JP6849558B2 - Electronic component storage packages and electronic devices - Google Patents

Electronic component storage packages and electronic devices Download PDF

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JP6849558B2
JP6849558B2 JP2017163980A JP2017163980A JP6849558B2 JP 6849558 B2 JP6849558 B2 JP 6849558B2 JP 2017163980 A JP2017163980 A JP 2017163980A JP 2017163980 A JP2017163980 A JP 2017163980A JP 6849558 B2 JP6849558 B2 JP 6849558B2
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conductor layer
electronic component
insulator
frame portion
component storage
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JP2019041072A (en
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絵美 向井
絵美 向井
博司 柴山
博司 柴山
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Kyocera Corp
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Description

本発明は、光半導体素子等の電子部品が電気的に接続される導体層を有する電子部品収納用パッケージおよび電子装置に関する。 The present invention relates to an electronic component storage package and an electronic device having a conductor layer to which electronic components such as an optical semiconductor element are electrically connected.

電子部品を収容する電子部品収納用パッケージは、電子部品が収容される基体と、基体に収容される電子部品を外部接続するための導体層とを有している（例えば特許文献１を参照）。導体層は、基体の外面に位置する部分を有している。基体の外面に位置する導体層が外部電気回路と電気的に接続されて、電子部品と外部電気回路都が電気的に接続される。基体のうち導体層が位置する部分は、例えばセラミック材料等の絶縁体からなり、導体層が配置された突出部分を有している。この場合の絶縁体は、導体層とともに入出力端子としても機能する（例えば特許文献２を参照）。 The electronic component storage package that houses the electronic components has a substrate that houses the electronic components and a conductor layer for externally connecting the electronic components housed in the substrate (see, for example, Patent Document 1). .. The conductor layer has a portion located on the outer surface of the substrate. The conductor layer located on the outer surface of the substrate is electrically connected to the external electric circuit, and the electronic component and the external electric circuit city are electrically connected. The portion of the substrate on which the conductor layer is located is made of an insulator such as a ceramic material, and has a protruding portion on which the conductor layer is arranged. The insulator in this case also functions as an input / output terminal together with the conductor layer (see, for example, Patent Document 2).

特開2012−108283号公報Japanese Unexamined Patent Publication No. 2012-108283 特開2017−120901号公報JP-A-2017-120901

上記電子部品収納用パッケージにおいて、基体の外面に帯状の複数の導体層が直接に配置される場合がある。これらの導体層は、電子部品の信号電極と電気的に接続されるものであり、高密度で配置される場合が多い。そのため、複数の導体層を、対応する外部電気回路に正しく位置合せして接続させることが難しい。 In the electronic component storage package, a plurality of strip-shaped conductor layers may be directly arranged on the outer surface of the substrate. These conductor layers are electrically connected to the signal electrodes of electronic components and are often arranged at high density. Therefore, it is difficult to correctly align and connect the plurality of conductor layers to the corresponding external electric circuits.

本発明の１つの態様の電子部品収納用パッケージは、凹部を含む上面および該凹部を囲む枠部を有し、該枠部の少なくとも一部が絶縁体である基体と、前記絶縁体において前記枠部の内面および外面に位置している複数の導体層とを備えており、該複数の導体層のうち前記枠部の外面に位置している導体層は、それぞれ第１端部および該第１端部と反対側の第２端部を有しているとともに前記第１端部同士が互いに隣り合うように線幅方向に互いに離れて配列された複数の信号線路を含んでおり、それぞれの前記信号線路が、前記第１端部において前記枠部の外面に沿って突出した凸部を有している。 The electronic component storage package of one aspect of the present invention has an upper surface including a recess and a frame portion surrounding the recess, and a substrate in which at least a part of the frame portion is an insulator and the frame in the insulator. A plurality of conductor layers located on the inner surface and the outer surface of the portion are provided, and among the plurality of conductor layers, the conductor layers located on the outer surface of the frame portion are the first end portion and the first portion, respectively. It has a second end on the opposite side of the end and includes a plurality of signal lines arranged apart from each other in the line width direction so that the first ends are adjacent to each other. The signal line has a convex portion protruding along the outer surface of the frame portion at the first end portion.

本発明の１つの態様の電子部品収納用パッケージによれば、上記構成であることから、導体層の外部電気回路に対する位置合せが容易であり、位置合せの精度の向上も容易な電子部品収納用パッケージを提供することができる。 According to the electronic component storage package of one aspect of the present invention, since it has the above configuration, it is easy to align the conductor layer with respect to the external electric circuit, and it is easy to improve the alignment accuracy. Package can be provided.

本発明の電子装置によれば、上記構成の電子部品収納用パッケージを含むことから、導体層を外部電気回路に対して高い位置精度で容易に接続することができる電子装置を提供することができる。 According to the electronic device of the present invention, since the electronic component storage package having the above configuration is included, it is possible to provide an electronic device capable of easily connecting the conductor layer to an external electric circuit with high position accuracy. ..

（ａ）は、本発明の実施形態の電子部品収納用パッケージを絶縁体側から見た斜視図であり、（ｂ）は（ａ）の反対側から見た斜視図である。(A) is a perspective view of the electronic component storage package of the embodiment of the present invention seen from the insulator side, and (b) is a perspective view seen from the opposite side of (a). 本発明の実施形態の電子部品収納用パッケージを示す分解斜視図である。It is an exploded perspective view which shows the electronic component storage package of embodiment of this invention. （ａ）は、発明の実施形態の電子部品収納用パッケージを示す平面図であり、（ｂ）は（ａ）の長辺側の側面図であり、（ｃ）は（ａ）の短辺側の側面図である。(A) is a plan view showing the electronic component storage package of the embodiment of the invention, (b) is a side view of the long side of (a), and (c) is the short side of (a). It is a side view of. 本発明の実施形態の電子部品収納用パッケージにおける要部を拡大して示す側面図である。It is a side view which shows the main part in the electronic component storage package of embodiment of this invention in an enlarged manner. 本発明の実施形態の電子装置を示す平面図である。It is a top view which shows the electronic device of embodiment of this invention. 本発明の実施形態の電子装置を示す斜視図である。It is a perspective view which shows the electronic device of embodiment of this invention. （ａ）は本発明の変形例の電子部品収納用パッケージを示す側面図であり、（ｂ）は（ａ）の要部を拡大して示す側面図である。(A) is a side view showing a package for storing electronic components of a modified example of the present invention, and (b) is an enlarged side view showing a main part of (a).

本発明の電子部品収納用パッケージおよび電子装置について、図面を参照して説明する。図１（ａ）は、本発明の実施形態の電子部品収納用パッケージを絶縁体側から見た斜視図であり、図１（ｂ）は図１（ａ）の反対側から見た斜視図である。図２は、本発明の実施形態の電子部品収納用パッケージを示す分解斜視図である。図３（ａ）は、発明の実施形態の電子部品収納用パッケージを示す平面図であり、図３（ｂ）は図３（ａ）の長辺側の側面図であり、図３（ｃ）は図３（ａ）の短辺側の側面図である。図４は、本発明の実施形態の電子部品収納用パッケージにおける要部を拡大して示す側面図である。図５は、本発明の実施形態の電子装置を示す平面図である。図６は、本発明の実施形態の電子装置を示す斜視図である。 The electronic component storage package and the electronic device of the present invention will be described with reference to the drawings. FIG. 1A is a perspective view of the electronic component storage package according to the embodiment of the present invention as viewed from the insulator side, and FIG. 1B is a perspective view seen from the opposite side of FIG. 1A. .. FIG. 2 is an exploded perspective view showing a package for storing electronic components according to an embodiment of the present invention. FIG. 3A is a plan view showing a package for storing electronic components according to an embodiment of the invention, FIG. 3B is a side view of the long side of FIG. 3A, and FIG. 3C is a side view. Is a side view of the short side of FIG. 3A. FIG. 4 is an enlarged side view showing a main part of the electronic component storage package according to the embodiment of the present invention. FIG. 5 is a plan view showing an electronic device according to an embodiment of the present invention. FIG. 6 is a perspective view showing an electronic device according to an embodiment of the present invention.

本発明の実施形態の電子部品収納用パッケージ10は、凹部１ａを含む上面および凹部１ａを囲む枠部１ｂを有し、枠部１ｂの少なくとも一部が絶縁体１ｂａである基体１を備えている。また、この電子部品収納用パッケージ10は、絶縁体１ｂａにおいて枠部１ｂの内面および外面に位置している複数の導体層２を備えている。複数の導体層２のうち枠部１ｂ（絶縁体１ｂａ）外面に位置している導体層２は、それぞれ第１端部２Ａａおよび第１端部２Ａａと反対側の第２端部２Ａｂを有しているとともに第１端部２Ａａ同士が互いに隣り合うように線幅方向に互いに離れて配列された複数の信号線路２Ａを含んでいる。それぞれの信号線路２Ａが、第１端部２Ａａにおいて枠部１ｂの外面に沿って突出した凸部２Ａｃを有している。本発明の実施形態の電子装置20は、上記構成の電子部品収納用パッケージ10と、凹部１ａ内に収容されて導体層２と電気的に接続された電子部品11とを備えている。 The electronic component storage package 10 of the embodiment of the present invention has a frame portion 1b including an upper surface including a recess 1a and a frame portion 1b surrounding the recess 1a, and includes a substrate 1 in which at least a part of the frame portion 1b is an insulator 1ba. .. Further, the electronic component storage package 10 includes a plurality of conductor layers 2 located on the inner surface and the outer surface of the frame portion 1b in the insulator 1ba. Of the plurality of conductor layers 2, the conductor layer 2 located on the outer surface of the frame portion 1b (insulator 1ba) has a first end portion 2Aa and a second end portion 2Ab opposite to the first end portion 2Aa, respectively. In addition, the first end 2Aa includes a plurality of signal lines 2A arranged apart from each other in the line width direction so as to be adjacent to each other. Each signal line 2A has a convex portion 2Ac protruding along the outer surface of the frame portion 1b at the first end portion 2Aa. The electronic device 20 according to the embodiment of the present invention includes an electronic component storage package 10 having the above configuration, and an electronic component 11 housed in the recess 1a and electrically connected to the conductor layer 2.

基体１は、電子部品を収容する筐体として機能する。例えば、凹部１ａ内に電子部品11が収容され、凹部１ａの開口部分が後述する蓋体12等で塞がれる。このときには、凹部１ａおよび蓋体12等で構成される容器（容器としては符号なし）内に電子部品11が気密封止される。基体１は、平面視で長方形状であり、上面に凹部１ａを有する直方体状の部材である。蓋体12は、例えばシーム溶接等の接合法で基体１（後述する枠部１ｂの金属筐体１ｂｂ上面）に接合される。 The substrate 1 functions as a housing for accommodating electronic components. For example, the electronic component 11 is housed in the recess 1a, and the opening portion of the recess 1a is closed by a lid 12 or the like described later. At this time, the electronic component 11 is airtightly sealed in a container (unmarked as a container) composed of the recess 1a, the lid 12, and the like. The substrate 1 is a rectangular parallelepiped member having a rectangular shape in a plan view and having a recess 1a on the upper surface. The lid 12 is joined to the substrate 1 (the upper surface of the metal housing 1bb of the frame portion 1b described later) by a joining method such as seam welding.

基体１は、少なくとも一部が絶縁体１ｂａである。絶縁体１ｂａは、信号線路２Ａ等の複数の導体層２を互いに電気的に絶縁させて保持する機能を有している。すなわち、基体１の枠部１ｂが絶縁体１ｂａを含んでいることにより、枠部１ｂの外面および内面等の表面に沿って複数の信号線路２Ａを配置することができる。これによって、例えば電子部品11が有する複数の信号電極（図示せず）とそれぞれに電気的に接続される複数の信号線路２Ａを、基体１に配置することが可能になっている。 At least a part of the substrate 1 is an insulator 1ba. The insulator 1ba has a function of electrically insulating and holding a plurality of conductor layers 2 such as a signal line 2A from each other. That is, since the frame portion 1b of the substrate 1 contains the insulator 1ba, a plurality of signal lines 2A can be arranged along the surfaces such as the outer surface and the inner surface of the frame portion 1b. This makes it possible to arrange, for example, a plurality of signal electrodes (not shown) of the electronic component 11 and a plurality of signal lines 2A electrically connected to each of them on the substrate 1.

例えば図１および図２に示すように、本実施形態の電子部品収納用パッケージ10における枠部１ｂは、切欠き部１ｂｃを有する金属筐体１ｂｂを含んでいる。切欠き部１ｂｃは、平面視において長方形状の金属筐体１ｂｂの１つの短辺側に位置し、短辺の全長と、これに隣り合う２つの長辺の端部分とを切り欠いている。また、切欠き部１ｂｃは、金属筐体１ｂｂの下部のみを切り欠いていて、切欠き部１ｂｃの上側で金属筐体１ｂｂは枠状に連続している。 For example, as shown in FIGS. 1 and 2, the frame portion 1b in the electronic component storage package 10 of the present embodiment includes a metal housing 1bb having a notch portion 1bc. The cutout portion 1bc is located on one short side side of the rectangular metal housing 1bb in a plan view, and cuts out the entire length of the short side and the end portions of the two long sides adjacent to the short side. Further, the notch portion 1bc cuts out only the lower part of the metal housing 1bb, and the metal housing 1bb is continuous in a frame shape on the upper side of the notch portion 1bc.

この切欠き部１ｂｃ内に絶縁体１ｂａが位置している。すなわち、金属筐体１ｂｂの切欠き部１ｂｃが絶縁体１ｂａによって塞がれている。言い換えれば、金属筐体１ｂｂと絶縁体１ｂａとが一体になって、電子部品11等を囲む枠状の部材（枠部１ｂ）が形成されている。 The insulator 1ba is located in the notch 1bc. That is, the notch 1bc of the metal housing 1bb is closed by the insulator 1ba. In other words, the metal housing 1bb and the insulator 1ba are integrated to form a frame-shaped member (frame portion 1b) that surrounds the electronic component 11 and the like.

また、この実施形態の基体１は、枠部１ｂの下側の開口を塞ぐ基部１ｃを有している。枠部１ｂの内側面と基部１ｃの上面とによって、凹部１ａが構成されている。なお、図２では、基部１ｃと枠部１ｂとが別体として示されている。基体１は、このような形態に限定されるものではなく、例えば、枠部１ｂの金属筐体１ｂｂと基部１ｃとが一体的に形成されていても構わない。この場合には、枠部１ｂの金属筐体１ｂｂとは、互いに同じ金属材料からなるものでもよい。 Further, the substrate 1 of this embodiment has a base portion 1c that closes an opening on the lower side of the frame portion 1b. The recess 1a is formed by the inner surface of the frame portion 1b and the upper surface of the base portion 1c. In FIG. 2, the base portion 1c and the frame portion 1b are shown as separate bodies. The substrate 1 is not limited to such a form, and for example, the metal housing 1bb of the frame portion 1b and the base portion 1c may be integrally formed. In this case, the metal housing 1bb of the frame portion 1b may be made of the same metal material as each other.

なお、この実施形態の電子部品収納用パッケージ10および電子装置20においては、金属筐体１ｂｂのうち切欠き部１ｂｃと反対側の側壁部分に貫通孔１ｄが設けられている。貫通孔１ｄは、例えば、凹部１ａの内側と外側との間を光接続するための部材を挿入させて固定するためのスペースとして機能する。貫通孔１ｄを通して光ファイバ（図示せず）を含む光接続用の部材を配置すれば、凹部１ａの内外で光信号の送受が可能になる。また、貫通孔１ｄが光接続部材で塞がれれば、電子部品11を収容する容器を有効に気密封止することもできる。 In the electronic component storage package 10 and the electronic device 20 of this embodiment, a through hole 1d is provided in the side wall portion of the metal housing 1bb opposite to the notch portion 1bc. The through hole 1d functions as, for example, a space for inserting and fixing a member for optical connection between the inside and the outside of the recess 1a. If a member for optical connection including an optical fiber (not shown) is arranged through the through hole 1d, an optical signal can be transmitted and received inside and outside the recess 1a. Further, if the through hole 1d is closed with the optical connection member, the container accommodating the electronic component 11 can be effectively airtightly sealed.

枠部１ｂの金属筐体１ｂｂおよび基部１ｃは、例えば、鉄−ニッケル合金、鉄−ニッケル−コバルト合金、銅−タングステン合金またはステンレス鋼等の金属材料によって形成されている。金属筐体１ｂｂおよび基部１ｃは、例えば、上記金属材料の原材に圧延加工、打ち抜き加工、研磨加工、研削加工およびエッチング加工等の加工法から適宜選択された加工を施して所定形状に成形することにより、製作することができる。金属筐体１ｂｂおよび基部１ｃを別体として製作したときには、例えば、これらをろう材等の接合材を介して互いに接合することによって、金属筐体１ｂｂおよび基部１ｃとが一体化した、基体１の一部（絶縁体１ｂａ以外の金属部分）を製作することができる。 The metal housing 1bb and the base 1c of the frame portion 1b are formed of a metal material such as an iron-nickel alloy, an iron-nickel-cobalt alloy, a copper-tungsten alloy, or stainless steel. The metal housing 1bb and the base 1c are formed into a predetermined shape by subjecting the raw material of the metal material to a process appropriately selected from processing methods such as rolling, punching, polishing, grinding and etching. By doing so, it can be manufactured. When the metal housing 1bb and the base 1c are manufactured as separate bodies, for example, the metal housing 1bb and the base 1c are integrated by joining them to each other via a bonding material such as a brazing material. A part (a metal part other than the insulator 1ba) can be manufactured.

また、金属筐体１ｂｂおよび基部１ｃは、その露出表面にニッケル層および金層等を含むめっき層が被着されていてもよい。この場合、金属筐体１ｂｂおよび基部１ｃの酸化を抑制することができる。また、上記ろう付けの際に、ろう材の濡れ性を向上させることができる。これにより、基体１を含む電子部品収納用パッケージ10の長期信頼性の向上、および金属筐体１ｂｂと基部１ｃとの接合強度、つまり基体１の機械的強度の向上等が容易になる。また、電子部品11の気密封止の信頼性向上に対しても有効である。 Further, the metal housing 1bb and the base portion 1c may be coated with a plating layer including a nickel layer, a gold layer and the like on the exposed surface thereof. In this case, oxidation of the metal housing 1bb and the base 1c can be suppressed. In addition, the wettability of the brazing material can be improved during the above brazing. As a result, it becomes easy to improve the long-term reliability of the electronic component storage package 10 including the base 1, and to improve the joint strength between the metal housing 1bb and the base 1c, that is, the mechanical strength of the base 1. It is also effective in improving the reliability of the airtight sealing of the electronic component 11.

前述したように、絶縁体１ｂａは、複数の導体層２が配置される部材である。また、絶縁体１ｂａは、金属筐体１ｂｂの切欠き部１ｂｃを塞ぐ部材である。すなわち、絶縁体１ｂａは、凹部１ａの内外を電気的に導通する入出力端子を構成する部材である。この形態において、絶縁体１ｂａは、凹部１ａの内側に位置する部分と外側に位置する部分とを含んでいる。絶縁体１ｂａのうち凹部１ａ内に位置する部分に配置された導体層２は、例えば、電子部品11と電気的に接続される端子として機能する。また、絶縁体１ｂａのうち凹部１ａ外に位置する部分に配置された導体層２は、例えば、外部電気回路（図示せず）と電気的に接続される端子として機能する。電子部品11（電子部品11本体上面に位置する電極等）と導体層２との電気的な接続は、例えばボンディングワイヤ等の導電性接続材を介して行なわせることができる。 As described above, the insulator 1ba is a member on which a plurality of conductor layers 2 are arranged. Further, the insulator 1ba is a member that closes the cutout portion 1bc of the metal housing 1bb. That is, the insulator 1ba is a member constituting an input / output terminal that electrically conducts the inside and outside of the recess 1a. In this form, the insulator 1ba includes a portion located inside and a portion located outside the recess 1a. The conductor layer 2 arranged in the portion of the insulator 1ba located in the recess 1a functions as, for example, a terminal electrically connected to the electronic component 11. Further, the conductor layer 2 arranged in the portion of the insulator 1ba located outside the recess 1a functions as, for example, a terminal electrically connected to an external electric circuit (not shown). The electrical connection between the electronic component 11 (the electrode or the like located on the upper surface of the main body of the electronic component 11) and the conductor layer 2 can be made via a conductive connecting material such as a bonding wire.

切欠き部１ｂｃにおける絶縁体１ｂａと金属筐体１ｂｂとの接合は、例えば、銀ろう等のろう材を介して行なわれる。この場合、ろう材を介して金属筐体１ｂｂの切欠き部１ｂｃ内に絶縁体１ｂａをろう材で挟んでセットし、ジグ等で仮固定しながら電気炉で加熱することによって、絶縁体１ｂａと金属筐体１ｂｂとを接合させることができる。絶縁体１ｂａのうち金属筐体１ｂｂと接合される部分に、ろう付け用の下地金属層（図示せず）をメタライズ法等の方法で設けておいてもよい。 The bonding of the insulator 1ba and the metal housing 1bb in the notch portion 1bc is performed, for example, through a brazing material such as silver wax. In this case, the insulator 1ba is sandwiched between the brazing materials and set in the notch 1bc of the metal housing 1bb via the brazing material, and heated in an electric furnace while temporarily fixing with a jig or the like to obtain the insulator 1ba. It can be joined to the metal housing 1bb. A base metal layer (not shown) for brazing may be provided on a portion of the insulator 1ba to be joined to the metal housing 1bb by a method such as a metallizing method.

絶縁体１ｂａのうち凹部１ａ内の導体層と凹部１ａ外の導体層とが、絶縁体１ｂａの内部または表面に設けられた導体層（図示せず）を介して互いに電気的に接続されていれば、導体層２を介して、電子部品11と外部電気回路都との電気的な接続を行なわせることができる。このときに、凹部１ａ外に位置する絶縁体１ｂａの側面に設けられた導体層２は、信号線路２Ａを含んでいる。信号線路２Ａは、電子部品11と外部電気回路都との間で信号を伝送する機能を有する。また、信号線路２Ａは、上記のように外部電気回路都との接続用の端子としても機能する。 Of the insulator 1ba, the conductor layer inside the recess 1a and the conductor layer outside the recess 1a are electrically connected to each other via a conductor layer (not shown) provided inside or on the surface of the insulator 1ba. For example, the electronic component 11 and the external electric circuit city can be electrically connected via the conductor layer 2. At this time, the conductor layer 2 provided on the side surface of the insulator 1ba located outside the recess 1a includes the signal line 2A. The signal line 2A has a function of transmitting a signal between the electronic component 11 and the external electric circuit city. Further, the signal line 2A also functions as a terminal for connection with the external electric circuit city as described above.

複数の導体層２のうち枠部１ｂの外面、つまり絶縁体１ｂａの外面に位置している導体層２は、複数の信号線路２Ａを含んでいる。複数の信号線路２Ａは、それぞれ第１端部２Ａａおよび第１端部２Ａａと反対側の第２端部２Ａｂを有しているとともに第１端部２Ａａ同士が互いに隣り合うように線幅方向に互いに離れて配列されている。また、例えば図４等に示すように、それぞれの信号線路２Ａが、第１端部２Ａａにおいて枠部１ｂの外面に沿って突出した凸部２Ａｃを有している。このような電子部品収納用パッケージ10によれば、凸部２Ａｃを基準にして導体層２の第１端部２Ａａを含む部位に、外部電気回路を容易に、高い精度で位置合せすることができる。 Of the plurality of conductor layers 2, the conductor layer 2 located on the outer surface of the frame portion 1b, that is, the outer surface of the insulator 1ba includes a plurality of signal lines 2A. The plurality of signal lines 2A each have a first end portion 2Aa and a second end portion 2Ab on the opposite side of the first end portion 2Aa, and the first end portions 2Aa are adjacent to each other in the line width direction. They are arranged apart from each other. Further, as shown in FIG. 4, for example, each signal line 2A has a convex portion 2Ac protruding along the outer surface of the frame portion 1b at the first end portion 2Aa. According to such an electronic component storage package 10, the external electric circuit can be easily and highly accurately aligned with the portion including the first end portion 2Aa of the conductor layer 2 with reference to the convex portion 2Ac. ..

すなわち、導体層２（信号線路２Ａ）の端である第１端部２Ａａから直接に凸部２Ａｃが突出しているので、例えば目視または画像認識装置による凸部２Ａｃの位置認識が容易であり、その位置を基準にして信号線路２Ａの外部接続される部位も容易に知ることができる。したがって、導体層２の外部電気回路に対する位置合せが容易であり、位置合せの精度の向上も容易な電子部品収納用パッケージ10を提供することができる。 That is, since the convex portion 2Ac directly protrudes from the first end portion 2Aa which is the end of the conductor layer 2 (signal line 2A), the position recognition of the convex portion 2Ac can be easily performed, for example, visually or by an image recognition device. The externally connected portion of the signal line 2A can also be easily known with reference to the position. Therefore, it is possible to provide the electronic component storage package 10 in which the alignment of the conductor layer 2 with respect to the external electric circuit is easy and the accuracy of the alignment is easily improved.

また、実施形態の電子装置20は、上記構成の電子部品収納用パッケージ10を含んでいる。そのため、導体層２の外部電気回路に対する位置合せが容易であり、位置合せの精度の向上も容易な電子装置20を提供することができる。電子装置20を外部電気回路に接続するときには、例えば凸部２Ａｃの位置を目視等で認識して、その位置に外部電気回路の所定部位を位置合せする。その後、はんだ等のろう材を介して信号線路２Ａと外部電気回路とを互いに接続させる。ろう材は、上記の位置合せ時に、あらかじめ信号線路２Ａ等の所定部位にペースト等の形態で配置しておいてもよい。 Further, the electronic device 20 of the embodiment includes the electronic component storage package 10 having the above configuration. Therefore, it is possible to provide the electronic device 20 which can easily align the conductor layer 2 with respect to the external electric circuit and can easily improve the accuracy of the alignment. When the electronic device 20 is connected to the external electric circuit, for example, the position of the convex portion 2Ac is visually recognized, and a predetermined portion of the external electric circuit is aligned with the position. After that, the signal line 2A and the external electric circuit are connected to each other via a brazing material such as solder. The brazing material may be arranged in advance in a predetermined portion such as the signal line 2A in the form of a paste or the like at the time of the above alignment.

上記の電子部品11は、例えば光電変換素子であって、信号線路２Ａ等の導体層２によって外部電気回路都電気的に接続される。また、電子部品11は、前述した貫通孔１ｄに配置される光接続部材によって外部の電子機器等と光接続される。例えば、外部の電子機器から光信号が電子装置20に伝送され、電子部品11で電気信号に変換される。この電気信号が導体層２によって外部電気回路に伝送される。これにより、外部の電子機器と外部電気回路との間で信号の伝送が行なわれる。すなわち、電子装置20を介した光通信が行なわれる。このときに伝送される信号は、例えば約40ＧＨ以上であり、収容される電子部品11が光通信用のものであるときには、例えば約60ＧＨｚ（56〜64ＧＨｚ）程度であり、さらに光通信の用途等に応じて約100ＧＨｚ程度のときも含まれる。 The electronic component 11 is, for example, a photoelectric conversion element, and is electrically connected to an external electric circuit by a conductor layer 2 such as a signal line 2A. Further, the electronic component 11 is optically connected to an external electronic device or the like by the optical connection member arranged in the through hole 1d described above. For example, an optical signal is transmitted from an external electronic device to the electronic device 20, and is converted into an electric signal by the electronic component 11. This electric signal is transmitted to the external electric circuit by the conductor layer 2. As a result, the signal is transmitted between the external electronic device and the external electric circuit. That is, optical communication is performed via the electronic device 20. The signal transmitted at this time is, for example, about 40 GHz or more, and when the accommodated electronic component 11 is for optical communication, it is, for example, about 60 GHz (56 to 64 GHz), and further used for optical communication, etc. It is also included when the frequency is about 100 GHz.

凸部２Ａｃは、図４に示す例では長方形状であるが、これには限定されず、正方形状または三角形状等の多角形状でもよく、円弧状（扇形状）または楕円弧状等の湾曲した外縁
を有するものでもよい。また、複数の凸部２Ａｃは、互いに形状および寸法等が異なるものを含んでいても構わない。凸部２Ａｃは、信号線路２Ａの一部として、信号線路２Ａと同時に、金属ペーストの印刷および焼成等の方法で形成することができる。つまり、信号線路２Ａ本体と凸部２Ａｃとを同時に形成することができる。 The convex portion 2Ac has a rectangular shape in the example shown in FIG. 4, but is not limited to this, and may have a polygonal shape such as a square shape or a triangular shape, and a curved outer edge such as an arc shape (fan shape) or an elliptical arc shape. It may have. Further, the plurality of convex portions 2Ac may include those having different shapes, dimensions and the like from each other. The convex portion 2Ac can be formed as a part of the signal line 2A at the same time as the signal line 2A by a method such as printing and firing of a metal paste. That is, the signal line 2A main body and the convex portion 2Ac can be formed at the same time.

また、凸部２Ａｃは、凸部２Ａｃ以外の部分における信号線路２Ａ（導体層２）と同様に、露出表面にニッケルおよび金等のめっき層が被着されていてもよい。このめっき層は、凸部２Ａｃの先端部分（いわゆる端面）まで被覆していなくても構わない。凸部２Ａｃの端面が金めっき層で被覆されていないときには、その部分におけるろう材の濡れ性を低減して、ろう材が不要な部分まで流れ出るような可能性を低減することもできる。 Further, the convex portion 2Ac may be coated with a plating layer such as nickel or gold on the exposed surface in the same manner as the signal line 2A (conductor layer 2) in the portion other than the convex portion 2Ac. This plating layer does not have to cover the tip portion (so-called end face) of the convex portion 2Ac. When the end face of the convex portion 2Ac is not covered with the gold plating layer, the wettability of the brazing material at that portion can be reduced, and the possibility that the brazing material flows out to an unnecessary portion can be reduced.

絶縁体１ｂａは、例えば金属筐体１ｂｂの切欠き部１ｂｃをことができるような形状および寸法を有する。図１および図２等に示す例において、絶縁体１ｂａは、例えば平面視において「コ」字（または「Ｕ」字）状であって、切欠き部１ｂｃと同じ高さを有している。 The insulator 1ba has a shape and dimensions capable of forming a notch 1bc of, for example, a metal housing 1bb. In the examples shown in FIGS. 1 and 2, for example, the insulator 1ba has a "U" shape (or "U" shape) in a plan view and has the same height as the notch portion 1bc.

絶縁体１ｂａは、セラミック材料等の絶縁材料からなる。絶縁体１ｂａを構成するセラミック材料としては、酸化アルミニウム質焼結体、ムライト質焼結体、炭化珪素質焼結体、窒化アルミニウム質焼結体、窒化珪素質焼結体またはガラスセラミック焼結体（結晶化ガラス）等のセラミック材料を挙げることができる。 The insulator 1ba is made of an insulating material such as a ceramic material. Examples of the ceramic material constituting the insulator 1ba include an aluminum oxide sintered body, a mulite sintered body, a silicon carbide sintered body, an aluminum nitride material sintered body, a silicon nitride material sintered body, or a glass-ceramic sintered body. Ceramic materials such as (crystallized glass) can be mentioned.

絶縁体１ｂａは、上記のようなセラミック材料の原料粉末を有機バインダ等とともにシート状に成形したグリーンシートを、所定の寸法に切断加工した後、所定の温度で焼成することによって製作することができる。この場合、必要に応じて複数のセラミックグリーンシートを積層した後に焼成してもよい。また、上記の原料粉末を有機バインダ等とともに金型等を用いて絶縁体１ｂａの所定形状に成形して、この成形体を焼成して絶縁体１ｂａを製作することもできる。 The insulator 1ba can be manufactured by cutting a green sheet obtained by molding the above-mentioned raw material powder of a ceramic material into a sheet shape together with an organic binder or the like, cutting it to a predetermined size, and then firing it at a predetermined temperature. .. In this case, if necessary, a plurality of ceramic green sheets may be laminated and then fired. Further, the above-mentioned raw material powder can be molded into a predetermined shape of the insulator 1ba using a mold or the like together with an organic binder or the like, and the molded body can be fired to produce the insulator 1ba.

導体層２は、例えば、タングステン、モリブデン、マンガン、銅、金、パラジウム、白金、ニッケルまたはコバルト等の金属材料によって形成されている。導体層２は、これらの金属材料のいずれかを主成分として含有する合金材料であってもよい。このような金属材料は、メタライズ層、めっき層または薄膜層等の形態で絶縁体１ｂａに配置されている。 The conductor layer 2 is formed of, for example, a metal material such as tungsten, molybdenum, manganese, copper, gold, palladium, platinum, nickel or cobalt. The conductor layer 2 may be an alloy material containing any of these metal materials as a main component. Such a metal material is arranged on the insulator 1ba in the form of a metallized layer, a plating layer, a thin film layer, or the like.

導体層２は、例えばタングステンのメタライズ層からなる場合であれば、タングステンの粉末を有機溶剤およびバインダ等とともに混練して作製した金属ペーストを、絶縁体１ｂａまたは絶縁体１ｂａとなるセラミックグリーンシートに所定パターンに印刷し、焼成する方法で形成することができる。また、このメタライズ層の表面にさらに、ニッケル、ニッケル−コバルト合金、銅、パラジウムおよび金等から適宜選択しためっき層を被着させるようにしてもよい。 When the conductor layer 2 is made of, for example, a tungsten metallized layer, a metal paste prepared by kneading tungsten powder with an organic solvent, a binder, or the like is specified on a ceramic green sheet to be an insulator 1ba or an insulator 1ba. It can be formed by printing on a pattern and firing. Further, the surface of the metallized layer may be further coated with a plating layer appropriately selected from nickel, nickel-cobalt alloy, copper, palladium, gold and the like.

なお、導体層２は、信号線路２Ａ以外の他の線路または接地層との面積が比較的広い層を含んでいてもよい。本実施形態の電子部品収納用パッケージ10および電子装置20において、導体層２は接地導体層２Ｇをさらに含んでいる。すなわち、例えば図１〜図４に示すように、枠部１ｂ（絶縁体１ｂａ）の外面に位置している導体層２が、側面視において複数の信号線路２Ａを囲む接地導体層２Ｇをさらに含んでいる。 The conductor layer 2 may include a layer other than the signal line 2A or a layer having a relatively large area with the ground layer. In the electronic component storage package 10 and the electronic device 20 of the present embodiment, the conductor layer 2 further includes a ground conductor layer 2G. That is, for example, as shown in FIGS. 1 to 4, the conductor layer 2 located on the outer surface of the frame portion 1b (insulator 1ba) further includes a ground conductor layer 2G surrounding a plurality of signal lines 2A in a side view. I'm out.

このような接地導体層２Ｇがあるときには、接地導体層２Ｇと信号線路２Ａとの間に生じる容量成分等により、信号線路２Ａにおけるインピーダンス（特性インピーダンス）の調整が容易である。また、信号線路２Ａと外部との間の電磁的なノイズの送受を接地導体
層２Ｇで低減することもできる。 When there is such a ground conductor layer 2G, it is easy to adjust the impedance (characteristic impedance) in the signal line 2A due to the capacitance component generated between the ground conductor layer 2G and the signal line 2A. Further, the transmission / reception of electromagnetic noise between the signal line 2A and the outside can be reduced by the ground conductor layer 2G.

このように接地導体層２Ｇが信号線路２Ａを囲んで位置しているときには、信号線路２Ａにおける高周波信号の伝送特性を向上させることが容易である。すなわち、この実施形態における電子部品収納用パッケージ10および電子装置20は、高周波特性の向上に有利である。上記のように、電子装置20が光通信用のものであれば、電子装置20としての特性向上にも適した構造とすることができる。 When the ground conductor layer 2G is located so as to surround the signal line 2A in this way, it is easy to improve the transmission characteristics of the high frequency signal in the signal line 2A. That is, the electronic component storage package 10 and the electronic device 20 in this embodiment are advantageous in improving the high frequency characteristics. As described above, if the electronic device 20 is for optical communication, it can have a structure suitable for improving the characteristics of the electronic device 20.

また、例えば図４等に示すように、接地導体層２Ｇが、信号線路２Ａの凸部２Ａｃと対向する縁部において凸部２Ａｃの方向に突出した接地凸部２Ｇｃを有していてもよい。接地導体層２Ｇが、上記のような接地凸部２Ｇｃを有しているときには、接地凸部２Ｇｃも、信号線路２Ａと外部電気回路都の位置合せに利用することができる。そのため、信号線路２Ａと外部電気回路都の位置合せの精度を効果的に高めることができる。 Further, for example, as shown in FIG. 4, the ground conductor layer 2G may have a ground convex portion 2Gc protruding in the direction of the convex portion 2Ac at the edge portion facing the convex portion 2Ac of the signal line 2A. When the grounding conductor layer 2G has the grounding convex portion 2Gc as described above, the grounding convex portion 2Gc can also be used for positioning the signal line 2A and the external electric circuit city. Therefore, the accuracy of alignment between the signal line 2A and the external electric circuit city can be effectively improved.

具体的には、凸部２Ａｃと接地凸部２Ｇｃとが両者の間の間隙を挟んで直線状に断続しているので、断続した１つの直線（線分）を基準にして、外部電気回路に接続される信号線路２Ａの位置を認識することができる。この断続した直線は、凸部２Ａｃが単独で存在している場合に比べて長いため、位置認識をしやすくすることができる。 Specifically, since the convex portion 2Ac and the ground convex portion 2Gc are intermittently connected in a straight line with a gap between them, the external electric circuit can be used with reference to one intermittent straight line (line segment). The position of the connected signal line 2A can be recognized. Since this intermittent straight line is longer than when the convex portion 2Ac exists alone, it is possible to facilitate position recognition.

また、導体層２は、さらに信号線路２Ａおよび接地導体層２Ｇ以外に他の導体層を有していてもよい。例えば、この実施形態の電子部品収納用パッケージ10および電子装置20では、絶縁体１ｂａが外側面において段状であり、その段部分の上面に、リード端子３が接続される他の導体層２Ｌが配置されている。リード端子３は、電子部品収納用パッケージ10および電子装置20を外部電気回路に電気的に接続させる端子として機能する。の場合、他の導体層２Ｌおよびリード端子３は、外部電気回路と電子装置20とを電気的に接続する導電路として機能する。他の導体層２Ｌおよびリード端子３を介して接続される外部電気回路は、前述した信号線路２Ａが電気的に接続される外部電気回路と同じでもよく、異なるものでもよい。 Further, the conductor layer 2 may further have another conductor layer other than the signal line 2A and the ground conductor layer 2G. For example, in the electronic component storage package 10 and the electronic device 20 of this embodiment, the insulator 1ba has a stepped shape on the outer surface, and another conductor layer 2L to which the lead terminal 3 is connected is formed on the upper surface of the stepped portion. Have been placed. The lead terminal 3 functions as a terminal for electrically connecting the electronic component storage package 10 and the electronic device 20 to an external electric circuit. In the case of, the other conductor layer 2L and the lead terminal 3 function as a conductive path that electrically connects the external electric circuit and the electronic device 20. The external electric circuit connected via the other conductor layer 2L and the lead terminal 3 may be the same as or different from the external electric circuit to which the signal line 2A described above is electrically connected.

なお、接地導体層２Ｇおよび他の導体層２Ｌは、例えば信号線路２Ａと同様の金属材料を用い、同様の方法で形成することができる。接地導体層２Ｇおよび他の導体層２Ｌについても、ニッケルおよび金等のめっき層を被着させて構わない。 The ground conductor layer 2G and the other conductor layer 2L can be formed by the same method using, for example, the same metal material as the signal line 2A. A plating layer such as nickel or gold may be adhered to the ground conductor layer 2G and the other conductor layer 2L.

リード端子３は、例えば、鉄−ニッケル合金、鉄−ニッケルコバルト合金、銅または銅合金等の金属材料によって形成されている。リード端子３は、例えば鉄−ニッケル−コバルト合金からなる場合であれば、この合金材料に対して、打ち抜き加工、研磨加工、研削加工およびエッチング加工等の加工法から適宜選択された加工を施して所定形状に成形することにより、製作することができる。リード端子３と他の導体層２Ｌとの接続は、例えば、銀ろう等のろう材を介した接合法で行なうことができる。また、リード端子３についても、ニッケルおよび金等のめっき層を被着させて構わない。 The lead terminal 3 is formed of, for example, a metal material such as an iron-nickel alloy, an iron-nickel cobalt alloy, or copper or a copper alloy. If the lead terminal 3 is made of, for example, an iron-nickel-cobalt alloy, the alloy material is subjected to a process appropriately selected from processing methods such as punching, polishing, grinding and etching. It can be manufactured by molding it into a predetermined shape. The lead terminal 3 and the other conductor layer 2L can be connected by, for example, a joining method using a brazing material such as silver wax. Further, the lead terminal 3 may also be coated with a plating layer such as nickel and gold.

図７（ａ）は本発明の変形例の電子部品収納用パッケージ10を示す側面図であり、図７（ｂ）は図７（ａ）の要部を拡大して示す側面図である。図７において図１〜図６と同様の部位には同様の符号を付している。図７に示す例において、複数の信号線路２Ａが、第２端部２Ａｂにおいて枠部１ｂ（絶縁体１ｂａ）の外面に沿って突出した補助凸部２Ａｄを有している。 FIG. 7A is a side view showing the electronic component storage package 10 of a modified example of the present invention, and FIG. 7B is an enlarged side view showing a main part of FIG. 7A. In FIG. 7, the same parts as those in FIGS. 1 to 6 are designated by the same reference numerals. In the example shown in FIG. 7, the plurality of signal lines 2A have an auxiliary convex portion 2Ad protruding along the outer surface of the frame portion 1b (insulator 1ba) at the second end portion 2Ab.

信号線路２Ａが、第２端部２Ａｂにおいて補助凸部２Ａｄを有している場合には、第２端部２Ａｂ側でも、信号線路２Ａと外部電気回路都の位置合わせを容易にすることができる。すなわち、信号線路２の両端（２Ａａ、２Ａｂ）に、外部電気回路に対する位置合せ
の基準を配置することができる。これにより、信号線路２Ａと外部電気回路都の位置合わせを容易にすることができ、位置合せの精度を高めることもできる。 When the signal line 2A has the auxiliary convex portion 2Ad at the second end portion 2Ab, the alignment of the signal line 2A and the external electric circuit city can be facilitated also on the second end portion 2Ab side. .. That is, the alignment reference with respect to the external electric circuit can be arranged at both ends (2Aa, 2Ab) of the signal line 2. As a result, the alignment between the signal line 2A and the external electric circuit can be facilitated, and the accuracy of the alignment can be improved.

この場合、凸部２Ａｃおよび補助凸部２Ａｄは、信号線路２Ａの長さ方向に沿って１つの直線上に位置していれば、凸部２Ａｃおよび補助凸部２Ａｄをあわせた信号線路２Ａの外部電気回路との接続位置の認識精度を高める上で有利である。また、凸部２Ａｃおよび補助凸部２Ａｄと接地凸部２Ｇｃとが１つの直線上に並んでいてもよい。これにより、信号線路の位置認識を容易にすることもできる。 In this case, if the convex portion 2Ac and the auxiliary convex portion 2Ad are located on one straight line along the length direction of the signal line 2A, the outer portion of the signal line 2A in which the convex portion 2Ac and the auxiliary convex portion 2Ad are combined is located. It is advantageous in improving the recognition accuracy of the connection position with the electric circuit. Further, the convex portion 2Ac, the auxiliary convex portion 2Ad, and the ground convex portion 2Gc may be arranged on one straight line. This also facilitates position recognition of the signal line.

補助凸部２Ａｄも、凸部２Ａｃと同様に、信号線路２Ａの一部として、信号線路２Ａと同時に、金属ペーストの印刷および焼成等の方法で形成することができる。つまり、信号線路２Ａ本体と凸部２Ａｃおよび補助凸部２Ａｄとを同時に形成することができる。 Like the convex portion 2Ac, the auxiliary convex portion 2Ad can also be formed as a part of the signal line 2A at the same time as the signal line 2A by a method such as printing and firing of a metal paste. That is, the signal line 2A main body, the convex portion 2Ac, and the auxiliary convex portion 2Ad can be formed at the same time.

信号線路２Ａが凸部２Ａｃを有する場合、または凸部２Ａｃおよび補助凸部２Ａｄの両方を有するときに、複数の信号線路２Ａのうち一部または１つの信号線路２Ａにおいて、他の信号線路２Ａと凸部２Ａｃまたは補助凸部２Ａｄの形状および寸法等の外形が異なっていてもよい。この場合には、外形が異なる凸部２Ａｃまたは補助凸部２Ａｄを、電子部品収納用パッケージ10および電子装置20における複数の信号線路２Ａのインデックスマークとして利用することもできる。 When the signal line 2A has the convex portion 2Ac, or when the signal line 2A has both the convex portion 2Ac and the auxiliary convex portion 2Ad, in a part or one signal line 2A of the plurality of signal lines 2A, the other signal line 2A and the other signal line 2A The outer shape and dimensions of the convex portion 2Ac or the auxiliary convex portion 2Ad may be different. In this case, the convex portion 2Ac or the auxiliary convex portion 2Ad having different outer shapes can be used as index marks of a plurality of signal lines 2A in the electronic component storage package 10 and the electronic device 20.

なお、本発明は以上の実施の形態の例に限定されるものではなく本発明の要旨の範囲内であれば種々の変更は可能である。 The present invention is not limited to the examples of the above embodiments, and various modifications can be made within the scope of the gist of the present invention.

例えば、基体の全体が絶縁体であるもの（図示せず）でも構わない。この場合にも、絶縁体である基体の側面において、複数の信号線路の第１端部に凸部（実施形態における凸部２Ａｃと同様のもの）があれば、その凸部を基準にして信号線路と外部電気回路都の位置合わせを容易にすることができる。このような効果は、枠部の全体が絶縁体であり、その枠部が金属製の基部に接合された基体（図示せず）である場合にも同様に得ることができる。また、この場合にも、絶縁体である基体に光接続端子用の貫通孔（１ｄ）が設けられていて構わない。 For example, the entire substrate may be an insulator (not shown). Also in this case, if there is a convex portion (similar to the convex portion 2Ac in the embodiment) at the first end portion of the plurality of signal lines on the side surface of the substrate which is an insulator, the signal is signaled with reference to the convex portion. It is possible to facilitate the alignment of the line and the external electric circuit city. Such an effect can be similarly obtained when the entire frame portion is an insulator and the frame portion is a substrate (not shown) bonded to a metal base portion. Further, also in this case, the substrate which is an insulator may be provided with a through hole (1d) for an optical connection terminal.

１・・基体
１ａ・・凹部
１ｂ・・枠部
１ｂａ・・絶縁体
１ｂｂ・・金属筐体
１ｂｃ・・切欠き部
１ｃ・・基部
１ｄ・・貫通孔
２・・導体層
２Ａ・・信号線路
２Ａａ・・第１端部
２Ａｂ・・第２端部
２Ａｃ・・凸部
２Ａｄ・・補助凸部
２Ｇ・・接地導体層
２Ｇｃ・・接地凸部
２Ｌ・・他の導体層
３・・リード端子
10・・電子部品収納用パッケージ
11・・電子部品
12・・蓋体
20・・電子装置 1 ... Hypokeimenon
1a ・ ・ Recessed part 1b ・ ・ Frame part 1ba ・ ・ Insulator 1bb ・ ・ Metal housing 1bc ・ ・ Notch part 1c ・ ・ Base part 1d ・ ・ Through hole 2 ・ ・ Conductor layer 2A ・ ・ Signal line 2Aa ・ ・ First End 2Ab ・ ・ 2nd end 2Ac ・ ・ Convex 2Ad ・ ・ Auxiliary convex 2G ・ ・ Ground conductor layer 2Gc ・ ・ Ground convex 2L ・ ・ Other conductor layer 3 ・ ・ Lead terminal
10 ... Package for storing electronic components
11 ... Electronic components
12 ... lid
20 ... Electronic device

Claims (5)

凹部を含む上面および該凹部を囲む枠部を有し、該枠部の少なくとも一部が絶縁体である基体と、
前記絶縁体において前記枠部の内面および外面に位置している複数の導体層とを備えており、
該複数の導体層のうち前記枠部の外面に位置している導体層は、それぞれ第１端部および該第１端部と反対側の第２端部を有しているとともに前記第１端部同士が互いに隣り合うように線幅方向に互いに離れて配列された複数の信号線路を含んでおり、それぞれの前記信号線路が、前記第１端部において前記枠部の外面に沿って突出した凸部を有している電子部品収納用パッケージ。 A substrate having an upper surface including a recess and a frame portion surrounding the recess, and at least a part of the frame portion being an insulator.
The insulator includes a plurality of conductor layers located on the inner surface and the outer surface of the frame portion.
Of the plurality of conductor layers, the conductor layer located on the outer surface of the frame portion has a first end portion and a second end portion opposite to the first end portion, respectively, and the first end portion is provided. It contains a plurality of signal lines arranged apart from each other in the line width direction so that the portions are adjacent to each other, and each of the signal lines projects along the outer surface of the frame portion at the first end portion. A package for storing electronic components that has a convex part. 前記基体が、前記枠部を含むとともに該枠部の一部に切欠き部を有する金属筐体と、前記切欠き部に位置している前記絶縁体とを有している請求項１記載の電子部品収納用パッケージ。 The first aspect of claim 1, wherein the substrate has a metal housing including the frame portion and a notch portion in a part of the frame portion, and the insulator located in the notch portion. Package for storing electronic components. 前記枠部の外面に位置している前記導体層が、側面視において前記複数の信号線路を囲む接地導体層をさらに含んでおり、該接地導体層が、前記凸部と対向する縁部において前記凸部の方向に突出した接地凸部を有している請求項１または請求項２記載の電子部品収納用パッケージ。 The conductor layer located on the outer surface of the frame portion further includes a grounding conductor layer surrounding the plurality of signal lines in a side view, and the grounding conductor layer is said at an edge portion facing the convex portion. The electronic component storage package according to claim 1 or 2, which has a grounding convex portion protruding in the direction of the convex portion. 前記複数の信号線路が、前記第２端部において前記枠部の外面に沿って突出した補助凸部を有している請求項１〜請求項３のいずれか１項記載の電子部品収納用パッケージ。 The electronic component storage package according to any one of claims 1 to 3, wherein the plurality of signal lines have an auxiliary convex portion protruding along the outer surface of the frame portion at the second end portion. .. 請求項１〜請求項４のいずれか１項記載の電子部品収納用パッケージと、
前記凹部内に収容されて前記導体層と電気的に接続された電子部品とを備える電子装置。 The electronic component storage package according to any one of claims 1 to 4.
An electronic device including an electronic component housed in the recess and electrically connected to the conductor layer.
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