JP6832594B2 - チップ型電解コンデンサのリード線端子 - Google Patents
チップ型電解コンデンサのリード線端子 Download PDFInfo
- Publication number
- JP6832594B2 JP6832594B2 JP2019215148A JP2019215148A JP6832594B2 JP 6832594 B2 JP6832594 B2 JP 6832594B2 JP 2019215148 A JP2019215148 A JP 2019215148A JP 2019215148 A JP2019215148 A JP 2019215148A JP 6832594 B2 JP6832594 B2 JP 6832594B2
- Authority
- JP
- Japan
- Prior art keywords
- metal wire
- lead
- terminal
- electrolytic capacitor
- type electrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003990 capacitor Substances 0.000 title claims description 25
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 239000002184 metal Substances 0.000 claims description 41
- 239000011247 coating layer Substances 0.000 claims description 17
- 239000011888 foil Substances 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
(a)外周に半田濡れ性が良好な被覆層412が設けられた所定長さの金属線材411を準備する工程。
(b)金属線材411をプレス加工してリード部41を形成する工程。
(c)コンデンサ素子3の電極箔にリード線端子4の端子部42を接続する工程。
4 リード線端子
41 リード部
42 端子部
411 金属線材
412 被覆層
Claims (2)
- チップ型電解コンデンサ(1)のコンデンサ素子(3)に接続されるリード線端子(4)であって、
帯板状のリード部(41)と、その一端に接合されて前記コンデンサ素子(3)の電極箔に接続される端子部(42)とを有し、
前記リード部(41)は、外周に半田濡れ性が良好な被覆層(412)が設けられた金属線材(411)から成り、前記端子部(42)が前記電極箔に接続される前の状態で前記金属線材(411)が帯板状にプレスされて形成され、前記リード部(41)の両面がプレス加工時における被押圧面であるリード線端子。 - 前記金属線材(411)が断面多角形状である請求項1記載のリード線端子。
Priority Applications (1)
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JP2019215148A JP6832594B2 (ja) | 2019-11-28 | 2019-11-28 | チップ型電解コンデンサのリード線端子 |
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JP2019215148A JP6832594B2 (ja) | 2019-11-28 | 2019-11-28 | チップ型電解コンデンサのリード線端子 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017030843A Division JP6656625B2 (ja) | 2016-10-04 | 2017-02-22 | チップ型電解コンデンサの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020031241A JP2020031241A (ja) | 2020-02-27 |
JP6832594B2 true JP6832594B2 (ja) | 2021-02-24 |
Family
ID=69624358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019215148A Active JP6832594B2 (ja) | 2019-11-28 | 2019-11-28 | チップ型電解コンデンサのリード線端子 |
Country Status (1)
Country | Link |
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JP (1) | JP6832594B2 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58191630U (ja) * | 1982-06-16 | 1983-12-20 | 松下電器産業株式会社 | 電子部品 |
JPH0217475Y2 (ja) * | 1984-10-31 | 1990-05-16 | ||
JP2965588B2 (ja) * | 1989-10-02 | 1999-10-18 | ニチコン株式会社 | 面実装用電解コンデンサ |
JP3289321B2 (ja) * | 1992-07-07 | 2002-06-04 | 松下電器産業株式会社 | チップ形アルミ電解コンデンサ |
JP2003105586A (ja) * | 2001-09-27 | 2003-04-09 | Kyowa Densen Kk | 電子部品用リード部材および該リード部材の製造方法 |
JP5334757B2 (ja) * | 2009-08-31 | 2013-11-06 | 三洋電機株式会社 | 電解コンデンサ |
MY177177A (en) * | 2013-09-30 | 2020-09-08 | Kohoku Kogyo Kk | Method for manufacturing tab terminal for electrolytic capacitor |
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2019
- 2019-11-28 JP JP2019215148A patent/JP6832594B2/ja active Active
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JP2020031241A (ja) | 2020-02-27 |
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