JP7060011B2 - Epoxy resin composition for encapsulation and electronic component equipment - Google Patents
Epoxy resin composition for encapsulation and electronic component equipment Download PDFInfo
- Publication number
- JP7060011B2 JP7060011B2 JP2019510060A JP2019510060A JP7060011B2 JP 7060011 B2 JP7060011 B2 JP 7060011B2 JP 2019510060 A JP2019510060 A JP 2019510060A JP 2019510060 A JP2019510060 A JP 2019510060A JP 7060011 B2 JP7060011 B2 JP 7060011B2
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- JP
- Japan
- Prior art keywords
- epoxy resin
- mass
- resin composition
- inorganic filler
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920000647 polyepoxide Polymers 0.000 title claims description 121
- 239000003822 epoxy resin Substances 0.000 title claims description 119
- 239000000203 mixture Substances 0.000 title claims description 65
- 238000005538 encapsulation Methods 0.000 title claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 48
- 239000011256 inorganic filler Substances 0.000 claims description 45
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 45
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 31
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 25
- 239000005011 phenolic resin Substances 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 9
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 8
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- 229930185605 Bisphenol Natural products 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 claims description 3
- -1 aliphatic aldehyde compound Chemical class 0.000 description 26
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 239000007822 coupling agent Substances 0.000 description 12
- 150000002989 phenols Chemical class 0.000 description 11
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000003086 colorant Substances 0.000 description 9
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 6
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 5
- 239000006082 mold release agent Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 3
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- XHWQYYPUYFYELO-UHFFFAOYSA-N ditridecyl phosphite Chemical compound CCCCCCCCCCCCCOP([O-])OCCCCCCCCCCCCC XHWQYYPUYFYELO-UHFFFAOYSA-N 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 3
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 3
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- 150000004057 1,4-benzoquinones Chemical class 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 2
- 150000004780 naphthols Chemical class 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 150000003003 phosphines Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229960001755 resorcinol Drugs 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- XGINAUQXFXVBND-UHFFFAOYSA-N 1,2,6,7,8,8a-hexahydropyrrolo[1,2-a]pyrimidine Chemical compound N1CC=CN2CCCC21 XGINAUQXFXVBND-UHFFFAOYSA-N 0.000 description 1
- AHBGXHAWSHTPOM-UHFFFAOYSA-N 1,3,2$l^{4},4$l^{4}-dioxadis***e 2,4-dioxide Chemical compound O=[Sb]O[Sb](=O)=O AHBGXHAWSHTPOM-UHFFFAOYSA-N 0.000 description 1
- MODAACUAXYPNJH-UHFFFAOYSA-N 1-(methoxymethyl)-4-[4-(methoxymethyl)phenyl]benzene Chemical group C1=CC(COC)=CC=C1C1=CC=C(COC)C=C1 MODAACUAXYPNJH-UHFFFAOYSA-N 0.000 description 1
- SDRZFSPCVYEJTP-UHFFFAOYSA-N 1-ethenylcyclohexene Chemical compound C=CC1=CCCCC1 SDRZFSPCVYEJTP-UHFFFAOYSA-N 0.000 description 1
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 description 1
- BLBVJHVRECUXKP-UHFFFAOYSA-N 2,3-dimethoxy-1,4-dimethylbenzene Chemical group COC1=C(C)C=CC(C)=C1OC BLBVJHVRECUXKP-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- GGIBUEPJJRWWNM-UHFFFAOYSA-N 2-[[2-[2-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical class C1OC1COC1=CC=CC=C1C1=CC=CC=C1OCC1CO1 GGIBUEPJJRWWNM-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- KKOHCQAVIJDYAF-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O KKOHCQAVIJDYAF-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- VGDAMJGKFYMEDE-UHFFFAOYSA-N 5-(dimethoxymethylsilyl)pentane-1,3-diamine Chemical compound NCCC(CC[SiH2]C(OC)OC)N VGDAMJGKFYMEDE-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KNANZMNFPYPCHN-UHFFFAOYSA-N N'-[2-(dimethoxymethylsilyl)propan-2-yl]ethane-1,2-diamine Chemical compound COC(OC)[SiH2]C(C)(C)NCCN KNANZMNFPYPCHN-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910000411 antimony tetroxide Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 229940027987 antiseptic and disinfectant phenol and derivative Drugs 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- CRGRWBQSZSQVIE-UHFFFAOYSA-N diazomethylbenzene Chemical compound [N-]=[N+]=CC1=CC=CC=C1 CRGRWBQSZSQVIE-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 1
- XMQYIPNJVLNWOE-UHFFFAOYSA-N dioctyl hydrogen phosphite Chemical compound CCCCCCCCOP(O)OCCCCCCCC XMQYIPNJVLNWOE-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- NEXSMEBSBIABKL-UHFFFAOYSA-N hexamethyldisilane Chemical compound C[Si](C)(C)[Si](C)(C)C NEXSMEBSBIABKL-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- UJNZOIKQAUQOCN-UHFFFAOYSA-N methyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C)C1=CC=CC=C1 UJNZOIKQAUQOCN-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000004206 montan acid ester Substances 0.000 description 1
- 235000013872 montan acid ester Nutrition 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 235000019809 paraffin wax Nutrition 0.000 description 1
- 235000019271 petrolatum Nutrition 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001184 polypeptide Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 102000004196 processed proteins & peptides Human genes 0.000 description 1
- 108090000765 processed proteins & peptides Proteins 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 235000002639 sodium chloride Nutrition 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N trans-stilbene Chemical compound C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- QLAGHGSFXJZWKY-UHFFFAOYSA-N triphenylborane;triphenylphosphane Chemical compound C1=CC=CC=C1B(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QLAGHGSFXJZWKY-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Description
本発明は、封止用エポキシ樹脂組成物及び電子部品装置に関する。 The present invention relates to an epoxy resin composition for encapsulation and an electronic component device.
近年、スマートフォン等の電子機器の軽薄短小化及び高機能化が進んでいる。これに伴い、高速大容量の情報を取り扱う電子機器から発生する熱が増大しており、電子機器が誤作動を起こす恐れがある。そのため、電子機器内部から発生した熱を効率よく放熱すること、すなわち高い放熱性（高い熱伝導性）が求められている。放熱性の高い機器構造等が検討されるとともに、封止材自体の高放熱化も検討されている。その手法として、放熱性に優れたアルミナのような無機充填材の使用、無機充填材の高充填化等が検討されてきた（例えば、特許文献１～３）。 In recent years, electronic devices such as smartphones have become lighter, thinner, shorter, smaller, and more sophisticated. Along with this, heat generated from electronic devices that handle high-speed and large-capacity information is increasing, and there is a risk that the electronic devices will malfunction. Therefore, it is required to efficiently dissipate heat generated from the inside of an electronic device, that is, to have high heat dissipation (high thermal conductivity). In addition to studying equipment structures with high heat dissipation, high heat dissipation of the encapsulant itself is also being studied. As the method, the use of an inorganic filler such as alumina having excellent heat dissipation, high filling of the inorganic filler, and the like have been studied (for example, Patent Documents 1 to 3).
しかしながら、アルミナのような放熱性に優れた無機充填材を高充填化させた封止用エポキシ樹脂組成物は、熱時硬度が低下し、必ずしも連続成形性に優れた材料ではないという問題がある。 However, the epoxy resin composition for encapsulation, which is made by highly filling an inorganic filler having excellent heat dissipation such as alumina, has a problem that the hardness at the time of heat is lowered and the material is not necessarily excellent in continuous moldability. ..
本発明の一形態は、熱時硬度及び熱伝導性に優れる封止用エポキシ樹脂組成物並びにこれを用いて封止された素子を備える電子部品装置を提供することを目的とする。 One aspect of the present invention is an object of the present invention to provide an epoxy resin composition for sealing having excellent thermal hardness and thermal conductivity, and an electronic component device including an element sealed using the same.
前述のように、電子機器から発生する熱を放熱するための手法として、放熱性に優れたアルミナの高充填化がこれまで行われてきたが、熱時硬度が低下し、連続成形性に問題がある。本発明者らは、鋭意検討の結果、アルミナの一部を別の無機充填材に置き換えることにより、エポキシ樹脂組成物の優れた熱伝導性と優れた熱時硬度とを両立させるに至った。
例えば、上記課題を解決するための手段には、以下の実施態様が含まれる。As mentioned above, as a method for dissipating heat generated from electronic devices, high filling of alumina with excellent heat dissipation has been performed so far, but the hardness at the time of heat decreases, and there is a problem in continuous formability. There is. As a result of diligent studies, the present inventors have achieved both excellent thermal conductivity and excellent thermal hardness of the epoxy resin composition by replacing a part of alumina with another inorganic filler.
For example, the means for solving the above problems include the following embodiments.
＜１＞ （Ａ）エポキシ樹脂、（Ｂ）硬化剤、（Ｃ）硬化促進剤及び（Ｄ）無機充填材を含み、前記無機充填材は、無機充填材全量に対し、アルミナを７５質量％～９８質量％含む封止用エポキシ樹脂組成物。
＜２＞ 前記無機充填材は、アルミナと、窒化ケイ素、窒化ホウ素、酸化マグネシウム、酸化亜鉛、炭化ケイ素及び窒化アルミニウムからなる群より選択される少なくとも一つの無機充填材と、を含む＜１＞に記載の封止用エポキシ樹脂組成物。
＜３＞ 前記硬化剤がフェノール硬化剤である＜１＞又は＜２＞に記載の封止用エポキシ樹脂組成物。<1> Containing (A) epoxy resin, (B) curing agent, (C) curing accelerator, and (D) inorganic filler, the inorganic filler contains 75% by mass or more of alumina with respect to the total amount of the inorganic filler. Epoxy resin composition for encapsulation containing 98% by mass.
<2> The inorganic filler includes alumina and at least one inorganic filler selected from the group consisting of silicon nitride, boron nitride, magnesium oxide, zinc oxide, silicon carbide and aluminum nitride in <1>. The sealing epoxy resin composition according to the above.
<3> The epoxy resin composition for encapsulation according to <1> or <2>, wherein the curing agent is a phenol curing agent.
＜４＞ 素子と、前記素子を封止する＜１＞～＜３＞のいずれか１つに記載の封止用エポキシ樹脂組成物の硬化物とを備える電子部品装置。 <4> An electronic component device comprising an element and a cured product of the epoxy resin composition for encapsulation according to any one of <1> to <3> for encapsulating the element.
本発明の一形態によれば、熱時硬度及び熱伝導性に優れる封止用エポキシ樹脂組成物並びにこれを用いて封止された素子を備える電子部品装置を提供することができる。 According to one embodiment of the present invention, it is possible to provide an epoxy resin composition for sealing having excellent thermal hardness and thermal conductivity, and an electronic component device including an element sealed using the same.
以下、本発明を実施するための形態について詳細に説明する。但し、本発明は以下の実施形態に限定されるものではない。以下の実施形態において、その構成要素（要素ステップ等も含む）は、特に明示した場合を除き、必須ではない。数値及びその範囲についても同様であり、本発明を制限するものではない。 Hereinafter, embodiments for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the components (including element steps and the like) are not essential unless otherwise specified. The same applies to the numerical values and their ranges, and does not limit the present invention.
本開示において「～」を用いて示された数値範囲には、「～」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
本開示中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本開示中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
本開示において各成分は該当する物質を複数種含んでいてもよい。組成物中に各成分に該当する物質が複数種存在する場合、各成分の含有率は、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率を意味する。In the present disclosure, the numerical range indicated by using "-" includes the numerical values before and after "-" as the minimum value and the maximum value, respectively.
In the numerical range described stepwise in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of the numerical range described in another stepwise description. .. Further, in the numerical range described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
In the present disclosure, each component may contain a plurality of applicable substances. When a plurality of substances corresponding to each component are present in the composition, the content of each component means the total content of the plurality of substances present in the composition unless otherwise specified.
〔封止用エポキシ樹脂組成物〕
本開示の封止用エポキシ樹脂組成物は、（Ａ）エポキシ樹脂、（Ｂ）硬化剤、（Ｃ）硬化促進剤及び（Ｄ）無機充填材を含み、前記無機充填材は、無機充填材全量に対し、アルミナを７５質量％～９８質量％含む。これにより、熱時硬度の低下を抑制しつつ高い放熱性を有する封止用エポキシ樹脂組成物が提供される。また、本開示の封止用エポキシ樹脂組成物は、例えば、電子部品装置を封止するために用いられる。[Epoxy resin composition for encapsulation]
The sealing epoxy resin composition of the present disclosure contains (A) epoxy resin, (B) curing agent, (C) curing accelerator and (D) inorganic filler, and the inorganic filler is the total amount of the inorganic filler. On the other hand, it contains 75% by mass to 98% by mass of alumina. This provides a sealing epoxy resin composition having high heat dissipation while suppressing a decrease in hardness at the time of heat. Further, the sealing epoxy resin composition of the present disclosure is used, for example, for sealing an electronic component device.
［（Ａ）エポキシ樹脂］
本開示の封止用エポキシ樹脂組成物（以下、「エポキシ樹脂組成物」とも称する。）は、（Ａ）エポキシ樹脂を含む。（Ａ）エポキシ樹脂としては、分子中にエポキシ基を有するものであればその種類は特に制限されない。[(A) Epoxy resin]
The sealing epoxy resin composition of the present disclosure (hereinafter, also referred to as “epoxy resin composition”) contains (A) an epoxy resin. The type of the epoxy resin (A) is not particularly limited as long as it has an epoxy group in the molecule.
（Ａ）エポキシ樹脂として具体的には、フェノール、クレゾール、キシレノール、レゾルシン、カテコール、ビスフェノールＡ、ビスフェノールＦ等のフェノール化合物及びα－ナフトール、β－ナフトール、ジヒドロキシナフタレン等のナフトール化合物からなる群より選ばれる少なくとも１種のフェノール性化合物と、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド等の脂肪族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるノボラック樹脂をエポキシ化したものであるノボラック型エポキシ樹脂（フェノールノボラック型エポキシ樹脂、オルソクレゾールノボラック型エポキシ樹脂等）；上記フェノール性化合物と、ベンズアルデヒド、サリチルアルデヒド等の芳香族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるトリフェニルメタン型フェノール樹脂をエポキシ化したものであるトリフェニルメタン型エポキシ樹脂；上記フェノール化合物及びナフトール化合物と、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド、ベンズアルデヒド、サリチルアルデヒド等のアルデヒド化合物とを酸性触媒下で共縮合させて得られるノボラック樹脂をエポキシ化したものである共重合型エポキシ樹脂；ビスフェノールＡ、ビスフェノールＡＤ、ビスフェノールＦ等のジグリシジルエーテルであるジフェニルメタン型エポキシ樹脂；アルキル置換又は非置換のビフェノールのジグリシジルエーテルであるビフェニル型エポキシ樹脂；スチルベン系フェノール化合物のジグリシジルエーテルであるスチルベン型エポキシ樹脂；ビスフェノールＳ等のジグリシジルエーテルである硫黄原子含有エポキシ樹脂；ブタンジオール、ポリエチレングリコール、ポリプロピレングリコール等のアルコール類のグリシジルエーテルであるエポキシ樹脂；フタル酸、イソフタル酸、テトラヒドロフタル酸、ダイマー酸等の多価カルボン酸化合物のグリシジルエステルであるグリシジルエステル型エポキシ樹脂；アニリン、ジアミノジフェニルメタン、イソシアヌル酸等の窒素原子に結合した活性水素をグリシジル基で置換したものであるグリシジルアミン型エポキシ樹脂；ジシクロペンタジエンとフェノール化合物の共縮合樹脂をエポキシ化したものであるジシクロペンタジエン型エポキシ樹脂；分子内のオレフィン結合をエポキシ化したものであるビニルシクロヘキセンジエポキシド、３，４－エポキシシクロヘキシルメチル－３，４－エポキシシクロヘキサンカルボキシレート、２－（３，４－エポキシ）シクロヘキシル－５，５－スピロ（３，４－エポキシ）シクロヘキサン－ｍ－ジオキサン等の脂環型エポキシ樹脂；パラキシリレン変性フェノール樹脂のグリシジルエーテルであるパラキシリレン変性エポキシ樹脂；メタキシリレン変性フェノール樹脂のグリシジルエーテルであるメタキシリレン変性エポキシ樹脂；テルペン変性フェノール樹脂のグリシジルエーテルであるテルペン変性エポキシ樹脂；ジシクロペンタジエン変性フェノール樹脂のグリシジルエーテルであるジシクロペンタジエン変性エポキシ樹脂；シクロペンタジエン変性フェノール樹脂のグリシジルエーテルであるシクロペンタジエン変性エポキシ樹脂；多環芳香環変性フェノール樹脂のグリシジルエーテルである多環芳香環変性エポキシ樹脂；ナフタレン環含有フェノール樹脂のグリシジルエーテルであるナフタレン型エポキシ樹脂；ハロゲン化フェノールノボラック型エポキシ樹脂；ハイドロキノン型エポキシ樹脂；トリメチロールプロパン型エポキシ樹脂；オレフィン結合を過酢酸等の過酸で酸化して得られる線状脂肪族エポキシ樹脂；フェノールアラルキル樹脂、ナフトールアラルキル樹脂等のアラルキル型フェノール樹脂をエポキシ化したものであるアラルキル型エポキシ樹脂；などが挙げられる。更にはシリコーン樹脂のエポキシ化物、アクリル樹脂のエポキシ化物等もエポキシ樹脂として挙げられる。これらのエポキシ樹脂は、１種を単独で用いても２種以上を組み合わせて用いてもよい。 (A) The epoxy resin is specifically selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A and bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol and dihydroxynaphthalene. A novolak type epoxy resin obtained by epoxidizing a novolak resin obtained by condensing or cocondensing at least one phenolic compound and an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc. under an acidic catalyst (novolak type epoxy resin). Phenol novolak type epoxy resin, orthocresol novolak type epoxy resin, etc.); Triphenylmethane type phenol obtained by condensing or cocondensing the above phenolic compound with aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde under an acidic catalyst. A triphenylmethane-type epoxy resin obtained by epoxidizing a resin; obtained by co-condensing the above-mentioned phenol compound and naphthol compound with an aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde under an acidic catalyst. Copolymerized epoxy resin obtained by epoxidizing a novolak resin; diphenylmethane type epoxy resin which is a diglycidyl ether such as bisphenol A, bisphenol AD, and bisphenol F; biphenyl type which is an alkyl-substituted or unsubstituted biphenol diglycidyl ether. Epoxy resin; Stilben-type epoxy resin which is a diglycidyl ether of a stilben-based phenol compound; Sulfur atom-containing epoxy resin which is a diglycidyl ether such as bisphenol S; Glycidyl ether of alcohols such as butanediol, polyethylene glycol and polypropylene glycol. Epoxy resin; glycidyl ester type epoxy resin which is a glycidyl ester of a polyvalent carboxylic acid compound such as phthalic acid, isophthalic acid, tetrahydrophthalic acid, dimer acid; active hydrogen bonded to a nitrogen atom such as aniline, diaminodiphenylmethane, isocyanuric acid, etc. A glycidylamine-type epoxy resin substituted with a glycidyl group; a dicyclopentadiene-type epoxy resin obtained by epoxidizing a cocondensation resin of dicyclopentadiene and a phenol compound; an epoxidized olefin bond in the molecule. Vinyl cyclohexene diepoki Fats such as sid, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 2- (3,4-epoxy) cyclohexyl-5,5-spiro (3,4-epoxy) cyclohexane-m-dioxane Cyclic epoxy resin; paraxylylene-modified epoxy resin that is a glycidyl ether of paraxylylene-modified phenol resin; metaxylylene-modified epoxy resin that is a glycidyl ether of metaxylylene-modified phenol resin; terpene-modified epoxy resin that is glycidyl ether of terpene-modified phenol resin; dicyclopentadiene Dicyclopentadiene-modified epoxy resin, which is a glycidyl ether of a modified phenol resin; cyclopentadiene-modified epoxy resin, which is a glycidyl ether of a cyclopentadiene-modified phenol resin; Naphthalene type epoxy resin which is glycidyl ether of naphthalene ring-containing phenol resin; Halogen halide phenol novolac type epoxy resin; Hydroquinone type epoxy resin; Trimethylol propane type epoxy resin; Examples thereof include a linear aliphatic epoxy resin; an aralkyl type epoxy resin obtained by epoxidizing an aralkyl type phenol resin such as a phenol aralkyl resin and a naphthol aralkyl resin; and the like. Further, epoxies of silicone resin, epoxies of acrylic resin and the like can also be mentioned as epoxy resins. These epoxy resins may be used alone or in combination of two or more.
（Ａ）エポキシ樹脂のエポキシ当量（分子量／エポキシ基数）は、特に制限されない。成形性、耐リフロー性、電気的信頼性等の各種特性バランスの観点からは、１００ｇ／ｅｑ～１０００ｇ／ｅｑであることが好ましく、１５０ｇ／ｅｑ～５００ｇ／ｅｑであることがより好ましい。 (A) The epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of balance of various characteristics such as moldability, reflow resistance, and electrical reliability, it is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq.
（Ａ）エポキシ樹脂のエポキシ当量は、ＪＩＳ Ｋ ７２３６：２００９に準じた方法で測定される値とする。 (A) The epoxy equivalent of the epoxy resin shall be a value measured by a method according to JIS K 7236: 2009.
（Ａ）エポキシ樹脂の融点又は軟化点は、特に制限されない。成形性と耐リフロー性の観点からは４０℃～１８０℃であることが好ましく、エポキシ樹脂組成物の調製の際の取扱い性の観点からは５０℃～１３０℃であることがより好ましい。 (A) The melting point or softening point of the epoxy resin is not particularly limited. From the viewpoint of moldability and reflow resistance, the temperature is preferably 40 ° C. to 180 ° C., and from the viewpoint of handleability when preparing the epoxy resin composition, the temperature is more preferably 50 ° C. to 130 ° C.
（Ａ）エポキシ樹脂の融点又は軟化点は、ＪＩＳ Ｋ ７２３４：１９８６及びＪＩＳ Ｋ ７２３３：１９８６に記載の単一円筒回転粘度計法により測定される値とする。 (A) The melting point or softening point of the epoxy resin shall be a value measured by the single cylinder rotary viscometer method described in JIS K 7234: 1986 and JIS K 7233: 1986.
エポキシ樹脂組成物中の（Ａ）エポキシ樹脂の含有率は、強度、流動性、耐熱性、成形性等の観点から２質量％～１０質量％であることが好ましく、２．５質量％～７．５質量％であることがより好ましく、３質量％～６．５質量％であることが更に好ましい。 The content of the (A) epoxy resin in the epoxy resin composition is preferably 2% by mass to 10% by mass, preferably 2.5% by mass to 7% by mass, from the viewpoints of strength, fluidity, heat resistance, moldability, and the like. It is more preferably 5.5% by mass, further preferably 3% by mass to 6.5% by mass.
［（Ｂ）硬化剤］
本開示のエポキシ樹脂組成物は、（Ｂ）硬化剤を含む。硬化剤の種類は特に制限されず、（Ａ）エポキシ樹脂の種類、エポキシ樹脂組成物の所望の特性等に応じて選択できる。[(B) Curing agent]
The epoxy resin composition of the present disclosure contains (B) a curing agent. The type of the curing agent is not particularly limited, and can be selected according to (A) the type of epoxy resin, desired properties of the epoxy resin composition, and the like.
（Ｂ）硬化剤として具体的には、フェノール硬化剤、アミン硬化剤、酸無水物硬化剤、ポリメルカプタン硬化剤、ポリアミノアミド硬化剤、イソシアネート硬化剤、ブロックイソシアネート硬化剤等が挙げられる。耐熱性向上の観点からは、硬化剤は、フェノール硬化剤が好ましい。 Specific examples of the (B) curing agent include a phenol curing agent, an amine curing agent, an acid anhydride curing agent, a polypeptide curing agent, a polyaminoamide curing agent, an isocyanate curing agent, and a blocked isocyanate curing agent. From the viewpoint of improving heat resistance, the curing agent is preferably a phenol curing agent.
フェノール硬化剤として具体的には、レゾルシン、カテコール、ビスフェノールＡ、ビスフェノールＦ、フェノール、クレゾール、キシレノール、フェニルフェノール、アミノフェノール等のフェノール化合物及びα－ナフトール、β－ナフトール、ジヒドロキシナフタレン等のナフトール化合物からなる群より選ばれる少なくとも一種のフェノール性化合物と、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド、ベンズアルデヒド、サリチルアルデヒド等のアルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるノボラック型フェノール樹脂；上記フェノール性化合物と、ジメトキシパラキシレン、ビス（メトキシメチル）ビフェニル等とから合成されるフェノールアラルキル樹脂、ナフトールアラルキル樹脂等のアラルキル型フェノール樹脂；パラキシリレン変性フェノール樹脂；メタキシリレン変性フェノール樹脂；メラミン変性フェノール樹脂；テルペン変性フェノール樹脂；上記フェノール性化合物と、ジシクロペンタジエンとから共重合により合成されるジシクロペンタジエン型フェノール樹脂及びジシクロペンタジエン型ナフトール樹脂；シクロペンタジエン変性フェノール樹脂；多環芳香環変性フェノール樹脂；ビフェニル型フェノール樹脂などが挙げられる。例えば、耐リフロー性向上の観点から、フェノールアラルキル樹脂が好ましい。
これらのフェノール硬化剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。Specific examples of the phenolic curing agent include phenol compounds such as resorcin, catechol, bisphenol A, bisphenol F, phenol, cresol, xylenol, phenylphenol, and aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene. A novolak-type phenolic resin obtained by condensing or co-condensing at least one phenolic compound selected from the above group with an aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, salicylaldehyde, etc. under an acidic catalyst; the above-mentioned phenolic property. Phenolic aralkyl resin synthesized from compounds and dimethoxyparaxylene, bis (methoxymethyl) biphenyl, etc., naphthol aralkyl resin and other aralkyl-type phenolic resins; paraxylylene-modified phenolic resin; metaxylylene-modified phenolic resin; melamine-modified phenolic resin; terpene-modified Phenolic resin; dicyclopentadiene-type phenol resin and dicyclopentadiene-type naphthol resin synthesized by copolymerization of the above phenolic compound with dicyclopentadiene; cyclopentadiene-modified phenolic resin; polycyclic aromatic ring-modified phenolic resin; biphenyl-type Examples include phenolic resin. For example, a phenol aralkyl resin is preferable from the viewpoint of improving reflow resistance.
These phenol curing agents may be used alone or in combination of two or more.
（Ｂ）硬化剤の官能基当量（フェノール硬化剤の場合は水酸基当量）は、特に制限されない。成形性、耐リフロー性、電気的信頼性等の各種特性バランスの観点からは、７０ｇ／ｅｑ～１０００ｇ／ｅｑであることが好ましく、８０ｇ／ｅｑ～５００ｇ／ｅｑであることがより好ましい。 (B) The functional group equivalent of the curing agent (hydroxyl equivalent in the case of the phenol curing agent) is not particularly limited. From the viewpoint of balance of various characteristics such as moldability, reflow resistance, and electrical reliability, it is preferably 70 g / eq to 1000 g / eq, and more preferably 80 g / eq to 500 g / eq.
フェノール硬化剤の水酸基当量は、ＪＩＳ Ｋ ００７０：１９９２に準じた方法により測定される値とする。 The hydroxyl group equivalent of the phenol curing agent shall be a value measured by a method according to JIS K 0070: 1992.
（Ｂ）硬化剤の融点又は軟化点は、特に制限されない。成形性と耐リフロー性の観点からは、４０℃～１８０℃であることが好ましく、エポキシ樹脂組成物の製造時における取扱い性の観点からは、５０℃～１３０℃であることがより好ましい。 (B) The melting point or softening point of the curing agent is not particularly limited. From the viewpoint of moldability and reflow resistance, the temperature is preferably 40 ° C. to 180 ° C., and from the viewpoint of handleability during production of the epoxy resin composition, the temperature is more preferably 50 ° C. to 130 ° C.
（Ｂ）硬化剤の融点又は軟化点は、ＪＩＳ Ｋ ７２３４：１９８６及びＪＩＳ Ｋ ７２３３：１９８６に記載の単一円筒回転粘度計法により測定される値とする。 (B) The melting point or softening point of the curing agent shall be a value measured by the single cylinder rotary viscometer method described in JIS K 7234: 1986 and JIS K 7233: 1986.
（Ａ）エポキシ樹脂と（Ｂ）硬化剤との当量比、すなわち（Ａ）エポキシ樹脂中の官能基数に対する（Ｂ）硬化剤中の官能基数の比（（Ｂ）硬化剤中の官能基数／（Ａ）エポキシ樹脂中の官能基数）は、特に制限されない。それぞれの未反応分を少なく抑える観点からは、０．５～１．５の範囲に設定されることが好ましく、０．６～１．３の範囲に設定されることがより好ましく、０．７～１．２の範囲に設定されることが更に好ましい。 The equivalent ratio of (A) epoxy resin to (B) curing agent, that is, the ratio of the number of functional groups in (B) curing agent to (A) the number of functional groups in the epoxy resin ((B) the number of functional groups in the curing agent / ( A) The number of functional groups in the epoxy resin) is not particularly limited. From the viewpoint of suppressing each unreacted component to a small amount, it is preferably set in the range of 0.5 to 1.5, more preferably set in the range of 0.6 to 1.3, and 0.7. It is more preferable to set it in the range of about 1.2.
［（Ｃ）硬化促進剤］
本開示のエポキシ樹脂組成物は、（Ｃ）硬化促進剤を含む。硬化促進剤の種類は特に制限されず、（Ａ）エポキシ樹脂の種類、エポキシ樹脂組成物の所望の特性等に応じて選択できる。また、（Ｃ）硬化促進剤としては、エポキシ樹脂組成物の電気的信頼性及び成形時の流動性の観点から、リン系の硬化促進剤が好ましい。[(C) Curing accelerator]
The epoxy resin composition of the present disclosure contains (C) a curing accelerator. The type of the curing accelerator is not particularly limited, and can be selected according to (A) the type of epoxy resin, desired properties of the epoxy resin composition, and the like. Further, as the (C) curing accelerator, a phosphorus-based curing accelerator is preferable from the viewpoint of electrical reliability and fluidity during molding of the epoxy resin composition.
（Ｃ）硬化促進剤として具体的には、１，８－ジアザ－ビシクロ（５，４，０）ウンデセン－７、１，５－ジアザ－ビシクロ（４，３，０）ノネン、５，６－ジブチルアミノ－１，８－ジアザ－ビシクロ（５，４，０）ウンデセン－７、ベンジルジメチルアミン、トリエタノールアミン、ジメチルアミノエタノール、トリス（ジメチルアミノメチル）フェノール等の３級アミン類及びこれらの誘導体、２－メチルイミダゾール、２－フェニルイミダゾール、２－フェニル－４－メチルイミダゾール等のイミダゾール類及びこれらの誘導体、トリブチルホスフィン、メチルジフェニルホスフィン、トリフェニルホスフィン、ジフェニルホスフィン、フェニルホスフィン等の有機ホスフィン類及びこれらのホスフィン類に無水マレイン酸、ベンゾキノン、ジアゾフェニルメタン等のπ結合をもつ化合物を付加してなる分子内分極を有するリン化合物、テトラフェニルホスホニウムテトラフェニルボレート、トリフェニルホスフィンテトラフェニルボレート、２－エチル－４－メチルイミダゾールテトラフェニルボレート、Ｎ－メチルモテトラフェニルホスホニウムテトラフェニルボレート、トリフェニルホスフィンとベンゾキノンの付加物、トリパラトリルホスフィンとベンゾキノンの付加物、トリフェニルホスホニウムトリフェニルボランなどが挙げられる。これらの硬化促進剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。 (C) Specifically, as a curing accelerator, 1,8-diaza-bicyclo (5,4,0) undecene-7, 1,5-diaza-bicyclo (4,3,0) nonen, 5,6- Tertiary amines such as dibutylamino-1,8-diaza-bicyclo (5,4,0) undecene-7, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol and derivatives thereof. , 2-Methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and other imidazoles and derivatives thereof, tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, phenylphosphine and other organic phosphines and A phosphorus compound having intramolecular polarization, obtained by adding a compound having a π bond such as maleic anhydride, benzoquinone, or diazophenylmethane to these phosphines, tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenylborate, 2- Examples thereof include ethyl-4-methylimidazole tetraphenylborate, N-methylmotetraphenylphosphonium tetraphenylborate, triphenylphosphine and benzoquinone adducts, tripalatorylphosphine and benzoquinone adducts, triphenylphosphonium triphenylborane and the like. These curing accelerators may be used alone or in combination of two or more.
エポキシ樹脂組成物中の（Ｃ）硬化促進剤の含有率は硬化促進効果が得られれば特に限定されない。エポキシ樹脂組成物中の（Ｃ）硬化促進剤の含有率は、（Ａ）エポキシ樹脂と（Ｂ）硬化剤の合計量に対して、０．１質量％～８．０質量％であることが好ましく、０．５質量％～５．０質量％であることがより好ましく、１．０質量％～３．０質量％であることが更に好ましい。（Ｃ）硬化促進剤の含有率が（Ａ）エポキシ樹脂と（Ｂ）硬化剤の合計量に対して、０．１質量％以上であると、硬化時間の短縮化が図れる傾向にあり、８．０質量％以下であると、硬化速度が速すぎず良好な成形品が得られる傾向にある。 The content of the (C) curing accelerator in the epoxy resin composition is not particularly limited as long as the curing promoting effect can be obtained. The content of the (C) curing accelerator in the epoxy resin composition may be 0.1% by mass to 8.0% by mass with respect to the total amount of the (A) epoxy resin and (B) curing agent. It is more preferably 0.5% by mass to 5.0% by mass, and even more preferably 1.0% by mass to 3.0% by mass. When the content of the (C) curing accelerator is 0.1% by mass or more with respect to the total amount of the (A) epoxy resin and (B) curing agent, the curing time tends to be shortened. When it is 0.0% by mass or less, the curing rate is not too fast and a good molded product tends to be obtained.
［（Ｄ）無機充填材］
本開示のエポキシ樹脂組成物は、（Ｄ）無機充填材を含む。（Ｄ）無機充填材を含むことにより、硬化物とした際に吸湿性低減及び強度向上を図ることができる。[(D) Inorganic filler]
The epoxy resin composition of the present disclosure contains (D) an inorganic filler. (D) By containing the inorganic filler, it is possible to reduce the hygroscopicity and improve the strength when the cured product is formed.
更に、（Ｄ）無機充填材は、無機充填材全量に対し、アルミナを７５質量％～９８質量％含む。アルミナを７５質量％以上含むことにより、熱伝導性に優れるエポキシ樹脂組成物が得られ、アルミナを９８質量％以下含むことにより、熱時硬度の低下が抑制されたエポキシ樹脂組成物が得られる。また、吸湿性、線膨張係数の低減、強度向上及び半田耐熱性の観点からもアルミナを７５質量％～９８質量％含むことが好ましい。 Further, (D) the inorganic filler contains 75% by mass to 98% by mass of alumina with respect to the total amount of the inorganic filler. By containing 75% by mass or more of alumina, an epoxy resin composition having excellent thermal conductivity can be obtained, and by containing 98% by mass or less of alumina, an epoxy resin composition in which a decrease in thermal hardness is suppressed can be obtained. Further, from the viewpoints of hygroscopicity, reduction of linear expansion coefficient, strength improvement and solder heat resistance, it is preferable to contain alumina in an amount of 75% by mass to 98% by mass.
（Ｄ）無機充填材は、無機充填材全量に対し、アルミナを７５質量％～９５質量％含むことが好ましく、７５質量％～９２質量％含むことがより好ましく、７５質量％～９０質量％含むことが更に好ましく、７５質量％～８５質量％含むことが特に好ましい。 (D) The inorganic filler preferably contains 75% by mass to 95% by mass of alumina, more preferably 75% by mass to 92% by mass, and more preferably 75% by mass to 90% by mass, based on the total amount of the inorganic filler. It is more preferable, and it is particularly preferable to contain 75% by mass to 85% by mass.
（Ｄ）無機充填材は、アルミナを７５質量％～９８質量％含むため、アルミナ以外の無機充填材を２質量％～２５質量％含む。アルミナ以外の無機充填材（以下、「その他の無機充填材」とも称する。）としては、溶融シリカ、結晶シリカ、窒化ケイ素、窒化ホウ素、酸化マグネシウム、酸化亜鉛、炭化ケイ素及び窒化アルミニウム、ジルコン、珪酸カルシウム、炭酸カルシウム、チタン酸カリウム、ベリリア、ジルコニア、フォステライト、ステアタイト、スピネル、ムライト、チタニア等の粉体又はこれらを球形化したビーズ、チタン酸カリウム等の単結晶繊維、ガラス繊維、アラミド繊維、炭素繊維などが挙げられる。また、その他の無機充填材としては、難燃効果の観点から、水酸化アルミニウム、ホウ酸亜鉛、水酸化マグネシウム等が挙げられる。その他の無機充填材は１種を単独で用いても２種以上を組み合わせて用いてもよい。 (D) Since the inorganic filler contains 75% by mass to 98% by mass of alumina, it contains 2% by mass to 25% by mass of an inorganic filler other than alumina. Examples of the inorganic filler other than alumina (hereinafter, also referred to as “other inorganic filler”) include molten silica, crystalline silica, silicon nitride, boron nitride, magnesium oxide, zinc oxide, silicon carbide and aluminum nitride, zircon, and silicic acid. Powders of calcium, calcium carbonate, potassium titanate, verilia, zirconia, fosterite, steatite, spinel, mulite, titania, etc. or spherical beads of these, single crystal fibers such as potassium titanate, glass fibers, aramid fibers , Carbon fiber and the like. Further, examples of other inorganic fillers include aluminum hydroxide, zinc borate, magnesium hydroxide and the like from the viewpoint of flame retardant effect. As the other inorganic fillers, one type may be used alone or two or more types may be used in combination.
（Ｄ）無機充填材は、熱伝導性の観点から、アルミナ以外の無機充填材として、窒化ケイ素、窒化ホウ素、酸化マグネシウム、酸化亜鉛、炭化ケイ素及び窒化アルミニウムからなる群より選択される少なくとも一つの無機充填材を含むことが好ましい。中でも炭化ケイ素がより好ましい。 (D) The inorganic filler is at least one selected from the group consisting of silicon nitride, boron nitride, magnesium oxide, zinc oxide, silicon carbide and aluminum nitride as an inorganic filler other than alumina from the viewpoint of thermal conductivity. It preferably contains an inorganic filler. Of these, silicon carbide is more preferable.
（Ｄ）無機充填材は、無機充填材全量に対し、アルミナ以外の無機充填材を５質量％～２５質量％含むことが好ましく、８質量％～２５質量％含むことがより好ましく、１０質量％～２５質量％含むことが更に好ましく、１５質量％～２５質量％含むことが特に好ましい。
例えば、（Ｄ）無機充填材は、無機充填材全量に対し、炭化ケイ素を５質量％～２５質量％含むことが好ましく、８質量％～２５質量％含むことがより好ましく、１０質量％～２５質量％含むことが更に好ましく、１５質量％～２５質量％含むことが特に好ましい。(D) The inorganic filler preferably contains an inorganic filler other than alumina in an amount of 5% by mass to 25% by mass, more preferably 8% by mass to 25% by mass, and 10% by mass, based on the total amount of the inorganic filler. It is more preferably contained in an amount of about 25% by mass, and particularly preferably contained in an amount of 15% by mass to 25% by mass.
For example, (D) the inorganic filler preferably contains 5% by mass to 25% by mass, more preferably 8% by mass to 25% by mass, and 10% by mass to 25% by mass, based on the total amount of the inorganic filler. It is more preferably contained in an amount of 15% by mass, and particularly preferably 15% by mass to 25% by mass.
エポキシ樹脂組成物における（Ｄ）無機充填材の含有率は、吸湿性、線膨張係数の低減、強度向上及び半田耐熱性の観点から、エポキシ樹脂組成物全量に対し、８３質量％～９７質量％であることが好ましく、８５質量％～９４質量％であることがより好ましく、８８質量％～９３質量％であることが更に好ましい。 The content of the (D) inorganic filler in the epoxy resin composition is 83% by mass to 97% by mass with respect to the total amount of the epoxy resin composition from the viewpoints of moisture absorption, reduction of linear expansion coefficient, strength improvement and solder heat resistance. It is preferably 85% by mass to 94% by mass, more preferably 88% by mass to 93% by mass.
エポキシ樹脂組成物におけるアルミナの含有率は、吸湿性、線膨張係数の低減、強度向上及び半田耐熱性の観点から、エポキシ樹脂組成物全量に対し、６０質量％～９５質量％であることが好ましく、６５質量％～９０質量％であることがより好ましく、７５質量％～８５質量％であることが更に好ましい。 The content of alumina in the epoxy resin composition is preferably 60% by mass to 95% by mass with respect to the total amount of the epoxy resin composition from the viewpoints of hygroscopicity, reduction of coefficient of linear expansion, strength improvement and solder heat resistance. , 65% by mass to 90% by mass, more preferably 75% by mass to 85% by mass.
なお、（Ｄ）無機充填材の形状は特に限定されず、例えば、粉状、球状、繊維状等が挙げられる。中でも、エポキシ樹脂組成物の成形時の流動性及び金型摩耗性の点からは、球形が好ましい。 The shape of the inorganic filler (D) is not particularly limited, and examples thereof include powder, spherical, and fibrous. Above all, a spherical shape is preferable from the viewpoint of fluidity at the time of molding and mold wear resistance of the epoxy resin composition.
［その他の成分］
本開示のエポキシ樹脂組成物は、前述の（Ａ）エポキシ樹脂、（Ｂ）硬化剤、（Ｃ）硬化促進剤及び（Ｄ）無機充填材以外のその他の成分を含んでいてもよい。その他の成分としては、本発明の効果を奏する範囲において特に限定されず、離型剤；カップリング剤；臭素化エポキシ樹脂、リン化合物等の難燃剤；三酸化アンチモン、四酸化アンチモン等の難燃助剤；着色剤；応力緩和剤；酸化防止剤などの各種添加剤が挙げられる。
以下、その他の成分として、離型剤、カップリング剤、着色剤及び応力緩和剤の具体例について説明する。[Other ingredients]
The epoxy resin composition of the present disclosure may contain other components other than the above-mentioned (A) epoxy resin, (B) curing agent, (C) curing accelerator and (D) inorganic filler. The other components are not particularly limited as long as the effects of the present invention are exhibited, and are a mold release agent; a coupling agent; a flame retardant such as a brominated epoxy resin and a phosphorus compound; and a flame retardant such as antimony trioxide and antimony tetroxide. Examples include various additives such as auxiliaries; colorants; stress relievers; antioxidants.
Hereinafter, specific examples of a mold release agent, a coupling agent, a colorant, and a stress relaxation agent will be described as other components.
（離型剤）
エポキシ樹脂組成物は、成形時における金型との良好な離型性を得る観点から、離型剤を更に含んでいてもよい。離型剤は特に制限されず、従来公知のものを用いることができる。具体的には、カルナバワックス、モンタン酸、ステアリン酸等の高級脂肪酸、高級脂肪酸金属塩、パラフィン系ワックス、モンタン酸エステル等の脂肪酸エステル系ワックス、酸化ポリエチレン、非酸化ポリエチレン等のポリオレフィン系ワックスなどが挙げられる。離型剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。(Release agent)
The epoxy resin composition may further contain a mold release agent from the viewpoint of obtaining good mold release property from the mold at the time of molding. The release agent is not particularly limited, and conventionally known release agents can be used. Specifically, higher fatty acids such as carnauba wax, montanic acid and stearic acid, higher fatty acid metal salts, paraffin waxes, fatty acid ester waxes such as montanic acid esters, and polyolefin waxes such as polyethylene oxide and non-oxidized polyethylene are available. Can be mentioned. The release agent may be used alone or in combination of two or more.
エポキシ樹脂組成物が離型剤を含む場合、離型剤の含有率は、（Ａ）エポキシ樹脂と（Ｂ）硬化剤の合計量に対して、１０質量％以下であることが好ましく、その効果を発揮させる観点から、０．５質量％以上であることが好ましい。 When the epoxy resin composition contains a mold release agent, the content of the mold release agent is preferably 10% by mass or less with respect to the total amount of the (A) epoxy resin and (B) curing agent, and the effect thereof. From the viewpoint of exerting the above, it is preferably 0.5% by mass or more.
（カップリング剤）
エポキシ樹脂組成物は、カップリング剤を更に含んでいてもよい。カップリング剤の種類は、特に制限されず、公知のカップリング剤を使用することができる。カップリング剤としては、例えば、シランカップリング剤及びチタンカップリング剤が挙げられる。カップリング剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。(Coupling agent)
The epoxy resin composition may further contain a coupling agent. The type of the coupling agent is not particularly limited, and a known coupling agent can be used. Examples of the coupling agent include a silane coupling agent and a titanium coupling agent. As the coupling agent, one type may be used alone or two or more types may be used in combination.
シランカップリング剤としては、例えば、ビニルトリクロロシラン、ビニルトリエトキシシラン、ビニルトリス（β－メトキシエトキシ）シラン、γ－メタクリロキシプロピルトリメトキシシラン、β－（３，４－エポキシシクロヘキシル）エチルトリメトキシシラン、γ－グリシドキシプロピルトリメトキシシラン、ビニルトリアセトキシシラン、γ－メルカプトプロピルトリメトキシシラン、γ－アミノプロピルトリエトキシシラン、γ－［ビス（β－ヒドロキシエチル）］アミノプロピルトリエトキシシラン、Ｎ－β－（アミノエチル）－γ－アミノプロピルトリメトキシシラン、γ－（β－アミノエチル）アミノプロピルジメトキシメチルシラン、Ｎ－（トリメトキシシリルプロピル）エチレンジアミン、Ｎ－（ジメトキシメチルシリルイソプロピル）エチレンジアミン、メチルトリメトキシシラン、メチルトリエトキシシラン、Ｎ－β－（Ｎ－ビニルベンジルアミノエチル）－γ－アミノプロピルトリメトキシシラン、γ－クロロプロピルトリメトキシシラン、ヘキサメチルジシラン、γ－アニリノプロピルトリメトキシシラン、ビニルトリメトキシシラン及びγ－メルカプトプロピルメチルジメトキシシランが挙げられる。 Examples of the silane coupling agent include vinyltrichlorosilane, vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane. , Γ-glycidoxypropyltrimethoxysilane, vinyltriacetoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ- [bis (β-hydroxyethyl)] aminopropyltriethoxysilane, N -Β- (Aminoethyl) -γ-aminopropyltrimethoxysilane, γ- (β-aminoethyl) aminopropyldimethoxymethylsilane, N- (trimethoxysilylpropyl) ethylenediamine, N- (dimethoxymethylsilylisopropyl) ethylenediamine, Methyltrimethoxysilane, Methyltriethoxysilane, N-β- (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, hexamethyldisilane, γ-anilinopropyltrimethoxy Examples thereof include silane, vinyltrimethoxysilane and γ-mercaptopropylmethyldimethoxysilane.
チタンカップリング剤としては、例えば、イソプロピルトリイソステアロイルチタネート、イソプロピルトリス（ジオクチルパイロホスフェート）チタネート、イソプロピルトリ（Ｎ－アミノエチル－アミノエチル）チタネート、テトラオクチルビス（ジトリデシルホスファイト）チタネート、テトラ（２，２－ジアリルオキシメチル－１－ブチル）ビス（ジトリデシルホスファイト）チタネート、ビス（ジオクチルパイロホスフェート）オキシアセテートチタネート、ビス（ジオクチルパイロホスフェート）エチレンチタネート、イソプロピルトリオクタノイルチタネート、イソプロピルジメタクリルイソステアロイルチタネート、イソプロピルトリドデシルベンゼンスルホニルチタネート、イソプロピルイソステアロイルジアクリルチタネート、イソプロピルトリ（ジオクチルホスフェート）チタネート、イソプロピルトリクミルフェニルチタネート及びテトライソプロピルビス（ジオクチルホスファイト）チタネートが挙げられる。 Examples of the titanium coupling agent include isopropyltriisostearoyl titanate, isopropyltris (dioctylpyrophosphate) titanate, isopropyltri (N-aminoethyl-aminoethyl) titanate, tetraoctylbis (ditridecylphosphite) titanate, and tetra (ditridecylphosphite) titanate. 2,2-diallyloxymethyl-1-butyl) bis (ditridecylphosphite) titanate, bis (dioctylpyrophosphate) oxyacetate titanate, bis (dioctylpyrophosphate) ethylene titanate, isopropyltrioctanoyl titanate, isopropyldimethacryliso Examples thereof include stearoyl titanate, isopropyltridodecylbenzenesulfonyl titanate, isopropylisostearoyl dialicyl titanate, isopropyltri (dioctyl phosphate) titanate, isopropyltricylphenyl titanate and tetraisopropylbis (dioctylphosphite) titanate.
エポキシ樹脂組成物がカップリング剤を含有する場合、カップリング剤の含有率は、エポキシ樹脂組成物の全体に対し、３質量％以下であることが好ましく、その効果を発揮させる観点から、０．１質量％以上であることが好ましい。 When the epoxy resin composition contains a coupling agent, the content of the coupling agent is preferably 3% by mass or less with respect to the entire epoxy resin composition, and from the viewpoint of exerting the effect, 0. It is preferably 1% by mass or more.
（着色剤）
エポキシ樹脂組成物は、着色剤を更に含んでもよい。着色剤としてはカーボンブラック、有機染料、有機顔料、酸化鉄、鉛丹、ベンガラ等の公知の着色剤を挙げることができる。着色剤の含有量は目的等に応じて適宜選択できる。着色剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。(Colorant)
The epoxy resin composition may further contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, iron oxide, lead tan, and red iron oxide. The content of the colorant can be appropriately selected according to the purpose and the like. As the colorant, one type may be used alone or two or more types may be used in combination.
着色剤としてカーボンブラック等の導電性粒子を併用する場合、粒径１０μｍ以上の粒子が導電性粒子全量に対して１質量％以下のものを用いることが好ましく、カーボンブラックの含有率としては、（Ａ）エポキシ樹脂と（Ｂ）硬化剤の合計量に対して、３質量％以下であることが好ましい。 When conductive particles such as carbon black are used in combination as the colorant, it is preferable to use particles having a particle size of 10 μm or more in an amount of 1% by mass or less based on the total amount of the conductive particles, and the carbon black content is (1). It is preferably 3% by mass or less with respect to the total amount of A) epoxy resin and (B) curing agent.
（応力緩和剤）
エポキシ樹脂組成物は、シリコーンオイル、シリコーンゴム粒子、合成ゴム等の応力緩和剤を更に含んでもよい。応力緩和剤を含むことにより、パッケージの反り変形及びパッケージクラックの発生をより低減させることができる。応力緩和剤としては、一般に使用されている公知の応力緩和剤（可とう剤）が挙げられる。具体的には、シリコーン系、スチレン系、オレフィン系、ウレタン系、ポリエステル系、ポリエーテル系、ポリアミド系、ポリブタジエン系等の熱可塑性エラストマー、ＮＲ（天然ゴム）、ＮＢＲ（アクリロニトリル－ブタジエンゴム）、アクリルゴム、ウレタンゴム、シリコーンパウダー等のゴム粒子、メタクリル酸メチル－スチレン－ブタジエン共重合体（ＭＢＳ）、メタクリル酸メチル－シリコーン共重合体、メタクリル酸メチル－アクリル酸ブチル共重合体等のコア－シェル構造を有するゴム粒子などが挙げられる。応力緩和剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。(Stress relaxation agent)
The epoxy resin composition may further contain a stress relaxation agent such as silicone oil, silicone rubber particles, and synthetic rubber. By containing a stress relaxation agent, it is possible to further reduce the warpage deformation of the package and the occurrence of package cracks. Examples of the stress relaxation agent include commonly used known stress relaxation agents (flexible agents). Specifically, thermoplastic elastomers such as silicone-based, styrene-based, olefin-based, urethane-based, polyester-based, polyether-based, polyamide-based, and polybutadiene-based, NR (natural rubber), NBR (acrylonitrile-butadiene rubber), and acrylic. Rubber particles such as rubber, urethane rubber, silicone powder, core-shell such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, methyl methacrylate-butyl acrylate copolymer, etc. Examples include rubber particles having a structure. As the stress relaxation agent, one type may be used alone or two or more types may be used in combination.
［エポキシ樹脂組成物の調製方法］
エポキシ樹脂組成物の調製方法は、特に制限されない。一般的な手法としては、所定の配合量の成分をミキサー等によって十分混合した後、ミキシングロール、押出機等によって溶融混練し、冷却し、粉砕する方法を挙げることができる。より具体的には、例えば、上述した成分の所定量を撹拌及び混合し、予め７０℃～１４０℃に加熱してあるニーダー、ロール、エクストルーダー等で混練し、冷却し、粉砕する方法を挙げることができる。[Preparation method of epoxy resin composition]
The method for preparing the epoxy resin composition is not particularly limited. As a general method, a method of sufficiently mixing a predetermined amount of components with a mixer or the like, melt-kneading with a mixing roll, an extruder or the like, cooling and pulverizing can be mentioned. More specifically, for example, a method of stirring and mixing a predetermined amount of the above-mentioned components, kneading with a kneader, a roll, an extruder or the like preheated to 70 ° C. to 140 ° C., cooling and pulverizing. be able to.
〔電子部品装置〕
本開示の電子部品装置は、素子と、前記素子を封止する上述の封止用エポキシ樹脂組成物の硬化物とを備える。
電子部品装置としては、リードフレーム、配線済みのテープキャリア、配線板、ガラス、シリコンウエハ、有機基板等の支持部材に、素子（半導体チップ、トランジスタ、ダイオード、サイリスタ等の能動素子、コンデンサ、抵抗体、コイル等の受動素子など）を搭載して得られた素子部をエポキシ樹脂組成物で封止したものが挙げられる。
より具体的には、リードフレーム上に素子を固定し、ボンディングパッド等の素子の端子部とリード部とをワイヤボンディング、バンプ等で接続した後、エポキシ樹脂組成物を用いてトランスファー成形等によって封止した構造を有するＤＩＰ（Ｄｕａｌ Ｉｎｌｉｎｅ Ｐａｃｋａｇｅ）、ＰＬＣＣ（Ｐｌａｓｔｉｃ Ｌｅａｄｅｄ Ｃｈｉｐ Ｃａｒｒｉｅｒ）、ＱＦＰ（Ｑｕａｄ Ｆｌａｔ Ｐａｃｋａｇｅ）、ＳＯＰ（Ｓｍａｌｌ Ｏｕｔｌｉｎｅ Ｐａｃｋａｇｅ）、ＳＯＪ（Ｓｍａｌｌ Ｏｕｔｌｉｎｅ Ｊ－ｌｅａｄ ｐａｃｋａｇｅ）、ＴＳＯＰ（Ｔｈｉｎ Ｓｍａｌｌ Ｏｕｔｌｉｎｅ Ｐａｃｋａｇｅ）、ＴＱＦＰ（Ｔｈｉｎ Ｑｕａｄ Ｆｌａｔ Ｐａｃｋａｇｅ）等の一般的な樹脂封止型ＩＣ（Ｉｎｔｅｇｒａｔｅｄ Ｃｉｒｃｕｉｔ）；テープキャリアにバンプで接続した素子をエポキシ樹脂組成物で封止した構造を有するＴＣＰ（Ｔａｐｅ Ｃａｒｒｉｅｒ Ｐａｃｋａｇｅ）；支持部材上に形成した配線に、ワイヤボンディング、フリップチップボンディング、はんだ等で接続した素子を、エポキシ樹脂組成物で封止した構造を有するＣＯＢ（Ｃｈｉｐ Ｏｎ Ｂｏａｒｄ）モジュール、ハイブリッドＩＣ、マルチチップモジュール等；裏面に配線板接続用の端子を形成した支持部材の表面に素子を搭載し、バンプ又はワイヤボンディングにより素子と支持部材に形成された配線とを接続した後、エポキシ樹脂組成物で素子を封止した構造を有するＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）、ＣＳＰ（Ｃｈｉｐ Ｓｉｚｅ Ｐａｃｋａｇｅ）、ＭＣＰ（Ｍｕｌｔｉ Ｃｈｉｐ Ｐａｃｋａｇｅ）などが挙げられる。また、プリント配線板においてもエポキシ樹脂組成物を好適に使用することができる。[Electronic component equipment]
The electronic component device of the present disclosure includes an element and a cured product of the above-mentioned sealing epoxy resin composition that seals the element.
Electronic component devices include lead frames, pre-wired tape carriers, wiring boards, glass, silicon wafers, organic substrates, and other support members, as well as elements (semiconductor chips, transistors, diodes, active elements such as thyristors, capacitors, and resistors. , A passive element such as a coil, etc.), and the element portion obtained by mounting the element portion is sealed with an epoxy resin composition.
More specifically, the element is fixed on the lead frame, the terminal portion of the element such as a bonding pad and the lead portion are connected by wire bonding, bumps, etc., and then sealed by transfer molding or the like using an epoxy resin composition. DIP (Dual Inline Package), PLCC (Plastic Readed Chip Carrier), QFP (Quad Flat Package), SOP (Small Outline Package), SOJ (SmallOdlinePack) TS- ), TQFP (Thin Quad Flat Package) and other general resin-sealed ICs (Integrated Circuits); TCP (Tape Carrier Package) having a structure in which an element connected to a tape carrier with a bump is sealed with an epoxy resin composition. A COB (Chip On Board) module, a hybrid IC, or a multi-chip module having a structure in which an element connected by wire bonding, flip chip bonding, solder, or the like to a wiring formed on a support member is sealed with an epoxy resin composition. Etc .; The element is mounted on the front surface of the support member having terminals for connecting the wiring plate on the back surface, and after connecting the element and the wiring formed on the support member by bump or wire bonding, the element is formed with an epoxy resin composition. Examples thereof include BGA (Ball Grid Array), CSP (Chip Size Package), and MCP (Multi Chip Package) having a sealed structure. Further, the epoxy resin composition can also be preferably used in the printed wiring board.
エポキシ樹脂組成物を用いて電子部品装置を封止する方法としては、低圧トランスファー成形法、インジェクション成形法、圧縮成形法等が挙げられる。これらの中では、低圧トランスファー成形法が一般的である。 Examples of the method for sealing the electronic component device using the epoxy resin composition include a low-pressure transfer molding method, an injection molding method, and a compression molding method. Among these, the low pressure transfer molding method is common.
以下、実施例により本発明を具体的に説明するが、本発明の範囲はこれらの実施例に限定されるものではない。 Hereinafter, the present invention will be specifically described with reference to Examples, but the scope of the present invention is not limited to these Examples.
［エポキシ樹脂組成物の調製］
下記に示す成分を表１に示す配合割合（質量部）で予備混合（ドライブレンド）した後、二軸ニーダーで混練し、冷却粉砕して実施例と比較例のエポキシ樹脂組成物を調製した。[Preparation of epoxy resin composition]
The components shown below were premixed (dry blended) at the blending ratios (parts by mass) shown in Table 1, kneaded with a twin-screw kneader, cooled and pulverized to prepare epoxy resin compositions of Examples and Comparative Examples.
（Ａ）エポキシ樹脂
・Ａ１・・・ビスフェノール型エポキシ樹脂、新日鉄住金化学株式会社、品名「ＹＳＬＶ－８０ＸＹ」
・Ａ２・・・ビフェニル型エポキシ樹脂、三菱ケミカル株式会社、品名「ＹＸ－４０００」
（Ｂ）硬化剤
・Ｂ１・・・トリフェニルメタン型フェノール樹脂、エア・ウォーター株式会社、品名「ＨＥ９１０」
（Ｃ）硬化促進剤
・Ｃ１・・・リン系硬化促進剤（トリブチルホスフィンとベンゾキノンの付加物）
（Ｄ）無機充填材
・ＤＡ－１・・・アルミナフィラー、デンカ株式会社、品名「ＤＡＢ１０ＦＣＡｌｌ」
・ＤＡ－２・・・アルミナフィラー、株式会社アドマテックス、品名「ＡＥ－２０００ＳＩ」
・ＤＢ－１・・・アルミナフィラー／シリカフィラー＝９／１（質量比）、デンカ株式会社、品名「ＤＡＢ－１０ＦＣ」
・ＤＣ－１・・・平均粒径（Ｄ５０、小径側からの体積累積５０％に対応する粒径）１４．０μｍ及び比表面積０．３ｍ２／ｇの炭化ケイ素
・ＤＣ－２・・・平均粒径（Ｄ５０、小径側からの体積累積５０％に対応する粒径）１８．６μｍ及び比表面積０．３ｍ２／ｇの炭化ケイ素(A) Epoxy resin ・ A1 ・ ・ ・ Bisphenol type epoxy resin, Nippon Steel & Sumitomo Metal Chemical Co., Ltd., product name “YSLV-80XY”
・ A2 ・ ・ ・ Biphenyl type epoxy resin, Mitsubishi Chemical Corporation, product name “YX-4000”
(B) Hardener-B1 ... Triphenylmethane type phenol resin, Air Water Inc., product name "HE910"
(C) Curing accelerator ・ C1 ・ ・ ・ Phosphorus-based curing accelerator (adduct of tributylphosphine and benzoquinone)
(D) Inorganic filler DA-1 ... Alumina filler, Denka Co., Ltd., product name "DAB10FCAll"
・ DA-2 ・ ・ ・ Alumina filler, Admatex Co., Ltd., product name “AE-2000SI”
・ DB-1 ・ ・ ・ Alumina filler / silica filler = 9/1 (mass ratio), Denka Co., Ltd., product name “DAB-10FC”
DC-1 ... Average particle size (D50, particle size corresponding to 50% cumulative volume from the small diameter side) 14.0 μm and specific surface area 0.3 m 2 / g silicon carbide DC-2 ... Average Grain size (D50, particle size corresponding to 50% cumulative volume from the small diameter side) 18.6 μm and specific surface area 0.3 m 2 / g silicon carbide
（熱時硬度の評価）
エポキシ樹脂組成物の熱時硬度の評価を以下のようにして行った。
上記のように調製したエポキシ樹脂組成物を、トランスファー成形機により、金型温度１７５℃～１８０℃、成形圧力６．９ＭＰａ、硬化時間９０秒の条件で熱時硬度測定用の試験片（直径５０ｍｍ×厚さ３ｍｍの円板）を成形した。成形後直ちにショアＤ型硬度計を用いて試験片の熱時硬度を測定した。
結果を表２に示す。(Evaluation of hardness at heat)
The thermal hardness of the epoxy resin composition was evaluated as follows.
The epoxy resin composition prepared as described above is subjected to a test piece (diameter 50 mm) for measuring hot hardness by a transfer molding machine under the conditions of a mold temperature of 175 ° C to 180 ° C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds. × A disk with a thickness of 3 mm) was molded. Immediately after molding, the hot hardness of the test piece was measured using a Shore D type hardness tester.
The results are shown in Table 2.
表２に示すように、実施例１～３では、無機充填材全量に対するアルミナの含有率が１００質量％である比較例１～３よりも熱時硬度が高い結果となり、連続成形性に優れていた。 As shown in Table 2, in Examples 1 to 3, the hardness at heat is higher than that in Comparative Examples 1 to 3 in which the content of alumina with respect to the total amount of the inorganic filler is 100% by mass, and the continuous formability is excellent. rice field.
（熱伝導率の評価）
エポキシ樹脂組成物の熱伝導率の評価を以下のようにして行った。
上記のように調製したエポキシ樹脂組成物を、真空ハンドプレス成形機により、金型温度１７５℃～１８０℃、成形圧力７．０ＭＰａ、硬化時間６００秒の条件で熱伝導率評価用の試験片（１．１ｃｍ角、厚み１．１ｍｍ）を成形した。
成形した試験片について、厚さ方向の熱拡散率を測定した。熱拡散率の測定はレーザーフラッシュ法（装置：ＬＦＡ４４７ ｎａｎｏｆｌａｓｈ、ＮＥＴＺＳＣＨ社製）にて行った。パルス光照射は、パルス幅０．３１（ｍｓ）、印加電圧２４７Ｖの条件で行った。測定は雰囲気温度２５℃±１℃で行った。また上記試験片の密度は電子比重計（ＳＤ－２００Ｌ、アルファーミラージュ株式会社製）を用いて測定した。
次いで、式（１）を用いて比熱、密度を熱拡散率に乗算することによって，熱伝導率の値を得た。
λ＝α×Ｃｐ×ρ・・・式（１）
（式（１）中、λは熱伝導率（Ｗ／（ｍ・Ｋ））、αは熱拡散率（ｍ２／ｓ）、Ｃｐは比熱（Ｊ／（ｋｇ・Ｋ））、ρは密度（ｄ：ｋｇ／ｍ３）をそれぞれ示す。）
結果を表３に示す。(Evaluation of thermal conductivity)
The thermal conductivity of the epoxy resin composition was evaluated as follows.
The epoxy resin composition prepared as described above was subjected to a test piece for thermal conductivity evaluation by a vacuum hand press molding machine under the conditions of a mold temperature of 175 ° C. to 180 ° C., a molding pressure of 7.0 MPa, and a curing time of 600 seconds. 1.1 cm square, thickness 1.1 mm) was molded.
The thermal diffusivity in the thickness direction of the molded test piece was measured. The thermal diffusivity was measured by a laser flash method (device: LFA447 nanoflash, manufactured by NETZSCH). The pulsed light irradiation was performed under the conditions of a pulse width of 0.31 (ms) and an applied voltage of 247V. The measurement was performed at an atmospheric temperature of 25 ° C. ± 1 ° C. The density of the test piece was measured using an electronic hydrometer (SD-200L, manufactured by Alpha Mirage Co., Ltd.).
Then, the value of thermal conductivity was obtained by multiplying the specific heat and density by the thermal diffusivity using the equation (1).
λ = α × Cp × ρ ・ ・ ・ Equation (1)
(In equation (1), λ is the thermal conductivity (W / (m · K)), α is the thermal diffusivity (m 2 / s), Cp is the specific heat (J / (kg · K)), and ρ is the density. (D: kg / m 3 ) are shown respectively.)
The results are shown in Table 3.
表３に示すように、実施例１～３では、無機充填材全量に対するアルミナの含有率が１００質量％である比較例１～３よりも熱伝導率が高い結果となった。 As shown in Table 3, in Examples 1 to 3, the thermal conductivity was higher than that in Comparative Examples 1 to 3 in which the content of alumina with respect to the total amount of the inorganic filler was 100% by mass.
２０１７年３月３１日に出願された日本国特許出願２０１７－０７２８９２の開示はその全体が参照により本明細書に取り込まれる。
本明細書に記載された全ての文献、特許出願、及び技術規格は、個々の文献、特許出願、及び技術規格が参照により取り込まれることが具体的且つ個々に記された場合と同程度に、本明細書中に参照により取り込まれる。The disclosure of Japanese patent application 2017-072892 filed on March 31, 2017 is incorporated herein by reference in its entirety.
All documents, patent applications, and technical standards described herein are to the same extent as if the individual documents, patent applications, and technical standards were specifically and individually stated to be incorporated by reference. Incorporated by reference herein.
Claims (5)
前記無機充填材は、炭化ケイ素を含み、
前記硬化剤がフェノール硬化剤であり、前記フェノール硬化剤はトリフェニルメタン型フェノール樹脂を含む封止用エポキシ樹脂組成物。 It contains (A) epoxy resin, (B) curing agent, (C) curing accelerator and (D) inorganic filler, and the inorganic filler contains 75% by mass to 98% by mass of alumina with respect to the total amount of the inorganic filler. Including,
The inorganic filler contains silicon carbide and contains
The curing agent is a phenol curing agent, and the phenol curing agent is a sealing epoxy resin composition containing a triphenylmethane type phenol resin .
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- 2018-03-28 CN CN201880021591.7A patent/CN110461939A/en active Pending
- 2018-03-28 CN CN202211541808.1A patent/CN115785621A/en active Pending
- 2018-03-30 TW TW107111081A patent/TW201842021A/en unknown
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| Publication number | Publication date |
|---|---|
| JPWO2018181600A1 (en) | 2020-02-13 |
| JP7472931B2 (en) | 2024-04-23 |
| CN110461939A (en) | 2019-11-15 |
| JP2022097508A (en) | 2022-06-30 |
| TW201842021A (en) | 2018-12-01 |
| CN115785621A (en) | 2023-03-14 |
| WO2018181600A1 (en) | 2018-10-04 |
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