JP6976743B2 - 液体吐出ヘッド用基板、液体吐出ヘッド、液体吐出装置、導電層の形成方法、及び液体吐出ヘッド用基板の製造方法 - Google Patents
液体吐出ヘッド用基板、液体吐出ヘッド、液体吐出装置、導電層の形成方法、及び液体吐出ヘッド用基板の製造方法 Download PDFInfo
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B41J2/16—Production of nozzles
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- B41J2/1626—Manufacturing processes etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J25/00—Actions or mechanisms not otherwise provided for
- B41J25/001—Mechanisms for bodily moving print heads or carriages parallel to the paper surface
- B41J25/006—Mechanisms for bodily moving print heads or carriages parallel to the paper surface for oscillating, e.g. page-width print heads provided with counter-balancing means or shock absorbers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/165—Prevention or detection of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
- B41J2/16517—Cleaning of print head nozzles
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
を有し、
前記発熱抵抗素子、前記第2絶縁層、及び前記導電層を通る断面において、前記導電層の前記端部の側面と底面の成す角は鋭角である液体吐出ヘッド用基板に関する。
実施の形態の液体吐出ヘッド用基板とその製造方法について、図1乃至図4を用いて説明する。図1乃至図4において、同一の構成や機能を有する部分については同じ参照番号を用いる。
本実施の形態について、図5を用いて説明する。実施の形態1と同様の構成、機能を有する部分、効果については説明を省略する。本実施の形態の実施の形態1との違いは、導電層6が開口を有する点である。
本実施の形態について図6、図7(a)〜図8(c)を用いて説明する。本実施の形態においても、実施の形態1または2と同様の構成、機能を有する部分、効果、製造方法等については説明を省略する。本実施の形態と実施の形態1との違いは、実施の形態1の導電層17がイリジウムを含む層と、イリジウムとは異なる金属の層との2層の積層、または1層だったのに対し、本実施の形態では、導電層17は3層の導電層を有する。
本実施の形態について、図9を用いて説明する。実施の形態1〜3と同様の構成、機能を有する部分、効果については説明を省略する。本実施の形態の実施の形態3との違いは、導電層62が開口を有する点である。
図10を参照しながら、上記液体吐出ヘッド用基板を液体吐出装置に搭載した例について、インクジェット記録方式のものを例示して説明する。しかし、液体吐出装置はこの形態には限定されず、例えば、溶融型や昇華型等の熱転写方式の液体吐出装置についても同様である。液体吐出装置は、例えば、記録機能のみを有するシングルファンクションプリンタであっても良いし、例えば、記録機能、FAX機能、スキャナ機能等の複数の機能を有するマルチファンクションプリンタであっても良い。また、液体吐出装置は、例えば、カラーフィルタ、電子デバイス、光学デバイス、微小構造物等を所定の記録方式で製造するための製造装置であっても良い。
2 電極
3 発熱抵抗素子
5 Ir膜
6,61,62 Ta膜
7 フォトレジスト膜
8 絶縁層
Claims (8)
- 発熱抵抗素子と、
前記発熱抵抗素子を覆う第1絶縁層と、
前記第1絶縁層の上に配され、前記発熱抵抗素子の上面に対する平面視において、前記第1絶縁層を介して前記発熱抵抗素子と重なる導電層と、
前記導電層の端部を覆う第2絶縁層と、
を有し、
前記導電層は、イリジウム層と、前記イリジウム層の上に配される第1タンタル層を有し、
前記発熱抵抗素子、前記第2絶縁層、及び前記導電層を通る断面において、前記イリジウム層と前記第1タンタル層の前記端部の側面と底面の成す角は鋭角である液体吐出ヘッド用基板。 - 前記第1タンタル層は、前記平面視において前記発熱抵抗素子と重なる領域に開口を有する請求項1に記載の液体吐出ヘッド用基板。
- 前記導電層は、第2タンタル層を有し、
前記イリジウム層は前記第2タンタル層の上に配される請求項1または2に記載の液体吐出ヘッド用基板。 - 前記第2絶縁層は、炭化シリコン及び炭窒化シリコンの少なくとも一方を含む請求項1乃至3のいずれか1項に記載の液体吐出ヘッド用基板。
- 前記第2絶縁層には、接着層を介してノズル部材が配されており、
前記ノズル部材の前記第2絶縁層に接着されている部分は、前記平面視において、前記導電層を囲む請求項1乃至4のいずれか1項に記載の液体吐出ヘッド用基板。 - 液体吐出素子が前記発熱抵抗素子及び前記導電層を有し、
前記発熱抵抗素子を複数、有する請求項1乃至5のいずれか1項に記載の液体吐出ヘッド用基板。 - 前記請求項6に記載の液体吐出ヘッド用基板と、
前記液体吐出ヘッド用基板の前記複数の発熱抵抗素子のそれぞれ異なる1つに対応するように配された複数の吐出口と、
を有する記録部と、
前記記録部に取り付けられたインク容器と、を
有する液体吐出ヘッド。 - 請求項7に記載の液体吐出ヘッドと、
前記液体吐出ヘッドが搭載されるキャリッジと、
前記キャリッジを移動するためのガイドと、
を有する液体吐出装置。
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JP2017127977A JP6976743B2 (ja) | 2017-06-29 | 2017-06-29 | 液体吐出ヘッド用基板、液体吐出ヘッド、液体吐出装置、導電層の形成方法、及び液体吐出ヘッド用基板の製造方法 |
US16/016,429 US10843462B2 (en) | 2017-06-29 | 2018-06-22 | Liquid discharge head substrate, liquid discharge head, liquid discharge apparatus, method for forming conductive layer, and method for manufacturing liquid discharge head substrate |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3320825B2 (ja) | 1992-05-29 | 2002-09-03 | 富士写真フイルム株式会社 | 記録装置 |
US6218221B1 (en) * | 1999-05-27 | 2001-04-17 | Chi Mei Optoelectronics Corp. | Thin film transistor with a multi-metal structure and a method of manufacturing the same |
US7249818B1 (en) * | 1999-10-12 | 2007-07-31 | Hewlett-Packard Development Company, L.P. | Print head apparatus with malfunction detector |
JP2004055845A (ja) * | 2002-07-19 | 2004-02-19 | Canon Inc | 回路基板およびその製造方法 |
JP2004146552A (ja) * | 2002-10-24 | 2004-05-20 | Fujitsu Ltd | 微細レジストパターンの形成方法 |
JP5076119B2 (ja) * | 2006-02-22 | 2012-11-21 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
JP5006663B2 (ja) * | 2006-03-08 | 2012-08-22 | キヤノン株式会社 | 液体吐出ヘッド |
EP2229279B1 (en) * | 2007-12-02 | 2012-04-18 | Hewlett-Packard Development Company, L.P. | Electrically connecting electrically isolated printhead die ground networks as flexible circuit |
JP5328607B2 (ja) * | 2008-11-17 | 2013-10-30 | キヤノン株式会社 | 液体吐出ヘッド用基板、該基板を有する液体吐出ヘッド、該ヘッドのクリーニング方法および前記ヘッドを用いる液体吐出装置 |
JP5765924B2 (ja) * | 2010-12-09 | 2015-08-19 | キヤノン株式会社 | 液体吐出ヘッドの駆動方法、液体吐出ヘッド、及び液体吐出装置 |
JP2012152902A (ja) * | 2011-01-21 | 2012-08-16 | Canon Inc | 液体吐出ヘッド用基板 |
JP2012179856A (ja) * | 2011-03-02 | 2012-09-20 | Seiko Epson Corp | シランカップリング剤の成膜方法及びインクジェットヘッドの製造方法 |
US9544982B2 (en) * | 2014-01-31 | 2017-01-10 | Asml Netherlands B.V. | Nozzle |
JP2016037625A (ja) * | 2014-08-06 | 2016-03-22 | キヤノン株式会社 | エッチング方法及び液体吐出ヘッド用基板の製造方法 |
JP6736321B2 (ja) * | 2015-03-27 | 2020-08-05 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
JP2017001217A (ja) * | 2015-06-05 | 2017-01-05 | キヤノン株式会社 | 液体吐出ヘッド、液体吐出ヘッドの製造方法 |
US10040285B2 (en) | 2015-08-27 | 2018-08-07 | Canon Kabushiki Kaisha | Liquid ejection head and liquid ejection device, and aging treatment method and initial setup method for a liquid ejection device |
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