JP6892517B2 - 成形パネル - Google Patents
成形パネル Download PDFInfo
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- JP6892517B2 JP6892517B2 JP2019550202A JP2019550202A JP6892517B2 JP 6892517 B2 JP6892517 B2 JP 6892517B2 JP 2019550202 A JP2019550202 A JP 2019550202A JP 2019550202 A JP2019550202 A JP 2019550202A JP 6892517 B2 JP6892517 B2 JP 6892517B2
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- 239000012530 fluid Substances 0.000 claims description 259
- 239000011241 protective layer Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 32
- 238000000465 moulding Methods 0.000 claims description 30
- 239000012778 molding material Substances 0.000 claims description 13
- 238000001721 transfer moulding Methods 0.000 claims description 2
- 238000000748 compression moulding Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 16
- 238000007639 printing Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000002032 lab-on-a-chip Methods 0.000 description 4
- 239000000976 ink Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000009897 systematic effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920002392 Novomer Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D99/00—Subject matter not provided for in other groups of this subclass
- B29D99/001—Producing wall or panel-like structures, e.g. for hulls, fuselages, or buildings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/1433—Structure of nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/20—Modules
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
デバイスの例は、流体吐出デバイス、流体センサ、ラボオンチップ(LOC)デバイス、集積流体処理デバイス、微小電気機械システム、及び/又は他の係る微細加工されたデバイスを含むことができる。係る例において、(流体吐出ダイのような)流体ダイは、パネルへ成形されることができ、この場合、成形パネルは、当該パネルを貫通して形成された流体スロットを有することができる。成形パネルは、成形(モールド)材料が投入され得るモールドチェイスを用いて形成され得る。本明細書で説明される例において使用され得る例示的な成形材料は、日立化成株式会社が提供しているCEL400ZHF40WGのようなエポキシ成形化合物、及び/又は他の係る材料を含むことができる。モールドチェイスは、モールドチェイスの流体スロット特徴要素に対応する流体スロットが成形パネルに形成され得るように、流体ダイの流体供給穴と位置合わせされ得る流体スロット特徴要素を有することができる。更に、モールドチェイスを用いた成形パネルの形成中に、モールドチェイスに投入された成形材料が剥離ライナに接触することができるように、剥離ライナがモールドチェイスの内面に配置され得る。例示的な剥離ライナは、ポリフッ化ビニルフィルム(polyvinyl fluoride film:PTFE)及び他の類似した材料のような、様々な材料から形成され得る。
Claims (12)
- 支持体上に流体吐出ダイを配列し、前記流体吐出ダイは、ノズルオリフィスが形成された上面、及び流体供給穴が形成された底面を有し、
成形パネルに少なくとも部分的に埋め込まれた前記流体吐出ダイを含む前記成形パネルを、前記流体吐出ダイの前記流体供給穴と位置合わせされた流体スロット特徴要素を含むモールドチェイスを用いて形成し、前記モールドチェイスが、前記モールドチェイスの内面上に剥離ライナを更に含み、前記成形パネルを形成することは、前記モールドチェイスの前記流体スロット特徴要素の前記内面上の前記剥離ライナを前記流体吐出ダイの前記底面と接触させて、前記流体供給穴を覆うことを含み、
前記成形パネルが前記モールドチェイスの流体スロット特徴要素に対応する、前記成形パネルを貫通して形成された流体スロットを含むように、前記成形パネルから前記モールドチェイス及び剥離ライナを解放して、前記流体スロットが前記流体吐出ダイの前記流体供給穴に流体接続されることを含む、プロセス。 - 前記モールドチェイス及び剥離ライナを解放した後、内部に少なくとも部分的に埋め込まれた前記流体吐出ダイを含む前記成形パネルを前記支持体から解放することを更に含む、請求項1に記載のプロセス。
- 支持体上に流体吐出ダイを配列し、前記流体吐出ダイは、ノズルオリフィスが形成された上面、及び流体供給穴が形成された底面を有し、
前記流体供給穴を覆うために前記流体吐出ダイの前記底面上に保護層を分布させ、
成形パネルに少なくとも部分的に埋め込まれた前記流体吐出ダイを含む前記成形パネルを、前記流体吐出ダイの前記流体供給穴と位置合わせされた流体スロット特徴要素を含むモールドチェイスを用いて形成し、前記モールドチェイスが、前記モールドチェイスの内面上に剥離ライナを更に含み、前記成形パネルを形成することは、前記保護層を前記モールドチェイスの前記流体スロット特徴要素の前記内面上の前記剥離ライナと係合させて前記保護層を変形させ、前記流体供給穴の上にシールを形成することを含み、
前記成形パネルが前記モールドチェイスの流体スロット特徴要素に対応する、前記成形パネルを貫通して形成された流体スロットを含むように、前記成形パネルから前記モールドチェイス及び剥離ライナを解放し、
前記流体スロットと前記流体吐出ダイの前記流体供給穴とが流体接続されるように、前記流体吐出ダイの前記底面から前記保護層を除去することを含む、プロセス。 - 前記流体吐出ダイの前記底面上に分布された前記保護層の高さが、約1μm〜約20μmの範囲内である、請求項3に記載のプロセス。
- 前記保護層を除去した後、内部に少なくとも部分的に埋め込まれた前記流体吐出ダイを含む前記成形パネルを前記支持体から解放することを更に含む、請求項3又は4に記載のプロセス。
- 支持体上に複数の流体吐出ダイを配列し、各流体吐出ダイが、その流体供給穴の上にその後面上に配置された保護層を有し、
前記複数の流体吐出ダイを含む成形パネルを、モールドチェイス及び前記モールドチェイスに結合された剥離ライナを用いて形成し、前記剥離ライナが前記モールドチェイスの内面を覆い、前記モールドチェイスが、個々の流体吐出ダイの流体供給穴と位置合わせされた、前記複数の流体吐出ダイの個々の流体吐出ダイに対する個々の流体スロット形成特徴要素を有し、前記成形パネルを形成することは、前記個々の流体吐出ダイの前記保護層を前記個々の流体スロット形成特徴要素の表面と係合させて前記保護層を変形させ、前記個々の流体吐出ダイの前記流体供給穴の上に保護シールを形成することを含み、
前記成形パネルが前記モールドチェイスの個々の流体スロット形成特徴要素に対応し且つ前記個々の流体吐出ダイの流体供給穴と位置合わせされた、前記成形パネルを貫通して形成された個々の流体スロットを有するように、前記成形パネルから前記モールドチェイス及び剥離ライナを解放し、
前記個々の流体吐出ダイ上に配置された前記保護層を除去することを含み、前記除去することにより、前記個々の流体吐出ダイの流体供給穴が、前記成形パネルを貫通して形成された個々の流体スロットに流体接続される、プロセス。 - 前記個々の流体吐出ダイの前記保護層を前記個々の流体スロット形成特徴要素の表面と係合させることが、前記個々の流体スロット形成特徴要素の表面を覆う前記剥離ライナと前記個々の流体吐出ダイの前記保護層を係合させることを含む、請求項6に記載のプロセス。
- 前記成形パネルを形成することが、前記モールドチェイスにおいて成形材料を圧縮成形またはトランスファー成形することを含む、請求項6又は7に記載のプロセス。
- 前記支持体から前記複数の流体吐出ダイを含む前記成形パネルを解放することを更に含む、請求項6〜8の何れか1項に記載のプロセス。
- 前記成形パネルを単一化することを更に含み、前記単一化により、それぞれが少なくとも1つの流体吐出ダイを含む流体吐出デバイスが形成される、請求項6〜9の何れか1項に記載のプロセス。
- 個々の流体吐出デバイスは、前記個々の流体吐出デバイスの幅に沿って千鳥配列構成で端から端まで全般的に配列された一組の流体吐出デバイスを含む、請求項10に記載のプロセス。
- 前記流体吐出ダイ上に分布された前記保護層の高さが、約1μm〜約20μmの範囲内である、請求項6〜11の何れか1項に記載のプロセス。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2017/030374 WO2018203872A1 (en) | 2017-05-01 | 2017-05-01 | Molded panels |
Publications (2)
Publication Number | Publication Date |
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JP2020511337A JP2020511337A (ja) | 2020-04-16 |
JP6892517B2 true JP6892517B2 (ja) | 2021-06-23 |
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JP2019550202A Active JP6892517B2 (ja) | 2017-05-01 | 2017-05-01 | 成形パネル |
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US (3) | US11577456B2 (ja) |
EP (1) | EP3573812B1 (ja) |
JP (1) | JP6892517B2 (ja) |
CN (1) | CN110461575B (ja) |
WO (1) | WO2018203872A1 (ja) |
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EP3573812B1 (en) * | 2017-05-01 | 2023-01-04 | Hewlett-Packard Development Company, L.P. | Molded panels |
WO2023140856A1 (en) * | 2022-01-21 | 2023-07-27 | Hewlett-Packard Development Company, L.P. | Polymer based conductive paths for fluidic dies |
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-
2017
- 2017-05-01 EP EP17908567.5A patent/EP3573812B1/en active Active
- 2017-05-01 WO PCT/US2017/030374 patent/WO2018203872A1/en unknown
- 2017-05-01 CN CN201780088946.XA patent/CN110461575B/zh active Active
- 2017-05-01 JP JP2019550202A patent/JP6892517B2/ja active Active
- 2017-05-01 US US16/495,472 patent/US11577456B2/en active Active
-
2023
- 2023-01-17 US US18/098,094 patent/US20230150199A1/en active Pending
- 2023-01-17 US US18/098,089 patent/US20230150198A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20230150199A1 (en) | 2023-05-18 |
CN110461575A (zh) | 2019-11-15 |
US20200094475A1 (en) | 2020-03-26 |
EP3573812A4 (en) | 2020-09-23 |
EP3573812A1 (en) | 2019-12-04 |
CN110461575B (zh) | 2021-10-01 |
EP3573812B1 (en) | 2023-01-04 |
WO2018203872A1 (en) | 2018-11-08 |
JP2020511337A (ja) | 2020-04-16 |
US11577456B2 (en) | 2023-02-14 |
US20230150198A1 (en) | 2023-05-18 |
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