JP6929103B2 - 光モジュール - Google Patents
光モジュール Download PDFInfo
- Publication number
- JP6929103B2 JP6929103B2 JP2017075093A JP2017075093A JP6929103B2 JP 6929103 B2 JP6929103 B2 JP 6929103B2 JP 2017075093 A JP2017075093 A JP 2017075093A JP 2017075093 A JP2017075093 A JP 2017075093A JP 6929103 B2 JP6929103 B2 JP 6929103B2
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- JP
- Japan
- Prior art keywords
- semiconductor laser
- optical module
- light
- optical
- carrier
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0267—Integrated focusing lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0261—Non-optical elements, e.g. laser driver components, heaters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
- H01S5/06226—Modulation at ultra-high frequencies
- H01S5/0623—Modulation at ultra-high frequencies using the beating between two closely spaced optical frequencies, i.e. heterodyne mixing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12107—Grating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12147—Coupler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1082—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region with a special facet structure, e.g. structured, non planar, oblique
- H01S5/1085—Oblique facets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
Description
Claims (5)
- 厚み方向の一方の面である第1面に偏って位置する活性層と、前記活性層から前記第1面に沿って出射する光を前記第1面とは反対の第2面へ向けて反射させる反射鏡と、がモノリシック集積されて、前記第2面から前記光を出射するよう構成された半導体レーザと、
厚み方向の一方の面である第3面に前記光が入射するように前記半導体レーザが搭載され、前記光を透過する材料から構成されて、前記第3面とは反対の第4面にレンズを一体的に有し、前記第3面及び前記第4面を有する本体部を含み、前記本体部にスペーサ部を一体的に有し、配線パターンを前記第3面に有するキャリアと、
前記第1面及び前記配線パターンを接続するワイヤと、
光導波路及び前記光導波路に前記光を導入するための光結合器が作り込まれた基板と、
を有することを特徴とする光モジュール。 - 請求項1に記載された光モジュールであって、
前記半導体レーザは、インジウムリン系化合物半導体を母材とし、
前記キャリアは、シリコンを母材とすることを特徴とする光モジュール。 - 請求項1又は2に記載された光モジュールであって、
前記半導体レーザは、前記光を集光させる機能を有しないことを特徴とする光モジュール。 - 請求項1から3のいずれか1項に記載された光モジュールであって、
前記光結合器は、グレーティングカプラであることを特徴とする光モジュール。 - 請求項1から4のいずれか1項に記載された光モジュールであって、
前記半導体レーザと前記キャリアは、はんだ、ろう材及び接着剤のいずれか1つによって接合されていることを特徴とする光モジュール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017075093A JP6929103B2 (ja) | 2017-04-05 | 2017-04-05 | 光モジュール |
US15/944,049 US10381799B2 (en) | 2017-04-05 | 2018-04-03 | Optical module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017075093A JP6929103B2 (ja) | 2017-04-05 | 2017-04-05 | 光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018181927A JP2018181927A (ja) | 2018-11-15 |
JP6929103B2 true JP6929103B2 (ja) | 2021-09-01 |
Family
ID=63711843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017075093A Active JP6929103B2 (ja) | 2017-04-05 | 2017-04-05 | 光モジュール |
Country Status (2)
Country | Link |
---|---|
US (1) | US10381799B2 (ja) |
JP (1) | JP6929103B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110178275B (zh) * | 2017-01-19 | 2021-01-22 | 三菱电机株式会社 | 半导体激光元件、半导体激光元件的制造方法 |
JP2020134638A (ja) * | 2019-02-15 | 2020-08-31 | パナソニックIpマネジメント株式会社 | 光モジュールの実装構造体 |
TWI782350B (zh) * | 2020-11-03 | 2022-11-01 | 國立中山大學 | 光模態轉換裝置及其製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6079786A (ja) * | 1983-10-06 | 1985-05-07 | Nec Corp | 双安定レ−ザ |
JP4634010B2 (ja) * | 2003-01-28 | 2011-02-16 | 株式会社日立製作所 | 半導体光素子 |
US6856717B2 (en) * | 2003-03-24 | 2005-02-15 | Hymite A/S | Package with a light emitting device |
JP4537758B2 (ja) * | 2003-11-11 | 2010-09-08 | 株式会社リコー | 光伝送素子モジュール |
CN101147088B (zh) * | 2005-02-16 | 2011-08-17 | 应用材料股份有限公司 | 光学耦合至ic芯片 |
JP4905252B2 (ja) * | 2007-05-23 | 2012-03-28 | 日立電線株式会社 | 光通信モジュール |
JP5085988B2 (ja) * | 2007-06-21 | 2012-11-28 | 株式会社日立製作所 | 光素子集積ヘッドの製造方法 |
JP2010003883A (ja) * | 2008-06-20 | 2010-01-07 | Opnext Japan Inc | 半導体レーザ素子、光モジュールおよび光トランシーバ |
US8168939B2 (en) | 2008-07-09 | 2012-05-01 | Luxtera, Inc. | Method and system for a light source assembly supporting direct coupling to an integrated circuit |
JP2010147315A (ja) * | 2008-12-19 | 2010-07-01 | Fuji Xerox Co Ltd | 光半導体装置、光伝送装置及び面発光素子 |
JP2011081071A (ja) * | 2009-10-05 | 2011-04-21 | Hitachi Cable Ltd | 光モジュール |
EP2506370B1 (en) * | 2011-03-30 | 2015-10-28 | Huawei Technologies Co., Ltd. | A submount arrangement for VCSELs |
JP6200642B2 (ja) | 2012-11-30 | 2017-09-20 | 日本オクラロ株式会社 | 光学装置 |
EP2746828B1 (en) * | 2012-12-19 | 2019-08-21 | Huawei Technologies Co., Ltd. | Optical interposer |
CN107111060A (zh) * | 2014-07-14 | 2017-08-29 | 拜奥德光电公司 | 与光耦合元件的3d光子集成 |
AU2016298390B2 (en) * | 2015-07-30 | 2021-09-02 | Optipulse Inc. | Rigid high power and high speed lasing grid structures |
JP6739154B2 (ja) * | 2015-08-21 | 2020-08-12 | 日本ルメンタム株式会社 | 光モジュール |
-
2017
- 2017-04-05 JP JP2017075093A patent/JP6929103B2/ja active Active
-
2018
- 2018-04-03 US US15/944,049 patent/US10381799B2/en active Active
Also Published As
Publication number | Publication date |
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US10381799B2 (en) | 2019-08-13 |
JP2018181927A (ja) | 2018-11-15 |
US20180294620A1 (en) | 2018-10-11 |
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