JP6833722B2 - 発光モジュール - Google Patents
発光モジュール Download PDFInfo
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- JP6833722B2 JP6833722B2 JP2017559161A JP2017559161A JP6833722B2 JP 6833722 B2 JP6833722 B2 JP 6833722B2 JP 2017559161 A JP2017559161 A JP 2017559161A JP 2017559161 A JP2017559161 A JP 2017559161A JP 6833722 B2 JP6833722 B2 JP 6833722B2
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- 239000002184 metal Substances 0.000 description 5
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Images
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/06—Electrode terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Description
20 発光パネル
21,22 透明フィルム
23 導体層
24 樹脂層
24P 接続パッド
30 基板
31 基材
32 導体層
33 導体層
34 ビア
35 絶縁シート
36 絶縁シート
50 発光素子
50B 発光素子
50G 発光素子
50R 発光素子
51 ベース基板
52 N型半導体層
53 活性層
54 P型半導体層
55,56 電極
57,58 バンプ
70 コネクタ
201〜237,251,252,261〜265 メッシュパターン
241 熱硬化性樹脂
242 熱可塑性樹脂
301〜336,351〜362,371,372,381,382 導体パターン
G1〜G9 発光素子群
Claims (11)
- 曲げ弾性率が0kgf/mm2より大きく320kgf/mm2以下で、透光性を有する第1絶縁フィルムと、
前記第1絶縁フィルムの一側の面に設けられる導体層と、
前記第1絶縁フィルムに対向して配置され、曲げ弾性率が0kgf/mm2より大きく320kgf/mm2以下の透光性を有する第2絶縁フィルムと、
前記第1絶縁フィルムと前記第2絶縁フィルムの間に配置され、一方の面に前記導体層に接続される一対の電極を有する複数の発光素子と、
複数の前記発光素子を前記第1絶縁フィルムに対して保持し、0℃から100℃の範囲での引張貯蔵弾性率が0.01GPa以上で1000GPa以下である樹脂層と、
を有する可撓性のある発光パネルと、
絶縁性を有する基材と、
前記基材の一側の面に設けられ、前記発光パネルの前記導体層を介して、複数の前記発光素子それぞれに接続される複数の第1導体パターンと、
前記基材の他側の面に設けられ、複数の前記第1導体パターンと交差する方向に設けられるとともに、前記第1導体パターンを介して、複数の前記発光素子にそれぞれ接続される第2導体パターンと、
前記第1導体パターンと前記第2導体パターンとを接続するビアと、
を有し、前記発光パネルの可撓性よりも可撓性が高く、前記第1絶縁フィルムに接続されるフレキシブル基板と、
を備え、
複数の前記発光素子は、相互に発光色が異なる第1発光素子及び第2発光素子を含み、
前記発光パネルの前記導体層と、前記フレキシブル基板の前記第1導体パターン及び前記第2導体パターンとによって、前記第1発光素子及び前記第2発光素子の一方の前記電極に共通して接続されるコモンラインと、前記第1発光素子及び前記第2発光素子の他方の前記電極にそれぞれ接続される個別ラインと、が形成され、
前記コモンライン及び前記個別ラインの間に電圧が選択的に印加されることで、複数の前記発光素子に含まれる前記第1発光素子及び前記第2発光素子を選択的に発光させることが可能な発光モジュール。 - 前記フレキシブル基板は、多層配線基板である請求項1に記載の発光モジュール。
- 前記導体層は、前記発光素子の一方の前記電極と前記第1導体パターンに接続される第1回路パターンと、前記発光素子の他方の前記電極と前記第1導体パターンに接続される第2回路パターンと、を有する請求項1又は2に記載の発光モジュール。
- 前記フレキシブル基板には、前記第2導体パターンと外部機器を接続するためのコネクタが設けられる請求項1乃至3のいずれか一項に記載の発光モジュール。
- 全光線透過率が5%以上95%以下で、曲げ弾性率が0kgf/mm2より大きく320kgf/mm2以下であり、透光性を有する第1絶縁フィルムと、
前記第1絶縁フィルムに対向して配置され、全光線透過率が5%以上95%以下で、曲げ弾性率が0kgf/mm2より大きく320kgf/mm2以下であり、透光性を有する第2絶縁フィルムと、
前記第1絶縁フィルムと前記第2絶縁フィルムの間に配置され、一方の面に一対の電極を有する複数の発光素子と、
複数の前記発光素子を前記第1絶縁フィルムに対して保持し、0℃から100℃の範囲での引張貯蔵弾性率が0.01GPa以上で1000GPa以下である樹脂層と、
前記第1絶縁フィルムの一側の面に設けられ、複数の前記発光素子の一方の前記電極をそれぞれ並列に接続する第1回路パターンと、
前記第1絶縁フィルムの一側の面に設けられ、複数の前記発光素子の他方の前記電極をそれぞれ並列に接続する第2回路パターンと、
を備え、
前記第1回路パターンと前記第2回路パターンの所定の位置に電圧を印加したときに、並列に接続された複数の前記発光素子のうちの端に位置する発光素子を流れる電流の電流値と、中央に位置する発光素子を流れる電流の電流値の差が5%以下であり、
並列に接続される複数の前記発光素子を40cm又は3m離れて観察したときに、複数の前記発光素子の発光強度の違いが感じられないことを特徴とする発光モジュール。 - 前記第1回路パターン及び前記第2回路パターンは、メッシュパターンである請求項3又は5に記載の発光モジュール。
- 前記発光素子の前記電極には、バンプが形成される請求項1乃至6のいずれか一項に記載の発光モジュール。
- 前記発光素子は、マトリクス状に二次元配置されている請求項1乃至7のいずれか一項に記載の発光モジュール。
- 複数の前記発光素子は、相互に異なる色の光を射出する第1発光素子と第2発光素子を含む請求項5に記載の発光モジュール。
- 複数の前記発光素子は、前記第1発光素子と前記第2発光素子を含む発光素子群を構成し、前記発光素子群は、マトリクス状に配列されている請求項1乃至4及び9のいずれか一項に記載の発光モジュール。
- 前記第1回路パターンと前記第2回路パターンに並列接続される前記発光素子の数は、15個以下である請求項5に記載の発光モジュール。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015257166 | 2015-12-28 | ||
JP2015257166 | 2015-12-28 | ||
JP2016062160 | 2016-03-25 | ||
JP2016062160 | 2016-03-25 | ||
PCT/JP2016/088318 WO2017115712A1 (ja) | 2015-12-28 | 2016-12-22 | 発光モジュール |
Publications (2)
Publication Number | Publication Date |
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JPWO2017115712A1 JPWO2017115712A1 (ja) | 2018-10-18 |
JP6833722B2 true JP6833722B2 (ja) | 2021-02-24 |
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US (1) | US10854582B2 (ja) |
JP (1) | JP6833722B2 (ja) |
CN (2) | CN111682017B (ja) |
WO (1) | WO2017115712A1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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EP3660903B1 (en) * | 2017-07-28 | 2022-02-09 | LG Chem, Ltd. | Transparent light emitting element display |
WO2019066336A1 (ko) * | 2017-09-26 | 2019-04-04 | 주식회사 엘지화학 | 투명 발광소자 디스플레이용 전극 기판 및 이의 제조방법 |
JP7117681B2 (ja) * | 2018-03-30 | 2022-08-15 | 日亜化学工業株式会社 | 発光モジュールの製造方法及び発光モジュール |
JP2020038895A (ja) * | 2018-09-03 | 2020-03-12 | 東芝ホクト電子株式会社 | 発光装置 |
JP7165857B2 (ja) * | 2018-09-03 | 2022-11-07 | 日亜化学工業株式会社 | 発光装置 |
CN109585629A (zh) * | 2018-11-21 | 2019-04-05 | 大连集思特科技有限公司 | 一种透明薄膜组成的led显示屏及其制作方法 |
CN111295071B (zh) * | 2018-12-07 | 2021-08-24 | 联想(新加坡)私人有限公司 | 模块以及基板 |
CN112351592B (zh) * | 2020-11-24 | 2021-11-30 | 中国科学技术大学 | 一种基于液晶高分子薄膜制备柔性电路板的方法 |
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US7575959B2 (en) * | 2004-11-26 | 2009-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
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JP4882792B2 (ja) * | 2007-02-25 | 2012-02-22 | 日亜化学工業株式会社 | 半導体発光素子 |
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KR20100003321A (ko) * | 2008-06-24 | 2010-01-08 | 삼성전자주식회사 | 발광 소자, 이를 포함하는 발광 장치, 상기 발광 소자 및발광 장치의 제조 방법 |
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JP5402456B2 (ja) * | 2009-09-18 | 2014-01-29 | 富士ゼロックス株式会社 | 発光装置、プリントヘッドおよび画像形成装置 |
WO2012026013A1 (ja) * | 2010-08-26 | 2012-03-01 | 京セミ株式会社 | 半導体素子付き織網基材の製造方法、その製造装置及び半導体素子付き織網基材 |
JP6166863B2 (ja) | 2010-09-13 | 2017-07-19 | 東芝ホクト電子株式会社 | 発光装置 |
JP5970688B2 (ja) * | 2011-11-02 | 2016-08-17 | セイコーエプソン株式会社 | 液晶装置および電子機器 |
KR20150025231A (ko) * | 2013-08-28 | 2015-03-10 | 서울반도체 주식회사 | 광원 모듈 및 그 제조 방법, 및 백라이트 유닛 |
WO2015058565A1 (en) * | 2013-10-24 | 2015-04-30 | He Shan Lide Electronic Enterprise Company Ltd. | Flexible circuit board and method for manufacturing the same, and led flexible strip light |
WO2015083366A1 (ja) * | 2013-12-02 | 2015-06-11 | 東芝ホクト電子株式会社 | 発光ユニット、発光装置及び発光ユニットの製造方法 |
KR102391361B1 (ko) * | 2015-01-14 | 2022-04-27 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
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US10854582B2 (en) | 2020-12-01 |
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CN111682017B (zh) | 2023-08-29 |
CN108369980B (zh) | 2020-07-21 |
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