JP6838963B2 - Vacuum suction member - Google Patents
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- JP6838963B2 JP6838963B2 JP2016256325A JP2016256325A JP6838963B2 JP 6838963 B2 JP6838963 B2 JP 6838963B2 JP 2016256325 A JP2016256325 A JP 2016256325A JP 2016256325 A JP2016256325 A JP 2016256325A JP 6838963 B2 JP6838963 B2 JP 6838963B2
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- 239000000758 substrate Substances 0.000 claims description 20
- 238000001179 sorption measurement Methods 0.000 claims description 16
- 238000009423 ventilation Methods 0.000 claims description 11
- 239000010419 fine particle Substances 0.000 description 20
- 239000002245 particle Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000009826 distribution Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000012530 fluid Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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Description
本発明は、半導体ウエハなどの対象物を真空吸着するために使用される真空吸着部材に関する。 The present invention relates to a vacuum suction member used for vacuum suction of an object such as a semiconductor wafer.
従来、露光装置のような半導体製造装置においては、半導体ウエハなどの対象物をステージ上に固定して処理するために、対象物がステージ上の真空吸着部材を介して真空吸着される。 Conventionally, in a semiconductor manufacturing apparatus such as an exposure apparatus, an object such as a semiconductor wafer is vacuum-adsorbed via a vacuum adsorption member on the stage in order to fix and process the object on the stage.
このような真空吸着部材として、例えば、特許文献1には、ウエハを吸着するときにウエハに対向する主面の外周部及び中心部をそれぞれ取り巻く2つの輪帯状の凸部と、これらの輪帯状凸部の間における主面上の領域に配置された多数の吸引穴と、各吸引穴を取り囲むピン状の凸部とを備えた基板保持部材が記載されている。 As such a vacuum suction member, for example, Patent Document 1 describes two ring-shaped convex portions surrounding the outer peripheral portion and the central portion of the main surface facing the wafer when sucking the wafer, and these ring-shaped convex portions. A substrate holding member with a large number of suction holes arranged in a region on the main surface between the protrusions and pin-shaped protrusions surrounding each suction hole is described.
この基板保持部材では、ウエハと各ピン状の凸部とで該凸部の内側に形成される隔室を、吸引穴を経て真空吸引することにより、ウエハが各ピン状の凸部の上に固定される。また、この基板保持部材では、ウエハと輪帯状凸部とでピン状の凸部の外側に形成される温調隔室内に温調流体を流すことにより、ウエハなどで発生する熱を排出し、熱により発生し得る不都合を防止している。 In this substrate holding member, the wafer and each pin-shaped convex portion are vacuum-sucked through a suction hole in a separable chamber formed inside the convex portion, so that the wafer is placed on each pin-shaped convex portion. It is fixed. Further, in this substrate holding member, the heat generated in the wafer or the like is discharged by flowing the temperature control fluid into the temperature control chamber formed on the outside of the pin-shaped convex portion by the wafer and the ring-shaped convex portion. It prevents inconveniences that may occur due to heat.
また、特許文献2には、ウエハに対向する主面に設けた輪体シール及びウエハ支持部材のウエハ支持面上にウエハを載置し、ウエハと輪体シールとの間に形成される密閉空間を真空吸引してウエハを吸着するウエハホルダが記載されている。このウエハホルダでは、ウエハ支持面に溝を設けることにより、ウエハ支持面とウエハとの間にパーティクル(微粒子)を挟み込む事態の発生頻度を減らし、露光エラーの原因になるウエハの吸着歪みを低減させるようにしている。 Further, in Patent Document 2, a ring body seal provided on a main surface facing the wafer and a sealed space formed between the wafer and the ring body seal by placing the wafer on the wafer support surface of the wafer support member. A wafer holder that sucks a wafer by vacuum is described. In this wafer holder, by providing a groove on the wafer support surface, the frequency of occurrence of a situation where particles (fine particles) are sandwiched between the wafer support surface and the wafer is reduced, and the adsorption distortion of the wafer that causes an exposure error is reduced. I have to.
また、特許文献3には、ウエハに対向する主面(ウエハ吸着面)の外周に空気をシールする環状土手部を設け、その内側に、ウエハを保持する複数のピン状の凸部を配列した、真空チャックが記載されている。この真空チャックでは、環状土手部の内外周に沿って、上記ピン状の凸部とは別のピン状の凸部が複数設けられている。 Further, in Patent Document 3, an annular bank portion for sealing air is provided on the outer periphery of a main surface (wafer adsorption surface) facing the wafer, and a plurality of pin-shaped convex portions for holding the wafer are arranged inside the annular bank portion. , Vacuum chuck is described. In this vacuum chuck, a plurality of pin-shaped convex portions different from the pin-shaped convex portions are provided along the inner and outer circumferences of the annular bank portion.
この真空チャックでは、これらの凸部の高さを環状土手部の高さよりも高く設定し、これらの凸部で環状土手部の極近傍においてウエハを支えることにより、ウエハ吸着面を負圧にするという環状土手部の作用を残したまま、環状土手部とウエハとの間に異物(パーティクル)が挟まる可能性を低減するようにしている。 In this vacuum chuck, the height of these convex portions is set higher than the height of the annular bank portion, and the wafer is supported by these convex portions in the very vicinity of the annular bank portion, thereby creating a negative pressure on the wafer suction surface. While retaining the function of the annular bank portion, the possibility of foreign matter (particles) being caught between the annular bank portion and the wafer is reduced.
しかしながら、上記特許文献1の基板保持部材によれば、温調隔室を形成するための2つの輪帯状凸部が必要であるとともに、輪帯状凸部とウエハとの間に微粒子(パーティクル)が挟まるおそれがある。また、微粒子が、温調流体によって巻き上げられ、ピン状の凸部やウエハに付着し、ウエハに対する加工精度を悪化させるおそれがある。 However, according to the substrate holding member of Patent Document 1, two ring-shaped convex portions for forming the temperature control partition chamber are required, and fine particles (particles) are formed between the ring-shaped convex portion and the wafer. There is a risk of getting caught. Further, the fine particles may be wound up by the temperature control fluid and adhere to the pin-shaped protrusions or the wafer, which may deteriorate the processing accuracy of the wafer.
一方、上記特許文献2のウエハホルダでは、ウエハと輪体シールとの間に形成される密閉空間を真空吸引することによりウエハが吸着される。このため、真空吸着開始時にウエハ支持面とウエハとの間に挟み込まれたパーティクルは、真空吸着している間、ウエハ支持面の溝にエアの流れが生じないので、そのまま残留することになる。 On the other hand, in the wafer holder of Patent Document 2, the wafer is sucked by vacuum sucking the sealed space formed between the wafer and the ring seal. Therefore, the particles sandwiched between the wafer support surface and the wafer at the start of vacuum suction do not cause air flow in the groove of the wafer support surface during vacuum suction, and therefore remain as they are.
他方、上記特許文献3の真空チャックによれば、環状土手部とウエハとの間に異物が挟まる可能性を低減できるが、ピン状の凸部とウエハとの間に異物が挟まれて残留するおそれがある。 On the other hand, according to the vacuum chuck of Patent Document 3, the possibility of foreign matter being caught between the annular bank portion and the wafer can be reduced, but the foreign matter is caught and remains between the pin-shaped convex portion and the wafer. There is a risk.
本発明の目的は、かかる従来技術の問題点に鑑み、対象物と真空吸着部材との接触面に微粒子が挟まるのを極力防止した真空吸着部材を提供することにある。 An object of the present invention is to provide a vacuum suction member that prevents fine particles from being caught in a contact surface between an object and a vacuum suction member as much as possible in view of the problems of the prior art.
第1の発明に係る真空吸着部材は、
対象物に対向する主面を有し、内部に通気路が設けられた基体と、
前記主面に立設され、前記通気路に通じた内部空間を画定する中空の筒状部を有する複数の吸着部とを備え、
前記複数の吸着部を経て真空吸引することにより前記対象物を吸着するための真空吸着部材において、
前記複数の吸着部のうちの少なくとも一部の吸着部は、それぞれ前記筒状部の端面から突出する突出部を有し、
各前記突出部の端面は、真空吸着される前記対象物を支持する第1面を構成し、
前記第1面と前記筒状部の端面である第2面との間のレベルにおいて、該筒状部の内部空間側と外部空間側との間で真空吸引用のエアが流通するための流通空間が形成され、
前記複数の吸着部は、前記主面の中心の領域とその外側の少なくとも1つの環状の領域とを有する複数の領域に立設されており、
前記吸着部毎の前記対象物を支持する支持面の面積は、前記領域毎に異なることを特徴とする。
The vacuum suction member according to the first invention is
A substrate having a main surface facing the object and having a ventilation path inside,
It is provided with a plurality of suction portions which are erected on the main surface and have a hollow tubular portion that defines an internal space leading to the ventilation path.
In a vacuum suction member for sucking an object by vacuum suction through the plurality of suction portions.
At least a part of the suction portions of the plurality of suction portions has a protrusion protruding from the end surface of the tubular portion.
The end face of each of the protrusions constitutes a first surface that supports the object to be vacuum-sucked.
Flow for vacuum suction air to flow between the internal space side and the external space side of the tubular portion at the level between the first surface and the second surface which is the end surface of the tubular portion. Space is formed ,
The plurality of suction portions are erected in a plurality of regions having a central region of the main surface and at least one annular region outside the central region.
The area of the support surface that supports the object for each suction portion is different for each region .
第1発明によれば、対象物を真空吸着部材の吸着部上に配置し、各吸着部における筒状部の内部空間を基体内の通気路を経て真空吸引することにより、対象物が真空吸着部材上に吸着されて支持される。このため、従来の真空吸着部材が有していた主面の周辺部を囲って真空吸着用の密閉空間を形成するための環状の土手部が不要となる。これにより、対象物と真空吸着部材との間の接触面積を従来よりも減少させて、該接触面に微粒子が挟まるのを極力回避することができる。 According to the first invention, the object is vacuum-sucked by arranging the object on the suction portion of the vacuum suction member and vacuum-sucking the internal space of the tubular portion in each suction portion through the ventilation path in the substrate. It is attracted and supported on the member. For this reason, an annular bank portion for forming a closed space for vacuum suction by surrounding the peripheral portion of the main surface, which is provided by the conventional vacuum suction member, becomes unnecessary. As a result, the contact area between the object and the vacuum suction member can be reduced as compared with the conventional case, and it is possible to prevent fine particles from being caught in the contact surface as much as possible.
また、対象物と主面との間の吸着部以外の空間には、従来の真空吸着部材で流していたような温調流体が流れないので、かかる温調流体により微粒子が舞い上がって対象物に付着したり、吸着部と対象物との間に挟み込まれたりすることはない。 In addition, since the temperature control fluid does not flow in the space between the object and the main surface other than the suction part, as was the case with the conventional vacuum suction member, the temperature control fluid causes fine particles to fly up to the object. It does not adhere or get caught between the suction part and the object.
また、対象物が真空吸着部材上に吸着されている間、吸着部のうちの少なくとも一部においては、吸着部の内部空間の真空吸引に伴って、突出部の第1面と筒状部の第2面との間のレベルの流通空間を経て筒状部の外部空間側から内部空間側へエアが流れる。このとき、微粒子がエア中に存在していたとしても、かかる微粒子は、内部空間側へ流入するエアによって、基体内の通気路を経て真空吸着部材の外部に排出される。したがって、このような微粒粒子が第1面と対象物との間に挟まることを防止することもできる。
また、半径方向の複数の領域毎に支持面の面積が異なる吸着部を配置したので、対象物に対する単位面積あたりの吸着力を、半径方向において容易に調節することができる。その結果、例えば主面の中心に近い吸着部から吸着を開始することにより、大きく撓んだ対象物を、その撓みを矯正しながら吸着することができる。
Further, while the object is adsorbed on the vacuum suction member, at least a part of the suction part has the first surface of the protruding part and the tubular part due to the vacuum suction of the internal space of the suction part. Air flows from the outer space side to the inner space side of the tubular portion through the circulation space at the level between the second surface and the second surface. At this time, even if the fine particles are present in the air, the fine particles are discharged to the outside of the vacuum suction member through the ventilation path in the substrate by the air flowing into the internal space side. Therefore, it is possible to prevent such fine particles from being sandwiched between the first surface and the object.
Further, since the suction portions having different support surface areas are arranged in each of the plurality of radial regions, the suction force per unit area with respect to the object can be easily adjusted in the radial direction. As a result, for example, by starting the suction from the suction portion near the center of the main surface, it is possible to suck the object that is greatly bent while correcting the bending.
第2発明に係る真空吸着部材は、第1発明において、
前記複数の吸着部のうちの少なくとも一部の吸着部は、それぞれ複数の前記突出部を有し、
前記複数の突出部を有する各吸着部は、隣り合う該突出部の間を経て前記筒状部の内部空間側と外部空間側とが通じていることを特徴とする。
The vacuum suction member according to the second invention is the first invention.
At least a part of the plurality of suction portions has the plurality of protrusions.
Each of the suction portions having the plurality of protruding portions is characterized in that the internal space side and the external space side of the tubular portion communicate with each other through the adjacent protruding portions.
第2発明によれば、第1発明の場合と同様の作用効果に加えて次のような効果を奏する。すなわち、隣り合う突出部間の間隔を適宜選択して、筒状部の内部空間側と外部空間側とを通じている流通空間の断面積を適宜設定することにより、吸着部1つあたりの吸着力を適切に調整することができる。 According to the second invention, in addition to the same action and effect as in the case of the first invention, the following effects are exhibited. That is, by appropriately selecting the distance between the adjacent protrusions and appropriately setting the cross-sectional area of the distribution space passing through the internal space side and the external space side of the tubular portion, the suction force per suction portion can be increased. It can be adjusted appropriately.
第3発明に係る真空吸着部材は、第1又は第2発明において、
前記複数の吸着部のうちの少なくとも一部の吸着部は、それぞれ前記突出部として複数のピン状凸部を有し、
前記ピン状凸部を有する吸着部は、前記筒状部の端面に、該筒状部の内部空間の開口部を囲うように立設された環状凸部を有し、
前記環状凸部の端面は、前記第1面と前記第2面の間のレベルに位置することを特徴とする。
The vacuum suction member according to the third invention is the first or second invention.
At least a part of the suction portions of the plurality of suction portions has a plurality of pin-shaped convex portions as the protrusions, respectively.
The suction portion having the pin-shaped convex portion has an annular convex portion erected on the end surface of the tubular portion so as to surround the opening of the internal space of the tubular portion.
The end surface of the annular convex portion is characterized to be located at a level between the first surface and the second surface.
第3発明によれば、第2発明の場合と同様の作用効果に加えて次のような効果を奏する。すなわち、環状凸部の高さを適宜選択することにより、流通空間の断面積を調整して、吸着部による対象物の吸着力を適切に設定することができる。 According to the third invention, in addition to the same action and effect as in the case of the second invention, the following effects are exhibited. That is, by appropriately selecting the height of the annular convex portion, the cross-sectional area of the distribution space can be adjusted, and the suction force of the object by the suction portion can be appropriately set.
第4発明に係る真空吸着部材は、第1発明において、
前記吸着部毎の支持面の面積は、該吸着部が属する前記領域が前記主面の中心に近いほど大きいことを特徴とする。
The vacuum suction member according to the fourth invention is the first invention.
The area of the support surface for each suction portion is characterized in that the region to which the suction portion belongs is larger as it is closer to the center of the main surface.
第4発明によれば、例えば、対象物に対する吸着部1つあたりの吸着力を、その吸着部が属する領域が主面の中心に近いほど大きくして、主面の中心に近い領域ほど吸着部1つあたりの吸着力が大きくなるように構成することができる。これにより、主面の中心に近い吸着部から吸着を開始することにより、大きく撓んだ対象物を、その撓みを支障なく矯正しながら吸着することができる。 According to the fourth invention, for example, the suction force per suction portion for an object is increased as the region to which the suction portion belongs is closer to the center of the main surface, and the region closer to the center of the main surface is as the suction portion. It can be configured so that the suction force per one is large. As a result, by starting the suction from the suction portion near the center of the main surface, it is possible to suck the object that is greatly bent while correcting the bending without any trouble.
以下、図面を用いて本発明の実施形態を説明する。図1A及び図1Bに示すように、本発明の第1実施形態に係る真空吸着部材1は、対象物としてのウエハ2に対向する主面3を有し、内部に通気路4が設けられた基体5と、主面3に立設された複数の吸着部6とを備え、複数の吸着部6を経て図示しない真空吸引機構で真空吸引することによりウエハ2を吸着する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1A and 1B, the vacuum suction member 1 according to the first embodiment of the present invention has a main surface 3 facing the wafer 2 as an object, and a ventilation passage 4 is provided inside. The substrate 5 is provided with a plurality of suction portions 6 erected on the main surface 3, and the wafer 2 is sucked by vacuum suction through the plurality of suction portions 6 by a vacuum suction mechanism (not shown).
なお、真空吸着部材1の構成の明確化のため、図示される各構成要素はデフォルメされており、各構成要素の断面図におけるアスペクト比のほか、幅又は高さと相互の間隔との比率などは実際とは異なっている。 In order to clarify the configuration of the vacuum suction member 1, each component shown in the drawing is deformed, and in addition to the aspect ratio in the cross-sectional view of each component, the ratio of the width or height to the mutual spacing and the like are shown. It is different from the actual one.
基体5及び吸着部6は、これらの形成に通常使用される材料及び方法を用いて形成される。具体的には、基体5は、例えばSi3N4や、AlN焼結体、SiC焼結体、Al2O3焼結体などのセラミックス焼結体として形成される。 The substrate 5 and the adsorption portion 6 are formed by using the materials and methods usually used for forming them. Specifically, the substrate 5 is formed as a ceramic sintered body such as Si 3 N 4 or an AlN sintered body, a SiC sintered body, or an Al 2 O 3 sintered body.
吸着部6は、セラミックス焼結体として形成され、基体5と同一素材により形成されることが望ましい。基体5と吸着部6とが同一素材により一体形成される場合は、基体5及び吸着部6となるセラミックス焼結体に機械加工を施すことにより形成することができる。基体5と吸着部6とが別体で形成される場合は、活性ろう付けや接着(有機接着、無機接着)などの従前の方法により基体5に対して吸着部6を固定することができる。 It is desirable that the adsorption portion 6 is formed as a ceramic sintered body and is made of the same material as the substrate 5. When the substrate 5 and the adsorption portion 6 are integrally formed of the same material, they can be formed by machining the substrate 5 and the ceramic sintered body to be the adsorption portion 6. When the substrate 5 and the adsorption portion 6 are formed separately, the adsorption portion 6 can be fixed to the substrate 5 by a conventional method such as active brazing or adhesion (organic adhesion, inorganic adhesion).
図2及び図3に示すように、各吸着部6は、通気路4に通じた内部空間7を画定する中空の筒状部8を有する。各吸着部6は、筒状部8の端面から突出する突出部としての複数のピン状凸部9を有する。各ピン状凸部9の端面は、真空吸着されるウエハ2を支持する平面状の第1面10を構成する。 As shown in FIGS. 2 and 3, each suction portion 6 has a hollow tubular portion 8 that defines an internal space 7 that leads to the ventilation passage 4. Each suction portion 6 has a plurality of pin-shaped convex portions 9 as protruding portions protruding from the end surface of the tubular portion 8. The end surface of each pin-shaped convex portion 9 constitutes a planar first surface 10 that supports the wafer 2 to be vacuum-adsorbed.
第1面10のレベルから筒状部8の端面である第2面11のレベルまでの範囲において、筒状部8の内部空間7側と外部空間12側との間で真空吸引用のエアが流通するための流通空間13が形成されている。第2面11の主面3からの高さは0.5mmであり、第1面10の第2面11からの高さは、10μmである。 In the range from the level of the first surface 10 to the level of the second surface 11 which is the end surface of the tubular portion 8, vacuum suction air is generated between the internal space 7 side and the external space 12 side of the tubular portion 8. A distribution space 13 for distribution is formed. The height of the second surface 11 from the main surface 3 is 0.5 mm, and the height of the first surface 10 from the second surface 11 is 10 μm.
なお、第1面10の第2面11からの高さは0.1〜30μmであることが好ましい。第1面10の第2面11からの高さが0.1μm未満であると、第2面11の表面粗さと同程度の高さとなるため、ピン状凸部9を設けることによる効果が得られにくくなる。また、第1面10の第2面11からの高さが30μmを超えると、流通空間13を介したエアの流れが大きくなりすぎて所望の吸着力が得られにくくなる。 The height of the first surface 10 from the second surface 11 is preferably 0.1 to 30 μm. If the height of the first surface 10 from the second surface 11 is less than 0.1 μm, the height is about the same as the surface roughness of the second surface 11, so that the effect of providing the pin-shaped convex portion 9 can be obtained. It becomes difficult to be damaged. Further, if the height of the first surface 10 from the second surface 11 exceeds 30 μm, the flow of air through the distribution space 13 becomes too large, and it becomes difficult to obtain a desired adsorption force.
真空吸着部材1における吸着部6の実際の配置は、図4に示すように、例えば、直径が200mmのウエハ2を吸着する場合、吸着部6は、ウエハ2の中心に対応する位置(主面3の中心)に1つ配置されるとともに、これを中心として直径が40mmから190mmまで30mmずつ増加する6つの同心円上のそれぞれに、ほぼ等間隔で複数配置される。 As shown in FIG. 4, the actual arrangement of the suction portion 6 in the vacuum suction member 1 is such that when a wafer 2 having a diameter of 200 mm is sucked, the suction portion 6 is located at a position (main surface) corresponding to the center of the wafer 2. One is arranged at the center of 3), and a plurality of them are arranged at approximately equal intervals on each of the six concentric circles whose diameters increase by 30 mm from 40 mm to 190 mm around the center.
すなわち、ウエハ2に対してほぼ均等となるように、149個の吸着部6が主面3上に配置される。吸着部6の筒状部8の内直径は3.0mmであり、外直径は6.0mmである。 That is, 149 suction portions 6 are arranged on the main surface 3 so as to be substantially uniform with respect to the wafer 2. The inner diameter of the tubular portion 8 of the suction portion 6 is 3.0 mm, and the outer diameter is 6.0 mm.
この構成において、真空吸着部材1によりウエハ2を吸着する際には、ウエハ2が真空吸着部材1の吸着部6上に配置され、各吸着部6における筒状部8の内部空間7が基体5内の通気路4を経て真空吸引される。これにより、ウエハ2が真空吸着部材1上に吸着されて支持される。 In this configuration, when the vacuum suction member 1 sucks the wafer 2, the wafer 2 is arranged on the suction portion 6 of the vacuum suction member 1, and the internal space 7 of the tubular portion 8 in each suction portion 6 is the substrate 5. Vacuum is sucked through the ventilation passage 4 inside. As a result, the wafer 2 is attracted and supported on the vacuum suction member 1.
このようにしてウエハ2が吸着されている間、各吸着部6においては、その内部空間7の真空吸引に伴い、ピン状凸部9の第1面10のレベルから筒状部8の第2面11のレベルまでの範囲に存在する流通空間13を経て、筒状部8の外部空間12側から内部空間7側へエアが流れる。 While the wafer 2 is being sucked in this way, in each suction portion 6, the second surface of the pin-shaped convex portion 9 is changed to the second surface of the tubular portion 8 due to the vacuum suction of the internal space 7. Air flows from the outer space 12 side of the tubular portion 8 to the inner space 7 side through the circulation space 13 existing in the range up to the level of the surface 11.
この間、外部空間12側において微粒子(パーティクル)が浮遊したり、エアの流れによって舞い上がったりしている場合には、かかる微粒子は、内部空間7側へ流入するエアによって、基体5内の通気路4を経て、真空吸着部材1の外部に排出される。これにより、ピン状凸部9の第1面10とウエハ2との間に微粒子が挟まることが極力回避される。 During this time, if fine particles (particles) are suspended on the external space 12 side or are soared by the flow of air, the fine particles are separated by the air flowing into the internal space 7 side in the ventilation passage 4 in the substrate 5. Is discharged to the outside of the vacuum suction member 1. As a result, it is possible to prevent fine particles from being caught between the first surface 10 of the pin-shaped convex portion 9 and the wafer 2.
以上のように、第1実施形態によれば、ウエハ2と主面3との間の吸着部6以外の空間には、従来の真空吸着部材で流していたような温調流体を流すことが無いので、かかる温調流体の流れに起因して微粒子が舞い上がり、ウエハ2や、ウエハ2と真空吸着部材との間の接触面に付着することはない。 As described above, according to the first embodiment, the temperature control fluid that has been flowed by the conventional vacuum suction member can be flowed in the space between the wafer 2 and the main surface 3 other than the suction part 6. Therefore, the fine particles do not fly up due to the flow of the temperature control fluid and do not adhere to the wafer 2 or the contact surface between the wafer 2 and the vacuum suction member.
また、ウエハ2が真空吸着部材1上に吸着されている間、外部空間12側に微粒子が浮遊などしている場合でも、かかる微粒子は、外部空間12側から内部空間7側へ流れるエアによって、真空吸着部材1の外部に排出される。したがって、ピン状凸部9の第1面10とウエハ2との間に微粒子が挟まることを極力防止することができる。 Further, even when the fine particles are suspended on the external space 12 side while the wafer 2 is sucked on the vacuum suction member 1, the fine particles are generated by the air flowing from the external space 12 side to the internal space 7 side. It is discharged to the outside of the vacuum suction member 1. Therefore, it is possible to prevent fine particles from being caught between the first surface 10 of the pin-shaped convex portion 9 and the wafer 2.
さらに、従来の真空吸着部材が有していた主面の周辺部を囲って真空吸着用の密閉空間を形成するための環状の土手部が不要となる。これにより、ウエハ2と真空吸着部材1との間の接触面積を従来よりも減少させて、両者の接触面に微粒子が挟まるのをさらに回避することができる。 Further, an annular bank portion for forming a closed space for vacuum adsorption by surrounding the peripheral portion of the main surface, which is provided by the conventional vacuum suction member, becomes unnecessary. As a result, the contact area between the wafer 2 and the vacuum suction member 1 can be reduced as compared with the conventional case, and it is possible to further prevent fine particles from being caught in the contact surfaces of both.
第2実施形態の真空吸着部材では、図5に示すように、吸着部14は、筒状部8の第2面11に立設した突出部として、4つの部分円筒状の環状凸部15を備える。4つの環状凸部15は、筒状部8の端面である第2面11に立設した円筒状の壁に4つのスリットSを設けることによって、該壁を4等分したような部分円筒形状を有する。 In the vacuum suction member of the second embodiment, as shown in FIG. 5, the suction portion 14 has four partially cylindrical annular convex portions 15 as protruding portions erected on the second surface 11 of the tubular portion 8. Be prepared. The four annular convex portions 15 have a partially cylindrical shape in which the wall is divided into four equal parts by providing four slits S in a cylindrical wall erected on a second surface 11 which is an end surface of the tubular portion 8. Has.
ただし、スリットSは必ずしも円筒状の壁の下端(第2面11のレベル)から上端(第1面10のレベル)まで設ける必要はなく、スリットSの下端は、第2面11より上のレベルに位置してもよい。 However, the slit S does not necessarily have to be provided from the lower end (level of the second surface 11) to the upper end (level of the first surface 10) of the cylindrical wall, and the lower end of the slit S is at a level above the second surface 11. May be located at.
かかる吸着部14においては、隣り合う環状凸部15の間を経て筒状部8の内部空間7側と外部空間12側とが通じている。すなわち、上記のスリットSの部分は、筒状部8の内部空間7側と外部空間12側との間で真空吸引用のエアが流通するための流通空間を構成する。 In the suction portion 14, the inner space 7 side and the outer space 12 side of the tubular portion 8 communicate with each other through the adjacent annular convex portions 15. That is, the portion of the slit S constitutes a distribution space for air for vacuum suction to flow between the internal space 7 side and the external space 12 side of the tubular portion 8.
第2実施形態によれば、スリットSの幅や長さを選択することにより、吸着部14の1つあたりの吸着力を適切に調整することができる。他の構成及び作用・効果は、第1実施形態の場合と同様である。 According to the second embodiment, by selecting the width and length of the slit S, the suction force per suction portion 14 can be appropriately adjusted. Other configurations and actions / effects are the same as in the case of the first embodiment.
第3実施形態の真空吸着部材では、図6に示すように、吸着部16は、それぞれ筒状部8の端面である第2面11に立設した突出部として複数のピン状凸部9を有する。また、吸着部16は、筒状部8の端面である第2面11に、筒状部8の内部空間7の開口部を囲うように立設された環状凸部17を有する。環状凸部17の端面は、ピン状凸部9の端面である第1面10と第2面11との間のレベルに位置する。 In the vacuum suction member of the third embodiment, as shown in FIG. 6, each of the suction portions 16 has a plurality of pin-shaped convex portions 9 as protruding portions erected on the second surface 11 which is the end surface of the tubular portion 8. Have. Further, the suction portion 16 has an annular convex portion 17 erected on the second surface 11 which is an end surface of the tubular portion 8 so as to surround the opening of the internal space 7 of the tubular portion 8. The end face of the annular convex portion 17 is located at a level between the first surface 10 and the second surface 11, which are the end faces of the pin-shaped convex portion 9.
本実施形態の吸着部16は、第1実施形態の吸着部6に対して上記の環状凸部17を設けたような構成を有する。すなわち、筒状部8の内部空間7側と外部空間12側との間において真空吸引用のエアを流通させる流通空間の断面積(エアの流れに垂直な最小断面の面積)が、環状凸部17により制限されている。 The suction portion 16 of the present embodiment has a configuration in which the above-mentioned annular convex portion 17 is provided with respect to the suction portion 6 of the first embodiment. That is, the cross-sectional area (the area of the minimum cross section perpendicular to the air flow) of the circulation space through which the air for vacuum suction flows between the internal space 7 side and the external space 12 side of the tubular portion 8 is the annular convex portion. Limited by 17.
このため、環状凸部17の高さを選択することにより、吸着部16の1つあたりの吸着力を適切に調整することができる。他の構成及び作用・効果は、第1実施形態の場合と同様である。 Therefore, by selecting the height of the annular convex portion 17, the suction force per suction portion 16 can be appropriately adjusted. Other configurations and actions / effects are the same as in the case of the first embodiment.
第4実施形態の真空吸着部材では、複数の吸着部が、主面3の中心の領域とその外側の少なくとも1つの環状の領域とを有する複数の領域に立設されており、吸着部毎のウエハ2を支持する支持面の面積は、領域毎に異なっている。 In the vacuum suction member of the fourth embodiment, a plurality of suction portions are erected in a plurality of regions having a central region of the main surface 3 and at least one annular region outside the central region of the main surface 3, and each suction portion has a plurality of suction portions. The area of the support surface that supports the wafer 2 is different for each region.
具体的には、図7のように、例えば主面3の中心部の領域3aと、その外側の3つの環状の領域3b〜3dとの4つの領域3a〜3dが設定される。そして、領域3a〜3d毎に、そこに配置された吸着部あたりの支持面の面積が異なっている。すなわち、領域3a〜3dには、それぞれ平面図が図8A〜図8Dに示されるような吸着部21〜24が配置される。 Specifically, as shown in FIG. 7, for example, four regions 3a to 3d, which are a region 3a at the center of the main surface 3 and three annular regions 3b to 3d outside the region 3a, are set. Then, the area of the support surface per the suction portion arranged there is different for each of the regions 3a to 3d. That is, the adsorption portions 21 to 24 are arranged in the regions 3a to 3d as shown in FIGS. 8A to 8D, respectively.
吸着部21は、筒状部8の端面全体を支持面としたものである。吸着部22は、第1実施形態におけるものと同様のピン状凸部9を12本だけ第2面11上に立設して構成される。吸着部23は、同様のピン状凸部9を6本だけ第2面11上に立設して構成される。吸着部24は、同様のピン状凸部9を3本だけ第2面11上に立設して構成される。 The suction portion 21 has the entire end surface of the tubular portion 8 as a support surface. The suction portion 22 is configured by erection of only 12 pin-shaped convex portions 9 similar to those in the first embodiment on the second surface 11. The suction portion 23 is configured by erection of only six similar pin-shaped convex portions 9 on the second surface 11. The suction portion 24 is configured by erection of only three similar pin-shaped convex portions 9 on the second surface 11.
したがって、吸着部21〜24毎の支持面(吸着部21の場合はその端面、吸着部22〜24の場合は第1面10)の面積は、その吸着部21〜24が属する領域3a〜3dが主面3の中心に近いほど大きい。この場合、領域3a〜3dが主面3の中心に近いほど、その領域3a〜3dに属する吸着部21〜24の1つあたりの上述の流通空間の断面積は小さい(吸着部21の場合はゼロ)ので、該1つあたりの吸着力は、それが属する領域3a〜3dが主面3の中心に近いほど大きい。 Therefore, the area of the support surface for each of the suction portions 21 to 24 (the end surface of the suction portion 21 and the first surface 10 of the suction portions 22 to 24) is the region 3a to 3d to which the suction portions 21 to 24 belong. Is larger as it is closer to the center of the main surface 3. In this case, the closer the regions 3a to 3d are to the center of the main surface 3, the smaller the cross-sectional area of the above-mentioned distribution space per one of the suction portions 21 to 24 belonging to the regions 3a to 3d (in the case of the suction portion 21). Since it is zero), the adsorption force per one is larger as the regions 3a to 3d to which it belongs are closer to the center of the main surface 3.
したがって、吸着部21〜24を、対応する領域3a〜3dに配置することを条件として、図4のように主面3全体にほぼ均等に配置することにより、主面3の中心に近い領域ほど、ウエハ2に働く単位面積あたりの吸着力が大きくなるように構成することができる。 Therefore, on condition that the suction portions 21 to 24 are arranged in the corresponding regions 3a to 3d, by arranging them substantially evenly over the entire main surface 3 as shown in FIG. 4, the region closer to the center of the main surface 3 is closer. , The adsorption force per unit area acting on the wafer 2 can be increased.
この構成において、真空吸着部材によりウエハ2を吸着する際には、主面3の中心に近い領域3aの吸着部21から真空吸引が開始され、順次、遠い方の領域3b〜3dの吸着部22〜24へと真空吸引が開始されてゆく。これにより、ウエハ2が大きく撓んでいたとしても、ウエハ2は、その中心側から外周部側に向かって順次吸着されてゆくので、その撓みが支障なく矯正されつつ吸着される。 In this configuration, when the wafer 2 is sucked by the vacuum suction member, vacuum suction is started from the suction portion 21 of the region 3a near the center of the main surface 3, and the suction portions 22 of the regions 3b to 3d farther away are sequentially started. Vacuum suction is started from ~ 24. As a result, even if the wafer 2 is greatly bent, the wafer 2 is sequentially adsorbed from the central side to the outer peripheral side thereof, so that the bending is corrected and adsorbed without any trouble.
以上のように、第4実施形態によれば、主面3の中心に近い領域3aの吸着部21から順次吸着を開始することによって、大きく撓んだウエハ2を、その撓みを矯正しながら吸着することができる。本実施形態の真空吸着部材における他の構成、及び作用・効果は、第1実施形態の場合と同様である。 As described above, according to the fourth embodiment, by sequentially starting the suction from the suction portion 21 of the region 3a near the center of the main surface 3, the greatly bent wafer 2 is sucked while correcting the bending. can do. Other configurations, actions and effects of the vacuum suction member of the present embodiment are the same as those of the first embodiment.
図9は、従来の比較例1及び2の真空吸着部材並びに本発明に従った実施例1〜4の真空吸着部材について、ウエハ2を真空吸着した際にウエハ2に転写された0.3μm以上の粒子(パーティクル)の数を示す。なお、パーティクルの数の測定は、WM10(トプコン社製)を用いて行った。 FIG. 9 shows 0.3 μm or more transferred to the wafer 2 when the wafer 2 is vacuum-sucked with respect to the conventional vacuum suction members of Comparative Examples 1 and 2 and the vacuum suction members of Examples 1 to 4 according to the present invention. Indicates the number of particles in. The number of particles was measured using WM10 (manufactured by Topcon).
比較例1及び2の真空吸着部材は、それぞれ従来のリングチャック及びピンチャックに相当し、実施例1〜4の真空吸着部材は、上述の実施形態1〜4の真空吸着部材にそれぞれ対応する。 The vacuum suction members of Comparative Examples 1 and 2 correspond to the conventional ring chuck and pin chuck, respectively, and the vacuum suction members of Examples 1 to 4 correspond to the vacuum suction members of the above-described embodiments 1 to 4, respectively.
ここで、リングチャックとは、その主面の中心を共通の中心とする17本の同心円リング状のリブ(凸条)を主面上に設け、ウエハ2、主面、及び17本のリブで形成される各空間を、主面の各空間に対応する部分に開口した吸気路を介して真空吸引することによりウエハ2を吸着するように構成した真空吸着部材である。 Here, the ring chuck is provided with 17 concentric ring-shaped ribs (convex stripes) having the center of the main surface as a common center on the main surface, and is composed of the wafer 2, the main surface, and 17 ribs. It is a vacuum suction member configured to suck the wafer 2 by vacuum sucking each space to be formed through an intake path opened in a portion corresponding to each space on the main surface.
また、ピンチャックとは、その主面の外周部に設けた1つのリング状のリブ(凸条)と、主面におけるリブの内側の部分にほぼ均等に配置した多数の支持ピンとを有し、ウエハ2、主面、及びリング状のリブで形成される空間を主面の中心に開口した吸気路を介して真空吸引することによってウエハ2を吸着するように構成した真空吸着部材である。 Further, the pin chuck has one ring-shaped rib (convex) provided on the outer peripheral portion of the main surface thereof, and a large number of support pins arranged substantially evenly on the inner portion of the rib on the main surface. It is a vacuum suction member configured to suck the wafer 2 by vacuum sucking a space formed by a wafer 2, a main surface, and a ring-shaped rib through an intake path opened at the center of the main surface.
図10には、比較例1、2及び実施例1〜4の真空吸着部材についての主な仕様が示されている。実施例1〜4については、吸着部6、14、16、21〜24の第1面10に関連する仕様として、ピン状凸部9の直径(ピン直径)、吸着部6、16、22〜24の1個あたりのピン状凸部9の個数(ピン個数)、基体5あたりの吸着部の個数、環状凸部(実施例2では環状凸部15、実施例3では環状凸部17)の内径、該環状凸部の幅、及びスリットSの幅のうちの該当するものの値が示されている。 FIG. 10 shows the main specifications of the vacuum suction members of Comparative Examples 1 and 2 and Examples 1 to 4. Regarding Examples 1 to 4, as specifications related to the first surface 10 of the suction portions 6, 14, 16, 21 to 24, the diameter of the pin-shaped convex portion 9 (pin diameter), the suction portions 6, 16, 22 to 22 The number of pin-shaped convex portions 9 (number of pins) per 24, the number of suction portions per substrate 5, and the annular convex portions (the annular convex portion 15 in Example 2 and the annular convex portion 17 in Example 3). The values of the inner diameter, the width of the annular convex portion, and the width of the slit S are shown.
また、比較例2については、支持ピンに関連する仕様として、支持ピンの直径、支持ピンの間隔(ピン間隔)、支持ピンの個数(ピン個数)、及び支持ピンにおけるウエハ2との接触面の総面積(ピン総面積)が示されている。 Regarding Comparative Example 2, as specifications related to the support pins, the diameter of the support pins, the spacing between the support pins (pin spacing), the number of support pins (the number of pins), and the contact surface of the support pins with the wafer 2 The total area (total pin area) is shown.
また、比較例1及び2のリブに関連する仕様として、リブの幅、及びリブの個数(リブ個数)が示されている。また、比較例1、2及び実施例1〜4について、真空吸着部材とウエハ2との接触面の総面積(接触総面積)及びこの接触総面積のウエハ2の面積に対する割合が示されている。 Further, as specifications related to the ribs of Comparative Examples 1 and 2, the width of the ribs and the number of ribs (number of ribs) are shown. Further, for Comparative Examples 1 and 2 and Examples 1 to 4, the total area of the contact surface between the vacuum suction member and the wafer 2 (total contact area) and the ratio of the total contact area to the area of the wafer 2 are shown. ..
図9及び図10から理解されるように、真空吸着部材とウエハ2との接触面の総面積(接触総面積)が大きいほど、該接触面に(挟まれて)付着する粒子数(パーティクル数)が増大することがわかる。また、実施例1〜4では、接触総面積を、リブを用いずに専ら吸着部6、14、16、21〜24を用いることによって減少させ、これによって付着する粒子数を減少させていることがわかる。 As can be understood from FIGS. 9 and 10, the larger the total area (total contact area) of the contact surface between the vacuum suction member and the wafer 2, the more particles (number of particles) adhere to the contact surface (sandwiched). ) Increases. Further, in Examples 1 to 4, the total contact area is reduced by exclusively using the adsorption portions 6, 14, 16 and 21 to 24 without using ribs, thereby reducing the number of particles adhering. I understand.
さらに、実施例1〜4では、吸着部6、14、16又は21〜24の個数がいずれも149個であることから、吸着部6、14、16、21〜24の1個あたりの接触面の面積の増加にともなって付着する粒子数が増大することがわかる。そして、実施例1〜4によれば、比較例1、2に比べて、ウエハ2との接触総面積が小さい分、接触面に付着する粒子数が少ないことがわかる。 Further, in Examples 1 to 4, since the number of the suction portions 6, 14, 16 or 21 to 24 is 149, each contact surface of the suction portions 6, 14, 16, 21 to 24 It can be seen that the number of adsorbed particles increases as the area of the above increases. Then, according to Examples 1 to 4, it can be seen that the total contact area with the wafer 2 is smaller than that of Comparative Examples 1 and 2, and the number of particles adhering to the contact surface is smaller.
このように、実施例1〜4によれば、従来のリングチャック(比較例1)やピンチャック(比較例2)が有していた密閉空間を形成するためのリブ(環状の土手部)が存在しないので、ウエハ2と真空吸着部材1との間の接触面積を従来よりも減少させて、両者の接触面に微粒子が挟まるのを極力回避することができる。 As described above, according to Examples 1 to 4, the ribs (annular bank portion) for forming the closed space that the conventional ring chuck (Comparative Example 1) and pin chuck (Comparative Example 2) have are provided. Since it does not exist, the contact area between the wafer 2 and the vacuum suction member 1 can be reduced as compared with the conventional case, and fine particles can be prevented from being caught in the contact surfaces of the two as much as possible.
また、ウエハ2が真空吸着部材により吸着されている間、外部空間12側から流通空間13を経て内部空間7側へ流れるエア流れが、外部空間12側で浮遊し又は舞い上がった微粒子を真空吸着部材の外部に排出していると考えられる。これによっても、該エアの流れが存在しない比較例1、2の場合に比べて、真空吸着部材とウエハ2との間に挟まる微粒数を減少させているものと考えられる。 Further, while the wafer 2 is sucked by the vacuum suction member, the air flow flowing from the outer space 12 side through the flow space 13 to the inner space 7 side floats or soars fine particles on the outer space 12 side to the vacuum suction member. It is thought that it is discharged to the outside of. It is considered that this also reduces the number of fine particles sandwiched between the vacuum suction member and the wafer 2 as compared with the cases of Comparative Examples 1 and 2 in which the air flow does not exist.
以上、本発明の実施形態及び実施例について説明したが、本発明はこれに限定されない。例えば、筒状部8の端面(第2面11)から突出する突出部は、上記のピン状凸部9や環状凸部15以外の形状を有していてもよい。また、真空吸着部材による吸着の対象物は、ウエハ2に限らず、真空吸着部材により支持して位置決めし、処理が行われる他の半導体基板などであってもよい。 Although the embodiments and examples of the present invention have been described above, the present invention is not limited thereto. For example, the protruding portion protruding from the end surface (second surface 11) of the tubular portion 8 may have a shape other than the pin-shaped convex portion 9 and the annular convex portion 15. Further, the object of suction by the vacuum suction member is not limited to the wafer 2, and may be another semiconductor substrate that is supported and positioned by the vacuum suction member and processed.
また、第1〜第3実施形態の真空吸着部材は、吸着部6、14又は16に加えて、図8Aのような突出部を有していない吸着部を有していてもよい。この場合、ウエハ2を吸着するときには、吸着部においては、その端面がウエハ2との接触面となる。 Further, the vacuum suction member of the first to third embodiments may have a suction portion having no protruding portion as shown in FIG. 8A, in addition to the suction portions 6, 14 or 16. In this case, when the wafer 2 is sucked, the end face of the suction portion becomes the contact surface with the wafer 2.
1…真空吸着部材、2…ウエハ(対象物)、3…主面、3a〜3d…領域、4…通気路、5…基体、6、14、16、21〜24…吸着部、7…内部空間、8…筒状部、9…ピン状凸部(突出部)、10…第1面、11…第2面、12…外部空間、13…流通空間、15…部分円筒状の環状凸部(突出部)、17…環状凸部。 1 ... Vacuum suction member, 2 ... Wafer (object), 3 ... Main surface, 3a to 3d ... Region, 4 ... Ventilation path, 5 ... Base, 6, 14, 16, 21 to 24 ... Suction part, 7 ... Inside Space, 8 ... Cylindrical part, 9 ... Pin-shaped convex part (protruding part), 10 ... First surface, 11 ... Second surface, 12 ... External space, 13 ... Distribution space, 15 ... Partial cylindrical annular convex part (Protruding part), 17 ... Circular convex part.
Claims (4)
前記主面に立設され、前記通気路に通じた内部空間を画定する中空の筒状部を有する複数の吸着部とを備え、
前記複数の吸着部を経て真空吸引することにより前記対象物を吸着するための真空吸着部材において、
前記複数の吸着部のうちの少なくとも一部の吸着部は、それぞれ前記筒状部の端面から突出する突出部を有し、
各前記突出部の端面は、真空吸着される前記対象物を支持する第1面を構成し、
前記第1面と前記筒状部の端面である第2面との間のレベルにおいて、該筒状部の内部空間側と外部空間側との間で真空吸引用のエアが流通するための流通空間が形成され、
前記複数の吸着部は、前記主面の中心の領域とその外側の少なくとも1つの環状の領域とを有する複数の領域に立設されており、
前記吸着部毎の前記対象物を支持する支持面の面積は、前記領域毎に異なることを特徴とする真空吸着部材。 A substrate having a main surface facing the object and having a ventilation path inside,
It is provided with a plurality of suction portions which are erected on the main surface and have a hollow tubular portion that defines an internal space leading to the ventilation path.
In a vacuum suction member for sucking an object by vacuum suction through the plurality of suction portions.
At least a part of the suction portions of the plurality of suction portions has a protrusion protruding from the end surface of the tubular portion.
The end face of each of the protrusions constitutes a first surface that supports the object to be vacuum-sucked.
Flow for vacuum suction air to flow between the internal space side and the external space side of the tubular portion at the level between the first surface and the second surface which is the end surface of the tubular portion. Space is formed ,
The plurality of suction portions are erected in a plurality of regions having a central region of the main surface and at least one annular region outside the central region.
A vacuum suction member , wherein the area of the support surface for supporting the object for each suction portion is different for each region.
前記複数の突出部を有する各吸着部は、隣り合う該突出部の間を経て前記筒状部の内部空間側と外部空間側とが通じていることを特徴とする請求項1に記載の真空吸着部材。 At least a part of the plurality of suction portions has the plurality of protrusions.
The vacuum according to claim 1, wherein each of the suction portions having the plurality of protruding portions communicates with the internal space side and the external space side of the tubular portion via the adjacent protruding portions. Adsorption member.
前記ピン状凸部を有する吸着部は、前記筒状部の端面に、該筒状部の内部空間の開口部を囲うように立設された環状凸部を有し、
前記環状凸部の端面は、前記第1面と前記第2面の間のレベルに位置することを特徴とする請求項1又は2に記載の真空吸着部材。 At least a part of the suction portions of the plurality of suction portions has a plurality of pin-shaped convex portions as the protrusions, respectively.
The suction portion having the pin-shaped convex portion has an annular convex portion erected on the end surface of the tubular portion so as to surround the opening of the internal space of the tubular portion.
The vacuum suction member according to claim 1 or 2, wherein the end surface of the annular convex portion is located at a level between the first surface and the second surface.
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