JP6840617B2 - 研磨装置および研磨方法 - Google Patents

研磨装置および研磨方法 Download PDF

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Publication number
JP6840617B2
JP6840617B2 JP2017096604A JP2017096604A JP6840617B2 JP 6840617 B2 JP6840617 B2 JP 6840617B2 JP 2017096604 A JP2017096604 A JP 2017096604A JP 2017096604 A JP2017096604 A JP 2017096604A JP 6840617 B2 JP6840617 B2 JP 6840617B2
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JP
Japan
Prior art keywords
polishing
substrate
air cylinder
connecting mechanism
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017096604A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018192545A (ja
Inventor
誠 柏木
誠 柏木
吉田　篤史
篤史 吉田
峯杰 杜
峯杰 杜
道義 山下
道義 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2017096604A priority Critical patent/JP6840617B2/ja
Priority to PCT/JP2018/000092 priority patent/WO2018211736A1/ja
Priority to TW107101488A priority patent/TWI762554B/zh
Publication of JP2018192545A publication Critical patent/JP2018192545A/ja
Application granted granted Critical
Publication of JP6840617B2 publication Critical patent/JP6840617B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP2017096604A 2017-05-15 2017-05-15 研磨装置および研磨方法 Active JP6840617B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017096604A JP6840617B2 (ja) 2017-05-15 2017-05-15 研磨装置および研磨方法
PCT/JP2018/000092 WO2018211736A1 (ja) 2017-05-15 2018-01-05 研磨装置および研磨方法
TW107101488A TWI762554B (zh) 2017-05-15 2018-01-16 研磨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017096604A JP6840617B2 (ja) 2017-05-15 2017-05-15 研磨装置および研磨方法

Publications (2)

Publication Number Publication Date
JP2018192545A JP2018192545A (ja) 2018-12-06
JP6840617B2 true JP6840617B2 (ja) 2021-03-10

Family

ID=64273846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017096604A Active JP6840617B2 (ja) 2017-05-15 2017-05-15 研磨装置および研磨方法

Country Status (3)

Country Link
JP (1) JP6840617B2 (zh)
TW (1) TWI762554B (zh)
WO (1) WO2018211736A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7111778B2 (ja) * 2020-08-24 2022-08-02 株式会社サンシン 研磨ロボット装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3650198B2 (ja) * 1995-12-12 2005-05-18 スピードファム株式会社 防振機構付き片面研磨装置
JPH11198026A (ja) * 1998-01-16 1999-07-27 Ebara Corp ポリッシング装置
JP3707605B2 (ja) * 2000-11-15 2005-10-19 株式会社平和 揚送研磨装置の設置構造
JP5886602B2 (ja) * 2011-03-25 2016-03-16 株式会社荏原製作所 研磨装置および研磨方法
JP6130677B2 (ja) * 2013-01-31 2017-05-17 株式会社荏原製作所 研磨装置および研磨方法

Also Published As

Publication number Publication date
TW201901778A (zh) 2019-01-01
TWI762554B (zh) 2022-05-01
WO2018211736A1 (ja) 2018-11-22
JP2018192545A (ja) 2018-12-06

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