JP7019657B2 - 配線回路基板の製造方法 - Google Patents
配線回路基板の製造方法 Download PDFInfo
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- JP7019657B2 JP7019657B2 JP2019222680A JP2019222680A JP7019657B2 JP 7019657 B2 JP7019657 B2 JP 7019657B2 JP 2019222680 A JP2019222680 A JP 2019222680A JP 2019222680 A JP2019222680 A JP 2019222680A JP 7019657 B2 JP7019657 B2 JP 7019657B2
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- Prior art keywords
- wiring
- resist
- seed film
- thickness direction
- insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/058—Additional resists used for the same purpose but in different areas, i.e. not stacked
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
Description
本発明(5)は、前記種膜の厚みが、50nm以上、1000nm以下である、(1)~(4)のいずれか一項に記載の配線回路基板の製造方法を含む。
本発明の配線回路基板の製造方法の一実施形態を図1A~図2を参照して説明する。
そして、この製造方法では、第2工程において、図1Dおよび図1Gに示すように、厚みが互いに異なる第1配線3および第2配線4のそれぞれを、第1レジスト7および第2レジスト8のそれぞれを用いて形成するので、所望の形状、配置、サイズを有する第1配線3および第2配線4を形成することができる。
以上の各変形例において、上記した一実施形態と同様の部材および工程については、同一の参照符号を付し、その詳細な説明を省略する。また、各変形例は、特記する以外、一実施形態と同様の作用効果を奏することができる。さらに、一実施形態およびその変形例を適宜組み合わせることができる。
3 第1配線
4 第2配線
6 種膜
7 第1レジスト
8 第2レジスト
T3 種膜の厚み
Claims (4)
- 絶縁層を形成する第1工程と、
第1配線および前記第1配線より厚い第2配線を、前記絶縁層の厚み方向一方面に、順に形成する第2工程とを備え、
前記第2工程は、
種膜を、前記絶縁層の前記厚み方向一方面に形成する工程と、
第1レジストを、前記種膜の前記厚み方向一方面に、前記第1配線の反転パターンで形成する工程と、
前記第1配線を、前記第1レジストから露出する前記種膜の前記厚み方向一方面にめっきにより形成する工程と、
前記第1レジストを除去する工程と、
第2レジストを、前記種膜の厚み方向一方面に、前記第1配線を被覆するように、前記第2配線の反転パターンで形成する工程と、
前記第2配線を、前記第2レジストから露出する前記種膜の厚み方向一方面にめっきにより形成する工程と、
前記第2レジストを除去する工程と、
前記第1配線および前記第2配線から露出する前記種膜を除去する工程と
を順に備え、
前記第1レジストは、開口部を有し、
前記第2レジストは、第2開口部を有し、
前記第2開口部は、前記開口部が形成された位置に重ならず、
前記第1配線は、電気信号を伝送するように構成され、前記第1配線の厚みT1は、15μm以下、1μm以上であり、前記第1配線の幅W1は、5μm以上、50μm以下であり、
前記第2配線は、電源電流を伝送するように構成され、前記第2配線の厚みT2は、20μm以上、500μm以下であり、前記第2配線の幅W2は、20μm以上、100μm以下であることを特徴とする、配線回路基板の製造方法。 - 前記第1レジストを除去する工程では、前記種膜が残ることを特徴とする、請求項1に記載の配線回路基板の製造方法。
- 前記第2配線は、前記第1配線に対して独立することを特徴とする、請求項1または2に記載の配線回路基板の製造方法。
- 前記種膜の厚みが、50nm以上、1000nm以下であることを特徴とする、請求項1~3のいずれか一項に記載の配線回路基板の製造方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019222680A JP7019657B2 (ja) | 2019-12-10 | 2019-12-10 | 配線回路基板の製造方法 |
CN202080085687.7A CN114788423A (zh) | 2019-12-10 | 2020-11-27 | 布线电路基板的制造方法 |
PCT/JP2020/044169 WO2021117501A1 (ja) | 2019-12-10 | 2020-11-27 | 配線回路基板の製造方法 |
KR1020227018620A KR20220113935A (ko) | 2019-12-10 | 2020-11-27 | 배선 회로 기판의 제조 방법 |
US17/783,206 US20230007783A1 (en) | 2019-12-10 | 2020-11-27 | Method for producing wiring circuit board |
TW109142601A TW202137836A (zh) | 2019-12-10 | 2020-12-03 | 配線電路基板之製造方法 |
JP2021203306A JP7203939B2 (ja) | 2019-12-10 | 2021-12-15 | 配線回路基板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019222680A JP7019657B2 (ja) | 2019-12-10 | 2019-12-10 | 配線回路基板の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021203306A Division JP7203939B2 (ja) | 2019-12-10 | 2021-12-15 | 配線回路基板の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2021093434A JP2021093434A (ja) | 2021-06-17 |
JP2021093434A5 JP2021093434A5 (ja) | 2021-09-16 |
JP7019657B2 true JP7019657B2 (ja) | 2022-02-15 |
Family
ID=76312732
Family Applications (1)
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JP2019222680A Active JP7019657B2 (ja) | 2019-12-10 | 2019-12-10 | 配線回路基板の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20230007783A1 (ja) |
JP (1) | JP7019657B2 (ja) |
KR (1) | KR20220113935A (ja) |
CN (1) | CN114788423A (ja) |
TW (1) | TW202137836A (ja) |
WO (1) | WO2021117501A1 (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001007456A (ja) | 1999-06-17 | 2001-01-12 | Toshiba Corp | 配線回路基板 |
JP2002111174A (ja) | 2000-09-27 | 2002-04-12 | Nitto Denko Corp | 配線回路基板の製造方法 |
JP2010056576A (ja) | 2009-12-07 | 2010-03-11 | Panasonic Electric Works Co Ltd | 配線基板及びその製造方法 |
JP2010067317A (ja) | 2008-09-11 | 2010-03-25 | Dainippon Printing Co Ltd | サスペンション用基板 |
US20170170111A1 (en) | 2015-12-15 | 2017-06-15 | Intel IP Corporation | Semiconductor package having a variable redistribution layer thickness |
JP2018074073A (ja) | 2016-11-02 | 2018-05-10 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
JP2018157051A (ja) | 2017-03-17 | 2018-10-04 | 三菱マテリアル株式会社 | バンプ付き配線基板の製造方法 |
JP2018174188A (ja) | 2017-03-31 | 2018-11-08 | 大日本印刷株式会社 | 導電基板およびその製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4159222A (en) * | 1977-01-11 | 1979-06-26 | Pactel Corporation | Method of manufacturing high density fine line printed circuitry |
JPH0832244A (ja) * | 1994-07-12 | 1996-02-02 | Toshiba Corp | 多層配線基板 |
JP2806370B2 (ja) * | 1996-07-16 | 1998-09-30 | 日本電気株式会社 | パターン形成方法 |
JP4034772B2 (ja) * | 2004-09-16 | 2008-01-16 | Tdk株式会社 | 多層基板及びその製造方法 |
JP2016186986A (ja) * | 2015-03-27 | 2016-10-27 | 株式会社フジクラ | プリント配線板及びプリント配線板の製造方法 |
US9653406B2 (en) * | 2015-04-16 | 2017-05-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Conductive traces in semiconductor devices and methods of forming same |
CA2992290C (en) * | 2015-07-14 | 2024-01-02 | Conocophillips Company | Enhanced oil recovery response prediction |
-
2019
- 2019-12-10 JP JP2019222680A patent/JP7019657B2/ja active Active
-
2020
- 2020-11-27 WO PCT/JP2020/044169 patent/WO2021117501A1/ja active Application Filing
- 2020-11-27 US US17/783,206 patent/US20230007783A1/en active Pending
- 2020-11-27 KR KR1020227018620A patent/KR20220113935A/ko active Search and Examination
- 2020-11-27 CN CN202080085687.7A patent/CN114788423A/zh active Pending
- 2020-12-03 TW TW109142601A patent/TW202137836A/zh unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001007456A (ja) | 1999-06-17 | 2001-01-12 | Toshiba Corp | 配線回路基板 |
JP2002111174A (ja) | 2000-09-27 | 2002-04-12 | Nitto Denko Corp | 配線回路基板の製造方法 |
JP2010067317A (ja) | 2008-09-11 | 2010-03-25 | Dainippon Printing Co Ltd | サスペンション用基板 |
JP2010056576A (ja) | 2009-12-07 | 2010-03-11 | Panasonic Electric Works Co Ltd | 配線基板及びその製造方法 |
US20170170111A1 (en) | 2015-12-15 | 2017-06-15 | Intel IP Corporation | Semiconductor package having a variable redistribution layer thickness |
JP2018074073A (ja) | 2016-11-02 | 2018-05-10 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
JP2018157051A (ja) | 2017-03-17 | 2018-10-04 | 三菱マテリアル株式会社 | バンプ付き配線基板の製造方法 |
JP2018174188A (ja) | 2017-03-31 | 2018-11-08 | 大日本印刷株式会社 | 導電基板およびその製造方法 |
Also Published As
Publication number | Publication date |
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WO2021117501A1 (ja) | 2021-06-17 |
KR20220113935A (ko) | 2022-08-17 |
JP2021093434A (ja) | 2021-06-17 |
US20230007783A1 (en) | 2023-01-05 |
TW202137836A (zh) | 2021-10-01 |
CN114788423A (zh) | 2022-07-22 |
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