JP6837384B2 - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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- JP6837384B2 JP6837384B2 JP2017101603A JP2017101603A JP6837384B2 JP 6837384 B2 JP6837384 B2 JP 6837384B2 JP 2017101603 A JP2017101603 A JP 2017101603A JP 2017101603 A JP2017101603 A JP 2017101603A JP 6837384 B2 JP6837384 B2 JP 6837384B2
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Description
(実施の形態1)
図1に示されるように、本実施の形態の半導体装置CHは、たとえばチップ状態であり、半導体基板を有している。半導体基板の表面には、ドライバ回路DRI、プリドライバ回路PDR、アナログ回路ANA、電源回路PC、ロジック回路LC、入出力回路IOCなどの各形成領域が配置されている。
BiC−DMOS(Bipolar Complementary Metal Oxide Semiconductor)分野においては、図2に示されるように、LDMOSトランジスタ、ロジックCMOSトランジスタおよびバイポーラトランジスタが混載される。このような分野においても、デザインスケーリングが進んできている。これにより従来のLOCOS(LoCal Oxidation of Silicon)に代えてSTIが用いられるようになってきている。
本実施の形態では、分離溝TNCのソース側壁面SWSにn型ウエル領域NWLおよびp-ドリフト領域DFTが交互に分布しているためインパクトイオン化が抑制できたと考えられる。つまりpLDMOSトランジスタLPTのON時には、p-ドリフト領域DFTには電流が流れる。しかしn型ウエル領域NWLには、チャネルに反転した部分を除いて電流は流れない。インパクトイオン化は、電流が流れている領域において発生する。このため、p-ドリフト領域DFTにおいてはインパクトイオン化が発生するが、n型ウエル領域NWLではインパクトイオン化は発生しない。よってn型ウエル領域NWLが配置されたソース側壁面SWSではインパクトイオン化が発生しないためインパクトイオン化を抑制できたと考えられる。
図19および図20に示されるように、本実施の形態の構成は、実施の形態1の構成と比較して、p-ドリフト領域DFTおよびn型ウエル領域NWLの構成において実施の形態1と異なっている。
Claims (10)
- 第1導電型の基板領域を有し、かつ主表面を有し、前記主表面に分離溝を有する半導体基板と、
前記半導体基板の前記主表面に配置された第1導電型のソース領域と、
前記主表面に配置され、前記ソース領域との間で前記分離溝を挟む第1導電型のドレイン領域と、
前記分離溝の下側に配置され、かつ前記ドレイン領域よりも低い不純物濃度を有する第1導電型のドリフト領域と、
前記ソース領域と前記分離溝との間の前記主表面に配置され、かつ前記ドリフト領域とpn接合を構成する第2導電型のウエル領域と、
前記ウエル領域および前記ドリフト領域に対して前記主表面とは反対側に配置された第2導電型の不純物領域と、
前記基板領域の前記主表面側に配置された第2導電型の埋め込み領域とを備え、
前記不純物領域は、前記ウエル領域の不純物濃度および前記埋め込み領域の不純物濃度よりも低い不純物濃度を有しており、かつ前記ドリフト領域の下面に接してpn接合を構成しており、
前記埋め込み領域は、前記基板領域とpn接合を構成しており、
前記不純物領域および前記埋め込み領域は、平面視において、前記ソース領域、前記ウエル領域および前記ドレイン領域と重なっており、
前記ウエル領域と前記ドリフト領域とにより構成されるpn接合は、前記分離溝の前記ソース領域側の側面に沿って前記主表面から前記分離溝の底面に向かって延びている、半導体装置。 - 前記ウエル領域は、第1櫛部を構成する複数のウエル歯部を有し、
前記ドリフト領域は、第2櫛部を構成する複数のドリフト歯部を有し、
前記複数のウエル歯部に含まれる2つの前記ウエル歯部は、前記複数のドリフト歯部に含まれる1つの前記ドリフト歯部を挟み込み、
前記ウエル歯部と前記ドリフト歯部とのpn接合が、前記分離溝の前記ソース領域側の側面に沿って前記主表面から前記分離溝の底面に向かって延びている、請求項1に記載の半導体装置。 - 前記複数のウエル歯部と前記複数のドリフト歯部とは、前記分離溝の前記ソース領域側の前記側面において交互に配置されている、請求項2に記載の半導体装置。
- 前記分離溝の前記ソース領域側の前記側面において、前記複数のウエル歯部の各々の前記主表面に沿う方向の寸法は、前記複数のドリフト歯部の各々の前記主表面に沿う方向の寸法よりも大きい、請求項2に記載の半導体装置。
- 前記ウエル領域の下面には前記ドリフト領域が接している、請求項2に記載の半導体装置。
- 前記ウエル領域の下面には前記ドリフト領域が接しておらず、前記不純物領域が接している、請求項2に記載の半導体装置。
- 前記主表面からの前記ドリフト領域の深さは、前記分離溝の深さよりも深い、請求項1に記載の半導体装置。
- 平面視において前記ウエル領域は前記ドリフト領域の周囲を取り囲んでいる、請求項1に記載の半導体装置。
- 前記分離溝に埋め込まれた分離絶縁層と、
前記ウエル領域と絶縁しながら対向するように、かつ前記分離絶縁層の上に延在するように前記主表面の上に形成されたゲート電極とをさらに備えた、請求項1に記載の半導体装置。 - 半導体基板の第1導電型の基板領域上に、第2導電型の埋め込み領域を形成する工程と、
前記埋め込み領域上に第2導電型の不純物領域を形成する工程と、
前記半導体基板の主表面に、互いにpn接合を構成する第1導電型のドリフト領域と第2導電型のウエル領域とを形成する工程と、
前記半導体基板の前記主表面に分離溝を形成する工程と、
前記分離溝との間で前記ウエル領域を挟みかつ前記ウエル領域とpn接合を構成する第1導電型のソース領域と、前記ソース領域との間で前記分離溝を挟みかつ前記ドリフト領域よりも高い不純物濃度を有する第1導電型のドレイン領域と、を前記主表面に形成する工程と、を備え、
前記不純物領域は、前記ウエル領域の不純物濃度および前記埋め込み領域の不純物濃度よりも低い不純物濃度を有しており、かつ前記ドリフト領域の下面に接してpn接合を構成しており、
前記埋め込み領域は、前記基板領域とpn接合を構成しており、
前記不純物領域および前記埋め込み領域は、平面視において、前記ソース領域、前記ウエル領域および前記ドレイン領域と重なっており、
前記ウエル領域と前記ドリフト領域とにより構成されるpn接合が、前記分離溝の前記ソース領域側の側面に沿って前記主表面から前記分離溝の底面に向かって延びるように前記分離溝が形成される、半導体装置の製造方法。
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