JP7018965B2 - 電子モジュール - Google Patents
電子モジュール Download PDFInfo
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- JP7018965B2 JP7018965B2 JP2019566023A JP2019566023A JP7018965B2 JP 7018965 B2 JP7018965 B2 JP 7018965B2 JP 2019566023 A JP2019566023 A JP 2019566023A JP 2019566023 A JP2019566023 A JP 2019566023A JP 7018965 B2 JP7018965 B2 JP 7018965B2
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Description
本発明による電子モジュールは、
第一基板と、
前記第一基板の一方側に設けられる第二基板と、
前記第一基板と前記第二基板との間に設けられるチップモジュールと、を備え、
前記チップモジュールが、電子素子と、前記電子素子に電気的に接続される接続体と、を有し、
前記電子素子が、前記電子モジュールの厚み方向である第一方向に沿って延在してもよい。
本発明の概念1による電子モジュールにおいて、
前記チップモジュールは、第一電子素子と、前記第一電子素子に対して前記接続体を介して接続された第二電子素子とを有してもよい。
本発明の概念1又は2のいずれかによる電子モジュールにおいて、
前記接続体は第一接続体及び第二接続体を有し、
前記チップモジュールは、第一電子素子と、第二電子素子と、前記第一電子素子と前記第二電子素子との間に設けられた第一接続体と、前記第二電子素子の前記第一接続体と反対側に設けられた第二接続体と、を有してもよい。
本発明の概念1乃至3のいずれか1つによる電子モジュールにおいて、
前記接続体は、ヘッド部と、前記ヘッド部からヘッド部の厚み方向で延びた柱部とを有し、
前記ヘッド部は前記電子モジュールの厚み方向で延在してもよい。
本発明の概念1乃至4のいずれか1つによる電子モジュールにおいて、
前記チップモジュールが複数設けられ、
前記チップモジュールの間に、前記チップモジュールに電気的に接続されるチップ接続体が設けられてもよい。
本発明の概念5による電子モジュールにおいて、
前記チップモジュールは、前記チップ接続体と嵌合する嵌合部を有してもよい。
本発明の概念1乃至6のいずれか1つによる電子モジュールは、
前記第一基板の一方側に設けられた第一導体層と、
前記第二基板の他方側に設けられた第二導体層と、をさらに備え、
前記接続体が、前記電子素子と前記第一導体層及び前記第二導体層の各々とを接続する接続端子を有し、
前記接続端子に接続される第一導体層及び第二導体層のいずれか一方が外部装置と電気的に接続されなくてもよい。
本発明の概念1乃至7のいずれか1つによる電子モジュールは、
前記第一基板の一方側に設けられた第一導体層と、
前記第二基板の他方側に設けられた第二導体層と、をさらに備え、
前記接続体が、ヘッド部と、前記ヘッド部の端部から前記第一基板の面内方向に沿って延在し、前記第一導体層に接続される第一基端部と、前記ヘッド部の端部から前記第二基板の面内方向に沿って延在し、前記第二導体層に接続される第二基端部とを有し、
前記ヘッド部の端部から前記第一基端部が延在する方向と、前記端子ヘッド部の端部から前記第二基端部が延在する方向とが、第二方向及び第三方向を含む電子モジュールの面内方向で重複しなくてもよい。
本発明の概念8による電子モジュールにおいて、
前記ヘッド部の端部から前記第一基端部が延在する方向と、前記端子ヘッド部の端部から前記第二基端部が延在する方向とは180度異なってもよい。
《構成》
本実施の形態において、「一方側」は図1の上方側を意味し、「他方側」は図1の下方側を意味する。図1の上下方向を「第一方向」と呼び、左右方向を「第二方向」と呼び、紙面の表裏方向を「第三方向」と呼ぶ。第二方向及び第三方向を含む面内方向を「面内方向」といい、一方側から見た場合には「平面視」という。
次に、上述した構成からなる本実施の形態による作用・効果の一例について説明する。なお、「作用・効果」で説明するあらゆる態様を、上記構成で採用することができる。
次に、本発明の第2の実施の形態について説明する。
次に、本発明の第3の実施の形態について説明する。
次に、本発明の第4の実施の形態について説明する。
次に、本発明の第5の実施の形態について説明する。
次に、本発明の第6の実施の形態について説明する。
13 第一電子素子(電子素子)
21 第二基板
23 第二電子素子(電子素子)
60 第一接続体(接続体)
61 第一ヘッド部(ヘッド部)
62 第一柱部(柱部)
70 第二接続体(接続体)
71 第二ヘッド部(ヘッド部)
72 第二柱部(柱部)
79 嵌合部
80 接続端子
100 チップモジュール
150 チップ接続体
Claims (9)
- 電子モジュールにおいて、
第一基板と、
前記第一基板の一方側に設けられる第二基板と、
前記第一基板と前記第二基板との間に設けられるチップモジュールと、
少なくとも前記チップモジュール、前記第一基板の一方側の面及び前記第二基板の他方側の面を封止する封止部と、を備え、
前記チップモジュールは、電子素子と、前記電子素子に電気的に接続される接続体と、を有し、
前記電子素子は、前記電子モジュールの厚み方向である第一方向に沿って延在することを特徴とする電子モジュール。 - 前記接続体は、ヘッド部と、前記ヘッド部の端部から前記第一基板の面内方向に沿って延在し、前記第一基板の一方側に設けられた第一導体層に接続される第一基端部と、前記ヘッド部の端部から前記第二基板の面内方向に沿って延在し前記第二基板の他方側に設けられた第二導体層に接続される第二基端部とを有することを特徴とする請求項1に記載の電子モジュール。
- 前記接続体は第一接続体及び第二接続体を有し、
前記チップモジュールは、第一電子素子と、第二電子素子と、前記第一電子素子と前記第二電子素子との間に設けられた第一接続体と、前記第二電子素子の前記第一接続体と反対側に設けられた第二接続体と、を有することを特徴とする請求項1又は2のいずれかに記載の電子モジュール。 - 前記接続体は、ヘッド部と、前記ヘッド部からヘッド部の厚み方向で延びた柱部とを有し、
前記ヘッド部は前記電子モジュールの厚み方向で延在することを特徴とする請求項1乃至3のいずれか1項に記載の電子モジュール。 - 前記チップモジュールが複数設けられ、
前記チップモジュールの間に、前記チップモジュールに電気的に接続されるチップ接続体が設けられることを特徴とする請求項1乃至4のいずれか1項に記載の電子モジュール。 - 電子モジュールにおいて、
第一基板と、
前記第一基板の一方側に設けられる第二基板と、
前記第一基板と前記第二基板との間に設けられるチップモジュールと、を備え、
前記チップモジュールは、電子素子と、前記電子素子に電気的に接続される接続体と、を有し、
前記電子素子は、前記電子モジュールの厚み方向である第一方向に沿って延在し、
前記チップモジュールが複数設けられ、
前記チップモジュールの間に、前記チップモジュールに電気的に接続されるチップ接続体が設けられ、
前記チップモジュールは、前記チップ接続体と嵌合する嵌合部を有することを特徴とする電子モジュール。 - 前記第一基板の一方側に設けられた第一導体層と、
前記第二基板の他方側に設けられた第二導体層と、をさらに備え、
前記接続体は、前記電子素子と前記第一導体層及び前記第二導体層の各々とを接続する接続端子を有し、
前記接続端子に接続される第一導体層及び第二導体層のいずれか一方は外部装置と電気的に接続されないことを特徴とする請求項1乃至6のいずれか1項に記載の電子モジュール。 - 電子モジュールにおいて、
第一基板と、
前記第一基板の一方側に設けられる第二基板と、
前記第一基板と前記第二基板との間に設けられるチップモジュールと、
前記第一基板の一方側に設けられた第一導体層と、
前記第二基板の他方側に設けられた第二導体層と、を備え、
前記チップモジュールは、電子素子と、前記電子素子に電気的に接続される接続体と、を有し、
前記電子素子は、前記電子モジュールの厚み方向である第一方向に沿って延在し、
前記接続体は、ヘッド部と、前記ヘッド部の端部から前記第一基板の面内方向に沿って延在し、前記第一導体層に接続される第一基端部と、前記ヘッド部の端部から前記第二基板の面内方向に沿って延在し、前記第二導体層に接続される第二基端部とを有し、
前記ヘッド部の端部から前記第一基端部が延在する方向と、前記ヘッド部の端部から前記第二基端部が延在する方向とは、第二方向及び第三方向を含む電子モジュールの面内方向で重複しないことを特徴とする電子モジュール。 - 前記ヘッド部の端部から前記第一基端部が延在する方向と、前記ヘッド部の端部から前記第二基端部が延在する方向とは180度異なることを特徴とする請求項8に記載の電子モジュール。
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