JP7053177B2 - Electronic control device and manufacturing method - Google Patents

Electronic control device and manufacturing method Download PDF

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JP7053177B2
JP7053177B2 JP2017132853A JP2017132853A JP7053177B2 JP 7053177 B2 JP7053177 B2 JP 7053177B2 JP 2017132853 A JP2017132853 A JP 2017132853A JP 2017132853 A JP2017132853 A JP 2017132853A JP 7053177 B2 JP7053177 B2 JP 7053177B2
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浩 大森
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Hitachi Astemo Ltd
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Description

本発明は、基板が封止された電子制御装置及び同製造方法に関する。 The present invention relates to an electronic control device in which a substrate is sealed and a manufacturing method thereof.

電子制御装置は、通常、基板に電子部品が実装されて構成されている。電子部品や基板を保護するために、電子部品が実装された基板は、例えば、ケースに収納される。このような電子制御装置に関する従来技術として特許文献１及び特許文献２に開示される技術がある。 An electronic control device is usually configured by mounting electronic components on a substrate. In order to protect the electronic components and the substrate, the substrate on which the electronic components are mounted is housed in, for example, a case. As a conventional technique relating to such an electronic control device, there is a technique disclosed in Patent Document 1 and Patent Document 2.

特許文献１に開示された電子制御装置は、両面に電子部品が実装されている基板と、基板の一面を覆っている第１のカバー部材と、基板の他面を覆っている第２のカバー部材と、からなる。 The electronic control device disclosed in Patent Document 1 includes a substrate on which electronic components are mounted on both sides, a first cover member covering one surface of the substrate, and a second cover covering the other surface of the substrate. It consists of a member.

第１のカバー部材の端部には、棒状の端子が取付けられている。この端子は基板の端部に空けられた穴に差し込まれ、基板は第１のカバー部材に支持される。第２のカバー部材の中央には、基板に向けて突出する突出部が形成されている。突出部の先端は基板の中央の部位に当接し基板は第２のカバー部材にも支持される。さらに、第１のカバー部材の縁と、第２のカバー部材の縁とは、防水性の接着剤により接着されている。 A rod-shaped terminal is attached to the end of the first cover member. This terminal is inserted into a hole made in the end of the substrate, and the substrate is supported by the first cover member. A protrusion protruding toward the substrate is formed in the center of the second cover member. The tip of the protrusion abuts on the central portion of the substrate, and the substrate is also supported by the second cover member. Further, the edge of the first cover member and the edge of the second cover member are adhered to each other by a waterproof adhesive.

特許文献２に開示された電子制御装置は、基板の一面に電子部品が実装され、これらの基板及び電子部品が第１のカバー部材及び第２のカバー部材によって覆われてなる。第１のカバー部材は、電子部品の上方を覆っており、第２のカバー部材は、基板の他面に密着している。 In the electronic control device disclosed in Patent Document 2, electronic components are mounted on one surface of a substrate, and these substrates and electronic components are covered with a first cover member and a second cover member. The first cover member covers the upper part of the electronic component, and the second cover member is in close contact with the other surface of the substrate.

特開２０１５－２２０１５３号公報Japanese Unexamined Patent Publication No. 2015-220153 特開２００８－４１７１８号公報Japanese Unexamined Patent Publication No. 2008-41718

ところで、特許文献１に開示された発明では、基板は、端部及び中央の部位のみが支持されている。そのため、基板と第１のケースの間、基板と第２のケースの間にはいずれも隙間がある。電子制御装置が車両に搭載された場合、車両の走行時に生じる振動が基板に伝わる。基板が振動すると、基板のみならず基板に実装された電子部品も振動の影響を受ける。 By the way, in the invention disclosed in Patent Document 1, only the end portion and the central portion of the substrate are supported. Therefore, there is a gap between the substrate and the first case, and between the substrate and the second case. When the electronic control device is mounted on the vehicle, the vibration generated when the vehicle is running is transmitted to the substrate. When the board vibrates, not only the board but also the electronic components mounted on the board are affected by the vibration.

さらに、基板と第１のケース，第２のケースの間に隙間があると、ケース内に水や薬品および塵埃等が侵入する虞がある。 Further, if there is a gap between the substrate and the first case and the second case, water, chemicals, dust and the like may enter the case.

一方、特許文献２に開示された発明では、基板の他面は、第２のケースに密着している。このため、振動から受ける影響を和らげることができる。しかし、基板の他面に電子部品が実装できなくなるため、基板を大型化せざるを得ない。 On the other hand, in the invention disclosed in Patent Document 2, the other surface of the substrate is in close contact with the second case. Therefore, it is possible to mitigate the influence of vibration. However, since electronic components cannot be mounted on the other surface of the board, the size of the board has to be increased.

本発明は、基板の大型化を抑制しつつ、振動及び水から電子部品を保護することのできる電子制御装置の提供を課題とする。 An object of the present invention is to provide an electronic control device capable of protecting electronic components from vibration and water while suppressing an increase in the size of a substrate.

請求項１による発明によれば、両面に電子部品が実装されている基板と、この基板を包む包囲部と、を有する電子制御装置において、
前記包囲部は、前記基板の一面のみを覆っているカバー部材と、前記基板の他面を覆っている樹脂部材と、からなり、
前記樹脂部材は、前記他面に密着して前記電子部品を封止していると共に、前記カバー部材及び前記基板を一体的に接合しており、
前記カバー部材は、前記基板に接続されるリード端子を保持するコネクタ部を有し、
このコネクタ部は、前記カバー部材に一体的に形成されており、
前記カバー部材は、前記基板の端部を全周に亘り囲っている部位を有し、
前記樹脂部材は、前記カバー部材側へ突出している凸部を有しており、
前記カバー部材の前記凸部は、
前記基板の端部を全周に亘り囲っている部位と、前記基板の端部との間に侵入していると共に、
前記基板と、前記カバー部材のなかの前記基板の端部を全周に亘り囲っている部位との双方に対して接合されている、ことを特徴とする電子制御装置。
According to the first aspect of the present invention, in an electronic control device having a substrate on which electronic components are mounted on both sides and a surrounding portion surrounding the substrate.
The surrounding portion is composed of a cover member that covers only one surface of the substrate and a resin member that covers the other surface of the substrate.
The resin member is in close contact with the other surface to seal the electronic component, and the cover member and the substrate are integrally bonded.
The cover member has a connector portion for holding a lead terminal connected to the substrate.
This connector portion is integrally formed with the cover member, and is formed integrally with the cover member .
The cover member has a portion that surrounds the end portion of the substrate over the entire circumference.
The resin member has a convex portion protruding toward the cover member.
The convex portion of the cover member is
In addition to penetrating between the portion that surrounds the end portion of the substrate over the entire circumference and the end portion of the substrate,
An electronic control device characterized in that the substrate is joined to both the substrate and a portion of the cover member that surrounds an end portion of the substrate over the entire circumference .

請求項２に記載のごとく、好ましくは、前記基板の厚み方向を基準として、前記電子部品のなかで最も寸法の長い長尺電子部品は、前記他面に実装されている。 As described in claim 2, preferably, the long electronic component having the longest dimension among the electronic components is mounted on the other surface with reference to the thickness direction of the substrate.

請求項３による発明によれば、両面に電子部品が実装されている基板と、この基板の一面のみを覆うカバー部材と、前記基板の他面に形成される樹脂の原料である樹脂原料と、この樹脂原料を成形する型と、を準備する準備工程と、
前記基板の一面に前記カバー部材を仮組みして、カバー付き基板を得る仮組工程と、
前記金型に前記樹脂原料を投入する投入工程と、
前記カバー部材が仮組みされた前記基板の他面に、前記電子部品を覆うように前記樹脂原料によりモールド成型を施し、前記カバー部材及び前記基板が一体的に接合された電子制御装置を得る成型工程と、を有し、
前記カバー部材は、前記基板に接続されるリード端子を保持するコネクタ部を有し、
このコネクタ部は、前記カバー部材に一体的に形成されており、
前記カバー部材は、前記基板の端部を全周に亘り囲っている部位を有し、
前記樹脂部材は、前記カバー部材側へ突出している凸部を有しており、
前記カバー部材の前記凸部は、
前記基板の端部を全周に亘り囲っている部位と、前記基板の端部との間に侵入していると共に、
前記基板と、前記カバー部材のなかの前記基板の端部を全周に亘り囲っている部位との双方に対して接合されている、ことを特徴とする電子制御装置の製造方法が提供される。 According to the invention according to claim 3, a substrate on which electronic components are mounted on both sides, a cover member that covers only one surface of the substrate, and a resin raw material that is a raw material for a resin formed on the other surface of the substrate. The preparatory process for preparing the mold for molding this resin raw material,
A temporary assembly process of temporarily assembling the cover member on one surface of the substrate to obtain a substrate with a cover.
The charging process of charging the resin raw material into the mold and
Molding is performed on the other surface of the substrate on which the cover member is temporarily assembled with the resin raw material so as to cover the electronic component, and molding to obtain an electronic control device in which the cover member and the substrate are integrally bonded. With the process,
The cover member has a connector portion for holding a lead terminal connected to the substrate.
This connector portion is integrally formed with the cover member, and is formed integrally with the cover member .
The cover member has a portion that surrounds the end portion of the substrate over the entire circumference.
The resin member has a convex portion protruding toward the cover member.
The convex portion of the cover member is
In addition to penetrating between the portion that surrounds the end portion of the substrate over the entire circumference and the end portion of the substrate,
Provided is a method for manufacturing an electronic control device , which is bonded to both the substrate and a portion of the cover member that surrounds an end portion of the substrate over the entire circumference. ..

請求項１に係る発明では、基板を包む包囲部は、基板の一面のみを覆っているカバー部材と、基板の他面を覆っている樹脂部材と、からなる。この樹脂部材は、基板の他面に密着して電子部品を封止している。即ち、基板と樹脂部材との間の隙間は埋められ、基板全体が樹脂部材により支持されている。そのため、基板の振動が抑制され、水が基板及び電子部品へ付着することも抑制される。 In the invention according to claim 1, the surrounding portion that encloses the substrate includes a cover member that covers only one surface of the substrate and a resin member that covers the other surface of the substrate. This resin member is in close contact with the other surface of the substrate to seal the electronic component. That is, the gap between the substrate and the resin member is filled, and the entire substrate is supported by the resin member. Therefore, the vibration of the substrate is suppressed, and the adhesion of water to the substrate and electronic components is also suppressed.

さらに、樹脂部材は、カバー部材及び基板を一体的に接合している。即ち、樹脂部材は、基板のみならず、カバー部材にも密着している。そのため、基板は、カバー部材と樹脂部材に包まれ、基板及び電子部品はより確実に封止される。 Further, the resin member integrally joins the cover member and the substrate. That is, the resin member is in close contact not only with the substrate but also with the cover member. Therefore, the substrate is wrapped in the cover member and the resin member, and the substrate and the electronic component are more reliably sealed.

さらに、電子部品は、両面に実装されているため、基板が大型化することを抑制できる。 Further, since the electronic components are mounted on both sides, it is possible to prevent the substrate from becoming large.

以上から、本発明によれば、基板の大型化を抑制しつつ、振動及び水や薬品および塵埃等から電子部品を保護することのできる電子制御装置を提供することができる。
加えて、カバー部材は、基板に接続されるリード端子を保持するコネクタ部を有する。このコネクタ部は、カバー部材に一体的に形成されている。そのため、電子制御装置を構成する部品点数は、削減される。
From the above, according to the present invention, it is possible to provide an electronic control device capable of protecting electronic components from vibration, water, chemicals, dust and the like while suppressing the increase in size of the substrate.
In addition, the cover member has a connector portion that holds a lead terminal connected to the substrate. This connector portion is integrally formed with the cover member. Therefore, the number of parts constituting the electronic control device is reduced.

請求項２に係る発明では、基板の厚み方向を基準として、電子部品のなかで最も寸法の長い長尺電子部品は、他面に実装されている。即ち、長尺電子部品は、樹脂部材により封止される。そのため、電子部品のなかで最も寸法の長い長尺電子部品、例えば、電解コンデンサが他面に実装されると、カバー部材で覆われる基板の一面に実装される場合に比べて、電解コンデンサは基板に強固に固定できる。 In the invention according to claim 2, the long electronic component having the longest dimension among the electronic components is mounted on the other surface with reference to the thickness direction of the substrate. That is, the long electronic component is sealed by the resin member. Therefore, when a long electronic component having the longest dimension among electronic components, for example, an electrolytic capacitor is mounted on another surface, the electrolytic capacitor is mounted on one surface of a substrate covered with a cover member. Can be firmly fixed to.

請求項３に係る発明では、電子制御装置の製造方法は、カバー部材が仮組みされた基板の他面に、電子部品を覆うように樹脂原料によりモールド成型を施し、カバー部材及び基板が一体的に接合された電子制御装置を得る成型工程を有する。モールド成型により、樹脂部材が基板の他面に密着して電子部品を封止すると共に、カバー部材及び基板を一体的に接合する。そのため、基板の振動は抑制され、水や薬品および塵埃等が基板及び電子部品へ付着することを抑制できる。
加えて、カバー部材は、基板に接続されるリード端子を保持するコネクタ部を有する。このコネクタ部は、カバー部材に一体的に形成されている。そのため、電子制御装置を構成する部品点数は、削減される。 In the invention according to claim 3 , in the manufacturing method of the electronic control device, the cover member and the substrate are integrally molded by molding the other surface of the substrate on which the cover member is temporarily assembled with a resin raw material so as to cover the electronic component. It has a molding process for obtaining an electronic control device joined to the device. By molding, the resin member adheres to the other surface of the substrate to seal the electronic component, and the cover member and the substrate are integrally joined. Therefore, the vibration of the substrate is suppressed, and the adhesion of water, chemicals, dust, etc. to the substrate and electronic components can be suppressed.
In addition, the cover member has a connector portion that holds a lead terminal connected to the substrate. This connector portion is integrally formed with the cover member. Therefore, the number of parts constituting the electronic control device is reduced.

本発明の実施例１による電子制御装置の断面図である。It is sectional drawing of the electronic control apparatus according to Example 1 of this invention. 図１に示された電子制御装置を得る工程の前半を説明する図である。It is a figure explaining the first half of the process of obtaining the electronic control apparatus shown in FIG. 1. 図１に示された電子制御装置を得る工程の後半を説明する図である。It is a figure explaining the latter half of the process of obtaining the electronic control apparatus shown in FIG. 1. 本発明の実施例２による電子制御装置の断面図である。It is sectional drawing of the electronic control apparatus by Example 2 of this invention.

本発明の実施の形態を添付図に基づいて以下に説明する。なお、図中Ｆｒは前、Ｒｒは後、Ｕｐは上、Ｄｎは下を示している。
＜実施例１＞ Embodiments of the present invention will be described below with reference to the accompanying drawings. In the figure, Fr indicates the front, Rr indicates the rear, Up indicates the top, and Dn indicates the bottom.
<Example 1>

図１（ａ）を参照する。図１には、本発明の実施例１による電子制御装置１０が示されている。この電子制御装置１０は、例えば、車両に搭載される。電子制御装置１０は、両面に電子部品３１,３４,４１が実装されている基板２０と、この基板２０を包む包囲部１１と、を有する。 See FIG. 1 (a). FIG. 1 shows an electronic control device 10 according to a first embodiment of the present invention. The electronic control device 10 is mounted on a vehicle, for example. The electronic control device 10 has a substrate 20 on which electronic components 31, 34, 41 are mounted on both sides thereof, and a surrounding portion 11 that encloses the substrate 20.

基板２０の上面２１（一面２１）には、ＱＦＰ（Quad Flat Package）型の第１のIC装置３１（電子部品３１）が取付けられている。この第１のIC装置３１は、半導体チップを封止する薄板状のパッケージ３２と、このパッケージ３２から側方に突出する多数のリード３３と、からなる。リード３３の一端は、パッケージ３２の内部で半導体チップと電気的に接続している。 A QFP (Quad Flat Package) type first IC device 31 (electronic component 31) is attached to the upper surface 21 (one surface 21) of the substrate 20. The first IC device 31 includes a thin plate-shaped package 32 for encapsulating a semiconductor chip, and a large number of leads 33 projecting laterally from the package 32. One end of the lead 33 is electrically connected to the semiconductor chip inside the package 32.

同様に、基板２０の下面２２（他面２２）には、ＱＦＰ（Quad Flat Package）型の第２のIC装置３４（電子部品３４）が取付けられている。第２のIC装置３４も、パッケージ３５と、リード３６と、を有する。 Similarly, a QFP (Quad Flat Package) type second IC device 34 (electronic component 34) is attached to the lower surface 22 (other surface 22) of the substrate 20. The second IC device 34 also has a package 35 and a lead 36.

さらに、基板２０の下面２２には、電解コンデンサ４１（電子部品４１）が実装されている。この電解コンデンサ４１は、コンデンサ素子を包む底付き円筒状のアルミケース４２と、アルミケース４２と共にコンデンサ素子を封止する封口材４３と、を有する。 Further, an electrolytic capacitor 41 (electronic component 41) is mounted on the lower surface 22 of the substrate 20. The electrolytic capacitor 41 has a cylindrical aluminum case 42 with a bottom that wraps the capacitor element, and a sealing material 43 that seals the capacitor element together with the aluminum case 42.

基板２０の厚み方向（上下方向）を基準として、電解コンデンサ４１の高さＨ１は、第１のIC装置３１の高さＨ２、第２のIC装置３４の高さＨ３よりも高い。即ち、電解コンデンサ４１は、基板２０に実装される電子部品のなかで最も寸法の長い長尺電子部品といえる。 The height H1 of the electrolytic capacitor 41 is higher than the height H2 of the first IC device 31 and the height H3 of the second IC device 34 with respect to the thickness direction (vertical direction) of the substrate 20. That is, it can be said that the electrolytic capacitor 41 is a long electronic component having the longest dimension among the electronic components mounted on the substrate 20.

第１のIC装置３１、第２のIC装置３４、電解コンデンサ４１が実装された基板２０を包む包囲部１１は、基板２０の上面２１のみを覆っているカバー部材５０と、基板２０の下面２２を覆っている樹脂部材６０と、からなる。 The surrounding portion 11 that encloses the substrate 20 on which the first IC device 31, the second IC device 34, and the electrolytic capacitor 41 are mounted includes a cover member 50 that covers only the upper surface 21 of the substrate 20, and a lower surface 22 of the substrate 20. It is composed of a resin member 60 covering the above.

カバー部材５０は、第１のIC装置３１を覆う本体部５１と、この本体部５１の後端から後方に延びる第１のフランジ部７０と、本体部５１の前端から前方に延びる第２のフランジ部８０と、からなる。 The cover member 50 includes a main body 51 that covers the first IC device 31, a first flange 70 that extends rearward from the rear end of the main body 51, and a second flange that extends forward from the front end of the main body 51. It consists of a part 80.

カバー部材５０には、基板２０に接続される２つのコネクタ端子４５,４５を保持するコネクタ部５２が一体的に形成されている。コネクタ部５２は、第２のフランジ部８０の上方に設けられる The cover member 50 is integrally formed with a connector portion 52 that holds two connector terminals 45, 45 connected to the substrate 20. The connector portion 52 is provided above the second flange portion 80.

第１のフランジ部７０は、基板２０の後端部２３の上部に当接する第１の当接部７１と、この第１の当接部７１から後方に延びる第１の延出部７２と、この第１の延出部７２から下方に突出する第１の突出部７３と、からなる。 The first flange portion 70 includes a first contact portion 71 that abuts on the upper portion of the rear end portion 23 of the substrate 20, a first extension portion 72 that extends rearward from the first contact portion 71, and the first flange portion 70. It is composed of a first protruding portion 73 that protrudes downward from the first extending portion 72.

同様に、第２のフランジ部８０は、基板２０の前端部２４の上部に当接する第２の当接部８１と、この第２の当接部８１から前方に延びる第２の延出部８２と、この第２の延出部８２から下方に突出する第２の突出部８３と、からなる。 Similarly, the second flange portion 80 has a second contact portion 81 that abuts on the upper portion of the front end portion 24 of the substrate 20, and a second extension portion 82 that extends forward from the second contact portion 81. And a second protruding portion 83 that protrudes downward from the second extending portion 82.

基板２０は、第１のフランジ部７０と第２のフランジ部８０を含む部位が基板２０を囲むように、配置されている。 The substrate 20 is arranged so that a portion including the first flange portion 70 and the second flange portion 80 surrounds the substrate 20.

樹脂部材６０は、基板２０の他面に密着して第２のIC装置３４、電解コンデンサ４１を封止していると共に、カバー部材５０及び基板２０を一体的に接合している。 The resin member 60 is in close contact with the other surface of the substrate 20 to seal the second IC device 34 and the electrolytic capacitor 41, and the cover member 50 and the substrate 20 are integrally bonded.

詳細には、樹脂部材６０は、基板２０の他面に密着して第２のIC装置３４及び電解コンデンサ４１を封止する封止部６１と、この封止部６１の後部に形成された第１の接合部６２と、封止部６１の前部に形成された第２の接合部６３と、からなる。 Specifically, the resin member 60 has a sealing portion 61 formed in close contact with the other surface of the substrate 20 to seal the second IC device 34 and the electrolytic capacitor 41, and a second portion formed at the rear of the sealing portion 61. It is composed of a joint portion 62 of 1 and a second joint portion 63 formed in the front portion of the sealing portion 61.

第１の接合部６２は、基板２０の後端部２３と第１のフランジ部７０とを一体的に接合している。第２の接合部６３は、基板２０の後端部２４と第２のフランジ部８０とを一体的に接合している。 The first joint portion 62 integrally joins the rear end portion 23 of the substrate 20 and the first flange portion 70. The second joining portion 63 integrally joins the rear end portion 24 of the substrate 20 and the second flange portion 80.

第１の接合部６２は、上方に凸となる第１の凸部６４が形成されている。同様に、第２の接合部６３には、上方に凸となる第２の凸部６５が形成されている。 The first joint portion 62 is formed with a first convex portion 64 that is convex upward. Similarly, the second joint portion 63 is formed with a second convex portion 65 that is convex upward.

図１（ｂ）を参照する。基板２０の前端部２４と第２の突出部８３は、離れている。第２の凸部６５は、基板２０の前端部２４と、第２の突出部８３と、第２の延出部８２に接合している。同様に、基板２０の後端部２３と第１の突出部７３は、離れている。第１の凸部６４は、基板２０の後端部２３と、第１の突出部７３と、第１の延出部７２に接合している。 See FIG. 1 (b). The front end portion 24 of the substrate 20 and the second protruding portion 83 are separated from each other. The second convex portion 65 is joined to the front end portion 24 of the substrate 20, the second protruding portion 83, and the second extending portion 82. Similarly, the rear end portion 23 of the substrate 20 and the first protruding portion 73 are separated from each other. The first convex portion 64 is joined to the rear end portion 23 of the substrate 20, the first protruding portion 73, and the first extending portion 72.

図２、図３を参照する。次に、この電子制御装置１０の製造方法について説明する。 Refer to FIGS. 2 and 3. Next, a method of manufacturing the electronic control device 10 will be described.

図２（ａ）を参照する。はじめに、両面に電子部品３１,３４,４１が実装されている基板２０と、この基板２０の上面２１のみを覆うカバー部材５０と、基板２０の下面２２に形成される樹脂部材６０（図３（ｃ）参照）の原料である樹脂原料１３と、この樹脂原料１３を成形する金型１４と、を準備する（準備工程）。 See FIG. 2 (a). First, a substrate 20 on which electronic components 31, 34, 41 are mounted on both sides, a cover member 50 that covers only the upper surface 21 of the substrate 20, and a resin member 60 formed on the lower surface 22 of the substrate 20 (FIG. 3 (FIG. 3). c) The resin raw material 13 which is the raw material of) and the mold 14 for molding the resin raw material 13 are prepared (preparation step).

基板２０は、両面基板２０であり、例えば、ガラスクロスにエポキシ樹脂を含浸させた基材と、この基材の両面に設けられた導体パターンと、からなる。 The substrate 20 is a double-sided substrate 20, and is composed of, for example, a base material in which a glass cloth is impregnated with an epoxy resin, and conductor patterns provided on both sides of the base material.

基板２０の上面２１には、第１のIC装置３１を実装する。基板２０の下面２２には、第２のIC装置３４、電解コンデンサ４１を実装する。 The first IC device 31 is mounted on the upper surface 21 of the substrate 20. A second IC device 34 and an electrolytic capacitor 41 are mounted on the lower surface 22 of the substrate 20.

なお、基板２０に実装される部品は、これらの部品に限られない。例えば、抵抗器、トランジスタ、ダイオード等を実装してもよい。さらに、電解コンデンサ４１は、基板２０の上面２１に実装しても良い。 The components mounted on the substrate 20 are not limited to these components. For example, resistors, transistors, diodes and the like may be mounted. Further, the electrolytic capacitor 41 may be mounted on the upper surface 21 of the substrate 20.

第１のIC装置３１、第２のIC装置３４は、表面実装型である。IC装置３１,３４を基板２０に載置し、はんだにより、リードを基板２０の上面２１のランドに固定させる。同様に、電解コンデンサ４１も、表面実装型である。 The first IC device 31 and the second IC device 34 are surface mount type. The IC devices 31 and 34 are placed on the substrate 20, and the leads are fixed to the land on the upper surface 21 of the substrate 20 by soldering. Similarly, the electrolytic capacitor 41 is also a surface mount type.

カバー部材５０は、例えば、PBT（ポリブチレンテレフタレート）の樹脂で成形される。コネクタ端子４５，４５は、インサート成形によりカバー部材５０に保持されている。即ち、カバー部材５０を成型する金型にコネクタ端子４５，４５を載置させ、原料を流し込んでカバー部材５０を成形する。 The cover member 50 is formed of, for example, a resin of PBT (polybutylene terephthalate). The connector terminals 45 and 45 are held by the cover member 50 by insert molding. That is, the connector terminals 45 and 45 are placed on the mold for molding the cover member 50, and the raw material is poured into the mold to form the cover member 50.

樹脂原料１３は、半導体封止用のエポキシ樹脂を準備する。 As the resin raw material 13, an epoxy resin for encapsulating a semiconductor is prepared.

図２（ｂ）を参照する。次に、基板２０の上面２１にカバー部材５０を仮組みして、カバー付き基板２０を得る（仮組工程）。例えば、コネクタ端子４５，４５を、基板２０のスルーホール２６,２６に差し込み、はんだ付けをする。なお、基板２０の後端部２３、前端部２４をカバー部材５０に接着させてもよい。 See FIG. 2 (b). Next, the cover member 50 is temporarily assembled on the upper surface 21 of the substrate 20 to obtain the substrate 20 with a cover (temporary assembly step). For example, the connector terminals 45 and 45 are inserted into the through holes 26 and 26 of the substrate 20 and soldered. The rear end portion 23 and the front end portion 24 of the substrate 20 may be adhered to the cover member 50.

図２（ｃ）を参照する。次に、金型１４にエポキシ樹脂（樹脂原料１３）を投入する（投入工程）。金型１４には、樹脂原料１３を加熱させるためのヒータが内蔵されている。カバー付き基板２５の下面２２に形成される樹脂部材６０（図３（ｃ）参照）の離型性を高めるために、予め、離型剤を金型１４に塗布するか、離型フィルムを金型１４に貼り付けてもよい。 See FIG. 2 (c). Next, the epoxy resin (resin raw material 13) is charged into the mold 14 (loading step). The mold 14 has a built-in heater for heating the resin raw material 13. In order to improve the mold release property of the resin member 60 (see FIG. 3C) formed on the lower surface 22 of the substrate 25 with a cover, a mold release agent is applied to the mold 14 in advance, or a mold release film is applied to the mold. It may be attached to the mold 14.

図３（ａ）を参照する。次に、樹脂原料１３が投入された金型１４の上方に、カバー付き基板２５が位置するように、カバー付き基板２０を保持する。 See FIG. 3 (a). Next, the covered substrate 20 is held so that the covered substrate 25 is located above the mold 14 into which the resin raw material 13 is charged.

図３（ｂ）を参照する。次に、カバー部材５０が仮組みされた基板２０の下面２２に、第２のIC装置３４、電解コンデンサ４１を覆うようにコンプレッションモールド成形を施す（成形工程）。詳細には、カバー付き基板２０を、金型１４に架け渡されるように載置する。カバー部材５０の第１のフランジ部７０、第２のフランジ部８０は、金型１４の上部に当接する。 See FIG. 3 (b). Next, compression molding is performed on the lower surface 22 of the substrate 20 to which the cover member 50 is temporarily assembled so as to cover the second IC device 34 and the electrolytic capacitor 41 (molding step). Specifically, the substrate 20 with a cover is placed so as to be bridged over the mold 14. The first flange portion 70 and the second flange portion 80 of the cover member 50 abut on the upper portion of the mold 14.

このとき、基板２０の下面２２は、樹脂原料１３に接触すると共に、第２のIC装置３４、電解コンデンサ４１は、樹脂原料１３のなかに埋もれる。さらに、第１の突出部７３と基板２０の後端部２３との間は、樹脂原料１３で埋まる。同様に、第２の突出部８３と基板２０の前端部２４との間は、樹脂原料１３で埋まる。 At this time, the lower surface 22 of the substrate 20 comes into contact with the resin raw material 13, and the second IC device 34 and the electrolytic capacitor 41 are buried in the resin raw material 13. Further, the space between the first protruding portion 73 and the rear end portion 23 of the substrate 20 is filled with the resin raw material 13. Similarly, the space between the second protruding portion 83 and the front end portion 24 of the substrate 20 is filled with the resin raw material 13.

金型１４の加熱によるエポキシ樹脂の硬化条件は、例えば、１５０℃、５分とする。 The curing conditions of the epoxy resin by heating the mold 14 are, for example, 150 ° C. for 5 minutes.

図３（ｃ）を参照する。最後に、離型工程として、電子制御装置１０を金型１４から取り出して、電子制御装置１０を得る。これにより、電子制御装置１０が製造される。 See FIG. 3 (c). Finally, as a mold release step, the electronic control device 10 is taken out from the mold 14 to obtain the electronic control device 10. As a result, the electronic control device 10 is manufactured.

次に、本発明の効果について説明する。 Next, the effect of the present invention will be described.

図１を参照する。基板２０を包む包囲部１１は、基板２０の上面２１のみを覆っているカバー部材５０と、基板２０の下面２２を覆っている樹脂部材６０と、からなる。この樹脂部材６０は、基板２０の下面２２に密着して電子部品３４,４１を封止している。即ち、基板２０と樹脂部材６０との間の隙間は埋められ、基板２０全体が樹脂部材６０により支持されている。そのため、基板２０の振動が抑制され、水が基板２０及び電子部品３４,４１へ付着することも抑制される。 See FIG. The surrounding portion 11 that encloses the substrate 20 includes a cover member 50 that covers only the upper surface 21 of the substrate 20, and a resin member 60 that covers the lower surface 22 of the substrate 20. The resin member 60 is in close contact with the lower surface 22 of the substrate 20 to seal the electronic components 34 and 41. That is, the gap between the substrate 20 and the resin member 60 is filled, and the entire substrate 20 is supported by the resin member 60. Therefore, the vibration of the substrate 20 is suppressed, and the adhesion of water to the substrate 20 and the electronic components 34 and 41 is also suppressed.

さらに、樹脂部材６０は、カバー部材５０及び基板２０を一体的に接合している。即ち、樹脂部材６０は、基板２０のみならず、カバー部材５０にも密着している。そのため、基板２０は、カバー部材５０と樹脂部材６０に包まれ、基板２０及び電子部品３４,４１はより確実に封止される。 Further, the resin member 60 integrally joins the cover member 50 and the substrate 20. That is, the resin member 60 is in close contact not only with the substrate 20 but also with the cover member 50. Therefore, the substrate 20 is wrapped in the cover member 50 and the resin member 60, and the substrate 20 and the electronic components 34 and 41 are more reliably sealed.

特に、樹脂部材６０は、第１の凸部６４、第２の凸部６５を有する。これら、第１の凸部６４、第２の凸部６５は、基板２０とカバー部材５０との間に侵入するように形成されている。そのため、樹脂部材６０は、より確実に基板２０及びカバー部材５０を接合する。 In particular, the resin member 60 has a first convex portion 64 and a second convex portion 65. The first convex portion 64 and the second convex portion 65 are formed so as to penetrate between the substrate 20 and the cover member 50. Therefore, the resin member 60 more reliably joins the substrate 20 and the cover member 50.

さらに、電子部品３１,３４,４１は、両面に実装されているため、基板２０が大型化することを抑制できる。 Further, since the electronic components 31, 34, 41 are mounted on both sides, it is possible to prevent the substrate 20 from becoming large in size.

以上から、本発明によれば、基板２０の大型化を抑制しつつ、振動及び水から電子部品３４,４１品を保護することのできる電子制御装置１０を提供することができる。 From the above, according to the present invention, it is possible to provide an electronic control device 10 capable of protecting electronic components 34 and 41 from vibration and water while suppressing an increase in size of the substrate 20.

加えて、基板２０の厚み方向を基準として、最も高い電解コンデンサ４１は、下面２２に実装されている。即ち、電解コンデンサ４１は、樹脂部材６０で封止される。カバー部材５０で覆われる基板２０の上面２１に実装される場合と比べると、電解コンデンサ４１は基板２０に強固に固定できる。 In addition, the tallest electrolytic capacitor 41 is mounted on the lower surface 22 with respect to the thickness direction of the substrate 20. That is, the electrolytic capacitor 41 is sealed with the resin member 60. The electrolytic capacitor 41 can be firmly fixed to the substrate 20 as compared with the case where it is mounted on the upper surface 21 of the substrate 20 covered with the cover member 50.

加えて、コネクタ部５２は、カバー部材５０に一体的に形成されている。そのため、電子制御装置１０を構成する部品点数は、削減される。 In addition, the connector portion 52 is integrally formed with the cover member 50. Therefore, the number of parts constituting the electronic control device 10 is reduced.

加えて、樹脂部材６０は、エポキシ系樹脂を原料とする。汎用的な原料を採用することにより、電子制御装置１０を製造するコストは抑えられる In addition, the resin member 60 is made of an epoxy resin as a raw material. By adopting a general-purpose raw material, the cost of manufacturing the electronic control device 10 can be suppressed.

図３（ｂ）を参照する。電子制御装置１０の製造方法は、カバー部材５０が仮組みされた基板２０の下面２２に、第２のIC装置３４、電解コンデンサ４１を覆うようにコンプレッションモールド成型を施し電子制御装置１０を得る成型工程を有する。コンプレッションモールド成型により、樹脂部材６０が基板２０の下面２２に密着して第２のIC装置３４装置、電解コンデンサ４１を封止すると共に、カバー部材５０及び基板２０を一体的に接合する。そのため、基板２０の振動は抑制され、水が基板２０及び電子部品３４,４１へ付着することを抑制できる。 See FIG. 3 (b). The manufacturing method of the electronic control device 10 is to obtain the electronic control device 10 by performing compression molding on the lower surface 22 of the substrate 20 on which the cover member 50 is temporarily assembled so as to cover the second IC device 34 and the electrolytic capacitor 41. Has a process. By compression molding, the resin member 60 is brought into close contact with the lower surface 22 of the substrate 20 to seal the second IC device 34 device and the electrolytic capacitor 41, and the cover member 50 and the substrate 20 are integrally joined. Therefore, the vibration of the substrate 20 is suppressed, and the adhesion of water to the substrate 20 and the electronic components 34 and 41 can be suppressed.

さらに、プランジャにより圧力がかけられた樹脂が金型内に射出されるトランスファーモールド成型と比べて、圧力を抑えて、電子部品及び基板２０を封止することができる。成型時の電子部品３４,４１及び基板２０への負荷も抑えられる。さらに、コンプレッションモールド成型では、樹脂が通過するゲート等がないため、原料のロスが少ない。
＜実施例２＞ Further, the pressure can be suppressed and the electronic component and the substrate 20 can be sealed as compared with the transfer mold molding in which the resin pressured by the plunger is injected into the mold. The load on the electronic components 34, 41 and the substrate 20 during molding can also be suppressed. Furthermore, in compression molding, there is no gate through which the resin passes, so there is little loss of raw materials.
<Example 2>

次に、本発明の実施例２について説明する。実施例２による電子制御装置１０Ａでは、カバー部材５０Ａと、コネクタ部５２Ａは、別体として形成されている。その他の構成については、実施例１の電子制御装置１０と同様であり、符号を流用すると共に説明を省略する。 Next, Example 2 of the present invention will be described. In the electronic control device 10A according to the second embodiment, the cover member 50A and the connector portion 52A are formed as separate bodies. Other configurations are the same as those of the electronic control device 10 of the first embodiment, and the reference numerals are diverted and the description thereof will be omitted.

カバー部材５０Ａは、ダイカストによりアルミニウム合金で形成され、第１のIC装置３１を覆う本体部５１Ａと、この本体部５１の後端から後方に延びる第１のフランジ部７０と、本体部５１Ａの前端から前方に延びる第２のフランジ部８０と、からなる。 The cover member 50A is formed of an aluminum alloy by die casting, and has a main body portion 51A that covers the first IC device 31, a first flange portion 70 that extends rearward from the rear end of the main body portion 51, and a front end of the main body portion 51A. It is composed of a second flange portion 80 extending forward from the surface.

本体部５１Ａには、樹脂により形成されたコネクタ部５２Ａが取付けられている。詳細には、本体部５１Ａには、差込穴５３が空けられている。差込穴５３には、コネクタ部５２Ａの差込部５４が差し込まれている。差込部５４から露出しているコネクタ端子４５，４５は、差込穴５３を介して、基板２０に接続されている。本体部５１Ａとコネクタ部５２Ａとの間には、シール材５５が配置されている。 A connector portion 52A made of resin is attached to the main body portion 51A. Specifically, the main body 51A is provided with an insertion hole 53. The insertion portion 54 of the connector portion 52A is inserted into the insertion hole 53. The connector terminals 45 and 45 exposed from the insertion portion 54 are connected to the substrate 20 via the insertion hole 53. A sealing material 55 is arranged between the main body portion 51A and the connector portion 52A.

なお、本発明による電力変換装置は、ハイブリッド車両以外の車両の他、他の乗り物にも搭載することができる。即ち、本発明の作用及び効果を奏する限りにおいて、本発明は、実施例に限定されるものではない。 The power conversion device according to the present invention can be mounted on a vehicle other than the hybrid vehicle as well as on other vehicles. That is, the present invention is not limited to the examples as long as the actions and effects of the present invention are exhibited.

本発明の電力変換装置は、四輪車に好適である。 The power conversion device of the present invention is suitable for a four-wheeled vehicle.

１０…電子制御装置
１１…包囲部
２０…基板
２１…上面（一面）
２２…下面（他面）
２３…後端部
２４…前端部
２５…カバー付き基板
３１…第１のIC装置（電子部品）
３４…第２のIC装置（電子部品）
４１…電解コンデンサ（電子部品）
５０…カバー部材
５１…本体部
５２…コネクタ部
６０…樹脂部材
６１…封止部
６２…第１の接合部
６３…第２の接合部
６４…第１の凸部
６５…第２の凸部
７０…第１のフランジ部
７１…第１の当接部
７２…第１の延出部
７３…第１の突出部
８０…第２のフランジ部
８１…第２の当接部
８２…第２の延出部
８３…第２の突出部 10 ... Electronic control device 11 ... Surrounding part 20 ... Substrate 21 ... Top surface (one side)
22 ... Bottom surface (other surface)
23 ... Rear end 24 ... Front end 25 ... Substrate with cover 31 ... First IC device (electronic component)
34 ... Second IC device (electronic component)
41 ... Electrolytic capacitor (electronic component)
50 ... Cover member 51 ... Main body portion 52 ... Connector portion 60 ... Resin member 61 ... Sealing portion 62 ... First joint portion 63 ... Second joint portion 64 ... First convex portion 65 ... Second convex portion 70 ... First flange portion 71 ... First contact portion 72 ... First extension portion 73 ... First protrusion 80 ... Second flange portion 81 ... Second contact portion 82 ... Second extension Exit 83 ... Second protrusion

Claims (3)

両面に電子部品が実装されている基板と、この基板を包む包囲部と、を有する電子制御装置において、
前記包囲部は、前記基板の一面のみを覆っているカバー部材と、前記基板の他面を覆っている樹脂部材と、からなり、
前記樹脂部材は、前記他面に密着して前記電子部品を封止していると共に、前記カバー部材及び前記基板を一体的に接合しており、
前記カバー部材は、前記基板に接続されるリード端子を保持するコネクタ部を有し、
このコネクタ部は、前記カバー部材に一体的に形成されており、
前記カバー部材は、前記基板の端部を全周に亘り囲っている部位を有し、
前記樹脂部材は、前記カバー部材側へ突出している凸部を有しており、
前記カバー部材の前記凸部は、
前記基板の端部を全周に亘り囲っている部位と、前記基板の端部との間に侵入していると共に、
前記基板と、前記カバー部材のなかの前記基板の端部を全周に亘り囲っている部位との双方に対して接合されている、ことを特徴とする電子制御装置。 In an electronic control device having a substrate on which electronic components are mounted on both sides and a surrounding portion that encloses the substrate.
The surrounding portion is composed of a cover member that covers only one surface of the substrate and a resin member that covers the other surface of the substrate.
The resin member is in close contact with the other surface to seal the electronic component, and the cover member and the substrate are integrally bonded.
The cover member has a connector portion for holding a lead terminal connected to the substrate.
This connector portion is integrally formed with the cover member, and is formed integrally with the cover member .
The cover member has a portion that surrounds the end portion of the substrate over the entire circumference.
The resin member has a convex portion protruding toward the cover member.
The convex portion of the cover member is
In addition to penetrating between the portion that surrounds the end portion of the substrate over the entire circumference and the end portion of the substrate,
An electronic control device characterized in that the substrate is joined to both the substrate and a portion of the cover member that surrounds an end portion of the substrate over the entire circumference . 前記基板の厚み方向を基準として、前記電子部品のなかで最も寸法の長い長尺電子部品は、前記他面に実装されていることを特徴とする請求項１に記載の電子制御装置。 The electronic control device according to claim 1, wherein the long electronic component having the longest dimension among the electronic components is mounted on the other surface with respect to the thickness direction of the substrate. 両面に電子部品が実装されている基板と、この基板の一面のみを覆うカバー部材と、前記基板の他面に形成される樹脂の原料である樹脂原料と、この樹脂原料を成形する型と、を準備する準備工程と、
前記基板の一面に前記カバー部材を仮組みして、カバー付き基板を得る仮組工程と、
前記金型に前記樹脂原料を投入する投入工程と、
前記カバー部材が仮組みされた前記基板の他面に、前記電子部品を覆うように前記樹脂原料によりモールド成型を施し、前記カバー部材及び前記基板が一体的に接合された電子制御装置を得る成型工程と、を有し、
前記カバー部材は、前記基板に接続されるリード端子を保持するコネクタ部を有し、
このコネクタ部は、前記カバー部材に一体的に形成されており、
前記カバー部材は、前記基板の端部を全周に亘り囲っている部位を有し、
前記樹脂部材は、前記カバー部材側へ突出している凸部を有しており、
前記カバー部材の前記凸部は、
前記基板の端部を全周に亘り囲っている部位と、前記基板の端部との間に侵入していると共に、
前記基板と、前記カバー部材のなかの前記基板の端部を全周に亘り囲っている部位との双方に対して接合されている、ことを特徴とする電子制御装置の製造方法。 A substrate on which electronic components are mounted on both sides, a cover member that covers only one surface of the substrate, a resin raw material that is a raw material for a resin formed on the other surface of the substrate, and a mold for molding the resin raw material. Preparation process to prepare and
A temporary assembly process of temporarily assembling the cover member on one surface of the substrate to obtain a substrate with a cover.
The charging process of charging the resin raw material into the mold and
Molding is performed on the other surface of the substrate on which the cover member is temporarily assembled with the resin raw material so as to cover the electronic component, and molding to obtain an electronic control device in which the cover member and the substrate are integrally bonded. With the process,
The cover member has a connector portion for holding a lead terminal connected to the substrate.
This connector portion is integrally formed with the cover member, and is formed integrally with the cover member .
The cover member has a portion that surrounds the end portion of the substrate over the entire circumference.
The resin member has a convex portion protruding toward the cover member.
The convex portion of the cover member is
In addition to penetrating between the portion that surrounds the end portion of the substrate over the entire circumference and the end portion of the substrate,
A method for manufacturing an electronic control device , which is joined to both the substrate and a portion of the cover member that surrounds an end portion of the substrate over the entire circumference .
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