KR20210061473A (ko) | 2021-05-27 |
WO2018108380A1 (en) | 2018-06-21 |
KR20210141779A (ko) | 2021-11-23 |
US20240036477A1 (en) | 2024-02-01 |
TW201833675A (zh) | 2018-09-16 |
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