JP6923374B2 - Method for manufacturing plate-shaped carrier, polishing device and polishing body - Google Patents

Method for manufacturing plate-shaped carrier, polishing device and polishing body Download PDF

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JP6923374B2
JP6923374B2 JP2017127495A JP2017127495A JP6923374B2 JP 6923374 B2 JP6923374 B2 JP 6923374B2 JP 2017127495 A JP2017127495 A JP 2017127495A JP 2017127495 A JP2017127495 A JP 2017127495A JP 6923374 B2 JP6923374 B2 JP 6923374B2
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polished
plate
outer peripheral
shaped carrier
central axis
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JP2019010688A (en
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圭一 及川
圭一 及川
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Kyocera Corp
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Description

本開示は、中心軸に沿って等距離の外周面を有する被研磨体を研磨するための板状キャリア、研磨装置および中心軸に沿って等距離の外周面を有する研磨体の製造方法に関する。 The present disclosure relates to a plate-shaped carrier for polishing an object to be polished having an equidistant outer peripheral surface along the central axis, a polishing device, and a method for manufacturing a polished object having an equidistant outer peripheral surface along the central axis.

プランジャなど、中心軸に沿って等距離の外周面を有する被研磨体の外周面の研磨方法として、研磨面を構成する一対の定盤の間に、矩形状の開口部を有する保持孔を放射状に設け、自転と公転を付与されるキャリアを配置し、保持孔に被研磨体の曲面が上下定盤に当接するように配置し、被研磨体をその曲面の周方向に回転させ、被研磨体の中心軸が定盤主面に沿うようにしながら被研磨体を自由移動させて、被研磨体の曲面を研磨する研磨方法が開示されている（特許文献１）。 As a method of polishing the outer peripheral surface of an object to be polished having an outer peripheral surface equal distance along the central axis such as a plunger, a holding hole having a rectangular opening is radially provided between a pair of plate plates constituting the polished surface. A carrier that is provided to rotate and revolve is placed in the holding hole so that the curved surface of the object to be polished abuts on the upper and lower platens, and the object to be polished is rotated in the circumferential direction of the curved surface to be polished. A polishing method is disclosed in which the object to be polished is freely moved so that the central axis of the body is along the main surface of the platen to polish the curved surface of the object to be polished (Patent Document 1).

図９に、従来のキャリア３０の概略図を示す。キャリア３０の保持孔（収納部）３１は、上面視したとき、矩形状となっている。そして、被研磨体３２の外周面と対面する保持孔３１の壁面３１ａは、被研磨体３２の中心軸方向と平行となっており、被研磨体３２の全長にわたって、被研磨体３２と壁面３１ａとが接触している。 FIG. 9 shows a schematic view of the conventional carrier 30. The holding hole (storage portion) 31 of the carrier 30 has a rectangular shape when viewed from above. The wall surface 31a of the holding hole 31 facing the outer peripheral surface of the object to be polished 32 is parallel to the central axis direction of the object to be polished 32, and the object to be polished 32 and the wall surface 31a are covered over the entire length of the object to be polished 32. Are in contact with.

特開２０１１−１６１５５９号公報Japanese Unexamined Patent Publication No. 2011-161559

従来のキャリア３０で、例えば、板状の基板を研磨する場合、基板の主面の表面粗さを所定の範囲とすればよく、側面の表面粗さは問題とならなかった。 When polishing a plate-shaped substrate with the conventional carrier 30, for example, the surface roughness of the main surface of the substrate may be within a predetermined range, and the surface roughness of the side surface does not matter.

しかしながら、上述の研磨方法で、中心軸に沿って等距離の外周面を有する被研磨体３２を研磨すると、被研磨体３２の周方向に回転する被研磨体３２と、キャリア３０との間に異物が入り込んだ場合、その異物が回転する被研磨体３２と接触して被研磨体３２の外周面に周方向にキズが発生するという問題があった。 However, when the object to be polished 32 having the outer peripheral surfaces at equal distances along the central axis is polished by the above-mentioned polishing method, between the object to be polished 32 rotating in the circumferential direction of the object to be polished 32 and the carrier 30. When foreign matter enters, there is a problem that the foreign matter comes into contact with the rotating body 32 to be polished and scratches are generated on the outer peripheral surface of the body 32 to be polished in the circumferential direction.

本開示の板状キャリア、研磨装置および研磨体の製造方法は、例えば、円筒状、円柱状の研磨体を作製するためのものであり、研磨体の外周面にキズが発生するのを抑制することを目的とする。 The plate-shaped carrier, the polishing apparatus, and the method for manufacturing the polished body of the present disclosure are for producing, for example, a cylindrical or columnar polished body, and suppress the occurrence of scratches on the outer peripheral surface of the polished body. The purpose is.

本開示の板状キャリアは、上面および下面を有する板状であり、中心軸に沿って等距離の外周面を有する円柱状または円筒状の被研磨体を前記中心軸が前記下面と平行となるように配置することによって、前記被研磨体を前記被研磨体の前記中心軸を中心に回転可能に収納する、前記上面から前記下面に貫通する収納部を有し、前記収納部は、前記中心軸を挟んで両側からそれぞれ前記外周面と対面する第１側面および第２側面と、前記被研磨体の両端面にそれぞれ対面する第３側面および第４側面とを有し、前記第１側面は、上面視において前記外周面を少なくとも２つの支持部で支持する支持壁面と、前記支持部の間に配置された、前記上面から前記下面にかけて前記外周面と接触しない第１凹部とを有する。
The plate-shaped carrier of the present disclosure is a plate-like body having an upper surface and a lower surface, and has a columnar or cylindrical object to be polished having an outer peripheral surface at equal distances along a central axis , and the central axis is parallel to the lower surface. By arranging in such a manner, the storage portion penetrating from the upper surface to the lower surface is provided so as to rotatably store the object to be polished about the central axis of the object to be polished, and the storage portion is the center. It has a first side surface and a second side surface facing the outer peripheral surface from both sides of the shaft, and a third side surface and a fourth side surface facing both end surfaces of the object to be polished, respectively. It has a support wall surface that supports the outer peripheral surface with at least two support portions in a top view, and a first recess that is arranged between the support portions and does not come into contact with the outer peripheral surface from the upper surface to the lower surface.

本開示の研磨装置は、前記板状キャリアと、中心軸に沿って等距離の外周面を有する円柱状または円筒状の被研磨体を研磨する定盤と、を備え、前記定盤と、前記定盤の上に配置された前記板状キャリアとが相対的に移動することによって、前記被研磨体の前記外周面を研磨する。
The polishing apparatus of the present disclosure includes the plate-shaped carrier and a surface plate for polishing a columnar or cylindrical object to be polished having an outer peripheral surface at equal distances along a central axis. The outer peripheral surface of the object to be polished is polished by the relative movement of the plate-shaped carrier arranged on the surface plate.

本開示の研磨体の製造方法は、前記研磨装置の前記収納部に前記被研磨体を収納する工程と、前記定盤と前記キャリアとを相対的に移動させ、前記定盤で前記被研磨体の前記外周面を研磨する工程とを、有する。 A method of making an abrasive article of the present disclosure, the a step of housing the polished body in the housing portion, by relatively moving said said plate carrier, wherein the polished body at said surface plate of said polishing device It has a step of polishing the outer peripheral surface of the above.

本開示の板状キャリア、研磨装置によれば、中心軸に沿って等距離の外周面を有する被研磨体の外周面の研磨において、キズの発生を抑制することができる。また、本開示の研磨体の製造方法によれば、外周面にキズがない研磨体を製造することができる。 According to the plate-shaped carrier and the polishing apparatus of the present disclosure, it is possible to suppress the occurrence of scratches in polishing the outer peripheral surface of the object to be polished having the outer peripheral surfaces equidistant along the central axis. Further, according to the method for producing a polished body of the present disclosure, it is possible to manufacture a polished body having no scratches on the outer peripheral surface.

本実施形態に係る被研磨体の概略図である。It is the schematic of the object to be polished which concerns on this embodiment. 本実施形態に係る板状キャリアおよび研磨装置の概略図である。It is the schematic of the plate-shaped carrier and the polishing apparatus which concerns on this embodiment. 他の実施形態に係る板状キャリアの要部拡大図である。It is an enlarged view of the main part of the plate-shaped carrier which concerns on other embodiments. 他の実施形態に係る板状キャリアの要部拡大図である。It is an enlarged view of the main part of the plate-shaped carrier which concerns on other embodiments. 他の実施形態に係る板状キャリアの概略図である。It is the schematic of the plate-shaped carrier which concerns on other embodiment. 他の実施形態に係る板状キャリアの概略図である。It is the schematic of the plate-shaped carrier which concerns on other embodiment. 他の実施形態に係る板状キャリアの概略図である。It is the schematic of the plate-shaped carrier which concerns on other embodiment. 他の実施形態に係る研磨装置の概略図である。It is the schematic of the polishing apparatus which concerns on other embodiment. 従来のキャリアの概略図である。It is a schematic diagram of a conventional carrier.

本開示の板状キャリア、研磨装置および研磨体の製造方法について、図を参照しながら説明する。なお、板状キャリアは、キャリアともいう。 The plate-shaped carrier, the polishing apparatus, and the method for manufacturing the polished body of the present disclosure will be described with reference to the drawings. The plate-shaped carrier is also referred to as a carrier.

図１は、被研磨体１の概略図である。本開示において研磨対象となる被研磨体１は、図中Ａ−Ａ’で示す中心軸２に沿って等距離の外周面３を有する。被研磨体１は、円柱状であっても、円筒状であっても、内部に貫通孔や非貫通孔を有していても、外周面３に溝を有していてもよい。この被研磨体１が研磨されて研磨体となる。 FIG. 1 is a schematic view of the object to be polished 1. The object to be polished 1 in the present disclosure has an outer peripheral surface 3 equidistant along the central axis 2 indicated by AA'in the figure. The body 1 to be polished may be cylindrical, cylindrical, may have through holes or non-through holes inside, or may have grooves on the outer peripheral surface 3. The object to be polished 1 is polished to become an abrasive body.

図２は、本開示の研磨装置の概略図である。図２（ａ）はその側面図、図２（ｂ）はその上面図である。図２（ａ）に示すように、定盤５の上にキャリア７が配置されており、図２（ｂ）に示すように、キャリア７には、キャリア７を上下に貫通する貫通孔からなる収納部９が設けられている。そして、この収納部９は、被研磨体１を、中心軸２を中心に回転可能に収納する。 FIG. 2 is a schematic view of the polishing apparatus of the present disclosure. FIG. 2A is a side view thereof, and FIG. 2B is a top view thereof. As shown in FIG. 2 (a), the carrier 7 is arranged on the surface plate 5, and as shown in FIG. 2 (b), the carrier 7 includes through holes that penetrate the carrier 7 vertically. A storage unit 9 is provided. Then, the storage portion 9 rotatably stores the object to be polished 1 about the central axis 2.

収納部９は、被研磨体１を収納するために被研磨体１よりも大きく、収納部９の中で被研磨体１が中心軸２を中心に回転するように、被研磨体１の中心軸２を所定の範囲で維持可能な形状となっている。 The storage portion 9 is larger than the object to be polished 1 for accommodating the body 1 to be polished, and the center of the body 1 to be polished is such that the body 1 to be polished rotates about the central axis 2 in the storage portion 9. The shaft 2 has a shape that can be maintained within a predetermined range.

図２の例では、定盤５、キャリア７はともに円板状である。そして、例えば、キャリア７を回転させると、定盤５とキャリア７が相対的に移動することによって収納部９に収納された被研磨体１を定盤５で研磨することができる。キャリア７と定盤５とは、少なくともいずれか一方が、回転すればよい。 In the example of FIG. 2, the surface plate 5 and the carrier 7 are both disk-shaped. Then, for example, when the carrier 7 is rotated, the surface plate 5 and the carrier 7 move relative to each other, so that the object to be polished 1 stored in the storage portion 9 can be polished by the surface plate 5. At least one of the carrier 7 and the surface plate 5 may rotate.

図３は、キャリア７の収納部９に収納された被研磨体１を示す要部拡大図である。図中の矢印は、キャリア７と被研磨体１の進行方向である。相対的な移動を考えると定盤５は、矢印とは逆の方向に進むことになる。 FIG. 3 is an enlarged view of a main part showing the object to be polished 1 housed in the storage part 9 of the carrier 7. The arrows in the figure are the traveling directions of the carrier 7 and the object to be polished 1. Considering the relative movement, the surface plate 5 advances in the direction opposite to the arrow.

定盤５とキャリア７とが相対的に移動することによって、被研磨体１が中心軸２を中心に回転し、定盤５が被研磨体１の外周面３を研磨する。 As the surface plate 5 and the carrier 7 move relative to each other, the object to be polished 1 rotates about the central axis 2, and the surface plate 5 polishes the outer peripheral surface 3 of the object to be polished 1.

図３において、キャリア７が矢印の方向（左）に進むと、被研磨体１は収納部９の右側に押しつけられる。図３における被研磨体１の右側には、被研磨体１の外周面３と対面し、被研磨体１の外周面３を２つの支持部１５で支持する支持壁面１３が配置されている。 In FIG. 3, when the carrier 7 advances in the direction of the arrow (left), the object to be polished 1 is pressed to the right side of the storage portion 9. On the right side of the object to be polished 1 in FIG. 3, a support wall surface 13 that faces the outer peripheral surface 3 of the object to be polished 1 and supports the outer peripheral surface 3 of the object to be polished 1 by two support portions 15 is arranged.

この支持壁面１３は、上面視において、２つの支持部１５の間に、外周面３と接触しない凹部１７を有している。 The support wall surface 13 has a recess 17 between the two support portions 15 that does not come into contact with the outer peripheral surface 3 in the top view.

研磨時には被研磨体１の外周面３は、収納部９の支持壁面１３の支持部１５に接触しながら回転する。 At the time of polishing, the outer peripheral surface 3 of the object to be polished 1 rotates while being in contact with the support portion 15 of the support wall surface 13 of the storage portion 9.

図９に示す、従来のキャリア３０には、凹部１７がなく、被研磨体３２の外周面は広範囲で収納部３１の壁面３１ａと接触し、被研磨体３２と、収納部３１の壁面３１ａとの間に異物が入り込んだ場合、その異物が回転する被研磨体３２と接触し続けて外周面に周方向のキズが発生していた。 The conventional carrier 30 shown in FIG. 9 has no recess 17, and the outer peripheral surface of the object to be polished 32 comes into contact with the wall surface 31a of the storage portion 31 over a wide area, and the object to be polished 32 and the wall surface 31a of the storage portion 31 When foreign matter entered between the two, the foreign matter continued to come into contact with the rotating object 32 to be polished, and scratches were generated on the outer peripheral surface in the circumferential direction.

このようなキズを発生させる異物として、例えば、前工程で被研磨体１に付着していた異物、装置由来の異物、研摩中に発生する研磨屑、研磨砥粒に含まれる不純物が挙げられる。これら異物は、直径０．１ｍｍ以下のものが多い。 Examples of the foreign matter that causes such scratches include foreign matter adhering to the object to be polished 1 in the previous step, foreign matter derived from the apparatus, polishing debris generated during polishing, and impurities contained in the abrasive grains. Most of these foreign substances have a diameter of 0.1 mm or less.

収納部９に凹部１７を有する本開示の研磨装置によれば、被研磨体１と、収納部９の支持壁面１３との間に入り込んだ異物は、定盤５とキャリア７とが相対的に移動することに伴って、収納部９の凹部１７に移動するため、被研磨体１の外周面３との接触が起こりにくく、キズの発生を低減できる。 According to the polishing apparatus of the present disclosure having the recess 17 in the storage portion 9, foreign matter that has entered between the object to be polished 1 and the support wall surface 13 of the storage portion 9 is relatively formed between the surface plate 5 and the carrier 7. As it moves, it moves to the recess 17 of the storage portion 9, so that contact with the outer peripheral surface 3 of the object to be polished 1 is unlikely to occur, and the occurrence of scratches can be reduced.

支持部１５は、被研磨体１と点接触していてもよい。このような構造であると、被研磨体１の外周面３と支持部１５との接触面積を減らすことができ、被研磨体１の外周に異物に起因するキズが付くことを抑制することができる。 The support portion 15 may be in point contact with the object to be polished 1. With such a structure, the contact area between the outer peripheral surface 3 of the object to be polished 1 and the support portion 15 can be reduced, and scratches due to foreign matter can be suppressed on the outer periphery of the object to be polished 1. can.

図３に示すように、支持部１５が支持壁面１３に凸状に形成されていてもよく、図４に示すように、被研磨体１の中心軸２方向における両端部に支持部１５を有してもよい。このような構成であると、外周面３とキャリア７との接触面積が最小になるので好適である。 As shown in FIG. 3, the support portion 15 may be formed in a convex shape on the support wall surface 13, and as shown in FIG. 4, the support portions 15 are provided at both ends of the object 1 to be polished in the two directions of the central axis. You may. Such a configuration is suitable because the contact area between the outer peripheral surface 3 and the carrier 7 is minimized.

また、収納部９が、被研磨体１の中心軸２方向における中央部に対向する位置に凹部１７を有していてもよい。このような構成であると、異物が排出されやすい。 Further, the accommodating portion 9 may have a recess 17 at a position facing the central portion of the object to be polished 1 in the two directions of the central axis. With such a configuration, foreign matter is likely to be discharged.

また、収納部９は、複数の凹部１７を有していてもよい。例えば、収納部９が、３つの支持部１５を有し、支持部１５の間に２つの凹部１７を有する構造であると、２つの支持部を有する場合に比べ、一つあたりの支持部１５かかる力が減少するため、支持部１５が摩耗しにくくなり、キャリア７に起因する異物の発生を抑制できる。 Further, the storage portion 9 may have a plurality of recesses 17. For example, if the storage portion 9 has a structure having three support portions 15 and two recesses 17 between the support portions 15, the support portion 15 per support portion 15 is compared with the case where the storage portion 9 has two support portions. Since the force is reduced, the support portion 15 is less likely to be worn, and the generation of foreign matter caused by the carrier 7 can be suppressed.

また、被研磨体１の中心軸２を挟んで対向する二つの支持壁面１３のそれぞれに、凹部１７を有していてもよい。このような構成であると、被研磨体１が収納部９のいずれの支持壁面１３に接触した場合でもキズの発生を低減することができる。 Further, recesses 17 may be provided in each of the two support wall surfaces 13 facing each other with the central shaft 2 of the object to be polished 1 interposed therebetween. With such a configuration, it is possible to reduce the occurrence of scratches even when the object to be polished 1 comes into contact with any of the support wall surfaces 13 of the storage portion 9.

また、凹部１７は、中心軸２を挟んで対向する位置に有していてもよい。このような構
成であると、被研磨体１がいずれの支持壁面１３に接触したときでも同様な効果が得られるのでよい。従って、研磨の途中で、キャリア７の回転方向が変わったり、キャリア７と定盤５との相対的移動方向が変わった場合でも被研磨体１の外周３にキズが発生することを抑制できる。 Further, the recess 17 may be provided at a position facing each other with the central shaft 2 interposed therebetween. With such a configuration, the same effect can be obtained even when the object to be polished 1 comes into contact with any of the support wall surfaces 13. Therefore, even if the rotation direction of the carrier 7 changes or the relative movement direction of the carrier 7 and the surface plate 5 changes during polishing, it is possible to prevent scratches on the outer periphery 3 of the object to be polished 1.

また、２つの前記支持部１５を結んだ直線と、凹部１７の最深部１７ａとの距離のうち最も短い距離Ｌを０．１５ｍｍ以上としてもよい。経験的に異物の大きさは、０．１ｍｍ未満であることが多く、このような構成とすると、外周面３にキズが発生しにくい。 Further, the shortest distance L between the straight line connecting the two support portions 15 and the deepest portion 17a of the recess 17 may be 0.15 mm or more. Empirically, the size of the foreign matter is often less than 0.1 mm, and with such a configuration, scratches are unlikely to occur on the outer peripheral surface 3.

キャリア７における収納部９の配置は、図５、６に示すように種々の形態であってもよい。 The arrangement of the storage portion 9 in the carrier 7 may be in various forms as shown in FIGS. 5 and 6.

例えば、図５の例では、複数の収納部９がキャリア７の中心（キャリア７の自転中心でもある）に対して放射状に、すなわち被研磨体１の中心軸２とキャリア７の径方向とのなす角がおおよそ０°となるように配置されている。また、図６の例では、被研磨体１の中心軸２とキャリア７の径方向とのなす角が約１５°となるように複数の収納部９が配置されている。 For example, in the example of FIG. 5, a plurality of storage portions 9 are radially relative to the center of the carrier 7 (which is also the rotation center of the carrier 7), that is, the central axis 2 of the object to be polished 1 and the radial direction of the carrier 7. It is arranged so that the angle between them is approximately 0 °. Further, in the example of FIG. 6, a plurality of storage portions 9 are arranged so that the angle formed by the central axis 2 of the object to be polished 1 and the radial direction of the carrier 7 is about 15 °.

キャリア７の径方向と中心軸２のなす角度とのなす角は、３０°以内となるように配置されていてもよい。キャリア７の径方向と中心軸２のなす角度が大きくなると、面粗さ、円筒度などの加工精度を高くしやすくなる。 The angle formed by the radial direction of the carrier 7 and the angle formed by the central axis 2 may be arranged so as to be within 30 °. When the angle formed by the radial direction of the carrier 7 and the central axis 2 becomes large, it becomes easy to improve the processing accuracy such as surface roughness and cylindricity.

また、複数の収納部９が、同心円上に等間隔で配置されていてもよい。このような構成であると、研磨対象となる複数の被研磨体１に均一に負荷がかかるので、研磨量を均一化しやすくなる。 Further, a plurality of storage portions 9 may be arranged on concentric circles at equal intervals. With such a configuration, a load is uniformly applied to the plurality of objects to be polished 1, so that the amount of polishing can be easily made uniform.

収納部９の形状は、図５、図６のように多角形状であってもよいし、図７のように楕円形などであってもよく、支持壁面１３が曲線であってもよい。ただし、収納部９の形状が、円など、被研磨体１の中心軸２を収納部９内で維持することが難しい形状は不適である。 The shape of the storage portion 9 may be a polygonal shape as shown in FIGS. 5 and 6, an elliptical shape as shown in FIG. 7, and a curved support wall surface 13. However, a shape such as a circle in which it is difficult to maintain the central axis 2 of the object to be polished 1 in the storage portion 9 is unsuitable.

例えば、図６に示すキャリア７を用いて直径２ｍｍ、長さ１７ｍｍの被研磨体１を研磨する場合、キャリア７の厚みを１．５ｍｍとし、収納部９の、被研磨体１の中心軸２方向の長さ（以下、長さという）を１９ｍｍ、対向する支持壁面１３の間隔（以下、幅という）を中央部で３．５ｍｍ、両端部で２．５ｍｍとするとよい。 For example, when polishing the object to be polished 1 having a diameter of 2 mm and a length of 17 mm using the carrier 7 shown in FIG. 6, the thickness of the carrier 7 is set to 1.5 mm, and the central axis 2 of the object to be polished 1 of the storage portion 9 is set. The length in the direction (hereinafter referred to as length) may be 19 mm, the distance between the opposing support wall surfaces 13 (hereinafter referred to as width) may be 3.5 mm at the central portion and 2.5 mm at both ends.

この収納部９を上面視した形状は、例えば、図４〜６に示すような６角形状であり、支持壁面１３の長さ方向における中央に凹部１７を有するものである。 The shape of the storage portion 9 viewed from above is, for example, a hexagonal shape as shown in FIGS. 4 to 6 and has a recess 17 at the center in the length direction of the support wall surface 13.

この場合、外周面３に対する凹部１７の深さ、つまり、２つの支持部１５を結んだ直線と、凹部１７の最深部との最短距離は、約０．４５ｍｍである。この例で示すように最短距離は、０．１５ｍｍ以上としてもよい。このような構成であれば、直径０．１ｍｍの異物であっても被研磨体１と異物が接触することを抑制でき、容易に排出できる。 In this case, the depth of the recess 17 with respect to the outer peripheral surface 3, that is, the shortest distance between the straight line connecting the two support portions 15 and the deepest portion of the recess 17 is about 0.45 mm. As shown in this example, the shortest distance may be 0.15 mm or more. With such a configuration, even a foreign substance having a diameter of 0.1 mm can be prevented from coming into contact with the object to be polished 1 and can be easily discharged.

また、本開示の他の形態の研磨装置は、図８に示すように、定盤５として、キャリア７を挟んで対向する上定盤（不図示）と下定盤５ｂとを備え、キャリア７を自公転させるためのサンギア１９とインターナルギア２１とを備えている。研磨時は上定盤と下定盤５ｂとを逆方向に回転させながら、上定盤と下定盤５ｂとの間に研磨砥粒を含むスラリーを供給するとよい。 Further, as shown in FIG. 8, another form of the polishing apparatus of the present disclosure includes an upper surface plate (not shown) and a lower surface plate 5b that face each other with the carrier 7 in between as the surface plate 5, and the carrier 7 is provided. It is equipped with a sun gear 19 and an internal gear 21 for self-revolving. At the time of polishing, it is preferable to supply a slurry containing polishing abrasive grains between the upper surface plate and the lower surface plate 5b while rotating the upper surface plate and the lower surface plate 5b in opposite directions.

キャリア７は円板状で、外周に歯車を有している。その歯車はサンギア１９、インターナルギア２１と歯号している。キャリア７は、サンギア１９とインターナルギア２１の回転に伴い、上定盤と下定盤５ｂとの間で自公転する。なお、図５〜７のキャリア７も、外周に歯車を有する形態で例示している。 The carrier 7 has a disk shape and has gears on the outer circumference. The gears are toothed as Sun Gear 19 and Internal Gear 21. The carrier 7 revolves between the upper surface plate and the lower surface plate 5b as the sun gear 19 and the internal gear 21 rotate. The carrier 7 in FIGS. 5 to 7 is also illustrated in a form having a gear on the outer circumference.

被研磨体１の中心軸２を中心とする回転は、キャリア７と定盤５とが相対的に移動することによって生じる。被研磨体１の中心軸２を中心にする回転は、例えば、キャリア７が定盤５に対して公転および自転することや定盤５が自転することで生じる。 The rotation of the body 1 to be polished about the central axis 2 is caused by the relative movement of the carrier 7 and the surface plate 5. The rotation of the body 1 to be polished about the central axis 2 occurs, for example, when the carrier 7 revolves and rotates with respect to the surface plate 5 or when the surface plate 5 rotates.

キャリア７の径方向と被研磨体１の中心軸２のなす角度が小さく、被研磨体１の回転方向とキャリアの自転方向が近いほど、キャリア７の自転による被研磨体１の回転数が多くなる。前述したように、キャリア７の径方向と中心軸２のなす角度が大きくなると、面粗さ、円筒度などの加工精度を高くしやすくなる。 The smaller the angle between the radial direction of the carrier 7 and the central axis 2 of the object to be polished 1 and the closer the rotation direction of the object to be polished 1 to the rotation direction of the carrier, the higher the number of rotations of the object to be polished 1 due to the rotation of the carrier 7. Become. As described above, when the angle formed by the radial direction of the carrier 7 and the central axis 2 becomes large, it becomes easy to improve the processing accuracy such as surface roughness and cylindricity.

キャリア７が定盤５に対して、自転および公転する場合には、定盤５と被研磨体１の中心軸２とがなす角度は、研磨の際に変化する。その結果、研磨レートを大きくしながら、加工精度も高くしやすくなる。 When the carrier 7 rotates and revolves with respect to the surface plate 5, the angle formed by the surface plate 5 and the central axis 2 of the object to be polished 1 changes during polishing. As a result, it becomes easy to increase the processing accuracy while increasing the polishing rate.

定盤５の材質は、例えば、銅、錫、鋳鉄などの金属であってもよい。定盤５の表面には研磨スラリーの供給、排出のための溝を有していてもよい。定盤５が、その主面に収納部９と接続する溝を有していると、溝を通して異物を排出できるとともに、研磨砥粒を供給、排出することができる。特に、下定盤５ｂに溝が形成されていると、異物を効率的に排出することができる。また、定盤５の溝が凹部１７または、キャリア７の溝と接続するように配置すると、異物を効率的に排出することができる。 The material of the surface plate 5 may be, for example, a metal such as copper, tin, or cast iron. The surface of the surface plate 5 may have grooves for supplying and discharging the polishing slurry. When the surface plate 5 has a groove connected to the storage portion 9 on its main surface, foreign matter can be discharged through the groove, and polishing abrasive grains can be supplied and discharged. In particular, when the lower platen 5b is formed with a groove, foreign matter can be efficiently discharged. Further, if the groove of the surface plate 5 is arranged so as to be connected to the groove of the recess 17 or the carrier 7, foreign matter can be efficiently discharged.

キャリア７の材質は、例えば塩化ビニル樹脂などの樹脂、エポキシガラスなどのガラス、ＳＵＳなどの金属である。キャリア７の厚みは被研磨体１の直径よりも小さい。また、キャリア７は、その主面に、収納部９と接続する溝を有していてもよい。このような構造であると、溝を通して異物を排出できるとともに、研磨砥粒を供給、排出することができる。特に、キャリア７の下面側、すなわち定盤５と対向する主面に溝を形成されていると、異物を効率的に排出できる。また、溝が凹部１７と接続していると、異物を効率的に排出できる。 The material of the carrier 7 is, for example, a resin such as vinyl chloride resin, glass such as epoxy glass, or a metal such as SUS. The thickness of the carrier 7 is smaller than the diameter of the object to be polished 1. Further, the carrier 7 may have a groove connected to the storage portion 9 on its main surface. With such a structure, foreign matter can be discharged through the groove, and polishing abrasive grains can be supplied and discharged. In particular, if a groove is formed on the lower surface side of the carrier 7, that is, on the main surface facing the surface plate 5, foreign matter can be efficiently discharged. Further, when the groove is connected to the recess 17, foreign matter can be efficiently discharged.

以上説明した、本開示の研磨装置を用いた研磨体の製造方法について説明する。 The method for manufacturing a polished body using the polishing apparatus of the present disclosure described above will be described.

まず、中心軸２に沿って等距離の外周面３を有する被研磨体１を準備する。この被研磨体１は、円柱、円筒状のものであり、予め、粗研磨したものであってもよい。 First, an object to be polished 1 having an outer peripheral surface 3 equidistant along the central axis 2 is prepared. The object to be polished 1 has a cylindrical shape or a cylindrical shape, and may be rough-polished in advance.

次に、この被研磨体１を、定盤５上に配置されたキャリア７の収納部９に収納する。キャリア７は、被研磨体１を被研磨体１の中心軸２を中心に回転可能に収納する収納部９を有している。また、収納部９は、被研磨体１の外周面３と対面し、上面視において外周面３を少なくとも２つの支持部１５で支持する支持壁面１３と、支持部１５の間に配置された外周面３と接触しない凹部１７とを有している。 Next, the object to be polished 1 is stored in the storage portion 9 of the carrier 7 arranged on the surface plate 5. The carrier 7 has a storage portion 9 that rotatably stores the object to be polished 1 about the central axis 2 of the object to be polished 1. Further, the storage portion 9 faces the outer peripheral surface 3 of the object to be polished 1, and the outer peripheral surface 3 is arranged between the support wall surface 13 and the support portion 15 in which the outer peripheral surface 3 is supported by at least two support portions 15 in the top view. It has a recess 17 that does not come into contact with the surface 3.

そして、定盤５とキャリア７とを相対的に移動させ、被研磨体１を回転させながら、定盤５で被研磨体１の外周面３を研磨して、研磨体を製造する。 Then, the surface plate 5 and the carrier 7 are relatively moved, and the outer peripheral surface 3 of the object to be polished 1 is polished by the surface plate 5 while rotating the object 1 to be polished to manufacture the object to be polished.

このような工程を有する研磨体の製造方法によれば、研磨体の外周面にキズが発生することを抑制することができる。 According to the method for manufacturing a polished body having such a step, it is possible to suppress the occurrence of scratches on the outer peripheral surface of the polished body.

なお、本開示の研磨体の製造方法においては、本開示の研磨装置を用いるとよく、上述の種々のキャリアや定盤を用いることができる。 In the method for producing a polished body of the present disclosure, it is preferable to use the polishing apparatus of the present disclosure, and the various carriers and surface plates described above can be used.

以上説明したとおり、本開示の研磨装置および研磨体の製造方法は、キズの発生を抑制することができるものである。被研磨体１としては、例えば、セラミック焼結体が挙げられる。また、キズがあると目立ってしまう透明な単結晶に用いるとよい。特に、透明で機械的、光学的特性に優れたサファイアの製造に用いるとよい。 As described above, the polishing apparatus and the method for manufacturing a polished body of the present disclosure can suppress the occurrence of scratches. Examples of the object to be polished 1 include a ceramic sintered body. In addition, it is recommended to use it for a transparent single crystal that becomes conspicuous if it has scratches. In particular, it is preferable to use it for producing sapphire which is transparent and has excellent mechanical and optical properties.

本発明は前述した実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更、改良、組合せ等が可能である。例えば、研磨装置はキャリア７を保持し回転させながら加圧するプレッシャープレートを備えた、片面研磨装置であってもよい。また、研磨装置は機械的な研磨と化学的な研磨を同時に行う研磨装置であってもよい。また、定盤５上に研磨パッドを配置してもよい。 The present invention is not limited to the above-described embodiment, and various modifications, improvements, combinations, and the like can be made without departing from the gist of the present invention. For example, the polishing device may be a single-sided polishing device provided with a pressure plate that holds the carrier 7 and pressurizes it while rotating it. Further, the polishing device may be a polishing device that simultaneously performs mechanical polishing and chemical polishing. Further, the polishing pad may be arranged on the surface plate 5.

まず、中心軸に沿って等距離の外周面を有する単結晶体であるサファイア製の被研磨体を２００個準備した。被研磨体は、直径２ｍｍ、長さ１７ｍｍの円柱状である。 First, 200 sapphire objects to be polished, which are single crystals having outer peripheral surfaces equidistant along the central axis, were prepared. The object to be polished is a columnar body having a diameter of 2 mm and a length of 17 mm.

実施例として、図５に示す形態のキャリアと、比較例として図９に示す形態のキャリアとを準備した。それぞれのキャリアには被研磨体を被研磨体の中心軸を中心に回転可能に収納する収納部が設けられている。 As an example, a carrier of the form shown in FIG. 5 and a carrier of the form shown in FIG. 9 as a comparative example were prepared. Each carrier is provided with a storage portion for rotatably storing the object to be polished around the central axis of the object to be polished.

そして、実施例のキャリアの収納部に被研磨体を収納し、比較例のキャリアの収納部に被研磨体を収納した。そして、定盤とキャリアとを相対的に移動させ、定盤で被研磨体の外周面を研磨した。 Then, the object to be polished was stored in the storage portion of the carrier of the example, and the object to be polished was stored in the storage portion of the carrier of the comparative example. Then, the surface plate and the carrier were relatively moved, and the outer peripheral surface of the object to be polished was polished by the surface plate.

なお、定盤は銅製であり、キャリアは厚みが１．５ｍｍの塩化ビニル製である。また、研磨には粒径１μｍのダイヤモンド砥粒を含有するスラリーを用いた。 The surface plate is made of copper, and the carrier is made of vinyl chloride having a thickness of 1.5 mm. Further, a slurry containing diamond abrasive grains having a particle size of 1 μm was used for polishing.

実施例における、収納部の長さは１９ｍｍ、幅は中央部で３．５ｍｍ、両端部で２．５ｍｍであり、凹部を有する６角形状のものである。一方、比較例における収納部の長さは１９ｍｍ、幅は２．５ｍｍであり、凹部を有していない。 In the embodiment, the storage portion has a length of 19 mm, a width of 3.5 mm at the center portion, and 2.5 mm at both ends, and is a hexagonal shape having recesses. On the other hand, the storage portion in the comparative example has a length of 19 mm and a width of 2.5 mm, and does not have a recess.

それぞれの試験における外周面のキズ不良の発生率は、実施例の場合が０％、比較例の場合が５％であった。 The incidence of scratch defects on the outer peripheral surface in each test was 0% in the case of the example and 5% in the case of the comparative example.

１ ：被研磨体
２（Ａ−Ａ’）：中心軸
３ ：外周面
５ ：定盤
５ｂ：下定盤
７ ：キャリア
９ ：収納部
１３：支持壁面
１５：支持部
１７：凹部
１９：サンギア
２１：インターナルギア 1: Body to be polished 2 (AA'): Central axis 3: Outer peripheral surface 5: Surface plate 5b: Lower surface plate 7: Carrier 9: Storage part 13: Support wall surface 15: Support part 17: Recess 19: Sun gear 21: Internal gear

Claims (14)

被研磨体の外周面を研磨するための板状キャリアであって、
上面および下面を有する板状であり、
中心軸に沿って等距離の外周面を有する円柱状または円筒状の被研磨体を前記中心軸が前記下面と平行となるように配置することによって、前記被研磨体を前記中心軸を中心に回転可能に収納する、前記上面から前記下面に貫通する収納部を有し、
前記収納部は、前記中心軸を挟んで両側からそれぞれ前記外周面と対面する第１側面および第２側面と、前記被研磨体の両端面にそれぞれ対面する第３側面および第４側面とを有し、
前記第１側面は、上面視において前記外周面を少なくとも２つの支持部で支持する支持壁面と、前記支持部の間に配置された、前記上面から前記下面にかけて前記外周面と接触しない第１凹部とを有する、板状キャリア。 A plate-shaped carrier for polishing the outer peripheral surface of the object to be polished.
It is plate-shaped with an upper surface and a lower surface.
By arranging a cylindrical or cylindrical object to be polished having an outer peripheral surface equidistant along the central axis so that the central axis is parallel to the lower surface, the object to be polished is centered on the central axis. It has a storage portion that rotatably stores and penetrates from the upper surface to the lower surface.
The storage portion has a first side surface and a second side surface facing the outer peripheral surface from both sides of the central axis, and a third side surface and a fourth side surface facing both end surfaces of the object to be polished, respectively. death,
The first side surface is a support wall surface that supports the outer peripheral surface with at least two support portions in a top view, and a first recess that is arranged between the support portions and does not come into contact with the outer peripheral surface from the upper surface to the lower surface. A plate-shaped carrier having and. 前記支持部は、前記被研磨体と点接触する、請求項１に記載の板状キャリア。 The plate-shaped carrier according to claim 1, wherein the support portion makes point contact with the object to be polished. 前記支持壁面は、被研磨体の軸方向における端部で前記外周面を支持する、請求項１または請求項２に記載の板状キャリア。 The plate-shaped carrier according to claim 1 or 2, wherein the support wall surface supports the outer peripheral surface at an end portion in the axial direction of the object to be polished. 前記収納部の前記第１側面は、前記中心軸の中央部に対向する位置に前記第１凹部を有する、請求項１乃至請求項３のいずれかに記載の板状キャリア。 The plate-shaped carrier according to any one of claims 1 to 3 , wherein the first side surface of the storage portion has the first recess at a position facing the central portion of the central axis. 前記収納部の前記第１側面は、複数の前記第１凹部を有する、請求項１乃至請求項４のいずれかに記載の板状キャリア。 The plate-shaped carrier according to any one of claims 1 to 4 , wherein the first side surface of the storage portion has a plurality of the first recesses. 前記収納部は、前記第２側面に、前記中心軸を挟んで前記第１凹部に対向する第２凹部を有する請求項５に記載の板状キャリア。 The plate-shaped carrier according to claim 5, wherein the accommodating portion has a second concave portion facing the first concave portion with the central axis interposed therebetween on the second side surface. ２つの前記支持部を結んだ直線と、前記第１凹部の最深部との距離のうち最も短い距離が０．１５ｍｍ以上である請求項１乃至請求項６のいずれかに記載の板状キャリア。 The plate-shaped carrier according to any one of claims 1 to 6, wherein the shortest distance between the straight line connecting the two support portions and the deepest portion of the first recess is 0.15 mm or more. 前記収納部と連通する溝部を有する、請求項１乃至請求項７のいずれかに記載の板状キャリア。 The plate-shaped carrier according to any one of claims 1 to 7, which has a groove portion communicating with the storage portion. 前記溝部は、前記第１凹部と連通する、請求項８に記載の板状キャリア。 The plate-shaped carrier according to claim 8, wherein the groove portion communicates with the first recess. 請求項１乃至９のいずれかに記載の板状キャリアと、
中心軸に沿って等距離の外周面を有する円柱状または円筒状の被研磨体を研磨する定盤と、を備え、
前記定盤と、前記定盤の上に配置された前記板状キャリアとが相対的に移動することによって、前記被研磨体の前記外周面を研磨する、研磨装置。 The plate-shaped carrier according to any one of claims 1 to 9,
A surface plate for polishing a cylindrical or cylindrical object to be polished having an outer peripheral surface equidistant along the central axis is provided.
A polishing device that polishes the outer peripheral surface of the object to be polished by relatively moving the surface plate and the plate-shaped carrier arranged on the surface plate. 前記板状キャリアは、前記定盤と対向する主面に溝部を有する、請求項１０に記載の研磨装置。 The plate-like carrier has a groove on the surface plate and opposite major surfaces, the polishing apparatus according to claim 10. 請求項１０または請求項１１に記載の研磨装置の前記収納部に前記被研磨体を収納する工程と、
前記定盤と前記キャリアとを相対的に移動させ、前記定盤で前記被研磨体の前記外周面を研磨する工程とを、有する研磨体の製造方法。 A step of accommodating the object to be polished in the accommodating portion of the polishing apparatus according to claim 10 or 11.
A method for producing a polished body, which comprises a step of relatively moving the surface plate and the carrier and polishing the outer peripheral surface of the object to be polished with the surface plate. 前記研磨体が、単結晶体である、請求項１２に記載の研磨体の製造方法。 The method for producing a polished body according to claim 12, wherein the polished body is a single crystal body. 前記研磨体が、サファイアである、請求項１３に記載の研磨体の製造方法。 The method for producing an abrasive body according to claim 13, wherein the abrasive body is sapphire.
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