JP6831296B2 - 熱応動スイッチ素子及びそれを備えた電気回路。 - Google Patents
熱応動スイッチ素子及びそれを備えた電気回路。 Download PDFInfo
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- JP6831296B2 JP6831296B2 JP2017099126A JP2017099126A JP6831296B2 JP 6831296 B2 JP6831296 B2 JP 6831296B2 JP 2017099126 A JP2017099126 A JP 2017099126A JP 2017099126 A JP2017099126 A JP 2017099126A JP 6831296 B2 JP6831296 B2 JP 6831296B2
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- 230000005489 elastic deformation Effects 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000010956 nickel silver Substances 0.000 description 6
- 230000004044 response Effects 0.000 description 6
- 229910001316 Ag alloy Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 108091027981 Response element Proteins 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 2
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910000914 Mn alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910000711 U alloy Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
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- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- UTICYDQJEHVLJZ-UHFFFAOYSA-N copper manganese nickel Chemical compound [Mn].[Ni].[Cu] UTICYDQJEHVLJZ-UHFFFAOYSA-N 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
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- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- IVQODXYTQYNJFI-UHFFFAOYSA-N oxotin;silver Chemical compound [Ag].[Sn]=O IVQODXYTQYNJFI-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Images
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- Thermally Actuated Switches (AREA)
Description
1A :熱応動スイッチ素子
2 :固定片
3 :可動片
4 :熱応動素子
5 :変形抑制部材
5A :変形抑制部材
21 :固定接点
100 :電気回路
101 :電流ヒューズ
102 :直流電源
103 :負荷
SC1 :短絡回路
Claims (5)
- 固定接点を有する固定片と、
弾性変形することにより前記固定接点に接触可能に配された可動片と、
温度上昇に伴って変形することにより該可動片を前記固定接点から離隔する遮断状態から前記固定接点に接触する導通状態へと移行させる熱応動素子とを備え、
前記可動片が弾性変形によって前記固定接点と接触する前に、前記可動片と当接し、前記可動片の弾性変形を抑制する変形抑制部材をさらに備えたことを特徴とする熱応動スイッチ素子。 - 前記変形抑制部材は、前記熱応動素子が変形する温度よりも低い温度で軟化する請求項1記載の熱応動スイッチ素子。
- 前記変形抑制部材は、前記可動片を前記固定接点から離れる方向に付勢する弾性体である請求項1記載の熱応動スイッチ素子。
- 前記弾性体は、リフローソルダリングに用いられるソルダーペーストよりも高い温度で溶融する請求項3記載の熱応動スイッチ素子。
- 電流ヒューズを介して直流電源から負荷に電力を供給する電気回路であって、
請求項1乃至4のいずれかに記載の熱応動スイッチ素子を含み、
前記導通状態の前記熱応動スイッチ素子によって、前記直流電源と前記電流ヒューズとを短絡させる短絡回路を含むことを特徴とする電気回路。
Priority Applications (1)
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JP2017099126A JP6831296B2 (ja) | 2017-05-18 | 2017-05-18 | 熱応動スイッチ素子及びそれを備えた電気回路。 |
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JP2017099126A JP6831296B2 (ja) | 2017-05-18 | 2017-05-18 | 熱応動スイッチ素子及びそれを備えた電気回路。 |
Publications (2)
Publication Number | Publication Date |
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JP2018195486A JP2018195486A (ja) | 2018-12-06 |
JP6831296B2 true JP6831296B2 (ja) | 2021-02-17 |
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JP (1) | JP6831296B2 (ja) |
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