JP6827749B2 - Encapsulant - Google Patents
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- JP6827749B2 JP6827749B2 JP2016186333A JP2016186333A JP6827749B2 JP 6827749 B2 JP6827749 B2 JP 6827749B2 JP 2016186333 A JP2016186333 A JP 2016186333A JP 2016186333 A JP2016186333 A JP 2016186333A JP 6827749 B2 JP6827749 B2 JP 6827749B2
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- 239000008393 encapsulating agent Substances 0.000 title claims description 62
- 239000002245 particle Substances 0.000 claims description 92
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 53
- 239000011256 inorganic filler Substances 0.000 claims description 35
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 35
- 239000000395 magnesium oxide Substances 0.000 claims description 29
- 238000002156 mixing Methods 0.000 claims description 13
- 229920002050 silicone resin Polymers 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 claims description 5
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- 239000012798 spherical particle Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000945 filler Substances 0.000 description 95
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 12
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000011230 binding agent Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 7
- 239000004568 cement Substances 0.000 description 7
- 239000008096 xylene Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- GWESVXSMPKAFAS-UHFFFAOYSA-N Isopropylcyclohexane Natural products CC(C)C1CCCCC1 GWESVXSMPKAFAS-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910001120 nichrome Inorganic materials 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910003336 CuNi Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- -1 large Substances 0.000 description 1
- 231100001231 less toxic Toxicity 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、抵抗器等を含む電子部品の封止に使用する封入材に関する。 The present invention relates to an encapsulant used for encapsulating electronic components including resistors and the like.
従来より、セラミック製のケース内に巻線抵抗素子あるいは酸化金属皮膜抵抗素子を収納し、封入材により封止した大電力用の抵抗器が知られている。このような抵抗器は、例えば自動車のエンジンルーム内で使用され、発熱量が大きいため抵抗素子で発生した熱を外部へ逃がすことが重要になる。 Conventionally, there has been known a resistor for high electric power in which a winding resistance element or a metal oxide film resistance element is housed in a ceramic case and sealed with an encapsulant. Such a resistor is used, for example, in an engine room of an automobile, and since it generates a large amount of heat, it is important to release the heat generated by the resistance element to the outside.
例えば特許文献１は、基体上に抵抗膜を着膜した抵抗素子と、抵抗素子の両端に圧入した金属製キャップと、抵抗素子を内包するケースと、板状の電極端子と、抵抗素子をケース内に封止するための絶縁材料とで構成された、面実装が可能な高電力用の抵抗器を開示している。ここで絶縁材料は、アルミナ粉やシリカ粉を含有したセメント、樹脂等からなる。 For example, Patent Document 1 describes a resistance element having a resistance film formed on a substrate, metal caps press-fitted at both ends of the resistance element, a case containing the resistance element, a plate-shaped electrode terminal, and a resistance element. We disclose a surface mountable high power resistor composed of an insulating material for sealing inside. Here, the insulating material is made of cement, resin or the like containing alumina powder or silica powder.
また、大電力用の抵抗器として、従来よりセメント抵抗器（角型固定巻線抵抗器）が広く使用されている。例えば特許文献２は、抵抗素子と、抵抗素子を収容する絶縁ケースと、抵抗素子に当接するとともに絶縁ケースから導出される熱拡散板とを備え、抵抗素子を絶縁ケースに収容した状態で絶縁ケース内にセメントを充填して硬化させたセメント抵抗器を開示している。特許文献２のセメント抵抗器は、放熱効率を高めるため熱拡散板を抵抗素子に直接接触させた構造を有し、セメントは、砂状または粉末状の石英、ジルコニア、アルミナ、雲母等からなる耐熱絶縁材を主成分とし、シリコーン樹脂等のバインダー材を少量含む耐熱絶縁充填剤等を用いている。 Further, as a resistor for high power, a cement resistor (square fixed winding resistor) has been widely used conventionally. For example, Patent Document 2 includes a resistance element, an insulating case accommodating the resistance element, and a heat diffusion plate that comes into contact with the resistance element and is derived from the insulation case, and the insulation case is provided with the resistance element housed in the insulation case. A cement resistor in which a cement is filled and hardened is disclosed. The cement resistor of Patent Document 2 has a structure in which a heat diffusion plate is in direct contact with a resistance element in order to improve heat dissipation efficiency, and the cement is heat resistant made of sandy or powdery quartz, zirconia, alumina, mica, or the like. A heat-resistant insulating filler or the like containing an insulating material as a main component and a small amount of a binder material such as a silicone resin is used.
上述した従来の高電力用の抵抗器において絶縁材料として使用しているシリカ粉は、保存性、安定性に欠けるため長期間の保管には適さないという問題がある。また、上記従来の大電力用抵抗器（セメント抵抗器）は、熱伝導率の高い板状の金属を屈曲させて形成した熱拡散板を抵抗素子に接触させる等、抵抗器の構造により放熱効率を向上させている。加えて、熱拡散板のうち絶縁ケースに収容された収容部とセラミック基板とを熱伝導率の高い接着剤を使用して面接触させていることから、抵抗器の構造および製造工程が複雑化する。 Silica powder used as an insulating material in the above-mentioned conventional high-power resistors has a problem that it is not suitable for long-term storage because it lacks storage stability and stability. Further, the above-mentioned conventional high-power resistor (cement resistor) has a heat dissipation efficiency due to the structure of the resistor, such as bringing a heat diffusion plate formed by bending a plate-shaped metal having a high thermal conductivity into contact with a resistance element. Is improving. In addition, since the accommodating portion of the thermal diffusivity plate housed in the insulating case and the ceramic substrate are brought into surface contact with each other using an adhesive having high thermal conductivity, the structure and manufacturing process of the resistor are complicated. To do.
一方、封入材の熱伝導率を向上させようとする場合、フィラーを多量にバインダー樹脂に配合する（充填率を高める）ことが有効であっても、フィラーの量を増やすと流動性が低下するという問題がある。また、フィラーの充填率を高めて熱伝導率を向上させることは、封入材の空隙率が小さくなることを意味する。この場合の空隙は、封入材の熱膨張を吸収する役割を果たすため、空隙率が小さくなり過ぎると熱膨張を吸収しきれず、封入材が注入された絶縁性ケースに亀裂が入ったり、絶縁性ケースが破壊されるおそれがある。 On the other hand, when trying to improve the thermal conductivity of the encapsulant, even if it is effective to add a large amount of filler to the binder resin (increasing the filling rate), increasing the amount of filler lowers the fluidity. There is a problem. Further, increasing the filling rate of the filler to improve the thermal conductivity means that the porosity of the encapsulant becomes smaller. Since the voids in this case play a role of absorbing the thermal expansion of the encapsulant, if the porosity becomes too small, the thermal expansion cannot be completely absorbed, and the insulating case into which the encapsulant is injected may be cracked or have an insulating property. The case may be destroyed.
本発明は、上述した課題に鑑みて成されたものであり、その目的とするところは、電子部品の封止に用いる封入材として熱伝導率を向上させた封入材を提供することである。 The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an encapsulant having improved thermal conductivity as an encapsulant used for encapsulating electronic components.
かかる目的を達成し、上述した課題を解決する一手段として、例えば、以下の構成を備える。すなわち、本発明は、抵抗器、コンデンサ、バリスタ、ヒューズの封止に使用する封入材であって、前記封止材は少なくとも、粒子形状が多面体形状の無機フィラーと、粒子形状が球形の無機フィラーと、シリコーン樹脂とを含有し、前記多面体形状の無機フィラーは酸化アルミニウム粒子であり、前記球形の無機フィラーは酸化マグネシウム粒子であることを特徴とする。
また、本発明は、抵抗器、コンデンサ、バリスタ、ヒューズの封止に使用する封入材であって、前記封止材は少なくとも、粒子形状が多面体形状の無機フィラーと、粒子形状が球形の無機フィラーと、シリコーン樹脂とを含有し、前記多面体形状の無機フィラーの平均粒径はサブミクロン〜数ミクロンであり、前記球形の無機フィラーの平均粒径は数十ミクロン〜数百ミクロンであり、前記多面体形状の無機フィラーは酸化アルミニウム粒子であり、前記球形の無機フィラーは酸化マグネシウム粒子であることを特徴とする。 As one means for achieving such an object and solving the above-mentioned problems, for example, the following configuration is provided. That is, the present invention is an encapsulant used for encapsulating resistors, capacitors, varistor, and fuses , and the encapsulant is at least an inorganic filler having a polyhedron shape and an inorganic filler having a spherical particle shape. The polyhedron-shaped inorganic filler contains aluminum oxide particles, and the spherical inorganic filler is magnesium oxide particles .
Further, the present invention is an encapsulant used for encapsulating resistors, capacitors, varistor, and fuses, and the encapsulant is at least an inorganic filler having a polyhedron shape and an inorganic filler having a spherical particle shape. And the silicone resin, the average particle size of the polyhedron-shaped inorganic filler is submicron to several microns, the average particle size of the spherical inorganic filler is several tens of microns to several hundreds of microns, and the polyhedron The shape of the inorganic filler is aluminum oxide particles, and the spherical inorganic filler is magnesium oxide particles.
例えば前記球形の無機フィラーと前記多面体形状の無機フィラーの混合比は６：４〜８：２であることを特徴とする。 The mixing ratio of the inorganic filler example if the inorganic filler of the spherical said polyhedral shape 6: 4-8: characterized in that it is a 2.
また、本発明の抵抗器は、両端部に電極が装着された抵抗素子と、一面に開口部を有し、前記抵抗素子を収容する凹部が形成された絶縁性ケースとを備え、前記抵抗素子が収容された前記凹部を、前記開口部より充填した上記の封入材で封止してなることを特徴とする。例えば、前記封入材の空隙率が１０〜３５％であることを特徴とする。 Further, the resistor of the present invention includes a resistance element having electrodes mounted on both ends and an insulating case having an opening on one surface and a recess for accommodating the resistance element. The recess is sealed with the above-mentioned encapsulant filled from the opening. For example, the porosity of the encapsulant is 10 to 35%.
本発明によれば、平均粒径と材質の異なる複数の無機フィラーを混合した封入材により、総界面積を減らして界面での熱の損失を少なくして、熱伝導率を向上できる。 According to the present invention, the encapsulant in which a plurality of inorganic fillers having different average particle sizes and materials are mixed can reduce the total boundary area, reduce the heat loss at the interface, and improve the thermal conductivity.
以下、添付図面を参照して本発明に係る実施の形態例を詳細に説明する。図１は、本実施の形態例に係る抵抗器の製造工程を時系列で示すフローチャートである。また、図２（ａ）は、本実施の形態例に係る抵抗器の分解構造図、図２（ｂ）は、図１の工程を経て作製された抵抗器の外観斜視図である。 Hereinafter, examples of embodiments according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a flowchart showing a manufacturing process of a resistor according to an example of the present embodiment in chronological order. 2 (a) is an exploded structural view of the resistor according to the embodiment of the present embodiment, and FIG. 2 (b) is an external perspective view of the resistor produced through the steps of FIG.
図１のステップＳ１１において、抵抗器の抵抗素子を作製するため、例えばアルミナ等からなる円柱状の絶縁体、あるいはガラス繊維を束ねて長尺の棒状に形成した芯材の外周表面に、例えばＮｉＣｒ系合金、ＮｉＦｅ系合金等からなる抵抗線を所定ピッチで巻き付ける。抵抗線を巻き付けた芯材は長尺の状態であるため、ステップＳ１３で、カッターにより所定長の個片に切断し、抵抗素子を作製する。作製された抵抗素子を、図２（ａ）において符号１２で示す。 In step S11 of FIG. 1, in order to manufacture a resistance element of a resistor, for example, a columnar insulator made of alumina or the like, or an outer peripheral surface of a core material formed by bundling glass fibers into a long rod shape, for example, NiCr. A resistance wire made of a system alloy, a NiFe system alloy, or the like is wound at a predetermined pitch. Since the core material around which the resistance wire is wound is in a long state, it is cut into pieces having a predetermined length by a cutter in step S13 to produce a resistance element. The manufactured resistance element is shown by reference numeral 12 in FIG. 2A.
ステップＳ１５では、個片に切断された抵抗素子の両端部にキャップを装着する。具体的には、図２（ａ）に示すようにキャップ部１１ａと板状端子１３ａとが一体となった金属製キャップ１５ａと、キャップ部１１ｂと板状端子１３ｂとが一体となった金属製キャップ１５ｂ各々を、抵抗素子１２の両端部に装着（嵌合）する。 In step S15, caps are attached to both ends of the resistance element cut into individual pieces. Specifically, as shown in FIG. 2A, a metal cap 15a in which the cap portion 11a and the plate-shaped terminal 13a are integrated, and a metal in which the cap portion 11b and the plate-shaped terminal 13b are integrated are made. Each of the caps 15b is attached (fitted) to both ends of the resistance element 12.
なお、図２（ａ）に示す金属製キャップ１５ａ，１５ｂは、キャップ部１１ａと板状端子１３ａ、キャップ部１１ｂと板状端子１３ｂそれぞれを一体成型しているが、キャップ部と板状端子を個別に製造して、それらを溶接等で接続して一体化してもよい。 In the metal caps 15a and 15b shown in FIG. 2A, the cap portion 11a and the plate-shaped terminal 13a and the cap portion 11b and the plate-shaped terminal 13b are integrally molded, but the cap portion and the plate-shaped terminal are integrally molded. They may be manufactured individually and connected by welding or the like to be integrated.
ステップＳ１７において、セラミックケース１７の内部に封入材１９を充填する。図２（ａ）に示すようにセラミックケース１７は全体が直方体形状で、開口した一つの面を上面（開口面）１７ａとし、抵抗素子１２を収納する凹部１４が形成されている。この凹部１４に、無機材料である充填剤をバインダー等と混合して液状（泥状）にした封入材１９を充填する。なお、抵抗素子を収容するケースは、上述したセラミック等の絶縁材料の他、例えば樹脂製のケース、金属製（アルミ等）のケースであってもよい。 In step S17, the inside of the ceramic case 17 is filled with the encapsulant 19. As shown in FIG. 2A, the ceramic case 17 has a rectangular parallelepiped shape as a whole, one open surface is an upper surface (opening surface) 17a, and a recess 14 for accommodating the resistance element 12 is formed. The recess 14 is filled with an encapsulant 19 which is made into a liquid (mud) by mixing a filler which is an inorganic material with a binder or the like. In addition to the above-mentioned insulating material such as ceramic, the case for accommodating the resistance element may be, for example, a resin case or a metal (aluminum or the like) case.
続くステップＳ１９では、両端部に金属製キャップ１５ａ，１５ｂが装着された抵抗素子１２を、図２（ａ）において白抜き矢印で示すように移動して、封入材１９が充填されたセラミックケース１７の凹部１４に収容する。セラミックケース１７内に収容された抵抗素子１２は、図２（ｂ）に示すように封入材１９に浸って没入するが、金属製キャップ１５ａ，１５ｂの板状端子１３ａ，１３ｂの一部はセラミックケース１７の開口部１７ａから外部に突出し、それら突出した部位が抵抗器１０の外部接続端子１８ａ，１８ｂとなる。 In the following step S19, the resistance element 12 having the metal caps 15a and 15b mounted on both ends is moved as shown by the white arrows in FIG. 2A, and the ceramic case 17 filled with the encapsulant 19 is formed. It is housed in the recess 14 of the. As shown in FIG. 2B, the resistance element 12 housed in the ceramic case 17 is immersed in the encapsulant 19, but some of the plate-shaped terminals 13a and 13b of the metal caps 15a and 15b are made of ceramic. It protrudes outward from the opening 17a of the case 17, and the protruding portions serve as external connection terminals 18a and 18b of the resistor 10.
次にステップＳ２１において、例えば２００℃程度の温度で乾燥・焼付けを行って封入材１９を硬化させた後、ステップＳ２３において、セラミックケース１７の表面にレーザーによる定格等の表示を行う。そして、最後のステップＳ２５で抵抗器の抵抗値の検測、外観等の検査を行う。 Next, in step S21, the encapsulant 19 is cured by drying and baking at a temperature of, for example, about 200 ° C., and then in step S23, the rating or the like is displayed on the surface of the ceramic case 17 by a laser. Then, in the final step S25, the resistance value of the resistor is inspected, the appearance and the like are inspected.
次に、本実施の形態例に係る抵抗器の封止に使用する封入材について詳細に説明する。本実施の形態例に係る抵抗器の封入材は、フィラー（充填材）、バインダー樹脂、溶剤、添加剤（主に沈降抑制剤）により構成される樹脂組成物である。ここでは、充填材である無機フィラー（無機充填材）の粒子形状を、例えば八面体等の多面体形状とすることで熱伝導率を向上させている。また、後述するように、粒子形状と平均粒径の異なる複数種類のフィラーを組み合せる。 Next, the encapsulant used for encapsulating the resistor according to the present embodiment will be described in detail. The encapsulant of the resistor according to the embodiment of the present embodiment is a resin composition composed of a filler (filler), a binder resin, a solvent, and an additive (mainly a sedimentation inhibitor). Here, the thermal conductivity is improved by changing the particle shape of the inorganic filler (inorganic filler), which is a filler, to a polyhedral shape such as an octahedron. Further, as will be described later, a plurality of types of fillers having different particle shapes and average particle sizes are combined.
封入材のバインダー樹脂として、シリコーン樹脂の一種であるポリシルセスキオキサンを用いる。バインダー樹脂の含有量は、例えばシリコーン組成物全体に対して１０重量％以下とする。また、封入材の溶剤として、キシレンとＩＰＡ（イソプロピルアルコール）の混合溶媒、キシレンを用いないＩＰＡ、またはＩＰＡとシクロヘキサンの混合溶媒のいずれかを用いる。 Polysilcesquioxane, which is a kind of silicone resin, is used as the binder resin of the encapsulant. The content of the binder resin is, for example, 10% by weight or less based on the entire silicone composition. Further, as the solvent of the encapsulant, either a mixed solvent of xylene and IPA (isopropyl alcohol), IPA without xylene, or a mixed solvent of IPA and cyclohexane is used.
なお、近年における環境保全の観点からは、環境負荷の大きい物質であるキシレンを用いない（キシレンレス）タイプの溶媒を使用することが望まれるとともに、ＩＰＡは、シリコーン樹脂を比較的良好に溶解でき、廉価で毒性が少ないため比較的安全に使用できる。また、ＩＰＡとシクロヘキサンの混合溶媒は、ＩＰＡ／シクロヘキサン＝１／２の重量比で共沸系（任意の温度で液相組成と気相組成が常に均一である）を形成し、共沸点が６８．６℃と低いため、キシレンよりも蒸発速度が速いにもかかわらずコスト的に同程度であり、シリコーン樹脂との親和性もキシレンと同程度である。 From the viewpoint of environmental conservation in recent years, it is desirable to use a solvent of a type that does not use xylene (xylene-less), which is a substance having a large environmental load, and IPA can dissolve the silicone resin relatively well. It is inexpensive and less toxic, so it can be used relatively safely. Further, the mixed solvent of IPA and cyclohexane forms an azeotropic system (the liquid phase composition and the gas phase composition are always uniform at an arbitrary temperature) at a weight ratio of IPA / cyclohexane = 1/2, and the co-boiling point is 68. Since the temperature is as low as 0.6 ° C., the evaporation rate is faster than that of xylene, but the cost is the same, and the affinity with silicone resin is also the same as that of xylene.
封入材においてフィラーの比重が溶剤よりも大きいためフィラーが沈降しやすいことから、封入材の添加剤（沈降抑制剤）として、例えば、有機ベントナイト等の有機変性した層状鉱物を添加する。 Since the specific gravity of the filler in the encapsulant is larger than that of the solvent, the filler tends to settle. Therefore, as an additive (precipitation inhibitor) for the encapsulant, for example, an organically modified layered mineral such as organic bentonite is added.
上述したように、本実施の形態例に係る抵抗器の封入材において、多面体形状の無機フィラー（多面体フィラー）を使用することで、球状フィラーのみを使用した場合と比較して、フィラー同士が面で接触することとなり、熱伝導率を向上させることができる。すなわち、多面体フィラーは各面がほぼ平面であるため、破砕状フィラー、不定形フィラーよりもフィラー同士が面で接触しやすく、フィラー同士が面で接触することにより伝熱経路を確保し、熱伝導性が向上する。 As described above, by using the polyhedral-shaped inorganic filler (polyhedral filler) in the encapsulant of the resistor according to the embodiment of the present embodiment, the fillers face each other as compared with the case where only the spherical filler is used. The contact is made with, and the thermal conductivity can be improved. That is, since each surface of the polyhedral filler is almost flat, the fillers are more likely to come into contact with each other on the surface than the crushed filler and the amorphous filler, and the fillers come into contact with each other to secure a heat transfer path and conduct heat. Improves sex.
また、抵抗器内部の伝熱構造は、抵抗素子で発生した熱がフィラー内部の格子振動で伝わるので、フィラーは、熱損失が生じる結晶粒界を少なくすることが望ましい。このことから、結晶子のサイズが大きい（単結晶に近いものが望まれる）フィラーを使用する。よって、熱伝導率を向上させるためには、無機フィラーの粒径をできるだけ大きくして総界面積を減らし、界面での熱の損失を少なくすることが望ましい。 Further, in the heat transfer structure inside the resistor, the heat generated by the resistance element is transferred by the lattice vibration inside the filler, so that the filler preferably reduces the grain boundaries where heat loss occurs. For this reason, a filler having a large crystallite size (preferably close to a single crystal) is used. Therefore, in order to improve the thermal conductivity, it is desirable to increase the particle size of the inorganic filler as much as possible to reduce the total boundary area and reduce the heat loss at the interface.
さらに、封入材において熱伝導率を低下させる要因となる空気を含む空隙の割合を適切な範囲（１０〜３５％、望ましくは１０〜２０％）とするため、平均粒径が一種類のフィラーのみならず、複数種類の平均粒径のフィラーを組み合わせて、フィラーを高充填率化させる。 Furthermore, in order to keep the proportion of air-containing voids in the encapsulant, which is a factor that lowers the thermal conductivity, within an appropriate range (10 to 35%, preferably 10 to 20%), only fillers having one type of average particle size Instead, a plurality of types of fillers having an average particle size are combined to increase the filling rate of the fillers.
そこで、本実施の形態例に係る抵抗器の封入材の無機フィラーにおいて、多面体フィラーに球形フィラーを混合することにより、適切な流動性と空隙率を確保する。ここでは、無機フィラーとして、多面体状の酸化アルミニウム（アルミナ：Ａｌ2Ｏ3）粒子（小粒径フィラー）と、高温焼成された球状の酸化マグネシウム（マグネシア：ＭｇＯ）粒子（大〜中粒径フィラー）の２種類の材質、粒径のフィラーを使用する。 Therefore, in the inorganic filler of the encapsulant of the resistor according to the embodiment of the present embodiment, an appropriate fluidity and porosity are ensured by mixing the spherical filler with the polyhedral filler. Here, as inorganic fillers, polyhedral aluminum oxide (alumina: Al 2 O 3 ) particles (small particle size filler) and spherical magnesium oxide (magnesia: MgO) particles (large to medium particle size filler) fired at a high temperature are used. ) Two types of materials and particle size fillers are used.
より具体的には、平均粒径がサブミクロン〜数ミクロン程度の多面体状のアルミナ粒子と、平均粒径が数十ミクロン〜数百ミクロン程度の球状のマグネシア粒子を使用する。これらの多面体状のアルミナ粒子を「小粒径フィラー」、球状のマグネシア粒子を「大〜中粒径フィラー」と総称すると、本実施の形態例に係る抵抗器の封入材における無機フィラーは、小粒径フィラーと大〜中粒径フィラーを各１種類ずつ混合してなると言える。 More specifically, polyhedral alumina particles having an average particle size of about submicron to several microns and spherical magnesia particles having an average particle size of about several tens of microns to several hundreds of microns are used. When these polyhedral alumina particles are collectively referred to as "small particle size filler" and spherical magnesia particles are collectively referred to as "large to medium particle size filler", the inorganic filler in the encapsulant of the resistor according to the present embodiment is small. It can be said that one type of each of the particle size filler and the large to medium particle size filler is mixed.
アルミナとマグネシアは熱伝導率が良いことに加え、熱伝導率に異方性がなく等方的に熱が逃げることから、これらを使用して封入材の熱伝導率を向上させることができる。上述した大〜中粒径フィラーであるマグネシア粒子は、それ自体単体で熱伝導率が大きく、化学安定性が高いため、封入材の熱伝導率向上に寄与する。しかしながら、フィラーのすべてを大〜中粒径のマグネシア粒子で構成すると、粒径が比較的大きいため高充填が困難であり、空隙率が高くなりすぎてしまい、熱伝導率を向上させることが難しい。そこで、本実施の形態例に係る抵抗器では、比較的安価で熱伝導率が良く、化学的安定性の高い多面体形状のアルミナを小粒径フィラーとして選択した。 In addition to having good thermal conductivity, alumina and magnesia have no anisotropy in thermal conductivity and heat escapes isotropically. Therefore, they can be used to improve the thermal conductivity of the encapsulant. The magnesia particles, which are the above-mentioned large to medium particle size fillers, have high thermal conductivity and high chemical stability by themselves, and thus contribute to the improvement of the thermal conductivity of the encapsulant. However, if all of the filler is composed of magnesia particles having a large to medium particle size, high filling is difficult due to the relatively large particle size, the porosity becomes too high, and it is difficult to improve the thermal conductivity. .. Therefore, in the resistor according to the present embodiment, polyhedral alumina having a relatively low cost, good thermal conductivity, and high chemical stability was selected as the small particle size filler.
なお、小粒径フィラーはフィラー同士の接触点が多いため熱損失が大きくなるという欠点がある。この点に鑑みて、本実施の形態例に係る抵抗器では、小粒径フィラーとして多面体形状の粒子を使用し、フィラー同士を面接触させることで熱伝導率を向上させている。 It should be noted that the small particle size filler has a drawback that heat loss increases because there are many contact points between the fillers. In view of this point, in the resistor according to the present embodiment, polyhedral particles are used as the small particle size filler, and the fillers are brought into surface contact with each other to improve the thermal conductivity.
また、後述するように封入材における球状フィラーと多面体状フィラーの混合比は、６：４〜８：２の範囲内、望ましくは７：３とする。これにより、従来の抵抗器における熱伝導率が１〜１．５Ｗ／ｍ・Ｋ程度であったものを、２Ｗ／ｍ・Ｋ以上まで向上できることが判明した。 Further, as will be described later, the mixing ratio of the spherical filler and the polyhedral filler in the encapsulant is in the range of 6: 4 to 8: 2, preferably 7: 3. As a result, it was found that the thermal conductivity of the conventional resistor, which was about 1 to 1.5 W / m · K, can be improved to 2 W / m · K or more.
本実施の形態例に係る抵抗器は、上述したようにセラミックケース等の容器内に抵抗素子を配置し、封入材で封止している。そのため、封止材に熱膨張による体積の変化を吸収する空隙がある程度存在しないと、封入材が充填されたケースに亀裂が入り、破裂するおそれがある。一方、熱伝導率を向上させて放熱性を改善するためには、フィラー同士の接触面積を増やすことが重要であり、フィラーの充填率を高めれば、熱伝導率は向上する。しかし、フィラーの充填率が高いことは、封止材の空隙率が低下することを意味しており、熱膨張を吸収できなくなる。 In the resistor according to the embodiment of the present embodiment, as described above, the resistance element is arranged in a container such as a ceramic case and sealed with an encapsulant. Therefore, if the encapsulant does not have a certain amount of voids that absorb the change in volume due to thermal expansion, the case filled with the encapsulant may crack and burst. On the other hand, in order to improve the thermal conductivity and improve the heat dissipation, it is important to increase the contact area between the fillers, and if the filling rate of the fillers is increased, the thermal conductivity is improved. However, a high filler filling rate means that the porosity of the encapsulant is reduced, and thermal expansion cannot be absorbed.
そこで、本実施の形態例に係る抵抗器では、フィラーの充填率を６５〜９０％、望ましくは８０〜９０％以内（すなわち、空隙率を１０〜３５％、望ましくは１０〜２０％以内）に抑え、多面体状フィラーと球状フィラーにより接触面積を確保して、粒径と混合比を制御している。こうすることで熱伝導率が向上し、封止材の硬化時における封止材の空隙率が望ましい範囲となる。具体的には、熱伝導率が２Ｗ／ｍ・Ｋ以上、かつ空隙率が１０〜３５％、望ましくは１０〜２０％以内の抵抗器を得ることができる。 Therefore, in the resistor according to the present embodiment, the filling rate of the filler is 65 to 90%, preferably 80 to 90% or less (that is, the porosity is 10 to 35%, preferably 10 to 20% or less). The contact area is secured by suppressing the polyhedral filler and the spherical filler, and the particle size and the mixing ratio are controlled. By doing so, the thermal conductivity is improved, and the porosity of the sealing material at the time of curing of the sealing material becomes a desirable range. Specifically, a resistor having a thermal conductivity of 2 W / m · K or more and a porosity of 10 to 35%, preferably 10 to 20% or less can be obtained.
次に、本実施の形態例に係る抵抗器における封入材の具体的な組成（配合）について、実施例を参照して説明する。なお、以下の各実施例において熱伝導率の測定には、非定常法の一つである面加熱法を用いたホットディスク法と定常法を使用した。また、充填率は、封入材の見掛け上の密度を封入材の真密度で割って１００を掛けることによって求めた。 Next, the specific composition (blending) of the encapsulant in the resistor according to the present embodiment will be described with reference to the examples. In each of the following examples, the hot disk method and the steady method using the surface heating method, which is one of the unsteady methods, were used for the measurement of the thermal conductivity. The filling rate was determined by dividing the apparent density of the encapsulant by the true density of the encapsulant and multiplying by 100.
＜実施例１＞
表１は、実施例１に係る封入材として、キシレンを含有し、粒径の異なる２種類のフィラー（平均粒径のオーダーが一桁異なる２種類のフィラー）を使用した封入材であって、大粒径フィラー（フィラー１（Ｆ１））と小粒径フィラー（フィラー２（Ｆ２））の組成を６５／３０に固定した封入材（試料１〜９）について、熱伝導率と充填率を測定した結果を示している。
<Example 1>
Table 1 shows the encapsulant according to Example 1, which contains xylene and uses two types of fillers having different particle sizes (two types of fillers having an order of magnitude different in average particle size). Measure the thermal conductivity and filling rate of the encapsulant (Samples 1 to 9) in which the composition of the large particle size filler (filler 1 (F1)) and the small particle size filler (filler 2 (F2)) is fixed at 65/30. The result is shown.
表１より、実施例１に係る封入材は、充填率と熱伝導率の間に明確な相関は見受けられないものの、大〜中粒径フィラーとして大粒径ＭｇＯと中粒径ＭｇＯを使用し、小粒径フィラーとして小粒径多面体Ａｌ2Ｏ3を使用した試料において高い熱伝導率を示した。特に試料５（マグネシア粒子ＭｇＯ（４５．３μｍ）／多面体Ａｌ2Ｏ3（３．４μｍ）＝６５／３０（重量比））の場合、熱伝導率が最大の３．９８８Ｗ／ｍ・Ｋを示した。これは、比較対象とした現行品の２．３倍に当たり、このときの充填率は８０．５％であった。 From Table 1, in the encapsulant according to Example 1, although no clear correlation was found between the filling rate and the thermal conductivity, large particle size MgO and medium particle size MgO were used as the large to medium particle size fillers. , High thermal conductivity was shown in the sample using the small particle size polyhedron Al 2 O 3 as the small particle size filler. In particular, in the case of sample 5 (magnesia particle MgO (45.3 μm) / polyhedron Al 2 O 3 (3.4 μm) = 65/30 (weight ratio)), the thermal conductivity is 3.988 W / m · K at the maximum. It was. This was 2.3 times that of the current product to be compared, and the filling rate at this time was 80.5%.
その理由は、多面体アルミナ粒子Ａｌ2Ｏ3（３．４μｍ）が多面体形状であるため、大粒径の粒子の隙間に入り込んで高い充填率を確保できたと同時に、球状粒子と違って点接触ではなく面接触することで熱伝導のロスが少なくなる上、多面体アルミナ粒子は、例えば結晶子径が１２２ｎｍと他のフィラーと比べて大きいため、結晶粒界での熱伝導の損失が少ないことに起因すると考えられる。 The reason is that since the polyhedron alumina particles Al 2 O 3 (3.4 μm) have a polyhedron shape, they can enter the gaps of large particle size particles to secure a high filling rate, and at the same time, unlike spherical particles, in point contact. This is due to the fact that the loss of heat conduction at the crystal grain boundary is small because the polyhedron alumina particles have a crystallite diameter of 122 nm, which is larger than that of other fillers. It is thought that.
＜実施例２＞
表２は、実施例２に係る封入材として、キシレンを含有し、粒径の異なる３種類のフィラー（フィラー１（Ｆ１）、フィラー２（Ｆ２）、およびフィラー３（Ｆ３））を使用した封入材（試料１０〜１６）について熱伝導率と充填率を測定した結果を示している。
<Example 2>
Table 2 shows the encapsulation material according to Example 2, which contains xylene and uses three types of fillers (filler 1 (F1), filler 2 (F2), and filler 3 (F3)) having different particle sizes. The results of measuring the thermal conductivity and the filling rate of the materials (samples 10 to 16) are shown.
実施例２は、実施例１において最大の熱伝導率を示した試料５（ＭｇＯ（４５．３μｍ）／多面体Ａｌ2Ｏ3（３．４μｍ）＝６５／３０（重量比））の組成に対して、コスト的な観点から、高価な多面体Ａｌ2Ｏ3粒子を使用しないか、あるいはその使用量を抑えた試料についての特性を示している。 Example 2 is based on the composition of sample 5 (MgO (45.3 μm) / polyhedron Al 2 O 3 (3.4 μm) = 65/30 (weight ratio)) showing the maximum thermal conductivity in Example 1. Therefore, from the viewpoint of cost, the characteristics of the sample in which the expensive polyhedral Al 2 O 3 particles are not used or the amount used is suppressed are shown.
表２に示すように、フィラーとして粒径の異なる３種類のＭｇＯを組み合わせた場合、熱伝導率の向上は期待できなかったが、大、中、小の３種類の粒径のＭｇＯのうち、小粒径のＭｇＯを多面体Ａｌ2Ｏ3に変更することで熱伝導率の向上が確認できた。 As shown in Table 2, when three types of MgO having different particle sizes were combined as a filler, improvement in thermal conductivity could not be expected, but among the three types of MgO, large, medium, and small, It was confirmed that the thermal conductivity was improved by changing the small particle size MgO to the polyhedron Al 2 O 3 .
そこで、３種類のフィラー（Ｆ１,Ｆ２，Ｆ３）とバインダー（Ｂ）の重量比Ｆ１／Ｆ２／Ｆ３／Ｂにおいて、大粒径フィラーとしてのＭｇＯ粒子（４５．３μｍ）の重量比率を６５に固定し、残りのＦ２／Ｆ３についてＭｇＯ粒子（６．２３μｍ）と多面体Ａｌ2Ｏ3粒子（３．４μｍ）の重量比率を２５／５（試料１２）、２０／１０（試料１３）、１５／１５（試料１４）、１０／２０（試料１５）、５／２５（試料１６）にして、比較検討した。 Therefore, in the weight ratio F1 / F2 / F3 / B of the three types of fillers (F1, F2, F3) and the binder (B), the weight ratio of MgO particles (45.3 μm) as the large particle size filler is fixed at 65. Then, for the remaining F2 / F3, the weight ratio of MgO particles (6.23 μm) and polyhedron Al 2 O 3 particles (3.4 μm) was 25/5 (sample 12), 20/10 (sample 13), 15/15. (Sample 14), 10/20 (Sample 15), and 5/25 (Sample 16) were used for comparative examination.
その結果、試料１３（ＭｇＯ（４５．３μｍ）／ＭｇＯ（６．２３μｍ）／多面体Ａｌ2Ｏ3粒子（３．４μｍ）＝６５／２０／１０の組成）において最大の熱伝導率２．９８９Ｗ／ｍ・Ｋが得られた。また、このときの充填率は８３％と最も大きかった。よって、大粒径フィラーと中粒径フィラーをＭｇＯ、小粒径フィラーを多面体Ａｌ2Ｏ3粒子にすることで、封入材のコストダウンとともに熱伝導率の高いフィラーの配合組成が得られた。 As a result, the maximum thermal conductivity of sample 13 (MgO (45.3 μm) / MgO (6.23 μm) / polyhedral Al 2 O 3 particles (3.4 μm) = 65/20/10 composition) was 2.989 W / m · K was obtained. The filling rate at this time was the highest at 83%. Therefore, by using MgO for the large particle size filler and the medium particle size filler and polyhedral Al 2 O 3 particles for the small particle size filler, a blending composition of the filler having high thermal conductivity was obtained while reducing the cost of the encapsulant.
＜実施例３＞
表３は、実施例３に係る封入材として、キシレンを含有しない（キシレンレス）溶剤を用い、粒径の異なる２種類のフィラーの混合割合を変更した試料２０〜２４について、熱伝導率と充填率を測定した結果を示している。ここでは、実施例１で熱伝導率が最も大きい試料５に着目し、フィラー１（Ｆ１）として球形フィラーであるマグネシア粒子ＭｇＯ（４５．３μｍ）、フィラー２（Ｆ２）として多面体フィラーである多面体Ａｌ2Ｏ3（３．４μｍ）を選定した。
<Example 3>
Table 3 shows the thermal conductivity and filling of samples 20 to 24 in which a xylene-free (xylene-less) solvent was used as the encapsulant according to Example 3 and the mixing ratio of two types of fillers having different particle sizes was changed. The result of measuring the rate is shown. Here, focusing on the sample 5 having the highest thermal conductivity in Example 1, the magnesia particles MgO (45.3 μm) which is a spherical filler as the filler 1 (F1) and the polyhedral Al which is a polyhedral filler as the filler 2 (F2). 2 O 3 (3.4 μm) was selected.
実施例３では、フィラーＦ１，Ｆ２とバインダー樹脂Ｂの重量組成比（Ｆ１＋Ｆ２）／Ｂを９５／５に固定し、フィラーＦ１とフィラーＦ２の重量比率Ｆ１／Ｆ２を、９０／１０（試料２０）、８０／２０（試料２１）、７０／３０（試料２２）、６０／４０（試料２３）、５０／５０（試料２４）とした。また、沈降抑制剤としてＧＡＲＡＭＩＴＥ７３０５（ビックケミー社製）を、フィラーとバインダー樹脂の合計重量に対して外比で１重量％となるように添加した。 In Example 3, the weight composition ratio (F1 + F2) / B of the fillers F1 and F2 and the binder resin B is fixed to 95/5, and the weight ratio F1 / F2 of the filler F1 and the filler F2 is 90/10 (sample 20). , 80/20 (Sample 21), 70/30 (Sample 22), 60/40 (Sample 23), 50/50 (Sample 24). Further, GARAMITE 7305 (manufactured by Big Chemie) was added as a sedimentation inhibitor so as to be 1% by weight in terms of external ratio with respect to the total weight of the filler and the binder resin.
表３に示すように、粒径の異なる２種類のフィラーＦ１，Ｆ２の混合割合Ｆ１／Ｆ２を変更した封入材（試料２０〜２４）のうち、Ｆ１／Ｆ２＝７０／３０（７：３）の試料２２が熱伝導率、充填率ともに最も高く、Ｆ１／Ｆ２＝８０／２０（８：２）の試料２１、Ｆ１／Ｆ２＝６０／４０（６：４）の試料２３についても、従来品を超える良好な熱伝導率が得られた。これらより、封入材における球形の無機フィラーと多面体形状の無機フィラーの混合比は、６：４〜８：２の範囲が望ましく、７：３が好適と言える。また、いずれの試料においても、外観上フィラーが分離していない均一な状態が確認できた。なお、充填率は、試料２０〜２４のいずれも、上述した６５〜９０％の範囲内であった。 As shown in Table 3, among the encapsulants (samples 20 to 24) in which the mixing ratio F1 / F2 of the two types of fillers F1 and F2 having different particle sizes was changed, F1 / F2 = 70/30 (7: 3). Sample 22 has the highest thermal conductivity and filling rate, and F1 / F2 = 80/20 (8: 2) sample 21 and F1 / F2 = 60/40 (6: 4) sample 23 are also conventional products. Good thermal conductivity exceeding the above was obtained. From these, it can be said that the mixing ratio of the spherical inorganic filler and the polyhedral inorganic filler in the encapsulant is preferably in the range of 6: 4 to 8: 2, and preferably 7: 3. In addition, in all the samples, it was confirmed that the filler was not separated in appearance and was in a uniform state. The filling rate of each of the samples 20 to 24 was in the range of 65 to 90% described above.
以上説明したように本実施の形態例に係る抵抗器の封入材の組成として、粒径と材質の異なる２種類のフィラー、すなわち、小粒径フィラーとして多面体状のアルミナ粒子と、大〜中粒径フィラーとして球状のマグネシア粒子とを混合することで、熱伝導率の比較的良好な大〜中粒径フィラーをベースとして無機フィラーを高充填して空隙率を減らし、総界面積を減らして界面での熱の損失を少なくして、熱伝導率を向上させることができる。また、小粒径フィラーとして多面体状のアルミナ粒子を用いることにより、フィラー同士の接触点を減らすとともにフィラー同士の接触面積を増やし、点接触ではなく面接触とすることにより、熱伝導率を向上させることができる。 As described above, the composition of the encapsulant of the resistor according to the embodiment of the present embodiment includes two types of fillers having different particle sizes and materials, that is, polyhedral alumina particles as small particle size fillers and large to medium particles. By mixing spherical magnesia particles as a diameter filler, an inorganic filler is highly filled based on a large to medium particle size filler with relatively good thermal conductivity to reduce porosity, reduce the total boundary area, and interface. The thermal conductivity can be improved by reducing the heat loss in. Further, by using polyhedral alumina particles as the small particle size filler, the contact points between the fillers are reduced and the contact area between the fillers is increased, and the thermal conductivity is improved by making surface contact instead of point contact. be able to.
さらに、粒径と材質の異なる３種類のフィラー、すなわち、大粒径フィラーおよび中粒径フィラーとして球状のマグネシア粒子と、小粒径フィラーとして多面体状のアルミナ粒子とを混合した封入材においても、高い熱伝導率が得られた。 Further, even in an encapsulant in which three types of fillers having different particle sizes and materials, that is, spherical magnesia particles as a large particle size filler and a medium particle size filler and polyhedral alumina particles as a small particle size filler are mixed. High thermal conductivity was obtained.
また、封入材において複数種類の平均粒径のフィラーを組み合わせることでフィラーを高充填率化させて、封入材における空気を含む空隙の割合を少なくするとともに、多面体状フィラーと球状フィラーにより接触面積を確保し、粒径と混合比を制御することにより、熱伝導率の向上のみならず、封入材としての適切な流動性と空隙率を確保できる。 In addition, the filler is increased in filling rate by combining a plurality of types of fillers having an average particle size in the encapsulant to reduce the proportion of air-containing voids in the encapsulant, and the contact area is increased by the polyhedral filler and the spherical filler. By securing and controlling the particle size and the mixing ratio, it is possible not only to improve the thermal conductivity but also to secure appropriate fluidity and porosity as an encapsulant.
＜変形例＞
本発明は上述した実施の形態例に限定されず、種々の変形が可能である。例えば、上述した実施の形態例では抵抗器の抵抗素子を巻線型の抵抗素子としたが、これに限定されない。抵抗素子は、例えば円柱状絶縁体の外周に抵抗皮膜（金属皮膜、炭素皮膜、メタルグレーズ被膜、酸化金属皮膜）を着膜し、両端に金属製のキャップを嵌合した皮膜抵抗素子であってもよい。また、抵抗素子として、長方形状の金属板（ＣｕＮｉ系合金、ＮｉＣｒ系合金等）を所定パターンに形成した、平板状の金属板抵抗素子、あるいは長方形状の絶縁基板に酸化ルテニウム等の厚膜抵抗体と、抵抗体両端に電気的に接続した電極（銀等）をスクリーン印刷により形成し、その電極に外部接続端子を接続した厚膜抵抗素子を使用できる。
<Modification example>
The present invention is not limited to the above-described embodiment, and various modifications are possible. For example, in the above-described embodiment, the resistance element of the resistor is a winding type resistance element, but the present invention is not limited to this. The resistance element is, for example, a film resistance element in which a resistance film (metal film, carbon film, metal glaze film, metal oxide film) is formed on the outer circumference of a columnar insulator, and metal caps are fitted on both ends. May be good. Further, as the resistance element, a flat metal plate resistance element in which a rectangular metal plate (CuNi-based alloy, NiCr-based alloy, etc.) is formed in a predetermined pattern, or a thick film resistor such as ruthenium oxide on a rectangular insulating substrate. A thick film resistor element can be used in which electrodes (silver, etc.) electrically connected to both ends of the body and the resistor are formed by screen printing, and external connection terminals are connected to the electrodes.
上記実施の形態例に係る抵抗器では、外部に突出した板状端子１３ａ，１３ｂを抵抗器の外部接続端子１８ａ，１８ｂとしているが、これらの板状端子に代えてリード線をキャップ部１１ａ，１１ｂと一体成型するか、あるいは溶接等で接続して一体化して外部接続端子としてもよい。また、抵抗素子が上記の金属板抵抗素子の場合には、外部接続端子として、金属板の端部に接合した板状端子あるいはリード線を備える構成としてもよい。 In the resistor according to the above embodiment, the plate-shaped terminals 13a and 13b protruding to the outside are the external connection terminals 18a and 18b of the resistor, but instead of these plate-shaped terminals, a lead wire is used as a cap portion 11a, It may be integrally molded with 11b, or may be connected by welding or the like and integrated to form an external connection terminal. Further, when the resistance element is the above-mentioned metal plate resistance element, the external connection terminal may be configured to include a plate-shaped terminal or a lead wire joined to the end of the metal plate.
さらに、上記実施の形態例では外部接続端子１８ａ，１８ｂをケース開口部１７ａより突出させているが、例えばセラミックケース１７の長手方向の側面に溝を形成して、その溝より外部接続端子を外部へ突出させてもよい。 Further, in the above embodiment, the external connection terminals 18a and 18b are projected from the case opening 17a. For example, a groove is formed on the side surface of the ceramic case 17 in the longitudinal direction, and the external connection terminal is externally formed from the groove. It may be projected to.
また、上記実施の形態例では抵抗器の封止に使用する封入材を例に挙げたが、抵抗器に限定されず、ケース内に素子を封入するタイプの電子部品、例えばコンデンサ、バリスタ、ヒューズ等の封入材にも適用できる。 Further, in the above embodiment, the encapsulant used for encapsulating the resistor is given as an example, but the present invention is not limited to the resistor, and electronic components of the type in which the element is enclosed in the case, such as a capacitor, a varistor, and a fuse It can also be applied to encapsulants such as.
１０ 抵抗器
１１ａ，１１ｂ キャップ部
１２ 抵抗素子
１３ａ，１３ｂ 板状端子
１４ 凹部
１５ａ，１５ｂ 金属製キャップ
１７ セラミックケース
１７ａ 上面（開口面）
１８ａ，１８ｂ 外部接続端子
１９ 封入材
10 Resistors 11a, 11b Caps 12 Resistors 13a, 13b Plate-shaped terminals 14 Recesses 15a, 15b Metal caps 17 Ceramic case 17a Upper surface (opening surface)
18a, 18b External connection terminal 19 Encapsulating material
Claims (5)
前記封止材は少なくとも、粒子形状が多面体形状の無機フィラーと、粒子形状が球形の無機フィラーと、シリコーン樹脂とを含有し、
前記多面体形状の無機フィラーは酸化アルミニウム粒子であり、前記球形の無機フィラーは酸化マグネシウム粒子であることを特徴とする封入材。 Encapsulant used to seal resistors, capacitors, varistor, and fuses.
The encapsulant contains at least an inorganic filler having a polyhedral particle shape, an inorganic filler having a spherical particle shape, and a silicone resin.
The inorganic filler of polyhedral shape is aluminum oxide particles, sealing Irizai inorganic filler of said spherical you, wherein the magnesium oxide particles.
前記封止材は少なくとも、粒子形状が多面体形状の無機フィラーと、粒子形状 が球形の無機フィラーと、シリコーン樹脂とを含有し、
前記多面体形状の無機フィラーの平均粒径はサブミクロン〜数ミクロンであり、前記球形の無機フィラーの平均粒径は数十ミクロン〜数百ミクロンであり、
前記多面体形状の無機フィラーは酸化アルミニウム粒子であり、前記球形の無機フィラーは酸化マグネシウム粒子であることを特徴とする封入材。 Encapsulant used to seal resistors, capacitors, varistor, and fuses.
The encapsulant contains at least an inorganic filler having a polyhedral particle shape, an inorganic filler having a spherical particle shape, and a silicone resin.
The average particle size of the polyhedral inorganic filler is submicron to several microns, and the average particle size of the spherical inorganic filler is several tens to several hundreds of microns.
The inorganic filler of polyhedral shape is aluminum oxide particles, sealing Irizai inorganic filler of said spherical you, wherein the magnesium oxide particles.
一面に開口部を有し、前記抵抗素子を収容する凹部が形成された絶縁性ケースとを備え、
前記抵抗素子が収容された前記凹部を、前記開口部より充填した請求項１から３のいずれか１項に記載の封入材で封止してなることを特徴とする抵抗器。Resistor elements with electrodes mounted on both ends,
It is provided with an insulating case having an opening on one surface and a recess for accommodating the resistance element.
A resistor characterized in that the recess in which the resistance element is housed is sealed with the encapsulant according to any one of claims 1 to 3 , which is filled from the opening.
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