JP6905882B2 - Substrate holding device and its manufacturing method - Google Patents

Substrate holding device and its manufacturing method Download PDF

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JP6905882B2
JP6905882B2 JP2017133322A JP2017133322A JP6905882B2 JP 6905882 B2 JP6905882 B2 JP 6905882B2 JP 2017133322 A JP2017133322 A JP 2017133322A JP 2017133322 A JP2017133322 A JP 2017133322A JP 6905882 B2 JP6905882 B2 JP 6905882B2
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electrode
base material
connecting member
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JP2019016702A (en
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淳 土田
淳 土田
北林　徹夫
徹夫 北林
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NGK Spark Plug Co Ltd
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Description

本発明は、電極が埋設された基材を備える基板保持装置およびその製造方法に関する。 The present invention relates to a substrate holding device including a base material in which electrodes are embedded and a method for manufacturing the same.

従来、半導体製造用のウエハ等の基板が載置される基材に発熱抵抗体が埋設された基板保持装置が知られている（例えば、特許文献１参照）。 Conventionally, there is known a substrate holding device in which a heat generating resistor is embedded in a substrate on which a substrate such as a wafer for semiconductor manufacturing is placed (see, for example, Patent Document 1).

特開２０１５−１８７０４号公報Japanese Unexamined Patent Publication No. 2015-18704

基板保持装置においては、基板を適切に加温すべく基材の表面の温度分布の均一化が求められる。 In the substrate holding device, it is required to make the temperature distribution on the surface of the substrate uniform in order to appropriately heat the substrate.

本発明は、以上の点に鑑み、基材の表面の温度分布の均一化を図ることができる基板保持装置を提供することを目的とする。 In view of the above points, an object of the present invention is to provide a substrate holding device capable of making the temperature distribution on the surface of the base material uniform.

［１］上記目的を達成するため、本発明の基板保持装置は、
表面（例えば、実施形態の表面２ａ。以下同一。）と、裏面（例えば、実施形態の裏面２ｂ。以下同一。）とを有する板状のセラミックスからなる基材（例えば、実施形態の基材２。以下同一。）と、
前記基材に埋設された複数の電極（例えば、実施形態の第１から第３の電極３〜５。以下同一。）と、
前記基材の裏面に開口し、前記複数の電極を露出させる穴部（例えば、実施形態の第１穴部６、第２穴部８。以下同一。）と、
前記穴部から露出する、前記複数の電極のうちの少なくとも２つの電極同士を電気的に接続し、前記穴部に配置された接続部材（例えば、実施形態の第１接続部材７、第２接続部材９。以下同一。）と、
を備え、前記基材の表面上に基板（例えば、実施形態の基板。以下同一。）が保持されることを特徴とする。 [1] In order to achieve the above object, the substrate holding device of the present invention is
A base material made of plate-shaped ceramics having a front surface (for example, the front surface 2a of the embodiment; the same applies hereinafter) and a back surface (for example, the back surface 2b of the embodiment; the same applies hereinafter) (for example, the base material 2 of the embodiment). . Same below.) And
A plurality of electrodes embedded in the base material (for example, the first to third electrodes 3 to 5 of the embodiment; the same shall apply hereinafter).
A hole portion (for example, the first hole portion 6 and the second hole portion 8 of the embodiment; the same applies hereinafter) which is opened on the back surface of the base material to expose the plurality of electrodes.
At least two of the plurality of electrodes exposed from the hole are electrically connected to each other, and a connecting member arranged in the hole (for example, the first connecting member 7 and the second connection of the embodiment). Member 9. The same applies hereinafter.)
The substrate (for example, the substrate of the embodiment; the same applies hereinafter) is held on the surface of the substrate.

本発明によれば、基材の表面の温度分布の均一化を図ることができる。 According to the present invention, the temperature distribution on the surface of the base material can be made uniform.

［２］また、本発明の基板保持装置は、
表面（例えば、実施形態の表面２ａ。以下同一。）と、裏面（例えば、実施形態の裏面２ｂ。以下同一。）とを有する板状のセラミックスからなる基材（例えば、実施形態の基材２。以下同一。）と、
前記基材に埋設された一つ又は複数の電極（例えば、実施形態の第１から第３の電極３〜５。以下同一。）と、
前記基材の裏面に開口し、前記一つ又は複数の電極を露出させる穴部（例えば、実施形態の第１穴部６、第２穴部８。以下同一。）と、
前記穴部から露出する、前記一つの電極における離隔した部分同士又は前記複数の電極のうちの少なくとも２つの電極同士を電気的に接続し、前記穴部に配置された接続部材（例えば、実施形態の第１接続部材７、第２接続部材９。以下同一。）と、
を備え、前記基材の表面上に基板（例えば、実施形態の基板。以下同一。）が保持され、
前記接続部材は、前記穴部の深さ方向に沿って延びて前記電極と接続される複数の第１の部分（例えば、実施形態の第１の部分７ａ，９ａ。以下同一。）と、前記電極から間隔を存して前記複数の第１の部分同士を接続する第２の部分（例えば、実施形態の第２の部分７ｂ，９ｂ。以下同一。）と、を有することを特徴とする。 [2] Further, the substrate holding device of the present invention is
A base material made of plate-shaped ceramics having a front surface (for example, the front surface 2a of the embodiment; the same applies hereinafter) and a back surface (for example, the back surface 2b of the embodiment; the same applies hereinafter) (for example, the base material 2 of the embodiment). . Same below.) And
With one or more electrodes embedded in the base material (for example, the first to third electrodes 3 to 5 of the embodiment; the same applies hereinafter).
A hole portion (for example, the first hole portion 6 and the second hole portion 8 of the embodiment; the same applies hereinafter) which is opened on the back surface of the base material to expose the one or more electrodes.
A connecting member (for example, an embodiment) arranged in the hole portion by electrically connecting the separated portions of the one electrode or at least two electrodes of the plurality of electrodes exposed from the hole portion. 1st connecting member 7 and 2nd connecting member 9. The same shall apply hereinafter).
(For example, the substrate of the embodiment; the same shall apply hereinafter) is held on the surface of the substrate.
The connecting member includes a plurality of first portions (for example, first portions 7a, 9a of the embodiment; the same applies hereinafter) extending along the depth direction of the hole portion and connected to the electrode. It is characterized by having a second portion (for example, the second portions 7b, 9b of the embodiment, hereinafter the same) that connects the plurality of first portions to each other with a distance from the electrode.

かかる構成によれば、第２の部分の発熱の影響が基材の表面に伝達され難く、更なる基材の表面の温度分布の均一化を図ることができる。 According to such a configuration, the influence of heat generation in the second portion is difficult to be transmitted to the surface of the base material, and the temperature distribution on the surface of the base material can be further made uniform.

［３］また、本発明においては、前記基材の前記穴部には、前記基材の裏面側から見たときに前記接続部材を覆い隠す蓋部材（例えば、実施形態の蓋部材１０。以下同一。）が設けられていることが好ましい。 [3] Further, in the present invention, the hole portion of the base material has a lid member that covers the connecting member when viewed from the back surface side of the base material (for example, the lid member 10 of the embodiment; It is preferable that the same) is provided.

かかる構成によれば、接続部材を絶縁性部材で覆うことができ、半導体製造プロセスにおいて使用した場合に予期せぬ異常放電の防止とメンテナンス作業時の安全性の向上を図ることができる。 According to such a configuration, the connecting member can be covered with an insulating member, and when used in a semiconductor manufacturing process, unexpected abnormal discharge can be prevented and safety during maintenance work can be improved.

［４］また、本発明においては、前記基材の裏面の外縁よりも内側に筒状のシャフト（例えば、実施形態のシャフト１１。以下同一。）が接続され、前記電極と電気的に接続される端子（例えば、実施形態の端子１２。以下同一。）が、前記シャフトの内周面により画定される内部空間に収容され、前記基材の裏面のうち前記シャフトの外周よりも外側の領域に設けられた前記穴部に前記接続部材が設けられていることが好ましい。 [4] Further, in the present invention, a tubular shaft (for example, the shaft 11 of the embodiment; the same applies hereinafter) is connected inside the outer edge of the back surface of the base material, and is electrically connected to the electrode. (For example, the terminal 12 of the embodiment; the same applies hereinafter) is housed in an internal space defined by the inner peripheral surface of the shaft, and is located in a region of the back surface of the base material outside the outer periphery of the shaft. It is preferable that the connecting member is provided in the provided hole.

かかる構成によれば、電極が接続部材によって、シャフトの外周よりも外側の領域で接続されるため、シャフト内に新たな端子を配置する必要がなく、シャフトが比較的小径であっても電極に接続される端子の空間を十分に確保することができる。 According to such a configuration, since the electrodes are connected by the connecting member in the region outside the outer circumference of the shaft, it is not necessary to arrange new terminals in the shaft, and even if the shaft has a relatively small diameter, the electrodes can be connected. Sufficient space can be secured for the connected terminals.

［５］また、本発明においては、前記接続部材は、ろう材を介して前記電極に接合されていることが好ましい。 [5] Further, in the present invention, it is preferable that the connecting member is joined to the electrode via a brazing material.

かかる構成によれば、端子と電極とをろう材で接合する場合に、同様に接続部材も同一工程内でろう材を用いて電極に接合することができ、基板保持装置の製造作業効率の向上を図ることができる。 According to this configuration, when the terminal and the electrode are joined with a brazing material, the connecting member can also be joined to the electrode with the brazing material in the same process, and the manufacturing work efficiency of the substrate holding device is improved. Can be planned.

［６］また、本方法の発明は、前記基板保持装置の製造方法であって、セラミックス成形体を焼成する焼成工程を経て、前記穴部を有するセラミックス焼結体からなる前記基材を形成する基材形成工程と、前記焼成工程の後に、前記穴部に前記接続部材を挿入し前記接続部材を介して前記一つの電極の離隔した部分同士、又は前記複数の電極のうち少なくとも２つの電極同士を電気的に接続する電極間接続工程と、を備えることを特徴とする。 [6] Further, the present invention is a method for manufacturing the substrate holding device, in which the base material made of the ceramic sintered body having the holes is formed through a firing step of firing the ceramic molded body. After the base material forming step and the firing step, the connecting member is inserted into the hole and the separated portions of the one electrode are separated from each other via the connecting member, or at least two of the plurality of electrodes are separated from each other. It is characterized by comprising an electrode-to-electrode connection step of electrically connecting the ceramics.

本方法の発明によれば、従来よりも基材の表面の温度分布の均一化を図ることができる基板保持装置を製造することができる。 According to the invention of this method, it is possible to manufacture a substrate holding device capable of making the temperature distribution on the surface of the base material more uniform than before.

実施形態の基板保持装置の一部を示す説明的断面図。Explanatory sectional view which shows a part of the substrate holding apparatus of embodiment. 本実施形態の基材の穴部を示す底面図。The bottom view which shows the hole part of the base material of this embodiment. 本実施形態の電極を底面から示す説明図。The explanatory view which shows the electrode of this embodiment from the bottom surface. 本実施形態の第１電極を示す説明図。The explanatory view which shows the 1st electrode of this embodiment. 本実施形態の第２電極を示す説明図。Explanatory drawing which shows the 2nd electrode of this embodiment. 本実施形態の第３電極を示す説明図。The explanatory view which shows the 3rd electrode of this embodiment. 本実施形態の基板保持装置の回路図。The circuit diagram of the board holding device of this embodiment. 比較例の基板保持装置の第１電極を示す説明図。The explanatory view which shows the 1st electrode of the substrate holding apparatus of the comparative example.

図を参照して、実施形態の基板保持装置を説明する。本実施形態の基板保持装置１（例えば、実施形態の基板保持装置１。以下同一。）は、表面２ａ及び裏面２ｂを有する円板状のセラミックス焼結体からなる基材２と、基材２に埋設されたメッシュ状又は箔状の金属体からなる第１から第３の３つの電極３，４，５（発熱抵抗体）と、を備え、基材２の表面２ａに半導体ウエハなどの基板を加熱保持するものである。基材２は、窒化アルミニウムの焼結体である。第１から第３の３つの電極３，４，５は、基材２の表面２ａからの距離が互いに異なる位置に埋設された層状の電極である。 The substrate holding device of the embodiment will be described with reference to the figure. The substrate holding device 1 of the present embodiment (for example, the substrate holding device 1 of the embodiment; the same applies hereinafter) is a base material 2 made of a disk-shaped ceramic sintered body having a front surface 2a and a back surface 2b, and a base material 2. A substrate such as a semiconductor wafer is provided on the surface 2a of the base material 2 with three first to third electrodes 3, 4, 5 (heat generating resistors) made of a mesh-like or foil-like metal body embedded in the base material 2. Is heated and held. The base material 2 is a sintered body of aluminum nitride. The first to third three electrodes 3, 4, and 5 are layered electrodes embedded at positions where the distances from the surface 2a of the base material 2 are different from each other.

基材２には、裏面２ｂに開口し、第１電極３及び第２電極４の一部を露出させる第１穴部６が基材２の基材２の中心を挟んで対称に２か所に形成されている。第１穴部６は、第１電極３、第２電極４の一部をそれぞれ裏面２ｂに露出させる縦穴部分６ａと、第１電極３及び第２電極４から裏面２ｂ側に間隔を存して、縦穴部分６ａ同士を接続する横穴部分６ｂとで構成されている。横穴部分６ｂも裏面２ｂに開口している。第２電極４を露出させる縦穴部分６ａは第１電極３を露出させる縦穴部分６ａよりも深く形成されている。 In the base material 2, there are two first hole portions 6 that are open to the back surface 2b and expose a part of the first electrode 3 and the second electrode 4 symmetrically with the center of the base material 2 of the base material 2 in between. Is formed in. The first hole portion 6 has a vertical hole portion 6a that exposes a part of the first electrode 3 and the second electrode 4 to the back surface 2b, respectively, and a space between the first electrode 3 and the second electrode 4 on the back surface 2b side. It is composed of a horizontal hole portion 6b that connects the vertical hole portions 6a to each other. The lateral hole portion 6b is also opened on the back surface 2b. The vertical hole portion 6a that exposes the second electrode 4 is formed deeper than the vertical hole portion 6a that exposes the first electrode 3.

第１穴部６には、略Ｊ字状の第１接続部材７が配置されている。第１接続部材７は、モリブデン、又はタングステン、鉄にニッケル、コバルトを配合したコバール等の金属体で形成されるもので、基材２の裏面２ｂ側から表面２ａ側に向かって第１穴部６の深さ方向へ延びる柱状の一対の第１の部分７ａ，７ａを備える。一対の第１の部分７ａ，７ａの裏面２ｂ側の端部は、柱状の第２の部分７ｂによって接続されている。一対の第１の部分７ａ，７ａの一方は長く、他方は一方に比べて短く形成されている。そして、短い方の第１の部分７ａは、第１電極３の露出部分に接続されている。また、長い方の第１の部分７ａは、第２電極４の露出部分に接続されている。即ち、第２電極４の露出部分に接続される第１の部分７ａの軸線方向の長さは、第１電極３の露出部分に接続される第１の部分７ａの軸線方向の長さよりも大きい。 A substantially J-shaped first connecting member 7 is arranged in the first hole portion 6. The first connecting member 7 is formed of a metal body such as molybdenum, tungsten, or iron mixed with nickel or cobalt, and has a first hole portion from the back surface 2b side to the front surface 2a side of the base material 2. A pair of columnar first portions 7a, 7a extending in the depth direction of 6 is provided. The ends of the pair of first portions 7a, 7a on the back surface 2b side are connected by a columnar second portion 7b. One of the pair of first portions 7a, 7a is long, and the other is shorter than the other. The shorter first portion 7a is connected to the exposed portion of the first electrode 3. Further, the longer first portion 7a is connected to the exposed portion of the second electrode 4. That is, the axial length of the first portion 7a connected to the exposed portion of the second electrode 4 is larger than the axial length of the first portion 7a connected to the exposed portion of the first electrode 3. ..

更に、基材２には、第１穴部６とは９０度だけ周方向に位置をずらして、裏面２ｂに開口し、第１電極３及びの第３電極５の一部を露出させる第２穴部８が基材２の基材２の中心を挟んで対称に２か所に形成されている。即ち、基材２の裏面には、周方向に向かって等間隔で第１穴部６と第２穴部８とが交互に配置されている。 Further, the base material 2 is displaced from the first hole portion 6 by 90 degrees in the circumferential direction and is opened on the back surface 2b to expose a part of the first electrode 3 and the third electrode 5. The holes 8 are formed symmetrically at two locations with the center of the base material 2 of the base material 2 interposed therebetween. That is, on the back surface of the base material 2, the first hole portions 6 and the second hole portions 8 are alternately arranged at equal intervals in the circumferential direction.

第２穴部８は、第１電極３、第３電極５の一部をそれぞれ裏面２ｂに露出させる縦穴部分８ａと、第１電極３及び第３電極５から裏面２ｂ側に間隔を存して、縦穴部分８ａ同士を接続する横穴部分８ｂとで構成されている。横穴部分８ｂも裏面２ｂに開口している。第３電極５を露出させる縦穴部分８ａは第１電極３を露出させる縦穴部分８ａよりも深く形成されている。 The second hole portion 8 has a vertical hole portion 8a that exposes a part of the first electrode 3 and the third electrode 5 to the back surface 2b, respectively, and a space between the first electrode 3 and the third electrode 5 on the back surface 2b side. , It is composed of a horizontal hole portion 8b that connects the vertical hole portions 8a to each other. The lateral hole portion 8b is also opened on the back surface 2b. The vertical hole portion 8a that exposes the third electrode 5 is formed deeper than the vertical hole portion 8a that exposes the first electrode 3.

第２穴部８には、略Ｊ字状の第２接続部材９が配置されている。第２接続部材９は、モリブデン、又はタングステン、コバール等の金属体で形成されるもので、基材２の裏面２ｂ側から表面２ａ側に向かって第２穴部８の深さ方向へ延びる柱状の一対の第１の部分９ａ，９ａを備える。一対の第１の部分９ａ，９ａの裏面２ｂ側の端部は、柱状の第２の部分９ｂによって接続されている。一対の第１の部分９ａ，９ａの一方は長く、他方は一方に比べて短く形成されている。そして、短い方の第１の部分９ａは、第１電極３の露出部分に接続されている。また、長い方の第１の部分９ａは、第３電極５の露出部分に接続されている。即ち、第３電極５の露出部分に接続される第１の部分９ａの軸線方向の長さは、第１電極３の露出部分に接続される第１の部分９ａの軸線方向の長さよりも大きい。 A substantially J-shaped second connecting member 9 is arranged in the second hole portion 8. The second connecting member 9 is made of a metal body such as molybdenum, tungsten, or Kovar, and has a columnar shape extending from the back surface 2b side of the base material 2 toward the front surface 2a side in the depth direction of the second hole portion 8. A pair of first portions 9a, 9a are provided. The ends of the pair of first portions 9a, 9a on the back surface 2b side are connected by a columnar second portion 9b. One of the pair of first portions 9a, 9a is long, and the other is shorter than the other. The shorter first portion 9a is connected to the exposed portion of the first electrode 3. Further, the longer first portion 9a is connected to the exposed portion of the third electrode 5. That is, the axial length of the first portion 9a connected to the exposed portion of the third electrode 5 is larger than the axial length of the first portion 9a connected to the exposed portion of the first electrode 3. ..

第１穴部６及び第２穴部８には、それぞれ基材２の裏面２ｂ側から見たときに第１接続部材７又は第２接続部材９を覆い隠す蓋部材１０が無機接着剤により取り付けられている。このように、第１接続部材７又は第２接続部材９を絶縁性部材としての蓋部材１０で覆い隠すことにより、基板保持装置１を半導体製造プロセスにおいて使用した場合に予期せぬ異常放電の防止とメンテナンス作業時の安全性の向上を図ることができる。 A lid member 10 that covers the first connecting member 7 or the second connecting member 9 when viewed from the back surface 2b side of the base material 2 is attached to the first hole portion 6 and the second hole portion 8 by an inorganic adhesive, respectively. Has been done. By covering the first connecting member 7 or the second connecting member 9 with the lid member 10 as an insulating member in this way, it is possible to prevent an unexpected abnormal discharge when the substrate holding device 1 is used in the semiconductor manufacturing process. And it is possible to improve the safety during maintenance work.

基材２の裏面２ｂには、裏面２ｂの外縁よりも径方向内側に位置させて、基材２よりも小さい筒状のシャフト１１が接続されている。シャフト１１は窒化アルミニウムの焼結体からなる。 A tubular shaft 11 smaller than the base material 2 is connected to the back surface 2b of the base material 2 so as to be located radially inside the outer edge of the back surface 2b. The shaft 11 is made of a sintered body of aluminum nitride.

また、第２電極４及び第３電極５は、基材２の径方向内側に向かって延びる延長部４ａ，５ａを２つずつ有し、延長部４ａ，５ａにおける基材２の中心側の端部には、シャフト１１内に挿通された端子１２が夫々接続されている。即ち、シャフト１１内には合計４つの端子が挿通されている。 Further, the second electrode 4 and the third electrode 5 have two extension portions 4a and 5a extending inward in the radial direction of the base material 2, and the end of the extension portions 4a and 5a on the center side of the base material 2. Terminals 12 inserted in the shaft 11 are connected to the portions, respectively. That is, a total of four terminals are inserted in the shaft 11.

第１穴部６及び第２穴部８は、シャフト１１の外周１１ａよりも外側の領域に設けられており、第１接続部材７及び第２接続部材９も、シャフト１１の外周１１ａよりも外側の領域に位置している。 The first hole portion 6 and the second hole portion 8 are provided in a region outside the outer circumference 11a of the shaft 11, and the first connecting member 7 and the second connecting member 9 are also outside the outer circumference 11a of the shaft 11. It is located in the area of.

第１接続部材７及び第２接続部材９は、例えば銀ろうなどのろう材を介して第１電極３、第２電極４、第３電極５に夫々接合されている。 The first connecting member 7 and the second connecting member 9 are respectively joined to the first electrode 3, the second electrode 4, and the third electrode 5 via a brazing material such as silver brazing.

図７から明らかなように、実施形態の基板保持装置１では、３つの電極３〜５を結線して６つの発熱抵抗体Ｒ１〜Ｒ６に４つの端子１２から電力を入力している。 As is clear from FIG. 7, in the substrate holding device 1 of the embodiment, the three electrodes 3 to 5 are connected and power is input to the six heat generating resistors R1 to R6 from the four terminals 12.

次に、本実施形態の基板保持装置１の製造方法について説明する。 Next, a method of manufacturing the substrate holding device 1 of the present embodiment will be described.

まず、基材形成工程として、発熱抵抗体となる所定のパターンに形成されたモリブデン製のメッシュからなる電極３〜５を窒化アルミニウム粉末原料中に埋設し、１８００℃で円盤状のセラミックス成形体をホットプレス焼成する焼成工程を経て、第１穴部６及び第２穴部８を有するセラミックス焼結体からなる基材２を形成する。第１穴部６及び第２穴部８は、焼成工程の前にセラミックス成形体に形成してもよく、又は焼成工程後に、セラミックス焼結体に形成してもよい。 First, as a base material forming step, electrodes 3 to 5 made of molybdenum mesh formed in a predetermined pattern to be a heat generating resistor are embedded in an aluminum nitride powder raw material, and a disk-shaped ceramic molded body is formed at 1800 ° C. Through the firing step of hot press firing, the base material 2 made of a ceramics sintered body having the first hole portion 6 and the second hole portion 8 is formed. The first hole portion 6 and the second hole portion 8 may be formed on the ceramic molded body before the firing step, or may be formed on the ceramic sintered body after the firing step.

焼成工程においては、端子位置に電極と一体化したタングステン製の円板体を埋設しておく。円板体を埋設しておくことにより、焼成工程後に穴開け加工するときに電極を突き抜けてしまうことを防止することができる。 In the firing step, a tungsten disk integrated with the electrode is embedded at the terminal position. By embedding the disk body, it is possible to prevent the electrode from penetrating during the drilling process after the firing step.

そして、基材形成工程の後に（即ち、焼成工程の後に）、第１穴部６に第１接続部材７を挿入し第１接続部材７の両端を夫々第１電極３と第２電極４とにろう材を介して接合して、第１電極３と第２電極４とを電気的に接続する（電極間接続工程）。また、第２穴部８に第２接続部材９を挿入し、第２接続部材９の両端を夫々第１電極３と第３電極５とにろう材を介して接合して、第１電極３と第３電極５とを電気的に接続する（電極間接続工程）。端子１２と第２電極４及び第３電極５とをろう材で接合する場合に、同様に第１接続部材７及び第２接続部材９も同一工程内でろう材を用いて電極３〜５に接合することができ、基板保持装置１の製造作業効率の向上を図ることができる。 Then, after the base material forming step (that is, after the firing step), the first connecting member 7 is inserted into the first hole portion 6, and both ends of the first connecting member 7 are connected to the first electrode 3 and the second electrode 4, respectively. The first electrode 3 and the second electrode 4 are electrically connected by joining via a brazing material (inter-electrode connection step). Further, the second connecting member 9 is inserted into the second hole portion 8, and both ends of the second connecting member 9 are joined to the first electrode 3 and the third electrode 5 via a brazing material, respectively, so that the first electrode 3 is used. And the third electrode 5 are electrically connected (connecting step between electrodes). When the terminal 12, the second electrode 4 and the third electrode 5 are joined with a brazing material, similarly, the first connecting member 7 and the second connecting member 9 are also attached to the electrodes 3 to 5 using the brazing material in the same process. It can be joined, and the manufacturing work efficiency of the substrate holding device 1 can be improved.

本実施形態の基板保持装置１によれば、第２の部分７ｂ，９ｂが電極３〜５に対して裏面２ｂ側に向かい間隔を存しており、第１接続部材７及び第２接続部材９の電気抵抗が第１電極３、第２電極４及び第３電極５の電気抵抗よりも十分に小さいため、第１接続部材７及び第２接続部材９からの意図しない発熱を抑制することができる。また、第１接続部材７及び第２接続部材９が発熱したとしても、発熱の影響が基材２の表面２ａに伝達され難く、更なる基材２の表面２ａの温度分布の均一化を図ることができる。 According to the substrate holding device 1 of the present embodiment, the second portions 7b and 9b have a gap toward the back surface 2b side with respect to the electrodes 3 to 5, and the first connecting member 7 and the second connecting member 9 are provided. Since the electric resistance of the first electrode 3, the second electrode 4, and the third electrode 5 is sufficiently smaller than the electric resistance of the first electrode 3, the second electrode 4, and the third electrode 5, unintended heat generation from the first connecting member 7 and the second connecting member 9 can be suppressed. .. Further, even if the first connecting member 7 and the second connecting member 9 generate heat, the influence of the heat generation is difficult to be transmitted to the surface 2a of the base material 2, and the temperature distribution on the surface 2a of the base material 2 is further made uniform. be able to.

また、第１電極３と第２電極４とが第１接続部材７によってシャフト１１の外周１１ａよりも外側の領域で接続され、且つ、第１電極３と第３電極５とが第２接続部材９によってシャフト１１の外周よりも外側の領域で接続される。このため、シャフト１１内に第１電極３、第２電極４及び第３電極５の夫々に個別に給電する新たな端子を設ける必要がなく、第１電極３、第２電極４及び第３電極５に給電する端子の数を減らすことができる。また、シャフト１１内で第１電極３と第２電極４、及び第１電極３と第３電極５を接続する必要がなく、シャフト１１が比較的小径であっても第２電極４及び第３電極５に接続される端子１２の空間を十分に確保することができる。 Further, the first electrode 3 and the second electrode 4 are connected by the first connecting member 7 in a region outside the outer circumference 11a of the shaft 11, and the first electrode 3 and the third electrode 5 are connected to the second connecting member. 9 is connected in a region outside the outer circumference of the shaft 11. Therefore, it is not necessary to provide new terminals for supplying power to the first electrode 3, the second electrode 4, and the third electrode 5 individually in the shaft 11, and the first electrode 3, the second electrode 4, and the third electrode do not need to be provided. The number of terminals that supply power to 5 can be reduced. Further, it is not necessary to connect the first electrode 3 and the second electrode 4 and the first electrode 3 and the third electrode 5 in the shaft 11, and even if the shaft 11 has a relatively small diameter, the second electrode 4 and the third electrode 3 A sufficient space for the terminal 12 connected to the electrode 5 can be secured.

［比較例］
図８は、比較例として、第１電極３’を、第１接続部材７及び第２接続部材９で第２電極４及び第３電極５に接続することなく、シャフト１１の内部まで一部を延ばした延長部３ａ’を設けて構成したものである。この図８に示す比較例の如く第１電極３’を構成した場合には、基材２の表面２ａ側から透視したときに第１電極３’の延長部３ａ’が、第２電極４及び第３電極５の延長部４ａ，５ａと部分的に重なるとともに、延長部３ａ’における基材２の中心側の端部が延長部４ａ，５ａと重ならない。即ち、第１電極３’、第２電極４及び第３電極５の夫々に端子１２が２つずつ接続され、合計６つの端子１２がシャフト１１内に挿通されている。このため、当該重なった部分の基材２の表面２ａの温度が比較的高くなり、表面２ａの温度分布の均一化を図るためには限界がある。また、複数の電極の夫々に接続された端子をシャフト１１内に挿通する必要があるため、シャフト１１の小径化には限界がある。 [Comparison example]
In FIG. 8, as a comparative example, the first electrode 3'is partially connected to the inside of the shaft 11 without being connected to the second electrode 4 and the third electrode 5 by the first connecting member 7 and the second connecting member 9. It is configured by providing an extended extension portion 3a'. When the first electrode 3'is configured as in the comparative example shown in FIG. 8, the extension portion 3a'of the first electrode 3'is the second electrode 4 and when viewed from the surface 2a side of the base material 2. It partially overlaps with the extension portions 4a and 5a of the third electrode 5, and the central end portion of the base material 2 in the extension portion 3a'does not overlap with the extension portions 4a and 5a. That is, two terminals 12 are connected to each of the first electrode 3', the second electrode 4, and the third electrode 5, and a total of six terminals 12 are inserted into the shaft 11. Therefore, the temperature of the surface 2a of the base material 2 in the overlapping portion becomes relatively high, and there is a limit in achieving a uniform temperature distribution on the surface 2a. Further, since it is necessary to insert the terminals connected to the plurality of electrodes into the shaft 11, there is a limit to the reduction in the diameter of the shaft 11.

［その他の実施形態］
上記実施形態においては、３つの電極３，４，５を備える基板保持装置１を用いて説明したが、本発明の基板保持装置の電極は、３つに限らず、一つ又は複数（二つ又は四つ以上）の電極を備えていてもよい。電極が一つの場合には、同一電極内で離隔した部分同士をバイパスさせる個所の接続に接続部材を用いて接続すればよい。 [Other Embodiments]
In the above embodiment, the substrate holding device 1 provided with the three electrodes 3, 4, and 5 has been described, but the number of electrodes of the substrate holding device of the present invention is not limited to three, and one or a plurality (two). Alternatively, it may have four or more electrodes). When there is only one electrode, a connecting member may be used to connect the parts that are separated from each other in the same electrode to bypass each other.

１…基板保持装置、２…基材、２ａ…表面、２ｂ…裏面、３…第１電極、４…第２電極、４ａ…延長部、５…第３電極、５ａ…延長部、６…第１穴部、６ａ…縦穴部分、６ｂ…横穴部分、７…第１接続部材、７ａ…第１の部分、７ｂ…第２の部分、８…第２穴部、８ａ…縦穴部分、８ｂ…横穴部分、９…第２接続部材、９ａ…第１の部分、９ｂ…第２の部分、１０…蓋部材、１１…シャフト、１１ａ…外周、１２…端子。 1 ... Substrate holding device, 2 ... Base material, 2a ... Front surface, 2b ... Back surface, 3 ... First electrode, 4 ... Second electrode, 4a ... Extension part, 5 ... Third electrode, 5a ... Extension part, 6 ... 1 hole part, 6a ... vertical hole part, 6b ... horizontal hole part, 7 ... first connecting member, 7a ... first part, 7b ... second part, 8 ... second hole part, 8a ... vertical hole part, 8b ... horizontal hole Part, 9 ... 2nd connecting member, 9a ... 1st part, 9b ... 2nd part, 10 ... lid member, 11 ... shaft, 11a ... outer circumference, 12 ... terminal.

Claims (6)

表面と、裏面とを有する板状のセラミックスからなる基材と、
前記基材に埋設された複数の電極と、
前記基材の裏面に開口し、前記複数の電極を露出させる穴部と、
前記穴部から露出する、前記複数の電極のうちの少なくとも２つの電極同士を電気的に接続し、前記穴部に配置された接続部材と、
を備え、前記基材の表面上に基板が保持されることを特徴とする基板保持装置。 A base material made of plate-shaped ceramics having a front surface and a back surface,
A plurality of electrodes embedded in the base material and
A hole that opens on the back surface of the base material and exposes the plurality of electrodes,
Exposed from the hole portion, and a connecting member electrically connected, which is arranged in the hole at least two electrodes of the plurality of electrodes,
A substrate holding device comprising the above, wherein the substrate is held on the surface of the base material. 表面と、裏面とを有する板状のセラミックスからなる基材と、
前記基材に埋設された一つ又は複数の電極と、
前記基材の裏面に開口し、前記一つ又は複数の電極を露出させる穴部と、
前記穴部から露出する、前記一つの電極における離隔した部分同士又は前記複数の電極のうちの少なくとも２つの電極同士を電気的に接続し、前記穴部に配置された接続部材と、
を備え、前記基材の表面上に基板が保持され、
前記接続部材は、前記穴部の深さ方向に沿って延びて前記電極と接続される複数の第１の部分と、前記電極から間隔を存して前記複数の第１の部分同士を接続する第２の部分と、を有することを特徴とする基板保持装置。 A base material made of plate-shaped ceramics having a front surface and a back surface,
With one or more electrodes embedded in the substrate,
A hole that opens on the back surface of the base material and exposes the one or more electrodes.
A connecting member that electrically connects the separated portions of the one electrode or at least two of the plurality of electrodes that are exposed from the hole and is arranged in the hole.
The substrate is held on the surface of the substrate,
The connecting member connects a plurality of first portions extending along the depth direction of the hole portion and connected to the electrode, and the plurality of first portions at intervals from the electrode. A substrate holding device comprising a second portion. 請求項１又は請求項２に記載の基板保持装置であって、
前記基材の前記穴部には、前記基材の裏面側から見たときに前記接続部材を覆い隠す蓋部材が設けられていることを特徴とする基板保持装置。 The substrate holding device according to claim 1 or 2.
A substrate holding device characterized in that a lid member that covers the connecting member when viewed from the back surface side of the base material is provided in the hole portion of the base material. 請求項１から請求項３の何れか１項に記載の基板保持装置であって、
前記基材の裏面の外縁よりも内側に筒状のシャフトが接続され、
前記電極と電気的に接続される端子が、前記シャフトの内周面により画定される内部空間に収容され、
前記基材の裏面のうち前記シャフトの外周よりも外側の領域に設けられた前記穴部に前記接続部材が設けられていることを特徴とする基板保持装置。 The substrate holding device according to any one of claims 1 to 3.
A tubular shaft is connected inside the outer edge of the back surface of the base material, and the tubular shaft is connected.
The terminals electrically connected to the electrodes are housed in an internal space defined by the inner peripheral surface of the shaft.
A substrate holding device, wherein the connecting member is provided in a hole provided in a region of the back surface of the base material outside the outer circumference of the shaft. 請求項１から請求項４の何れか１項に記載の基板保持装置であって、
前記接続部材は、ろう材を介して前記電極に接合されていることを特徴とする基板保持装置。 The substrate holding device according to any one of claims 1 to 4.
A substrate holding device, wherein the connecting member is joined to the electrode via a brazing material. 請求項１から請求項５の何れか１項に記載の基板保持装置の製造方法であって、
セラミックス成形体を焼成する焼成工程を経て、前記穴部を有するセラミックス焼結体からなる前記基材を形成する基材形成工程と、
前記焼成工程の後に、前記穴部に前記接続部材を挿入し前記接続部材を介して前記一つの電極の離隔した部分同士、又は前記複数の電極のうち少なくとも２つの電極同士を電気的に接続する電極間接続工程と、を備えることを特徴とする基板保持装置の製造方法。 The method for manufacturing a substrate holding device according to any one of claims 1 to 5.
A base material forming step of forming the base material made of the ceramics sintered body having the hole portion through a firing step of firing the ceramic molded body, and a base material forming step.
After the firing step, the connecting member is inserted into the hole portion, and the separated portions of the one electrode or at least two of the plurality of electrodes are electrically connected to each other via the connecting member. A method for manufacturing a substrate holding device, which comprises an electrode-to-electrode connection step.
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