JP7045861B2 - 支持基台 - Google Patents
支持基台 Download PDFInfo
- Publication number
- JP7045861B2 JP7045861B2 JP2018005826A JP2018005826A JP7045861B2 JP 7045861 B2 JP7045861 B2 JP 7045861B2 JP 2018005826 A JP2018005826 A JP 2018005826A JP 2018005826 A JP2018005826 A JP 2018005826A JP 7045861 B2 JP7045861 B2 JP 7045861B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- support base
- temperature measuring
- grinding
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/20—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Forklifts And Lifting Vehicles (AREA)
- Manipulator (AREA)
- Load-Engaging Elements For Cranes (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
本発明の実施形態1に係る支持基台を図面に基づいて説明する。図1は、実施形態1に係る支持基台と被加工物とを示す斜視図である。図2は、実施形態1に係る支持基台により支持された被加工物を研削研磨する研削研磨装置の構成例の斜視図である。図3は、実施形態1に係る支持基台が被加工物を支持した状態を示す斜視図である。図4は、図3中のIV-IV線に沿う断面図である。図5は、実施形態1に係る支持基台の構成を示すブロック図である。
本発明の実施形態2に係る支持基台を図面に基づいて説明する。図6は、実施形態2に係る支持基台と被加工物とを示す斜視図である。図7は、実施形態2に係る支持基台が被加工物を支持した状態を示す断面図である。図8は、実施形態2に係る支持基台の構成を示すブロック図である。図6、図7及び図8は、実施形態1と同一部分に同一符号を付して説明を省略する。
10 箱体
11 支持面
12 載置面
20 温度測定ユニット
21 温度測定器
22 記録部
23 無線通信装置(無線通信手段)
30 電池
51 正極電極(電極)
52 負極電極(電極)
106 チャックテーブル
106-1 保持面
200 被加工物
Claims (3)
- 板状の被加工物を支持する支持基台であって、
接着部材が積層され、接着部材が被加工物に貼着されることにより、被加工物を固定する支持面と、該支持面と反対側の面でチャックテーブルの保持面に載置される載置面とを備え、該支持面に開口した複数の貫通孔が設けられた平板状の箱体と、
該箱体に収容される温度測定ユニット及び該温度測定ユニットの電源となる電池と、を備え、
該温度測定ユニットは、
該支持面の温度を測定するとともに、該貫通孔と対応して複数設けられた温度測定器と、
該温度測定器で測定した温度を記録する記録部と、を備え、
該温度測定器が、それぞれ、先端が互いに接続されかつ該貫通孔を通して該接着部材に取り付けられた一対の金属線を備える支持基台。 - 該温度測定ユニットは、
該温度測定器で測定した温度情報を該箱体の外へ発信する無線通信手段を備える請求項1に記載の支持基台。 - 該被加工物は、該支持基台を介して該チャックテーブルに保持された状態で研磨される請求項1又は請求項2に記載の支持基台。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018005826A JP7045861B2 (ja) | 2018-01-17 | 2018-01-17 | 支持基台 |
KR1020190002689A KR102614835B1 (ko) | 2018-01-17 | 2019-01-09 | 지지 기대 |
US16/246,724 US11241770B2 (en) | 2018-01-17 | 2019-01-14 | Support base |
CN201910035875.8A CN110052958B (zh) | 2018-01-17 | 2019-01-15 | 支承基台 |
TW108101573A TWI785187B (zh) | 2018-01-17 | 2019-01-16 | 支持基台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018005826A JP7045861B2 (ja) | 2018-01-17 | 2018-01-17 | 支持基台 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019123050A JP2019123050A (ja) | 2019-07-25 |
JP7045861B2 true JP7045861B2 (ja) | 2022-04-01 |
Family
ID=67213514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018005826A Active JP7045861B2 (ja) | 2018-01-17 | 2018-01-17 | 支持基台 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11241770B2 (ja) |
JP (1) | JP7045861B2 (ja) |
KR (1) | KR102614835B1 (ja) |
CN (1) | CN110052958B (ja) |
TW (1) | TWI785187B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6890860B1 (ja) * | 2020-07-25 | 2021-06-18 | Hi−Line22株式会社 | ガラス傷消し方法、傷消し監視装置、および傷消し監視プログラム |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003071714A (ja) | 2001-09-05 | 2003-03-12 | Disco Abrasive Syst Ltd | 研磨装置 |
JP2006315137A (ja) | 2005-05-13 | 2006-11-24 | Nitta Haas Inc | 研磨パッド |
WO2007072817A1 (ja) | 2005-12-20 | 2007-06-28 | Nikon Corporation | 基板搬送方法、基板搬送装置および露光装置 |
JP2011194509A (ja) | 2010-03-19 | 2011-10-06 | Nitta Haas Inc | 研磨装置、研磨パッドおよび研磨情報管理システム |
JP2015104769A (ja) | 2013-11-29 | 2015-06-08 | 株式会社荏原製作所 | 研磨テーブルおよび研磨装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH08112752A (ja) * | 1994-10-13 | 1996-05-07 | Mitsubishi Materials Shilicon Corp | 半導体ウェーハの研磨方法および研磨装置 |
JPH0929620A (ja) * | 1995-07-20 | 1997-02-04 | Ebara Corp | ポリッシング装置 |
CN1178392A (zh) * | 1996-09-19 | 1998-04-08 | 株式会社日立制作所 | 静电吸盘和应用了静电吸盘的样品处理方法及装置 |
US6352466B1 (en) * | 1998-08-31 | 2002-03-05 | Micron Technology, Inc. | Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
JP4546659B2 (ja) | 2001-03-28 | 2010-09-15 | 株式会社ディスコ | 研磨工具 |
JP4885376B2 (ja) | 2001-07-04 | 2012-02-29 | 株式会社ディスコ | 研削ホイール |
US6562185B2 (en) * | 2001-09-18 | 2003-05-13 | Advanced Micro Devices, Inc. | Wafer based temperature sensors for characterizing chemical mechanical polishing processes |
JP3980898B2 (ja) | 2002-02-05 | 2007-09-26 | 株式会社ディスコ | 研磨装置 |
US7011566B2 (en) * | 2002-08-26 | 2006-03-14 | Micron Technology, Inc. | Methods and systems for conditioning planarizing pads used in planarizing substrates |
JP2004363252A (ja) | 2003-06-03 | 2004-12-24 | Sumitomo Mitsubishi Silicon Corp | 半導体ウェーハの研磨面の温度測定方法および半導体ウェーハの研磨装置 |
US7201634B1 (en) * | 2005-11-14 | 2007-04-10 | Infineon Technologies Ag | Polishing methods and apparatus |
JP2009244174A (ja) * | 2008-03-31 | 2009-10-22 | Tokyo Electron Ltd | ウェハ型温度計、温度測定装置、熱処理装置および温度測定方法 |
JP2010183037A (ja) * | 2009-02-09 | 2010-08-19 | Toshiba Corp | 半導体製造装置 |
US20140020829A1 (en) * | 2012-07-18 | 2014-01-23 | Applied Materials, Inc. | Sensors in Carrier Head of a CMP System |
JP2015023137A (ja) * | 2013-07-18 | 2015-02-02 | 株式会社ディスコ | 剥離装置及び剥離方法 |
US20160121452A1 (en) * | 2014-10-31 | 2016-05-05 | Ebara Corporation | Polishing apparatus and polishing method |
US11089657B2 (en) * | 2015-03-06 | 2021-08-10 | SCREEN Holdings Co., Ltd. | Light-irradiation heat treatment apparatus |
US10930535B2 (en) * | 2016-12-02 | 2021-02-23 | Applied Materials, Inc. | RFID part authentication and tracking of processing components |
US20180281151A1 (en) * | 2017-03-30 | 2018-10-04 | Applied Materials, Inc. | Adhesive-less carriers for chemical mechanical polishing |
-
2018
- 2018-01-17 JP JP2018005826A patent/JP7045861B2/ja active Active
-
2019
- 2019-01-09 KR KR1020190002689A patent/KR102614835B1/ko active IP Right Grant
- 2019-01-14 US US16/246,724 patent/US11241770B2/en active Active
- 2019-01-15 CN CN201910035875.8A patent/CN110052958B/zh active Active
- 2019-01-16 TW TW108101573A patent/TWI785187B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003071714A (ja) | 2001-09-05 | 2003-03-12 | Disco Abrasive Syst Ltd | 研磨装置 |
JP2006315137A (ja) | 2005-05-13 | 2006-11-24 | Nitta Haas Inc | 研磨パッド |
WO2007072817A1 (ja) | 2005-12-20 | 2007-06-28 | Nikon Corporation | 基板搬送方法、基板搬送装置および露光装置 |
JP2011194509A (ja) | 2010-03-19 | 2011-10-06 | Nitta Haas Inc | 研磨装置、研磨パッドおよび研磨情報管理システム |
JP2015104769A (ja) | 2013-11-29 | 2015-06-08 | 株式会社荏原製作所 | 研磨テーブルおよび研磨装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI785187B (zh) | 2022-12-01 |
US11241770B2 (en) | 2022-02-08 |
JP2019123050A (ja) | 2019-07-25 |
KR20190088008A (ko) | 2019-07-25 |
CN110052958B (zh) | 2022-07-08 |
US20190217440A1 (en) | 2019-07-18 |
TW201933528A (zh) | 2019-08-16 |
CN110052958A (zh) | 2019-07-26 |
KR102614835B1 (ko) | 2023-12-15 |
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