JP7039527B2 - 無線装置および無線装置の製造方法 - Google Patents
無線装置および無線装置の製造方法 Download PDFInfo
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- JP7039527B2 JP7039527B2 JP2019130233A JP2019130233A JP7039527B2 JP 7039527 B2 JP7039527 B2 JP 7039527B2 JP 2019130233 A JP2019130233 A JP 2019130233A JP 2019130233 A JP2019130233 A JP 2019130233A JP 7039527 B2 JP7039527 B2 JP 7039527B2
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Description
まず、図1および図2を参照して、第1の実施形態に係る無線装置の構造について説明する。図1は、第1の実施形態に係る無線装置の外観を示す斜視図であり、図2は、図1の線分A-A’を通り、XZ面に平行な面における断面図である。
なお、上述の第1の実施形態に係る無線装置においては、図1に示したように、封止樹脂104の表面のうち、基板101の第1の面101aと平行な上面部から、この上面部と交差する1つの側面部を介して基板101の端面に到達する形状で、第1の金属膜105が設けられている。しかし、第1の金属膜105は、基板101の端面において第1の配線111と接触し、第1の配線111と接続される形状であれば、どのような形状で設けられていてもよい。
第2の金属膜106は、上述のように、無線回路102が動作する際にグランド電位となる導体である。したがって、例えば図7に示すように、第2の金属膜16にスロットアンテナ109の少なくとも一部を形成し、アンテナ付きの無線装置として構成することもできる。この場合、スロットアンテナ109は、基板101の第1の面101aに対して垂直な方向(-Z方向)に見たときに、無線回路102と重ならないように形成する。これにより、第2の金属膜106による電磁波シールドの機能を維持しながら、アンテナ付きの無線装置を実現することができる。
上述の第1の実施形態に係る無線装置は、2次電池107を基板101の第2の面101bに表面実装している。しかし、2次電池107は、第1の電極107aが基板101に設けられた第1の配線111に電気的に接続され、第2の電極107bが基板101に設けられた第2の配線112に電気的に接続されるように無線装置に搭載されればよく、基板101の第2の面101bに表面実装する形態に限らない。
次に、第2の実施形態について説明する。第2の実施形態に係る無線装置は、2次電池107として、一般的に市販されているリチウムポリマー電池を無線装置に搭載した例である。一般的に市販されているリチウムポリマー電池は電源回路を備えており、この電源回路にコネクタがケーブルによって接続されている。リチウムポリマー電池の第1の電極(正極)は、電源回路を介してコネクタの正極側端子と電気的に接続され、リチウムポリマー電池の第2の電極(負極)は、電源回路を介してコネクタの負極側端子と電気的に接続されている。以下では、本実施形態に係る無線装置に搭載される2次電池107を、第1実施形態と区別して2次電池107’と表記する。
101a 第1の面
101b 第2の面
102 無線回路
103 電源回路
104 封止樹脂
105 第1の金属膜
106 第2の金属膜
107 2次電池
107a 第1の電極
107b 第2の電極
108 ギャップ部
109 スロットアンテナ
111 第1の配線
112 第2の配線
113 第3の配線
Claims (10)
- 基板と、
前記基板の第1の面に搭載された、無線回路を含む半導体素子と、
前記基板の前記第1の面に設けられ、前記半導体素子を封止する非導電層と、
前記非導電層の表面から前記基板の少なくとも1つの端面に亘って設けられ、該端面において前記基板に設けられた第1の配線と接触する第1の金属膜と、
前記非導電層の表面から前記基板の少なくとも1つの端面に亘って、前記第1の金属膜と離間して設けられ、該端面において前記基板に設けられた第2の配線と接触する第2の金属膜と、
第1の電極が前記第1の配線と電気的に接続され、第2の電極が前記第2の配線と電気的に接続された2次電池と、を備える無線装置。 - 前記2次電池は、前記基板の第2の面に搭載されている
請求項1に記載の無線装置。 - 前記基板の第2の面側に配置される電池基板をさらに備え、
前記2次電池は、前記電池基板に搭載されている
請求項1に記載の無線装置。 - 前記2次電池は、前記基板の前記第1の面に搭載され、前記半導体素子とともに前記非導電層により封止されている
請求項1に記載の無線装置。 - 前記2次電池の前記第1の電極は、前記基板に設けられた第3の配線および電源回路を介して前記第1の配線と電気的に接続されている
請求項1乃至4のいずれか一項に記載の無線装置。 - 前記第2の金属膜の一部は、前記基板の前記第1の面に対して垂直な方向に見たときに、前記半導体素子と重なるように設けられている
請求項1乃至5のいずれか一項に記載の無線装置。 - 前記非導電層の表面は、前記基板の前記第1の面と平行な上面部と、該上面部と交差する側面部とを含み、
前記第1の金属膜は、前記非導電層の側面部から前記基板の少なくとも1つの端面に亘って設けられている
請求項1乃至6のいずれか一項に記載の無線装置。 - 前記第1の金属膜と前記第2の金属膜は、前記非導電層の表面から前記基板の少なくとも1つの端面に亘って成膜された一体の金属膜に対して切削加工を施してスリット状のギャップ部を形成し、該ギャップ部により前記一体の金属膜を分離することにより形成される
請求項1乃至7のいずれか一項に記載の無線装置。 - 前記第1の金属膜および前記第2の金属膜の少なくとも一方にスロットアンテナの少なくとも一部が形成されている
請求項1乃至8のいずれか一項に記載の無線装置。 - 基板の第1の面に搭載された半導体素子を封止する非導電層の表面から前記基板の少なくとも1つの端面に亘って一体の金属膜を成膜する工程と、
前記一体の金属膜に対して切削加工を施してスリット状のギャップ部を形成し、該ギャップ部により前記一体の金属膜を、前記基板の少なくとも1つの端面において前記基板に設けられた第1の配線と接触する第1の金属膜と、前記基板の少なくとも1つの端面において前記基板に設けられた第2の配線と接触する第2の金属膜とに分離する工程とを有し、
前記第1の配線は2次電池の第1の電極と電気的に接続され、前記第2の配線は2次電池の第2の電極と電気的に接続される
無線装置の製造方法。
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