JP6914293B2 - Ceramic package for filling electrolyte containing liquid - Google Patents

Ceramic package for filling electrolyte containing liquid Download PDF

Info

Publication number
JP6914293B2
JP6914293B2 JP2019088105A JP2019088105A JP6914293B2 JP 6914293 B2 JP6914293 B2 JP 6914293B2 JP 2019088105 A JP2019088105 A JP 2019088105A JP 2019088105 A JP2019088105 A JP 2019088105A JP 6914293 B2 JP6914293 B2 JP 6914293B2
Authority
JP
Japan
Prior art keywords
package
plan
ceramic
view
external connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019088105A
Other languages
Japanese (ja)
Other versions
JP2020113737A (en
Inventor
隆幸 宮路
隆幸 宮路
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Spark Plug Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to US16/659,902 priority Critical patent/US11309135B2/en
Priority to EP19219390.2A priority patent/EP3699938B1/en
Priority to KR1020190175595A priority patent/KR102376698B1/en
Priority to CN202010022928.5A priority patent/CN111435652B/en
Publication of JP2020113737A publication Critical patent/JP2020113737A/en
Application granted granted Critical
Publication of JP6914293B2 publication Critical patent/JP6914293B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

本発明は、複数のセラミック層を積層してなるパッケージ本体と、該パッケージ本体の表面に開口する凹部の底面側に設けた複数の電極パッドと、該電極パッドと前記パッケージ本体の裏面に設けた複数の外部接続端子との間を個別に接続するビア導体とを備え、上記凹部内に液分含有電解質を充填した際に、前記ビア導体などが腐食しにくい液分含有電解質充填用セラミックパッケージに関する。 In the present invention, a package main body formed by laminating a plurality of ceramic layers, a plurality of electrode pads provided on the bottom surface side of a recess opened on the surface of the package main body, and the electrode pads and the back surface of the package main body are provided. The present invention relates to a ceramic package for filling a liquid-containing electrolyte, which is provided with a via conductor for individually connecting between a plurality of external connection terminals, and the via conductor and the like are less likely to corrode when the recess is filled with the liquid-containing electrolyte. ..

例えば、複数のセラミック層を積層して箱形状としたパッケージ基体の内側（キャビティ）の底面に設けた内部電極と、前記パッケージ基体の裏面に設けた外部電極と、を下層側のセラミック層を貫通する導通線路を介して接続し、前記内部電極を高さ３０μｍ以上、望ましくは５０μｍ以上の軟質金属（金など）で形成した気密封着用パッケージが提案されている（例えば、特許文献１参照）。
上記気密封着用パッケージによれば、上記内部電極に対する外部からの応力伝搬を吸収でき、該内部電極の上に搭載される水晶素子への歪みの軽減が図れると共に、従来の保持サポートが不要となるため、製造工数や構成部品の削減や、コスト低減が図れ、且つ薄型化対応品として提供することが可能となる。 For example, an internal electrode provided on the bottom surface of the inside (cavity) of a box-shaped package substrate obtained by laminating a plurality of ceramic layers and an external electrode provided on the back surface of the package substrate penetrate the ceramic layer on the lower layer side. There has been proposed an air-sealed wearing package in which the internal electrodes are connected via a conductive line and the internal electrodes are formed of a soft metal (gold or the like) having a height of 30 μm or more, preferably 50 μm or more (see, for example, Patent Document 1).
According to the air-sealed wearing package, stress propagation from the outside to the internal electrode can be absorbed, distortion to the crystal element mounted on the internal electrode can be reduced, and the conventional holding support becomes unnecessary. Therefore, it is possible to reduce the manufacturing man-hours and component parts, reduce the cost, and provide the product as a thin product.

ところで、前記気密封着用パッケージは、前記内部電極の上にキャパシタなどの電子部品を搭載し、更に該電子部品の周囲で且つ前記パッケージ基体の内側（キャビティ）に、例えば、液状やゲル状の電解質を充填した後、該キャビティ内を気密に封止して電池あるいは電気化学セルとして用いることも可能である。
しかし、前記内部電極における外部に露出する表面に金属メッキにより被覆されたニッケル層および金層の薄い部分から、上記電解質が当該内部電極を形成するタングステン（Ｗ）などの金属部に接触することによって、該金属部の腐食が始まり、かかる腐食が前記導通線路を経て、前記外部電極に至る場合がある。その結果、前記腐食が進んで、前記セラミック層同士間に位置する層間導体などにリークパスを発生させて、前記パッケージ基体のキャビティ内部と外部との気密性が損なう場合がある、という問題があった。
更に、前記層間導体が腐食によって切断されると、外部電極との電気的な接続が遮断される結果、導通不良が発生する、という問題もあった。 By the way, in the airtight wearing package, an electronic component such as a capacitor is mounted on the internal electrode, and further, around the electronic component and inside (cavity) of the package substrate, for example, a liquid or gel-like electrolyte. It is also possible to airtightly seal the inside of the cavity and use it as a battery or an electrochemical cell.
However, the electrolyte comes into contact with a metal portion such as tungsten (W) forming the internal electrode from a thin portion of the nickel layer and the gold layer whose surface exposed to the outside of the internal electrode is coated with metal plating. , Corrosion of the metal portion may start, and such corrosion may reach the external electrode via the conduction line. As a result, there is a problem that the corrosion progresses and a leak path is generated in an interlayer conductor or the like located between the ceramic layers, which may impair the airtightness between the inside and the outside of the cavity of the package substrate. ..
Further, when the interlayer conductor is cut by corrosion, the electrical connection with the external electrode is cut off, and as a result, conduction failure occurs.

特開平１０−４１４３１号公報（第１〜４頁、図１〜６）Japanese Unexamined Patent Publication No. 10-41431 (pages 1 to 4, FIGS. 1 to 6)

本発明は、背景技術で説明した問題点を解決し、パッケージ本体の表面に開口する凹部内に液状成分を含む電解質を充填した際に、前記電解質による金属製の導体部分の腐食が前記凹部の外部へ進展しにくくした液分含有電解質充填用セラミックパッケージを提供する、ことを課題とする。 The present invention solves the problems described in the background art, and when an electrolyte containing a liquid component is filled in the recesses opened on the surface of the package body, the corrosion of the metal conductor portion by the electrolyte is caused by the recesses. An object of the present invention is to provide a ceramic package for filling a liquid-containing electrolyte that does not easily propagate to the outside.

課題を解決するための手段および発明の効果Means for Solving Problems and Effects of Invention

本発明は、前記課題を解決するため、複数のセラミック層を積層してなるパッケージ本体の表面に開口する凹部の底面に形成した電極パッドの一部を、上記セラミック層間の内層面に進入させ、更に該進入部分（内側部分）の一部が外側に向かって突出する凸部を有する電極パッドを形成し、該凸部と上記パッケージ本体の裏面に設けた外部接続端子との間を、ビア導体により電気的に接続する、ことに着想して成されたものである。
即ち、本発明の液分含有電解質充填用セラミックパッケージ（請求項１）は、複数のセラミック層を積層してなり、対向する表面および裏面を有するパッケージ本体と、該パッケージ本体の表面に開口し、底面および側面を有する凹部と、該凹部の底面と、該底面を面方向に延長した上記セラミック層間の内層面と、に亘って形成された複数の電極パッドと、上記パッケージ本体の裏面に形成された複数の外部接続端子と、を備え、上記凹部内に液分含有電解質が充填される液分含有電解質充填用セラミックパッケージであって、上記電極パッドは、平面視が多角形状のパッド本体と、上記セラミック層間の内層面に沿って形成された内側部分とを有し、該内側部分と上記パッド本体との境界が上記セラミック層間に位置し、前記内側部分は、平面視で上記パッド本体から外側に向かって突出する凸部を有し、該凸部と上記外部接続端子との間に、前記パッケージ本体のセラミック層を貫通するビア導体が形成されている、ことを特徴とする。 In order to solve the above problems, the present invention allows a part of the electrode pads formed on the bottom surface of the recesses opened on the surface of the package body formed by laminating a plurality of ceramic layers to enter the inner layer surface between the ceramic layers. Further, an electrode pad having a convex portion in which a part of the entry portion (inner portion) protrudes outward is formed, and a via conductor is provided between the convex portion and the external connection terminal provided on the back surface of the package body. It was created with the idea of connecting more electrically.
That is, the ceramic package for filling a liquid-containing electrolyte (claim 1) of the present invention is formed by laminating a plurality of ceramic layers, and is open to a package body having opposite front surfaces and back surfaces and the surface of the package body. A plurality of electrode pads formed over a recess having a bottom surface and side surfaces, a bottom surface of the recess, and an inner layer surface between the ceramic layers extending the bottom surface in the surface direction, and formed on the back surface of the package body. A ceramic package for filling a liquid-containing electrolyte, which comprises a plurality of external connection terminals and is filled with a liquid-containing electrolyte in the recess. It has an inner portion formed along the inner layer surface between the ceramic layers, the boundary between the inner portion and the pad body is located between the ceramic layers, and the inner portion is outside from the pad body in a plan view. It is characterized in that it has a convex portion protruding toward the surface, and a via conductor penetrating the ceramic layer of the package body is formed between the convex portion and the external connection terminal.

前記パッケージによれば、以下の効果（１）を得ることができる。
（１）前記凹部の底面に露出する複数の前記電極パッド上に、追って電子部品を実装した際に、該電子部品の周囲を包囲するように充填される液状またはゲル状の液分含有電解質が、前記セラミック層間の内層面と電極パッドの両端面との微細な隙間を通じて前記内側部分の外周縁に沿って、平面視で前記パッケージの外側に向かって流れ出る場合がある。かかる場合でも、前記内側部分とパッド本体との境界が前記セラミック層間に位置していると共に、前記凸部が、平面視で前記内側部分の一部としてパッド本体の外側に向かって突出し、且つ該凸部の幅方向の両側に前記複数のセラミック層同士が密着した内層面が位置しており、前記内側部分において平面視がＬ字形状となって、上述した電解質の浸入経路が長くなる。そのため、当該凸部に一端部側が接続された前記ビア導体に上記液分などが到達しにくくなり、該ビア導体の腐食を含む劣化を抑制することができる。従って、前記電極パッドと前記外部接続端子との間における電気的な接続状態を安定して維持することが可能となる。 According to the package, the following effect (1) can be obtained.
(1) When an electronic component is subsequently mounted on a plurality of electrode pads exposed on the bottom surface of the recess, a liquid or gel-like liquid-containing electrolyte that is filled so as to surround the periphery of the electronic component is formed. In some cases, the liquid may flow out toward the outside of the package in a plan view along the outer peripheral edge of the inner portion through a minute gap between the inner layer surface between the ceramic layers and both end surfaces of the electrode pad. Even in such a case, the boundary between the inner portion and the pad main body is located between the ceramic layers, and the convex portion protrudes toward the outside of the pad main body as a part of the inner portion in a plan view, and the convex portion is formed. Inner layer surfaces in which the plurality of ceramic layers are in close contact with each other are located on both sides of the convex portion in the width direction, and the plan view becomes L-shaped in the inner portion, so that the above-mentioned electrolyte infiltration path becomes long. Therefore, it becomes difficult for the liquid or the like to reach the via conductor whose one end side is connected to the convex portion, and deterioration including corrosion of the via conductor can be suppressed. Therefore, it is possible to stably maintain the electrical connection state between the electrode pad and the external connection terminal.

尚、前記セラミック層のセラミックは、アルミナなどの高温同時焼成セラミック、あるいはガラス−セラミックなどの低温同時焼成セラミックである。
また、前記複数のセラミック層は、少なくとも、下層側の平板状のセラミック層と、上層側の矩形枠状のセラミック層との上下２層を有し、これらを積層して前記パッケージ本体を構成している。
更に、前記電極パッド、外部接続端子、および、ビア導体は、前記セラミックがアルミナなどの場合には、タングステン（以下、単にＷと記載する）またはモリブデン（以下、単にＭｏと記載する）が適用され、ガラス−セラミックなどの場合には、銅（Ｃｕ）または銀（Ａｇ）が適用される。
また、前記電極パッドと外部接続端子との外部に露出する表面には、ニッケル層を介して薄い金層が被覆されている。
更に、前記電子部品には、例えば、キャパシタなどが例示される。
また、前記ビア導体の径方向に沿った断面は、円形状、長円形状、楕円形状、矩形状の何れかである。
加えて、前記凸部の幅方向とは、該凸部の突出する方向と直交する方向である。 The ceramic of the ceramic layer is a high-temperature co-fired ceramic such as alumina or a low-temperature co-fired ceramic such as glass-ceramic.
Further, the plurality of ceramic layers have at least two upper and lower layers of a flat plate-shaped ceramic layer on the lower layer side and a rectangular frame-shaped ceramic layer on the upper layer side, and these are laminated to form the package body. ing.
Further, when the ceramic is alumina or the like, tungsten (hereinafter, simply referred to as W) or molybdenum (hereinafter, simply referred to as Mo) is applied to the electrode pad, the external connection terminal, and the via conductor. , Glass-ceramic, etc., copper (Cu) or silver (Ag) is applied.
Further, the surface of the electrode pad and the external connection terminal exposed to the outside is coated with a thin gold layer via a nickel layer.
Further, examples of the electronic component include a capacitor and the like.
The cross section of the via conductor along the radial direction is any of a circular shape, an oval shape, an elliptical shape, and a rectangular shape.
In addition, the width direction of the convex portion is a direction orthogonal to the projecting direction of the convex portion.

更に、前記凹部には、実装される電子部品と共に、その周囲に液分含有電解質が充填される。該液分含有電解質は、ゲル状あるいは液状の成分を含有し、例えば、イオン化されたＮａ、Ｋ、Ｃａ、Ｐ、Ｃｌなどを含んでいる。具体的には、四フッ化ホウ酸リチウムなどのリチウム塩、塩酸、硫酸、硝酸などの酸をジメトキシエタンやプロピレンカーボネートなどの有機溶媒に溶解したものが挙げられる。
また、前記ゲル状の電解質は、液体状の電解質をポリマーゲルに含浸させたもので、該ポリマーゲルには、ポリエチレンオキシド、ポリメタクリル酸メチル、ポリフッ化ビニリデンなどが含まれる。あるいは、ピリジン系、循環式アミン系、脂肪族アミン系、またはイミダゾリウム系のイオン性液体やアミジン系などの常温溶融塩を用いても良い。
加えて、前記セラミックパッケージは、複数の該セラミックパッケージを平面視で縦横に隣接して併有する製品領域と、該製品領域の周囲を囲み且つ前記複数のセラミック層を積層した平面視が枠状の耳部とから構成された多数個取りの形態（大版）としても良い。 Further, the recess is filled with a liquid-containing electrolyte around the electronic component to be mounted. The liquid-containing electrolyte contains a gel-like or liquid component, and contains, for example, ionized Na, K, Ca, P, Cl and the like. Specific examples thereof include those obtained by dissolving a lithium salt such as lithium tetrafluoroborate and an acid such as hydrochloric acid, sulfuric acid and nitric acid in an organic solvent such as dimethoxyethane and propylene carbonate.
The gel-like electrolyte is obtained by impregnating a polymer gel with a liquid electrolyte, and the polymer gel contains polyethylene oxide, polymethyl methacrylate, polyvinylidene fluoride and the like. Alternatively, a normal temperature molten salt such as a pyridine-based, circulating amine-based, aliphatic amine-based, or imidazolium-based ionic liquid or amidine-based may be used.
In addition, the ceramic package has a product region in which a plurality of the ceramic packages are vertically and horizontally adjacent to each other in a plan view, and a plan view in which the plurality of ceramic layers are laminated and surrounds the periphery of the product region is frame-shaped. It may be in the form of a large number of pieces (large version) composed of the ears.

また、本発明には、前記パッド本体は、平面視で矩形状であり、該パッド本体の一部に前記内側部分を有し、平面視において前記凸部の幅は、前記内側部分の幅よりも小さい、液分含有電解質充填用セラミックパッケージ（請求項２）も含まれる。
これによれば、平面視で、前記電極パッドが有するパッド本体に含まれる前記内側部分の幅よりも、該内側部分から外側に突出した前記凸部の幅が小さいので、前記凹部内の前記液分含有電解質が、該凸部の幅方向の両側に位置する前記複数のセラミック層同士が密着した内層面によって、当該凸部側に浸透する事態が抑制されると共に、前記内側部分の両側縁に沿って上記電解質が浸入する際に、該内側部分において平面視がＬ字形状となるので、上記電解質の浸入経路が長くなる。従って、前記効果（１）をより確実に得ることが可能となる。
更に、前記内側部分と凸部との幅関係とは逆に、平面視において前記凸部の幅が、前記内側部分の幅よりも大きい場合に比べて、前記の形態によれば、前記内層面において前記凸部の配置に要するスペースを比較小さくできるので、本パッケージの小型化にも寄与することが可能となる（以下、効果（２）と称する）。 Further, in the present invention, the pad body is rectangular in a plan view, has the inner portion in a part of the pad body, and the width of the convex portion is larger than the width of the inner portion in the plan view. A small ceramic package for filling a liquid-containing electrolyte (claim 2) is also included.
According to this, in a plan view, the width of the convex portion protruding outward from the inner portion is smaller than the width of the inner portion included in the pad body of the electrode pad, so that the liquid in the concave portion. The inner layer surface in which the plurality of ceramic layers located on both sides of the convex portion in the width direction of the component-containing electrolyte is in close contact with each other suppresses the situation where the component-containing electrolyte permeates the convex portion side, and also on both side edges of the inner portion. When the electrolyte infiltrates along the line, the plan view becomes L-shaped in the inner portion, so that the infiltration route of the electrolyte becomes long. Therefore, the effect (1) can be obtained more reliably.
Further, contrary to the width relationship between the inner portion and the convex portion, according to the above-described form, the inner layer surface is compared with the case where the width of the convex portion is larger than the width of the inner portion in a plan view. Since the space required for arranging the convex portions can be made relatively small, it is possible to contribute to the miniaturization of the present package (hereinafter, referred to as effect (2)).

更に、本発明には、前記凸部は、平面視で四角形状、前記パッド本体側と反対側の端辺が幅広の底辺である台形状、あるいは、前記パッド本体側と反対側に前記凹部の側面と平行状な直線部と、該直線部よりも上記パッド本体側に位置する幅狭の首部と、からなる平面視でＴ字形状を呈する、液分含有電解質充填用セラミックパッケージ（請求項３）も含まれる。
これによれば、前記凹部内のガス中の前記電解質が、凹部内から前記内側部分の両外縁から凸部側に進入する経路が一層長くなる。従って、前記効果（１）をより顕著に得ることが可能となる。
尚、前記台形状には、平面視が角形状で且つそのうちの２つの隅に傾斜辺を対称に有する変形五角形も含まれる。 Further, in the present invention, the convex portion has a rectangular shape in a plan view and has a trapezoidal shape in which the end side opposite to the pad body side is a wide base, or the concave portion is formed on the side opposite to the pad body side. A ceramic package for filling a liquid-containing electrolyte (claim 3), which has a T-shape in a plan view consisting of a straight portion parallel to the side surface and a narrow neck portion located closer to the pad body than the straight portion. ) Is also included.
According to this, the path through which the electrolyte in the gas in the concave portion enters from the concave portion to the convex portion side from both outer edges of the inner portion becomes longer. Therefore, the effect (1) can be obtained more remarkably.
The trapezoidal shape also includes a modified pentagon having a square shape in a plan view and symmetrically inclined sides at two corners thereof.

また、本発明には、前記複数の電極パッドの１つに対して、複数の前記外部接続端子が電気的に接続されている、液分含有電解質充填用セラミックパッケージ（請求項４）も含まれる。
これによれば、１つの電極パッドに対して、複数の前記外部接続端子が電気的に接続されているので、例えば、本パッケージを搭載するマザーボードなどにおける多くの外部電極との接続が容易となるか、あるいは、複数のマザーボードなどとの並列した接続が可能となる（以下、効果（３）と称する）。
更に、本発明には、前記複数の前記外部接続端子は、平面視で前記パッケージ本体の裏面における周辺に沿って形成されている、液分含有電解質充填用セラミックパッケージ（請求項５）も含まれる。
これによれば、本パッケージをマザーボードなどに搭載する際の位置決めが比較的容易となる（以下、効果（４）と称する）。 The present invention also includes a ceramic package for filling a liquid-containing electrolyte (claim 4), in which a plurality of the external connection terminals are electrically connected to one of the plurality of electrode pads. ..
According to this, since the plurality of the external connection terminals are electrically connected to one electrode pad, it becomes easy to connect to many external electrodes, for example, on a motherboard on which the present package is mounted. Alternatively, it is possible to connect in parallel with a plurality of motherboards (hereinafter referred to as effect (3)).
Further, the present invention also includes a ceramic package for filling a liquid-containing electrolyte (claim 5), in which the plurality of external connection terminals are formed along the periphery on the back surface of the package body in a plan view. ..
According to this, positioning when mounting this package on a motherboard or the like becomes relatively easy (hereinafter, referred to as effect (4)).

また、本発明には、前記パッケージ本体の表面および裏面の間に位置する側面には、複数の側面導体が形成され、前記外部接続端子の側面側端部は、前記側面導体の裏面側端部と個別に接続されている、液分含有電解質充填用セラミックパッケージ（請求項６）も含まれる。
これによれば、複数の前記外部接続端子は、複数の前記側面導体と個別に接続されているので、マザーボードなどにおける複数の電極との接続強度を、広い接触面積のハンダを介して、より確実にし得る（以下、効果（５）と称する）。
加えて、本発明には、前記パッケージ本体の裏面には、平面視で該裏面の周辺に沿って形成された複数の前記外部接続端子のほかに、これら周辺側の外部接続端子に囲まれた当該裏面の中央側にも、単数または複数の中央側の外部接続端子が形成されている、液分含有電解質充填用セラミックパッケージ（請求項７）も含まれる。
これによれば、前記効果（３）をより顕著に奏することが可能となる。 Further, in the present invention, a plurality of side conductors are formed on the side surface located between the front surface and the back surface of the package body, and the side surface side end portion of the external connection terminal is the back surface side end portion of the side surface conductor. Also included is a ceramic package for filling the liquid-containing electrolyte (claim 6), which is individually connected to the.
According to this, since the plurality of the external connection terminals are individually connected to the plurality of the side conductors, the connection strength with the plurality of electrodes on the motherboard or the like is more reliable through the solder having a wide contact area. (Hereinafter referred to as effect (5)).
In addition, in the present invention, on the back surface of the package body, in addition to the plurality of external connection terminals formed along the periphery of the back surface in a plan view, the back surface is surrounded by external connection terminals on the peripheral side. A ceramic package for filling a liquid-containing electrolyte (claim 7) is also included, wherein one or a plurality of external connection terminals on the central side are formed on the central side of the back surface.
According to this, the effect (3) can be exerted more remarkably.

（Ａ）は、本発明による一形態の前記セラミックパッケージを示す平面図、（Ｂ）は、前記（Ａ）中のＢ−Ｂ線の矢視に沿った垂直断面図、（Ｃ）は、該パッケージの要部を示す分解斜視図。(A) is a plan view showing one form of the ceramic package according to the present invention, (B) is a vertical cross-sectional view taken along the line BB in (A), and (C) is the said ceramic package. An exploded perspective view showing the main parts of the package. （Ａ）〜（Ｃ）は、電極パッドにおける内側部分に設けた互いに異なる形態の凸部を示す下層側のセラミック層の平面図。(A) to (C) are plan views of the ceramic layer on the lower layer side showing convex portions having different shapes provided on the inner portion of the electrode pad. （Ａ）〜（Ｃ）は、互いに異なる形態の前記セラミックパッケージを示す下層側のセラミック層の平面図。(A) to (C) are plan views of the ceramic layer on the lower layer side showing the ceramic packages having different forms from each other. （Ａ）、（Ｂ）は、異なる形態の前記セラミックパッケージを示す下層側のセラミック層の底面図。(A) and (B) are bottom views of the ceramic layer on the lower layer side showing the ceramic packages having different forms.

以下において、本発明を実施するための形態について説明する。
図１（Ａ）は、本発明による一形態の液分含有電解質充填用セラミックパッケージ（以下、単にパッケージと称する）１ａを示す平面図、（Ｂ）は、（Ａ）中のＢ−Ｂ線の矢視に沿った垂直断面図、（Ｃ）は、該パッケージ１ａの要部を示す分解斜視図である。
上記パッケージ１ａは、図１（Ａ）〜（Ｃ）に示すように、平面視の外形が長方形（矩形）状で且つ対向する表面３および裏面４を有するパッケージ本体２と、該パッケージ本体２の表面３に開口し、平面視が長方形状の底面６および四辺の側面７を有する凹部（キャビティ）５と、前記底面６のうち図示で左側の一側面７側に互いに隣接して形成された一対（複数）の電極パッド８と、上記パッケージ本体２の裏面４に形成され一対（複数）の外部接続端子１４と、を備えている。
尚、前記外部接続端子１４は、図１（Ｂ）でその前後方向に沿って一対が配置されている。また、図１（Ｂ）で右側には、電気的に独立し、且つ本パッケージ１ａの搭載時に用いられるダミー用の裏面パッド１５が形成されている。 Hereinafter, embodiments for carrying out the present invention will be described.
FIG. 1 (A) is a plan view showing one form of a ceramic package for filling a liquid-containing electrolyte (hereinafter, simply referred to as a package) 1a according to the present invention, and FIG. 1 (B) is a line BB in (A). A vertical cross-sectional view taken along the arrow (C) is an exploded perspective view showing a main part of the package 1a.
As shown in FIGS. 1A to 1C, the package 1a is a package main body 2 having a rectangular outer shape in a plan view and having a front surface 3 and a back surface 4 facing each other, and the package main body 2. A pair of recesses (cavities) 5 that are open to the surface 3 and have a bottom surface 6 that is rectangular in a plan view and side surfaces 7 on all four sides, and a pair of the bottom surface 6 that are formed adjacent to each other on the left side surface 7 side in the drawing. It includes (plurality) electrode pads 8 and a pair (plurality) of external connection terminals 14 formed on the back surface 4 of the package body 2.
A pair of the external connection terminals 14 are arranged along the front-rear direction in FIG. 1 (B). Further, on the right side in FIG. 1B, a back surface pad 15 for a dummy that is electrically independent and is used when the package 1a is mounted is formed.

前記パッケージ本体２は、図１（Ｂ），（Ｃ）に示すように、下層側の平坦なセラミック層ｃ１の上面の外周側に、矩形枠状のセラミック層ｃ２を積層したもので、該セラミック層ｃ１，ｃ２間は、前記底面６を面方向に延長した内層面１３である。尚、上記セラミック層ｃ１，ｃ２は、例えば、アルミナからなる。
また、前記電極パッド８は、平面視が長方形（矩形）状のパッド本体８ｘと、前記セラミック層ｃ１，ｃ２間の内層面１３内に位置する内側部分９と、を有している。更に、該該内側部分９は、パッド本体８ｘから平面視で外側に突出する平面視が長方形（四角形）状の凸部１０を有している。即ち、該電極パッド８は、前記凹部５の底面６と、該底面６をその面方向に延長した前記内層面１３とに亘って形成され、且つ内側部分９とパッド本体８ｘとの境界が前記内層面１３に位置している。平面視における凸部１０の幅は、上記内側部分９の幅よりも小さく、該凸部１０の幅方向の両側には、該内側部分９の両角部が位置している。 As shown in FIGS. 1B and 1C, the package body 2 is formed by laminating a rectangular frame-shaped ceramic layer c2 on the outer peripheral side of the upper surface of a flat ceramic layer c1 on the lower layer side. Between the layers c1 and c2 is an inner layer surface 13 which is an extension of the bottom surface 6 in the surface direction. The ceramic layers c1 and c2 are made of, for example, alumina.
Further, the electrode pad 8 has a pad body 8x having a rectangular shape in a plan view, and an inner portion 9 located in the inner layer surface 13 between the ceramic layers c1 and c2. Further, the inner portion 9 has a convex portion 10 having a rectangular shape in a plan view, which projects outward from the pad body 8x in a plan view. That is, the electrode pad 8 is formed over the bottom surface 6 of the recess 5 and the inner layer surface 13 extending the bottom surface 6 in the surface direction, and the boundary between the inner portion 9 and the pad body 8x is said. It is located on the inner layer surface 13. The width of the convex portion 10 in a plan view is smaller than the width of the inner portion 9, and both corner portions of the inner portion 9 are located on both sides of the convex portion 10 in the width direction.

更に、図１（Ａ）、（Ｂ）に示すように、上記凸部１０と、パッケージ本体２の裏面４に形成された前記外部接続端子１４との間には、セラミック層ｃ１を貫通する２本のビア導体１１が個別に形成されている。加えて、電極パッド８のパッド本体８ｘのうち、前記凹部５の底面６上に位置する部分と、上記外部接続端子１４との間にも、別に２本のビア導体１２が形成されている。上記ビア導体１１，１２の本数は、１本ずつでも、あるいは３本以上ずつの任意数としても良い。
尚、前記電極パッド８、ビア導体１１，１２、外部接続端子１４、および裏面パッド１５の材料は、主にＷまたはＭｏからなる。
また、例えば、前記ビア導体１１が直径５０μｍの円形断面を有する場合、前記凸部１０は、前記内側部分９の両外側縁から少なくとも１００μｍ以上外側に突出している。更に、上記ビア導体１１は、該凸部１０の幅方向における両側縁および外端縁から少なくとも５０μｍ以上内側の位置に接続されている。
更に、電極パッド８のパッド本体８ｘ、外部接続端子１４、および裏面パッド１５の外部に露出する表面には、ニッケル層を介して薄い金層（何れも図示せず）が被覆されている。 Further, as shown in FIGS. 1A and 1B, the ceramic layer c1 penetrates between the convex portion 10 and the external connection terminal 14 formed on the back surface 4 of the package body 2. The via conductors 11 of the book are individually formed. In addition, two via conductors 12 are separately formed between the portion of the pad body 8x of the electrode pad 8 located on the bottom surface 6 of the recess 5 and the external connection terminal 14. The number of the via conductors 11 and 12 may be one by one, or may be an arbitrary number of three or more.
The material of the electrode pad 8, the via conductors 11 and 12, the external connection terminal 14, and the back surface pad 15 is mainly made of W or Mo.
Further, for example, when the via conductor 11 has a circular cross section having a diameter of 50 μm, the convex portion 10 projects outward by at least 100 μm or more from both outer edges of the inner portion 9. Further, the via conductor 11 is connected to a position inside at least 50 μm or more from both side edges and outer edge of the convex portion 10 in the width direction.
Further, the surface of the electrode pad 8 exposed to the outside of the pad body 8x, the external connection terminal 14, and the back surface pad 15 is coated with a thin gold layer (none of which is shown) via a nickel layer.

前記パッケージ１ａでは、平面視で前記電極パッド８の内側部分９の一部である凸部１０が、パッド本体８ｘから外側に向かって突出し、且つ該凸部１０の幅方向の両側に前記複数のセラミック層ｃ１，ｃ２同士が密着した内層面１３が位置している。そのため、図１（Ｂ）に示すように、前記凹部５の底面６に露出する前記電極パッド８上に追って電子部品１６を実装した際に、該電子部品１６の周囲を包囲する前記凹部５内に充填される液状またはゲル状の液分含有電解質（図示せず）が、前記セラミック層ｃ１，ｃ２間の内層面１３と内側部分９の両外側縁との微細な隙間を通じて該内側部分９の外端縁に沿って、平面視で外側に向かって流れ出る場合がある。かかる場合でも、上記電解質などが凸部１０に一端部側が接続された前記ビア導体１１に到達しにくくなり、該ビア導体１１の腐食を含む劣化を抑制できる。尚、前記ビア導体１２が上記電解質により腐食した場合でも、上記ビア導体１１を腐食から防止ないし抑制している。 In the package 1a, the convex portions 10 which are a part of the inner portion 9 of the electrode pad 8 project outward from the pad main body 8x in a plan view, and the plurality of convex portions 10 are projected on both sides of the convex portions 10 in the width direction. The inner layer surface 13 in which the ceramic layers c1 and c2 are in close contact with each other is located. Therefore, as shown in FIG. 1B, when the electronic component 16 is mounted on the electrode pad 8 exposed on the bottom surface 6 of the recess 5, the inside of the recess 5 surrounds the periphery of the electronic component 16. A liquid or gel-like liquid-containing electrolyte (not shown) filled in the ceramic layer c1 and c2 is filled with a liquid or gel-like electrolyte in the inner portion 9 through a minute gap between the inner layer surface 13 between the ceramic layers c1 and c2 and both outer edges of the inner portion 9. It may flow outward along the outer edge in a plan view. Even in such a case, it becomes difficult for the electrolyte or the like to reach the via conductor 11 whose one end side is connected to the convex portion 10, and deterioration including corrosion of the via conductor 11 can be suppressed. Even when the via conductor 12 is corroded by the electrolyte, the via conductor 11 is prevented or suppressed from corrosion.

従って、前記パッケージ１ａによれば、前記電極パッド８と外部接続端子１４との間における電気的な接続状態を安定して維持でき、前記凸部１０のスペースを小さくできるので、前記効果（１），（２）を確実に得ることが可能となる。
尚、前記パッケージ本体２の表面３には、平面視が矩形状の図示しないメタライズ層を予め形成しておき、追って一対の前記電極パッド８上に跨がって電子部品１６を実装し、更にその周囲を含む前記凹部５内に前記電解質（図示せず）を充填した後、上記メタライズ層の上に図示しない金属蓋を溶接やロウ付けなどで接合することにより、上記凹部５内を外部から封止しても良い。
また、前記図１（Ａ）において、前記凹部５で対向する左右一対の短辺ごとの側面７側に、一対ずつ（合計４つ）の前記電極パッド８を左右対称に配置し、図示でパッケージ本体２ａの右側にも前記同様のビア導体１１，１２や外部接続端子１４を設けた形態としても良い。 Therefore, according to the package 1a, the electrical connection state between the electrode pad 8 and the external connection terminal 14 can be stably maintained, and the space of the convex portion 10 can be reduced, so that the effect (1) , (2) can be surely obtained.
A metallized layer (not shown) having a rectangular plan view is formed in advance on the surface 3 of the package body 2, and electronic components 16 are mounted on the pair of electrode pads 8 in advance. After filling the recess 5 including the periphery thereof with the electrolyte (not shown), a metal lid (not shown) is joined onto the metallized layer by welding, brazing, or the like to form the recess 5 from the outside. It may be sealed.
Further, in FIG. 1A, a pair of the electrode pads 8 (four in total) are symmetrically arranged on the side surface 7 side of each pair of left and right short sides facing each other in the recess 5, and the package is shown in the drawing. The same via conductors 11 and 12 and the external connection terminal 14 may be provided on the right side of the main body 2a.

図２（Ａ）は、前記パッケージ１ａにおいて、前記電極パッド８の内側部分９の一部であり、パッド本体８ｘから外側に向かって突出して設けた異なる形態の凸部１０ａを示す下層側の前記セラミック層ｃ１の平面図である。
上記凸部１０ａは、図２（Ａ）に示すように、前記電極パッド８における内側部分９の一部であり、平面視で三角形状で且つ対称に位置する一対の凹み部１７に挟まれ、平面視が台形（多角形）状を呈している。即ち、該凸部１０ａは、平面視で上記パッド本体８ｘと反対側（外側）の端辺が幅広の変形五角形（台形状）を呈している。上記凸部１０ａと、前記外部接続端子１４との間には、２本のビア導体１１が前記同様に接続され、前記凹部５内のパッド本体８ｘと、上記外部接続端子１４との間にも、２本のビア導体１２が前記同様に接続されている。 FIG. 2A is a part of the inner portion 9 of the electrode pad 8 in the package 1a, and is the lower layer side showing the convex portion 10a of a different form provided so as to project outward from the pad body 8x. It is a top view of the ceramic layer c1.
As shown in FIG. 2A, the convex portion 10a is a part of the inner portion 9 of the electrode pad 8, and is sandwiched between a pair of concave portions 17 that are triangular and symmetrically located in a plan view. The plan view is trapezoidal (polygon). That is, the convex portion 10a exhibits a deformed pentagon (trapentagon) having a wide end side (outside) opposite to the pad body 8x in a plan view. Two via conductors 11 are connected between the convex portion 10a and the external connection terminal 14 in the same manner as described above, and also between the pad body 8x in the concave portion 5 and the external connection terminal 14. Two via conductors 12 are connected in the same manner as described above.

また、図２（Ｂ）は、前記パッケージ１ａにおいて、前記電極パッド８の内側部分９の一部であり、パッド本体８ｘから外側に向かって突出して設けた更に異なる形態の凸部１０ｂを示す下層側の前記セラミック層ｃ１の平面図である。
上記凸部１０ｂは、図２（Ｂ）に示すように、前記電極パッド８における内側部分９の一部であり、平面視で台形形状で且つ対称に位置する一対の凹み部１８に挟まれ、平面視が台形（多角形）状を呈している。即ち、該凸部１０ｂは、平面視で上記パッド本体８ｘと反対側（外側）の端辺が幅広の変形五角形が平面視で台形状で、且つ対称に位置する一対の凹み部１８により、幅狭とされた首部２１によって、パッド本体８ｘと連結された形状を呈している。上記凸部１０ｂと、前記外部接続端子１４との間には、２本のビア導体１１が前記同様に接続され、前記凹部５内のパッド本体８ｘと、上記外部接続端子１４との間にも、２本のビア導体１２が前記同様に接続されている。 Further, FIG. 2B is a lower layer which is a part of the inner portion 9 of the electrode pad 8 in the package 1a and shows a convex portion 10b having a further different form provided so as to project outward from the pad body 8x. It is a top view of the ceramic layer c1 on the side.
As shown in FIG. 2B, the convex portion 10b is a part of the inner portion 9 of the electrode pad 8, and is sandwiched between a pair of concave portions 18 having a trapezoidal shape and symmetrical positions in a plan view. The plan view is trapezoidal (polygon). That is, the convex portion 10b is wide due to a pair of recessed portions 18 in which a deformed pentagon having a wide end side (outside) opposite to the pad body 8x in a plan view is trapezoidal in a plan view and is located symmetrically. It has a shape connected to the pad body 8x by the narrowed neck portion 21. Two via conductors 11 are connected between the convex portion 10b and the external connection terminal 14 in the same manner as described above, and also between the pad body 8x in the concave portion 5 and the external connection terminal 14. Two via conductors 12 are connected in the same manner as described above.

更に、図２（Ｃ）は、前記パッケージ１ａにおいて、前記電極パッド８の内側部分９の一部であり、パッド本体８ｘから外側に向かって突出して設けた更に異なる形態の凸部１０ｃを示す下層側の前記セラミック層ｃ１の平面図である。
上記凸部１０ｃは、図２（Ｃ）に示すように、前記電極パッド８における内側部分９の一部であり、平面視で角形（矩形）状で且つ対称に位置する一対の凹み部１９に挟まれた首部２１を有する平面視がＴ字形状を呈している。即ち、該凸部１０ｃは、前記凹部５において該凸部１０ｃに最も近い位置の側面５と平行状な直線部２０と、該直線部２０よりも前記パッド本体８ｘ側に位置し且つ一対の凹み部１９の挟まれた幅狭の首部２１とからなっている。
上記部１０ｃの直線部２０は、平面視で細長い長円形状を呈し、その両端部と前記外部接続端子１４との間には、２本のビア導体１１が前記同様に接続され、前記凹部５内のパッド本体８ｘと、記外部接続端子１４との間にも、２本のビア導体１２が前記同様に接続されている。 Further, FIG. 2C shows a lower layer which is a part of the inner portion 9 of the electrode pad 8 in the package 1a and shows a convex portion 10c having a different form and provided so as to project outward from the pad body 8x. It is a top view of the ceramic layer c1 on the side.
As shown in FIG. 2C, the convex portion 10c is a part of the inner portion 9 of the electrode pad 8, and is formed in a pair of concave portions 19 having a rectangular shape and symmetrical positions in a plan view. The plan view having the sandwiched neck portion 21 has a T-shape. That is, the convex portion 10c is a straight portion 20 parallel to the side surface 5 at the position closest to the convex portion 10c in the concave portion 5, and a pair of recesses located on the pad body 8x side of the straight portion 20. It is composed of a narrow neck portion 21 sandwiched between the portions 19.
The straight portion 20 of the portion 10c has an elongated oval shape in a plan view, and two via conductors 11 are connected between both ends thereof and the external connection terminal 14 in the same manner as described above, and the recess 5 is formed. Two via conductors 12 are also connected between the inner pad body 8x and the external connection terminal 14 in the same manner as described above.

前記のような凸部１０ａ〜１０ｃを有する一対の前記電極パッド８を備えたパッケージ１ａにおいても、平面視で前記電極パッド８の内側部分９が外側に向かって突出する前記凸部１０ａ〜１０ｃを有し、且つ前記凹み部１７〜１９（内側部分９とパッド本体８ｘとの境界）を形成する前記セラミック層ｃ１，ｃ２同士が密着した内層面１３に位置している。その結果、前記電解質が、上記凸部１０ａ〜１０ｃに一端部側が接続された前記ビア導体１１に到達しにくくなり、該ビア導体１１の腐食を含む劣化をより確実に抑制できる。しかも、前記凸部１０ａ〜１０ｃの幅は、何れも内側部分９の幅よりも小さくされている。
従って、前記凸部１０ａ〜１０ｃの何れかを含む一対の電極パッド８を備えた前記パッケージ１ａによっても、前記効果（１），（２）を一層確実に得ることできる。 Even in the package 1a provided with the pair of electrode pads 8 having the convex portions 10a to 10c as described above, the convex portions 10a to 10c in which the inner portion 9 of the electrode pads 8 projects outward in a plan view are provided. It is located on the inner layer surface 13 in which the ceramic layers c1 and c2 are in close contact with each other and have the recessed portions 17 to 19 (the boundary between the inner portion 9 and the pad body 8x). As a result, it becomes difficult for the electrolyte to reach the via conductor 11 whose one end side is connected to the convex portions 10a to 10c, and deterioration including corrosion of the via conductor 11 can be more reliably suppressed. Moreover, the widths of the convex portions 10a to 10c are all smaller than the width of the inner portion 9.
Therefore, the effects (1) and (2) can be obtained more reliably even by the package 1a provided with the pair of electrode pads 8 including any of the convex portions 10a to 10c.

図３（Ａ）は、異なる形態のパッケージ１ｂを示す下層側のセラミック層ｃ１の平面図である。
上記パッケージ１ｂは、図３（Ａ）に示すように、前記同様のパッケージ本体２および凹部５を備え、該凹部５において対向する一対の短辺の側面７側に、一対（複数）の電極パッド８が左右対称に形成されている。該電極パッド８も、前記パッケージ１と同様に、凹部５の底面６と前記セラミック層ｃ１，ｃ２間の内層面１３とに亘って形成されたパッド本体８ｘと、該パッド本体８ｘの内側部分９と、該内側部分９の一部であり、前記パッド本体８ｘから平面視で外側に向かって突出し、且つ前記内層面１３に形成された凸部１０とを有している。 FIG. 3A is a plan view of the lower ceramic layer c1 showing different forms of the package 1b.
As shown in FIG. 3A, the package 1b includes the same package body 2 and recess 5, and a pair (plurality) of electrode pads are provided on the side surface 7 side of the pair of short sides facing each other in the recess 5. 8 is formed symmetrically. Similar to the package 1, the electrode pad 8 also has a pad body 8x formed over the bottom surface 6 of the recess 5 and the inner layer surface 13 between the ceramic layers c1 and c2, and an inner portion 9 of the pad body 8x. And a convex portion 10 which is a part of the inner portion 9, protrudes outward from the pad body 8x in a plan view, and is formed on the inner layer surface 13.

前記パッケージ本体２の裏面４における左右方向の両端側には、図示しない一対の前記外部接続端子１４が個別に形成されており、該外部接続端子１４ごとと、図３（Ａ）で重複する上記電極パッド８の凸部１０との間には、２本ずつのビア導体１１が個別に接続されている。尚、上記各電極パッド８のうち、凹部５の底面６に位置するパッド本体８ｘと、上記外部接続端子１４との間には、２本ずつのビア導体１２が個別に接続されている。
図示のように、凹部５内における前記一対の電極パッド８のパッド本体８ｘ同士間に跨がって、追って電子部品１６が実装される。
以上のようなパッケージ１ｂによっても、前記パッケージ１ａと同様に前記効果（１），（２）を得ることが可能である。 A pair of external connection terminals 14 (not shown) are individually formed on both ends of the back surface 4 of the package body 2 in the left-right direction, and the external connection terminals 14 overlap with each other in FIG. 3A. Two via conductors 11 are individually connected to the convex portion 10 of the electrode pad 8. Of the electrode pads 8, two via conductors 12 are individually connected between the pad body 8x located on the bottom surface 6 of the recess 5 and the external connection terminal 14.
As shown in the drawing, the electronic component 16 is mounted so as to straddle between the pad bodies 8x of the pair of electrode pads 8 in the recess 5.
With the package 1b as described above, the effects (1) and (2) can be obtained in the same manner as the package 1a.

図３（Ｂ）は、更に異なる形態のパッケージ１ｃを示す下層側のセラミック層ｃ１の平面図である。
上記パッケージ１ｃは、図３（Ｂ）に示すように、前記同様のパッケージ本体２および凹部５を備え、該凹部５において左側の短辺である側面７と、上下一対の長辺である側面７の何れか一方とに跨がって、一対の電極パッド８Ａが図示で上下対称に形成されている。該電極パッド８Ａは、図示のように、平面が長方形（矩形）状のパッド本体８ｙと、該パッド本体８ｙに含まれ、隣接する１つの短辺と１つの長辺とに跨がった平面視がＬ字形状を呈し、且つ前記セラミック層ｃ１，ｃ２間の内層面１３に形成された内側部分９ａと、該内側部分９ａの短辺と長辺との中間ごとの位置から平面視で上記パッド本体８ｙの外側の内層面１３に沿って個別に突出した一対の凸部１０と、を有している。 FIG. 3B is a plan view of the ceramic layer c1 on the lower layer side showing a package 1c having a further different form.
As shown in FIG. 3B, the package 1c includes the same package body 2 and recess 5, and has a side surface 7 which is a short side on the left side of the recess 5 and a side surface 7 which is a pair of upper and lower long sides. A pair of electrode pads 8A are formed vertically symmetrically in the drawing so as to straddle any one of them. As shown in the figure, the electrode pad 8A is a flat surface included in a pad body 8y having a rectangular shape and a flat surface straddling one adjacent short side and one long side. The above is a plan view from the position of the inner portion 9a formed on the inner layer surface 13 between the ceramic layers c1 and c2 and the intermediate side between the short side and the long side of the inner portion 9a. It has a pair of convex portions 10 that individually project along the outer inner layer surface 13 of the pad body 8y.

図３（Ｂ）に示すように、１つの前記電極パッド８Ａにおける一対の凸部１０は、互いに直角向きの姿勢であると共に、該一対の凸部１０の幅は、これらが突出する前記内側部分９ａの短辺または長辺の幅方向の幅よりもそれぞれ小さい。
前記パッケージ本体２の裏面４における左端側には、前記パッケージ１ａと同様に一対の外部接続端子１４が形成され、図示にて平面視で重複する上記電極パッド８Ａごとの凸部１０との間には、２本ずつのビア導体１１が形成されている。
以上のようなパッケージ１ｃによっても、前記パッケージ１ａと同様に前記効果（１），（２）を得ることが可能である。
尚、前記パッケージ１ｃでは、前記ビア導体１２を省略したが、任意本数の該ビア導体１２を前記パッケージ１ａ，１ｂの場合と同様に形成しても良い。
また、前記電極パッド８Ａを、前記凹部５の四隅側ごとに４つ個別に且つ左右対称に形成し、該４つの電極パッド８Ａに跨がって前記電子部品１６を上記凹部５の底面６上に実装する形態としても良い。 As shown in FIG. 3B, the pair of convex portions 10 in one of the electrode pads 8A are oriented at right angles to each other, and the width of the pair of convex portions 10 is the inner portion from which they protrude. It is smaller than the width of the short side or the long side of 9a in the width direction.
Similar to the package 1a, a pair of external connection terminals 14 are formed on the left end side of the back surface 4 of the package body 2, and are between the convex portions 10 of each of the electrode pads 8A which overlap in a plan view in the drawing. Is formed with two via conductors 11 each.
With the package 1c as described above, the effects (1) and (2) can be obtained in the same manner as the package 1a.
Although the via conductor 12 is omitted in the package 1c, an arbitrary number of via conductors 12 may be formed in the same manner as in the case of the packages 1a and 1b.
Further, four electrode pads 8A are individually and symmetrically formed for each of the four corners of the recess 5, and the electronic component 16 is placed on the bottom surface 6 of the recess 5 across the four electrode pads 8A. It may be implemented in.

図３（Ｃ）は、前記各形態とは別異な形態のパッケージ１ｄを示す下層側のセラミック層ｃ１の平面図である。
上記パッケージ１ｄは、図３（Ｃ）に示すように、前記同様のパッケージ本体２および凹部５を備え、該凹部５において対向する一対の長辺の側面７側ごとに平面視が横長の長方形（矩形）状を呈するパッド本体８ｚと、該パッド本体８ｚのうち、長辺の上記側面７の全長と、これに隣接する一対の短辺の側面７ごとの一部に対応し、且つ前記内層面１３に沿って形成された内側部分９ｂと、を備えた一対（複数）の電極パッド８Ｂを上下対称に有している。
図示のように、電極パッド８Ｂは、それぞれの内側部分９ｂのうち、横長の長辺部分から平面視でパッド本体８ｚから２つの凸部１０が互いに離間して外側に向かって突出して形成され、且つ左右の短辺の中間から平面視でパッド本体８ｚから１つの凸部１０が外側に向かって突出して形成されている。即ち、平面視で１つの電極パッド８Ｂの内側部分９ｂは、４つの凸部１０を備えている。 FIG. 3C is a plan view of the ceramic layer c1 on the lower layer side showing the package 1d having a form different from each of the above forms.
As shown in FIG. 3C, the package 1d includes a similar package body 2 and a recess 5, and is a rectangular shape having a horizontally long plan view on each side surface 7 side of a pair of long sides facing each other in the recess 5. The pad body 8z having a rectangular shape, the total length of the side surface 7 of the long side of the pad body 8z, and a part of each side surface 7 of the pair of short sides adjacent thereto, and the inner layer surface. It has a pair (plurality) of electrode pads 8B provided with an inner portion 9b formed along the number 13 in a vertically symmetrical manner.
As shown in the figure, the electrode pad 8B is formed by forming two convex portions 10 apart from each other and projecting outward from the pad main body 8z in a plan view from a horizontally long long side portion of each inner portion 9b. Further, one convex portion 10 is formed so as to project outward from the pad body 8z in a plan view from the middle of the left and right short sides. That is, in a plan view, the inner portion 9b of one electrode pad 8B includes four convex portions 10.

更に、前記パッケージ本体２の裏面４には、平面視で前記一対の電極パッド８Ｂと対向する位置ごとには、横長の図示しない一対の外部接続端子１４が形成されている。かかる外部接続端子１４と、上記電極パッド８Ｂごとの前記凸部１０ごととの間には、図３（Ｃ）に示すように、２本ずつのビア導体１１が形成されている。
そして、図示のように、一対の電極パッド８Ｂごとの前記凹部５内に位置する前記パッド本体８ｚごとの上に跨がって、追って電子部品１６が実装される。
以上のようなパッケージ１ｄによっても、前記効果（１），（２）を得ることができる。
尚、前記パッケージ１ｂ〜１ｄにおける電極パッド８，８Ａ，８Ｂにおける凸部１０を、前記凸部１０ａ〜１０ｃの何れか１つと置き換えた形態としても良い。これらの形態を有するパッケージによっても、前記効果（１），（２）を得ることが可能である。 Further, on the back surface 4 of the package body 2, a pair of horizontally long external connection terminals 14 (not shown) are formed at each position facing the pair of electrode pads 8B in a plan view. As shown in FIG. 3C, two via conductors 11 are formed between the external connection terminal 14 and each of the convex portions 10 of each of the electrode pads 8B.
Then, as shown in the drawing, the electronic component 16 is mounted over the pad main body 8z located in the recess 5 of each pair of electrode pads 8B.
The effects (1) and (2) can also be obtained with the package 1d as described above.
In addition, the convex portion 10 in the electrode pads 8, 8A, 8B in the packages 1b to 1d may be replaced with any one of the convex portions 10a to 10c. The effects (1) and (2) can also be obtained by a package having these forms.

図４（Ａ）は、前記パッケージ１ｂのパッケージ本体２の裏面４において、複数の外部接続端子１４の異なる配置形態を示す底面図である。
前記図３（Ａ）で示した左右一対の電極パッド８とパッケージ本体２の厚み方向で対向した裏面４には、図４（Ａ）に示すように、前記電極パッド８ごとから前記セラミック層ｃ１を貫通して延びた２本ずつのビア導体１１，１２と個別に接続する４つ（合計８つ）の外部接続端子１４が形成されている。これらのうち、パッケージ本体２の対向する一対の側面２ｓ側ごとに位置する４つの外部接続端子１４は、それらの側面側端部が、前記側面２ｓごとに形成された側面導体２４の裏面側端部と個別に接続されている。かかる側面導体２４は、前記同様の金属からなり、少なくとも前記セラミック層ｃ１の厚み方向に沿って形成された水平断面が半円形状の凹溝２３の内壁面に沿って、全体が半円筒形状を呈している。
以上の形態によれば、１つの電極パッド８に対して、複数の外部接続端子１４を電気的に接続し、且つ何れかの前記外部接続端子１４と側面導体２４とが接続した形態とすることで、前記効果（３），（５）を更に得ることができる。
尚、上述した形態は、前記パッケージ１ａ，１ｃ，１ｄにも適用可能である。 FIG. 4A is a bottom view showing different arrangement forms of the plurality of external connection terminals 14 on the back surface 4 of the package main body 2 of the package 1b.
As shown in FIG. 4A, the ceramic layer c1 is formed from each of the electrode pads 8 on the back surface 4 of the pair of left and right electrode pads 8 shown in FIG. 3A and the back surface 4 of the package body 2 facing each other in the thickness direction. Four (a total of eight) external connection terminals 14 are formed which are individually connected to the two via conductors 11 and 12 extending through the above. Of these, the four external connection terminals 14 located on each of the pair of opposite side surface 2s sides of the package body 2 have their side surface side ends formed on each side surface 2s, and the back surface side ends of the side conductor 24. It is individually connected to the unit. The side conductor 24 is made of the same metal as described above, and has a semi-cylindrical shape as a whole along the inner wall surface of the concave groove 23 having a semicircular horizontal cross section formed at least along the thickness direction of the ceramic layer c1. It is presented.
According to the above embodiment, a plurality of external connection terminals 14 are electrically connected to one electrode pad 8, and any of the external connection terminals 14 and the side conductor 24 are connected to each other. Therefore, the above-mentioned effects (3) and (5) can be further obtained.
The above-described form can also be applied to the packages 1a, 1c, and 1d.

図４（Ｂ）は、前記パッケージ１ｄのパッケージ本体２の裏面４において、異なる配置形態である複数の外部接続端子１４，１４ｃを示す底面図である。
前記図３（Ｃ）で示した上下一対の電極パッド８ｚとパッケージ本体２の厚み方向で対向した裏面４の周辺に沿って、図４（Ｂ）に示すように、前記電極パッド８ｚごとから前記セラミック層ｃ１を貫通して延びた８本ずつのビア導体１１と個別に接続する８つ（合計１６つ）の外部接続端子１４が形成されている。更に、上記裏面４の周辺に沿って、平面視が矩形枠状に配置された複数の外部接続端子１４に囲まれた当該裏面４の中央側には、上記一対の電極パッド８ｚの何れか一方と、ビア導体１２を介して個別に接続された８つの中央側の外部接続端子１４ｃが、全体の外形が矩形状となるように形成されている。
以上のような形態によれば、前記（３），（４）を更に得ることができる。
尚、上述した形態は、前記パッケージ１ａ〜１ｃにも適用可能である。 FIG. 4B is a bottom view showing a plurality of external connection terminals 14 and 14c having different arrangement forms on the back surface 4 of the package main body 2 of the package 1d.
As shown in FIG. 4B, from each of the electrode pads 8z, along the periphery of the back surface 4 facing the pair of upper and lower electrode pads 8z shown in FIG. 3C in the thickness direction of the package body 2. Eight (16 in total) external connection terminals 14 are formed which are individually connected to eight via conductors 11 extending through the ceramic layer c1. Further, one of the pair of electrode pads 8z is located on the center side of the back surface 4 surrounded by a plurality of external connection terminals 14 arranged in a rectangular frame shape in a plan view along the periphery of the back surface 4. The eight central external connection terminals 14c individually connected via the via conductor 12 are formed so that the overall outer shape is rectangular.
According to the above-described form, the above (3) and (4) can be further obtained.
The above-described form can also be applied to the packages 1a to 1c.

本発明は、以上において説明した各形態に限定されるものではない。
例えば、前記パッケージ本体を構成するセラミック層は、前記アルミナに限らず、例えば、ムライトや窒化アルミニウムなどの高温同時焼成セラミック、あるいは、例えば、ガラス−セラミックなどの低温同時焼成セラミックからなるものとしても良い。後者からなる場合、前記電極パッド、ビア導体、外部接続端子などの導体の材料には、主に銅または銀が用いられる。
また、前記パッケージ本体２の表面３および裏面４の平面視における外形や、前記凹部５の底面６の平面視における外形は、ほぼ正方形を呈する形態としても良い。かかる形態でも、２つ（一対）または４つの前記電極パッド８，８Ａの何れかを前記パッケージ１ａ，１ｂと同様に配置しても良い。
上述のパッド本体８，８ｘ，８ｙ，８ｚは、矩形状の形態を示したが、これ以外の多角形状を呈する形態であっても良い。
また、上述の凸部１０，１０ａ〜１０ｃは、対応する内側部分９の幅よりも、該凸部１０，１０ａ〜１０ｃの幅を小さい形状としたが、当該凸部１０，１０ａ〜１０ｃの幅を対応する内側部分９の幅よりも大きい形状としても良い。かかる形状の場合でも、前記効果（１）を得ることが可能である。 The present invention is not limited to each of the forms described above.
For example, the ceramic layer constituting the package body is not limited to the alumina, and may be, for example, a high-temperature co-fired ceramic such as mulite or aluminum nitride, or a low-temperature co-fired ceramic such as glass-ceramic. .. When the latter is used, copper or silver is mainly used as the material of the conductor such as the electrode pad, the via conductor, and the external connection terminal.
Further, the outer shape of the front surface 3 and the back surface 4 of the package body 2 in a plan view and the outer shape of the bottom surface 6 of the recess 5 in a plan view may be in a substantially square shape. In such a form, either two (pair) or four of the electrode pads 8 and 8A may be arranged in the same manner as the packages 1a and 1b.
The pad bodies 8, 8x, 8y, and 8z described above have a rectangular shape, but may have a polygonal shape other than the above.
Further, the above-mentioned convex portions 10, 10a to 10c have a shape in which the width of the convex portions 10, 10a to 10c is smaller than the width of the corresponding inner portion 9, but the width of the convex portions 10, 10a to 10c. May be a shape larger than the width of the corresponding inner portion 9. Even in the case of such a shape, the effect (1) can be obtained.

更に、前記パッケージ本体２を構成する下層の前記セラミック層ｃ１は、２層以上のセラミック層を積層して形成しても良く、該セラミック層同士間の内層面には、前記ビア導体１１，１２と適宜接続する内層配線を形成しても良い。
また、前記パッケージ本体２の表面３には、互いに離間する複数の凹部５が開口し、該凹部５内ごとに前記電極パッド８，８Ａ，８Ｂの何れかを配置した形態としても良い。
加えて、前記パッケージ１ａ〜１ｄは、これらの何れか一種類を平面視で縦横に隣接して併設した多数個取りの形態としたものであっても良い。 Further, the lower ceramic layer c1 constituting the package main body 2 may be formed by laminating two or more ceramic layers, and the via conductors 11 and 12 are formed on the inner layer surface between the ceramic layers. An inner layer wiring may be formed to appropriately connect with.
Further, a plurality of recesses 5 that are separated from each other may be opened on the surface 3 of the package body 2, and any of the electrode pads 8, 8A, and 8B may be arranged in each of the recesses 5.
In addition, the packages 1a to 1d may be in the form of a large number of packages 1a to 1d in which any one of them is arranged vertically and horizontally adjacent to each other in a plan view.

本発明によれば、パッケージ本体の表面に開口する凹部（キャビティ）内に液状などの電解質を充填した場合でも、該電解質による金属製の導体部分の腐食が前記凹部の外部へ進展しにくくした液分含有電解質充填用セラミックパッケージを確実に提供できる。 According to the present invention, even when a recess (cavity) that opens on the surface of the package body is filled with an electrolyte such as a liquid, the liquid that prevents corrosion of the metal conductor portion by the electrolyte from extending to the outside of the recess. A ceramic package for filling a component-containing electrolyte can be reliably provided.

１ａ〜１ｄ………………液分含有電解質充填用セラミックパッケージ
２…………………………パッケージ本体
２ｓ………………………側面
３…………………………表面
４…………………………裏面
５…………………………凹部
６…………………………凹部の底面
７…………………………凹部の側面
８，８Ａ、８Ｂ…………電極パッド
８ｘ〜８ｚ………………パッド本体
９，９ａ，９ｂ…………内側部分
１０，１０ａ〜１０ｃ…凸部
１１………………………ビア導体
１３………………………内層面
１４，１４ｃ……………外部接続端子
２０………………………直線部
２１………………………首部
２４………………………側面導体
ｃ１，ｃ２………………セラミック層 1a ~ 1d ……………… Ceramic package for filling electrolyte containing liquid 2 ………………………… Package body 2s ………………………… Side 3 …………………… …… Front side 4 ………………………… Back side 5 ……………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………… …… Concave side surface 8,8A, 8B ………… Electrode pad 8x ～ 8z ……………… Pad body 9,9a, 9b ………… Inner part 10,10a-10c… Convex part 11 ………… ……………… Via conductor 13 ………………………… Inner layer surface 14, 14c ……………… External connection terminal 20 ………………………… Straight part 21 ……………… ……… Neck 24 ………………………… Side conductors c1, c2 ……………… Ceramic layer

Claims (7)

複数のセラミック層を積層してなり、対向する表面および裏面を有するパッケージ本体と、
上記パッケージ本体の表面に開口し、底面および側面を有する凹部と、
上記凹部の底面と、該底面を面方向に延長した上記セラミック層間の内層面と、に亘って形成された複数の電極パッドと、
上記パッケージ本体の裏面に形成された複数の外部接続端子と、を備え、上記凹部内に液分含有電解質が充填される液分含有電解質充填用セラミックパッケージであって、
上記電極パッドは、平面視が多角形状のパッド本体と、上記セラミック層間の内層面に沿って形成された内側部分とを有し、該内側部分と上記パッド本体との境界が上記セラミック層間位置し、前記内側部分は、平面視で上記パッド本体の外側に向かって突出する凸部を有し、
上記凸部と上記外部接続端子との間に、前記パッケージ本体のセラミック層を貫通するビア導体が形成されている、
ことを特徴とする液分含有電解質充填用セラミックパッケージ。 A package body that is made by stacking multiple ceramic layers and has opposite front and back surfaces.
A recess that opens on the surface of the package body and has a bottom surface and side surfaces,
A plurality of electrode pads formed over the bottom surface of the recess and the inner layer surface between the ceramic layers extending the bottom surface in the surface direction.
A ceramic package for filling a liquid-containing electrolyte, comprising a plurality of external connection terminals formed on the back surface of the package body, and filling the recesses with the liquid-containing electrolyte.
The electrode pad has a pad body having a polygonal plan view and an inner portion formed along the inner layer surface between the ceramic layers, and the boundary between the inner portion and the pad body is located between the ceramic layers. The inner portion has a convex portion that protrudes toward the outside of the pad body in a plan view.
A via conductor penetrating the ceramic layer of the package body is formed between the convex portion and the external connection terminal.
A ceramic package for filling a liquid-containing electrolyte. 前記パッド本体は、平面視で矩形状であり、該パッド本体の一部に前記内側部分を有し、平面視において前記凸部の幅は、前記内側部分の幅よりも小さい、
ことを特徴とする請求項１に記載の液分含有電解質充填用セラミックパッケージ。 The pad body has a rectangular shape in a plan view, has the inner portion in a part of the pad body, and the width of the convex portion is smaller than the width of the inner portion in the plan view.
The ceramic package for filling a liquid-containing electrolyte according to claim 1. 前記凸部は、平面視で四角形状、前記パッド本体側と反対側の端辺が幅広の底辺である台形状、あるいは、前記パッド本体側と反対側に前記凹部の側面と平行状な直線部と、該直線部よりも上記パッド本体側に位置する幅狭の首部と、からなる平面視でＴ字形状を呈する、
ことを特徴とする請求項１または２に記載の液分含有電解質充填用セラミックパッケージ。 The convex portion has a quadrangular shape in a plan view and has a trapezoidal shape in which the end side opposite to the pad body side is a wide base, or a straight portion parallel to the side surface of the concave portion on the side opposite to the pad body side. And a narrow neck portion located closer to the pad body side than the straight portion, and exhibiting a T-shape in a plan view.
The ceramic package for filling a liquid-containing electrolyte according to claim 1 or 2. 前記複数の電極パッドの１つに対して、複数の前記外部接続端子が電気的に接続されている、
ことを特徴とする請求項１乃至３の何れか一項に記載の液分含有電解質充填用セラミックパッケージ。 A plurality of the external connection terminals are electrically connected to one of the plurality of electrode pads.
The ceramic package for filling a liquid-containing electrolyte according to any one of claims 1 to 3. 前記複数の前記外部接続端子は、平面視で前記パッケージ本体の裏面における周辺に沿って形成されている、
ことを特徴とする請求項１乃至４の何れか一項に記載の液分含有電解質充填用セラミックパッケージ。 The plurality of external connection terminals are formed along the periphery on the back surface of the package body in a plan view.
The ceramic package for filling a liquid-containing electrolyte according to any one of claims 1 to 4. 前記パッケージ本体の表面および裏面の間に位置する側面には、複数の側面導体が形成され、前記外部接続端子の側面側端部は、前記側面導体の裏面側端部と個別に接続されている、
ことを特徴とする請求項１乃至５の何れか一項に記載の液分含有電解質充填用セラミックパッケージ。 A plurality of side conductors are formed on the side surface located between the front surface and the back surface of the package body, and the side surface side end portion of the external connection terminal is individually connected to the back surface side end portion of the side surface conductor. ,
The ceramic package for filling a liquid-containing electrolyte according to any one of claims 1 to 5. 前記パッケージ本体の裏面には、平面視で該裏面の周辺に沿って形成された複数の前記外部接続端子のほかに、これら周辺側の外部接続端子に囲まれた当該裏面の中央側にも、単数または複数の中央側の外部接続端子が形成されている、
ことを特徴とする請求項１乃至６の何れか一項に記載の液分含有電解質充填用セラミックパッケージ。 On the back surface of the package body, in addition to the plurality of external connection terminals formed along the periphery of the back surface in a plan view, the central side of the back surface surrounded by the external connection terminals on the peripheral side is also present. One or more central external connection terminals are formed,
The ceramic package for filling a liquid-containing electrolyte according to any one of claims 1 to 6, wherein the ceramic package is characterized by the above.
JP2019088105A 2019-01-11 2019-05-08 Ceramic package for filling electrolyte containing liquid Active JP6914293B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US16/659,902 US11309135B2 (en) 2019-01-11 2019-10-22 Ceramic package
EP19219390.2A EP3699938B1 (en) 2019-01-11 2019-12-23 Ceramic package
KR1020190175595A KR102376698B1 (en) 2019-01-11 2019-12-26 Ceramic package for filling with a liquid-containing electrolyte
CN202010022928.5A CN111435652B (en) 2019-01-11 2020-01-09 Ceramic package for electrolyte filling containing liquid component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019003018 2019-01-11
JP2019003018 2019-01-11

Publications (2)

Publication Number Publication Date
JP2020113737A JP2020113737A (en) 2020-07-27
JP6914293B2 true JP6914293B2 (en) 2021-08-04

Family

ID=71668314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019088105A Active JP6914293B2 (en) 2019-01-11 2019-05-08 Ceramic package for filling electrolyte containing liquid

Country Status (2)

Country Link
JP (1) JP6914293B2 (en)
KR (1) KR102376698B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102486356B1 (en) * 2021-03-25 2023-01-09 한국에너지기술연구원 Electrochemical device and method for manufacturing the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1041431A (en) 1996-07-22 1998-02-13 Fuji Denka:Kk Package for airtight sealing
JP2005135726A (en) * 2003-10-30 2005-05-26 Kyocera Corp Case for battery, and battery
JP2005183373A (en) * 2003-11-27 2005-07-07 Kyocera Corp Battery case, manufacturing method thereof and battery, electric double-layer capacitor case and manufacturing method thereof, and electric double-layer capacitor
JP2005191194A (en) * 2003-12-25 2005-07-14 Kyocera Corp Ceramic container and tantalum electrolytic capacitor employing it
US7651813B2 (en) * 2004-11-25 2010-01-26 Kyocera Corporation Container, battery and electric double layer capacitor
JP5415827B2 (en) * 2009-05-19 2014-02-12 ルビコン株式会社 Surface mount devices

Also Published As

Publication number Publication date
KR20200087680A (en) 2020-07-21
JP2020113737A (en) 2020-07-27
KR102376698B1 (en) 2022-03-18

Similar Documents

Publication Publication Date Title
US10886203B2 (en) Packaging structure with recessed outer and inner lead surfaces
TWI419188B (en) Solid electrolytic capacitor
JP6914293B2 (en) Ceramic package for filling electrolyte containing liquid
JP2000228451A (en) Electronic component
JP5791283B2 (en) Electronic component storage package and electronic device including the same
JP3996904B2 (en) Surface mount base for electronic devices
JP4913617B2 (en) Thermo module and manufacturing method thereof
JP7137965B2 (en) Ceramic package for liquid-containing electrolyte filling
EP3699938B1 (en) Ceramic package
JP2020113722A (en) package
JP7182712B2 (en) Electronic component storage packages, electronic devices, and electronic modules
JP5252992B2 (en) Crystal oscillator package and crystal oscillator
JP2018181972A (en) Ceramic substrate
JP6383147B2 (en) package
JP2012174713A (en) Electronic component housing package, and electronic equipment including the same
WO2020218335A1 (en) Electronic component accommodating package, electronic device, and electronic module
JP2015109353A (en) Package
JP6838961B2 (en) Wiring board and its manufacturing method
JP5192860B2 (en) package
JP4511335B2 (en) Multi-circuit board and electronic device
JP5631548B2 (en) Electronic component package
JP5632031B2 (en) Manufacturing method of electronic component package
JP2017175094A (en) Ceramic package
JP2017175527A (en) Ceramic package
WO2015022745A1 (en) Chip-type fuse

Legal Events

Date Code Title Description
RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20200210

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200819

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210615

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210706

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210713

R150 Certificate of patent or registration of utility model

Ref document number: 6914293

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350