JP6827401B2 - パワー半導体モジュールの製造方法およびパワー半導体モジュール - Google Patents
パワー半導体モジュールの製造方法およびパワー半導体モジュール Download PDFInfo
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- JP6827401B2 JP6827401B2 JP2017206085A JP2017206085A JP6827401B2 JP 6827401 B2 JP6827401 B2 JP 6827401B2 JP 2017206085 A JP2017206085 A JP 2017206085A JP 2017206085 A JP2017206085 A JP 2017206085A JP 6827401 B2 JP6827401 B2 JP 6827401B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 26
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- 238000007789 sealing Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Description
本発明の第2のパワー半導体モジュールの製造方法は、(a)複数の横型パワートランジスタを内蔵するパワー半導体チップを形成する工程と、(b)パワー半導体チップの制御を行う制御用チップを、パワー半導体チップとは異なるプロセスルールに従って形成する工程と、(c)工程(a)で形成されたパワー半導体チップと工程(b)で形成された制御用チップとを用いて一つのパワー半導体モジュールを形成する工程と、を備える。工程(c)は、(c1)パワー半導体チップの下面がモールド樹脂から露出するように、パワー半導体チップの下面以外と制御用チップとをモールド樹脂で封止する工程を含む。
本発明の第2のパワー半導体モジュールの製造方法は、(a)複数の横型パワートランジスタを内蔵するパワー半導体チップを形成する工程と、(b)パワー半導体チップの制御を行う制御用チップを、パワー半導体チップとは異なるプロセスルールに従って形成する工程と、(c)工程(a)で形成されたパワー半導体チップと工程(b)で形成された制御用チップとを用いて一つのパワー半導体モジュールを形成する工程と、を備える。工程(c)は、(c1)パワー半導体チップの下面がモールド樹脂から露出するように、パワー半導体チップの下面以外と制御用チップとをモールド樹脂で封止する工程を含む。この製造方法によれば、制御用チップと横型パワートランジスタとが別のチップで形成されるため、制御用チップが横型パワートランジスタの導通時の発熱による受ける影響を小さくすることができる。従って、制御用チップの動作限界温度を低く設計することが出来るため、制御用チップの小型化ひいてはパワー半導体モジュールの小型化が実現できる。また、パワー半導体チップと制御用チップとを異なるプロセスルールに従って形成することにより、制御用チップを最適なプロセスルールに従って形成することが可能であり、制御用チップの小型化を図ることができる。
<A−1.構成>
図1は、実施の形態1に係るパワー半導体モジュール101の平面図であり、図2はパワー半導体モジュール101の断面図である。
図3は、実施の形態1に係るパワー半導体モジュール101の製造方法を示すフローチャートである。以下、図3に沿ってパワー半導体モジュール101の製造方法を説明する。
本実施の形態に係るパワー半導体モジュールの製造方法は、(a)複数の横型パワートランジスタ1UP,1UN,1VP,1VN,1WP,1WNを内蔵するパワー半導体チップである6in1チップ1を形成する工程と、(b)6in1チップ1の制御を行う制御用チップ3U,3V,3Wを、6in1チップ1とは異なるプロセスルールに従って形成する工程と、(c)工程(a)で形成された6in1チップ1と工程(b)で形成された制御用チップ3U,3V,3Wとを用いて一つのパワー半導体モジュールを形成する工程と、を備える。この製造方法によれば、制御用チップ3U,3V,3Wと横型パワートランジスタ1UP,1UN,1VP,1VN,1WP,1WNとが別のチップで形成されるため、制御用チップ3U,3V,3Wが横型パワートランジスタ1UP,1UN,1VP,1VN,1WP,1WNの導通時の発熱による受ける影響を小さくすることができる。従って、制御用チップ3U,3V,3Wの動作限界温度を低く設計することが出来るため、制御用チップ3U,3V,3Wの小型化、並びにパワー半導体モジュール101全体の小型化が実現できる。また、6in1チップ1と制御用チップ3U,3V,3Wとを異なるプロセスルールに従って形成することにより、制御用チップ3U,3V,3Wを最適なプロセスルールに従って形成することが可能であり、制御用チップ3U,3V,3Wの小型化を図ることができる。
<B−1.構成>
以下、実施の形態2の構成を、実施の形態1と共通または対応する構成には同一の参照符号を付して説明する。
実施の形態2に係るパワー半導体モジュール102の製造方法を図3のフローチャートに沿って説明する。
実施の形態2のパワー半導体モジュール102において、制御用チップは、複数の横型パワートランジスタのうち上アームとして動作するパワートランジスタ1UN,1VN,1WNを制御する上アーム制御用チップである制御用チップ3Nと、複数の横型パワートランジスタのうち下アームとして動作するパワートランジスタ1UP,1VP,1WPを制御する下アーム制御用チップである制御用チップ3Pと、を備える。そして、実施の形態2のパワー半導体モジュールの製造工程において、制御用チップ3Nと制御用チップ3Pとは異なるプロセスルールに従って形成される。従って、制御用チップ3Nと制御用チップ3Pとがそれぞれに最適なプロセスルールに従って作成されることによって、パワー半導体モジュール102の小型化が実現する。
<C−1.構成>
図6は、実施の形態3のパワー半導体モジュール103の断面図である。実施の形態1のパワー半導体モジュール101では、図2に示されるように、6in1チップ1の全体がモールド樹脂9により封止されていた。これに対して実施の形態3のパワー半導体モジュール103では、図6に示されるように、6in1チップ1の下面がモールド樹脂9から露出する。パワー半導体モジュール103のこれ以外の構成は、パワー半導体モジュール101と同様である。
実施の形態3のパワー半導体モジュールの製造方法は、(c1)パワー半導体チップである6in1チップ1の下面以外と制御用チップ3U,3V,3Wとをモールド樹脂9で封止する工程を備える。6in1チップ1の下面がモールド樹脂9から露出することにより、6in1チップ1の下面がパワー半導体モジュール外部への放熱面となる。従って、6in1チップ1と放熱面との間の定常熱抵抗を低減することが可能となる。
<D−1.構成>
図7は、実施の形態4のパワー半導体モジュール104の断面図である。パワー半導体モジュール104は、実施の形態1のパワー半導体モジュール101の構成において、6in1チップ1の下面に支持体11を接合し、支持体11の下面をモールド樹脂9から露出させたものである。支持体11は、例えば金属のような熱伝導の良い材料で構成される。パワー半導体モジュール104のこれ以外の構成は、パワー半導体モジュール101と同様である。
実施の形態4のパワー半導体モジュールの製造方法は、(c1)パワー半導体チップである6in1チップ1の下面に支持体11を接合する工程と、(c2)支持体11の下面以外、6in1チップ1、および制御用チップ3U,3V,3Wをモールド樹脂9で封止する工程とを備える。支持体11の下面がモールド樹脂9から露出することにより、支持体11の下面がパワー半導体モジュール外部への放熱面となる。従って、6in1チップ1と放熱面との間の過渡熱抵抗を低減することが可能となる。
Claims (6)
- (a)複数の横型パワートランジスタを内蔵するパワー半導体チップを形成する工程と、
(b)前記パワー半導体チップの制御を行う制御用チップを、前記パワー半導体チップとは異なるプロセスルールに従って形成する工程と、
(c)前記工程(a)で形成された前記パワー半導体チップと前記工程(b)で形成された前記制御用チップとを用いて一つのパワー半導体モジュールを形成する工程と、
を備え、
前記制御用チップは、前記複数の横型パワートランジスタのうち上アームとして動作するパワートランジスタを制御する上アーム制御用チップと、前記複数の横型パワートランジスタのうち下アームとして動作するパワートランジスタを制御する下アーム制御用チップと、を備え、
前記工程(b)は、前記上アーム制御用チップと前記下アーム制御用チップとを異なるプロセスルールに従って形成する工程である、
パワー半導体モジュールの製造方法。 - 前記工程(b)は、前記制御用チップを前記パワー半導体チップより小さい回路線幅で形成する工程である、
請求項1に記載のパワー半導体モジュールの製造方法。 - 前記工程(b)は、前記下アーム制御用チップを前記上アーム制御用チップより小さい回路線幅で形成する工程である、
請求項1または請求項2に記載のパワー半導体モジュールの製造方法。 - (a)複数の横型パワートランジスタを内蔵するパワー半導体チップを形成する工程と、
(b)前記パワー半導体チップの制御を行う制御用チップを、前記パワー半導体チップとは異なるプロセスルールに従って形成する工程と、
(c)前記工程(a)で形成された前記パワー半導体チップと前記工程(b)で形成された前記制御用チップとを用いて一つのパワー半導体モジュールを形成する工程と、を備え、
前記工程(c)は、
(c1)前記パワー半導体チップの下面がモールド樹脂から露出するように、前記パワー半導体チップの下面以外と前記制御用チップとを前記モールド樹脂で封止する工程を含む、
パワー半導体モジュールの製造方法。 - 前記工程(c)は、
(c1)前記パワー半導体チップの下面に支持体を接合する工程と、
(c2)前記支持体の下面以外、前記パワー半導体チップ、および前記制御用チップをモールド樹脂で封止する工程と、を含む、
請求項1から3のいずれか1項に記載のパワー半導体モジュールの製造方法。 - 複数の横型パワートランジスタを内蔵するパワー半導体チップと、
前記パワー半導体チップの制御を行う制御用チップとを備え、
前記制御用チップにおける半導体の回路線幅は、前記パワー半導体チップにおける半導体の回路線幅よりも小さく、
前記制御用チップは、前記複数の横型パワートランジスタのうち上アームとして動作するパワートランジスタを制御する上アーム制御用チップと、前記複数の横型パワートランジスタのうち下アームとして動作するパワートランジスタを制御する下アーム制御用チップと、を備え、
前記下アーム制御用チップにおける半導体の回路線幅は、前記上アーム制御用チップにおける半導体の回路線幅よりも小さい、
パワー半導体モジュール。
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