JP6818576B2 - Sheet pasting device and pasting method - Google Patents
Sheet pasting device and pasting method Download PDFInfo
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- JP6818576B2 JP6818576B2 JP2017019378A JP2017019378A JP6818576B2 JP 6818576 B2 JP6818576 B2 JP 6818576B2 JP 2017019378 A JP2017019378 A JP 2017019378A JP 2017019378 A JP2017019378 A JP 2017019378A JP 6818576 B2 JP6818576 B2 JP 6818576B2
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- 238000000034 method Methods 0.000 title claims description 15
- 239000000853 adhesive Substances 0.000 claims description 83
- 230000001070 adhesive effect Effects 0.000 claims description 83
- 238000003825 pressing Methods 0.000 claims description 42
- 238000005520 cutting process Methods 0.000 claims description 40
- 239000004744 fabric Substances 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 32
- 239000010410 layer Substances 0.000 description 9
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- -1 optical disks Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Description
本発明は、シート貼付装置および貼付方法に関する。 The present invention relates to a sheet pasting device and a sticking method.
従来、切断刃で剥離シートに仮着された原接着シートに閉ループ状の切込を設けることで、当該切込の内側に所定形状の接着シートを形成し、押圧部材で当該接着シートを被着体に押圧して貼付するシート貼付装置が知られている（例えば、特許文献１参照）。 Conventionally, by providing a closed loop-shaped notch in the original adhesive sheet temporarily attached to the release sheet with a cutting blade, an adhesive sheet having a predetermined shape is formed inside the notch, and the adhesive sheet is adhered by a pressing member. A sheet sticking device that presses against a body to stick is known (see, for example, Patent Document 1).
しかしながら、特許文献１に記載されたような従来のシート貼付装置では、原反を繰り出している途中で接着シートを形成し、当該形成した接着シートを所定量繰り出してから被着体に貼付するため、被着体に対する接着シートの貼付位置がずれてしまい、貼付精度が低下してしまうという不都合がある。 However, in the conventional sheet attaching device as described in Patent Document 1, an adhesive sheet is formed in the middle of feeding out the original fabric, and a predetermined amount of the formed adhesive sheet is fed out before being attached to the adherend. , There is a disadvantage that the sticking position of the adhesive sheet to the adherend is displaced and the sticking accuracy is lowered.
本発明の目的は、貼付精度の低下を抑制することができるシート貼付装置および貼付方法を提供することにある。 An object of the present invention is to provide a sheet pasting device and a sticking method capable of suppressing a decrease in sticking accuracy.
本発明は、請求項に記載した構成を採用した。 The present invention has adopted the configuration described in the claims.
以上のような本発明によれば、切断刃を支持手段に支持させ、原接着シートを押圧した押圧部材を支持手段の支持面に沿った所定方向に移動させることで、原接着シートから接着シートを形成すると同時に、当該接着シートを被着体に貼付することができ、貼付精度の低下を抑制することができる。 According to the present invention as described above, the cutting blade is supported by the support means, and the pressing member pressing the original adhesive sheet is moved in a predetermined direction along the support surface of the support means, whereby the original adhesive sheet is changed to the adhesive sheet. At the same time, the adhesive sheet can be attached to the adherend, and a decrease in attachment accuracy can be suppressed.
以下、本発明の一実施形態を図面に基づいて説明する。
なお、本実施形態におけるＸ軸、Ｙ軸、Ｚ軸は、それぞれが直交する関係にあり、Ｘ軸およびＹ軸は、所定平面内の軸とし、Ｚ軸は、前記所定平面に直交する軸とする。さらに、本実施形態では、Ｙ軸と平行な図１中手前方向から観た場合を基準とし、方向を示した場合、「上」がＺ軸の矢印方向で「下」がその逆方向、「左」がＸ軸の矢印方向で「右」がその逆方向、「前」がＹ軸と平行な図１中手前方向で「後」がその逆方向とする。
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
The X-axis, Y-axis, and Z-axis in the present embodiment are orthogonal to each other, the X-axis and the Y-axis are axes in a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. To do. Further, in the present embodiment, when viewed from the front direction in FIG. 1 parallel to the Y axis, when the direction is shown, "up" is the arrow direction of the Z axis and "down" is the opposite direction. "Left" is the direction of the arrow on the X-axis, "right" is the opposite direction, "front" is the middle front direction parallel to the Y-axis, and "rear" is the opposite direction.
図１において、シート貼付装置１０は、被着体としての半導体ウエハ（以下、単に「ウエハ」ともいう）ＷＦを支持する支持面２１Ａを有する支持手段２０と、帯状の原接着シートＡＳに剥離シートＲＬが仮着された原反ＲＳを繰り出す繰出手段３０と、支持手段２０に着脱自在に支持された切断刃４１を有し、切断刃４１で原接着シートＡＳ側から原接着シートＡＳを貫通する閉ループ状の切込ＣＵ（図２（Ａ）参照）を設け、切込ＣＵの内側に接着シートＡＳ１（図２（Ｂ）参照）を形成し、切込ＣＵの外側に不要シートＵＳを形成する切断手段４０と、剥離シートＲＬ側から原接着シートＡＳを押圧する押圧部材としての押圧ローラ５２を有し、原接着シートＡＳを押圧した押圧ローラ５２を支持面２１Ａに沿った所定方向に移動させて、切断刃４１で原接着シートＡＳに切込ＣＵを設けるとともに、ウエハＷＦに接着シートＡＳ１を貼付する押圧手段５０とを備えている。
原接着シートＡＳは、基材シートＢＳと、基材シートＢＳの一方の面側に接着剤ＡＤ層を有し、基材シートＢＳの他方の面側に剥離シートＲＬが疑似接着によって仮着されている。
In FIG. 1, the sheet attaching device 10 has a support means 20 having a support surface 21A for supporting a semiconductor wafer (hereinafter, simply referred to as “wafer”) WF as an adherend, and a strip-shaped original adhesive sheet AS with a release sheet. It has a feeding means 30 for feeding out the raw fabric RS to which the RL is temporarily attached, and a cutting blade 41 detachably supported by the supporting means 20, and the cutting blade 41 penetrates the original adhesive sheet AS from the original adhesive sheet AS side. A closed loop-shaped notch CU (see FIG. 2 (A)) is provided, an adhesive sheet AS1 (see FIG. 2 (B)) is formed inside the notch CU, and an unnecessary sheet US is formed on the outside of the notch CU. It has a cutting means 40 and a pressing roller 52 as a pressing member for pressing the original adhesive sheet AS from the release sheet RL side, and the pressing roller 52 pressing the original adhesive sheet AS is moved in a predetermined direction along the support surface 21A. The cutting blade 41 is provided with a notch CU in the original adhesive sheet AS, and is provided with a pressing means 50 for attaching the adhesive sheet AS1 to the wafer WF.
The original adhesive sheet AS has an adhesive AD layer on one surface side of the base sheet BS and the base sheet BS, and the release sheet RL is temporarily attached to the other surface side of the base sheet BS by pseudo-adhesion. ing.
支持手段２０は、減圧ポンプや真空エジェクタ等の図示しない減圧手段によってウエハＷＦを支持面２１Ａで吸着保持可能なテーブル２１を備えている。 The support means 20 includes a table 21 capable of sucking and holding the wafer WF on the support surface 21A by a pressure reducing means (not shown) such as a pressure reducing pump or a vacuum ejector.
繰出手段３０は、原反ＲＳを支持する支持ローラ３１と、原反ＲＳを案内するガイドローラ３２と、駆動機器としてのリニアモータ３３の第１スライダ３３Ａに支持されたフレーム３４と、当該フレーム３４に支持された駆動機器としての回動モータ３５Ａによって回動する駆動ローラ３５と、駆動ローラ３５との間に不要シートＵＳおよび剥離シートＲＬを挟み込むピンチローラ３６と、不要シートＵＳおよび剥離シートＲＬを案内するガイドローラ３７と、図示しない駆動機器によって駆動し、不要シートＵＳおよび剥離シートＲＬを回収する回収ローラ３８とを備えている。 The feeding means 30 includes a support roller 31 that supports the original fabric RS, a guide roller 32 that guides the original fabric RS, a frame 34 supported by the first slider 33A of the linear motor 33 as a drive device, and the frame 34. A pinch roller 36 that sandwiches an unnecessary sheet US and a release sheet RL between a drive roller 35 that is rotated by a rotation motor 35A as a drive device supported by the drive roller 35, and an unnecessary sheet US and a release sheet RL. It includes a guide roller 37 for guiding, and a recovery roller 38 that is driven by a drive device (not shown) to collect unnecessary sheet US and release sheet RL.
切断手段４０は、内径がウエハＷＦの外形よりも大きい円環状の切断刃４１を備えている。切断刃４１は、磁石（永久磁石や電磁石）および当該磁石に磁着可能な例えば鉄を含むもの等のうち一方で構成され、テーブル２１における少なくとも支持面２１Ａは、他方で構成され、切断刃４１と支持面２１Ａとが相互に磁着可能に構成されている。 The cutting means 40 includes an annular cutting blade 41 having an inner diameter larger than the outer diameter of the wafer WF. The cutting blade 41 is composed of one of a magnet (permanent magnet and an electromagnet) and one containing, for example, iron that can be magnetized on the magnet, and at least the support surface 21A in the table 21 is composed of the other, and the cutting blade 41 is formed. And the support surface 21A are configured to be magnetized with each other.
押圧手段５０は、リニアモータ３３の第２スライダ３３Ｂに支持された駆動機器としての直動モータ５１の出力軸５１Ａに支持された押圧ローラ５２を備えている。 The pressing means 50 includes a pressing roller 52 supported by the output shaft 51A of the linear motor 51 as a driving device supported by the second slider 33B of the linear motor 33.
以上のシート貼付装置１０において、ウエハＷＦに接着シートＡＳ１を貼付する手順について説明する。
先ず、各部材が初期位置に配置された図１中実線で示すシート貼付装置１０に対し、作業者が原反ＲＳを図１に示すようにセットした後、図示しない操作パネルやパーソナルコンピュータ等の入力手段を介して自動運転開始の信号を入力する。そして、作業者または多関節ロボットやベルトコンベア等の図示しない搬送手段がテーブル２１の支持面２１Ａ上にウエハＷＦを載置すると、支持手段２０が図示しない減圧手段を駆動し、ウエハＷＦを吸着保持する。
The procedure for attaching the adhesive sheet AS1 to the wafer WF in the above sheet attaching device 10 will be described.
First, after the operator sets the original fabric RS as shown in FIG. 1 on the sheet attaching device 10 shown by the solid line in FIG. 1 in which each member is arranged at the initial position, an operation panel, a personal computer, or the like (not shown) is used. The signal for starting automatic operation is input via the input means. Then, when a transport means (not shown) such as an operator or an articulated robot or a belt conveyor places the wafer WF on the support surface 21A of the table 21, the support means 20 drives a decompression means (not shown) to suck and hold the wafer WF. To do.
次に、押圧手段５０が直動モータ５１を駆動し、押圧ローラ５２を下降させて原接着シートＡＳを切断刃４１左端部に押圧して当該原接着シートＡＳに切込ＣＵを形成した後、繰出手段３０がリニアモータ３３を駆動し、押圧ローラ５２を図２（Ａ）の二点鎖線で示す位置まで支持面２１Ａに沿って右方向に移動させる。これにより、原接着シートＡＳに設けられた閉ループ状の切込ＣＵの外側に不要シートＵＳが形成され、その内側にウエハＷＦよりも大きい接着シートＡＳ１が形成されると同時に、当該接着シートＡＳ１がウエハＷＦに貼付される。次いで、押圧手段５０が直動モータ５１を駆動し、押圧ローラ５２を上昇させた後、繰出手段３０がリニアモータ３３および回動モータ３５Ａを駆動し、フレーム３４を右方向に移動させ、図２（Ｂ）に示すように、接着シートＡＳ１から剥離シートＲＬを剥離する。 Next, the pressing means 50 drives the linear motor 51 to lower the pressing roller 52 to press the original adhesive sheet AS against the left end of the cutting blade 41 to form a cut CU in the original adhesive sheet AS. The feeding means 30 drives the linear motor 33 to move the pressing roller 52 to the right along the support surface 21A to the position indicated by the alternate long and short dash line in FIG. 2 (A). As a result, an unnecessary sheet US is formed on the outside of the closed loop-shaped notch CU provided on the original adhesive sheet AS, and an adhesive sheet AS1 larger than the wafer WF is formed on the inside thereof, and at the same time, the adhesive sheet AS1 is formed. It is attached to the wafer WF. Next, after the pressing means 50 drives the linear motor 51 and raises the pressing roller 52, the feeding means 30 drives the linear motor 33 and the rotary motor 35A to move the frame 34 to the right, and FIG. As shown in (B), the release sheet RL is peeled from the adhesive sheet AS1.
この後、繰出手段３０が駆動ローラ３５をロックさせた状態で、リニアモータ３３を駆動し、フレーム３４を初期位置に復帰させて未使用の原反ＲＳを繰り出すとともに、繰出手段３０が図示しない駆動機器を駆動し、回収ローラ３８で不要シートＵＳおよび剥離シートＲＬを回収する。そして、支持手段２０が図示しない減圧手段の駆動を停止し、図示しない搬送手段で接着シートＡＳ１が貼付されたウエハＷＦを次工程に搬送した後、繰出手段３０がリニアモータ３３を駆動し、押圧ローラ５２を初期位置に復帰させ、以降上記同様の動作が繰り返される。 After that, with the drive roller 35 locked by the feeding means 30, the linear motor 33 is driven, the frame 34 is returned to the initial position to feed the unused raw fabric RS, and the feeding means 30 is not shown. The equipment is driven, and the unnecessary sheet US and the release sheet RL are collected by the collection roller 38. Then, the support means 20 stops driving the decompression means (not shown), and after the wafer WF to which the adhesive sheet AS1 is attached is conveyed to the next step by the conveying means (not shown), the feeding means 30 drives and presses the linear motor 33. The roller 52 is returned to the initial position, and the same operation as described above is repeated thereafter.
以上のような実施形態によれば、切断刃４１を支持手段２０に支持させ、原接着シートＡＳを押圧した押圧ローラ５２を支持手段２０の支持面２１Ａに沿った所定方向に移動させることで、原接着シートＡＳから接着シートＡＳ１を形成すると同時に、当該接着シートＡＳ１をウエハＷＦに貼付することができ、貼付精度の低下を抑制することができる。 According to the above embodiment, the cutting blade 41 is supported by the support means 20, and the pressing roller 52 that presses the original adhesive sheet AS is moved in a predetermined direction along the support surface 21A of the support means 20. At the same time as forming the adhesive sheet AS1 from the original adhesive sheet AS, the adhesive sheet AS1 can be attached to the wafer WF, and a decrease in attachment accuracy can be suppressed.
以上のように、本発明を実施するための最良の構成、方法等は、前記記載で開示されているが、本発明は、これに限定されるものではない。すなわち、本発明は、主に特定の実施形態に関して特に図示され、かつ説明されているが、本発明の技術的思想および目的の範囲から逸脱することなく、以上述べた実施形態に対し、形状、材質、数量、その他の詳細な構成において、当業者が様々な変形を加えることができるものである。また、上記に開示した形状、材質などを限定した記載は、本発明の理解を容易にするために例示的に記載したものであり、本発明を限定するものではないから、それらの形状、材質などの限定の一部もしくは全部の限定を外した部材の名称での記載は、本発明に含まれる。 As described above, the best configuration, method, etc. for carrying out the present invention are disclosed in the above description, but the present invention is not limited thereto. That is, the present invention is particularly illustrated and described primarily with respect to a particular embodiment, but without departing from the scope of the technical idea and purpose of the present invention, with respect to the embodiments described above. Those skilled in the art can make various modifications in terms of material, quantity, and other detailed configurations. Further, the description limiting the shape, material, etc. disclosed above is exemplarily described for facilitating the understanding of the present invention, and does not limit the present invention. Therefore, those shapes, materials, etc. The description by the name of the member excluding some or all of the restrictions such as the above is included in the present invention.
例えば、原接着シートは、帯状のものに限らず枚葉状のものであってもよく、繰出手段３０は、剥離シートＲＬに仮着された枚葉状の原接着シートを繰り出してもよい。 For example, the raw adhesive sheet is not limited to a strip-shaped one, and may be a single-wafer-shaped one, and the feeding means 30 may feed out the single-leaf-shaped raw adhesive sheet temporarily attached to the release sheet RL.
切断手段４０は、ウエハＷＦよりも大きい接着シートＡＳ１を形成するのではなく、異なる形状のものを形成したり、ウエハＷＦと同形状のものを形成したり、ウエハＷＦよりも小さいものを形成してもよい。
ウエハＷＦよりも小さいものを形成する場合、例えば、図２（Ａ）中の符号ＡＡの図に示すように、切断手段４０に代えて、内部にウエハＷＦを配置可能な円形の開口部４６Ａを有する基台下部４６および当該基台下部４６の上部から内側に円環状に突出する基台上部４７を備える基台４８と、基台上部４７の突出先端側の上面に設けられ、内径がウエハＷＦの外径よりも小さい円環状の切断刃４９とを備え、基台４８が支持手段２０に着脱自在に構成された切断手段４５を採用してもよい。
このような構成において、ウエハＷＦに接着シートＡＳ１を貼付する場合、先ず、支持手段２０に切断手段４５を取り付けていない状態において、図示しない搬送手段がテーブル２１の支持面２１Ａ上にウエハＷＦを載置し、支持手段２０がウエハＷＦを吸着保持した後、作業者または多関節ロボットやベルトコンベア等の図示しない搬送手段が符号ＡＡの図に示すように、切断手段４５を支持手段２０に取り付ける。その後、上記実施形態と同様の動作により、原接着シートＡＳの切込ＣＵの内側にウエハＷＦよりも小さい接着シートＡＳ１を形成すると同時に、当該接着シートＡＳ１をウエハＷＦに貼付する。そして、接着シートＡＳ１から剥離シートＲＬを剥離し、回収ローラ３８で不要シートＵＳおよび剥離シートＲＬを回収してから切断手段４５を支持手段２０から取り外し、図示しない搬送手段で接着シートＡＳ１が貼付されたウエハＷＦを次工程に搬送した後、上記同様の動作が繰り返される。
切断手段４０は、切断刃４１が上面視で複数の円弧状に分割されていてもよく、この場合、接着シートＡＳ１の貼付処理時には隣り合う切断刃４１同士を接触させて円環状にし、ウエハＷＦの支持手段２０への載置時や取り替え時にはこれらの処理を行いやすいように隣り合う切断刃４１を離間させてもよく、また切断刃４１同士の接近離間は、作業者または多関節ロボットあるいは駆動機器等が行ってもよい。
切断手段４０は、メカチャックやチャックシリンダ等の把持手段、クーロン力、接着剤、粘着剤、吸引吸着、ベルヌーイ吸着、駆動機器等で支持手段２０に着脱自在に支持されていてもよい。
切断刃４１、４９は、支持手段２０に着脱不能に固定されていてもよい。
The cutting means 40 does not form an adhesive sheet AS1 larger than the wafer WF, but forms a different shape, forms the same shape as the wafer WF, or forms a smaller one than the wafer WF. May be.
When forming a wafer smaller than the wafer WF, for example, as shown in the figure of reference numeral AA in FIG. 2 (A), instead of the cutting means 40, a circular opening 46A in which the wafer WF can be arranged is provided. A base 48 having a lower base 46 and a base upper 47 protruding inward from the upper part of the base lower 46, and a wafer WF provided on the upper surface of the base upper 47 on the protruding tip side. A cutting means 45 having an annular cutting blade 49 smaller than the outer diameter of the above and having a base 48 detachably attached to the supporting means 20 may be adopted.
In such a configuration, when the adhesive sheet AS1 is attached to the wafer WF, first, in a state where the cutting means 45 is not attached to the support means 20, a transport means (not shown) places the wafer WF on the support surface 21A of the table 21. After the wafer WF is attracted and held by the support means 20, a worker or a transport means (not shown) such as an articulated robot or a belt conveyor attaches the cutting means 45 to the support means 20 as shown in the figure of reference numeral AA. Then, by the same operation as in the above embodiment, the adhesive sheet AS1 smaller than the wafer WF is formed inside the notch CU of the original adhesive sheet AS, and at the same time, the adhesive sheet AS1 is attached to the wafer WF. Then, the release sheet RL is peeled off from the adhesive sheet AS1, the unnecessary sheet US and the release sheet RL are collected by the recovery roller 38, the cutting means 45 is removed from the support means 20, and the adhesive sheet AS1 is attached by a transport means (not shown). After the wafer WF is transferred to the next step, the same operation as described above is repeated.
In the cutting means 40, the cutting blades 41 may be divided into a plurality of arcs in a top view. In this case, when the adhesive sheet AS1 is attached, the cutting blades 41 adjacent to each other are brought into contact with each other to form an annular shape, and the wafer WF is formed. The adjacent cutting blades 41 may be separated from each other so that these processes can be easily performed when the cutting blades are placed on the supporting means 20 or replaced, and the cutting blades 41 can be separated from each other by an operator, an articulated robot, or a drive. Equipment etc. may do it.
The cutting means 40 may be detachably supported by the supporting means 20 by a gripping means such as a mechanical chuck or a chuck cylinder, a Coulomb force, an adhesive, an adhesive, suction suction, Bernoulli suction, a drive device, or the like.
The cutting blades 41 and 49 may be non-detachably fixed to the support means 20.
押圧手段５０は、初めに被着体の中央部上方の原接着シートＡＳを押圧ローラ５２で押圧し、その後、押圧ローラ５２を左右方向に移動させてもよいし、人手で押圧ローラ５２を昇降させたり、所定方向に移動させてもよい。
押圧ローラ５２を昇降させる直動モータ５１に代えてまたは併用して、支持手段２０を昇降させる構成を設けて、ウエハＷＦを接着シートＡＳ１に対して接近させてもよい。
押圧ローラ５２の位置を固定しておきまたは、押圧ローラ５２を移動させつつ接着シートＡＳ１および支持手段２０を移動させて接着シートＡＳ１をウエハＷＦに貼付してもよい。
The pressing means 50 may first press the original adhesive sheet AS above the central portion of the adherend with the pressing roller 52, and then move the pressing roller 52 in the left-right direction, or manually raise and lower the pressing roller 52. It may be moved or moved in a predetermined direction.
The wafer WF may be brought closer to the adhesive sheet AS1 by providing a configuration for raising and lowering the support means 20 in place of or in combination with the linear motor 51 for raising and lowering the pressing roller 52.
The position of the pressing roller 52 may be fixed, or the adhesive sheet AS1 and the supporting means 20 may be moved while the pressing roller 52 is moved to attach the adhesive sheet AS1 to the wafer WF.
また、本発明における原接着シートＡＳ、接着シートＡＳ１（以下、単に「接着シート」という）および被着体の材質、種別、形状等は、特に限定されることはない。例えば、接着シートは、円形、楕円形、三角形や四角形等の多角形、その他の形状であってもよいし、感圧接着性、感熱接着性等の接着形態のものであってもよく、感熱接着性の接着シートが採用された場合は、当該接着シートを加熱する適宜なコイルヒータやヒートパイプ等の加熱側等の加熱手段を設けるといった適宜な方法で接着されればよい。また、このような接着シートは、例えば、接着剤層だけの単層のもの、基材シートと接着剤層との間に中間層を有するもの、基材シートの上面にカバー層を有する等３層以上のもの、更には、基材シートを接着剤層から剥離することのできる所謂両面接着シートのようなものであってもよく、両面接着シートは、単層又は複層の中間層を有するものや、中間層のない単層又は複層のものであってよい。また、被着体としては、例えば、食品、樹脂容器、シリコン半導体ウエハや化合物半導体ウエハ等の半導体ウエハ、回路基板、光ディスク等の情報記録基板、ガラス板、鋼板、陶器、木板または樹脂板等、任意の形態の部材や物品なども対象とすることができる。なお、接着シートを機能的、用途的な読み方に換え、例えば、情報記載用ラベル、装飾用ラベル、保護シート、ダイシングテープ、ダイアタッチフィルム、ダイボンディングテープ、記録層形成樹脂シート等の任意の形状の任意のシート、フィルム、テープ等を前述のような任意の被着体に貼付することができる。 Further, the materials, types, shapes, etc. of the original adhesive sheet AS, the adhesive sheet AS1 (hereinafter, simply referred to as “adhesive sheet”) and the adherend in the present invention are not particularly limited. For example, the adhesive sheet may have a circular shape, an elliptical shape, a polygonal shape such as a triangle or a square, or any other shape, or may have an adhesive form such as pressure-sensitive adhesiveness or heat-sensitive adhesiveness, and is heat-sensitive. When an adhesive adhesive sheet is adopted, it may be adhered by an appropriate method such as providing an appropriate heating means such as a coil heater or a heat pipe for heating the adhesive sheet. Further, such an adhesive sheet may be, for example, a single layer having only an adhesive layer, a sheet having an intermediate layer between the base sheet and the adhesive layer, a cover layer on the upper surface of the base sheet, and the like. It may be a layer or more, or even a so-called double-sided adhesive sheet capable of peeling the base sheet from the adhesive layer, and the double-sided adhesive sheet has a single layer or a multi-layer intermediate layer. It may be a single layer or a multi-layer without an intermediate layer. The adherend includes, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit boards, information recording substrates such as optical disks, glass plates, steel plates, pottery, wood plates or resin plates, etc. Members and articles of any form can also be targeted. In addition, the adhesive sheet is changed to a functional and versatile reading, and for example, an arbitrary shape such as an information description label, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer forming resin sheet, etc. Any sheet, film, tape, etc. can be attached to any adherend as described above.
本発明における手段および工程は、それら手段および工程について説明した動作、機能または工程を果たすことができる限りなんら限定されることはなく、まして、前記実施形態で示した単なる一実施形態の構成物や工程に全く限定されることはない。例えば、支持手段は、被着体を支持する支持面を有するものであれば、出願当初の技術常識に照らし合わせ、その技術範囲内のものであればなんら限定されることはない（他の手段および工程についての説明は省略する）。
また、前記実施形態における駆動機器は、回動モータ、直動モータ、リニアモータ、単軸ロボット、多関節ロボット等の電動機器、エアシリンダ、油圧シリンダ、ロッドレスシリンダおよびロータリシリンダ等のアクチュエータ等を採用することができる上、それらを直接的又は間接的に組み合せたものを採用することもできる（実施形態で例示したものと重複するものもある）。
前記実施形態において、ローラが採用されている場合、各ローラを回転駆動させる駆動機器を備えてもよいし、各ローラの表面をゴムや樹脂等の弾性変形が可能な部材で構成してもよいし、各ローラを弾性変形しない部材で構成してもよいし、押圧ローラや押圧ヘッド等の押圧手段や押圧部材が採用されている場合、上記で例示したものに代えてまたは併用して、ローラ、丸棒、ブレード材、ゴム、樹脂、スポンジ等による押圧部材を採用したり、大気やガス等のエアの吹き付けにより押圧する構成を採用したりしてもよいし、押圧手段や押圧部材の押圧部をゴムや樹脂等の弾性変形が可能な部材で構成してもよいし、弾性変形しない部材で構成してもよいし、剥離手段や剥離部材が採用されている場合は、板状部材、丸棒、ローラ等で構成してもよいし、支持（保持）手段や支持（保持）部材等の被支持部材を支持または保持する構成のものが採用されている場合、メカチャックやチャックシリンダ等の把持手段、クーロン力、接着剤、粘着剤、磁力、ベルヌーイ吸着、駆動機器等で被支持部材を支持（保持）する構成を採用してもよいし、切断手段や切断刃が採用されている場合、上記で例示したものに代えてまたは併用して、カッター刃、レーザカッタ、イオンビーム、火力、熱、水圧、電熱線、気体や液体等の吹付け等の切断部材を採用したり、適宜な駆動機器を組み合わせたもので切断部材を移動させて切断するようにしたりしてもよい。
The means and processes in the present invention are not limited as long as they can perform the operations, functions or processes described for the means and processes, much less the components of the mere embodiment shown in the above embodiments. It is not limited to the process at all. For example, the supporting means is not limited as long as it has a supporting surface for supporting the adherend, as long as it is within the technical scope in light of the common general technical knowledge at the time of filing (other means). And the description of the process is omitted).
Further, the drive equipment in the above embodiment includes electric equipment such as a rotary motor, a linear motor, a linear motor, a single-axis robot, and an articulated robot, and actuators such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to being able to be adopted, it is also possible to adopt a combination thereof directly or indirectly (some of which overlap with those illustrated in the embodiment).
In the above-described embodiment, when the rollers are adopted, a drive device for rotationally driving each roller may be provided, or the surface of each roller may be made of a member capable of elastic deformation such as rubber or resin. However, each roller may be composed of a member that does not elastically deform, or if a pressing means such as a pressing roller or a pressing head or a pressing member is adopted, the rollers may be used in place of or in combination with those exemplified above. , A pressing member made of a round bar, a blade material, rubber, resin, sponge, etc. may be adopted, or a configuration of pressing by blowing air such as air or gas may be adopted, or a pressing means or pressing member may be pressed. The portion may be made of a member that can be elastically deformed such as rubber or resin, or may be made of a member that is not elastically deformed. If a peeling means or a peeling member is adopted, a plate-shaped member, It may be composed of a round bar, a roller, or the like, or if a structure that supports or holds a supported member such as a supporting (holding) means or a supporting (holding) member is adopted, a mechanical chuck, a chuck cylinder, or the like. A structure may be adopted in which the supported member is supported (held) by a gripping means, a Coulomb force, an adhesive, an adhesive, a magnetic force, Bernoulli adsorption, a driving device, or the like, or a cutting means or a cutting blade is adopted. In the case, instead of or in combination with the ones exemplified above, a cutting member such as a cutter blade, a laser cutter, an ion beam, thermal power, heat, hydraulic pressure, heating wire, spraying of gas or liquid, etc. may be adopted, or as appropriate. The cutting member may be moved to cut with a combination of various driving devices.
１０ シート貼付装置
２０ 支持手段
２１Ａ 支持面
３０ 繰出手段
４０ 切断手段
４１ 切断刃
５０ 押圧手段
５２ 押圧ローラ（押圧部材）
ＡＳ 原接着シート
ＡＳ１ 接着シート
ＣＵ 切込
ＲＬ 剥離シート
ＲＳ 原反
ＷＦ ウエハ（被着体）
10 Sheet pasting device 20 Supporting means 21A Supporting surface 30 Feeding means 40 Cutting means 41 Cutting blade 50 Pressing means 52 Pressing roller (pressing member)
AS original adhesive sheet AS1 adhesive sheet CU notch RL peeling sheet RS original fabric WF wafer (adhesive)
Claims (2)
原接着シートに剥離シートが仮着された原反を繰り出す繰出手段と、
前記支持手段に支持された切断刃を有し、前記切断刃で前記原接着シート側から前記原接着シートを貫通する閉ループ状の切込を設け、前記切込の内側に接着シートを形成し、前記切込の外側に不要シートを形成する切断手段と、
前記剥離シート側から前記原接着シートを押圧する押圧部材を有し、前記原接着シートを押圧した前記押圧部材を前記支持面に沿った所定方向に移動させて、前記切断刃で前記原接着シートに前記切込を設けるとともに、前記被着体に前記接着シートを貼付する押圧手段とを備えていることを特徴とするシート貼付装置。 A support means having a support surface for supporting the adherend,
A feeding means for feeding out the raw fabric with the release sheet temporarily attached to the original adhesive sheet,
A cutting blade supported by the supporting means is provided, and a closed loop-shaped cut penetrating the original adhesive sheet is provided from the original adhesive sheet side by the cutting blade to form an adhesive sheet inside the notch. A cutting means for forming an unnecessary sheet on the outside of the notch, and
The original adhesive sheet has a pressing member that presses the original adhesive sheet from the release sheet side, and the pressing member that presses the original adhesive sheet is moved in a predetermined direction along the support surface, and the original adhesive sheet is used by the cutting blade. A sheet affixing device comprising the notch and a pressing means for affixing the adhesive sheet to the adherend.
原接着シートに剥離シートが仮着された原反を繰り出す繰出工程と、
前記支持手段に支持された切断刃で前記原接着シート側から前記原接着シートを貫通する閉ループ状の切込を設け、前記切込の内側に接着シートを形成し、前記切込の外側に不要シートを形成する切断工程と、
押圧部材で前記剥離シート側から前記原接着シートを押圧し、当該原接着シートを押圧した前記押圧部材を前記支持面に沿った所定方向に移動させて、前記切断刃で前記原接着シートに前記切込を設けるとともに、前記被着体に前記接着シートを貼付する押圧工程とを備えていることを特徴とするシート貼付方法。 A support process that supports the adherend on the support surface of the support means,
The feeding process of feeding the raw fabric with the release sheet temporarily attached to the raw adhesive sheet,
A closed loop-shaped notch that penetrates the original adhesive sheet from the original adhesive sheet side is provided by a cutting blade supported by the support means, an adhesive sheet is formed inside the notch, and is unnecessary outside the notch. The cutting process to form the sheet and
The original adhesive sheet is pressed from the release sheet side by the pressing member, the pressing member pressing the original adhesive sheet is moved in a predetermined direction along the support surface, and the cutting blade presses the original adhesive sheet onto the original adhesive sheet. A sheet affixing method comprising a pressing step of providing a notch and affixing the adhesive sheet to the adherend.
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